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Renesas Debuts Best-in-Class MCUs Optimized for Single-Motor Applications Including Power Tools, Home Appliances and More

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions,introduced the RA2T1 microcontroller (MCU) group based on the Arm® Cortex®-M23 processor optimized for motor control systems in July9. RA2T1 devices are specifically designed for single-motor applications such as fans, power tools, vacuum cleaners, refrigerators, printers, hair dryers and many more.　　Feature Set Optimized for Motor Control　　The new RA2T1 devices include a number of features designed to enhance motor control function, specifically in single-motor systems. One of the notable features is a 3-channel S&H function that simultaneously detects the 3-phase current values of Brushless DC (BLDC) motors. This method provides superior control accuracy as opposed to sequential measurement methods. The RA2T1 MCUs also offer complementary Pulse Width Modulation (PWM) function of the timer, which enables automatic insertion of dead time and generation of an asymmetric PWM. This function is optimized for inverter drive, which facilitates control algorithm implementation.　　The RA2T1 devices offer safety features that are critical in motor control applications. They provide a Port Output Enable function and a high-speed comparator that work together to quickly shut off the PWM output when an overcurrent is detected. The shutdown state can be selected according to the inverter specifications.　　Renesas Leadership in Embedded Processing for Motor Control　　Renesas has shipped motor-control specific MCUs for over 20 years. The company ships over 230 million motor control embedded processors per year to thousands of customers worldwide. In addition to multiple RA MCU groups, Renesas offers motor-control specific devices in its 32-bit RX Family, its 16-bit RL78 MCUs and its 64-bit RZ MPUs.　　“Customers have trusted Renesas motor control solutions for many years across thousands of systems,” said Daryl Khoo, Vice President of Embedded Processing Marketing Division at Renesas. “The RA2T1 MCUs enhance our leadership in this area with market-leading technology, low-power operation, and legendary Renesas quality and safety standards for single-motor systems.”　　Key Features of the RA2T1 Group MCUs　　Core: 64 MHz Arm Cortex-M23　　Memory: 64KB Flash, 8KB SRAM, 2KB Data Flash　　Analog Peripherals: 12-bit ADC with 3-channel Sample and Hold, temperature sensor, internal reference voltage, 2-channel high-speed comparators　　System: High-, mid- and low-speed On-chip Oscillators; clock output; power-on reset; voltage detection; data transfer, event link and interrupt controllers; low-power modes　　Safety: PWM forced shutdown, SRAM parity error check, ADC self-diagnosis, clock frequency accuracy measurement, illegal memory access detection　　Operating Temperature Range: Ta = -40°C to 125°C　　Operating Voltage: 1.6V to 5.5V　　Packages: 48LQFP, 32-LQFP, 48-QFN, 32-QFN, 24-QFN (4mm x 4mm)　　The new RA2T1 Group MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. Using the FSP will ease migration of motor control designs to other RA Series devices.　　Winning Combinations　　Renesas has combined the new RA2T1 Group MCUs with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations, including Portable Power Tools, Smart BLDC Ceiling Fan, Cordless Vacuum Cleaner, Cordless Leaf Blower. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.　　Availability　　The RA2T1 Group MCUs are available now, along with the FSP software. The new MCUs are supported in Renesas’ Flexible Motor Control development kit that enables easy evaluation of motor control using permanent magnet synchronous motors (brushless DC motors), and the Renesas Motor Workbench development tool. This development kit offers a common design platform with numerous Renesas motor control MCUs from the RA and RX families, enabling migration of IP across numerous devices. Information on all these offerings is available at renesas.com/RA2T1. Samples and kits can be ordered either on the Renesas website or through distributors.　　Renesas MCU Leadership　　A world leader in MCUs, Renesas ships more than 3.5 billion units per year, with approximately 50% of shipments serving the automotive industry, and the remainder supporting industrial and Internet of Things applications as well as data center and communications infrastructure. Renesas has the broadest portfolio of 8-, 16- and 32-bit devices, delivering unmatched quality and efficiency with exceptional performance. As a trusted supplier, Renesas has decades of experience designing smart, secure MCUs, backed by a dual-source production model, the industry’s most advanced MCU process technology and a vast network of more than 250 ecosystem partners. For more information about Renesas MCUs, visit renesas.com/MCUs.

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Renesas

Release time：2025-07-14 14:38 reading：526 Continue reading>>

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ROHM Develops an Ultra-Compact MOSFET Featuring Industry-Leading* Low ON-Resistance Ideal for Fast Charging Applications

　　ROHM has developed a 30V N-channel MOSFET — AW2K21 — in a common-source configuration that achieves an industry-leading ON-resistance of 2.0mΩ (typ.) in a compact 2.0mm × 2.0mm package.　　With the rise of compact devices featuring large-capacity batteries, such as smartphones, the need for fast charging functionality to shorten charging times continues to grow. These applications require bidirectional protection to prevent reverse current flow to peripheral ICs and other components when not actively supplying or receiving power. What’s more, fast charging involves high current power transfer, leading smartphone manufacturers to demand stringent specifications for MOSFETs, including a maximum current rating of 20A, breakdown voltage between 28V and 30V, and an ON-resistance of 5mΩ or less. However, meeting these requirements with standard solutions typically necessitates the use of two large low ON-resistance MOSFETs, increasing board space along with mounting complexity.　　In response, ROHM developed an ultra-compact low ON-resistance MOSFET optimized for fast high-power charging. The AW2K21 adopts a proprietary structure that enhances cell density while minimizing the ON-resistance per unit chip area. Two MOSFETs are integrated into a single package, allowing a single part to support bidirectional protection applications (commonly required in power supply and charging circuits).　　The proprietary structure also places the drain terminal on the top surface, unlike on the backside in standard vertical trench MOS structures. This enables the use of a WLCSP, which achieves a larger chip-to-package area ratio that further reduces ON-resistance per unit area. As a result, the new product not only minimizes power loss but also supports high current operation, making it ideal for high-power fast charging applications despite its ultra-compact size.　　For example, in power supply and charging circuits for compact devices, standard solutions typically require two 3.3mm × 3.3mm MOSFETs. In contrast, the AW2K21 can achieve the same functionality with a single 2.0mm × 2.0mm unit, reducing the footprint and ON-resistance by approximately 81% and 33%, respectively. Even compared to similarly sized GaN HEMTs, ON-resistance is decreased by up to 50%, contributing to lower power consumption and increased space savings across a variety of applications.　　The AW2K21 is also suitable for use as a unidirectional protection MOSFET in load switch applications, where it maintains the industry’s lowest ON-resistance. At the same time, ROHM is further pushing the limits of miniaturization with the development of an even smaller 1.2mm × 1.2mm model.　　Going forward, ROHM remains dedicated to supporting the miniaturization and energy efficiency of electronic systems through compact, high-performance solutions that contribute to the realization of a sustainable society.　　Key Product Characteristics　　Application Examples　　• Smartphones　　• VR (Virtual Reality) headsets　　• Compact printers　　• Tablets　　　　 • Wearables　　　　　　　　　　 • LCD monitors　　• Laptops　　　　 • Portable gaming consoles　　　 • Drones　　And other applications equipped with fast charging capability.　　Terminology　　MOSFET (Metal Oxide Semiconductor Field Effect Transistor)　　A field-effect transistor (FET) featuring a metal oxide semiconductor structure (the most commonly used type). It consists of three terminals: gate, drain, and source. Applying a voltage to the gate (control terminal) regulates current flow from the drain to the source.　　N-channel MOSFETs turn ON when a positive voltage is applied to the gate relative to the source. A common-source configuration MOSFET integrates two transistor elements that share a single source terminal.　　ON-Resistance　　The resistance between the Drain and Source of a MOSFET when it is in the ON state. A smaller RDS(on) reduces power loss during operation.　　Breakdown Voltage　　The maximum voltage that can be applied between the drain and source terminals of a MOSFET without causing damage. Exceeding this limit results in dielectric breakdown, potentially leading to device failure or malfunction.　　WLCSP (Wafer Level Chip Scale Package)　　An ultra-compact package in which terminals and wiring are formed directly on the wafer before separated into individual chips. Unlike general packages where the chips are cut from the wafer and then molded with resin to form terminals, WLCSP allows the package size to match the chip itself, making it possible to further reduce size.　　GaN HEMT　　GaN (Gallium Nitride) is a compound semiconductor material used in next-generation power devices. It offers superior physical properties over conventional silicon, enabling higher frequency operation with faster switching speeds. HEMT stands for High Electron Mobility Transistor.

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ROHM

Release time：2025-07-08 17:04 reading：407 Continue reading>>

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Murata Launches World’s First 10µF/50Vdc MLCC in 0805-inch Size for Automotive Applications

　　Murata Manufacturing Co., Ltd. has announced the new GCM21BE71H106KE02 multilayer ceramic capacitor (MLCC) has entered mass production. The device is the world's first 0805-inch size (2.0 x 1.25 mm) MLCC to offer a capacitance of 10µF with a 50Vdc rating and is specifically engineered for automotive applications*. This cutting-edge product marks a significant advancement in MLCC design, delivering a smaller 0805-inch package while maintaining capacitance, voltage rating, and MLCC reliability.　　Advancements in advanced driver-assistance systems (ADAS) and autonomous driving (AD) technologies necessitate deploying an increased number of integrated circuits (ICs) within vehicle systems. This surge in ICs simultaneously leads to a greater demand for supporting high-capacitance passive components while imposing tighter spatial constraints – as a greater number of capacitors must be accommodated on increasingly crowded automotive printed circuit boards (PCBs).　　Designed for 12V automotive power lines, the GCM21BE71H106KE02 capacitor leverages Murata’s proprietary ceramic material and thinning technologies to help engineers to save PCB space and reduce the overall capacitor count, resulting in smaller, more efficient, and reliable automotive systems. As the first automotive-specific MLCC to achieve a 10µF capacitance with a 50Vdc rating in the compact 0805-inch size the GCM21BE71H106KE02 represents a significant advancement in capacitance efficiency. It offers roughly 2.1 times the capacitance of Murata’s previous 4.7µF/50Vdc product, despite sharing the same physical size. Furthermore, compared to the previous 10µF/50Vdc MLCC in the larger 1206-inch size (3.2 x 1.6 mm), the new MLCC occupies approximately 53% less space, providing substantial space savings for automotive applications.　　Murata will continue to pursue further miniaturization and increased capacitance of MLCCs, while expanding its product lineup to meet the evolving needs of the automotive market. These efforts will support the industry as they look to develop higher-performance and more multifunctional vehicles. In addition, by downsizing electronic components, Murata aims to reduce material usage and improve production efficiency per unit, helping to lower electricity consumption at its manufacturing sites and reduce overall environmental impact.

Key word：

Murata

Release time：2025-07-04 13:59 reading：505 Continue reading>>

GigaDevice launches the GD32G5 series high-performance MCUs with Cortex®-M33 core, unleashing innovation potential in industrial <span style='color:red'>applications</span>

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GigaDevice launches the GD32G5 series high-performance MCUs with Cortex®-M33 core, unleashing innovation potential in industrial applications

　　GigaDevice (Stock Code: 603986), a leading semiconductor supplier, today officially announced the launch of the GD32G5 series high-performance microcontrollers, based on the Arm® Cortex®-M33 core.　　The GD32G5 series MCUs, featuring exceptional processing performance, a wide range of digital and analog interface resources, and enhanced security capabilities, can be widely applied across diverse scenarios such as digital power systems, charging stations, energy storage inverters, frequency converters, servo motors, and optical communication. This new product lineup offers 14 models across 7 package types, including LQFP, QFN, and WLCSP. 　　Powerful Performance Empowering the Industrial Market　　The GD32G5 series MCUs are powered by the high-performance Arm® Cortex®-M33 core, with a clock frequency of up to 216 MHz. These MCUs feature an advanced DSP hardware accelerator and a single-precision floating-point unit (FPU). They also integrate a hardware trigonometric function accelerator (TMU), supporting 10 types of function calculations, along with various other hardware acceleration units, including filter algorithms (FAC) and Fast Fourier Transform (FFT), which significantly enhance processing efficiency. At maximum frequency, the GD32G5 series MCUs deliver performance of up to 316 DMIPS, achieving an impressive CoreMark® score of 694.　　The GD32G5 series MCUs are equipped with 256KB to 512KB of embedded Flash memory, supporting the dual-bank Flash feature, and 128KB of SRAM, which includes 32KB Tightly Coupled Memory RAM (TCMRAM) for zero-wait execution of critical instructions and data. Additionally, they feature high-speed cache memory, with up to 2KB I-Cache and 512B D-Cache, further boosting core processing performance.　　Extensive Peripherals Enable Development Innovation　　The GD32G5 series MCUs integrate a comprehensive range of peripheral resources. They support four 12-bit ADCs with a sampling rate of up to 5.3 MSPS and up to 42 channels, as well as four 12-bit DACs, two of which offer sampling rates as high as 15 MSPS. Additionally, the series includes eight high-speed comparators (COMPs) and a suite of high-precision analog peripherals designed to meet the demands of motor and power control applications. The GD32G5 series also features a 16-channel high-precision timer (HRTimer) with accuracy reaching 145 ps, along with three advanced 8-channel timers, two 32-bit general-purpose timers, five 16-bit general-purpose timers, two 16-bit basic timers, and one low-power timer.　　In terms of communication interfaces, the GD32G5 series offers five U(S)ARTs, four I2Cs, three SPIs, and one QSPI supporting up to 200 MHz DDR/SDR interfaces. The MCUs are equipped with three CAN-FD modules, ideal for high-speed communication applications. Additionally, they integrate one HPDF (high-performance digital filter) supporting 8 channels and 4 filters, with external Σ-Δ modulator support. The series also includes four configurable logic modules (CLAs) and the Trigsel module, which allows flexible configuration of trigger sources. Designed to operate in a wide temperature range from -40°C to 105°C, the GD32G5 series is well-suited for demanding applications such as optical modules, industrial power supplies, and high-speed motor control, where stringent temperature requirements must be met.

Key word：

GigaDevice

Release time：2025-05-21 16:47 reading：590 Continue reading>>

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ROHM at PCIM Europe 2025: Powerful Highlights for E-Mobility and Industrial Applications

　　From May 6th to 8th ROHM will exhibit at the PCIM Expo & Conference, the leading international event for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, taking place in Nuremberg. On its booth 304 in hall 9, ROHM will showcase reference projects with renowned partners and present the evolution of its package designs and evaluation boards.　　"PCIM 2025 in Nuremberg is the meeting place for innovation and progress in power electronics. This is where the brightest minds in the industry come together to shape the future of e-mobility and industrial applications. We will be presenting great customer applications to showcase the possibilities offered by our products in the best possible way. Whether in the PV industry or e-mobility sectors – we are involved and would like to talk to our customers on site about the key projects of the future," says Wolfram Harnack, President at ROHM Semiconductor Europe.　　Highlights of ROHM’s presence at PCIM 2025 include:　　For automotive applications, ROHM will exhibit an inverter unit utilizing the TRCDRIVE pack™ that consists of a 2-in-1 SiC Molded Module. Valeo and ROHM have been collaborating since 2022, initially focusing on technical exchange to enhance the performance and efficiency of motor inverters, a key component in the propulsion systems of electric vehicles (EVs) and plug-in hybrids (PHEVs).　　Power solutions for on-board chargers (OBCs), essential for e-mobility applications, will also be on the booth. ROHM will showcase the new EcoSiC™ molded power modules suitable for OBCs, along with OBC applications adopting ROHM’s power semiconductor devices.　　ROHM’s Power Eco Family products: ROHM has grouped the four product lines of power semiconductors under the brand concept “Power Eco Family” and is contributing to the development of a sustainable ecosystem through improved application performance. We will show featured solutions and case studies at the booth.　　In this context, one application example is the new GaN Lineup: ROHM’s EcoGaN™ series of 650V GaN HEMTs in the TOLL package has been adopted for AI server power supplies by Murata Power Solutions, a subsidiary of the Murata Manufacturing Group and a leading supplier of electronic components, batteries and power supplies in Japan. Integrating ROHM’s GaN HEMTs, which combine low loss operation with high-speed switching performance, in Murata Power Solutions’ 5.5kW AI server power supply unit achieves greater efficiency and miniaturization.　　For more information, please refer to AMEYA360’s related news release.　　The details of the Power Eco Family are as follows.　　●　EcoSiC™ is a brand of devices leveraging silicon carbide which is attracting attention in the power device field for performance that surpasses silicon.　　●　EcoGaN™ comprises compact, energy-efficient devices that utilize the low ON resistance, high-speed switching characteristics of GaN to achieve lower application power consumption, smaller peripheral components, and simpler designs requiring fewer parts.　　●　EcoIGBT™ is ROHM’s brand of IGBTs consisting of both devices and modules designed to meet the needs of high-voltage applications in the power device field.　　●　EcoMOS™ is ROHM's brand of silicon power MOSFETs designed for energy-efficient applications in the power device sector.　　During the fair, ROHM’s power experts will participate in several panel discussions and conference presentations. Additionally, they will hold poster sessions at the PCIM Europe 2025 conference.　　More information regarding ROHM’s key highlights at PCIM 2025 is available here: www.rohm.com/pcim　　*EcoSiC™, EcoGaN™, EcoIGBT™, EcoMOS™ and TRCDRIVE pack™ are trademarks or registered trademarks of ROHM Co., Ltd.

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ROHM

Release time：2025-04-23 17:01 reading：403 Continue reading>>

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Renesas Introduces Low-Power Bluetooth Low Energy SoC for Automotive Applications

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced a new industry-leading Bluetooth chip that combines a radio transceiver, an Arm® M0+ microcontroller, memory, peripherals and security features in a compact SoC design. The DA14533, the first automotive-qualified device in the company’s Bluetooth® Low Energy system-on-chip (SoC) family, includes advanced power management features to simplify system integration and reduce power consumption. With its software stack qualified against Bluetooth Core 5.3 and support for extended temperatures, developers can jump-start projects in applications from tire pressure monitoring and keyless entry to wireless sensors and battery management systems.　　Optimized Design to Deliver Unparalleled Power Efficiency　　Building on Renesas’ leadership in Bluetooth LE SoCs (SmartBond Tiny Family) with industry-leading low power consumption, the new DA14533 includes some of the most advanced power management features in the industry. The device includes an integrated DC-DC buck converter, which accurately adjusts the output voltage according to system requirements. Active system power consumption is lower than comparable devices in the market, requiring only 3.1mA during transmission and 2.5mA during reception. In hibernation mode, the current drops to 500nA. These power management and power-saving features help extend the operational life of small-capacity battery-powered systems and meet the stringent power requirements of tire pressure monitoring systems’ mission profile.　　Auto-Grade AEC-Q100 Qualified and Up-to-Date Security Features　　The DA14533 is an AEC-Q100 Grade 2 qualified device, which means the device has passed strict testing to sustain quality and reliability in harsh automotive environments. Moreover, the device’s extended temperature range (-40 to +105°C) ensures reliable performance in demanding conditions, making it ideal for automotive and industrial systems where stability and durability are essential. Qualified against Bluetooth Core 5.3 specifications, the device contains the latest security features to safeguard connected devices from various threats.　　“Our SmartBond Tiny SoC family has seen remarkable success in the industrial market, with over 100 million units shipped to date,” said Chandana Pairla, VP of Connectivity Solutions Division at Renesas. “This new automotive-grade device will enable a new class of Bluetooth LE applications that demand high power efficiency, a small footprint and broader temperature tolerance for next-generation battery-powered automotive and industrial systems.”　　Lower Bill-of-Materials Reduces Costs and Simplifies Development　　Similar to other Bluetooth LE SoC devices in the SmartBond Tiny family, the DA14533 only requires 6 external components, offering a best-in-class engineering bill of materials (eBOM).　　A single external crystal oscillator (XTAL) is used for both active and sleep modes, eliminating the need for a separate oscillator for sleep mode. Its ultra-compact design – available in a WFFCQFN 22-pin 3.5 x 3.5 mm package – makes the device the smallest automotive Bluetooth LE SoC on the market. With its compact design and low eBOM, the device integrates seamlessly into space-constrained systems, reducing overall system costs and accelerating time-to-market for customers.　　Key Features of the DA14533　　Arm® Cortex®-M0+ microcontroller – Standalone application processor or data pump in hosted systems　　64KB RAM and 12KB One-Time Programmable (OTP) memory　　2.4 GHz radio transceiver　　Integrated low IQ buck DC-DC converter　　External SPI flash　　Single XTAL operation (single crystal oscillator)　　Software stack qualified against Bluetooth Core 5.3　　AEC-Q100 Grade 2-qualified with wide operating temperature range support (-40 to +105°C)　　WFFCQFN 22-pin 3.5 x 3.5 mm package

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Renesas

Release time：2025-04-08 14:06 reading：785 Continue reading>>

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Exploring Infrared Sensors: Types, Applications, and Principle

　　In the realm of modern technology, infrared (IR) sensors stand out as versatile and essential components across a wide array of applications. These sensors leverage the infrared part of the electromagnetic spectrum to detect and measure infrared radiation, which can be indicative of heat, motion, and various other parameters. This article delves into the fundamentals of Infrared Sensors, and their diverse applications.　　What is an infrared sensor ?Infrared sensors detect radiation in the infrared spectrum, which ranges from about 750 nanometers (nm) to 1 millimeter (mm). Unlike visible light, infrared radiation is not visible to the human eye but can be felt as heat. IR sensors convert this radiation into an electrical signal that can be processed and interpreted by electronic systems.　　How many types of IR sensors are there?1. Active Infrared Sensors: These sensors emit their own infrared light and detect the reflected light. They are commonly used in proximity sensors and certain types of motion detectors. An example is the IR LED and photodiode pair, which measures changes in the reflected light to determine the presence of objects.　　2. Passive Infrared Sensors (PIR): Unlike active sensors, PIR sensors do not emit any radiation. Instead, they detect the infrared radiation naturally emitted by objects. PIR sensors are widely used in motion detection applications, such as security systems and automatic lighting.　　What is the purpose of the IR sensor?IR sensors serve various purposes across multiple applications. Here are some common uses:　　1. Proximity Detection　　– Used in devices like automatic doors, smartphones, and vehicles to detect nearby objects without physical contact.　　2. Motion Detection　　– Common in security systems and alarms (e.g., PIR sensors) to sense movement in a defined area.　　3. Temperature Measurement　　– Employed in non-contact thermometers to measure the temperature of objects or bodies from a distance.　　4. Remote Controls　　– Found in TVs, air conditioners, and other electronics to facilitate wireless communication with remote controls.　　5. Obstacle Avoidance　　– Used in robotics and drones to navigate and avoid collisions by detecting nearby objects.　　6. Gas Detection　　– Some IR sensors can detect specific gases based on their absorption of infrared light, useful in industrial applications.　　7. Night Vision and Thermal Imaging　　– Used in military, security, and surveillance applications to detect heat signatures in low-light conditions.　　8. Data Transmission　　– In certain applications, IR can be used for wireless data transfer over short distances.　　What is an infrared sensor used for?Infrared sensors have a broad range of applications, benefiting various industries from consumer electronics to healthcare. Here are some notable examples:　　1. Consumer Electronics:　　– Remote Controls: IR sensors are integral to remote control devices for televisions, air conditioners, and other home appliances. They receive signals from the remote control unit to perform the desired function.　　– Smartphones and Tablets: Some devices use IR sensors for facial recognition, which helps in unlocking screens and enhancing security.　　2. Healthcare:　　– Thermography: Infrared thermography is used for non-invasive temperature measurement, allowing for early detection of fevers and other medical conditions. It’s particularly valuable in monitoring patients’ health and in diagnosing conditions based on temperature anomalies.　　– Vital Sign Monitoring: IR sensors can be used in wearable devices to monitor vital signs such as heart rate and blood oxygen levels.　　3. Automotive Industry:　　– Collision Avoidance Systems: IR sensors help in detecting obstacles and monitoring the surrounding environment to prevent accidents. They are used in parking assist systems and adaptive cruise control.　　– Night Vision: Some high-end vehicles are equipped with IR sensors to enhance visibility during night driving by detecting pedestrians and animals on the road.　　4. Industrial Automation:　　– Temperature Measurement: In manufacturing processes, IR sensors are employed to monitor the temperature of machinery and products to ensure they remain within safe and optimal limits.　　– Quality Control: These sensors are used to inspect products for defects and irregularities by detecting variations in thermal emission.　　5. Environmental Monitoring:　　– Gas Detection: IR sensors can detect the presence and concentration of specific gases in the atmosphere by measuring their absorption of infrared light. This is crucial for monitoring air quality and ensuring safety in industrial environments.　　What is the principle of IR sensor?The principle of an infrared (IR) sensor is based on the detection and measurement of infrared radiation, which is electromagnetic radiation with wavelengths longer than visible light. The core principle involves capturing the infrared radiation emitted or reflected by objects and converting it into an electrical signal that can be analyzed. Here’s a detailed breakdown of how IR sensors work:　　1. Emission and Detection of Infrared Radiation　　Infrared Radiation Basics:　　– Infrared radiation is part of the electromagnetic spectrum with wavelengths ranging from approximately 750 nanometers (nm) to 1 millimeter (mm), just beyond the visible light spectrum.　　– All objects emit infrared radiation as a function of their temperature. Hotter objects emit more infrared radiation compared to cooler ones.　　Detection Principle:　　– Active IR Sensors: These sensors emit their own infrared light (often using an IR LED) and then measure the amount of this light that is reflected back from objects in their environment. The detected signal changes based on the distance, size, and properties of the object, allowing the sensor to infer its presence, distance, or other characteristics.　　– Passive IR Sensors (PIR): These sensors do not emit any radiation. Instead, they detect the infrared radiation naturally emitted by objects in their field of view. They typically use a sensor element that responds to changes in infrared radiation, such as a pyroelectric detector or a thermopile.　　2. Conversion of Infrared Radiation to Electrical Signal　　Pyroelectric Detectors:　　– Pyroelectric sensors contain materials that generate an electrical charge when exposed to infrared radiation. This charge is proportional to the amount of infrared radiation detected.　　– The sensor detects changes in temperature caused by infrared radiation, converting these changes into an electrical signal.　　Thermopiles:　　– A thermopile consists of multiple thermocouples connected in series or parallel. It measures the temperature difference between the heated element exposed to infrared radiation and a reference element.　　– This temperature difference generates a voltage, which is then measured and converted into an output signal.　　Photodetectors:　　– Some IR sensors use photodetectors (such as photodiodes or phototransistors) sensitive to infrared light. These detectors convert the incident infrared light into an electrical current proportional to the light intensity.　　3. Signal Processing　　Once the infrared radiation is converted into an electrical signal, the output is typically processed and analyzed by the sensor’s electronics. This may involve amplification, filtering, and digitization of the signal. The processed signal can then be used to trigger actions or provide readings depending on the application. For example:　　– In motion detectors, the sensor might trigger an alarm if it detects significant changes in infrared radiation indicating movement.　　– In temperature measurement systems, the signal is used to provide accurate temperature readings or to monitor thermal conditions.　　How do I choose an IR sensor?Choosing an infrared (IR) sensor depends on several factors related to your application. Here’s a quick guide to help you make the right choice:　　1. Type of IR Sensor　　– Active IR Sensors: Emit IR light and measure reflections (e.g., proximity sensors).　　– Passive IR Sensors: Detect IR radiation from objects (e.g., PIR sensors for motion detection).　　2. Detection Range　　– Consider the distance over which you need to detect objects. Check the specifications for range and field of view.　　3. Sensitivity　　– Look for specifications on sensitivity, which determines how small a change in IR radiation the sensor can detect.　　4. Environmental Conditions　　– Ensure the sensor can operate in the conditions it will face (temperature, humidity, dust, etc.).　　5. Response Time　　– Consider how quickly the sensor needs to respond. This is crucial for applications like motion detection.　　6. Output Type　　– Decide whether you need digital output (on/off) or analog output (variable signal) based on how you’ll process the sensor data.　　7. Power Consumption　　– Look for power-efficient models if you’re running on batteries or need to minimize energy use.　　8. Size and Form Factor　　– Ensure the physical size and mounting options fit your project requirements.　　9. Cost　　– Determine your budget, as prices can vary widely based on features and capabilities.　　10. Manufacturer Support　　– Choose brands or suppliers that provide good documentation and support.　　How far can IR sensors detect?The detection range of IR sensors can vary significantly based on the type of sensor and its design:　　1. Active IR Sensors　　– Proximity Sensors: Typically have a range of a few centimeters to a few meters (around 0.1 to 5 meters) depending on the sensor’s power and environment.　　– IR Range Finders: Can detect distances up to 10-20 meters or more, depending on the model and application.　　2. Passive IR Sensors (PIR)　　– Commonly used for motion detection in security systems, these sensors usually have a range of about 5 to 12 meters (16 to 40 feet). The actual range can be influenced by factors such as the angle of detection and the presence of obstacles.　　3. IR Cameras and Thermal Sensors　　– These devices can detect heat signatures at much greater distances, often exceeding 100 meters, depending on the resolution and the environment.　　Factors Influencing Range　　– Sensitivity: Higher sensitivity allows for detection at greater distances.　　– Environmental Conditions: Obstructions, temperature, and humidity can affect performance.　　– Field of View: A wider field of view may reduce the effective detection range.　　ConclusionInfrared sensors are indispensable components in modern technology, offering critical functionalities across various fields. From enhancing consumer electronics to advancing healthcare and industrial automation, their applications are both diverse and impactful. As technological advancements continue to push the boundaries of what is possible, IR sensors are poised to become even more integral to our everyday lives, driving innovations and efficiencies across multiple sectors. Understanding their technology and applications provides valuable insights into how these sensors are shaping the future of technology and industry.

Key word：

SIMCom

Release time：2025-03-21 13:17 reading：469 Continue reading>>

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SIMCom Powers Smart Terminals with 5G + Wi-Fi 7 for Commercial Applications

　　As AI-driven smart devices evolve, reliable connectivity remains essential for advanced applications. During MWC25 and EW25, SIMCom introduced its 5G + Wi-Fi 7 wireless communication solution, engineered for smart router applications. This solution delivers solid performance, fast speeds, and dependable wireless communication, and it is already being used in commercial products to help manufacturers optimize both cost and time-to-market.　　5G + Wi-Fi 7: Unlocking the Full Potential of Smart Terminals　　Based on the Qualcomm® Snapdragon™ X62 5G Modem-RF System, a key component of the world's first 3GPP Release 16 modem-RF family. Designed with an upgradable architecture, this technology enables rapid commercialization of 5G Release 16, extending 5G connectivity to various applications, including mobile broadband, fixed wireless, industrial IoT, and private 5G networks. By integrating Wi-Fi 7, this solution enhances the wireless experience for smart devices, providing higher capacity, lower latency, and greater efficiency.　　Showcasing Real-World Applications　　During MWC25 and EW25 , SIMCom partnered with LUXSHARE ICT to demonstrate the real-world capabilities of 5G + Wi-Fi 7. A key highlight was the 5G CPE BE17000 Wi-Fi 7 Mesh Router, featuring SIMCom's SIM8262E-M2 module. By inserting a 5G SIM card, this router utilizes advanced 5G connectivity, allowing users to share ultra-fast networks with multiple Wi-Fi devices. The Wi-Fi 7 Mesh technology further enhances:　　● Network coverage and capacity　　● Ultra-HD streaming without buffering　　● Lightning-fast file downloads　　● Seamless video conferencing and online collaboration　　This deployment underscores SIMCom's commitment to delivering high-speed, uninterrupted connectivity for AI-driven applications, addressing the increasing demand for reliable smart networking solutions.　　( 5G CPE BE17000 WiFi 7 Mesh Router with LUXSHARE ICT )　　Global 5G Adaptability for Diverse Market Needs　　One of the key advantages of SIMCom’s 5G + Wi-Fi 7 solution is its ability to support both NSA and SA network architectures, ensuring robust cellular performance and high data transmission rates. The Snapdragon X62 5G Modem-RF System enables full compatibility with global 5G frequency bands, covering high, mid, and low spectrum ranges. This allows SIMCom to offer customized regional solutions, catering to the specific connectivity requirements of different global markets.　　Driving the Future of Smart Connectivity　　With the integration of 5G and Wi-Fi 7, SIMCom is revolutionizing AI-powered smart terminals, enabling faster, more intelligent, and always-connected experiences. As AI-driven applications continue to expand, high-speed, stable, and adaptive connectivity will play a pivotal role in unlocking new possibilities across industries.　　By leading the way in advanced 5G and Wi-Fi solutions, SIMCom empowers device manufacturers, businesses, and end users to fully embrace the next generation of smart, connected experiences.　　About LUXSHARE ICT:　　Established on May 24, 2004, Luxshare Precision successfully listed on the ChiNext Board of Shenzhen Stock Exchange on September 15, 2010 (stock code: 002475). The Company is committed to providing integrated intelligent solutions, parts, modules and systems for enterprise communication products (high-speed interconnect, optical module, heat dissipation module, base station antenna, base station filter), consumer electronic products (TWS wireless headphones, smart wear, wireless charging module, 5G router, VR headsets, smart speaker), and automobile systems (automobile wiring harness, connector, intelligent cabin, intelligent driving) and central gateway, etc　　About SIMCom:　　SIMCom Wireless Solutions Limited is a global leading IoT wireless modules and solutions supplier. Since established in 2002, SIMCom has been fully committed to providing a variety of wireless modules and terminal level solutions worldwide, such as 5G,4G, LTE-A, LTE-M(CAT-M1), NB-IoT, 3G, 2G, and GPS/GLONASS/BEIDOU satellite positioning technology.　　SIMCom insists on providing high-quality modules and industry solutions. With 23 years of professional technical innovation and service experiences, it continuously meets the needs of customers in all industries of the Internet of Things. While deepening the vertical industry, we continue to define advantageous products and build core competitiveness. With the Group's continuous investment in research and development, technology and production, we will continue to innovate and enrich our technology roadmap, and promote the development of the industry in the next few years.

Key word：

SIMCom

Release time：2025-03-20 13:58 reading：399 Continue reading>>

Trade news

Leading Performance for High Voltage Applications: NOVOSENSE Launches the NSI67X0 Series of Smart Isolated Drivers

　　NOVOSENSE has officially launched the NSI67X0 series of smart isolated drivers with Isolated Analog Sensing function. Suitable for driving power devices such as SiC, IGBTs and MOSFETs, and available in both automotive (AEC-Q100 compliant) and industrial variants, this series can be widely used in new energy vehicles, air conditioners, power supplies, photovoltaics and other applications.　　This series of isolated gate drivers equates an isolated analog to PWM sensor, which can be used for temperature or voltage detection. The design further enhances driver versatility, simplifies system design, effectively reduces system size and lowers overall cost.　　High-voltage Drive and Ultra-high Common-mode Immunity　　Designed to drive IGBTs or SiC up to 2121V DC operating voltage, NSI67X0 offers advanced protection functions, excellent dynamic performance, and outstanding robustness. This series uses SiO2 capacitor isolation technology to isolate the input side from the output side, providing ultra-high common-mode immunity (CMTI>150kV/μs) while ensuring extremely small offset between devices, which is at the leading level in the industry.　　Powerful Output Capability and Miniaturized Package　　The NSI67X0 series has powerful output capability, supporting ±10A drive current and a maximum output drive voltage of 36V, far exceeding most similar products. Its SOW16 package design further enhances safety by achieving a creepage distance of more than 8mm while maintaining miniaturization.　　Comprehensive Protection Functions and Automotive Certification　　With comprehensive protection functions, including fast overcurrent protection, short-circuit protection, fault soft turn off, 4.5A Miller clamp, and undervoltage protection, this series is a reliable choice for driving power devices such as IGBTs. The entire product family meets the AEC-Q100 standard for automotive applications and can be widely used in new energy vehicles, industrial control and energy management.　　Features of NSI67X0 Series　　◆ Smart isolation drivers up to 2121Vpk for driving SiC and IGBTs　　◆ High CMTI: 150 kV/μs　　◆ Input side supply voltage: 3V ~ 5.5V　　◆ Driver side supply voltage: up to 32V　　◆ Rail-to-rail output　　◆ Peak source and sink current: ±10A　　◆ Typical propagation delay: 90ns　　◆ Operating ambient temperature: -40°C ~ +125°C　　◆ Compliant with AEC-Q100 for automotive applications　　◆ RoHS compliant package type: SOW16, creepage distance > 8mm　　Protection Functions　　◆ Fast over-current and short-circuit protection, with optional DESAT threshold voltage of 9V and 6.5V and OC threshold voltage of 0.7V　　◆ Integrated soft turn off function in case of fault, with optional soft turn off current of 400mA and 900mA　　◆ Integrated Miller clamp function, with clamp current up to 4.5A　　◆ Independent undervoltage protection UVLO on both HV and LV sides　　◆ Fault alarm (FLT/RDY pin indication)　　Isolated Analog Sampling Function　　◆ Isolated analog sampling function　　◆ AIN input voltage range: 0.2V ~ 4.7V　　◆ APWM output duty cycle: 96% ~ 6%　　◆ Duty cycle accuracy: 1.6%　　◆ APWM output frequency: 10kHz　　◆ Optional AIN integrated constant current source output　　Safety Related Certification　　◆ UL Certification: 1 minute 5700Vrms　　◆ VDE Certification: DIN VDE V 0884-11:2017-01　　◆ CSA Certification: Approved under CSA Component Acceptance Notice 5A　　◆ CQC Certification: Compliant with GB4943.1-2011　　Introduction to Principle of High-precision Temperature Sampling of NSI67X0 Series　　The AIN interface of the NSI6730 has a built-in 200uA current source. When an external NTC is connected, a voltage drop will be generated and demodulated into a 10kHz PWM signal for isolated output. The PWM signal is captured by the processor MCU, and the corresponding voltage value and temperature are obtained by calculating the duty cycle.　　When the AIN voltage is in the range of 0.2V ~ 4.7V, the AIN input voltage and APWM output duty cycle are linearly related. When the AIN voltage is converted to a PWM signal, the PWM duty cycle conforms to the following formula:　　That is, the AIN voltage of 0.2V ~ 4.7V corresponds to a PWM duty cycle of 96% ~ 6%.　　Model Selection Chart of NSI67X0 Series　　This series offers a variety of models to meet the needs of different applications. Specifically, in the NSI67X0 series, when X is 3, the AIN interface integrates a constant current source; when X is 7, the AIN interface does not integrate a constant current source.

Key word：

NOVOSENSE

Release time：2025-02-24 16:18 reading：964 Continue reading>>

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SIM8230: Advanced and Flexible 5G Connectivity for Demanding IoT Applications

　　The 5G RedCap specification, introduced in version R17 of the 3GPP standard, addresses the growing need for efficient connectivity in IoT devices that do not require the full performance of 5G. Also known as "Reduced Capability," this technology offers a more cost-effective and energy-efficient alternative to 4G, LTE-M, and NB-IoT.　　RedCap provides an optimal balance between speed and energy efficiency, making it ideal for applications that demand constant connectivity without requiring maximum 5G capacity.　　The SIM8230 module from SIMCom fits perfectly into this context, offering multi-band compatibility, intensive data transmission, and easy integration into IoT devices. Its efficient design meets the needs for economical connectivity, providing a viable solution for a wide range of IoT applications.　　The SIM8230 is a multi-band 5G NR/LTE-FDD/LTE-TDD module that supports 5G SA according to version R17 (3GPP), providing advanced connectivity capabilities. It stands out for its compatibility with a wide range of protocols, facilitating integration into various platforms.　　Compact and Easy to Integrate　　Equipped with interfaces like PCIe, USB 2.0, and GPIO, the SIM8230 offers developers great flexibility to customize their projects. Its LGA format optimizes design and installation, allowing for a more durable assembly and improving heat dissipation, saving space and simplifying installation.　　Rapid 5G Implementation with Minimal Reprogramming　　The compatibility of the SIM8230’s AT commands with the SIM7600/8200/8260 series reduces costs and accelerates time to market. This is especially advantageous for companies that need to implement 5G solutions quickly without requiring extensive reprogramming.　　Additionally, the SIM8230 is based on the Qualcomm X35 platform, which introduces the world's first 5G NR-Light modem-RF system, designed to enhance connectivity at the intelligent edge. This optimized architecture combines energy efficiency and lower complexity design, allowing compact devices to make the most of 5G connectivity. Thanks to its energy- saving features and improved performance, the X35 not only facilitates a smooth migration from LTE CAT-4+ devices but also enables a new wave of use cases for IoT devices, facilitating the rollout of 5G solutions with minimal reprogramming.　　Technical Specifications of the SIM8230　　- The SIM8230 is available in different regional versions to adapt to connectivity needs in various markets: The SIM8230C, SIM8230E, SIM8230G, SIM8230JP, SIM8230NA, and SIM8230SA models are presented in an LGA+LCC format with dimensions of 30.0x30.0x2.5 mm, optimized for compact devices. For M2 formats, the SIM8230C-M2, SIM8230E-M2, SIM8230G-M2, and SIM8230JP-M2 models have dimensions of 42.0x31.4x3.4 mm. Additionally, the SIM8230C-PCIE, SIM8230E-PCIE, SIM8230G-PCIE, and SIM8230JP-PCIE models are available in PCIe format with dimensions of 50.8x31.0x3.6 mm.　　- Supported Frequencies: 5G NR (Sub6G), LTE-FDD, LTE-TDD.　　- GNSS: Compatibility with global navigation systems, ideal for geolocation applications (GPS/GLONASS/BeiDou).　　- Temperature Range: Operates between -40℃ and +85℃, ensuring reliability in extreme weather conditions.　　- Electrical Characteristics: Operates with a voltage of 3.3 to 4.4 V, providing wide compatibility.　　- Data Transfer Performance: Sub-6G SA with speeds of up to 220 Mbps download and 100 Mbps upload; LTE with up to 200 Mbps download and 75 Mbps upload, providing solid performance on LTE networks.　　- Software Functions: Support for protocols such as TCP/IP, IPV4, IPV6, Multi-PDP, FTPS, HTTPS, MQTTS, and DNS, as well as USB/FOTA functionality for remote firmware updates.　　- Interfaces and Connectivity: Includes interfaces such as USB, UART, PCM, GPIO, I2C, and PCIe. Supports SIM cards of 1.8V/2.95V, expanding its compatibility.　　- Certifications: The SIM8230 is currently in the process of obtaining international certifications such as CE (RED), FCC, GCF, PTCRB and MNO TA.　　Versatile and Robust Applications　　The SIM8230 stands out as a key module in CPE and MiFi applications, offering efficient 5G connectivity and FWA access that meet the needs of both industrial and residential sectors. Its optimized design and low energy consumption make it ideal for remote environments, providing high-speed internet access in MiFi devices and converting 5G signals into WiFi in CPE installations.　　Moreover, its versatility makes it a preferred option for emerging sectors such as telemedicine, smart cities, and connected automotive, opening new possibilities for innovative IoT solutions. Its high efficiency, security, and flexibility make it an adaptable solution for future demands, ensuring fast and reliable connections in an increasingly interconnected world.

Key word：

simcom

Release time：2024-12-19 10:34 reading：763 Continue reading>>

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