<span style='color:red'>Murata</span> Type 2FR Hostless Tri-Radio Module
     Murata Electronics Type 2FR Hostless Wi-Fi® 6 + BLUETOOTH® LE 5.4 / 802.15.4 Tri-Radio Module is highly integrated while based on the NXP RW612 Wireless MCU. The Type 2FR wireless module delivers class-leading integration, efficiency, and multiple radio capabilities in a 12mm x 11mm package.The Murata Type 2FR supports dual-band Wi-Fi 6, Bluetooth Low Energy (LE) 5.4, IEEE 802.15.4, and ethernet. This versatility provides seamless connectivity and operational efficiency. Additionally, it supports Matter Network over Wi-Fi, Thread, and ethernet, simplifying device interoperability and management.FEATURESNXP RW612 inside260MHz Arm® Cortex® -M33Supports IEEE 802.11a/b/g/n/ac/ax specification with dual-band 2.4GHz and 5GHz Wi-Fi 6SISO with 20MHz channels; up to MCS9 data ratesSupports Bluetooth specification version 5.4Supports IEEE 802.15.41.2MB SRAM; 16MB Flash; External PSRAM interface for system memory expansion up to 128MB64 GPIOs, FlexSPI, SDIO 3.0, Ethernet, USB, USART, I2C, SPI, I2S, PCM, ACOMP, DAC, ADC, JTAGRF signal from pin padTemperature range of -40°C to 85°C12.0mm x 11.0mm x 1.55mm (maximum) dimensionsMSL 3Surface-mount typeRoHS compliantAPPLICATIONSSmart homeBlood pressure monitorFitness equipmentGaming accessoriesGlucometerHome security and surveillanceIn-home energy displayMajor home appliancesMulti-radio hub/smart device gateway for internet connectivitySmall and medium appliancesSmart power socket and light switchWeighing scaleIndustrialBuilding securityLightingPoint of Sale (POS) terminals
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Release time:2025-03-24 13:52 reading:187 Continue reading>>
ROHM’s EcoGaN™ has been Adopted for AI Server Power Supplies by <span style='color:red'>Murata</span> Power Solutions
  ROHM has announced that the EcoGaN™ series of 650V GaN HEMTs in the TOLL package has been adopted for AI server power supplies by Murata Power Solutions, a subsidiary of the Murata Manufacturing Group and a leading supplier of electronic components, batteries and power supplies in Japan. Integrating ROHM’s GaN HEMTs, which combine low loss operation with high-speed switching performance, in Murata Power Solutions’ 5.5kW AI server power supply unit achieves greater efficiency and miniaturization. Mass production of this power supply unit is set to begin in 2025.  Rapid advancements in IoT-related fields such as AI and AR (Augmented Reality) have led to a surge in global data traffic in recent years. Notably, the power consumption for a single AI-generated response is estimated to be several times higher than that of a standard Internet search, highlighting the need for more efficient AI power supplies. Meanwhile, GaN devices, known for low ON resistance and high-speed switching performance, are gaining attention for their ability to enhance power supply efficiency while reducing the size of peripheral components such as inductors used in power circuits.  Dr. Joe Liu, Technical Fellow, Murata Power Solutions  “We are pleased to have successfully designed AI server power supply units featuring higher efficiency and power density by incorporating ROHM’s GaN HEMTs. The high-speed switching capability, low parasitic capacitance, and zero reverse recovery characteristics of GaN HEMTs help minimize switching losses. This allows for higher operating frequencies in switching converters, reducing the size of magnetic components. ROHM’s GaN HEMTs deliver competitive performance and exceptional reliability, yielding excellent results in the development of Murata Power Solutions’ 5.5kW AI server power supply units. Going forward, we will continue our collaboration with ROHM, a leader in power semiconductors, to improve the efficiency of power supplies and address the social issue of increasing power demand.”  Yuhei Yamaguchi, General Manager, Power Stage Product Development Div., LSI Business Unit, ROHM Co., Ltd.  “We are delighted that ROHM's EcoGaN™ products have been integrated into AI server power supply units from Murata Power Solutions, a global leader in power supplies. The GaN HEMTs used in this application provide industry-leading switching performance in a high heat dissipation TOLL package, enhancing power density and efficiency in Murata Power Solutions’ power supply units. We look forward to strengthening our partnership with Murata Manufacturing, a company that shares the similar vision of contributing to society through electronics - promoting the miniaturization and efficiency of power supplies to enrich people’s lives.”  Murata Power Solutions’ Power Supply Units for AI Servers  Murata Power Solutions’ series of “1U Front End” AC-DC power supplies includes the D1U T-W-3200-12-HB4C (12V output) and D1U T-W-3200-54-HB4C (54V output) 3.2kW power supplies in the high power density short version M-CRPS package, as well as the 5.5kW D1U67T-W-5500-50-HB4C designed for AI servers. These front-end power supplies deliver high conversion efficiency that meets the stringent requirements of 80+ Titanium and Open Compute products while supporting N+m redundant operation for system reliability, making them ideal for powering the latest GPU servers. In addition to providing reliable, efficient power for servers, workstations, and storage/communication systems, the low profile 1U design of these units helps to minimize system footprint.  ROHM's EcoGaN™  ROHM’s brand name for GaN devices that contribute to energy conservation and miniaturization by maximizing GaN characteristics to achieve lower application power consumption, smaller peripheral components, and simpler designs requiring fewer parts.  • EcoGaN™ is a trademark or registered trademark of ROHM Co., Ltd.  Related ROHM Web Pages        • 650V TOLL Package GaN HEMTs (Feb. 2025 News Release)  https://www.rohm.com/news-detail?news-title=2025-02-27_news_gan&defaultGroupId=false  • ROHM GaN Power Device Page (EcoGaN™)  https://www.rohm.com/products/gan-power-devices/  About Murata Manufacturing  Murata Manufacturing is a global leader in the development, production, and sales of ceramic-based electronic components. By leveraging proprietary expertise in material development, process innovation, product design, and production technology, supported by software, analysis, and evaluation, Murata Manufacturing creates innovative products that drive the advancement of an electronic society.  For more information, please visit Murata Manufacturing's website: https://corporate.murata.com/en-global/
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Release time:2025-03-13 11:46 reading:270 Continue reading>>
<span style='color:red'>Murata</span> SCH1633-D01 Sets a New Standard for Automotive 6DoF Sensor
  Murata is expanding its range of innovative Six Degrees-of-Freedom devices with the introduction of the SCH1633-D01. The micro-electromechanical system (MEMS) based sensor moves the benchmark for performance, system integration, and total cost optimization. It is designed for various automotive applications, including autonomous driving (AD), advanced driver-assistance systems (ADAS), inertial navigation, vehicle stability control, and camera or headlight alignment.  Market Demands  With the increasing push for vehicle autonomy and safety, there is an unquestionable demand for extremely accurate sensors with comprehensive built-in safety features and a high level of integration. Likewise, complying with technical regulations like the UNECE’s headlight leveling regulation requires accurate and cost-optimized solutions – something the SCH1633-D01 has demonstrated it can achieve.  The SCH1633-D01 is a single-package solution optimized for zonal architecture where all required subsystems, like GNSS integration, chassis control, and vehicle attitude sensing (camera and headlight alignment) can utilize its measurements. It is targeted for deployment in the central vehicle inertia measuring unit (IMU) providing a high-quality signal for all subsystems within the vehicle even in the toughest environments. This integration helps to reduce system complexity and provides a much-needed opportunity for cost optimization.  SCH1633-D01 Features  SCH1633-D01 is packaged in a unique 24-pin SOIC housing and uses the SafeSPI 2.0 interface with an up to 20-bit data frame for an extremely smooth and high-resolution output. The component supports various system-level time synchronization features, ensuring that the SCH1633-D01’s output can be easily harnessed across the entire vehicle. Furthermore, the extensive self-diagnostics features utilize over 200 monitoring signals to ensure the output is always trustworthy.  The SCH1633-D01 is designed to provide a high-quality output, even in harsh temperature conditions. It features AEC-Q100 grade 1 qualification to guarantee reliable use throughout the whole component lifetime and is ISO26262 compliant with ASIL-B+ rating (up to ASIL-D via system integration) for exceptional built-in safety.  For further information on the product’s extensive functionality, please visit its detail page here.  Murata’s Recent 6DoF MEMS Success  Murata’s previous generation 6DoF MEMS solution has proven to be highly successful as over 90% of autonomous miles in California alone are driven with the sensor on board. The improvements in this next-generation 6DoF devices are based on customer feedback, and they have already gained global recognition.  The industrial counterpart SCH16T-K01, launched in January this year, has won the first prize in the Industrial & Manufacturing category of the Sensors Converge fair’s “Best of Sensors Award” competition and the SCH1633-D01 preliminary sample feedback has been remarkably positive.  A partner of Murata, Hexagon, has been using the SCH1633-D01 in their products. Gordon Heidinger, Segment Manager, Automotive and Safety-Critical Systems at Hexagon’s Autonomy & Positioning division, remarked, “  The SCH1633-D01 is displaying exceptional performance for a single MEMS sensor. We're pleased to promote this sensor integrated with our positioning solution”.  Murata has also successfully demonstrated that the UNECE headlight leveling regulation can be fulfilled with the SCH1633-D01 sensor in combination with a commercially available alignment algorithm. This is a significant leap towards cost-effective regulation compliance.  “Automotive 6DoF applications are rapidly developing, with fierce competition among manufacturers to capture a share of the market. This product offers high performance, demanded by the latest systems, while also providing a much-needed cost-saving opportunity,” said Ville Nurmiainen, General Manager of Product management at Murata Electronics Oy. He continued, “The SCH1633-D01 will give both a technological and cost down advantage to OEMs choosing to utilize the product to its full potential and will help them to further drive automotive applications forward and create safer roads for us all.”  Preliminary samples are available now. Mass production of this exciting new solution is planned for early 2025.
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Release time:2024-11-12 11:22 reading:933 Continue reading>>
<span style='color:red'>Murata</span>’s Type 1SC-NTN module achieves Skylo U.S. certification for cellular and non-terrestrial network connectivity
<span style='color:red'>Murata</span> Unveils the World’s Smallest Multilayer Ceramic Capacitor with the First 006003-inch Size (0.16mm×0.08mm) Device
  Murata Manufacturing Co. Ltd has expanded its innovative range of multilayer ceramic capacitors (MLCCs) with yet another groundbreaking addition. Exemplifying Murata’s continual commitment for minimization, it has developed the world’s first 006003-inch size (0.16 mm x 0.08 mm) MLCC. This achievement represents a volume ratio approximately 75% lower than the existing smallest product, the 008004-inch size (0.25×0.125mm).  In recent years, as electronic devices become more sophisticated and compact, the number of electronic components installed has increased, while simultaneously the space required for installation has been reduced. As electronic devices continue to advance in intelligence, there has been a corresponding increase in the incorporation of MLCCs across all types of electronic devices, with the latest smartphones utilizing up to 1000 units. Against this background, there is a growing need for ultra-compact products that enable high-density component mounting with limited mounting space.  Since its inception in 1944, Murata has been committed to the exploration and advancement of ceramic capacitors, nurturing its unparalleled understanding of raw materials, manufacturing processes, and production technologies. In 2014, Murata successfully brought to market the world’s first 008004-inch size (0.25×0.125mm) multilayer ceramic capacitors, which have experienced growing utilization in smartphone modules and wearable devices. The creation of this MLCC is the outcome of years of focused R&D in elemental technologies, resulting in a device that measures just 0.16mm x 0.08mm x 0.08mm (L/W/T).  “Under our slogan 'Innovator in Electronics' we will continue to lead the electronics industry by providing innovative products and developing technologies,” said Hidetoshi Nakagawa, General Manager of Ceramic Capacitor Marketing at Murata Manufacturing Co Ltd. He continued, “This product is another world’s first in a long line of Murata’s market defining MLCCs and will significantly contribute to the future miniaturization and improvement of our customer’s electronic devices.”  This revolutionary product will be showcased at Murata’s booth (6H104) during the CEATEC JAPAN 2024 event, scheduled to take place at Makuhari Messe in Chiba Prefecture on October 15, 2024. For further information on CEATEC 2024 and tickets visit here
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Release time:2024-09-26 11:09 reading:720 Continue reading>>
<span style='color:red'>Murata</span>:Mass production begins for 0603M size copper electrode NTC thermistors, ideal for automotive applications
  Murata Manufacturing Co., Ltd. (hereinafter “Murata”) has developed 0603M size (0.6 x 0.3 x 0.3 mm) copper electrode NTC thermistors “NCU03XH103F6SRL” and “NCU03XH103F60RL” (hereinafter “this product”) for markets such as the automotive market where there is a demand for high reliability electronic components. This product is an expansion of the NCU series size lineup. Mass production has already begun, and samples can also be provided.  As advances are being made towards automated driving and IoT integration in the automotive market, circuit boards are being made with an increasingly larger number of electronic components, and in turn, higher component densities. With the increasing sophistication of ADAS*1/telematics technologies*2, there are higher loads on electronic components, amplifying the issue of component overheating. As a result, there is a heightened demand for overheating detection and temperature monitoring technologies.  We have taken advantage of Murata’s years of processing technology development experience to create a 0603M size (0.6 x 0.3 x 0.3 mm) product that can be used for high reliability applications. Compared to Murata’s existing products (1005M size), this product has an approximately 80% lower volume and approximately 70% smaller mounting area.  Murata will continue to expand our product lineup to meet market demand. By responding quickly to market demand, we also contribute to further improvements in circuit board component densities and downsizing of devices for high reliability applications.  *1ADAS: Advanced Driver Assistance System  *2Telematics technology: Devices that use communications technology installed in vehicles to collect and transmit driver and vehicle data and share information in real time. Main applications of this technology include navigation systems that collect traffic information to help drivers avoid traffic jams and voice recognition services used to operate in-car features.  Features  Works with automobiles and other systems that require high reliability components. Downsizing (0603M size) achieved with copper electrodes.  Approximately 80% lower volume and approximately 70% smaller mounting area than Murata’s existing products (1005M size). Because this product has the same characteristics as our existing products, there is no need to change the circuit board design when replacing an existing product with this product. This product will also help our customers increase their component density and save space on the circuit board.  Small in volume and capable of fast response.  Specifications
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Release time:2024-08-28 15:21 reading:732 Continue reading>>
<span style='color:red'>Murata</span>:Radisol Redefines Antenna Interference Countermeasures for Smartphones and Wearables
  Murata Manufacturing Co. Ltd announces the launch of Radisol – an innovative product designed to suppress interference between nearby antennas with low insertion loss, improving isolation and antenna radiation efficiency. This world-first solution is specifically engineered to meet the demands of compact modern devices like smartphones and wearables, offering benefits such as reduced power consumption, miniaturized construction, and enhanced communication quality. In addition, Radisol has been adopted by Motorola Mobility LLC (Headquarters: Libertyville, Illinois, USA, President: Sergio Buniac), in the new Edge series of smartphones scheduled to be released in August 2024. Motorola has realized a method of improving the characteristics of Wi-Fi® antennas by using Radisol.  As the demand for smaller smartphones and wearable devices grows, the number of antennas is also increasing to accommodate the expanding range of communication methods and bands. Additionally, MIMO technology to improve communication quality and speed is encouraging an increase in the number of antennas, while new designs such as foldable smartphones are encouraging antenna crowding. This has posed new difficulties, specifically the implications on antenna isolation and the decline in antenna effectiveness, as the interference of nearby antennas leads to a decrease in radiation efficiency.  Although discrete filters are a common solution for improving antenna isolation, they are not suitable when communication bands are closely situated, as insertion loss can impair antenna performance and occupy valuable board space. To address these challenges, Murata has created Radisol, a low-loss filter for antenna area that uses Murata’s unique ceramic multilayer technology and RF circuit design technology.  Antenna engineers usually construct a filter circuit using discrete L and C chip components to implement effective countermeasures. Instead, Radisol is just a single 0603-sized component that resolves the persisting challenges of antenna performance and packaging constraints. It effectively suppresses antenna interference, without significantly impacting the passband, and results in enhanced radiation efficiency and reduced power consumption.  Each Radisol component operates as a dedicated filter circuit designed specifically to mitigate the antenna interference associated with a specific communication band. The compact component integrates one capacitor and two inductors, providing band-stop filter characteristics within a single chip. Radisol features a unique design that utilizes the generation of lossless mutual inductance by two magnetically coupled coils. This setup forms a band-stop circuit with no notable insertion loss in the communication band. This specialized approach to antenna isolation enables Radisol to offer enhanced performance, with low insertion loss and high efficiency and system integration.  Included in the Radisol family are variants designed to effectively address the needs of common bands, including 2G & 5G Wi-Fi® as well as GPS signals. This eliminates the necessity of designing discrete filter circuits, simplifying the implementation of countermeasures. Murata will continue to expand upon the initial product lineup to further meet market demands and drive further innovation in antenna technology.  “By using Radisol engineers can address the challenges of modern communication devices without compromising signal integrity and radiation efficiency,” said Satoru Muto, General Manager of New Business Incubation Department at Murata. “By utilizing Murata's cutting-edge technology, this solution takes integration to a whole new level, eliminating the need for complex discrete filter circuits and saving valuable space.”  Radisol samples are available for evaluation and mass production has already begun in June 2024. To learn more about Radisol or to request samples, please contact your local Murata representative or visit here.
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Release time:2024-08-14 13:39 reading:741 Continue reading>>
<span style='color:red'>Murata</span> commercializes low-power Wi-Fi®/Bluetooth® combo module:Helping proliferate battery-powered IoT equipment
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Release time:2024-06-28 11:31 reading:602 Continue reading>>
<span style='color:red'>Murata</span> Power Solutions MPS Isolated DC-DC Converters
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Release time:2024-06-25 14:43 reading:751 Continue reading>>
<span style='color:red'>Murata</span>:Commercialized polymer aluminum electrolytic capacitors that have achieved low ESR 4.5 mΩ with a thin design and high capacitance
  Key features  Achieved low ESR 4.5 mΩ with a thin design and high capacitance  A low ESR product with high output noise level reduction effects  Contributes to stable power supply for CPU, GPU, and FPGA of data centers and accelerators that require high currents  Key applications: Server, accelerator, laptop PC  Request a free sample on the “my Murata” registered members-only portal website  Murata Manufacturing Co., Ltd. (hereinafter “Murata”) has developed the “ECASD40E477M4R5KA0” (hereinafter “this product”) polymer aluminum electrolytic smoothing capacitor that achieves low ESR (4.5 mΩ) while maintaining a thin design (2.0 mm Max) and large capacitance (470 μF) in a D case (7.3 x 4.3 mm), equivalent to conventional products*1. Mass production has already begun, and samples can also be provided.  *1ECASD40E477M006KA0 (470uF/2.5V/6mΩ)  In recent years, IT devices such as servers and accelerators used in data centers are being created to support larger currents. Since IC voltage fluctuation and heat generation are major issues that must be tackled to achieve stable device operation, it is necessary to both increase the capacitance of the capacitors used to suppress voltage fluctuations and to mount large, high-performance heat sinks (cooling units) on the ICs. Murata has proposed component costs reduction through problem solving using conventional low-profile and high-capacitance products as well as by reducing the number of components used.  However, there is a growing demand for lower ESR products as a response to noise amplification due to the application of larger currents. Murata has now developed this product with a ESR value improved by 25% while maintaining the height and high-capacitance of conventional products. With this product, Murata contributes to providing stable device power supply while suppressing mounting areas and costs of electronic components.  Specifications
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Release time:2024-06-11 15:13 reading:651 Continue reading>>

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