We warmly invite you to visit NOVOSENSE at PCIM Europe 2026. Discover how NOVOSENSE empowers innovation across automotive electronics, renewable energy & power supply, and industrial control with a comprehensive portfolio of isolators, interfaces, drivers, sensors, signal chain, and power management ICs.
Date: June 9–11, 2026
Venue: Nuremberg Exhibition Centre, Germany
Booth: Hall 4A, Booth 119
✦ What to Expect ✦
Functional safety ICs for safety-critical automotive systems
One-stop body control & automotive lighting solutions
SerDes and ultrasonic radar IC solutions for smarter mobility
Technical presentations on high-voltage electric mobility and AI data center power systems

✦ Highlights Preview ✦
Functional Safety ICs for Safety-Critical Automotive Systems
Isolated gate driver NSI6911F — certified by TÜV Rheinland to meet ISO 26262 ASIL D requirements, featuring up to 19A peak drive capability, ±150kV/μs CMTI, an integrated 12-bit isolated ADC, and advanced diagnostic functions for high-voltage applications such as traction inverters, OBCs, and DC-DC converters.
ASIL B ultrasonic radar ASSP NSUC1800 and LED driver NSL21924FS , reflecting NOVOSENSE's expanding functional safety portfolio across sensors, signal chain, power management, and driver ICs.
One-Stop Automotive Body Control & Lighting Solutions
For BCM and ZCU applications, NOVOSENSE offers motor driver products for brushed DC motors, stepper motors, BLDC motors, relays, valves, and solenoids, supporting efficient, precise, and safe motor control.
For automotive lighting, NOVOSENSE will showcase full-scenario LED driver solutions for ambient lighting, reading lights, headlighting, rear lighting, ISD/ISC lighting, grille lighting, and more, helping create safer, smarter, and more distinctive vehicle lighting experiences.
Enabling Smarter Mobility with SerDes and Ultrasonic Radar IC Solutions
SerDes chipset — NLS9116 single-channel serializer and NLS9246 four-channel deserializer, designed for cameras, displays, and domain controllers in ADAS and intelligent cockpit systems.
AK2 ultrasonic radar ASSP — comprising the NSUC1800 sensor-side chip and NSUC1802 host-side interface conversion chip, providing a turnkey solution for applications such as UPA and APA.
✦ Keynote Speeches ✦
Join NOVOSENSE experts at PCIM Europe 2026 for in-depth technical presentations on how advanced semiconductor technologies are addressing the evolving demands of high-voltage electric mobility and AI data center power systems.
E-Mobility & Energy Storage Stage
Hall 6, Booth 220
Topic: Evolution and Challenges of Gate Driver Technology for New Generation of xEV Powertrain System
Time: June 9, 2026 | 15:25–15:45 (GMT+1)
Speaker: Timmy Wu
Topic: Enabling EV High-Voltage Safety with Advanced Isolated Sensing
Time: June 11, 2026 | 12:05–12:25 (GMT+1)
Speaker: Lillian Liu
AI & Data Centers Stage
Hall 5, Booth 320
Topic: Power Density Scaling in AI Data Centers: From System Constraints to Semiconductor Device Challenges
Time: June 9, 2026 | 14:35–14:55 (GMT+1)
Speaker: Wenzhe Xu
Online messageinquiry
| model | brand | Quote |
|---|---|---|
| TL431ACLPR | Texas Instruments | |
| CDZVT2R20B | ROHM Semiconductor | |
| RB751G-40T2R | ROHM Semiconductor | |
| MC33074DR2G | onsemi | |
| BD71847AMWV-E2 | ROHM Semiconductor |
| model | brand | To snap up |
|---|---|---|
| BU33JA2MNVX-CTL | ROHM Semiconductor | |
| TPS63050YFFR | Texas Instruments | |
| IPZ40N04S5L4R8ATMA1 | Infineon Technologies | |
| BP3621 | ROHM Semiconductor | |
| STM32F429IGT6 | STMicroelectronics | |
| ESR03EZPJ151 | ROHM Semiconductor |
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