BIWIN TF200 Series MicroSD: Enhanced Raspberry Pi 4B Compatibility

Release time：2024-01-26
author：AMEYA360
source：BIWIN
reading：2127

　　BIWIN's TF200 series microSD cards have passed the Raspberry Pi 4B AVL certification, ensuring compatibility and adaptability with Raspberry Pi microcomputers.

BIWIN TF200 Series MicroSD: Enhanced Raspberry Pi 4B Compatibility

　　The TF200 microSD cards underwent rigorous tests on the Raspberry Pi 4 Model B/4GB platform. These tests included loading each test card with a custom image (including the latest Bullseye image), an automated stress test script, and a locally accessible website using Google Puppeteer for automated testing. After over 15,000 power-off tests and over 2.7 million seconds of continuous operation, the product demonstrated a continuous write speed of over 26 MB/s, a random write speed of up to 717 IOPS, and a random read speed of up to 3525 IOPS. These results meet the testing benchmarks required by Raspberry Pi, ensuring efficient and stable operation of the Raspberry Pi devices.

BIWIN TF200 Series MicroSD: Enhanced Raspberry Pi 4B Compatibility

　　The TF200 series microSD cards feature firmware functionalities such as garbage collection and bad block management to ensure stable data recording without frame loss. The product reaches the U3 speed class and V30 video speed class, with sequential read and write speeds of up to 158 MB/s and 113 MB/s respectively, supporting 4K RAW ultra-high-definition video capture and high-speed continuous shooting. Leveraging the company's advanced packaging technologies like multi-layer stacking and ultra-thin Die, the product offers capacities up to 256 GB (with future releases of 512 GB and 1 TB). It also supports flash wear leveling technology with a P/E Cycle of 3000 times. With operational temperature ranges from -25 °C to 85 °C and features such as waterproofing, shock resistance, and temperature shock resistance, the product is well-equipped to handle various complex environmental challenges.

BIWIN TF200 Series MicroSD: Enhanced Raspberry Pi 4B Compatibility

　　The TF200 series microSD cards combine high stability, reliability, and durability, making them compatible with mainstream terminal devices. They are suitable for fields like video surveillance, digital education, industrial tablets, and dashcams. Leveraging its expertise in storage solution development and advanced testing, BIWIN can tailor storage device performance, reliability, and power consumption to meet the testing and certification requirements of SoC chips and system platforms. This adaptability ensures a high degree of compatibility with different platforms, effectively meeting the diverse storage needs of various terminal applications.

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How Will BIWIN BGA SSD Break Through in the Intelligent Upgrade Path of Edge Devices?
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How Will BIWIN BGA SSD Break Through in the Intelligent Upgrade Path of Edge Devices?

　　In the wave of edge intelligence upgrades, as products are continuously evolving toward miniaturization and high integration, the device systems are confronted with dual challenges of physical space compression and surging computing power. Over the past years, BIWIN has invested significant effort in advancing research and development in storage technologies and advanced packaging and testing processes, providing it with competitive advantages in delivering tailored, miniaturized, and highly integrated storage solutions, including a diverse product portfolio, patented proprietary technologies, and a robust manufacturing and supply chain system.　　Notably, the BIWIN-launched EP410 BGA SSD, with its innovative architectural design, exemplifies a breakthrough solution for edge devices upgrades by offering three key capabilities: a compact and lightweight design, outstanding performance, and high reliability. While offering form factors as compact as those of embedded chips to meet the rigorous dimension requirements of portable devices, these SSDs are able to deliver superior performance and flexible capacity options compared to UFS/eMMC standards.　　Ultra-Thin, Compact Design to Maximize System Spatial Efficiency　　The increasing inference frequencies across smartphones and PCs have made the large capacity a fundamental configuration. Meanwhile, in order to deliver optimized user experience and robust operation under complicated environments, the terminal manufacturers are striving to achieve maximized hardware efficiency and capacity utilization within constrained system dimensions.　　Aligned with the trends in product iteration, BGA SSD EP410 is equipped with advanced packaging processes such as 16-layer die stacking and 40μm ultra-thin die, realizing the compact form factor measuring only 16×20×1.4mm—merely 1/14 the volume of conventional M.2 2280 SSDs (80×22×3.5mm). Surprisingly, it’s able to deliver uncompromising capacity up to 2TB, supporting the smooth image recognition and natural language processing in edge devices and free of capacity limitations. The adopted packaging processes not only reduces board footprint, providing more design flexibility for terminal manufacturers, but also enhances electrical performance to accommodate greater data throughput, enabling device manufacturers to develop more streamlined, competitively advantageous products.　　Uncompromised Performance, Establishing a Robust Foundation for Edge Intelligence Inference　　In terms of performance, BIWIN has harnessed its integrated R&D and packaging and testing business model, along with the optimization and tuning of firmware algorithm, to satisfy the critical demands for error correction, data security and integrity in storage products across various application scenarios.　　The BIWIN EP410 BGA SSD is compatible with PCIe 4.0 interface and NVMe protocol, with its sequential read/write speed reaching 7350MB/s and 6600MB/s respectively, far surpassing the theoretical bandwidth capability of UFS 4.0. Incorporated with self-developed flash memory management algorithm and dynamic bandwidth allocation technology, BIWIN BGA SSD has demonstrated excellent bandwidth stability, qualifying for edge intelligence devices’ access to high-speed data and transfers of high-load requirements with low latency, as well as the responsive handling of sophisticated intelligent tasks. 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In order to ensure efficient heat dissipation, the product is engineered with DRAM-less architecture with intelligent thermal throttling, as well as in-house LDPC, dynamic and static wear leveling, bad block management and multi-environmental adaptability, contributing to significantly improving the data integrity and security, ensuring long-term stable operations and preventing disconnection during critical usage scenarios including gaming, productivity applications, and content creation.　　Having been subjected to BIWIN’s thorough testing procedures, including electrical performance, SI, application, compatibility, and reliability testings, the products have been validated with their MTBF exceeding 1,500,000 hours and operating temperature ranging from 0℃ to 70℃, enabling the flagship intelligent terminals, for example the 2-in-1 laptops, UAVs, automotive IVI, to catch the wave of edge intelligence upgrades.　　Conclusion　　From the successful mass production of its first PCIe BGA SSD in 2018 to the latest generation EP410 BGA SSD featuring the PCIe Gen4 x4 interface, BIWIN’s continuously evolving products demonstrate its deep expertise in miniaturization and high-integration technologies, while also highlighting its visionary foresight in the ecosystem of edge intelligence. As AI and storage technologies progress toward deeper ecological integration, BIWIN will further leverage its early-mover advantages in mobile terminal storage chips and extend this advantage into the edge intelligence era. Whether in hardware design, software optimization, or ecosystem construction, BIWIN remains committed to advancing industry progress and delivering increasingly intelligent, efficient, and reliable storage solutions to users.
2025-03-20 14:01 reading：225
BIWIN Solutions for Communication Modules: High-Speed, Stable, and Built for Seamless Data Flow
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BIWIN Solutions for Communication Modules: High-Speed, Stable, and Built for Seamless Data Flow

　　The Internet of Things (IoT) is on a steep upward trajectory. Statista predicts that by 2025, the world will see a surge of connected IoT devices to 29.422 billion units from 9.757 billion units, with CAGR reaching 11.67%. This explosion isn’t just powering the deployment of more smart gadgets; it’s opening up huge opportunities for hardware and storage tech. At the core of this ecosystem, communication modules serve as the vital link between the physical and digital realms. Their performance directly shapes the efficiency, stability, and security of IoT systems, handling everything from collecting sensor data to transmitting it wirelessly to the cloud or end devices—powering critical functions like remote monitoring and data analysis.　　With the rapid expansion of IoT applications, storage components within communication modules face heightened challenges. They must excel in high-bandwidth data transmission, multitasking concurrency, continuous data streaming over extended periods, efficient and stable data read/write operations, data security protection, and system compatibility to ensure real-time transmission and secure storage of critical data.　　In response to these industry challenges head-on, BIWIN draws on its “integrated R&D and packaging” expertise, along with its expertise from markets such as smartphones and smart wearables, to offer a comprehensive storage solution product matrix for communication modules, including eMMC, LPDDR, eMCP, uMCP, and more. These products have been widely applied to power 5G/4G and smart modules from industry leaders like Quectel, Fibocom, and MeiG Smart, providing solid foundations for the efficient and reliable operations of communication networks.　　01 Tackling Tough Scenarios with Top-Notch Storage　　In practical deployments across fields such as smart metering, industrial applications, routers, automotive systems, and POS machines, communication modules face numerous challenges. Particularly in outdoor environments, harsh weather, extreme temperatures, humidity fluctuations, prolonged continuous operation, and electromagnetic interference can all impact module performance. Any data loss or delay could result in IoT system failures or degraded service quality.　　Taking specific IoT application scenarios as an example, in surveillance systems requiring uninterrupted high-definition video recording, storage components must maintain stable, high-speed read/write performance. 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Meanwhile, the chips have also been tested with rigorous processes, covering electrical testing, signal integrity (SI) testing, reliability testing, and application testing. These chips can withstand gravitational acceleration up to 1500G, vibration amplitudes of 20-2000Hz, and achieve a mean time between failures (MTBF) exceeding 1.5 million hours, ensuring high-quality delivery and consistency across all aspects.　　02 Building a Comprehensive Product Matrix to Provide Efficient and Reliable Storage Support　　With key attributes such as highly stable read/write performance, exceptional reliability and durability, and excellent compatibility, BIWIN’s eMMC, LPDDR4X, eMCP3/4x, and uMCP2.2 series products have earned certifications from mainstream SoC platforms like Qualcomm, MediaTek, and Unisoc. They have been integrated into the supply chains of multiple renowned communication module manufacturers, continuously empowering the stable operation of communication modules.　　In conclusion　　As technologies such as AI, edge computing, 5G/6G, and LPWAN become deeply integrated, the IoT will evolve into more mature and diverse forms, permeating all aspects of life and generating immense demand for data computation, processing, transmission, and storage. Facing this trend, BIWIN will capitalize on its comprehensive strengths in R&D, controller design, packaging and testing, and supply chain management to deepen collaboration with communication module vendors and platform providers, fully addressing the multidimensional customization needs of edge-side communication modules for storage performance, reliability, and stability and jointly accelerating the expansion of IoT application boundaries.
2025-03-13 11:40 reading：332
BIWIN Wins
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BIWIN Wins "Top 10 Digital Transformation Innovation Enterprises" Award

　　Over the past days, the 2024 DT WORLD (Digital-Tech World Leaders Summit) & IDI Award Ceremony (International Digital-Tech Innovation Award) were successfully held in Shenzhen. BIWIN was honored as the “Top 10 Digital Transformation Innovation Enterprises”, and Chengsi Sun, Chairman of BIWIN, was named one of the “Top 10 Digital Transformation Leaders.” These awards are not only the reflections of BIWIN’s technological prowess and innovation capabilities, but also the landmarks of the company’s significant achievements in advancing its own and the industry’s digital transformation.　　Integrated R&D and Packaging 2.0 Strategy: Cultivating New Quality Productive Forces　　Granted as the pillar hardware infrastructure supporting the digital economy and AI industry, semiconductor storage stands as a vital representative of new quality productive forces. 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As a result, these solutions empower the efficient data storage, analysis, and retrieval for intelligent equipment and robots, ensuring stable high-precision operations.　　In energy and power, BIWIN has introduced a myriad of large-capacity storage solutions to satisfy the vast monitoring demands of smart grid systems, enabling precise energy management and predictive maintenance. In security and surveillance, BIWIN products support 24/7 uninterrupted video data collection, transmission, and storage, with capabilities for intelligent video analysis and automated anomaly detection, enhancing public and personal safety. In railway transportation, BIWIN offers rugged SSD solutions to support intelligent urban rail operations, capable of withstanding harsh conditions like vibration, humidity, and corrosion. To promote the service quality and efficiency in healthcare sector, BIWIN provides highly reliable and secure storage solutions for the rapid and safe access of medical imaging and patient data, facilitating personalized treatment plans and big data analysis in clinical research.　　Digitalized R&D and Production Systems for High Efficiency and Flexibility　　BIWIN has established a comprehensive development system for semiconductor storage products, and much efforts have been exerted to realize the digitalized management across the entire process all the way from R&D design, and packaging/testing to production with the support of integrating advanced information technologies and management systems. By doing so, significant results have been achieved in enhancing market responsiveness and supply chain flexibility while ensuring robust quality control.　　To achieve efficient, consistent, and controllable R&D process management, BIWIN places a high emphasis on the construction of technical platforms. Continuous investments have been channeled into the development of platforms including chip design, chip simulation, firmware algorithm, automated testing, process realization, and equipment platforms, in order to ensure standardization, automation, and integration across key technical areas, providing efficient resource allocation and support for continuous innovation. Meanwhile, its intelligent interconnected operational system combining packaging, module manufacturing, and testing equipment, as well as the application of AGV robots, has contributed to achieving highly automated production with full traceability, ensuring every product meets strict quality standards.　　On this basis, BIWIN has, on one hand, developed customized systems to integrate sales, procurement, R&D, and production information, creating a comprehensive product lifecycle data management framework, enabling digitalization of product manufacturing and delivery. On the other hand, by automating the collection and analysis of production testing data, the company has built an intelligent manufacturing system that further optimizes its efficient service capabilities.　　In the future, BIWIN will continue to enhance its technical expertise and service capabilities while fostering deeper collaboration with various industries. By advancing the boundaries of storage technology and its applications, BIWIN aims to help enterprises achieve both efficiency and value in the wave of digital transformation.
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BIWIN SPEC TGS20x Industrial-Grade SSD: Built for Extreme Conditions with High Reliability
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BIWIN SPEC TGS20x Industrial-Grade SSD: Built for Extreme Conditions with High Reliability

　　Industrial equipment demands uninterrupted long-term operation while enduring extreme environmental conditions such as frequent vibrations, wide temperature and humidity variations, and unexpected power failures. These conditions impose stringent requirements on data processing reliability and durability to ensure continuous and stable system operation.　　BIWIN Spec has specifically designed the TGS20x and TGP20x series of wide-temperature industrial-grade SSDs to address these extreme environments. Compatible with SATA III, PCIe 3.0, and other interface standards, these solutions cover multiple form factors including 2.5", mSATA, and M.2 2280/2242, catering to diverse industrial scenarios. The TGS20x series SSDs have been widely adopted in industrial control, rail transit, data communications, and electric power sectors, providing highly reliable data storage support for various high-demand equipment.　　【Supporting Wide Temperature -40℃~85℃ to Ensure Stable Operation】　　Utilizes flash memory chips, controllers, and components that meet wide-temperature standards; supports operational temperatures from -40°C to 85°C and storage temperatures from -55°C to 95°C　　Rigorously tested with Mean Time Between Failures (MTBF) exceeding 3 million hours　　Enhanced through multiple firmware and hardware optimizations, including RAID, SRAM ECC, E2E, 4K LDPC, and power loss protection　　【Domestic Core Components with Customized Technical Support】　　Employs domestic NAND and controllers; leverages in-house firmware and hardware design with advanced packaging and testing; Achieves read/write speeds of up to 560MB/s and 510MB/s respectively; Supports capacities up to 2TB　　P/E cycles up to 3,000 times, featuring high durability　　Offers customized protective technologies including anti-sulfuration, protective coating, anddispensing reinforcement　　【5-Year Supply Cycle with Nationwide Efficient Service】　　Ensures high quality and consistency through fixed-BOM, automated production, rigorous testing, and comprehensive product lifecycle management　　Service centers located in major cities nationwide, including Beijing, Xi'an, Chengdu, Shanghai, Shenzhen, and Hangzhou, providingrapid response and FAE technical support
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