Basic knowledge of electronic components purchasing -Ameya360 electronic components purchasing website

Trade news

With 16-bit PWM dimming and 4-channel LED drivers, NSUC1500 from NOVOSENSE redefines cockpit experience

　　NOVOSENSE announced the addition of a new member to its NovoGenius product family - NSUC1500-Q1, a highly integrated ambient lighting driver SoC product.　　Integrating an ARM® Cortex®-M3 core and 4-channel high-precision current-mode LED drivers, NSUC1500-Q1 provides 16-bit independent PWM dimming and 6-bit analog dimming capabilities, and enables more accurate dimming and color mixing control while effectively compensating for lumen depreciation. Additionally, NSUC1500-Q1 is compliant with the AEC-Q100 Grade 1 and CISPR 25 Class 5 EMC standards, promising high reliability and flexibility.　　This innovative product allows opportunities to develop more efficient and creative smart cockpit lighting solutions that provide users with more superior visual experience.　　With continuous advancements of automotive personalization and innovation, vehicles of the future will be more than a means of transportation, but a mobile living space full of human touch and intelligence. The rapid evolvement of smart cockpits has further stimulated strong demand for more intelligent and comfortable driving experience from end-users. In this context, the creation of in-vehicle atmosphere is increasingly valued, as users expect to enhance the sense of immersion and emotional connection experience in the overall cabin through the integration and interaction between the ambient lighting system and other cockpit applications.　　The role of cabin ambient lighting is also quietly transforming. It goes beyond the traditional lighting and decoration functions, and has become a core element in enhancing the driving experience. By integrating personalized customization, intelligent response to driving conditions, and enhanced interactive features, the ambient lighting system can greatly improve the sense of immersion and ownership for drivers and passengers, creating a unique driving atmosphere for each individual.　　The NSUC1500-Q1, a highly integrated ambient lighting driver SoC, comes with an ARM® Cortex®-M3 processor core and four LED driver circuits. It also integrates high-precision constant current source, signal control, and LIN interface. These components work together to enable precise current control for each LED, and provide a perfect solution that answers complex and changing ambient lighting design requirements. Additionally, it supports flexible regulation of numerous LEDs. With internal high-precision PWM signals, NSUC1500-Q1 delivers exceptionally smooth dimming and color mixing effects. It also effectively compensates for brightness decay in RGB ambient lights due to temperature fluctuations and long-time aging, thereby ensuring consistent and outstanding lighting effects.　　High system reliability and effective protection mechanisms　　NSUC1500-Q1 is a good performer in system reliability, meeting the stringent reliability requirements of AEC-Q100 Grade 1. It also comes with advanced SoC-level LED diagnostics and protection functions. These design features significantly bolster the overall system reliability, and ensure stable operation of the ambient lighting system in a wide range of complex environments, thus delivering a more reassuring and dependable driving experience for users.　　Outstanding electrical properties and application flexibility　　In terms of electrical properties, NSUC1500-Q1 demonstrates exceptional adaptability and flexibility. Its LIN port provides reverse voltage withstand range from -40V to 40V, ensuring reliable operation in high-stress electrical environments. The BVDD pin supports a wide withstand voltage range from -0.3V to 40V, allowing it to directly use 12V power from the automotive battery. This greatly simplifies the system design process and significantly enhances the application flexibility.　　Integrated high-precision ADC for enhanced signal processing capability　　NSUC1500-Q1 integrates a high-performance 12-bit SAR ADC, providing more precise signal processing support for ambient lighting drivers. In the single-ended mode, its differential non-linearity (DNL) is controlled between -1LSB and +0.8LSB, and its integral non-linearity (INL) is maintained in the range from -1.1LSB to +1.1LSB, ensuring high accuracy and stability in signal processing. In the differential-ended mode, the DNL and INL of NSUC1500-Q1 can range from -0.8LSB to +0.8LSB, enabling smoother and more refined color transitions and brightness adjustments even in complex lighting scenarios.　　Ultimately streamlined BOM for significant cost reduction　　With an ultimately streamlined BOM, NSUC1500-Q1 from NOVOSENSE brings significant cost efficiency enhancement and design optimization for ambient lighting systems. Apart from the ambient lighting LEDs, its peripheral circuit requires only five components: three capacitors, one ferrite bead, one reverse protection diode, and an optional Transient Voltage Suppressor (TVS) diode. This streamlined BOM design markedly reduces system costs, and allows a smaller PCB footprint, helping achieve an optimal balance between system cost and performance.　　Excellent EMC performance and shortened design cycle　　NSUC1500-Q1 from NOVOSENSE offers reference designs for ambient lighting, with optimized EMC (Electromagnetic Compatibility) and thermal management performance. NSUC1500-Q1 has successfully undergone and passed all automotive EMC/EMI tests according to the CISPR 25: 2021 standard, meeting the most stringent Class 5 requirements. Its outstanding EMC performance ensures stable operation even in complex electromagnetic environments. In addition, the reference designs tailored for specific applications are carefully optimized and well answer customer needs, thereby shortening the design cycle and saving valuable time and resources for customers.　　Cortex-M3 core for enhanced scalability　　NOVOSENSE NSUC1500-Q1 is equipped with an Arm® Cortex®-M3 core, and offers rich scalability, including memory and package options. This not only allows flexible platform development, but also provides a highly cost-effective solution for ambient lighting applications.　　Key features of NSUC1500-Q1　　- 32-bit ARM® Cortex®-M3　　- 32 KB Flash, 2 KB SRAM, 2 KB EEPROM, 15KB ROM with integrated UDS bootloader　　- On-chip high-precision oscillator with a main frequency of 32 MHz　　- 35 kHz low-power and low-speed clock　　- Operating voltage range from 6.0V to 28V　　- 4-channel high-precision current-mode LED drivers, with a maximum drive current of 64 mA　　- Supporting 16-bit independent PWM dimming and 6-bit analog dimming　　- 1-channel 12-bit high-precision ADC with a sampling rate of up to 1.5Msps　　- LIN PHY supporting LIN 2.x standards and SAE J2602　　- Supporting various fault diagnostics capabilities, such as LIN diagnostics, RGB diagnostics, and supply voltage monitoring, as well as thermal shutdown functionality　　- Typical power consumption in sleep mode at 20μA　　- Compliant with AEC-Q100 Grade 1　　- Available in QFN20/SOP8/HSOP packages

Key word：

NOVOSENSE

Release time：2025-03-14 09:57 reading：380 Continue reading>>

Trade news

GigaDevice's Dual-Power Supply SPI NOR Flash for 1.2V SoCs Halves Read Power Consumption

　　GigaDevice, a leading semiconductor company specializing in flash Memory, 32-bit microcontrollers (MCUs), sensors, analog products and solutions, has unveiled the GD25NE series of dual-power supply SPI NOR Flash, designed specifically for 1.2 V system-on-chip (SoC) applications.　　The GD25NE series strengthens GigaDevice's strategic dual-power supply Flash roadmap, providing seamless compatibility with next-generation 1.2 V SoCs and eliminating the need for an external booster circuit. With its higher performance and lower power consumption, the GD25NE series addresses the growing demand for advanced embedded storage, making it an ideal choice for wearable devices, healthcare, IoT, data center and Edge AI applications.　　Combining a 1.8 V core voltage with a 1.2 V I/O interface voltage, GD25NE supports single, dual, quad STR (single transfer rate) and quad DTR (double transfer rate) operation. It achieves high-speed clock frequencies of up to 133 MHz in STR mode and 104 MHz in DTR mode.　　With a typical page program time of 0.15ms and sector erase time of 30ms, the GD25NE series significantly outperforms conventional 1.2 V-only Flash solutions—offering up to 20% faster read performance, over 60% faster program speed, and 30% reduction in erase time. Due to these advances, it makes the GD25NE series an outstanding choice for emerging embedded applications.　　The GD25NE series is engineered with ultra-low power consumption by design, making it ideal for energy-sensitive applications. It features a typical deep power-down current of just 0.2 µA, a Quad I/O DTR read current of 9mA at 104 MHz, and program/erase currents as low as 8 mA. Compared to conventional 1.8 V solutions, the 1.2 V design reduces power consumption by up to 50%. This optimized power architecture not only enhances power efficiency but also simplifies system design while maintaining higher performance.　　“The GD25NE series represents a new class of dual-supply SPI NOR Flash, delivering an optimal balance of high performance and ultra-low power consumption," said Ruwei Su, GigaDevice vice president and general manager of Flash BU, "With significantly reduced power usage, faster read speeds, and enhanced program/erase efficiency, this solution is designed to meet the evolving demands of next-generation 1.2 V SoCs. As part of our ongoing commitment to innovation, we continue to expand our portfolio, providing customers with more efficient, reliable, and future-ready Flash solutions for new leading-edge applications”

Key word：

GigaDevice

Release time：2025-03-12 10:59 reading：398 Continue reading>>

Trade news

ROHM’s PMICs for SoCs have been Adopted in Reference Designs for Telechips’ Next-Generation Cockpits

　　ROHM has announced the adoption of its PMICs in power reference designs focused on the next-generation cockpit SoCs ‘Dolphin3’ (REF67003) and ‘Dolphin5’ (REF67005) by Telechips, a major fabless semiconductor manufacturer for automotive applications headquartered in Pangyo, South Korea. Intended for use inside the cockpits of European automakers, these designs are scheduled for mass production in 2025.　　ROHM and Telechips have been engaged in technical exchanges since 2021, fostering a close collaborative relationship from the early stages of SoC chip design. As a first step in achieving this goal, ROHM’s power supply solutions have been integrated into Telechips’ power supply reference designs. These solutions support diverse model development by combining sub-PMICs and DrMOS with the main PMIC for SoCs.　　For infotainment applications, the Dolphin3 application processor (AP) power reference design includes the BD96801Qxx-C main PMIC for SoCs. Similarly, the Dolphin5 AP power reference design developed for next-generation digital cockpits combines the BD96805Qxx-C and BD96811Fxx-C main PMICs for SoC with the BD96806Qxx-C sub-PMIC for SoC, improving overall system efficiency and reliability.　　Modern cockpits are equipped with multiple displays, such as instrument clusters and infotainment systems, with each automotive application becoming increasingly multifunctional. As the processing power required for automotive SoCs increases, power ICs like PMICs must be able to support high currents while maintaining high efficiency. At the same time, manufacturers require flexible solutions that can accommodate different vehicle types and model variations with minimal circuit modifications. ROHM SoC PMICs address these challenges with high efficiency operation and internal memory (One Time Programmable ROM) that allows for custom output voltage settings and sequence control, enabling compatibility with large currents when paired with a sub-PMIC or DrMOS.　　Moonsoo Kim,　　Senior Vice President and Head of System Semiconductor R&D Center, Telechips Inc.“Telechips offers reference designs and core technologies centered around automotive SoCs for next-generation ADAS and cockpit applications. We are pleased to have developed a power reference design that supports the advanced features and larger displays found in next-generation cockpits by utilizing power solutions from ROHM, a global semiconductor manufacturer. Leveraging ROHM’s power supply solutions allows these reference designs to achieve advanced functionality while maintaining low power consumption. ROHM power solutions are highly scalable, so we look forward to future model expansions and continued collaboration.”　　Sumihiro Takashima,　　Corporate Officer and Director of the LSI Business Unit, ROHM Co., Ltd.“We are pleased that our power reference designs have been adopted by Telechips, a company with a strong track record in automotive SoCs. As ADAS continues to evolve and cockpits become more multifunctional, power supply ICs must handle larger currents while minimizing current consumption. ROHM SoC PMICs meet the high current demands of next-generation cockpits by adding a DrMOS or sub-PMIC in the stage after the main PMIC. This setup achieves high efficiency operation that contributes to lower power consumption. Going forward, ROHM will continue our partnership with Telechips to deepen our understanding of next-generation cockpits and ADAS, driving further evolution in the automotive sector through rapid product development.”　　・ Telechips SoC [Dolphin Series]　　The Dolphin series consists of automotive SoCs tailored to In-Vehicle Infotainment (IVI), Advanced Driver Assistance Systems (ADAS), and Autonomous Driving (AD) applications. Dolphin3 supports up to four displays and eight in-vehicle cameras, while Dolphin5 enables up to five displays and eight cameras, making highly suited as SoCs for increasingly multifunctional next-generation cockpits. Telechips is focused on expanding the Dolphin series of APs (Application Processors) for car infotainment, with models like Dolphin+, Dolphin3, and Dolphin5, by leveraging its globally recognized technical expertise cultivated over many years.　　・ ROHM 's Reference Design Page　　Details of ROHM’s reference designs and information on equipped products are available on ROHM’s website, along with reference boards. Please contact a sales representative or visit ROHM’s website for more information.　　https://www.rohm.com/contactus　　■ Power Supply Reference Design [REF67003] (equipped with Dolphin3)　　Reference Board No. REF67003-EVK-001　　https://www.rohm.com/reference-designs/ref67003　　■ Power Supply Reference Design [REF67005] (equipped with Dolphin5)　　Reference Board No. REF67005-EVK-001　　https://www.rohm.com/reference-designs/ref67005　　About Telechips Inc.Telechips is a fabless company specialized in designing system semiconductors that serve as the “brains” of automotive electronic components. The South Korean firm offers reliable, high-performance automotive SoCs. In response to the industry’s transition toward SDVs (Software Defined Vehicles), Telechips is broadening its core portfolio beyond car infotainment application processors (APs) to include MCUs, ADAS, network solutions, and AI accelerators.　　As a global, comprehensive automotive semiconductor manufacturer, Telechips adheres to international standards such as ISO 26262, TISAX, and ASPICE, leveraging both hardware and software expertise for future mobility ecosystems, including not only automotive smart cockpits, but also E/E architectures. What’s more, Telechips provides optimal solutions for In-Vehicle Infotainment systems (IVI), digital clusters, and ADAS, all compliant with key automotive standards (AEC-Q100, ISO 26262). Telechips has established business relationships with major automakers both domestically and internationally, supported by a strong track record of shipments.　　One flagship product is the Dolphin5 automotive SoC that integrates an Arm®-based CPU, GPU, and NPU to meet high-performance requirements. As a fabless company, Telechips outsources the manufacturing of its SoCs to Samsung Electronics’ foundry, delivering high-quality semiconductor products to domestic and overseas manufacturers. For more information, please visit Telechips’ website:　　https://www.telechips.com/　　*Arm® is a trademark or registered trademark of Arm Limited.　　TerminologyPMIC (Power Management IC)　　An IC that contains multiple power supply systems and functions for power management and sequence control on a single chip. It is becoming more commonplace in applications with multiple power supply systems in both the automotive and consumer sectors by significantly reducing space and development load vs conventional circuit configurations using individual components (i.e. DC-DC converter ICs, LDOs, discretes).　　SoC (System-on-a-Chip)　　A type of integrated circuit that incorporates a CPU (Central Processing Unit), memory, interface, and other elements on a single substrate. Widely used in automotive, consumer, and industrial applications due to its high processing capacity, power efficiency, and space savings.　　AP (Application Processor)　　Responsible for processing applications and software in devices such as smartphones, tablets, and automotive infotainment systems. It includes components such as a CPU, GPU, and memory controller to efficiently run the Operating System (OS), process multimedia, and render graphics.　　DrMOS (Doctor MOS)　　A module that integrates a MOSFET and gate driver IC. The simple configuration is expected to reduce design person-hours along with mounting area and to achieve efficient power conversion. At the same time, the built-in gate driver ensures high reliability by stabilizing MOSFET drive.

Key word：

ROHM

Release time：2024-12-20 13:56 reading：724 Continue reading>>

Trade news

ROHM at electronica 2024: Empowering Growth, Inspiring Innovation

　　Willich/Munich, Germany, October 10th, 2024 – ROHM Semiconductor Europe is looking forward to electronica 2024 – the world’s leading trade fair and conference for electronic components, systems, applications, and solutions. The event will take place between November 12th to 15th in Munich.　　At booth C3-520, ROHM will showcase its advanced power and analog technologies designed to enhance power density, efficiency, and reliability in both automotive and industrial applications. These advancements are crucial for addressing the increasing demands of modern electronic systems, particularly in the context of sustainability and innovation.　　Under the theme "Empowering Growth, Inspiring Innovation," ROHM will highlight via its various demo application stations in “tree style” how its high-quality semiconductor technologies contribute to solving critical social and ecological challenges. The focus will be on driving sustainability in electronic design and innovation, which aligns with the growing emphasis on creating environmentally responsible solutions within the industry.　　At electronica 2024, the exhibition space has been greatly expanded and the number of items on display has been increased to 30 – more than three times compared to the previous show.　　The latest solutions will be exhibited under the three themes of “for E-Mobility”, “for Automotive”, and “for Industrial”.　　For E-Mobility　　・TRCDRIVE pack™ with 2-in-1 SiC Molded Module to improve the efficiency of traction inverters　　・New EcoIGBT™ products for electric compressors　　・New EcoSiC™ Schottky Barrier Diodes for onboard chargers　　For Automotive　　・New configurable PMIC with supporting functional safety features for application processors, SoCs and FPGAs　　・LED Driver ICs for Exterior Lighting / Head Lamps　　・Advanced solutions on the ADAS cockpit demo　　For Industrial Equipment　　・Industrial AC-DC PWM Controller ICs – support a wide range of power transistors from Si MOSFETs and IGBTs to SiC MOSFETs　　・The EcoGaN™ family of 150V and 650V class GaN HEMTs in several EVKs　　・Latest R&D project on Terahertz　　In addition to product showcases, ROHM is committed to fostering technical exchange and collaboration at electronica 2024. "For us, electronica is more than just a showcase – it’s an opportunity to forge new connections, strengthen existing partnerships, and reunite with industry peers," says Wolfram Harnack, President of ROHM Semiconductor Europe. "We are excited to welcome our guests to Munich as we work together to shape the future of electronics."　　For a sneak peek at which highlights ROHM will present during electronica 2024, visit our event preview page: https://www.rohm.com/electronica　　TRCDRIVE pack™, EcoIGBT™, EcoSiC™ and EcoGaN™ are trademarks or registered trademarks of ROHM Co., Ltd.

Key word：

ROHM

Release time：2024-11-05 15:56 reading：548 Continue reading>>

Trade news

Fibocom Drives the Rapid Growth in the Economics of IoT Scale with Ultra-compact size Cat 1 bis Module MC610-GL at MWC Shanghai 2024

　　Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, announces the new member of its LTE Cat 1 bis module portfolio featuring high reliability, ultra-compact size and cost-effectiveness at MWC Shanghai 2024. The MC610-GL is positioned to foster the economics of IoT scale in vertical markets across asset tracking, E-mobility, AMI (Advanced Metering Infrastructure), etc.　　The Global Cellular IoT Module market shows a 7% year-over-year (YoY) growth in Q1 2024, according to the latest reports by IoT Analytics. Despite ongoing inventory and demand issues in several other regions globally, technologies like 5G and LTE Cat-1 bis have seen a combined market growth of 67% year-over-year, signifying their substantial contribution to the cellular IoT module market's overall growth. “The statistics have verified Cat 1 bis’ driving forces in bringing affordable and reliable wireless connectivity service to a diversified IoT landscape, even though 5G remains strong performance in the data-intensive scenarios, and Cat 1 bis takes the lead in the mainstream low and medium speed market thanks to the worldwide 4G infrastructure,” said Kevin Guan, Director of MTC Product Marketing at Fibocom. “Without a doubt, we are optimistic in expanding the utilization of Cat 1 bis technology in segment areas and providing the value-added reference design service to industry customers. Looking forward, the MC610-GL is expected to address its top performance in the global market and accelerate the large-scale IoT deployment worldwide.”　　Developed from the UNISOC 8910DM platform, the MC610-GL supports major carrier frequency bands worldwide and complies with rich network standards, thus ensuring uninterrupted wireless connection anywhere, anytime, especially catering to asset tracking scenarios. It adopts an ultra-compact LCC+LGA form factor design measured at 24.2 x 26.2 x 2.1mm with dual-mode (4G+2G) supported, providing great convenience for customers to switch from LTE Cat M to Cat 1 bis at the minimum investment. Equipped with rich standard interfaces, the module empowers a wide range of low-to-medium speed IoT industries with up to 10Mbps downlink data transmission rate while conserving significant cost. Leveraging the industry capabilities within Fibocom, customers are catered to the reference design service and support, reducing the lead time to market. In addition, regional versions for EMEA (MC610-EU) and Latin America (MC610-LA) are flexibly adjustable in request to customers’ cost concerns.

Key word：

Fibocom

Release time：2024-07-03 13:57 reading：640 Continue reading>>

Trade news

Murata commercializes low-power Wi-Fi®/Bluetooth® combo module:Helping proliferate battery-powered IoT equipment

　　Murata Manufacturing Co., Ltd. (hereinafter, “Murata”) has developed and begun mass-producing the low-power compact wireless module “Type 2GF” (hereinafter “this product”) with built-in Infineon Technologies (hereinafter “Infineon”) “CYW43022” Wi-Fi®/Bluetooth®/Bluetooth® Low Energy combo chip.　　With the expansion of applications in the IoT market in recent years, there has been a rise in IoT equipment with wireless communication functions. There has been a diversification in the different specifications wireless communication functions need to have depending on the application. For battery-powered devices, wireless communication functions are also being required to have lower power consumption.　　In response to this demand, Murata has applied proprietary wireless design technology and product processing technology to develop this product with CYW43022 built in to have low power consumption capabilities. Because CYW43022 can maintain connectivity even when a host processor is in sleep mode due to its connectivity processing capability with the chip’s Bluetooth® stack and Wi-Fi® network offloading, the chip helps this product consume less power at the system level. Space was also saved on the module by using often space-occupying noise shields in a smaller size, which allowed us to make this product more compact.　　Specifications

Key word：

Murata

Release time：2024-06-28 11:31 reading：610 Continue reading>>

BIWIN TF200 Series MicroSD: Enhanced Raspberry <span style='color:red'>Pi</span> 4B Compatibility

Trade news

BIWIN TF200 Series MicroSD: Enhanced Raspberry Pi 4B Compatibility

　　BIWIN's TF200 series microSD cards have passed the Raspberry Pi 4B AVL certification, ensuring compatibility and adaptability with Raspberry Pi microcomputers.　　The TF200 microSD cards underwent rigorous tests on the Raspberry Pi 4 Model B/4GB platform. These tests included loading each test card with a custom image (including the latest Bullseye image), an automated stress test script, and a locally accessible website using Google Puppeteer for automated testing. After over 15,000 power-off tests and over 2.7 million seconds of continuous operation, the product demonstrated a continuous write speed of over 26 MB/s, a random write speed of up to 717 IOPS, and a random read speed of up to 3525 IOPS. These results meet the testing benchmarks required by Raspberry Pi, ensuring efficient and stable operation of the Raspberry Pi devices.　　The TF200 series microSD cards feature firmware functionalities such as garbage collection and bad block management to ensure stable data recording without frame loss. The product reaches the U3 speed class and V30 video speed class, with sequential read and write speeds of up to 158 MB/s and 113 MB/s respectively, supporting 4K RAW ultra-high-definition video capture and high-speed continuous shooting. Leveraging the company's advanced packaging technologies like multi-layer stacking and ultra-thin Die, the product offers capacities up to 256 GB (with future releases of 512 GB and 1 TB). It also supports flash wear leveling technology with a P/E Cycle of 3000 times. With operational temperature ranges from -25 °C to 85 °C and features such as waterproofing, shock resistance, and temperature shock resistance, the product is well-equipped to handle various complex environmental challenges.　　The TF200 series microSD cards combine high stability, reliability, and durability, making them compatible with mainstream terminal devices. They are suitable for fields like video surveillance, digital education, industrial tablets, and dashcams. Leveraging its expertise in storage solution development and advanced testing, BIWIN can tailor storage device performance, reliability, and power consumption to meet the testing and certification requirements of SoC chips and system platforms. This adaptability ensures a high degree of compatibility with different platforms, effectively meeting the diverse storage needs of various terminal applications.

Key word：

BIWIN

Release time：2024-01-26 13:44 reading：2133 Continue reading>>

What are Transistor <span style='color:red'>Pi</span>nouts?What are the Two Types of Transistor <span style='color:red'>Pi</span>nouts?

Trade news

What are Transistor Pinouts?What are the Two Types of Transistor Pinouts?

　　Transistors, the foundational building blocks of modern electronic devices, come in diverse configurations, each with its own unique pinout and operational characteristics. This guide aims to provide a comprehensive overview of a standard transistor pinout and configuration.　　You’ll learn about the different types of transistors, their physical layout, and how to identify the base, collector, and emitter pins. This guide will serve as a valuable resource for understanding and working with transistors.　　What are Transistor Pinouts?A transistor pinout is the arrangement and identification of the pins located on a transistor. There are different forms of transistors, including bipolar junction transistors and field-effect transistors. Each of the independent forms of transistors has its unique pinout configuration.　　When transistors apply in any circuit, it is imperative that the correct pinout is used. You can find the ideal pin configuration through the datasheets provided by the manufacturer. These datasheets also provide the recommended operating conditions for specific transistors and their electrical characteristics.　　What are the Two Types of Transistor Pinouts?Two primary transistor pinout variants include:　　1. Single In-line Package: they are ideal for through-hole components, which makes them perfect for prototyping. It is a common variant for small-signal transistors, such as the ones used in low-power apps. In such a variant, all of the pins lie in one row along a single side of the transistor package.　　2. Dual In-line Package: they are ideal for both through-hole and SMD components. They can be mounted on PCBs and are perfect for a wide range of integrated circuits. In such a variant, the pins are in two parallel rows on either sides of the transistor package.　　How to Identify a Transistor Pinout?　　Identifying a transistor pinout involves the following steps:　　1. Refer to the datasheet: the datasheet offers the most accurate information about a transistor pinout. You can search for the part number of the transistor and check its datasheet online. You can also check the manufacturer’s website for more details.　　2. Check the markings on the transistor: manufacturers often place the part numbers on the transistors. Identify a code or pattern, which has the transistor pinout. Most transistors have markings near a specified pin to indicate the reference point.　　3. Note the transistor type: it can either be a PNP bipolar junction transistor or an NPN. It can also be either a P-channel field-effect transistor or an N-channel field-effect transistor. This information will help you to identify the transistor pinout.　　4. Use a multimeter: set the multimeter to a diode test mode. Note the transistor’s terminals then use the multimeter to measure forward voltage drop between two terminals.　　5. Check continuity: check the continuity between the terminals using the continuity function of the multimeter.　　6. Trial and error: when you can’t find the markings nor the datasheet, then you can opt to use the trial and error method. Start by applying a small voltage to one pair of the terminals and check the results. Test different combinations to identify the transistor pinout.　　What is a Transistor Pinout Diagram?A transistor pinout diagram is a graphical demonstration showing the arrangement of terminals and pins on a transistor and their corresponding functions. The diagrams are important since they help in connecting transistors correctly.　　A manufacturer’s datasheet will typically have a transistor pinout diagram. Here are some of the elements you will find in a transistor pinout diagram:　　Symbolic representation.　　Pins and labels.　　Physical orientation.　　Arrow or dot.　　Additional information about the transistor pinout.　　How Do You Test a Transistor Pinout?　　You can test a transistor pinout using a multimeter through the following steps:　　Testing the Bipolar Junction Transistor　　1. Identify the transistor type.　　2. Locate the base terminal.　　3. Use the diode test mode.　　4. Probe the base terminal.　　5. Locate the emitter and collector.　　6. Perform a verification using the continuity test.　　Testing Field-Effect Transistor　　1. Identify the FET type.　　2. Find the gate terminal.　　3. Utilize the diode test mode.　　4. Probe the gate terminal.　　5. Locate the source and drain.　　6. Perform a verification using the continuity test.　　Do All Transistors Have the Same Pinout?Not every transistor has the same pinout. The pinout depends on the specific type of transistor, the configuration, and the particular model or part number. You can easily find different models even from the same manufacturer with distinct pinouts.　　The primary factors that determine the transistor pinout include the following:　　Transistor type.　　Manufacturer and model.　　Package type.　　Application.　　Integrated circuits.　　Factors to Consider When Specifying the Pins of TransistorsFor proper operation of the electronic circuit, here are the key considerations when specifying the transistor pinout:　　1. Transistor type: is it a bipolar junction transistor or a field-effect transistor?　　2. Pin configuration: check the base, emitter, and collector for a BJT. For an FET, check the source, gate, and drain.　　3. Package type: consider the physical dimensions and pins layout based on the type of package.　　4. Application requirements: every application has its unique requirements.　　5. Datasheet information: for more accurate information of the transistor pinout, check the manufacturer’s datasheet.　　6. Polarity and orientation: consider the orientation and polarity of the transistor. This is particularly important when it is part of a larger circuit.　　7. Matching with circuit layout: take note of how the transistor’s pinout matches the circuit board layout. Make sure that the transistor pinout matches your circuit design and has a clean and efficient layout.　　8. Identification markings: check for markings on the transistor that show the pinout.　　9. Temperature and power ratings: the datasheet will provide information about the temperature and power ratings to ensure the transistor you choose can tackle its allocated applications.　　10. Alternatives and availability: take note of the availability of the selected transistor and analyze alternative models with identical specifications if the main choice is unavailable.　　11. Verification and testing: use a multimeter to analyze the transistor pinout before integration to the circuit. Exercise caution while adhering to the set standard testing procedures.　　Final ThoughtsIn conclusion, understanding the transistor pinout and configuration is a vital aspect of electronic circuit design. It allows for effective utilization of these essential components, enhancing the overall performance and reliability of electronic devices.　　When it comes to sourcing quality transistors, IBE stands out with commitment to excellence and innovation. With our wide range of high-performance transistors, IBE is a trusted partner for electronics professionals worldwide. Our products consistently deliver on quality and reliability, making us the go-to choice for those seeking the best in the field.

Key word：

Transistor Pinouts

Release time：2024-01-16 13:42 reading：1223 Continue reading>>

Trade news

GigaDevice Unveils the Industry's Smallest 128Mb SPI NOR Flash in 3x3x0.4mm FO-USON8 Package

　　GigaDevice a semiconductor industry leader in flash memory, 32-bit microcontrollers, sensors, and analog technology, announces the launch of the industry’s smallest 128Mb SPI NOR Flash, GD25LE128EXH, in the ultra-compact 3x3x0.4mm FO-USON8 package. With its thickness of only 0.4mm, the GD25LE128EXH offers designers unparalleled flexibility in designing compact applications, making it the ideal code storage unit for IoT, wearables, healthcare, and networking products that demand high functionality and low power consumption.　　As a flagship product of GigaDevice's low power SPI NOR Flash series, the GD25LE128EXH features outstanding performance, with a maximum frequency of 133MHz and a data throughput of up to 532Mbit/s, significantly enhancing system access speed and instant-on capability. Compared to other industry products, the GD25LE128EXH operates at a lower read current of only 6mA when running at 4-channel 133MHz frequency, reducing the power consumption by 45% and effectively extending battery life. The GD25LE128EXH achieves an ultra-small size for 128Mb products by using the new FO-USON8 package, which reduces area by 70% and thickness by 50%, compared to the conventional 6x5x0.8mm WSON8 package typically used for such products. As a result, GD25LE128EXH takes up 85% less space and reduces material cost.　　The 3x3x0.4mm FO-USON8 GD25LE128EXH is also pin compatible with 64Mb and lower capacity 3x4x 0.6mm USON8 products, enabling quick density upgrades to 128Mb without changing the PCB layout.　　"As a leading fabless company, GigaDevice not only advocates for innovative technology, but also applies it in practice," said Mike Chen, Executive Director of GigaDevice Memory Business Unit, " Our new GD25LE128EXH, the industry's first 128Mb SPI NOR Flash in an ultra-small package, with its lower power consumption, perfectly suitable for any battery-powered design. We anticipate an increase in demand for high-density SPI NOR Flash that is small and power-efficient, and we are planning to develop a more comprehensive product portfolio using advanced package technology to address such needs in the near future.”　　The GD25LE128EXH is currently in mass production, please contact our sales and distributors for order information. The 3mmx2mmx0.4mm FO-USON8 GD25LE64E will be expected to provide samples in the end of May, contact our sales to get more details.

Key word：

GigaDevice

Release time：2024-01-08 14:51 reading：2560 Continue reading>>

Trade news

ROHM Offers the Industry’s Largest* Library of LTspice® Models at Over 3,500 by Adding SiC and IGBTs

　　ROHM has expanded the library of SPICE model lineup for LTspice® of its circuit simulator. LTspice® is also equipped with circuit diagram capture and waveform viewer functions that make it possible for designers to check and verify in advance whether the circuit operation has been achieved as designed. In addition to the existing lineup of bipolar transistors, diodes, and MOSFETs, ROHM has added SiC power devices and IGBTs that increases its number of LTspice® models to more than 3,500 for discretes (which can be downloaded from product pages). This brings the amount of coverage of LTspice® models on ROHM’s website to over 80% of all products - providing greater convenience to designers when using circuit simulators that incorporate discrete products, now including power devices.　　In recent years, the increasing use of circuit simulation for circuit design has expanded the number of tools being utilized. Among these, LTspice® is an attractive option for a range of users, from students to even seasoned engineers at well-known companies. To support these and other users, ROHM has expanded its library of LTspice® models for discrete products.　　Besides product pages, ROHM has added a Design Models page in October that allows simulation models to be downloaded directly. Documentation on how to add libraries and create symbols (schematic symbols) is also available to facilitate circuit design and simulation execution.　　Going forward, ROHM will continue to contribute to solving circuit design issues by expanding the number of models compatible with various simulators while providing web tools such as ROHM Solution Simulator to meet growing customer needs.　　TerminologySPICE Model　　Data that expresses the operating characteristics of elements in mathematical equations for use in electronic circuit simulations. The SPICE model format may differ depending on the simulator (usually in the form of a text file).　　Circuit Simulator　　A software-based tool that makes it possible to design and verify electronic circuits without the need for actual electronic components.　　MOSFET (Metal Oxide Semiconductor Field Effect Transistor)　　The most commonly used structure in FETs.　　IGBT (Insulated Gate Bipolar Transistor)　　A power transistor that combines the high-speed switching characteristics of a MOSFET with the low conduction loss of a bipolar transistor.　　ROHM Solution Simulator　　A free electronic circuit simulation tool that runs on ROHM’s website. A wide variety of simulations are supported, from component selection and standalone device verification to system-level operational testing.

Key word：

ROHM

Release time：2023-12-06 11:52 reading：1893 Continue reading>>

model	brand	Quote
RB751G-40T2R	ROHM Semiconductor
TL431ACLPR	Texas Instruments
MC33074DR2G	onsemi
CDZVT2R20B	ROHM Semiconductor
BD71847AMWV-E2	ROHM Semiconductor

model	brand	To snap up
TPS63050YFFR	Texas Instruments
IPZ40N04S5L4R8ATMA1	Infineon Technologies
BU33JA2MNVX-CTL	ROHM Semiconductor
BP3621	ROHM Semiconductor
ESR03EZPJ151	ROHM Semiconductor
STM32F429IGT6	STMicroelectronics

PART	Quantity*	Target Price
	Quantity MOQ: 1	Target Price $ If not sure, you may skip this
remark

Telephone *	Name
Company
Email