Murata Type 2FR Hostless Tri-Radio Module
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Murata Type 2FR Hostless Tri-Radio Module

     Murata Electronics Type 2FR Hostless Wi-Fi® 6 + BLUETOOTH® LE 5.4 / 802.15.4 Tri-Radio Module is highly integrated while based on the NXP RW612 Wireless MCU. The Type 2FR wireless module delivers class-leading integration, efficiency, and multiple radio capabilities in a 12mm x 11mm package.The Murata Type 2FR supports dual-band Wi-Fi 6, Bluetooth Low Energy (LE) 5.4, IEEE 802.15.4, and ethernet. This versatility provides seamless connectivity and operational efficiency. Additionally, it supports Matter Network over Wi-Fi, Thread, and ethernet, simplifying device interoperability and management.FEATURESNXP RW612 inside260MHz Arm® Cortex® -M33Supports IEEE 802.11a/b/g/n/ac/ax specification with dual-band 2.4GHz and 5GHz Wi-Fi 6SISO with 20MHz channels; up to MCS9 data ratesSupports Bluetooth specification version 5.4Supports IEEE 802.15.41.2MB SRAM; 16MB Flash; External PSRAM interface for system memory expansion up to 128MB64 GPIOs, FlexSPI, SDIO 3.0, Ethernet, USB, USART, I2C, SPI, I2S, PCM, ACOMP, DAC, ADC, JTAGRF signal from pin padTemperature range of -40°C to 85°C12.0mm x 11.0mm x 1.55mm (maximum) dimensionsMSL 3Surface-mount typeRoHS compliantAPPLICATIONSSmart homeBlood pressure monitorFitness equipmentGaming accessoriesGlucometerHome security and surveillanceIn-home energy displayMajor home appliancesMulti-radio hub/smart device gateway for internet connectivitySmall and medium appliancesSmart power socket and light switchWeighing scaleIndustrialBuilding securityLightingPoint of Sale (POS) terminals
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Release time：2025-03-24 13:52 reading：202 Continue reading>>
Leading Performance for High Voltage Applications: NOVOSENSE Launches the NSI67X0 Series of Smart Isolated Drivers
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Leading Performance for High Voltage Applications: NOVOSENSE Launches the NSI67X0 Series of Smart Isolated Drivers

　　NOVOSENSE has officially launched the NSI67X0 series of smart isolated drivers with Isolated Analog Sensing function. Suitable for driving power devices such as SiC, IGBTs and MOSFETs, and available in both automotive (AEC-Q100 compliant) and industrial variants, this series can be widely used in new energy vehicles, air conditioners, power supplies, photovoltaics and other applications.　　This series of isolated gate drivers equates an isolated analog to PWM sensor, which can be used for temperature or voltage detection. The design further enhances driver versatility, simplifies system design, effectively reduces system size and lowers overall cost.　　High-voltage Drive and Ultra-high Common-mode Immunity　　Designed to drive IGBTs or SiC up to 2121V DC operating voltage, NSI67X0 offers advanced protection functions, excellent dynamic performance, and outstanding robustness. This series uses SiO2 capacitor isolation technology to isolate the input side from the output side, providing ultra-high common-mode immunity (CMTI>150kV/μs) while ensuring extremely small offset between devices, which is at the leading level in the industry.　　Powerful Output Capability and Miniaturized Package　　The NSI67X0 series has powerful output capability, supporting ±10A drive current and a maximum output drive voltage of 36V, far exceeding most similar products. Its SOW16 package design further enhances safety by achieving a creepage distance of more than 8mm while maintaining miniaturization.　　Comprehensive Protection Functions and Automotive Certification　　With comprehensive protection functions, including fast overcurrent protection, short-circuit protection, fault soft turn off, 4.5A Miller clamp, and undervoltage protection, this series is a reliable choice for driving power devices such as IGBTs. The entire product family meets the AEC-Q100 standard for automotive applications and can be widely used in new energy vehicles, industrial control and energy management.　　Features of NSI67X0 Series　　◆ Smart isolation drivers up to 2121Vpk for driving SiC and IGBTs　　◆ High CMTI: 150 kV/μs　　◆ Input side supply voltage: 3V ~ 5.5V　　◆ Driver side supply voltage: up to 32V　　◆ Rail-to-rail output　　◆ Peak source and sink current: ±10A　　◆ Typical propagation delay: 90ns　　◆ Operating ambient temperature: -40°C ~ +125°C　　◆ Compliant with AEC-Q100 for automotive applications　　◆ RoHS compliant package type: SOW16, creepage distance > 8mm　　Protection Functions　　◆ Fast over-current and short-circuit protection, with optional DESAT threshold voltage of 9V and 6.5V and OC threshold voltage of 0.7V　　◆ Integrated soft turn off function in case of fault, with optional soft turn off current of 400mA and 900mA　　◆ Integrated Miller clamp function, with clamp current up to 4.5A　　◆ Independent undervoltage protection UVLO on both HV and LV sides　　◆ Fault alarm (FLT/RDY pin indication)　　Isolated Analog Sampling Function　　◆ Isolated analog sampling function　　◆ AIN input voltage range: 0.2V ~ 4.7V　　◆ APWM output duty cycle: 96% ~ 6%　　◆ Duty cycle accuracy: 1.6%　　◆ APWM output frequency: 10kHz　　◆ Optional AIN integrated constant current source output　　Safety Related Certification　　◆ UL Certification: 1 minute 5700Vrms　　◆ VDE Certification: DIN VDE V 0884-11:2017-01　　◆ CSA Certification: Approved under CSA Component Acceptance Notice 5A　　◆ CQC Certification: Compliant with GB4943.1-2011　　Introduction to Principle of High-precision Temperature Sampling of NSI67X0 Series　　The AIN interface of the NSI6730 has a built-in 200uA current source. When an external NTC is connected, a voltage drop will be generated and demodulated into a 10kHz PWM signal for isolated output. The PWM signal is captured by the processor MCU, and the corresponding voltage value and temperature are obtained by calculating the duty cycle.　　When the AIN voltage is in the range of 0.2V ~ 4.7V, the AIN input voltage and APWM output duty cycle are linearly related. When the AIN voltage is converted to a PWM signal, the PWM duty cycle conforms to the following formula:　　That is, the AIN voltage of 0.2V ~ 4.7V corresponds to a PWM duty cycle of 96% ~ 6%.　　Model Selection Chart of NSI67X0 Series　　This series offers a variety of models to meet the needs of different applications. Specifically, in the NSI67X0 series, when X is 3, the AIN interface integrates a constant current source; when X is 7, the AIN interface does not integrate a constant current source.
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Release time：2025-02-24 16:18 reading：546 Continue reading>>
Murata：Radisol Redefines Antenna Interference Countermeasures for Smartphones and Wearables
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Murata：Radisol Redefines Antenna Interference Countermeasures for Smartphones and Wearables

　　Murata Manufacturing Co. Ltd announces the launch of Radisol – an innovative product designed to suppress interference between nearby antennas with low insertion loss, improving isolation and antenna radiation efficiency. This world-first solution is specifically engineered to meet the demands of compact modern devices like smartphones and wearables, offering benefits such as reduced power consumption, miniaturized construction, and enhanced communication quality. In addition, Radisol has been adopted by Motorola Mobility LLC (Headquarters: Libertyville, Illinois, USA, President: Sergio Buniac), in the new Edge series of smartphones scheduled to be released in August 2024. Motorola has realized a method of improving the characteristics of Wi-Fi® antennas by using Radisol.　　As the demand for smaller smartphones and wearable devices grows, the number of antennas is also increasing to accommodate the expanding range of communication methods and bands. Additionally, MIMO technology to improve communication quality and speed is encouraging an increase in the number of antennas, while new designs such as foldable smartphones are encouraging antenna crowding. This has posed new difficulties, specifically the implications on antenna isolation and the decline in antenna effectiveness, as the interference of nearby antennas leads to a decrease in radiation efficiency.　　Although discrete filters are a common solution for improving antenna isolation, they are not suitable when communication bands are closely situated, as insertion loss can impair antenna performance and occupy valuable board space. To address these challenges, Murata has created Radisol, a low-loss filter for antenna area that uses Murata’s unique ceramic multilayer technology and RF circuit design technology.　　Antenna engineers usually construct a filter circuit using discrete L and C chip components to implement effective countermeasures. Instead, Radisol is just a single 0603-sized component that resolves the persisting challenges of antenna performance and packaging constraints. It effectively suppresses antenna interference, without significantly impacting the passband, and results in enhanced radiation efficiency and reduced power consumption.　　Each Radisol component operates as a dedicated filter circuit designed specifically to mitigate the antenna interference associated with a specific communication band. The compact component integrates one capacitor and two inductors, providing band-stop filter characteristics within a single chip. Radisol features a unique design that utilizes the generation of lossless mutual inductance by two magnetically coupled coils. This setup forms a band-stop circuit with no notable insertion loss in the communication band. This specialized approach to antenna isolation enables Radisol to offer enhanced performance, with low insertion loss and high efficiency and system integration.　　Included in the Radisol family are variants designed to effectively address the needs of common bands, including 2G & 5G Wi-Fi® as well as GPS signals. This eliminates the necessity of designing discrete filter circuits, simplifying the implementation of countermeasures. Murata will continue to expand upon the initial product lineup to further meet market demands and drive further innovation in antenna technology.　　“By using Radisol engineers can address the challenges of modern communication devices without compromising signal integrity and radiation efficiency,” said Satoru Muto, General Manager of New Business Incubation Department at Murata. “By utilizing Murata's cutting-edge technology, this solution takes integration to a whole new level, eliminating the need for complex discrete filter circuits and saving valuable space.”　　Radisol samples are available for evaluation and mass production has already begun in June 2024. To learn more about Radisol or to request samples, please contact your local Murata representative or visit here.
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Release time：2024-08-14 13:39 reading：744 Continue reading>>
What is a Radio Frequency Integrated Circuit
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What is a Radio Frequency Integrated Circuit

　　From smartphones and wireless internet access to radar and navigation systems, radio frequency (RF) transmission technology is making the world increasingly interconnected. With the continuous advancement of this technology, Radio Frequency Integrated Circuits (RFICs) themselves have become complex chips that also need to be integrated into System-on-Chip (SoC) solutions. RFICs are designed to operate at high frequencies, typically within the range of several hundred megahertz to several gigahertz.　　The goal of RF circuit design is to send and receive signals between the source and destination with acceptable quality without incurring high costs. This can be achieved through the use of validated design methodologies in circuit design. RFICs typically incorporate amplifiers, filters, mixers, oscillators, and modulation/demodulation functions on a single chip.　　RF circuit design is a hybrid technology that simultaneously employs both low-frequency analog design methods and microwave circuit design methods. The primary difference between microwave design and low-frequency analog design lies in the importance of transmission line principles. Microwave design relies heavily on the concept of transmission lines, whereas low-frequency analog design does not. Therefore, choices of impedance levels and descriptions such as signal magnitude, noise, and distortion are affected.　　What is RFIC?At its core, an RFIC is a specialized type of integrated circuit (IC) designed to operate at high frequencies, typically within the radio frequency (RF) spectrum. These circuits are meticulously engineered to handle the unique challenges posed by high-frequency signals, making them indispensable components in a wide array of applications, from smartphones and Wi-Fi routers to radar systems and satellite communication.　　Main components of RFIC design　　Antenna: Used for transmitting and receiving radio frequency signals.　　Filters: Filters out signals in specific frequency bands. It includes bandpass filters (BPF) that allow a specific frequency range to pass through, low-pass filters (LPF) that allow frequencies lower than a specific frequency to pass through, and high-pass filters (HPF) that allow frequencies higher than a specific frequency to pass through.　　Impedance Matching: Matches the source impedance and load impedance to minimize signal reflection or enhance power transmission.　　Low-Noise Amplifier (LNA): Amplifies weak signals and filters out noise responses (as the received signal is not strong enough to pass directly through the mixer).　　Modulator: Used for signal modulation. It encodes the signal in a certain way to meet the requirements of the communication channel. It can act as an “up-converter” in the transmitter, where it combines the low-frequency analog signal with the local oscillator signal to generate an RF signal.　　Demodulator: Decodes the received signal. It extracts the signal carrying the original information from the modulated carrier.　　Power Amplifier: Used to amplify the output of the mixer to a higher power for transmission. The higher the transmission efficiency, the wider the coverage range.　　RF Switch: Allows high-frequency signals to pass through specific transmission channels.　　Use and Advantages of RFICWireless Communication and Connectivity: RFICs are widely used in wireless communication in fields such as smartphones, Internet of Things (IoT) devices, and household appliances. Devices that support RFICs have become an indispensable part of daily life. Their key advantages lie in compact integration, power management, and high-speed data transmission.　　Automotive Radar Systems: RFICs can be used in automotive radar systems for applications such as collision prevention, adaptive cruise control, and parking assistance. With their compact size, they can easily be installed in vehicles, thereby enhancing safety.　　Wireless Sensor Networks: RFICs can be used in wireless sensor networks for applications such as environmental monitoring, smart agriculture, and industrial automation. Wireless connections between sensor nodes eliminate the need for extensive wiring and infrastructure. RFIC applications offer flexibility and scalability as they are easy to expand or reconfigure based on RFIC-based networks.　　Satellite Communication: RFICs can be used for tasks such as signal amplification, frequency conversion, and modulation in satellite communication systems. Extensive coverage, high data transmission rates, and efficient signal processing are just some of their many advantages.　　Difference between RFIC and MMICRFICs (Radio Frequency Integrated Circuits) and MMICs (Monolithic Microwave Integrated Circuits) are both specialized types of integrated circuits designed for high-frequency applications, but they have distinct characteristics and applications.　　Frequency Range: The primary distinction between RFICs and MMICs lies in their operating frequency range. RFICs operate in the lower RF frequency range, while MMICs operate in the higher microwave frequency range.　　Applications: RFICs are typically used in consumer electronics and telecommunications applications that operate at lower frequencies, while MMICs are employed in high-frequency and microwave systems that require superior performance and bandwidth.　　Design Focus: RFICs are designed with a focus on integration, low power consumption, and cost-effectiveness for mass-market applications. In contrast, MMICs prioritize performance, high-frequency operation, and signal integrity, often targeting specialized or niche markets with demanding requirements.　　What is the frequency of RFIC?The frequency range of RFICs (Radio Frequency Integrated Circuits) can vary widely depending on the specific application and design requirements. RFICs are typically designed to operate within the radio frequency (RF) spectrum, which spans from a few kilohertz (kHz) to several hundred gigahertz (GHz).　　Common frequency bands for RFICs include:　　Low Frequency RFICs: These RFICs operate in the lower RF frequency range, typically spanning from a few megahertz (MHz) to several hundred megahertz (MHz). They are commonly used in applications such as AM/FM radio receivers, RFID (Radio Frequency Identification), and some wireless sensor networks.　　Medium Frequency RFICs: RFICs operating in the medium frequency range typically cover frequencies from several hundred megahertz (MHz) to a few gigahertz (GHz). This range includes common wireless communication standards like Bluetooth, Wi-Fi, Zigbee, and cellular networks (2G, 3G, 4G LTE).　　High Frequency and Microwave RFICs: These RFICs operate in the higher frequency range, spanning from a few gigahertz (GHz) up to several hundred gigahertz (GHz). They are used in applications such as radar systems, satellite communication, microwave links, and high-speed data transmission.　　ConclusionRadio Frequency Integrated Circuits (RFICs) stand as the unsung heroes of modern connectivity, bridging the gaps between devices, networks, and people. Through relentless innovation and ingenuity, RFIC technology has transformed the landscape of wireless communication, shaping the way we live, work, and interact in the digital age.
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Release time：2024-05-16 11:48 reading：678 Continue reading>>
Renesas’ New FemtoClock™ 3 Timing Solution Delivers Industry’s Lowest Power and Leading Jitter Performance of 25fs-rms
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Renesas’ New FemtoClock™ 3 Timing Solution Delivers Industry’s Lowest Power and Leading Jitter Performance of 25fs-rms

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today expanded its timing solutions portfolio with a new ultra-low 25fs-rms clock solution for wireline infrastructure, data center and industrial applications. The new FemtoClock™ 3 family includes ultra-low jitter clock generators and jitter attenuators with 8 and 12 outputs, enabling high-performance, easy-to-use, and cost-effective clock tree designs for next-generation, high-speed interconnect systems. Target applications for the new devices include telecom switches and routers, top-of-rack data center switches, medical imaging, broadcast audio & video and more.　　FemtoClock 3 devices provide industry leading phase noise and jitter required to meet the needs of 112Gbps SerDes rates, as well as next generation 224Gbps SerDes designs using commonly available 48MHz to 73MHz crystals. The highly integrated devices can generate up to four frequency domains and offer integrated LDOs (Low Drop Out regulators) with superior PSRR, reducing board complexity and cost.　　“Renesas leads the industry with best-in-class timing solutions built from decades of experience and patented technology,” said Zaher Baidas, Vice President of the Timing Division for Renesas. “FemtoClock 3 devices extend that leadership by providing multiple clock and synchronization functions in a single device with ultra-low jitter, simplifying printed circuit board design and reducing solution area and cost.”　　“FemtoClock 3 was the only timing solution that offered us the ultra-low jitter performance while maintaining low power dissipation and simplifying the PCB design and lowering solution area on our next-generation switches,” said Vincent Ho, CEO at UfiSpace. “We count on Renesas to deliver the timing solutions that enable us to deliver leading-edge products quickly and cost-effectively.”　　Key Features of the FemtoClock 3 Family　　Industry-leading 25fs-rms jitter exceeds next-generation 112Gbps and 224Gbps SerDes reference clock requirements　　Up to 4 frequency domains allow all system clocks to be generated from a single device　　Device variants with jitter attenuation, synchronization and clock generation capabilities and with 8 or 12 outputs　　Low power dissipation of 1.2W and operating a single 1.8V supply　　Integrated non-volatile memory allows for device customization in factory at no additional cost to customer　　Small 7 x 7mm 48-pin VFQFPN and 9 x 9mm 64-pin VFQFPN packages　　Compliant with ITU-T G.8262 and G.8262.1 for enhanced synchronous Ethernet　　Single chip with multiple operating modes simplifies overall clock tree　　FemtoClock 3 supports multiple operating modes, including synchronization, jitter attenuation, and clock generation. Customers can combine the new FemtoClock 3 solution with the broader ClockMatrix™, VersaClock, buffer and oscillator portfolio of timing solutions to address challenging timing needs for their high-performance wireline infrastructure and data center designs.　　FemtoClock 3 functions seamlessly in conjunction with the state-of-the-art Renesas IC Toolbox (RICBox) application, empowering users to configure and program devices on the evaluation board. Additionally, RICBox interfaces with the Renesas Lab on the Cloud platform, providing users with the capability to connect virtually to an actual laboratory setting.　　Winning Combinations　　Renesas has combined FemtoClock 3 with numerous compatible devices from its portfolio to offer Winning Combinations, including the 1600G Fixed Form Factor Switch. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly.
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Release time：2024-04-19 11:28 reading：1453 Continue reading>>
ROHM Develops Automotive Primary LDOs: Leveraging Original QuiCur™ Technology to Achieve Industry-Leading* Load Response Characteristics
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ROHM Develops Automotive Primary LDOs: Leveraging Original QuiCur™ Technology to Achieve Industry-Leading* Load Response Characteristics

　　ROHM has developed 45V rated 500mA output primary LDO regulators: BD9xxM5-C (BD933M5EFJ-C / BD950M5EFJ-C / BD900M5EFJ-C / BD933M5WEFJ-C / BD950M5WEFJ-C / BD900M5WEFJ-C). These devices are suitable for supplying power to automotive electronic components such as ECUs that operate from vehicle batteries.　　In recent years, the number of onboard power supply system and functions continues to grow as electrification in the automotive industry progresses. This increases the demand for primary LDOs that can directly step down the battery voltage to MCUs and other components used in ECUs. However, the energy supplied by the vehicle’s lead-acid battery is often subject to sudden voltage fluctuations, which primary LDOs are required to provide with excellent line-transient response in these conditions.　　At the same time, ECUs and other downstream devices often experience load current variations during operation, that also demand excellent load-transient response characteristics. A high frequency response is essential for fast output voltage recovery, but it has been difficult to provide sufficient phase margin at the same time to ensure stable operation. In response, ROHM developed a novel solution that addresses these challenges.　　The BD9xxM5-C incorporates original QuiCur™ high-speed load response technology that delivers excellent response characteristics to load current fluctuations. For example, the LDO can maintain output to within 100mV of set voltage even as the load changes between 0 and 500mA in 1μs (Rise time/Fall time). Furthermore, low 9.5µA (typ.) current consumption contributes to lower power consumption in automotive applications. These new products will be available in four packages, ranging from the compact HTSOP-J8 to the high heat dissipation TO252 (TO252-3/TO252-5) and HRP5 types. This allows users to select the most suitable package for each use case.　　Going forward, ROHM will continue to improve reliability while reducing power consumption in automotive applications by developing products utilizing its strengths in analog and other technologies.　　Product LineupThe new BD9xxM5-C meets the basic requirements for automotive products, including 150°C operation and qualification under the AEC-Q100 automotive reliability standard. A wide range of packages will be available to select from depending on the application environment, all featuring excellent response performance and low current consumption using proprietary QuiCur™ technology.　　The lineup will be expanded to comprise a total of 18 models, (including the TO252-3, TO252-5, and HRP5 packages) by FY2024.　　Application ExamplesSuitable for a wide range of automotive applications such as ECUs that operate on vehicle primary power supply systems.　　• Powertrain: Fuel Injection (FI), Tire Pressure Monitoring System (TPMS)　　• Body systems: Body Control Modules　　• Infotainment: Instrument Clusters, Head-Up Displays (HUDs)　　QuiCur™ High-Speed Load Response TechnologyQuiCur™ is the name of ROHM’s proprietary ‘Quick Current’ high-speed load response circuit capable of maximizing load response characteristics (response performance) without causing instability in the feedback circuits of power supply ICs.　　Stable operation of the power supply IC is also possible with minimal output capacitance. And in the case of switching regulators, which are a type of power supply IC, it is possible to linearly adjust the capacitance and output voltage fluctuation to easily achieve stable operation even when the capacitance is changed due to specification changes, significantly reducing the number of person-hours required for power circuit design - both in terms of decreasing component count and ensuring stable operation.　　Click on the URL below for more information on QuiCur™ Technology.　　https://www.rohm.com/news-detail?news-title=rohm-establishes-quicur-that-maximizes-the-response-performance-of-power-supply-ics&defaultGroupId=false　　• QuiCur™ is a trademark or registered trademark of ROHM Co., Ltd.　　Support ToolsROHM Real Models are high accuracy SPICE models that utilize original model-based technology to faithfully reproduce the electrical and temperature characteristics of the actual IC, resulting in a perfect match between the IC and simulation values. This ensures reliable verification, contributing to more efficient application development - for example by preventing rework after prototyping.　　ROHM Real Models are now available on ROHM’s website (see link below).　　https://www.rohm.com/products/power-management/linear-regulators/single-output-ldo-regulators?page=1&PS_ProductSeries=BD9xxM5%20series&PS_SpiceLink=1.0#parametricSearch　　Online Sales InformationSales Launch Date: February 2024　　Pricing: $1.5/unit (samples, excluding tax)　　Online Distributors: DigiKey, Mouser and Farnell　　The products will be sold at other online distributors as well.　　Applicable Part Nos: BD950M5EFJ-C, BD933M5WEFJ-C, BD950M5WEFJ-C, BD900M5WEFJ-C　　TerminologyPrimary　　In a power supply circuit, the side in charge of 1st stage conversion from a power source such as a battery is called the primary and the side responsible for 2nd stage conversion referred to as the secondary.　　LDO Regulator (Low Drop Out/Low Saturation Regulator)　　A type of power supply IC that converts between two different DC voltage levels. Falls under the category of linear regulator (where the input/output voltages operate linearly) characterized by a small input-output voltage difference. Compared to DC-DC converter ICs (switching regulators), LDOs feature a simpler circuit configuration and lower noise.　　Load Current　　From the point of view of the power supply ICs, all electronic circuits in the subsequent stages, including MCUs and sensors, can be considered “loads”. When these loads operate, a (load) current flows, causing the output voltage of the power supply IC to undershoot (drop) or overshoot. Load transient response characteristics refer to the response time until the changed voltage due to load current is restored and the power supply stabilizes.
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Release time：2024-03-27 11:07 reading：464 Continue reading>>
ROHM’s New SBDs: Achieving Class-Leading* Reverse Recovery Time with 100V Breakdown Voltage by Adopting a Trench MOS Structure that Significantly Improves VF-IR Trade-Off
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ROHM’s New SBDs: Achieving Class-Leading* Reverse Recovery Time with 100V Breakdown Voltage by Adopting a Trench MOS Structure that Significantly Improves VF-IR Trade-Off

　　ROHM has developed 100V breakdown Schottky barrier diodes (SBDs) that deliver industry-leading reverse recovery time (trr) for power supply and protection circuits in automotive, industrial, and consumer applications.　　Although numerous types of diodes exist, highly efficient SBDs are increasingly being used inside a variety of applications. Particularly SBDs with a trench MOS structure that provide lower VF than planar types enable higher efficiency in rectification applications. One drawback of trench MOS structures, however, is that they typically feature worse trr than planar topologies - resulting in higher power loss when used for switching.　　In response, ROHM developed a new series utilizing a proprietary trench MOS structure that simultaneously reduces both VF and IR (which are in a trade-off relationship) while also achieving class-leading trr.　　Expanding on the four existing conventional SBD lineups optimized for a variety of requirements, the YQ series is ROHM’s first to adopt a trench MOS structure. The proprietary design achieves class-leading trr of 15ns that reduces trr loss by approx. 37% and overall switching loss by approx. 26% over general trench-type MOS products, contributing to lower application power consumption. The new structure also improves both VF and IR loss compared to conventional planar type SBDs. This results in lower power loss when used in forward bias applications such as rectification, while also providing less risk of thermal runaway which is a major concern with SBDs. As such, they are ideal for sets requiring high-speed switching, such as drive circuits for automotive LED headlamps and DC-DC converters in xEVs that are prone to generate heat.　　Going forward, ROHM will strive to further improve the quality of its semiconductor devices, from low to high voltages, while strengthening its expansive lineup to further reduce power consumption and achieve greater miniaturization.　　SBD Trench MOS StructureThe trench MOS structure is created by forming a trench using polysilicon in the epitaxial wafer layer to mitigate electric field concentration. This reduces the resistance of the epitaxial wafer layer, achieving lower VF when applying voltage in the forward direction. At the same time, during reverse bias the electric field concentration is minimized, significantly decreasing IR. As a result, the YQ series improves VF and IR by approx. 7% and 82%, respectively, compared to conventional products.　　And unlike with typical trench MOS structures where trr is worse than planar types due to larger parasitic capacitance (resistance component in the device), the YQ series achieves an industry-leading trr of 15ns by adopting a unique structural design. This allows switching losses to be reduced by approx. 26%, contributing to lower application power consumption.　　Application Examples• Automotive LED headlamps • xEV DC-DC converters • Power supplies for industrial equipment　　• Lighting　　☆: Under development　　* The TO-277GE package products released and sold by online distributors this time are rated for car infotainment and body systems. For each part number, we are preparing grades that can be installed in powertrains, etc. (using the same part number), with mass production scheduled to start in September 2024. (The packaging symbol after the above part numbers will differ)　　Product Page and Related InformationApplication notes highlighting the advantages of these new products in circuits along with a white paper that showcases the features of each SBD series are available on ROHM's website. An SBD page is also available that allows users to narrow down product options by entering voltage conditions and other parameters, facilitating the selection process during design. Click on the URLs below for more information.　　■ ROHM SBD Product Page　　https://www.rohm.com/products/diodes/schottky-barrier-diodes　　■ Application Notes　　Advantages of YQ Series: Compact and Highly Power Conversion Efficiency Schottky Barrier Diodes for Automotive　https://fscdn.rohm.com/en/products/databook/applinote/discrete/diodes/yq_sbd_automotive_an-e.pdf　　■ White Paper　　ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment　　https://fscdn.rohm.com/en/products/databook/white_paper/discrete/diodes/sbd_lineup_wp-e.pdf　　Online Sales Information　　Applicable Part Nos: Refer to the above table.　　Availability: December 2023　　Pricing: $2,5/unit (samples, excluding tax)　　The products will be sold at other online distributors as well.　　Terminologytrr (Reverse Recovery Time)　　The time it takes for the switching diode to switch from the ON state to completely OFF. The lower this value is, the smaller the switching losses.　　Forward Voltage (VF)　　A voltage drop that occurs when electricity flows in the forward direction from + to -. The lower this value is, the higher the efficiency.　　Reverse Current (IR)　　Reverse current generated when reverse voltage is applied. The lower this value is, the smaller the power consumption (reverse power loss).　　Thermal Runaway　　When a diode is conducted in the reverse direction, heat generated within the chip may exceed the heat dissipation of the package, causing IR to increase and eventually lead to destruction, - a phenomenon called thermal runaway. For SBDs with high IR values, thermal runaway is especially likely to occur, so care must be taken when designing circuits.
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Release time：2024-02-20 11:26 reading：1907 Continue reading>>
Fibocom Smart Module SC126-NA Received Certification from a Leading Carrier in North America
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Fibocom Smart Module SC126-NA Received Certification from a Leading Carrier in North America

　　Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, is proud to announce a pivotal achievement for its 4G smart module SC126-NA receiving the certification from one of the leading carriers in North America. Integrated with a quad-core processor and leveraged 11nm technology, SC126-NA is a high-performance smart module designed for the entry-level intelligent IoT market, now the module is fully capable of providing an integrated, seamless connectivity service to a wide range of AIoT terminals including smart wireless payment terminals, industrial handhelds, 4G PTT-over-cellular terminals by gaining the certification.　　The global artificial intelligence IoT market is projected to reach high demand with the expansion of AI technology. As an essential in fostering the AIoT market growth, smart module empowers IoT devices with mobile computing capabilities, allowing real-time data processing and analysis, greatly reducing the decision-making timeline in critical scenarios for industry customers and improving overall efficiency. The validation of Fibocom's SC126-NA smart module can shorten the certification cycle of customers' terminal devices and ease the investment concerns for customers' IoT projects.　　Notably, Fibocom SC126-NA is equipped with an open Android operating system with rich multimedia processing capabilities. It can be connected to an FHD (1920 x 1080 @30fps) touchscreen, supporting multi-channel camera input, plus H.265 / H.264 encoding and decoding capabilities and integrating with facial recognition algorithm. Packaged in LCC + LGA form factor, the module offers maximum flexibility for customers to develop terminal devices for various market demands. In addition, SC126-NA is capable of providing precise positioning and navigation with GNSS. Furthermore, with the scalability to support a rich set of interfaces including MIPI / USB / UART / SPI / I2C, etc, Fibocom SC126-NA is an ideal smart wireless solution for various applications that require the integration of cellular communication and multimedia features. With the expanding landscape of AIoT applications in the global market, Fibocom developed a series of regional versions of SC126 to support the frequency bands in Europe and APAC, as well as Wi-Fi only version to satisfy the booming market demands.
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Release time：2023-11-14 13:26 reading：2221 Continue reading>>
Fibocom 5G Module FM160-NA Certified by All Three of US' Leading Operators
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Fibocom 5G Module FM160-NA Certified by All Three of US' Leading Operators

　　Fibocom’s 5G module FM160-NA has achieved an industry-leading milestone by receiving all three major US carriers’ certifications. The module has been approved to deliver optimal 5G connectivity service on all three carriers’ networks with verified capabilities, bolstering the mobile broadband applications with the best-in-class 5G experience.　　Shenzhen, China – September 14th 2023 – Fibocom a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, announces the significant milestone of its 5G module FM160-NA on the completion of receiving all three major US carriers’ certifications. The industry-leading FM160-NA will help customers in the North America market to reduce the time-to-market, accelerating the 5G FWA commercialization.　　Supporting NR Carrier Aggregation (CA), FM160-NA optimizes 5G user experience with extended coverage, boosted throughput, and increased capacity. Powered by the Qualcomm Snapdragon® X62 modem chipset, FM160-NA is backward compatible with LTE-TDD and LTE-FDD network standards. It delivers maximum downlink rates of 3.5Gbps and uplink rates of 900Mbps under 5G, empowering IoT applications with lightning data transmission speeds. Packaged in M.2 form factor with the size of 30x52x2.3mm, the module is pin-compatible with Fibocom's Release 15 module FM150, which allows customers to advance the 5G terminals without investment concerns.　　According to the research conducted by Statista, the total amount of 5G Fixed Wireless Access (FWA) connections is predicted to reach 236 million connections worldwide by 2028. In 2022, the number of 5G FWA connections in the world reached 19.23 million. The upgrade demand for higher data throughput for both 4G FWA service providers and early-stage 5G FWA service providers keeps growing. Customer Premises Equipment (CPE), as the access point to provide seamless and reliable connectivity service for homes, enterprises, and industries, is the key enabler in boosting FWA adoption. Fibocom FM160-NA is the ideal wireless solution for FWA customers to narrow down the digital divide by enabling gigabit connectivity for end devices such as CPE, ODU, mobile hot spot, USB dongles, etc.　　FM160-NA provides high-performance positioning and navigation services for mobility scenarios with built-in multi-constellation GNSS. Moreover, it also supports abundant functionalities such as digital audio, VoLTE and VoNR, which is flexible to acquire via software upgrade. Meanwhile, it supports multiple operating systems (Linux/ Android/ Windows), various network protocols as well as industry-standard interfaces (USIM, USB 3.1, PCIe 4.0 and I2S), allowing much flexibility and ease of integration for FWA customer deployment.　　Gene Santana, VP of Overseas Carriers Certification Dept., Fibocom, commented, "We are thrilled to gain all three major carriers’ certifications with the robust quality of FM160-NA, which marks the remarkable achievements for FM160-NA in the North America market. Looking forward, Fibocom is confident to deliver the best-in-class 5G solution for diversified mobile broadband markets and work closely with operators to accelerate the 5G monetization."
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Release time：2023-09-22 11:54 reading：2784 Continue reading>>
ROHM’s New 600V Super Junction MOSFETs Combine Class-Leading Noise Characteristics with the Industry’s Fastest* Reverse Recovery Time
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ROHM’s New 600V Super Junction MOSFETs Combine Class-Leading Noise Characteristics with the Industry’s Fastest* Reverse Recovery Time

　　ROHM has added three new models, the R60xxRNx series, to its PrestoMOS™ lineup of 600V Super Junction MOSFETs. These devices are optimized for driving small motors in refrigerators, ventilation fans, and other applications where noise suppression is important.　　Greater energy efficiency in equipment is required in recent years in response to the tightening of the global power supply, with motor drives accounting for up to 50% of the world’s total power demand. For this reason, high efficiency MOSFETs are increasingly being used in inverter circuits that convert power to drive motors. At the same time, however, countermeasures against noise generated from MOSFET operation typically involve adding components and/or changing circuit patterns, so there is a need to reduce both man-hours and costs. But reducing power loss and noise are generally in a trade-off relationship, making it difficult to achieve both.　　To meet these needs, in 2012, ROHM began mass production of the PrestoMOS™ lineup of Super Junction MOSFETs featuring the industry's fastest reverse recovery time(trr) characteristics, which has received high marks for achieving lower power consumption. The lineup now includes three new models that provide best-in-class noise characteristics while maintaining the fast trr through an optimized structure.　　The new R60xxRNx series maintains the high-speed trr characteristics of PrestoMOS™ while minimizing noise. An industry-best trr of 40ns is achieved by improving conventional lifetime control technology, reducing switching losses by approx. 30% over general products that translates to lower application power loss. At the same time, the newly developed Super Junction structure reduces noise characteristics (which are inversely related to faster trr) by about 15dB compared to standard products (under ROHM measurement conditions at 40MHz). Delivering industry-leading characteristics reduces the number of man-hours and parts required for noise countermeasures.　　Going forward, ROHM will continue to expand its high voltage MOSFET lineup in different packages and even lower ON resistances that contribute to environmental protection by reducing power consumption in a variety of applications.　　ROHM’s New 600V Super Junction MOSFETs Combine Class-Leading　　Noise Characteristics with the Industry’s Fastest* Reverse Recovery Time　　Contributes to lower power loss along with fewer man-hours and external parts required for noise suppression in devices equipped with small motors*ROHM July 13th, 2023 study　　Product LineupOnline Sales InformationVideoFeatured Products　　July 13th, 2023　　ROHM has added three new models, the R60xxRNx series, to its PrestoMOS™ lineup of 600V Super Junction MOSFETs. These devices are optimized for driving small motors in refrigerators, ventilation fans, and other applications where noise suppression is important.　　Greater energy efficiency in equipment is required in recent years in response to the tightening of the global power supply, with motor drives accounting for up to 50% of the world’s total power demand. For this reason, high efficiency MOSFETs are increasingly being used in inverter circuits that convert power to drive motors. At the same time, however, countermeasures against noise generated from MOSFET operation typically involve adding components and/or changing circuit patterns, so there is a need to reduce both man-hours and costs. But reducing power loss and noise are generally in a trade-off relationship, making it difficult to achieve both.　　To meet these needs, in 2012, ROHM began mass production of the PrestoMOS™ lineup of Super Junction MOSFETs featuring the industry's fastest reverse recovery time(trr) characteristics, which has received high marks for achieving lower power consumption. The lineup now includes three new models that provide best-in-class noise characteristics while maintaining the fast trr through an optimized structure.　　The new R60xxRNx series maintains the high-speed trr characteristics of PrestoMOS™ while minimizing noise. An industry-best trr of 40ns is achieved by improving conventional lifetime control technology, reducing switching losses by approx. 30% over general products that translates to lower application power loss. At the same time, the newly developed Super Junction structure reduces noise characteristics (which are inversely related to faster trr) by about 15dB compared to standard products (under ROHM measurement conditions at 40MHz). Delivering industry-leading characteristics reduces the number of man-hours and parts required for noise countermeasures.　　Going forward, ROHM will continue to expand its high voltage MOSFET lineup in different packages and even lower ON resistances that contribute to environmental protection by reducing power consumption in a variety of applications.　　PrestoMOS™     ‘Presto’ is an Italian musical term meaning ‘very fast’.　　PrestoMOS™ is ROHM’s original power MOSFET that maintains the high withstand voltage and low ON resistance of Super Junction MOSFETs while speeding up the trr of the built-in diode. Reducing switching losses make it ideal for a wider range of applications with inverter circuits, such as air conditioners and refrigerators.　　*PrestoMOS™ is a trademark or registered trademark of ROHM Co., Ltd.　　Application Examples◇ Refrigerators◇ Ventilation fans◇ Fan motorsAlso suitable for a variety of devices equipped with small motors.　　Online Sales InformationSales Launch Date: March 2023　　Online Distributors: DigiKey, Mouser, and Farnell　　Pricing: $3.5/unit (samples, excluding tax)　　Products and evaluation boards will be offered at online distributors as they become available.　　TerminologySuper Junction MOSFET (Metal Oxide Semiconductor Field Effect Transistor)　　A type of transistor, MOSFETs can be divided by device structure into DMOSFET (Double-diffused MOSFET), planar, and super junction topologies. Super Junction MOSFETs deliver superior breakdown voltage and output current than both DMOSFETs and planar types, while also featuring lower loss when handling large power.　　trr (Reverse Recovery Time)　　The time it takes for the built-in diode to switch from the ON state to completely OFF. The lower this value is, the smaller the loss during switching.　　Lifetime Control　　The time it takes for carriers (holes or electrons) that have moved when voltage is applied to the semiconductor to recombine when the voltage is stopped is called the lifetime, and the technology that makes recombination easier by intentionally creating defects in the semiconductor crystal structure is called lifetime control.
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Release time：2023-09-15 13:48 reading：2128 Continue reading>>

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