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Less Price Erosion Will Lift <span style='color:red'>MEMS</span> Sensor/Actuator Growth

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Less Price Erosion Will Lift MEMS Sensor/Actuator Growth

Products built with microelectromechanical systems (MEMS) technology are forecast to account for 73% of the $9.3 billion semiconductor sensor market in 2018 and about 47% of the projected 24.1 billion total sensor units to be shipped globally this year, according to IC Insights’ 2018 O-S-D Report—A Market Analysis and Forecast for Optoelectronics, Sensors/Actuators, and Discretes. Revenues for MEMS-built sensors—including accelerometers, gyroscope devices, pressure sensors, and microphone chips—are expected to grow 10% in 2018 to $6.8 billion compared to nearly $6.1 billion in 2017, which was a 17% increase from $5.2 billion in 2016, the O-S-D Reportsays. Shipments of MEMS-built sensors are forecast to rise about 11% in 2018 to 11.1 billion after growing 19% in 2016.An additional $5.9 billion in sales is expected to be generated in 2018 by MEMS-built actuators, which use their microelectromechanical systems transducers to translate and initiate action—such as dispensing ink in printers or drugs in hospital patients, reflecting light on tilting micromirrors in digital projectors, or filtering radio-frequency signals by converting RF to acoustic waves across structures on chips. Total sales of MEMS-built sensors and actuators are projected to grow 10% in 2018 to $12.7 billion after increasing nearly 18% in 2017 and 15% in 2016 (Figure 1).Figure 1In terms of unit volume, shipments of MEMS-built sensors and actuators are expected to grow by slightly less than 12% to 13.1 billion units worldwide after climbing 20% in 2017 and rising 11% in 2016. Total revenues for MEMS-based sensors and actuators are projected to increase by a compound annual growth rate (CAGR) of 9.2% between 2017 and 2022 to reach $17.8 billion in the final year of the forecast, according to the 2018 O-S-D Report. Worldwide shipments of these MEMS-built semiconductors are expected to grow by a CAGR of 11.4% in the 2017-2022 period to 20.2 billion units at the end of the forecast.One of the biggest changes expected in the five-year forecast period will be greater stability in the average selling price for MEMS-built devices and significantly less ASP erosion than in the past 10 years. The ASP for MEMS-built sensors and actuators is projected to drop by a CAGR of -2.0% between 2017 and 2022 compared to a -4.7% annual rate of decline in the 2012-2017 period and the steep CAGR plunge of -13.6% between 2007 and 2012. The ASP for MEMS-built devices is expected to be $0.88 in 2022 versus $0.97 in 2017, $1.24 in 2012, and $2.57 in 2007, says the 2018 report.The spread of MEMS-based sensors and actuators into a broader range of new “autonomous and “intelligent” automated applications—such as those connected to the Internet of Things (IoT) and containing artificial intelligence (AI)—will help keep ASPs from falling as much as they did in the last 10 years. IC Insights believes many MEMS-based semiconductors are becoming more specialized for certain applications, which will help insulate them from pricing pressures in the market.

Key word：

Sensor/Actuator

Release time：2018-09-06 00:00 reading：1111 Continue reading>>

Murata Invests in <span style='color:red'>MEMS</span> Sensor Manufacturing in Finland

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Murata Invests in MEMS Sensor Manufacturing in Finland

Murata is significantly increasing global production capacity, including most recently its factory located in Finland. After having recently purchased the previously leased buildings, the company will construct a new building of approximately 16,000 square meters. The new facility is scheduled to be completed by the end of 2019.The total value of the investment is five billion yen and is underpinned by the growing worldwide demand for MEMS sensors used in the automotive industry and various health and industrial applications."The market for advanced driver-assistance systems, self-directed cars, healthcare, and other emerging technologies are expected to be significant growth drivers. MEMS sensors are critical solutions for these applications and deliver proven measurement accuracy and stability in a variety of conditions," said Yuichiro Hayata, Managing Director for Murata Electronics Oy.“With the construction of this new production building, we will significantly increase our MEMS sensors production capacity. Moreover, by responding to the strong demand of gyro sensors, accelerometers, and combo sensors in the automotive, industry and healthcare fields, this will strengthen our business base in the automotive market, industrial equipment and medical devices market, while contributing to the economy and employment of Finland,” stated Makoto Kawashima, Director of Sensor Product Division in Murata Manufacturing.With the factory expansion in Finland, Murata will strengthen both R&D and manufacturing operations with a long-term perspective for increasing utilization of this facility. The company currently employs 1,000 people in Finland and estimates to create 150–200 new jobs in 2018–2019.Murata acquired the Finnish company VTI Technologies – today known as Murata Electronics Oy – in 2012. It is the only factory of Murata which manufactures MEMS sensors outside of Japan, and has experienced tremendous growth over the last 10 years. This site in Finland also hosts R&D space and one of the biggest clean room facilities in the country.

Key word：

Murata

Release time：2018-08-21 00:00 reading：1471 Continue reading>>

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SiTime and Intel to collaborate on MEMs timing for 5G

SiTime, a provider of MEMS timing, and Intel are to work together on integrating timing solutions for Intel’s 5G multi-mode radio modems, with additional applicability to Intel LTE, millimeter-wave wireless, Wi-Fi, Bluetooth, and GNSS solutions."Our collaboration with SiTime on MEMS-based silicon timing solutions will help our customers build leading 5G platforms to best take advantage of the increased performance and capacity that the 5G NR standard brings,” said Dr. Cormac Conroy, corporate vice president and general manager of the Communication and Devices Group at Intel.SiTime’s MEMS timing solutions are used to enhance system performance where stressors such as vibration, high temperature, and rapid thermal transients, can disrupt the timing signal and result in network reliability issues, lower data throughput, and even connectivity drops.The MEMS solutions being provided to Intel’s 5G modem business, are intended to meet the much higher performance requirements of emerging 5G radio modem platforms.In order for 5G to be successfully rolled out, networks will need to become faster, more agile, and much denser, using more equipment. Systems will be deployed closer to connected devices and in uncontrolled locations such as on streetlamps, traffic lights, rooftops, stadiums, and parking garages.In these settings, 5G devices will be subject to a range of environmental stressors, all of which will create demand for new, complex and higher-performance timing solutions to ensure that the deployment of 5G is successful.

Key word：

SiTime,Intel,5G

Release time：2018-07-27 00:00 reading：2804 Continue reading>>

ST Focuses <span style='color:red'>MEMS</span> Strategy on Industrial IoT

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ST Focuses MEMS Strategy on Industrial IoT

STMicroelectronics is making a big push into the Industrial IoT space with the announcement of a range of high-accuracy MEMS sensors and components designed to last for at least 10 years, serving the needs of advanced automation environments in which machines can be expected to perform for many years.As part of this strategy, the company has launched its first product, the IIS3DHHC low-noise three-axis accelerometer, which is optimized for high measurement resolution and stability to ensure accuracy over time and temperature. The MEMS sensor targets precision inclinometers in antenna-positioning mechanisms for communication systems, structural health monitoring (SHM) equipment for keeping buildings and bridges safe, and stabilizers or levelers for a wide variety of industrial platforms. Its long-term accuracy and robustness are also ideal for high-sensitivity tilt and security sensors, as well as image stabilization in high-end digital still cameras (DSCs).This will be part of a range of MEMS sensors for smart factories and industrial automation. STMicro says that its 10-year longevity commitment assures long-term availability of a wide range of high-performing components used in industrial equipment, helping vendors handle the typically long in-market lifetimes of their products and extended operation in challenging environmental conditions. In addition to industrial sensors, the program covers STM32 microcontrollers, motor drivers, analog components, power converters, LEDs, and existing MEMS sensors that will be supported for at least 10 years.In a briefing with EE Times, Andrea Onetti, group VP and general manager, MEMS Sensors Division, STMicroelectronics, said, “There are big opportunities for MEMS sensors in the industrial environment. In the past five to six years, the adoption of MEMS has been limited and mostly driven by smartphones. But as we enter the age of automation, smart industry, and smart driving, the demand for sensors will grow at a consumer pace here, too. However, there will be a requirement for a completely new generation of MEMS in terms of accuracy, performance, and longevity.”The differences in characteristics required for MEMS sensors in consumer, automotive, and industrial markets.Source: STMicroelectronics.Onetti emphasized that MEMS sensors used in the mobile industry to date didn’t need to address accuracy and precision — for example, they might have needed to do basic measurements like portrait and landscape detection. However, in smart manufacturing, accuracy and longevity would be paramount. “The fourth industrial revolution, or Industrie 4.0, is here, and this implies you’ll need a lot of sensors," Onetti said. "A machine that can detect and analyze its own functions, such as noise, vibration, and temperature, will need its own hardware ecosystem to make the machine smart.”He said that the sensors would not be limited to human interaction but would involve machine-to-machine interaction and intelligence, and that would require new types of sensors with wider performance characteristics. An example would be the leakage of a pipe; a normal microphone sensor would probably have a bandwidth just sufficient for the human ear, around 20 kHz, but for the industrial environment in which machines need to listen, this might need more like 80-kHz bandwidth.Onetti also echoed what we’ve been hearing a lot of in recent months in terms of more intelligence at the edge in Industrial IoT. “For monitoring, if you can play in a smart way with some local intelligence, you can save a lot of mobile data costs that would be incurred in constantly sending data to the cloud.”The new STMicro focus on Industrial IoT is clearly based on a recognition that growth in MEMS sales for smartphones is flattening, as its first-quarter results have shown. Onetti said, “The number of units of smartphones being shipped annually, which has been a primary driver of the MEMS sensors market, has been relatively flat at around 1.6 billion. However, the new growth market for MEMS sensors is high-accuracy devices, both in the industrial market as well as for new advanced features in the smartphone market.” He says that the key market for this growth will be Europe, but the U.S. and China are not to be neglected.Commenting on the introduction of the new IIS3DHHCinclinometers, he added, “These high-quality industrial sensors leverage our investments in MEMS design and high-yield fabrication processes to deliver superior performance with low ownership costs for applications where the highest precision, repeatability, and robustness are critical. We will continue to introduce new types of precision sensors for industrial applications in the coming months, covered by our 10-year longevity commitment, including combination sensors, specialized sensors, and complete inertial modules.”With full-scale range of ±2.5 g, the IIS3DHHC three-axis accelerometer is optimized for fine-positioning mechanisms and detecting small movements such as in advanced security sensors. Among key differences between this and typical consumer-oriented accelerometers, its ultra-low noise of 45 μg/√Hz (micro-g per root Hz) allows very high resolution.STMicro says that extreme stability ensures minimal drift of sensor characteristics over time or wide temperature variations. Sensitivity changes by less than 0.7% from –40°C and 85°C. Offset drift is below 0.4 mg/°C. This enables equipment to deliver consistent performance in various environments, including outdoors in cold or warm climates, or in industrial equipment, industrial robots, and drones, with minimal calibration or recalibration required.In addition, the inclinometer integrates analog-digital conversion, as well as digital circuitry including FIFO data storage and interrupt control. This saves external conversion components and simplifies power management to reduce energy demand and to enable longer run times for battery-powered equipment.The IIS3DHHC is in production now in a high-quality 16-lead 5 x 5 x 1.7-mm ceramic LGA package, priced from $4.50 for orders of 1,000 pieces.

Key word：

ST

Release time：2018-05-11 00:00 reading：929 Continue reading>>

Startup Tunes <span style='color:red'>MEMS</span> Switch for IoT

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Startup Tunes MEMS Switch for IoT

　　A startup spun out of GE reported progress making and getting its MEMS-based switch into a broad array of systems on the Internet of Things. Menlo Microsystems sees its chip, already designed into GE medical systems, as a power actuator and relay for a variety of many industrial IoT uses as well as an RF switch for mobile systems.　　Menlo’s electrostatic switch, first described in 2014, uses novel metal alloys on a glass substrate to create a beam that under current is pulled down to a gate to complete a contact. It requires significantly less power to activate and remain on than a solid-state switch, and products for many vertical markets can be created using a single proprietary process.　　The device’s low power consumption lets it handle high current power switching jobs. In addition, it does not generate heat like traditional power switches and relays that need large, expensive heat sinks.　　Currently the switch is made in a small research fab at GE. Menlo expects it to be in production in mid-2018 at a commercial MEMS fab, Silex Microsystems of Sweden, where it is currently running wafers with working devices.　　“Our biggest challenge right now is getting the technology in a commercial fab and getting it qualified,” said Russ Garcia, Menlo’s CEO.　　The biggest opportunities for the device are in replacing electromagnetic, electromechanical and solid-state devices in a wide variety of relays and power switches. Menlo expects to roll out in the next several months a variety of reference boards using its chips for industrial automation, robotics and home and building automation.　　One of biggest issues for IoT devices such as Nest’s smart thermostat is in efficiently turning on or off power hungry systems such as HVACs, something Menlo’s switches can do “while drawing almost no current,” Garcia said. “We offer one or two orders of magnitude improvements in power switch size and power consumption,” he added.　　The design was incubated in a 12-year research effort on MEMS switches inside GE. “They concluded MEMS reliability problems were materials issues, and developed unique alloys for the switch’s beams and contacts and a novel glass substrate that could reliably handle kilowatts of power over billions of on/off switches,” he said.　　GE’s medical division will be the first user of the chips, replacing with its chips the complex arrays of pin diodes currently in MRI systems. The company expects the MEMS switches could slash $10,000 off the cost of each MRI system. “Today, they have to pay five PhDs to tune each machine with pin diodes, but with the MEMS switch they can automate programing them,” Garcia said.　　GE gets an exclusive head start using the chips in its MRI systems. However, the startup is already in discussions with other MRI makers who will be able to use the chips in the future. “GE wants this business to scale to create a new strategic component supplier,” he said.　　Menlo also sees uses of the chips in RF switches. It already is designed into a military radio expected to ship next fall that delivers a ten-fold increase in power output with a ten-fold decrease in power dissipation.　　Separately, the startup expects to license its technology to vendors who make RF switches for smartphones such as Peregrine, Qorvo and Skyworks.　　“I don’t want to make 15-cent switches,” said Garcia, explaining the licensing approach. “We have collected NRE dollars from a couple players on phase one of their licensing evaluations,” he said.　　Menlo raised $22.5 million a year ago from investors including Corning, GE Ventures and Microsemi. It hopes its multiple market opportunities enable it to be cash positive by mid-2019. “My goal is not to raise any more money, our margins are very strong especially in the new fab, and some of our switches will sell for $20-$100 ASPs,” Garcia said.

Key word：

MEMS,IoT

Release time：2017-12-27 00:00 reading：1229 Continue reading>>

<span style='color:red'>MEMS</span> Design Shrinks Speakers to Chip Scale

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MEMS Design Shrinks Speakers to Chip Scale

　　Microelectromechanical-system-based audio speakers for earbuds, smartphones, wearables and other Internet of Things (IoT) devices have proved a tough row to hoe. But USound GmbH (Graz, Austria) now says it will be first to market with a family of MEMS audio speakers, with production volumes planned for the first quarter.　　USound calls its MEMS speaker Ganymede and says it will offer a reference design, called Magaclite, by the end of this year. The devices have been fitted to high-end sunglasses and are being developed for earbuds; smartphones; and multidriver, high-fidelity above-ear speakers.　　“It was a challenge to make the tiny MEMS drivers sound good,” Mark Laich, USound senior business development adviser, told EE Times at SEMI’s MEMS & Sensor Executive Congress (San Jose, Calif.) earlier this month. The difficulties can be chalked up to the physics of sound, which dictates that the cone size pushing the air be proportional to the wavelength of the sounds emitted. High-fidelity home speaker systems use 12- to 15-inch bass drivers along with midrange drivers in the 3-to-6 inch range and high-frequency tweeters as small as (and sometimes smaller than) an inch.　　For wearables, the proportions of the driver's size must be some small fraction of the wavelength of the sounds emitted plus some mechanical or electronic frequency equalization to make them sound truly high fidelity. High-end headphones, and even some expensive earbuds, use multiple drivers to achieve the highest fidelity. Most reasonably priced earbuds sacrifice fidelity for frugality by using a single driver plus a lot of electronic equalization.　　The same can be said for USound’s MEMS speakers. The company’s low-end model uses a single driver plus electronic equalization in a chip-scale package bonded directly to the MEMS die. “Our MEMS frame uses a rectangular actuator that pushes air using piezoelectric suspension beams, with a surrounding diaphragm that seals the chamber,” Laich said. “As a result, we have very fast actuation, with microsecond response time, which will assist with noise cancellation in future models that will be built with a MEMS codec partner.” Laich declined to identify the partner.　　Noise cancellation is accomplished by including a MEMS microphone in each earbud. The mic samples the common background noise and injects the sampled signal with 180? of phase change, thus inverting it so that the sampled signal zeroes out the ambient noise when mixed with the music signal. Of course, the response time of the speaker driver should be instantaneous to be 100 percent effective, so the microsecond response time of USound’s drivers suits them well for noise-canceling designs.　　But how do they sound?　　The best way to describe the speakers’ sound is “digital,” like the difference in sound between a CD and vinyl record. Of course, even with electronic equalization to boost the low frequencies, the sound from a single-driver reference design lacks the high fidelity of multidriver designs.　　The company has already designed multidriver reference designs for an unidentified brand of designer sunglasses. By combining a conventional low-frequency driver with USound’s mid- and high-frequency MEMS speakers, the design achieves high-fidelity sound, according to Laich. It also allows the drivers to be located above the ear canal and the output to be beam steered into the ear so that the listener can also converse with others, hear traffic sounds, and receive other audible cues from the environment.　　“Our above-the-ear designs project sound into the ear using a dipole, open-back design instead of the traditional monopole, closed-back design,” Laich told EE Times. “The dipole sacrifices a little volume in return for a narrow concentration of acoustic energy directed into ear canal, in the manner of beam forming.”　　USound has partnerships with Austria Technologie & Systemtechnik AG, for AT&S’ tiny printed-circuit boards; the Fraunhofer Institute for Silicon Technology, for ISIT’s expertise in producing power electronics for microsystems; the Institute for Electronic Music, for IEM’s interface expertise between acoustic technologies and audio practice; and STMicroelectronics, for ST’s manufacturing expertise in robotic ears.

Key word：

MEMS Design,Chip Scale

Release time：2017-11-23 00:00 reading：1576 Continue reading>>

<span style='color:red'>MEMS</span> Sensor Startup mCube Buys Xsens

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MEMS Sensor Startup mCube Buys Xsens

　　Privately held MEMS sensor vendor mCubeannounced the acquisition of 3D motion tracking technology company Xsens from ON Semiconductor for about $26 million.　　Combining the two companies will enable mCube to create new markets for motion sensing and tracking solution, especially in the medical devices and sports science motion tracking, said Ben Lee, mCube's CEO, in an interview with EE Times.　　MCube's claim to fame is that it makes the world's smallest and lowest power inertial sensor, a 3-axis accelerometer that in a 1.1×1.3 mm CSP and a profile of just 0.74mm. By combining that with Xsens' suite of technologies for converting motion sensor measurements into application data, Lee believes the combined company can deliver not only the sensor solution but a complete solution to bring motion sensing to market for many customers.　　The technology can be particularly appealing for sports applications, allowing coaches and trainers to track the performance of a player returning from injury, for example, Lee said.　　"We make the technology disappear into the clothing," Lee said. "When that happens, you could see athletes wearing them during games" to provide data on mobility and performance, he said.　　"The potential for this in sports, entertainment and medical, it's really limitless," Lee said.　　On Thursday (Nov. 9), mCube's MC3672 3-axis accelerometer was named an honoree by the Consumer Electronics Show (CES) 2018 Innovation Awards.　　Under the terms of the deal, Xsens will retain its brand name and will continue to operate from its current base in Enschede, the Netherlands as a stand-alone business unit of mCube, the companies said. The two companies will jointly develop new prodts, they said, and coordinate sales and marketing activities.　　Xsens was originally acquired in 2014 by Fairchild Semiconductor, which was later acquired by ON Semiconductor.

Key word：

MEMS Sensor,mCube,Xsens

Release time：2017-11-13 00:00 reading：1254 Continue reading>>

Paper or Plastic? Both Are in <span style='color:red'>MEMS</span>’ Future

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Paper or Plastic? Both Are in MEMS’ Future

　　How do you accurately forecast the future of microelectromechanical system (MEMS) technology — the fastest growing semiconductor segment, according to global industry association SEMI? By tracing the devices’ history, then surveying the top 500 most innovative scholarly articles on MEMS, Alissa Fitzgerald, founder of MEMS design and development house A.M. Fitzgerald and Associates LLC, told an audience here at SEMI’s MEMS & Sensors Executive Congress.　　“The next billion-dollar product is lurking in that university literature,” Fitzgerald said. The 2017 crop of academic papers reveals work on passive and near-zero-power sensors, as well as plastic- and paper-substrate alternatives to costly silicon for consumer and one-use, disposable specialty products.　　A.M. Fitzgerald already has a bead on the future of MEMS, having worked to bring novel academic and entrepreneurial ideas to fruition at small MEMS fabs, such as Rogue Valley Microdevices, which uses both commercial silicon and SOI wafers from Soitec.　　In her conference talk, Fitzgerald traced MEMS technology’s roots to the development of alkaline-etched 3-D force sensors of the 1980s, which led to Kurt Petersen’s invention of pressure sensors based on bulk-silicon-micromachining technology. The pressure sensors enabled inkjet nozzles, which led to digital light processing (DLP) MEMS and then to the first use of an accelerometer (from Analog Devices Inc.) to trigger airbags faster than old-school, ball-in-tube mechanical tripwires.　　“From there, a whole new era began with Bosch’s DRI [deep-reactive ion etching] process, which enabled the world’s first MEMS gyroscope. FBARs [thin-film bulk acoustic resonators] and the wide use of MEMS piezoelectric and aluminum nitride films also enabled the wide range of MEMS devices we have today,” said Fitzgerald. Another important invention was “precision-aligned eutectic bonding, which enabled InvenSense to wafer bond MEMS chips with its own ASICs for automatic hermitic sealing, eliminating the need for an extra capping step.”　　According to Fitzgerald, in the early days the major players, such as ADI and Bosch, fulfilled the needs of more than 50% of the market, leaving the 400 small companies to split up the leftovers. But with the popularization of the smartphone, a massive consumer market has grown those 400 little guys into the dominant position.　　So where did all these consumer market ideas come from? Fitzgerald traces them largely to the academic community which “nurses them along in university labs” as solutions looking for a problem. A.M. Fitzgerald and others design and develop the academics’ ideas into marketable products that fuel the current worldwide trillion dollar consumer markets.　　Looking ahead then boils down to finding out what the university labs are incubating, Fitzgerald said. “By scanning through the top 500 papers in 2017, which we filtered for commercial viability, we can predict the technologies that will be worldwide game changers.”　　Future of MEMS　　According to Fitzgerald, the first game changers will come from novel uses of FBAR and surface-acoustic-wave (SAW) sensors.　　Today, FBAR and SAW technologies are mainly used for RF filters. “But the literature reveals that they can also be used for producing passive sensors that do not require a battery but can still wake up a processor when a certain parameter has been achieved,” Fitzgerald said. The sensors can provide highly accurate detection of temperature extremes but also can be functionalized for pressure limits and even the detection of specific gases.　　“These passive sensors are perfect for harsh environments where you do not or cannot change batteries and yet provide high performance with zero standby power consumption,” she said.　　A further look at the 2017 MEMS literature turned up near-zero-power devices, sometimes called “event driven” sensors. These are similar to passive devices but use very small, microamp power supplies providing less than 1 picowatt in standby mode. When they sense the signature of a specific event, they flip on to alert an application processor.　　“For instance, Northeastern University has shown that near-zero power IR sensors can be made wavelength sensitive and can wake up a processor in an IoT [Internet of Things] device or security sentinel. Even when used in large arrays, they can nevertheless use small energy-harvesting techniques for their standby power source,” Fitzgerald said.　　Other nouveau MEMS devices use piezoelectric materials not just for energy harvesting, as today, but also to enable applications such as wide-range microspeakers, magnetometers, and even transformers, none of which would require licensing Bosch’s effective but expensive DRI process.　　“The consumer market is ripe for cheap devices and IoTs that are practically disposable by virtue of being scalable for mass production,” said Fitzgerald.　　In that same vein, MEMS researchers are working with alternatives to expensive silicon. In 2004, Fitzgerald said, 90% of the world’s MEMS devices were fabricated with bulk silicon or on the surface of silicon substrates, but as many as half of the next-generation devices described in the literature would be built on plastic or even paper substrates. “Paper-based technologies are increasingly replacing expensive, billion-dollar silicon fabs, especially for disposable applications using sensors that cost less than a penny each,” she said. The resultant devices are not as fast or precise as silicon builds, but their performance suffices for ephemeral consumer products or single-use applications.　　For example, paper sensors could be made that would detect specific types of bacteria. Such devices could reduce the need for broad-spectrum antibiotics, which are enabling the evolution of superbugs. Likewise, paper food packaging could embed paper-substrate devices that would tell the user whether an item has in fact spoiled, replacing today’s imprecise “use by” date stamps.　　“In the 2020s, were are going to see a new range of piezoelectric event-driven sensors, and in the 2030s we will see important growth in paper- and plastic-based sensors,” said Fitzgerald.　　Silicon will still be relevant for CMOS-plus-sensor designs with built-in readouts, she said. but “silicon technology is at risk of stagnation, as research efforts into using it are slowing down in favor of cheaper paper devices.”

Key word：

Paper,Plastic,MEMS’ Future

Release time：2017-11-07 00:00 reading：1489 Continue reading>>

<span style='color:red'>MEMS</span> Microphone Market Expected to Hit $1B in 2017

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MEMS Microphone Market Expected to Hit $1B in 2017

　　The market for microphones based on microelectromechanical system (MEMS) devices will reach the $1 billion milestone, or 5 billion units, this year, up from $993 million in 2016, according to a report from Yole Développement (Lyon, France). Yole further predicts that the electret microphone (ECM) market will hit $700 million this year, edging the combined revenue tally for MEMS and ECM mics close to $2 billion by year’s end.　　The study, “Acoustic MEMS and Audio Solutions 2017,” further estimates the microspeaker market at nearly $8.7 billion and states that the audio microchip market, including codecs, DSPs, and amplifiers, already exceeds $4.3 billion.　　“From mobile phones to cars, from home assistants to drones, audio components like MEMS microphones, ECMs, speakers, and audio integrated circuits are essential for key functions of those existing and new products,” study author Guillaume Girardin, technology and market analyst for MEMS and sensors at Yole, told EE Times in an exclusive interview.　　Girardin’s report for Yole traces the evolution of the markets for MEMS microphones, ECMs, microspeakers, and audio ICs since 2010. “The recent focus of all big consumer electronics players on audio features testifies to the importance of the audio device market, which will be worth $20 billion by 2022,” he told EE Times. “There’s clearly room for more added value in the audio value chain regarding hardware and software—smarter microphones, algorithms, DSPs, codecs, and microspeakers—which will enhance audio capabilities and drive us to a voice-powered future.”　　Reports by SystemPlus Consulting and KnowMade, meanwhile, include reverse engineering and cost analysis of the market’s first piezoelectric MEMS microphone, the Vesper VM1000. And in a freely available Q&A exchange with Yole titled “The Future is Voice Powered,” Vesper CEO Matt Crowley revealed Vesper’s strategy and described the features of its piezoelectric approach to MEMS microphones.　　SystemPlus tore down and analyzed the Knowles, STMicroelectronics, and Goertek MEMS microphones in the Apple iPhone 7-Plus. KnowMade, in turn, used that teardown to reveal the basis of Knowles’ patents and intellectual-property litigation involving those patents in “Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product mapping.”　　The reports collectively conclude that voice, and audio in general, is becoming a key function of consumer, automotive, and industrial applications and is being incorporated into a diverse ecosystem of related acoustic areas. According to Yole, the MEMS microphone market got an extra boost by the use of multiple mics per device—four in the iPhone 7 Plus—contributing to the audio business’ projected 6 percent compound annual growth rate to 2022. As such, the audio supply and value chain will become increasingly important to what Girardin calls our voice-powered future.

Key word：

MEMS,Microphone

Release time：2017-06-21 00:00 reading：1241 Continue reading>>

RF Filters Boost <span style='color:red'>MEMS</span> Market

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RF Filters Boost MEMS Market

　　The total value of the global MEMS market is projected to grow from about $13 billion in 2017 to more than $25 billion in 2022, driven largely by growth in RF applications like RF MEMS filters, according to a new report by French market research firm Yole Développement.　　Increased demand for RF MEMS filters is being driven by the emergence of 4G technology and increasing complexity of cellular communications, according to Yole (Lyon, France). The market research firm expects sales of RF MEMS filters — the biggest business in the RF front-end — to increase at a compound annual growth rate (CAGR) of 35 percent between 2017 and 2022.　　"Beyond the development of these RF MEMS devices, the RF front-end demonstrated comfortable growth, at 14 percent CAGR during the same period," said Claire Troadec, Yole's RF devices and technologies activity leader, in a press statement.　　The rise in prominence of RF MEMS filters has of course affected the fortunes of MEMS supplier. Broadcom Ltd., which in 2015 was formed by the acquisition by Avago Technologies of Broadcom Corp. in 2015, rose to become the second largest MEMS supplier in 2016 behind perennial MEMS market leader Robert Bosch of Germany, according to Yole.　　Other RF MEMS suppliers have also enjoyed riding the wave of market boom for RF MEMS filters.U.S.-based RF chip vendor Qorvo, for example, rose to $585 million in MEMS sales in 2016, up from just $145 million in 2014, according to Yole.　　Both STMicroelectronics and Hewlett Packard saw MEMS revenues decrease in 2016. ST continues to lower MEMS prices and HP is suffering from the shift from disposable to fixed inkjet heads," according to Troadec.　　"The MEMS market will grow further through a combination of functions, dedicated to consumer, automotive and medical applications," said Eric Mounier, senior technology and market analyst for MEMS and sensors at Yole, in a statement."　　Third-ranked MEMS supplier Texas Instruments, the No. 3 MEMS supplier, which mainly focuses in the MEMS arena on manufacturing micromirrors, has maintained its MEMS market share as many applications have emerged, including optical switches for telecoms, barcode readers, 3D gesture recognition, automotive HUDs or smart lighting and 3D printing, Yole said.

Key word：

RF,MEMS

Release time：2017-06-05 00:00 reading：1085 Continue reading>>

model	brand	Quote
BD71847AMWV-E2	ROHM Semiconductor
TL431ACLPR	Texas Instruments
MC33074DR2G	onsemi
CDZVT2R20B	ROHM Semiconductor
RB751G-40T2R	ROHM Semiconductor

model	brand	To snap up
BU33JA2MNVX-CTL	ROHM Semiconductor
TPS63050YFFR	Texas Instruments
ESR03EZPJ151	ROHM Semiconductor
STM32F429IGT6	STMicroelectronics
IPZ40N04S5L4R8ATMA1	Infineon Technologies
BP3621	ROHM Semiconductor

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