How Will <span style='color:red'>BIWIN</span> BGA SSD Break Through in the Intelligent Upgrade Path of Edge Devices?
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How Will BIWIN BGA SSD Break Through in the Intelligent Upgrade Path of Edge Devices?

　　In the wave of edge intelligence upgrades, as products are continuously evolving toward miniaturization and high integration, the device systems are confronted with dual challenges of physical space compression and surging computing power. Over the past years, BIWIN has invested significant effort in advancing research and development in storage technologies and advanced packaging and testing processes, providing it with competitive advantages in delivering tailored, miniaturized, and highly integrated storage solutions, including a diverse product portfolio, patented proprietary technologies, and a robust manufacturing and supply chain system.　　Notably, the BIWIN-launched EP410 BGA SSD, with its innovative architectural design, exemplifies a breakthrough solution for edge devices upgrades by offering three key capabilities: a compact and lightweight design, outstanding performance, and high reliability. While offering form factors as compact as those of embedded chips to meet the rigorous dimension requirements of portable devices, these SSDs are able to deliver superior performance and flexible capacity options compared to UFS/eMMC standards.　　Ultra-Thin, Compact Design to Maximize System Spatial Efficiency　　The increasing inference frequencies across smartphones and PCs have made the large capacity a fundamental configuration. Meanwhile, in order to deliver optimized user experience and robust operation under complicated environments, the terminal manufacturers are striving to achieve maximized hardware efficiency and capacity utilization within constrained system dimensions.　　Aligned with the trends in product iteration, BGA SSD EP410 is equipped with advanced packaging processes such as 16-layer die stacking and 40μm ultra-thin die, realizing the compact form factor measuring only 16×20×1.4mm—merely 1/14 the volume of conventional M.2 2280 SSDs (80×22×3.5mm). Surprisingly, it’s able to deliver uncompromising capacity up to 2TB, supporting the smooth image recognition and natural language processing in edge devices and free of capacity limitations. The adopted packaging processes not only reduces board footprint, providing more design flexibility for terminal manufacturers, but also enhances electrical performance to accommodate greater data throughput, enabling device manufacturers to develop more streamlined, competitively advantageous products.　　Uncompromised Performance, Establishing a Robust Foundation for Edge Intelligence Inference　　In terms of performance, BIWIN has harnessed its integrated R&D and packaging and testing business model, along with the optimization and tuning of firmware algorithm, to satisfy the critical demands for error correction, data security and integrity in storage products across various application scenarios.　　The BIWIN EP410 BGA SSD is compatible with PCIe 4.0 interface and NVMe protocol, with its sequential read/write speed reaching 7350MB/s and 6600MB/s respectively, far surpassing the theoretical bandwidth capability of UFS 4.0. Incorporated with self-developed flash memory management algorithm and dynamic bandwidth allocation technology, BIWIN BGA SSD has demonstrated excellent bandwidth stability, qualifying for edge intelligence devices’ access to high-speed data and transfers of high-load requirements with low latency, as well as the responsive handling of sophisticated intelligent tasks. From the application perspective, BIWIN BGA SSD has been included in the list of Google approved suppliers; on the compatibility front, it offers a cross-platform advantage, compatible with a variety of mainstream SoC solutions, which simplifies the design and introduction processes for clients.　　Intelligent Thermal Control and Reliability Design, Ensuring the Stable Operation of Critical Applications　　With the characteristics of chip miniaturization and high integration becoming more pronounced, the increases in power consumption and thermal output have presented challenges for devices’ operational stability and lifespan. Considering this, BIWIN EP410 BGA SSD has further strengthened its reliability design, verification, analysis and management processes. In order to ensure efficient heat dissipation, the product is engineered with DRAM-less architecture with intelligent thermal throttling, as well as in-house LDPC, dynamic and static wear leveling, bad block management and multi-environmental adaptability, contributing to significantly improving the data integrity and security, ensuring long-term stable operations and preventing disconnection during critical usage scenarios including gaming, productivity applications, and content creation.　　Having been subjected to BIWIN’s thorough testing procedures, including electrical performance, SI, application, compatibility, and reliability testings, the products have been validated with their MTBF exceeding 1,500,000 hours and operating temperature ranging from 0℃ to 70℃, enabling the flagship intelligent terminals, for example the 2-in-1 laptops, UAVs, automotive IVI, to catch the wave of edge intelligence upgrades.　　Conclusion　　From the successful mass production of its first PCIe BGA SSD in 2018 to the latest generation EP410 BGA SSD featuring the PCIe Gen4 x4 interface, BIWIN’s continuously evolving products demonstrate its deep expertise in miniaturization and high-integration technologies, while also highlighting its visionary foresight in the ecosystem of edge intelligence. As AI and storage technologies progress toward deeper ecological integration, BIWIN will further leverage its early-mover advantages in mobile terminal storage chips and extend this advantage into the edge intelligence era. Whether in hardware design, software optimization, or ecosystem construction, BIWIN remains committed to advancing industry progress and delivering increasingly intelligent, efficient, and reliable storage solutions to users.
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Release time：2025-03-20 14:01 reading：224 Continue reading>>
<span style='color:red'>BIWIN</span> Solutions for Communication Modules: High-Speed, Stable, and Built for Seamless Data Flow
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BIWIN Solutions for Communication Modules: High-Speed, Stable, and Built for Seamless Data Flow

　　The Internet of Things (IoT) is on a steep upward trajectory. Statista predicts that by 2025, the world will see a surge of connected IoT devices to 29.422 billion units from 9.757 billion units, with CAGR reaching 11.67%. This explosion isn’t just powering the deployment of more smart gadgets; it’s opening up huge opportunities for hardware and storage tech. At the core of this ecosystem, communication modules serve as the vital link between the physical and digital realms. Their performance directly shapes the efficiency, stability, and security of IoT systems, handling everything from collecting sensor data to transmitting it wirelessly to the cloud or end devices—powering critical functions like remote monitoring and data analysis.　　With the rapid expansion of IoT applications, storage components within communication modules face heightened challenges. They must excel in high-bandwidth data transmission, multitasking concurrency, continuous data streaming over extended periods, efficient and stable data read/write operations, data security protection, and system compatibility to ensure real-time transmission and secure storage of critical data.　　In response to these industry challenges head-on, BIWIN draws on its “integrated R&D and packaging” expertise, along with its expertise from markets such as smartphones and smart wearables, to offer a comprehensive storage solution product matrix for communication modules, including eMMC, LPDDR, eMCP, uMCP, and more. These products have been widely applied to power 5G/4G and smart modules from industry leaders like Quectel, Fibocom, and MeiG Smart, providing solid foundations for the efficient and reliable operations of communication networks.　　01 Tackling Tough Scenarios with Top-Notch Storage　　In practical deployments across fields such as smart metering, industrial applications, routers, automotive systems, and POS machines, communication modules face numerous challenges. Particularly in outdoor environments, harsh weather, extreme temperatures, humidity fluctuations, prolonged continuous operation, and electromagnetic interference can all impact module performance. Any data loss or delay could result in IoT system failures or degraded service quality.　　Taking specific IoT application scenarios as an example, in surveillance systems requiring uninterrupted high-definition video recording, storage components must maintain stable, high-speed read/write performance. To meet these demanding requirements, BIWIN’s storage chips are featured with custom-designed firmware architectures, dynamic SLC caching and unique direct-write solutions, and firmware optimizations for garbage collection and data encryption, contributing to the consistently stable data read/write operations. Testings show that BIWIN’s eMMC products achieve full-disk write speeds exceeding 15MB/s with performance fluctuations below 5%, perfectly aligning with IoT-specific application standards. Additionally, BIWIN’s storage chips support remote firmware upgrades for communication modules, enhancing device operational efficiency.　　On the reliability front, BIWIN’s chips are loaded with cutting-edge packaging technologies like multi-layer die stacking, ultra-thin dies, and heterogeneous multi-chip integration, capable of realizing a perfect balance among performance, durability, and heat management. Meanwhile, the chips have also been tested with rigorous processes, covering electrical testing, signal integrity (SI) testing, reliability testing, and application testing. These chips can withstand gravitational acceleration up to 1500G, vibration amplitudes of 20-2000Hz, and achieve a mean time between failures (MTBF) exceeding 1.5 million hours, ensuring high-quality delivery and consistency across all aspects.　　02 Building a Comprehensive Product Matrix to Provide Efficient and Reliable Storage Support　　With key attributes such as highly stable read/write performance, exceptional reliability and durability, and excellent compatibility, BIWIN’s eMMC, LPDDR4X, eMCP3/4x, and uMCP2.2 series products have earned certifications from mainstream SoC platforms like Qualcomm, MediaTek, and Unisoc. They have been integrated into the supply chains of multiple renowned communication module manufacturers, continuously empowering the stable operation of communication modules.　　In conclusion　　As technologies such as AI, edge computing, 5G/6G, and LPWAN become deeply integrated, the IoT will evolve into more mature and diverse forms, permeating all aspects of life and generating immense demand for data computation, processing, transmission, and storage. Facing this trend, BIWIN will capitalize on its comprehensive strengths in R&D, controller design, packaging and testing, and supply chain management to deepen collaboration with communication module vendors and platform providers, fully addressing the multidimensional customization needs of edge-side communication modules for storage performance, reliability, and stability and jointly accelerating the expansion of IoT application boundaries.
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Release time：2025-03-13 11:40 reading：327 Continue reading>>
<span style='color:red'>BIWIN</span> SPEC TGS20x Industrial-Grade SSD: Built for Extreme Conditions with High Reliability
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BIWIN SPEC TGS20x Industrial-Grade SSD: Built for Extreme Conditions with High Reliability

　　Industrial equipment demands uninterrupted long-term operation while enduring extreme environmental conditions such as frequent vibrations, wide temperature and humidity variations, and unexpected power failures. These conditions impose stringent requirements on data processing reliability and durability to ensure continuous and stable system operation.　　BIWIN Spec has specifically designed the TGS20x and TGP20x series of wide-temperature industrial-grade SSDs to address these extreme environments. Compatible with SATA III, PCIe 3.0, and other interface standards, these solutions cover multiple form factors including 2.5", mSATA, and M.2 2280/2242, catering to diverse industrial scenarios. The TGS20x series SSDs have been widely adopted in industrial control, rail transit, data communications, and electric power sectors, providing highly reliable data storage support for various high-demand equipment.　　【Supporting Wide Temperature -40℃~85℃ to Ensure Stable Operation】　　Utilizes flash memory chips, controllers, and components that meet wide-temperature standards; supports operational temperatures from -40°C to 85°C and storage temperatures from -55°C to 95°C　　Rigorously tested with Mean Time Between Failures (MTBF) exceeding 3 million hours　　Enhanced through multiple firmware and hardware optimizations, including RAID, SRAM ECC, E2E, 4K LDPC, and power loss protection　　【Domestic Core Components with Customized Technical Support】　　Employs domestic NAND and controllers; leverages in-house firmware and hardware design with advanced packaging and testing; Achieves read/write speeds of up to 560MB/s and 510MB/s respectively; Supports capacities up to 2TB　　P/E cycles up to 3,000 times, featuring high durability　　Offers customized protective technologies including anti-sulfuration, protective coating, anddispensing reinforcement　　【5-Year Supply Cycle with Nationwide Efficient Service】　　Ensures high quality and consistency through fixed-BOM, automated production, rigorous testing, and comprehensive product lifecycle management　　Service centers located in major cities nationwide, including Beijing, Xi'an, Chengdu, Shanghai, Shenzhen, and Hangzhou, providingrapid response and FAE technical support
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Release time：2024-12-23 15:51 reading：831 Continue reading>>
<span style='color:red'>BIWIN</span>'s
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BIWIN's "Integrated R&D and Packaging 2.0 Strategy"

　　The Third GMIF2024 Innovation Summit was successfully held on September 27, 2024 at Renaissance Shenzhen Bay Hotel. The event brought together senior executives and industry experts from renowned domestic and international companies, including the School of Integrated Circuits at Peking University, Micron, Western Digital, Solidigm, Arm, UNISOC, Intel, iFlytek, Rockchip, Silicon Motion, BIWIN, Victory Giant, Allwinner, InnoGrit, Maxio, QUANXING, Montage, Applied Materials (AMAT), Lam Research, DISCO, Skyverse, Loongson Technology, and many others. The gathering saw industry leaders engage in discussions on global storage innovation and ecosystem collaboration for shared growth in the AI era. During the summit, the GMIF2024 Annual Awards were officially unveiled, and a total of 38 key enterprises from across the industry supply chain had been honored for their outstanding contributions.　　At the GMIF2024 Innovation Summit, Sam Sun, Chairman of BIWIN Storage, delivered a keynote speech titled "Integrated R&D and Packaging 2.0 Strategy: Full Industry Chain Layout Empowering Client Value Elevation". In the keynote, Mr. Sun shared BIWIN's latest strategic initiatives, technological breakthroughs, and future development over the past year. Supported by continued investment and efforts in integrated R&D and packaging, BIWIN Storage is leveraging advanced technology and full-chain collaboration to empower customers to achieve greater value and drive industry progress.　　From Brand Upgrade to Global Market Expansion: Innovation-Driven and Sustained Growth　　Mr. Sun first and foremost highlighted BIWIN’s significant initiative in brand upgrade in 2024. A new logo and brand slogan were unveiled: 'Infinite Storage, Unlimited Solutions'. More than a transformation of its brand image, this upgradation is an emblem to BIWIN's ongoing strategic, technological and market expansion and the demonstration of its vision to achieve continuous growth in the global storage field.　　In the global market, BIWIN Storage achieved remarkable results in the first half of 2024, thanks to precise market positioning and efficient localized delivery. Its revenue surpassed 3.4 billion RMB, marking an almost 200% increase year-on-year. This growth reflects the successful implementation of the company's global expansion and localized operation strategies.　　Integrated R&D and Packaging 2.0 Strategy: Building Core Competence to Drive Technological Advancement　　BIWIN's "Integrated R&D and Packaging 2.0 Strategy" is regarded as a crucial initiative in its technological innovation and full-chain layout. Mr. Sun further elucidated BIWIN's investments in solutions, chip design, packaging and testing, and equipment development, and shared that with concentration on independent R&D and partnerships, BIWIN has now accumulated core strengths in these areas, and been capable of offering customers more high-efficiency and low-power solutions.　　BIWIN's latest strategy not only involves a keen focus on the R&D and packaging and testing of mainstream memory, but shifts attention to more far-reaching development opportunities in high-end advanced packaging and testing technology. Powered by its dual-drive strategy, BIWIN is dedicated to further enhancing its competitiveness in the storage industry, and providing customers with innovative and cost-effective solutions.　　Strategic Advanced Packaging and Testing Layout: Overcoming Industry Bottlenecks to Secure Future Advantages　　In the face of the increasing technological demands and market challenges in the storage industry, BIWIN Storage is actively promoting its full-chain layout. Mr. Sun noted that, in addition to focusing on storage solution R&D, the company has also been a pioneer in establishing storage packaging capabilities in South China. By advancing its wafer-level packaging and testing layout, BIWIN has positioned itself as one of the few semiconductor storage companies capable of offering advanced packaging services.　　With the adoption of cutting-edge technologies such as 3D/2.5D packaging, BIWIN Storage is able to deliver top-notch services to customers in reducing product power consumption, improving performance, and offering customized packaging and testing services for areas such as computing power. Mr. Sun emphasized that advanced packaging and testing is not only the consequence driven by market demand but is also the inevitable direction of future industry development. This layout will further solidify BIWIN Storage's leadership in the storage industry.　　To accelerate the implementation of advanced packaging and testing, BIWIN Storage has chosen to establish an advanced packaging and testing factory in the Greater Bay Area. As a core hub of China's high-tech industry, the Greater Bay Area houses numerous IC design companies and innovative enterprises. However, there are still significant gaps in the packaging and testing field. BIWIN's advanced packaging and testing layout fills this gap and promotes the coordinated development of the entire industry chain.　　Mr. Sun expressed that BIWIN Storage plans to launch its new plant in 2025 to provide more efficient and flexible packaging and testing services for customers in areas such as computing power. This layout will not only strengthen the company's competitiveness in the storage market but also inject new vitality into the Greater Bay Area's innovation ecosystem.　　Integrated R&D and Packaging 2.0 Strategy: Building Core Advantages to Strengthen Customer Loyalty　　In the summary of the "Integrated R&D and Packaging 2.0 Strategy", Sam Sun emphasized that the core of this strategy lies in enhancing BIWIN's core competitiveness in the storage industry through technological innovation and full-chain collaboration, while establishing closer partnerships with clients. The main advantages of this strategy are reflected in the following four aspects:　　01 Expanding Industry Coverage　　The Strategy contributes to enhancing collaboration with upstream wafer fabs to maintain control over R&D, manufacturing, and mass production, while serving a wider range of customers and expanding the industry chain through the application of advanced packaging and testing technologies.　　02 Enhancing Technological Barriers　　The Strategy contributes to strengthening technological innovation by increasing R&D investment, and participating in more high-end application scenarios, so as to gain a unique market advantage and secure a technological edge in the competitive landscape.　　03 Driving Innovation and Differentiation　　The Strategy contributes to offering products with higher bandwidth, lower power consumption to the market by developing differentiated solutions, more complex packaging processes, and advanced memory architectures, showcasing BIWIN's technological strength in the industry.　　04 Strengthening Customer Loyalty and Trust　　The Strategy contributes to providing high-quality and customized solutions, along with comprehensive technical and service support, to strengthen customer relationships and trust and achieve mutual success through deep collaboration with customers.　　Looking Ahead: Focusing on Dual-Drive Strategy to Elevate Customer Value　　In the end, Mr. Sun concluded BIWIN Storage's vision with the phrase "BIWIN, WIN-WIN". He emphasized that BIWIN Storage will continue its dual-drive strategy of storage and advanced packaging and testing to join hands with customers to seize future opportunities in the storage industry. BIWIN Storage aims to be more than just a storage product provider — it strives to be a trusted all-around partner, driving technological innovation and commercial success together with its customers.
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Release time：2024-11-08 13:45 reading：671 Continue reading>>
<span style='color:red'>BIWIN</span> Wins India's
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BIWIN Wins India's "The Most Extensive Range Memory Solutions Provider" Award

　　June 28th had witnessed the successful hosting of the 16th NCN-ICT India Partner Summit 2024 at New Delhi, India. In the midst of the celebrations, BIWIN was honored with the esteemed “The Most Extensive Range Memory Solutions Provider of 2023 Award”, a reflection of its unwavering dedication to excellence and innovation.　　BIWIN is the Winner of “The Most Extensive Range Memory Solutions Provider of 2023”　　As an annual event that celebrates the achievements and contributions of key players in the ICT industry, the NCN-ICT Summit Awards brought together industry leaders, corporate executives, distributors, and resellers from India and abroad. It serves as a platform for industry professionals to gain insights into the latest innovations, share best practices, and explore new business opportunities.　　Through a combination of online voting and evaluations conducted by a panel of experts and judges, this accolade is a testament to BIWIN’s commitment to delivering a comprehensive range of high-performance memory solutions and pushing forward with innovation and product expansion.　　Recognized as a leader in the storage industry, BIWIN offers a comprehensive range of embedded flash-based storage solutions, including mobile phones, education devices, tablets, gaming machines, smart wearables, UAVs, action cameras, in-vehicle systems, DVR/NVRs, servers, OTT boxes, routers, and more. By providing tailored storage solutions, BIWIN supports innovation and advancement in these diverse technology areas.　　Attending on behalf of BIWIN, Rajesh Khurana, Country Manager for Consumer Business, was honored to participate in the NCN-ICT Summit & Awards Night 2024 and accept the awards. He expressed heartfelt gratitude for the industry recognition and committed to integrating purpose-driven initiatives into BIWIN’s future work. Khurana emphasized that these efforts will not only honor the awards but also elevate BIWIN to new industry heights.　　Rajesh Khurana was also privileged to be part of a renowned panel at the 16th Annual NCN-ICT Partners Summit, which was joined by top industry leaders from Geonix, Savex, Synersoft, Kaspersky and Micron. The discussion focused on the next big thing in ICT technology and examined the need for new business approaches, emerging ICT technologies, and changing business dynamics, as well as their impact on the vendor-partner ecosystem.　　As noted by Rajesh Khurana, industry projections indicate that the memory market is expected to experience continued growth in the coming years, especially with the advancement of AI technologies, big data and Internet of Things which set to drive the demand to new levels. BIWIN will also endeavor to provide improved memory solutions for customers while contributing to the industry’s future development.
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Release time：2024-08-20 13:46 reading：748 Continue reading>>
<span style='color:red'>BIWIN</span> Secures Fastest Growing Flash Storage & Manufacturer Brand Title at DT Awards 2023
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BIWIN Secures Fastest Growing Flash Storage & Manufacturer Brand Title at DT Awards 2023

　　BIWIN, a distinguished player in the flash storage industry, clinches the prestigious "Fastest Growing Flash Storage & Manufacturer Brand" award at the 15th Digital Terminal (DT) Awards 2023. The ceremony, held at Hotel The Suryaa in New Delhi, underscores BIWIN's pivotal role in the fiercely competitive Indian ICT sector.　　Accepting the award on behalf of BIWIN, Rajesh Khurana, Country Manager for Consumer Business in India, emphasized BIWIN's commitment to innovation, excellence, and utmost customer satisfaction.　　The DT Awards, recognized as India's premier tech honor, gathered over 250 industry leaders and celebrated achievements across more than 110 categories. BIWIN's triumph in this category is a testament to BIWIN's unwavering dedication to delivering cutting-edge and relevant flash storage solutions to the Indian market. This success is fueled by BIWIN's distinctive design and an unwavering commitment to quality.　　The award not only acknowledges BIWIN's current standing as a key player in the flash storage industry but also propels BIWIN forward as an innovator committed to shaping the digital landscape. BIWIN continues to push boundaries in the flash storage sector, fueled by the recognition bestowed upon them at the 15th DT Awards.　　BIWIN's vision extends beyond this award, focusing on advancing technology solutions to shape the digital future. As a recipient of this esteemed accolade, BIWIN remains dedicated to spearheading innovation and excellence in the dynamic realm of flash storage.　　The Digital Terminal Awards, recognized as a premier accolade in the Indian ICT industry, annually celebrates the contributions of tech brands to the digital landscape. It stands as a testament to BIWIN's commitment to driving innovation and excellence in the ever-evolving tech sector.
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Release time：2024-01-26 13:50 reading：2151 Continue reading>>
<span style='color:red'>BIWIN</span> TF200 Series MicroSD: Enhanced Raspberry Pi 4B Compatibility
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BIWIN TF200 Series MicroSD: Enhanced Raspberry Pi 4B Compatibility

　　BIWIN's TF200 series microSD cards have passed the Raspberry Pi 4B AVL certification, ensuring compatibility and adaptability with Raspberry Pi microcomputers.　　The TF200 microSD cards underwent rigorous tests on the Raspberry Pi 4 Model B/4GB platform. These tests included loading each test card with a custom image (including the latest Bullseye image), an automated stress test script, and a locally accessible website using Google Puppeteer for automated testing. After over 15,000 power-off tests and over 2.7 million seconds of continuous operation, the product demonstrated a continuous write speed of over 26 MB/s, a random write speed of up to 717 IOPS, and a random read speed of up to 3525 IOPS. These results meet the testing benchmarks required by Raspberry Pi, ensuring efficient and stable operation of the Raspberry Pi devices.　　The TF200 series microSD cards feature firmware functionalities such as garbage collection and bad block management to ensure stable data recording without frame loss. The product reaches the U3 speed class and V30 video speed class, with sequential read and write speeds of up to 158 MB/s and 113 MB/s respectively, supporting 4K RAW ultra-high-definition video capture and high-speed continuous shooting. Leveraging the company's advanced packaging technologies like multi-layer stacking and ultra-thin Die, the product offers capacities up to 256 GB (with future releases of 512 GB and 1 TB). It also supports flash wear leveling technology with a P/E Cycle of 3000 times. With operational temperature ranges from -25 °C to 85 °C and features such as waterproofing, shock resistance, and temperature shock resistance, the product is well-equipped to handle various complex environmental challenges.　　The TF200 series microSD cards combine high stability, reliability, and durability, making them compatible with mainstream terminal devices. They are suitable for fields like video surveillance, digital education, industrial tablets, and dashcams. Leveraging its expertise in storage solution development and advanced testing, BIWIN can tailor storage device performance, reliability, and power consumption to meet the testing and certification requirements of SoC chips and system platforms. This adaptability ensures a high degree of compatibility with different platforms, effectively meeting the diverse storage needs of various terminal applications.
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Release time：2024-01-26 13:44 reading：2124 Continue reading>>
<span style='color:red'>BIWIN</span> Automotive Storage Solutions: Driving Innovation in Car Electronics
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BIWIN Automotive Storage Solutions: Driving Innovation in Car Electronics

　　BIWIN Storage Technology Co., Ltd. (referred to as BIWIN) focuses on the research and development, packaging and testing, and manufacturing of memory chips. It is recognized as a national high-tech enterprise and a national-level specialized and innovative Little Giants enterprise. The company has received strategic investments from the National Integrated Circuit Industry Investment Fund.　　BIWIN tightly integrates its operations around the semiconductor memory industry chain, establishing an integrated business model for research and development with packaging and testing. BIWIN possesses core competencies in storage medium characteristic research, firmware algorithm development, chip packaging and testing, test research and development, and global brand operations. BIWIN actively expands into technical domains such as IC design, advanced packaging and testing, and chip testing equipment development.　　In 2018, BIWIN achieved IATF 16949:2016 certification for automotive quality management systems--an affirmation of the company's prowess in standardized management, quality control, and technological ingenuity. Recently, BIWIN Huizhou Manufacturing Center of Advanced Packaging and Testing accomplished IATF 16949:2016 certification for the automotive industry quality management systems.　　Specializing in advanced packaging and testing, BIWIN demonstrates proficiency in automotive-grade chip testing, supporting both its parent company's automotive-grade chip business and its independent automotive-grade testing outsourcing ventures. The successful IATF 16949:2016 certification holds paramount significance for the company, symbolizing implementing an intelligent management system, establishing automotive-grade quality control and process capabilities, and delivering premium products and services to customers.　　Developed by the International Automotive Task Force (IATF) in collaboration with the International Organization for Standardization (ISO) based on ISO 9001:2015, IATF 16949:2016 aims to improve customer satisfaction by ensuring consistent production of high-quality automotive products. It is crucial for automotive companies, including manufacturers, suppliers, and service providers, as it not only indicates compliance with industry-specific quality standards but also encourages the adoption of best practices across the entire supply chain. Obtaining IATF 16949:2016 certification signifies a company's commitment to meeting the highest quality standards. Many globally renowned automotive manufacturers now mandate that their suppliers obtain IATF 16949:2016 certification　　Capitalizing on its integrated advantage in research and development, and packaging and testing, BIWIN is strategically expanding its presence in the automotive storage market. Starting from the definition phase, the company meticulously controls each stage of the process according to automotive-grade requirements, including IC design, storage algorithm and firmware development, hardware design, packaging manufacturing, product testing, and safety certification. Tailoring its approach to the specific demands of in-vehicle applications, BIWIN has introduced highly reliable, competitive, and secure automotive-grade storage solutions and services, ensuring a safe driving experience.　　Continued Research and Development　　Benefiting from years of technical accumulation and experience, BIWIN consistently increases its investment in the research and development of automotive-grade storage. In the field of automotive-grade NAND Flash medium analysis, the company has acquired the capability to analyze storage medium characteristics under automotive-grade conditions, including cross-temperature performance, data retention, read and write interference, and lifespan. In the realm of automotive-grade storage firmware development, BIWIN has mastered reliability protection algorithms such as data loss prevention and data recovery under automotive-grade scenarios, as well as lifespan extension algorithms like wear leveling and write amplification control.　　Advanced Packaging and Testing　　In the packaging domain, BIWIN excels in the design and simulation of packaging for automotive-grade storage products, along with automotive-grade packaging and testing process capabilities and quality control. In testing, leveraging the rich testing experience and self-developed chip testing equipment and algorithms, the company has established capabilities for high-temperature, ambient-temperature, and low-temperature testing of automotive-grade products, as well as dynamic aging testing. BIWIN can also conduct characteristic analysis and prediction of defective outlier samples based on big data, ensuring automotive-grade yield rates and PPM targets.　　Additionally, BIWIN has set up laboratories for design simulation, signal analysis, system verification, reliability testing, material analysis, failure analysis, and more, to comprehensively meet product design and validation needs, continuously forging high-reliability and superior-quality products.　　Comprehensive Layout　　Presently, the company has launched a series of automotive storage products, including eMMC, UFS, LPDDR, BGA SSD, and SSD, widely applied in automotive information and entertainment systems, advanced driver assistance systems, intelligent cockpit systems, dashcams, panoramic monitoring systems, automotive dashboards, in-vehicle wireless terminals, rail transportation, and more. These products have entered the supply chain systems of leading automotive manufacturers and Tier 1 automotive component suppliers.　　In the future, BIWIN will actively deploy and implement integrated R&D and testing 2.0, continuously advancing research and production in automotive-grade storage. Leveraging its profound technical expertise and practical experience in automotive-grade storage, BIWIN will actively deepen cooperation with renowned domestic and international automotive manufacturers. By fully harnessing the strengths and characteristics of all parties involved and achieving deep integration, BIWIN seeks to jointly promote and build a robust brand service, contributing to the rapid development of the automotive industry.
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Release time：2023-12-28 17:34 reading：2520 Continue reading>>
<span style='color:red'>BIWIN</span> Industrial eMMC Storage for Electric Power Industry
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BIWIN Industrial eMMC Storage for Electric Power Industry

　　In the digital era, smart power devices are becoming more widespread. Among them, the power monitoring gateway, as a core link in the modern power system, ensures real-time monitoring of the power supply system, ensuring stability and optimized scheduling by collecting, transmitting, and analyzing data.　　As the data custodian in the power gateway, the storage device’s quality profoundly affects power monitoring system performance and overall power system operation.　　What challenges does the power industry face in data storage? How should power enterprises choose reliable storage devices?　　Challenge One: Ensures Stable Power Supply with Reliable Data Storage　　High Quality, Low Failure: The power industry imposes strict requirements on equipment quality as any malfunction can lead to high maintenance costs and may even necessitate regional power outages for repairs, disrupting normal life and production. Storage products must exhibit high quality to minimize the risk of failures.　　Stability and Reliability, 24/7 Power Supply: A continuous, uninterrupted power supply is crucial for residential living or industrial production. Therefore, the power industry demands storage solutions that can maintain stability around the clock, 7 days a week.　　Long Lifespan: Products in the power industry have an extended usage lifespan, typically starting from five years and, in some cases, requiring a lifespan of 8 to 10 years or more. Correspondingly, storage solutions need to meet stringent longevity standards.　　Stable Supply Demand: To ensure product consistency, the power industry places high demands on the stable supply capability of storage manufacturers. This, in turn, sets elevated standards for the research and development and manufacturing capacity of storage providers.　　Challenge Two: How to Efficiently Improve Production Scheduling of Managing Large and Diverse Power Data?　　Fast Data Transfer Speed and High Accuracy: Power monitoring data is extensive, encompassing information on power loads, supply details, and the operation of smart meters, with stringent quality requirements. To ensure the timely and accurate transmission of power monitoring data and its effective utilization in decision-making mechanisms, the power gateway needs efficient capabilities for data collection, scheduling, and transmission, preventing issues like partial data loss or confusion.　　Multi-threaded Management, Low Latency: The power industry involves complex business processes spanning multiple specialized domains and departments. With an increasing volume of data transfers within the organization and across different regions, departments such as marketing, scheduling, equipment, and customer service may require immediate access to relevant data. Therefore, the storage device must possess robust multi-task management and high-performance capabilities to avoid performance issues arising from simultaneous multi-threaded access.　　Data Load Imbalance Resulted from Peak and Off-Peak Differences: Considering the variations in power demand during peak and off-peak periods, the storage device's performance needs to remain consistently stable. This ensures orderly data storage operations at any given time, addressing the challenges posed by the uneven distribution of data loads.　　Challenge Three: How to Ensure Security in the Electric Power Industry that is Vital to National Welfare?　　Data Security: As a critical element in production, the security protection of power data is crucial for the robust operation of the power grid business.　　According to the first-quarter Information Operation and Network Security Assurance report released by State Grid Fujian Electronic Power Co., Ltd., the company monitored and thwarted over 560,000 network attacks, blocking 6,341 high-risk attack source addresses.　　Hence, storage devices must implement data encryption technology to enhance data security measures, rigorously preventing the leakage of sensitive data. This ensures the security and integrity of power data.　　Challenge Four: How to Handle Extreme Weather in Outdoors?　　Complex and Unpredictable Environment: In actual operations, equipment in power monitoring systems may encounter a variety of complex and unpredictable environments, including extreme temperature changes and unexpected power outages. Therefore, storage devices must possess the capability to operate outdoors, ensuring reliable performance in challenging conditions such as extreme temperatures and adverse weather.　　BIWIN Storage Solution for the Electric Power Industry　　Industrial eMMC Embedded Storage　　Outstanding Performance, Long-Term Intensive Read/ Write Support: BIWIN’s industrial eMMC 5.1 integrates high-performance flash memory and controllers, boasting a high original lifespan of the flash memory with Mean Time Between Failures (MTBF) exceeding 3 million hours. It provides the power industry with an exceptionally high-performance and reliable storage solution for long-duration intensive read and write operations.　　Excellent Quality, Stable Supply: Thanks to the integrated approach of research, development, packaging and testing, BIWIN possesses advanced capabilities in R&D and IC package, testing, and manufacturing of memory, ensuring premium quality and a Defect Parts Per Million (DPPM) less than 100. With the advantages of mass production, BIWIN can ensure a long-term stable supply.　　Self-developed Firmware and Advanced Testing Ensure High Reliability: BIWIN’s industrial eMMC incorporates intelligent flash management, handling interface protocols, data storage and retrieval, Error Correcting Code (ECC) algorithms, defect handling, diagnosis, and power management. The self-development firmware includes features such as wear leveling management, garbage collection, and bad block management. Leveraging the company’s proprietary testing algorithms and advanced testing equipment, the product has successfully passed rigorous reliability and aging tests, establishing itself as a reliable and durable solution.　　Multiple Security Protections, Compatible with Mainstream Platforms: BIWIN’s industrial eMMC incorporates features such as Discard, Boot partition, secure erase, and Trim, enhancing the security of data storage.　　Small Size, Low Power Consumption, Works Well in Wide Temperature: It can operate in a wide temperature range from -40 °C to 85 °C. With dimensions of only 11.5x13x1.1 mm, the product is suitable for industrial embedded environments with limited space. Dynamic power management technology gives the product low power consumption characteristics, reducing operational costs and supporting enterprises in achieving green and sustainable development.
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Release time：2023-12-28 17:24 reading：2140 Continue reading>>
<span style='color:red'>BIWIN</span> to Launch Wide-temperature SSDs for Industrial Storage
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BIWIN to Launch Wide-temperature SSDs for Industrial Storage

　　Recently, BIWIN introduced a series of wide-temperature SSDs for extreme environments, including GP303, GP304, GS301, GS302, GS303, and GS304. Crafted with high quality 3D NAND and controller, BIWIN wide-temperature SSDs have the advantages of performance, stability, reliability and security. This series is a strong choice for electric power, Internet of Things, 5G, intelligent manufacturing, rail transit, industrial control and more.　　Supported by self-developed firmware, sequential read / write speeds up to 3400 MB/s / 2700 MB/s and full-drive write speed remains at 1000 MB/s　　With BIWIN self-developed firmware, BIWIN products release their excellent performance. BIWIN GP30 Series SSDs adopt PCIe Gen3x4 and NVMe 1.4 to deliver sequential read / write speeds up to 3400 MB/s / 2700 MB/s and is armed with capacity of up to 2 TB. The GP30 / GS30 Series SSDs have optimized the firmware to provide stable performance. The speed of GP30 and GS30 reaches 1000 MB/s / 450 MB/s on FIO.　　Work faultlessly in -40℃ to 85℃, 3 million hour MTBF　　To ensure great reliability, wide-temperature SSDs adopt quality NAND and have undergone strict tests to bring excellent performance in extreme temperatures. They are rigorously tested to perform well in temperature ranging from -40℃ to 85℃ with a more than 3 million hours MTBF. In addition, this series adopts Corner Fill and Anti-sulfuration for better data integrity in extreme environments.　　Secure your data with power loss protection and end-to-end data protection　　BIWIN wide-temperature SSDs have made great optimization of firmware and hardware in terms of power-down data protection, data patrol, end-to-end data protection, and soft data destruction in terms of security, the series products have multiple optimizations of firmware and hardware in terms of PLP, data patrol, end-to-end data protection, and data erase, effectively guaranteeing data integrity and stability.　　Local service team offers quick response　　Other than its headquarters in Shenzhen, BIWIN has established its overseas headquarters in Miami, USA and local sales teams in Los Angeles, Mexico City, Bogotá, Buenos Aires, Amsterdam, Frankfurt, Istanbul, New Delhi, Taiwan and more territories. We have a strong local support team to make quick response to our clients' needs, providing customized service, real-time FAE technical support, and full supply. Also, we have a globally distributed network that connecting customers across the globe.　　BIWIN GP30 / GS30 SSDs provide wide temperature technology, stable performance, and high reliability, meeting the demanding requirement of industrial applications. BIWIN will make greater efforts to maintain its advantages in R&D, advanced manufacturing, and product quality, bringing our customers quality products and worry-free services.
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Release time：2023-09-04 16:02 reading：3340 Continue reading>>

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