BIWIN Built-in BGA SSD Plus Mini SSD Make Ro<span style='color:red'>bot</span>s Smarter, Easier to Use, and Longer-Lasting
Trade news

BIWIN Built-in BGA SSD Plus Mini SSD Make Robots Smarter, Easier to Use, and Longer-Lasting

　　With the maturation of on-device AI computing, multimodal perception fusion, and reinforcement learning frameworks, robots are evolving from being merely reactive to becoming truly adaptive, with requirements of accumulating experience to achieve autonomous evolution, far beyond just executing commands.　　AI models are growing larger.What to do when data loading is too slow and affects decision-making?　　Devices are becoming increasingly compact, with every bit of internal space at a premium. How to balance tiny size with high-performance transmission?　　Training data keeps piling up, but memorycapacity isn’t enough and can’t be upgraded?　　Conventional embedded storage solutions (such as UFS, eMMC, M.2 SSD, MicroSD cards) are limited by trade-offs among performance, form factor, and scalability, making them insufficient for the evolving demands of humanoid robotics handling sustained high-load operation, long lifecycle, high system integration, and incremental learning.　　BIWIN BGA SSD, with its superior performance, compact form factor and excellent shock-resistance, has become one of the preferred solutions for robots; Mini SSD, positioned as an expandable storage choice with superb upgradability and flexibility, strikes a perfect balance between high performance and compact package. The combination of the built-in BGA SSD plus expandable Mini SSD constructs a new integrated storage architecture, working as a complete solution to provide stability, expandability, and systemic efficiency for intelligent robots.　　Built-in BGA SSD + External Mini SSD　　Supporting high-frequency data writes for advanced perception and decision-making　　The “brain” of a humanoid robot—the core computing motherboard—is the hardware hub for advanced perception, cognitive reasoning, and autonomous decision-making. Relying on high-performance AI computing chips, it runs multimodal large models and processes massive sensor data in real time to understand environments and plan tasks. This process demands fast and reliable storage for the operating system.　　BIWIN BGA SSD uses a PCIe 4.0 ×4 interface, delivering sequential read speeds up to 7350 MB/s and capacities up to 2TB, enabling “second-level” boot times for the OS and AI models.　　Robots operate under write-intensive workloads that far exceed typical consumer SSD applications. In some high-load systems, daily write volumes can reach 300 GB. Once the initial onboard storage (such as UFS or fixed SSD) becomes saturated, there’s no room left for ongoing data feeding and model iteration.　　Designed for effortless scalability, BIWIN Mini SSD features a SIM-card-style, slot-in design that enables a true “plug-and-play” experience. No disassembly or specialized tools are required to add up to 2 TB of high-speed storage (with higher capacities planned), ensuring long-term data accumulation, incremental learning, and intelligent evolution for robotic systems.　　While achieving extreme miniaturization and large capacity, BIWIN Mini SSD also delivers high-performance transfer rates. Equipped with a PCIe 4.0 ×2 interface, its read/write speeds reach up to 3700 MB/s and 3400 MB/s respectively, and future seamless upgrades to higher-performance versions (such as PCIe 5.0) are supported.　　SIM-card-sized, as light as 1g　　Saving device space and reducing weight　　As humanoid robots move toward practical deployment, lightweight design is not just about “shedding weight”; it’s more about simplifying mechanical structures, lowering manufacturing costs, improving mobility, and expanding application scenarios. As an essential hardware component, the size and weight of memory module directly impact overall device design.　　Both the BIWIN BGA SSD and Mini SSD feature a coin-sized footprint with an ultra-slim thickness of just 1.4 mm. The Mini SSD weighs as little as 1 g and can be directly inserted into a pre-designed socket, significantly reducing constraints on mechanical layout and overall system weight. For humanoid robots that demand high dynamic performance and extended battery life, BIWIN BGA SSD and Mini SSD deliver a “minimal physical presence” while enabling a “lightweight system design”—resulting in more compact architectures and greater motion agility.　　Dual Storage, Reshaping Industry Cooperation　　Safeguarding the Full Lifecycle Storage Needs of Robots　　Mini SSD, defined as an expandable memory solution, goes far beyond its storage function; its design concepts of modularization and standardization bring a brand-new product architecture mindset to intelligent terminal industries such as robots and notebooks.　　Manufacturer Enablement: Simplified Design, Faster Iteration　　BIWIN delivers a Mini SSD + socket solution based on a modular integration approach, enabling device manufacturers to optimize internal system layouts, reduce form-factor constraints, and develop thinner, lighter end products with clear differentiated competitiveness.　　The host-side socket offers strong compatibility across multiple capacity SKUs, requiring minimal hardware changes. This significantly lowers development effort, integration complexity, and overall system cost for device manufacturers.　　User Value: Plug-and-Play, Maximum Flexibility　　Storage expansion or replacement can be completed on-site without tools or specialized expertise. Designed for repeated, reliable insertion and removal, the solution allows end users to easily expand or swap TB-class storage, delivering a flexible and efficient storage experience.　　When paired with BIWIN’s in-house RD510 card reader (USB4.0 Type-C), users gain high-performance, portable storage for mobile productivity, content creation, and other data-intensive scenarios.　　Mini SSD has already entered mass production and is now integrated into multiple intelligent devices, including the OneXPlayer X1 Air, APEX, Super X, and GPD Win 5. It is also officially available for purchase in the consumer market.　　Since its debut, Mini SSD has been validated by several international honors, consisting of “Best Inventions of 2025” from TIME, “Best-in-Show” from Embedded World 2025, and “2026 CES Picks Awards” in the TWICE category. And BIWIN is also recognized as a winner of 2025 “China Chip” Outstanding Supporting Service Enterprise by right of this new innovation.　　Currently, BIWIN is collaborating with multiple SoC platforms and terminal brands to jointly promote Mini SSD interface specifications and ecosystem standards, accelerating its large-scale adoption in cutting-edge fields such as AI terminals and humanoid robots.
Key word：
Release time：2026-02-06 17:47 reading：456 Continue reading>>
Murata：SCH16T-K20 High-Precision 6-Axis IMU for Ro<span style='color:red'>bot</span>ics and Camera Systems
Trade news

Murata：SCH16T-K20 High-Precision 6-Axis IMU for Robotics and Camera Systems

　　Murata Manufacturing Co., Ltd. has announced the expansion of its SCH16T series of high-performance inertial measurement units (IMUs) with the introduction of the SCH16T-K20, targeting industrial, prosumer, and consumer markets worldwide. Designed for OEMs in robotics, drones, and camera systems, as well as IMU module manufacturers and system integrators requiring safety-critical IMUs, the SCH16T-K20 delivers market-leading precision, mechanical robustness, and reliability.　　In demanding inertial measurement applications such as dead-reckoning navigation as well as drone and camera stabilization, small measurement errors can accumulate over time leading to unpredictable measurement results. In these applications, key IMU parameters such as noise density, offset bias drift, and vibration rectification ultimately limit the end-application performance and achievable response speed. Murata improves all the key areas with the new SCH16T-K20, which features a brand-new MEMS accelerometer and improved gyroscope temperature calibration.　　The SCH16T-K20 is a 6 axis IMU with a typical gyroscope noise density of 0.0004 (°/s)/√Hz, gyroscope bias instability of 0.3 °/h, and accelerometer noise density as low as 33 µg/√Hz. Like all other SCH16T products, the SCH16T-K20 has a wide operating temperature range from -40 °C to +110 °C, a supply voltage of 3.0–3.6 V, and I/O voltage of 1.7–3.6 V, and a compact size of 0.46 × 0.53 × 0.11 inch (11.8 × 13.4 × 2.9 mm).　　The driver behind the SCH16T-K20 accelerometer performance improvement is the brand-new accelerometer MEMS based on Murata’s proven 3D MEMS technology. The new MEMS uses a double-differential measurement principle, familiar from current SCA3400 and legacy SCA103T series sensors. The double differential measurement enables SCH16T-K20’s market leading low noise density, as well as thermal and lifetime stability.　　The SCH16T-K20 also includes an enhanced version of the market-leading low-noise SCH16T gyroscope, now tuned specifically for the -40 °C to +85 °C temperature range to enable low offset bias shift across that range. All SCH16T series products are carefully validated with a test set based on AEC-Q100 operating temperature Grade 1 (-40 °C to +125 °C) standards*, ensuring reliable operation over a wide temperature window. The series sensors include market-leading self-diagnostic features, making them suitable for safety-critical applications. Murata’s unique MEMS stands out in the competitive IMU market for its exceptional mechanical resilience to shocks and vibration rectification. The series’ robust design and reliability contribute to longer device lifespans and reduced waste.　　The SCH16T-K20 becomes the highest-performing variant in the SCH16T lineup while maintaining pin-to-pin and software compatibility. This compatibility makes integration of different SCH16T variants easy for OEMs and module designers. Mass production of the SCH16T-K20 is scheduled to begin in the first half of 2026. Murata will continue developing sensor solutions aligned with evolving market demands, contributing to safer, more sustainable, and higher-performing technologies across industrial and consumer markets.
Key word：
Release time：2025-12-26 16:09 reading：998 Continue reading>>
ROHM launches SiC MOSFETs in TOLL package that achieves <span style='color:red'>bot</span>h miniaturization and high-power capability
Trade news

ROHM launches SiC MOSFETs in TOLL package that achieves both miniaturization and high-power capability

　　ROHM has begun mass production of the SCT40xxDLL series of SiC MOSFETs in TOLL (TO-Leadless) packages. Compared to conventional packages (TO-263-7L) with equivalent voltage ratings and on-resistance, these new packages offer approximately 39% improved thermal performance. This enables high-power handling despite their compact size and low profile. It is ideal for industrial equipment such as server power supplies and ESS (Energy Storage Systems) where the power density is increasing, and low-profile components are required to enable miniaturized product design.　　In applications like AI servers and compact PV inverters, the trend toward higher power ratings is occurring simultaneously with the contradictory demand for miniaturization, requiring power MOSFETs to achieve higher power density. Particularly in totem pole PFC circuits for slim power supplies, often called “the pizza box type,” stringent requirements demand thicknesses of 4mm or less for discrete semiconductors.　　ROHM's new product addresses these needs by reducing component footprint by approximately 26% and achieving a low profile of 2.3mm thickness – roughly half that of conventional packaged products. Furthermore, while most standard TOLL package products are limited by a drain-source rated voltage of 650V, ROHM's new products support up to 750V. This allows for lower gate resistance and increased safety margin for surge voltages, contributing to reduced switching losses.　　The lineup consists of six models with on-resistance ranging from 13mΩ to 65mΩ, with mass production started in September 2025 (sample price: $37.0/unit, tax excluded). 　　Product Lineup　　Application Examples　　・Industrial equipment: Power supplies for AI servers and data centers, PV inverters, ESS (energy storage systems)　　・Consumer equipment: General power supplies　　EcoSiC™ Brand　　EcoSiC™ is a brand of devices that utilize silicon carbide (SiC), which is attracting attention in the power device field for performance that surpasses silicon (Si). ROHM independently develops technologies essential for the evolution of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, we have established an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.• EcoSiC™ is a trademark or registered trademark of ROHM Co., Ltd.　　Terminology　　Totem Pole PFC Circuit　　A highly efficient power factor correction circuit configuration that reduces diode losses by using MOSFETs as rectifier elements. The adoption of SiC MOSFETs enables high voltage withstand capability, high efficiency, and high-temperature operation for the power supply.
Key word：
Release time：2025-12-04 17:10 reading：1148 Continue reading>>
Fibocom-Powered Ro<span style='color:red'>bot</span>ic Mower Solution Featured at SPOGA+GAFA 2025, Pioneering the Future of Boundary-Free Smart Lawn Care
Trade news

Fibocom-Powered Robotic Mower Solution Featured at SPOGA+GAFA 2025, Pioneering the Future of Boundary-Free Smart Lawn Care

　　Cologne, Germany – June 24, Fibocom, a global leader incommunication modules and AI solutions, had its state-of-the-art intelligentrobotic lawn mower solution prominently showcased at SPOGA+GAFA 2025, theworld’s leading trade fair for the garden and outdoor living industry. Multiplerobotic lawn mowers powered by Fibocom’s technology demonstrated seamlessnavigation across simulated garden environments—autonomously detectingboundaries, planning precise mowing routes, and avoiding obstacles—all withoutrelying on traditional physical perimeter wires. This impressive demonstrationhighlighted the disruptive potential of AI-driven, boundary-free lawn caresolutions.　　The global smartrobotic mower market holds vast potential, with Europe and North Americaaccounting for 72% of the world’s 250 million private gardens. Yet, adoptionremains low—under 6% in North America and 10–30% in Europe—highlightingsubstantial room for growth as demand for intelligent lawn care accelerates.　　Fibocom’ssolution integrates advanced AI vision, multi-sensor fusion, and intelligentnavigation to eliminate the need for traditional boundary wires. This enablesrobotic mowers to autonomously detect perimeters and obstacles, ensuring safe,efficient, and precise operation while significantly improving mowing productivity.It’s worth mentioning that, having accumulated over 350,000 kilometers ofreliable autonomous performance worldwide, this solution has proven itsrobustness in diverse and complex garden environments.　　Fibocom provides two solution variantstailored to diverse customer needs: a standard pure-vision model and a flagshipversion combining binocular VIO (Visual-Inertial Odometry) with RTK (Real-TimeKinematic) for superior stability, precision, and large-area coverage—ideal forprofessional and commercial applications. This comprehensive suite, encompassingstereo cameras, AI processing boards, motor control units, and customizablemobile applications, enables OEM partners to accelerate product developmentcycles and focus resources on product differentiation and go-to-marketstrategies. For end users, it revolutionizes lawn care with smart mapping,autonomous operation, and auto-recharging for a safer, easier experience.　　Strategic partnerships with top global brandsare fast-tracking the launch of Fibocom-powered products in key internationalmarkets over the next six months, underscoring Fibocom’s technologicalleadership and growing influence in the smart lawn care industry. Leveragingcutting-edge innovation and manufacturing excellence, Fibocom empowers partnersto penetrate top-tier European retail channels and scale globally, where everyimpeccably maintained lawn showcases the strength of Chinese smartmanufacturing on the world stage.
Key word：
Release time：2025-07-11 11:28 reading：953 Continue reading>>
New High Accuracy Current Sense Amps Compatible with Both Negative and High Voltages
Trade news

New High Accuracy Current Sense Amps Compatible with Both Negative and High Voltages

　　ROHM has developed a new lineup of high accuracy current sense amps – the BD1423xFVJ-C and the BD1422xG-C. They are qualified under the AEC-Q100 automotive reliability standard. The BD1423xFVJ-C series, offered in the TSSOP-B8J package, supports input voltages up to +80V, making it ideal for high-voltage environments such as 48V DC-DC converters, redundant power supplies, auxiliary batteries, and electric compressors. The series includes three models with different gain settings: BD14230FVJ-C, BD14231FVJ-C and BD14232FVJ-C.　　For lower voltage use cases, the BD1422xG-C, available in the compact SSOP6 package, supports input voltages up to +40V. This makes them suitable for automotive applications requiring space-saving designs, such as current monitoring and protection (overcurrent) in 5V/12V power supply networks used in body and drivetrain domains. Like its high-voltage counterpart, this series also consists of three different gain options: BD14220G-C, BD14221G-C and BD14222G-C.　　In recent years, alongside conventional 5V/12V power supplies, the automotive market has seen a growing adoption of 48V systems fueled by the rising popularity of electric vehicles. Furthermore, as vehicle functionality becomes more advanced, the need for precise monitoring and control across a wide range of applications continues to increase, placing a greater importance on high-accuracy current sensing.　　A current sense amp indirectly measures the current flowing through a circuit by amplifying the miniscule voltage drop across a shunt resistor. The amplified signal is then sent to an ADC or comparator for system control and monitoring. ROHM’s automotive-grade current sense amps meet market demands by leveraging proven analog expertise. This enables high-accuracy current sensing with compatibility for both negative and high voltage environments, contributing to improved safety and reliability in automotive applications, particularly electric vehicles.　　These new products achieve greater space efficiency by integrating most of current sensing circuitry, typically comprised of an operational amplifier and discrete components, int o a single package. As a result, current detection is possible by simply connecting a shunt resistor. The devices also feature a two-stage amplifier configuration, consisting of a chopper amplifier at the input and an auto-zero amplifier at the output. Internal resistor matching for gain setting ensures stable, accurate current sensing (±1%) while minimizing the effects of temperature variations.　　Furthermore, current detection accuracy is maintained even when an external RC filter circuit added for noise suppression, significantly reducing design complexity and development time. Additional features include -14V negative voltage tolerance that supports back electromotive force, reverse connection, and negative voltage input.　　Going forward, ROHM will continue to deliver optimal solutions that contribute to higher precision and enhanced reliability in automotive equipment.　　Application Examples　　• BD1423xFVJ-C (for 48V systems): Redundant power supplies, auxiliary batteries, DC-DC converters, and electric compressors, and the like　　• BD1422xG-C (for 5V/12V systems): Body DCUs (Domain Control Units) / ECUs (Electronic Control Units), etc.　　Terminology　　AEC-Q100 Automotive Reliability Standard　　AEC stands for Automotive Electronics Council, a reliability standard for automotive electronic components established by major automotive manufacturers and US electronic component makers. Q100 is a standard that specifically applies to integrated circuits (ICs).　　Shunt Resistor　　A resistor connected in series in the current path to detect the current in the circuit by measuring the potential difference across it.　　Chopper Amp　　An amp circuit designed to minimize signal offset and noise, primarily used for accurately amplifying low-frequency and weak DC signals.　　Auto-Zero Amp　　An amp that automatically compensates for offset voltage (unwanted noise and errors) by continuously sampling and correcting it during operation. This ensures high signal accuracy, making it ideal for applications that demand ultra-precise measurement and signal processing.
Key word：
Release time：2025-06-13 16:56 reading：735 Continue reading>>
Nidec Instruments Develops Vacuum-resistant Liquid Crystal Substrate Transfer Ro<span style='color:red'>bot</span>s
Trade news

Nidec Instruments Develops Vacuum-resistant Liquid Crystal Substrate Transfer Robots

　　Nidec Instruments Corporation (“Nidec Instruments” or the “Company”), a wholly owned subsidiary of Nidec Corporation, today announced the development of liquid crystal substrate transfer robots that can move their joints in a vacuum environment as freely as in the air.　　In a process to manufacture liquid crystal, organic electroluminescent (EL), and other displays, mother glass substrates are constantly required to be made larger, and their processing speed faster, as their production cost must be reduced and screen sizes must be made larger at the same time. In recent years, display manufacturers are required to handle large, 3m x 3m products because the larger glasses robots can transfer, the better transfer efficiency they can achieve.　　As mother glass substrates’ thin-film and vapor deposition processes require an extremely clean vacuum environment, transfer robots used in such processes must be vacuum-resistant as well.　　As the company with the largest global market share for transfer robots used in organic EL substrates’ vapor deposition process, Nidec Instruments utilized its knowhow in these latest products as well. Robots that operate in vacuum have joints with seals to keep air and dust inside their arms and other parts. Though such sealing mechanisms restrain the movements of transfer robots’ joints, the Company’s latest products adopt magnetic seals integrated with reducers to minimize the seals’ use, and thus secure the same level of freedom as in the air. To meet its customers’ needs, Nidec Instruments has added two new modes with different arm shapes, i.e., a boomerang type and a scalar type, to its product lineup, while suppressing cost by using common units for them.　　As a member of the world’s leading comprehensive motor manufacturer, Nidec Instruments stays committed to offering revolutionary solutions that contribute to creating a comfortable society.
Key word：
Release time：2023-12-11 17:46 reading：2395 Continue reading>>
Nidec Instruments Launches New Semiconductor Wafer Transfer Ro<span style='color:red'>bot</span>
Trade news

Nidec Instruments Launches New Semiconductor Wafer Transfer Robot

　　Nidec Instruments’ Latest Semiconductor Wafer Transfer Robot, SR7163 series.　　Despite a temporary slowdown in 2023, the global semiconductor market is expected to expand from 2024 after demand recovers in a wide variety of product groups such as memory logic and other IC products, and in the O-S-D (optoelectronics, sensor/actuator, and discrete semiconductor) segment. As the demand grows around the world for the construction of semiconductor factories with high production capacity, Nidec Instruments has developed the SR7163 series, a semiconductor wafer transfer robot to respond to its customers’ needs.　　Among semiconductor manufacturing equipment, the SR7163 series is expected to be used in batch-type thermal treatment equipment and other machines in processes that require to transfer multiple substrates to a stage with a different slot pitch. A product that utilizes an arm-link mechanism to move a hand horizontally, the SR7163 series boasts a small minimum turning radius that can accommodate narrow pitches of up to the minimum limit of 6.5mm. In addition, with the use of a highly airtight link-type arm, the SR7163 series meets ISO14644-1’s Class-1 cleanliness requirements, which is the industry’s highest-level cleanliness.　　As a member of the world’s leading comprehensive motor manufacturer, Nidec Instruments stays committed to offering revolutionary solutions that contribute to building a comfortable society.　　For more details on the above product, Please contact AMEYA360 official customer!
Key word：
Release time：2023-09-05 13:49 reading：3280 Continue reading>>
OMRON:Enabling safe sterilization of medical equipment with ro<span style='color:red'>bot</span>ics
Trade news

OMRON:Enabling safe sterilization of medical equipment with robotics

　　Hospitals play a major role in keeping our societies safe and thriving. Any medical practice is centered around instruments which form the backbone of the hospitals. Medical instruments require special care, and they must always be sterilized before operating on patients. Sterilization is quite a tedious task as it involves moving around instrument trolleys around the hospital which leaves the staff indulged in unproductive and injury prone activities.　　OMRON team in Australia took note of this redundant practice and partnered with Atherton to come up with an innovative solution that will encourage safe sterilization of medical instruments with automation.
Key word：
Release time：2023-01-11 14:32 reading：4368 Continue reading>>
IDC Expects Asia/Pacific excluding Japan Spending on Ro<span style='color:red'>bot</span>ics to Reach US$129.4B in 2022
Trade news

IDC Expects Asia/Pacific excluding Japan Spending on Robotics to Reach US$129.4B in 2022

　　The latest IDC Worldwide Semiannual Robotics and Drones Spending Guide forecasts Asia Pacific excluding Japan (APEJ) spending on robotics (including drones) and associated services to reach USD 129.4 billion by 2022, essentially three times the spending in 2018, with a five-year CAGR of 25.2% during 2017-2022. APEJ tops with the largest market share for robotics applications followed by the United States and Japan. Both are expected to record for more than 61.6% of the world’s entire robotics market in 2022.　　"To survive the escalating competition, APEJ manufacturing organizations surveyed by IDC in 2018 are putting robotics as their top priority for technology investment," said Dr. Jing Bing Zhang, Research Director for Worldwide Robotics at IDC. “While the uncertainty of the trade war between the United States and China is likely to dampen the market growth in the near term, we expect the growth trend to pick up from 2020 onward.”　　Discrete and process manufacturing are the dominant industries in robotics (including drones) spending, which turns over 58.1% of the overall spend in APEJ in 2019. Largely, welding and assembling use cases in discrete manufacturing, whilst pick and pack, and bottling use cases in process manufacturing are driving the robotics spend in 2019. However, customer deliveries, vegetable seeding and planting are the drone use cases which we expect to grow at fast pace with a five-year CAGR 126.4% and CAGR 112.1% respectively over the forecast period (2017-22).　　“There has been an intensive wave of industrial automation for which robotics and drones provide a major base; hence attracting investments with each passing year. Under Robotics, despite Manufacturing being a dominant industry in this area, investments will continue to increase in resource industry, retail, construction, among others,“ said Swati Chaturvedi, Senior Market Analyst at IDC.　　“On the other hand, drones, which are majorly a consumer-oriented technology, are gaining momentum in its industrial usage by enterprises and governments alike for tasks as mundane as filmmaking and inspection or as complex as agricultural uses, mining operations assistance, and insurance assessment.”　　From a technology perspective, hardware purchases related spending on robotics systems (including drones) in APEJ, which includes industrial, service and consumer robots and after-market hardware, is forecast to grow to $81.0 billion in 2022.　　China accounts largest market share in the Asia Pacific robotics (including drones) market. Its spending on robotics is expected to reach $80.5 billion, representing 62.2% of APEJ region's total spending in 2022.
Key word：
Release time：2019-01-25 00:00 reading：4299 Continue reading>>
Ca<span style='color:red'>bot</span> Microelectronics Corporation completes acquisition of KMG Chemicals
Trade news

Cabot Microelectronics Corporation completes acquisition of KMG Chemicals

Cabot Microelectronics Corporation (Nasdaq: CCMP), today announced that it has completed its previously announced acquisition of KMG Chemicals, Inc.  As a result of the acquisition, KMG has become a wholly owned subsidiary of Cabot Microelectronics.  Under the terms of the definitive agreement, each share of KMG common stock was converted into the right to receive $55.65 in cash and 0.2000 of a share of Cabot Microelectronics common stock, without interest and with cash paid in lieu of any fractional shares.The acquisition will extend and strengthen Cabot Microelectronics’ position as one of the leading suppliers of consumable materials to the semiconductor industry.  Additionally, the combined company will be a leading global provider of performance products and services for improving pipeline operations and optimizing throughput.  The transaction is expected to be significantly accretive to Cabot Microelectronics’ free cash flow and adjusted earnings per share in year one, excluding any acquisition-related costs.“I am pleased to announce that we have completed the KMG transaction.  We welcome KMG’s employees to our team and look forward to our journey together towards becoming the premier global provider of semiconductor and specialty materials.  We believe that our employees, customers and shareholders will benefit from this transaction as we become a stronger company, focused on providing high-performing and innovative solutions to our customers,” said David Li, President and CEO of Cabot Microelectronics.  “KMG’s industry-leading electronic materials business will expand our CMP product offerings with high-purity solutions used throughout the semiconductor manufacturing process.  We are also excited about the addition of KMG’s performance materials businesses to our portfolio which will allow us to expand our participation into new markets including the attractive, high-growth pipeline performance segment.”In connection with the acquisition, Cabot Microelectronics borrowed $1.065 billion under a new senior secured term loan facility, the proceeds of which were used to finance in part the cash portion of the merger consideration, to repay KMG’s existing indebtedness and to pay fees and expenses related to the acquisition.  Cabot Microelectronics issued approximately 3.2 million shares of common stock to holders of KMG common stock for the stock portion of the merger consideration.
Key word：
Release time：2018-11-16 00:00 reading：1356 Continue reading>>

Turn to

/ 3

Popular categories
Semiconductors Circuit Protection Electromechanical Embedded Solutions Connectors, Interconnects Sensors, Transducers Optoelectronics Development Kits Test and Measurement Power Fans, Thermal Management Boxes, Enclosures, Racks Cables, Wires Passive Components Others
  • Week of hot material
  • Material in short supply seckilling
model brand Quote
CDZVT2R20B ROHM Semiconductor
BD71847AMWV-E2 ROHM Semiconductor
MC33074DR2G onsemi
TL431ACLPR Texas Instruments
RB751G-40T2R ROHM Semiconductor
model brand To snap up
STM32F429IGT6 STMicroelectronics
IPZ40N04S5L4R8ATMA1 Infineon Technologies
ESR03EZPJ151 ROHM Semiconductor
BP3621 ROHM Semiconductor
TPS63050YFFR Texas Instruments
BU33JA2MNVX-CTL ROHM Semiconductor
Hot labels
ROHM
IC
Averlogic
Intel
Samsung
IoT
AI
Sensor
Chip
Original authorized brand
More Licensed Brands>>
Information leaderboard
  • Week of ranking
  • Month ranking

About us

Qr code of ameya360 official account

Identify TWO-DIMENSIONAL code, you can pay attention to

AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.

Please enter the verification code in the image below：

verification code