Exploring Infrared Sensors: Types, Applications, and Principle
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Exploring Infrared Sensors: Types, Applications, and Principle

　　In the realm of modern technology, infrared (IR) sensors stand out as versatile and essential components across a wide array of applications. These sensors leverage the infrared part of the electromagnetic spectrum to detect and measure infrared radiation, which can be indicative of heat, motion, and various other parameters. This article delves into the fundamentals of Infrared Sensors, and their diverse applications.　　What is an infrared sensor ?Infrared sensors detect radiation in the infrared spectrum, which ranges from about 750 nanometers (nm) to 1 millimeter (mm). Unlike visible light, infrared radiation is not visible to the human eye but can be felt as heat. IR sensors convert this radiation into an electrical signal that can be processed and interpreted by electronic systems.　　How many types of IR sensors are there?1. Active Infrared Sensors: These sensors emit their own infrared light and detect the reflected light. They are commonly used in proximity sensors and certain types of motion detectors. An example is the IR LED and photodiode pair, which measures changes in the reflected light to determine the presence of objects.　　2. Passive Infrared Sensors (PIR): Unlike active sensors, PIR sensors do not emit any radiation. Instead, they detect the infrared radiation naturally emitted by objects. PIR sensors are widely used in motion detection applications, such as security systems and automatic lighting.　　What is the purpose of the IR sensor?IR sensors serve various purposes across multiple applications. Here are some common uses:　　1. Proximity Detection　　– Used in devices like automatic doors, smartphones, and vehicles to detect nearby objects without physical contact.　　2. Motion Detection　　– Common in security systems and alarms (e.g., PIR sensors) to sense movement in a defined area.　　3. Temperature Measurement　　– Employed in non-contact thermometers to measure the temperature of objects or bodies from a distance.　　4. Remote Controls　　– Found in TVs, air conditioners, and other electronics to facilitate wireless communication with remote controls.　　5. Obstacle Avoidance　　– Used in robotics and drones to navigate and avoid collisions by detecting nearby objects.　　6. Gas Detection　　– Some IR sensors can detect specific gases based on their absorption of infrared light, useful in industrial applications.　　7. Night Vision and Thermal Imaging　　– Used in military, security, and surveillance applications to detect heat signatures in low-light conditions.　　8. Data Transmission　　– In certain applications, IR can be used for wireless data transfer over short distances.　　What is an infrared sensor used for?Infrared sensors have a broad range of applications, benefiting various industries from consumer electronics to healthcare. Here are some notable examples:　　1. Consumer Electronics:　　– Remote Controls: IR sensors are integral to remote control devices for televisions, air conditioners, and other home appliances. They receive signals from the remote control unit to perform the desired function.　　– Smartphones and Tablets: Some devices use IR sensors for facial recognition, which helps in unlocking screens and enhancing security.　　2. Healthcare:　　– Thermography: Infrared thermography is used for non-invasive temperature measurement, allowing for early detection of fevers and other medical conditions. It’s particularly valuable in monitoring patients’ health and in diagnosing conditions based on temperature anomalies.　　– Vital Sign Monitoring: IR sensors can be used in wearable devices to monitor vital signs such as heart rate and blood oxygen levels.　　3. Automotive Industry:　　– Collision Avoidance Systems: IR sensors help in detecting obstacles and monitoring the surrounding environment to prevent accidents. They are used in parking assist systems and adaptive cruise control.　　– Night Vision: Some high-end vehicles are equipped with IR sensors to enhance visibility during night driving by detecting pedestrians and animals on the road.　　4. Industrial Automation:　　– Temperature Measurement: In manufacturing processes, IR sensors are employed to monitor the temperature of machinery and products to ensure they remain within safe and optimal limits.　　– Quality Control: These sensors are used to inspect products for defects and irregularities by detecting variations in thermal emission.　　5. Environmental Monitoring:　　– Gas Detection: IR sensors can detect the presence and concentration of specific gases in the atmosphere by measuring their absorption of infrared light. This is crucial for monitoring air quality and ensuring safety in industrial environments.　　What is the principle of IR sensor?The principle of an infrared (IR) sensor is based on the detection and measurement of infrared radiation, which is electromagnetic radiation with wavelengths longer than visible light. The core principle involves capturing the infrared radiation emitted or reflected by objects and converting it into an electrical signal that can be analyzed. Here’s a detailed breakdown of how IR sensors work:　　1. Emission and Detection of Infrared Radiation　　Infrared Radiation Basics:　　– Infrared radiation is part of the electromagnetic spectrum with wavelengths ranging from approximately 750 nanometers (nm) to 1 millimeter (mm), just beyond the visible light spectrum.　　– All objects emit infrared radiation as a function of their temperature. Hotter objects emit more infrared radiation compared to cooler ones.　　Detection Principle:　　– Active IR Sensors: These sensors emit their own infrared light (often using an IR LED) and then measure the amount of this light that is reflected back from objects in their environment. The detected signal changes based on the distance, size, and properties of the object, allowing the sensor to infer its presence, distance, or other characteristics.　　– Passive IR Sensors (PIR): These sensors do not emit any radiation. Instead, they detect the infrared radiation naturally emitted by objects in their field of view. They typically use a sensor element that responds to changes in infrared radiation, such as a pyroelectric detector or a thermopile.　　2. Conversion of Infrared Radiation to Electrical Signal　　Pyroelectric Detectors:　　– Pyroelectric sensors contain materials that generate an electrical charge when exposed to infrared radiation. This charge is proportional to the amount of infrared radiation detected.　　– The sensor detects changes in temperature caused by infrared radiation, converting these changes into an electrical signal.　　Thermopiles:　　– A thermopile consists of multiple thermocouples connected in series or parallel. It measures the temperature difference between the heated element exposed to infrared radiation and a reference element.　　– This temperature difference generates a voltage, which is then measured and converted into an output signal.　　Photodetectors:　　– Some IR sensors use photodetectors (such as photodiodes or phototransistors) sensitive to infrared light. These detectors convert the incident infrared light into an electrical current proportional to the light intensity.　　3. Signal Processing　　Once the infrared radiation is converted into an electrical signal, the output is typically processed and analyzed by the sensor’s electronics. This may involve amplification, filtering, and digitization of the signal. The processed signal can then be used to trigger actions or provide readings depending on the application. For example:　　– In motion detectors, the sensor might trigger an alarm if it detects significant changes in infrared radiation indicating movement.　　– In temperature measurement systems, the signal is used to provide accurate temperature readings or to monitor thermal conditions.　　How do I choose an IR sensor?Choosing an infrared (IR) sensor depends on several factors related to your application. Here’s a quick guide to help you make the right choice:　　1. Type of IR Sensor　　– Active IR Sensors: Emit IR light and measure reflections (e.g., proximity sensors).　　– Passive IR Sensors: Detect IR radiation from objects (e.g., PIR sensors for motion detection).　　2. Detection Range　　– Consider the distance over which you need to detect objects. Check the specifications for range and field of view.　　3. Sensitivity　　– Look for specifications on sensitivity, which determines how small a change in IR radiation the sensor can detect.　　4. Environmental Conditions　　– Ensure the sensor can operate in the conditions it will face (temperature, humidity, dust, etc.).　　5. Response Time　　– Consider how quickly the sensor needs to respond. This is crucial for applications like motion detection.　　6. Output Type　　– Decide whether you need digital output (on/off) or analog output (variable signal) based on how you’ll process the sensor data.　　7. Power Consumption　　– Look for power-efficient models if you’re running on batteries or need to minimize energy use.　　8. Size and Form Factor　　– Ensure the physical size and mounting options fit your project requirements.　　9. Cost　　– Determine your budget, as prices can vary widely based on features and capabilities.　　10. Manufacturer Support　　– Choose brands or suppliers that provide good documentation and support.　　How far can IR sensors detect?The detection range of IR sensors can vary significantly based on the type of sensor and its design:　　1. Active IR Sensors　　– Proximity Sensors: Typically have a range of a few centimeters to a few meters (around 0.1 to 5 meters) depending on the sensor’s power and environment.　　– IR Range Finders: Can detect distances up to 10-20 meters or more, depending on the model and application.　　2. Passive IR Sensors (PIR)　　– Commonly used for motion detection in security systems, these sensors usually have a range of about 5 to 12 meters (16 to 40 feet). The actual range can be influenced by factors such as the angle of detection and the presence of obstacles.　　3. IR Cameras and Thermal Sensors　　– These devices can detect heat signatures at much greater distances, often exceeding 100 meters, depending on the resolution and the environment.　　Factors Influencing Range　　– Sensitivity: Higher sensitivity allows for detection at greater distances.　　– Environmental Conditions: Obstructions, temperature, and humidity can affect performance.　　– Field of View: A wider field of view may reduce the effective detection range.　　ConclusionInfrared sensors are indispensable components in modern technology, offering critical functionalities across various fields. From enhancing consumer electronics to advancing healthcare and industrial automation, their applications are both diverse and impactful. As technological advancements continue to push the boundaries of what is possible, IR sensors are poised to become even more integral to our everyday lives, driving innovations and efficiencies across multiple sectors. Understanding their technology and applications provides valuable insights into how these sensors are shaping the future of technology and industry.
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Release time：2025-03-21 13:17 reading：222 Continue reading>>
NOVOSENSE Achieves ISO 26262 ASIL D
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NOVOSENSE Achieves ISO 26262 ASIL D "Defined-Practiced" Certification, Reinforcing Automotive Safety Leadership

　　NOVOSENSE Microelectronics today announced it has earned the ISO 26262 ASIL D "Defined-Practiced" certification from TÜV Rheinland, a significant milestone validating the company's robust functional safety management system.　　This achievement confirms NOVOSENSE's successful implementation of functional safety practices in critical automotive applications, including ABS wheel speed sensors and isolated gate drivers. Moving from the "Managed" (system establishment) to the "Defined-Practiced" (system implementation) level signifies a major leap in NOVOSENSE's functional safety capabilities and underscores the maturity of its research and development (R&D) and quality management systems.　　Transitioning from Compliance to Real-World Application　　Since securing the ISO 26262 ASIL D "Managed" certification in December 2021, NOVOSENSE has focused on refining its R&D processes and strengthening its functional safety management. TÜV Rheinland's comprehensive audit assessed various aspects, including functional safety lifecycle management, safety culture, and R&D proficiency. The review specifically examined the practical application of these systems in NOVOSENSE's NSM41xx series wheel speed sensors and the NSI6911 isolated gate driver, confirming the company's systems meet the stringent "Defined-Practiced" standard.　　Key Product Highlights:　　• NSM41xx Series ABS Wheel Speed Sensors: These AMR-based sensors, designed to ISO 26262 ASIL B (D) standards, support ASIL D system-level functional safety. They offer precise wheel speed monitoring for critical systems like ABS, ESP, and EPS, ensuring reliability in demanding conditions. These are currently in mass production.　　• NSI6911 Isolated Gate Driver: Designed for new energy vehicle (NEV) main drives, this ASIL D-compliant driver features a 12-bit high-precision ADC, advanced diagnostics, and an SPI programmable interface. It provides robust driving and protection for SiC MOSFETs and IGBTs, ensuring NEV safety. Samples are now available.　　Commitment to Automotive Excellence　　Automotive applications remain a core focus for NOVOSENSE, driving the company to uphold its "Robust & Reliable" values. Building strong functional safety capabilities is a strategic priority, supported by a comprehensive ISO 26262:2018-compliant development process and a rigorous automotive-grade quality management system.　　As of 2024, NOVOSENSE has shipped over 500 million automotive chips, with automotive business representing more than 35% of its total revenue. Its products are trusted by leading NEV OEMs and Tier-1 suppliers.　　NOVOSENSE aims to be a preferred chip supplier in the global automotive supply chain. Through its strong R&D, reliable quality assurance, proven mass production, and flexible customization, NOVOSENSE delivers high-quality, high-reliability, and high-performance analog and mixed-signal chips, along with comprehensive system-level solutions.
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Release time：2025-03-20 09:57 reading：326 Continue reading>>
ROHM’s 2nd Generation MUS-IC™ Series Audio DAC Chip for Hi-Res Audio Playback with Exclusive HD Monaural Mode
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ROHM’s 2nd Generation MUS-IC™ Series Audio DAC Chip for Hi-Res Audio Playback with Exclusive HD Monaural Mode

　　ROHM has developed the 32-bit D/A converter IC (DAC chip) and evaluation board designed for flagship models in the MUS-IC™ series optimized for high-resolution audio playback.　　Engineered to maximally extract and accurately convert high-resolution sound data to analog, DAC chips are crucial for determining audio equipment quality. ROHM leverages over 50 years of expertise in audio IC development to establish superior sound quality design technology, offering products such as high-fidelity sound processors and high-quality audio power ICs.　　ROHM’s latest product builds on the 1st generation MUS-IC™ BD34301EKV audio DAC chip, renowned for its sound quality and widely adopted in high-end models from various companies. The BD34302EKV inherits the core design concept behind ROHM’s DAC chip — natural flat sound — and, by adding the three elements of spatial reverberation, quietness, and dynamic range from the MUS-IC™ series to authentically reproduce the “texture” of musical instruments for an even more realistic audio experience.　　By incorporating a new algorithm for Data Weighted Averaging (DWA), the BD34302EKV achieves a THD+N characteristic of -117dB (THD: -127dB), a key performance indicator that enhances sound quality by achieving a sound quality that conveys a realistic sense of texture. At the same time, the signal-to-noise ratio (SNR) of 130dB provides noise performance befitting a flagship DAC chip, while a sampling frequency of up to 1,536kHz allows customers to fully leverage the high-precision calculations of their digital signal processors (DSPs).　　In monaural mode, which allocates one DAC chip per channel, ROHM’s proprietary HD (High Definition) monaural mode contributes to smoother, more natural sound. As part of the MUS-IC™ series, uncompromising craftsmanship has been applied down to the smallest details. Based on years of expertise in sound quality design, the optimal bonding wire material for each terminal of the BD34302EKV was selected to accurately convey the natural “texture” of musical instruments. These features help create the ideal sound sought by high-end audio manufacturers.　　MUS-IC™ — ROHM’s Highest Grade Audio ICs        Created by combining the “sound quality design technology” with ROHM’s company mission of “Quality First”, “vertically integrated production system”, and “contribution to the musical culture”, MUS-IC™ (official name: ROHM Musical Device “MUS-IC™”) is an audio device brand that represents the ultimate IC solutions developed by ROHM’s team of experienced and dedicated engineers.　　For more information, please visit ROHM’s Musical Device “MUS-IC™” web page.　　https://micro.rohm.com/en/mus-ic/　　*MUS-IC™ is a trademark or registered trademark of ROHM Co., Ltd.　　Terminology        High Resolution Audio Source　　High-resolution audio sources, often called "hi-res audio," typically use a sampling frequency of 96kHz or higher and a bit depth of 24 bits or more. In comparison, standard CD-quality audio is played back at a 44.1kHz sampling frequency with 16-bit depth. This means hi-res audio provides significantly more data resolution and dynamic range than standard CD-quality audio, resulting in superior sound quality.　　DWA (Data Weighted Averaging)　　Technology that improves audio characteristics by balancing mismatches between elements when operating multiple switching components for analog conversion.　　THD+N (Total Harmonic Distortion + Noise)　　A key performance metric for audio equipment that measures the ratio of harmonics to the fundamental wave. Indicates how accurately the waveform is reproduced — the smaller the value the more faithful the reproduction.　　HD (High Definition) Monaural Mode　　ROHM’s proprietary digital signal processing technology that improves bit (amplitude) resolution. This allows for improvements in numerical performance while enhancing sound quality to deliver smooth audio that reveals the texture of musical instruments.
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Release time：2025-03-18 16:21 reading：272 Continue reading>>
ROHM’s New General-Purpose Chip Resistors Contribute to Greater Miniaturization
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ROHM’s New General-Purpose Chip Resistors Contribute to Greater Miniaturization

　　ROHM has expanded its portfolio of general-purpose chip resistors with the MCRx family. It is designed to achieve greater miniaturization and enhanced performance across a variety of applications. The new lineup includes the high-power MCRS series and low-resistance, high-power MCRL series.　　In today's era of advancing functionality and electrification, the increased miniaturization and improved performance of electronic components have become critical issues. This is especially evident in the automotive market, where the proliferation of electric vehicles (xEVs) is accelerating the use of electronic components. Similarly, the industrial equipment market is experiencing growing demand for compact, high performance electronic components as machinery becomes more functional and efficient. ROHM addresses both of these needs with the MCRx family of compact, high-performance resistors.　　The MCRS series improves rated power and TCR (Temperature Coefficient of Resistance) characteristics by optimizing the internal structure and incorporating new materials, enabling use in a smaller size compared to conventional products. A broad lineup in sizes ranging from 0402-size (0.04inch × 0.02inch) / 1005-size (1.0mm × 0.5mm) to 2512-size (0.25inch × 0.12inch) / 6432-size (6.4mm × 3.2mm) is available, making it possible to select the ideal product based on mounting space requirements. This leads to a compact, efficient circuit design, significantly increasing design flexibility. Meanwhile, the MCRL series, a low-resistance variant of the MCRS series, is offered in sizes ranging from 0805-size (0.08inch × 0.05inch) / 2012-size (2.0mm × 1.2mm) to 2512-size (0.25inch × 0.12inch) / 6432-size (6.4mm × 3.2mm) ideal for current detection applications.　　The MCRx family adopts a redesigned internal structure, improving production efficiency, quality, and product reliability across all sizes. Compliant with the AEC-Q200 automotive reliability standard, this series meets the increasing demand for electric vehicles (xEVs) while contributing to market expansion in communications infrastructure such as base stations and servers as well as factory automation equipment. In addition, the products are designated for long-term stable supply, supporting continuous use in long-life applications such as industrial equipment.　　The MCRS series will be expanded to include compact 0201-size (0.024inch × 0.012inch) / 0603-size (0.6mm × 0.3mm) products capable of withstanding temperatures up to +155°C. At the same time, the MCRE series will soon offer completely lead-free 01005-size (0.016inch × 0.008inch) / 0402-size (0.4mm × 0.2mm) products. These additions will allow ROHM to respond to the demand for further miniaturization while complying with environmentally-driven voluntary regulations and export restrictions.　　Going forward, ROHM is focused on developing and manufacturing products that cater to the diverse needs of customers worldwide. In particular, ROHM will continue to expand its lineup of resistors (its founding products) that improve miniaturization and reliability while ensuring long-term stable supply. By consistently delivering new value through technological innovation, ROHM seeks to solidify its market position and drive the evolution of electronic components.　　Application Examples        Suitable for a wide range of applications (excluding medical, military, aerospace, and nuclear control equipment)　　Automotive　　・Electric vehicles (xEVs): Battery Management Systems (BMS), powertrain control, Advanced Driver Assistance Systems (ADAS)　　・In-vehicle electronics: Engine Control Units (ECUs), infotainment systems, and more　　Industrial Equipment　　・Robotics: Control systems for industrial robots　　・Factory Automation (FA): Automated product line control systems　　・Power conversion equipment: Inverters, converters, and more　　Consumer Devices　　・Smart devices: Smartphones, tablets, wearables　　・Home appliances: TVs, refrigerators, washing machines　　Communication Equipment　　・Network equipment: Routers, switching hubs, communication equipment for data centers, etc.　　Online Sales Information        Sales Launch Date: October 2024　　The products will be offered at other online distributors as they become available.　　Products for Sale: MCR01S、MCR03S、MCR10S、MCR18S、MCR25S、MCR50S、MCR100S、MCR10L、MCR18L、MCR25L、MCR50L、MCR100L　　Additional resistance values will be added as needed.　　Resistance Value Search Page        Users can now search by series or resistance value and purchase samples on product pages.　　https://www.rohm.com/products/resistors　　Terminology        Temperature Coefficient of Resistance (TCR)　　An index of how much the resistance value changes with temperature. The lower the TCR, the less the resistance value fluctuates with temperature changes, resulting in more stable performance.　　AEC-Q200　　AEC stands for Automotive Electronics Council, a reliability standard for automotive electronic components established by major automotive manufacturers and US electronic component makers. Compliance with this standard by automotive components ensures reliable performance even under harsh environmental conditions. Q200 is a standard specifically intended for passive components such as resistors, capacitors, and inductors.　　xEV (Electric Vehicles)　　A collective term for vehicles primarily powered by electric motors, such as Hybrid Electric Vehicles (HEVs), Plug-in Hybrid Electric Vehicles (PHEVs), and Electric Vehicles (EVs).
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Release time：2025-03-12 10:22 reading：336 Continue reading>>
ROHM launches 650V GaN HEMT in a compact, high-heat dissipation TOLL package
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ROHM launches 650V GaN HEMT in a compact, high-heat dissipation TOLL package

　　ROHM has developed 650V GaN HEMTs in the TOLL (TO-LeadLess) package: the GNP2070TD-Z. Featuring a compact design with excellent heat dissipation, high current capacity, and superior switching performance, the TOLL package is increasingly being adopted in applications that require high power handling, particularly inside industrial equipment and automotive systems. For this launch, package manufacturing has been outsourced to ATX SEMICONDUCTOR (WEIHAI) CO., LTD. (hereinafter ATX), an experienced OSAT (Outsourced Semiconductor Assembly and Test) provider.　　Improving the efficiency of motors and power supplies, which account for most of the world’s electricity consumption, has become a significant challenge to achieving a decarbonized society. As power devices are key to improve efficiency, the adoption of new materials such as SiC (Silicon Carbide) and GaN is expected to further enhance the efficiency of power supplies.　　ROHM began mass production of its 1st generation of its 650V GaN HEMTs in April 2023, followed by the release of power stage ICs that combine a gate driver and 650V GaN HEMT in a single package. This time, ROHM has developed the product incorporating 2nd generation elements in a TOLL package, and added it to existing DFN8080 package to strengthen ROHM’s 650V GaN HEMT package lineup - meeting the market demand for even smaller and more efficient high-power applications.　　The new products integrate 2nd generation GaN-on-Si chips in a TOLL package, achieving industry-leading values in the device metric that correlates ON-resistance and output charge (RDS(ON) × Qoss). This contributes to further miniaturization and energy efficiency in power systems that require high voltage resistance and high-speed switching.　　To achieve mass production, ROHM leveraged proprietary technology and expertise in device design, cultivated through a vertically integrated production system, to carry out design and planning. Under the collaboration announced on December 10, 2024, front-end processes are carried out by Taiwan Semiconductor Manufacturing Company Limited (TSMC). Back-end processes are handled by ATX. On top, ROHM plans to partner with ATX to produce automotive-grade GaN devices.　　In response to the increasing adoption of GaN devices in the automotive sector, which is expected to accelerate in 2026, ROHM plans to ensure the rapid introduction of automotive-grade GaN devices by strengthening these partnerships in addition to advancing its own development efforts.　　Liao Hongchang, Director and General Manager, ATX SEMICONDUCTOR (WEIHAI) CO., LTD.　　“We are extremely pleased to have been entrusted with production by ROHM, a company renowned for its advanced manufacturing technologies and in-house production facilities that cover everything from wafer fabrication to packaging. We began technical exchanges with ROHM in 2017 and are currently exploring possibilities for deeper collaboration. This partnership was made possible due to ATX’s track record and technical expertise in the back-end manufacturing of GaN devices. Looking ahead, we also plan to collaborate on ROHM’s ongoing development of automotive-grade GaN devices. By strengthening our partnership, we aim to contribute to energy conservation across various industries and the realization of a sustainable society.”　　Satoshi Fujitani, General Manager, AP Production Headquarters, ROHM Co., Ltd.　　“We are delighted to have successfully produced 650V GaN HEMTs in the TOLL package, achieving sufficient performance. ROHM not only offers standalone GaN devices but also provides power solutions that combine them with ICs, leveraging ROHM’s expertise in analog technology. The knowledge and philosophy cultivated in the design of these products are also applied to device development. Collaborating with OSATs such as ATX, that possess advanced technical capabilities, allows us to stay ahead in the rapidly growing GaN market while utilizing ROHM’s strengths to bring innovative devices to market. Going forward, we will continue to enhance the performance of GaN devices to promote greater miniaturization and efficiency in a variety of applications, contributing to enrich people's lives.”　　EcoGaN™ Brand       Refers to ROHM’s new lineup of GaN devices that contribute to energy conservation and miniaturization by maximizing GaN characteristics to achieve lower application power consumption, smaller peripheral components, and simpler designs requiring fewer parts.　　EcoGaN™ is a trademark or registered trademark of ROHM Co., Ltd.　　Application Examples       Power supply for servers, communication base stations, industrial equipment and more.　　AC adapters (USB chargers), PV inverters, ESS (Energy Storage System).　　In a wide range of power supply systems with output power of 500W to 1kW class can be installed.　　Online Sales InformationSales Launch Date: December 2024　　Applicable Part No: GNP2070TD-ZTR　　The products will be available at DigiKey™, Mouser™ and Farnell™ from March, and will also be offered at other online distributors as they become available.　　Online Sales Information       Sales Launch Date: December 2024       Applicable Part No: GNP2070TD-ZTR　　　　About ATX SEMICONDUCTOR (WEIHAI) CO., Ltd.       ATX is an OSAT company based in Weihai, Shandong Province China, specializing in the assembly and testing of power devices. We support over 50 types of packages, including MOSFETs, IGBTs, SiC, and GaN devices, with an annual production capacity exceeding 5.7 billion units. ATX’s products are widely used in industrial equipment, automotive systems, renewable energy applications such as solar power, and consumer electronics. Notably, we hold a strong market share in the electric vehicle control sector, supplying internationally recognized brands.　　As a leading company in next-generation semiconductor device development utilizing proprietary intellectual properties and core technologies, ATX has established close, long-term collaborative relationships with the world’s top 10 power device companies.　　For more information, please visit ATX’s website: http://www.atxwh.com/　　Terminology       GaN HEMT　　GaN (Gallium Nitride) is a compound semiconductor material used in next-generation power devices. It is gaining adoption for its superior properties (over silicon), including exceptional high-frequency characteristics. HEMT stands for High Electron Mobility Transistor.　　RDS(ON) × Qoss　　An index for evaluating device performance, where Qoss represents the total output-side amount of charge between the drain and source. RDS(ON) refers to the on-state resistance between the Drain and Source of a MOSFET. The smaller RDS(ON) is, the lower the (power) loss during operation. Minimizing the product of these two leads to more efficient the switching operation and reduced switching losses.
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Release time：2025-03-11 09:14 reading：343 Continue reading>>
NOVOSENSE Launches NS<span style='color:red'>IP</span>3266 Full-Bridge Transformer Driver with Integrated Crystal Oscillator, Simplifying Isolated Driver Power Supply Design
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NOVOSENSE Launches NSIP3266 Full-Bridge Transformer Driver with Integrated Crystal Oscillator, Simplifying Isolated Driver Power Supply Design

　　NOVOSENSE today announced the launch of the NSIP3266 full-bridge transformer driver with integrated crystal oscillator, multiple protection functions and soft start support, which can be widely used in isolated driver power supply circuits in automotive on-board chargers (OBCs), traction inverters and charging piles, photovoltaic power generation and energy storage, server power supply and other systems. NSIP3266 supports a full-bridge topology with a wide range of inputs, and with clever pin and function design, it greatly simplifies the design of isolated driver’s power supply circuits, facilitating system manufacturers to optimize system circuits and shorten product time to market.　　Currently, isolated driver's power supply in high-voltage systems is available in three architectural forms: centralized, fully distributed, and semi-distributed. Centralized architecture has only one stage of power supply, and the auxiliary power input voltage has a wide input range, requiring closed-loop operation. At the same time, the transformer design is complicated, and especially when a single low-cost isolated power supply is used, there are problems of multi-output load regulation and long wiring, which increase the difficulty of system design and debugging.　　Fully distributed architecture uses independent isolated power modules to supply power to isolated drivers. The advantage is that 1-to-1 power supply and targeted protection can be achieved for isolated drivers, but a corresponding number of isolated power modules need to be configured, and the system cost is high.　　Semi-distributed architecture adopts a balanced strategy. Through a two-stage auxiliary power architecture, the first stage uses devices with a wide input voltage range to generate regulated rails, and the second stage can be a compact open-loop form using other devices to provide isolated power supply for isolated drives. Semi-distributed architecture is gaining popularity among engineers because of its simplicity in design and balance of system cost, performance, and protection requirements.　　Simplified circuit design with full-bridge topology　　NOVOSENSE's NSIP3266 full-bridge transformer driver is designed for semi-distributed architecture with isolated driver power supply. Common topology options for semi-distributed architecture include push-pull, LLC, and full-bridge. NSIP3266 adopts full-bridge topology. Compared with other solutions, the principle of full-bridge topology is simple, the transformer structure does not require a center tap, the working principle does not involve the design and selection of external L and C, and the peripheral BOM is often minimal. At the same time, the full-bridge topology is more tolerant to transformer design, including leakage inductance and parasitics, which saves engineers' efforts in system design and debugging.　　Ingenious design releases MCU resources　　It is worth mentioning that NSIP3266, through the internal integrated crystal oscillator circuit and RT pin design, allows engineers to complete the switching frequency configuration with only external resistors, achieving decoupling of MCU control and more flexible layout. At the same time, it can still provide safe power supply when the MCU fails, promoting higher system safety. In addition, the built-in soft-start function of NSIP3266 also eliminates the need for MCU control. While not requiring MCU domain routing, it saves secondary-side current limiting resistors, greatly simplifying board design and improving architectural flexibility.　　Wide voltage input and comprehensive protection　　NSIP3266 supports a wide operating voltage range of 6.5V~26V. No additional TVS protection tube is required in the system circuit, allowing engineers to choose the pre-stage power supply more flexibly. In addition, NSIP3266 provides multiple protection functions, including undervoltage protection, overcurrent protection, over-temperature protection, etc. The comprehensive protection functions enable engineers to focus on the optimization and innovation of the core system functions, and to design the system quickly and efficiently to meet the reliability requirements.　　Packaging and selections　　NSIP3266 is available in EP-MSOP8 package (3.0 x 3.0mm x 0.65mm, with thermal pad). The industrial version, NSIP3266-D, and the automotive version, NSIP3266-Q1, which meets the requirements of AEC-Q100, will be mass-produced in the first half of 2025. Please contact NOVOSENSE's sales team (sales@novosns.com) for product details or to request samples.　　Rich isolation products meet diverse needs　　With its expertise and leadership in isolation technology, NOVOSENSE provides a series of isolation and "isolation+" products covering digital isolators, isolated sampling, isolated interfaces, isolated power supply, and isolated drivers. NSIP3266 is a new addition to NOVOSENSE's isolated power supply family. NOVOSENSE also offers a selection of other cost-effective and high-performance, high-integration options, including: the NSIP605x series of push-pull transformer drivers; the NSIP88/89xx and NIRSP31x series with integrated transformers and multi-channel digital isolators; the NSIP83086 isolated RS485 transceiver and the NSIP1042 isolated CAN transceiver with integrated transformers and isolated interfaces. NOVOSENSE's comprehensive "isolation+" product portfolio can meet the diverse system design needs of various types of customers and provide one-stop chip solutions for them.
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Release time：2025-02-19 09:59 reading：680 Continue reading>>
ROHM’s PMICs for SoCs have been Adopted in Reference Designs for Telechips’ Next-Generation Cockpits
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ROHM’s PMICs for SoCs have been Adopted in Reference Designs for Telechips’ Next-Generation Cockpits

　　ROHM has announced the adoption of its PMICs in power reference designs focused on the next-generation cockpit SoCs ‘Dolphin3’ (REF67003) and ‘Dolphin5’ (REF67005) by Telechips, a major fabless semiconductor manufacturer for automotive applications headquartered in Pangyo, South Korea. Intended for use inside the cockpits of European automakers, these designs are scheduled for mass production in 2025.　　ROHM and Telechips have been engaged in technical exchanges since 2021, fostering a close collaborative relationship from the early stages of SoC chip design. As a first step in achieving this goal, ROHM’s power supply solutions have been integrated into Telechips’ power supply reference designs. These solutions support diverse model development by combining sub-PMICs and DrMOS with the main PMIC for SoCs.　　For infotainment applications, the Dolphin3 application processor (AP) power reference design includes the BD96801Qxx-C main PMIC for SoCs. Similarly, the Dolphin5 AP power reference design developed for next-generation digital cockpits combines the BD96805Qxx-C and BD96811Fxx-C main PMICs for SoC with the BD96806Qxx-C sub-PMIC for SoC, improving overall system efficiency and reliability.　　Modern cockpits are equipped with multiple displays, such as instrument clusters and infotainment systems, with each automotive application becoming increasingly multifunctional. As the processing power required for automotive SoCs increases, power ICs like PMICs must be able to support high currents while maintaining high efficiency. At the same time, manufacturers require flexible solutions that can accommodate different vehicle types and model variations with minimal circuit modifications. ROHM SoC PMICs address these challenges with high efficiency operation and internal memory (One Time Programmable ROM) that allows for custom output voltage settings and sequence control, enabling compatibility with large currents when paired with a sub-PMIC or DrMOS.　　Moonsoo Kim,　　Senior Vice President and Head of System Semiconductor R&D Center, Telechips Inc.“Telechips offers reference designs and core technologies centered around automotive SoCs for next-generation ADAS and cockpit applications. We are pleased to have developed a power reference design that supports the advanced features and larger displays found in next-generation cockpits by utilizing power solutions from ROHM, a global semiconductor manufacturer. Leveraging ROHM’s power supply solutions allows these reference designs to achieve advanced functionality while maintaining low power consumption. ROHM power solutions are highly scalable, so we look forward to future model expansions and continued collaboration.”　　Sumihiro Takashima,　　Corporate Officer and Director of the LSI Business Unit, ROHM Co., Ltd.“We are pleased that our power reference designs have been adopted by Telechips, a company with a strong track record in automotive SoCs. As ADAS continues to evolve and cockpits become more multifunctional, power supply ICs must handle larger currents while minimizing current consumption. ROHM SoC PMICs meet the high current demands of next-generation cockpits by adding a DrMOS or sub-PMIC in the stage after the main PMIC. This setup achieves high efficiency operation that contributes to lower power consumption. Going forward, ROHM will continue our partnership with Telechips to deepen our understanding of next-generation cockpits and ADAS, driving further evolution in the automotive sector through rapid product development.”　　・ Telechips SoC [Dolphin Series]　　The Dolphin series consists of automotive SoCs tailored to In-Vehicle Infotainment (IVI), Advanced Driver Assistance Systems (ADAS), and Autonomous Driving (AD) applications. Dolphin3 supports up to four displays and eight in-vehicle cameras, while Dolphin5 enables up to five displays and eight cameras, making highly suited as SoCs for increasingly multifunctional next-generation cockpits. Telechips is focused on expanding the Dolphin series of APs (Application Processors) for car infotainment, with models like Dolphin+, Dolphin3, and Dolphin5, by leveraging its globally recognized technical expertise cultivated over many years.　　・ ROHM 's Reference Design Page　　Details of ROHM’s reference designs and information on equipped products are available on ROHM’s website, along with reference boards. Please contact a sales representative or visit ROHM’s website for more information.　　https://www.rohm.com/contactus　　■ Power Supply Reference Design [REF67003] (equipped with Dolphin3)　　Reference Board No. REF67003-EVK-001　　https://www.rohm.com/reference-designs/ref67003　　■ Power Supply Reference Design [REF67005] (equipped with Dolphin5)　　Reference Board No. REF67005-EVK-001　　https://www.rohm.com/reference-designs/ref67005　　About Telechips Inc.Telechips is a fabless company specialized in designing system semiconductors that serve as the “brains” of automotive electronic components. The South Korean firm offers reliable, high-performance automotive SoCs. In response to the industry’s transition toward SDVs (Software Defined Vehicles), Telechips is broadening its core portfolio beyond car infotainment application processors (APs) to include MCUs, ADAS, network solutions, and AI accelerators.　　As a global, comprehensive automotive semiconductor manufacturer, Telechips adheres to international standards such as ISO 26262, TISAX, and ASPICE, leveraging both hardware and software expertise for future mobility ecosystems, including not only automotive smart cockpits, but also E/E architectures. What’s more, Telechips provides optimal solutions for In-Vehicle Infotainment systems (IVI), digital clusters, and ADAS, all compliant with key automotive standards (AEC-Q100, ISO 26262). Telechips has established business relationships with major automakers both domestically and internationally, supported by a strong track record of shipments.　　One flagship product is the Dolphin5 automotive SoC that integrates an Arm®-based CPU, GPU, and NPU to meet high-performance requirements. As a fabless company, Telechips outsources the manufacturing of its SoCs to Samsung Electronics’ foundry, delivering high-quality semiconductor products to domestic and overseas manufacturers. For more information, please visit Telechips’ website:　　https://www.telechips.com/　　*Arm® is a trademark or registered trademark of Arm Limited.　　TerminologyPMIC (Power Management IC)　　An IC that contains multiple power supply systems and functions for power management and sequence control on a single chip. It is becoming more commonplace in applications with multiple power supply systems in both the automotive and consumer sectors by significantly reducing space and development load vs conventional circuit configurations using individual components (i.e. DC-DC converter ICs, LDOs, discretes).　　SoC (System-on-a-Chip)　　A type of integrated circuit that incorporates a CPU (Central Processing Unit), memory, interface, and other elements on a single substrate. Widely used in automotive, consumer, and industrial applications due to its high processing capacity, power efficiency, and space savings.　　AP (Application Processor)　　Responsible for processing applications and software in devices such as smartphones, tablets, and automotive infotainment systems. It includes components such as a CPU, GPU, and memory controller to efficiently run the Operating System (OS), process multimedia, and render graphics.　　DrMOS (Doctor MOS)　　A module that integrates a MOSFET and gate driver IC. The simple configuration is expected to reduce design person-hours along with mounting area and to achieve efficient power conversion. At the same time, the built-in gate driver ensures high reliability by stabilizing MOSFET drive.
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Release time：2024-12-20 13:56 reading：723 Continue reading>>
Renesas Introduces Industry’s First Complete Memory Interface Chipset Solutions for Second-Generation DDR5 Server MRDIMMs
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Renesas Introduces Industry’s First Complete Memory Interface Chipset Solutions for Second-Generation DDR5 Server MRDIMMs

　　Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that it has delivered the industry’s first complete memory interface chipset solutions for the second-generation DDR5 Multi-Capacity Rank Dual In-Line Memory Modules (MRDIMMs).　　The new DDR5 MRDIMMs are needed to keep pace with the ever-increasing memory bandwidth demands of Artificial Intelligence (AI), High-Performance Compute (HPC) and other data center applications. They deliver operating speeds up to 12,800 Mega Transfers Per Second (MT/s), a 1.35x improvement in memory bandwidth over first-generation solutions. Renesas has been instrumental in the design, development and deployment of the new MRDIMMs, collaborating with industry leaders including CPU and memory providers, along with end customers.　　Renesas has designed and executed three new critical components: the RRG50120 second-generation Multiplexed Registered Clock Driver (MRCD), the RRG51020 second-generation Multiplexed Data Buffer (MDB), and the RRG53220 second-generation Power Management Integrated Circuit (PMIC). Renesas also offers temperature sensor (TS), and serial presence detect (SPD) hub solutions in mass production, making it the only memory interface company that offers the complete chipset solutions for industry standard next-generation MRDIMMs as well as all other server and client DIMMs.　　“The demand for higher performance systems driven by AI and HPC applications is relentless,” said Davin Lee, Senior Vice President and General Manager of Analog & Connectivity and Embedded Processing. “Renesas is at the forefront of this trend, working with industry leaders to develop next-generation technology and specifications. These companies depend on Renesas to deliver the technical know-how and the production capabilities they require to meet unprecedented demand. Our latest chipset solutions for second-generation DDR5 MRDIMMs showcase our leadership in this market.”　　Renesas’ RRG50120 second-generation MRCD is used on the MRDIMMs to buffer the Command/Address (CA) bus, chip selects and the clocks between the host controller and DRAMs. It consumes 45% less power compared to the first-generation device, a critical specification for heat management in very high-speed systems. The RRG51020 Gen2 MDB is the other key device used in the MRDIMMs to buffer data from the host CPU to DRAMs. Both the new Renesas MRCD and MDB support speeds up to 12.8 Gigabytes per Second (GB/s). Additionally, Renesas’ RRG53220 next-generation PMIC offers best-in-class electrical-over-stress protection and superior power efficiency and is optimized for high-current and low-voltage operation.　　Availability　　Renesas is sampling the RRG50120 MRCD, the RRG51020 MDB, and the RRG53220 PMIC now, and expects the new products to be available for production in the first half of 2025. More information on these new products is available at www.renesas.com/DDR5.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at renesas.com. Follow us on LinkedIn, Facebook, X, YouTube, and Instagram.　　(Remarks) Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries. All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.　　The content in the press release, including, but not limited to, product prices and specifications, is based on the information as of the date indicated on the document, but may be subject to change without prior notice.
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Release time：2024-12-03 14:43 reading：635 Continue reading>>
ROHM's 4th Generation SiC MOSFET Bare Chips Adopted in Three EV Models of ZEEKR from Geely
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ROHM's 4th Generation SiC MOSFET Bare Chips Adopted in Three EV Models of ZEEKR from Geely

　　ROHM has announced the adoption of power modules equipped with 4th generation SiC MOSFET bare chips for the traction inverters in three models of ZEEKR EV brand from Zhejiang Geely Holding Group (Geely), a top 10 global automaker. Since 2023, these power modules have been mass produced and shipped from HAIMOSIC (SHANGHAI) Co., Ltd. - a joint venture between ROHM and Zhenghai Group Co., Ltd. to Viridi E-Mobility Technology (Ningbo) Co., Ltd, a Tier 1 manufacturer under Geely.　　Geely and ROHM have been collaborating since 2018, beginning with technical exchanges, then later forming a strategic partnership focused on SiC power devices in 2021. This led to the integration of ROHM’s SiC MOSFETs into the traction inverters of three models: the ZEEKR X, 009, and 001. In each of these EVs, ROHM’s power solutions centered on SiC MOSFETs play a key role in extending the cruising range and enhancing overall performance.　　ROHM is committed to advancing SiC technology, with plans to launch 5th generation SiC MOSFETs in 2025 while accelerating market introduction of 6th and 7th generation devices. What’s more, by offering SiC in various forms, including bare chips, discrete components, and modules, ROHM is able to promote the widespread adoption of SiC technology, contributing to the creation of a sustainable society.　　ZEEKR Models Equipped with ROHM’s EcoSiC™The ZEEKR X, which features a maximum output exceeding 300kW and cruising range of more than 400km despite being a compact SUV, is attracting attention even outside of China due to its exceptional cost performance. The 009 minivan features an intelligent cockpit and large 140kWh battery, achieving an outstanding maximum cruising range of 822km. And for those looking for superior performance, the flagship model, 001, offers a maximum output of over 400kW from dual motors with a range of over 580km along with a four-wheel independent control system.　　About ZEEKRZEEKR was launched in 2021 as the dedicated EV brand of Geely, a leading Chinese automaker that also owns well-established premium brands such as Volvo Cars and Lotus Cars. The name ZEEKR combines ZE, representing ZERO, the starting point of infinite possibilities, E for innovation in the electric era, and KR, the chemical symbol for krypton, a rare gas that emits light when energized. ZEEKR’s philosophy centers on harmonizing humanity, technology, and nature, aiming to redefine the perception of electric vehicles through innovative designs and technologies. The brand has garnered praise in markets outside of China, including in the US and Europe, for its impressive driving performance and range, with plans to expand sales to Western and Northern Europe.　　Please visit ZEEKR's website for more information: https://zeekrglobal.com/　　Market Background and ROHM’s EcoSiC™In recent years, there has been a push to develop more compact, efficient, lightweight electric systems to expand the adoption of next-generation electric vehicles (xEVs) and achieve environmental goals such as carbon neutrality. For electric vehicles in particular, improving the efficiency of the traction inverter, a key element of the drive system, is crucial for extending the cruising range and reducing the size of the onboard battery, heightening expectations for SiC power devices.　　As the world’s first supplier to begin mass production of SiC MOSFETs in 2010, ROHM continues to lead the industry in SiC device technology development. These devices are now marketed under the EcoSiC™ brand, encompassing a comprehensive lineup that includes bare chips, discrete components, and modules. For more information, please visit the SiC page on ROHM’s website: https://www.rohm.com/products/sic-power-devices 　　EcoSiC™ BrandEcoSiC™ is a brand of devices that utilize silicon carbide (SiC), which is attracting attention in the power device field for performance that surpasses silicon (Si). ROHM independently develops technologies essential for the evolution of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, we have established an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.　　EcoSiC™ is a trademark or registered trademark of ROHM Co., Ltd.　　Supporting InformationROHM is committed to providing application-level support, including the use of in-house motor testing equipment Additionally, by clicking on the URL below, users can access various supporting contents on ROHM’s website that facilitate the evaluation and introduction of 4th generation SiC MOSFETs, such as SPICE and other design models, simulation circuits for common applications (ROHM Solution Simulator), and evaluation board information.　　https://www.rohm.com/products/sic-power-devices/sic-mosfet#supportInfo
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Release time：2024-09-03 10:42 reading：650 Continue reading>>
Power Module : Working Principle, Structural Features, and Process
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Power Module : Working Principle, Structural Features, and Process

　　A power module is an electronic device used to convert one form of electrical energy into another for supply to specific electronic systems or devices. It typically comprises an input terminal for receiving the raw power source (such as AC or DC) and one or more output terminals for providing converted and regulated electrical energy. This article summarizes the working principle, structural features, process flow, selection parameters, and design considerations of power modules.　　Working Principle of Power ModuleThe working principle of a power module is based on power electronics technology and control circuitry. Its core consists of switching power devices and control circuits. The following are detailed operational steps of power module operation:　　1. Input Voltage Conversion　　The power module first receives input voltage from the power line, typically AC.　　Next, through rectification circuitry using diodes or bridge rectifiers, AC is converted into pulsating DC.　　Subsequently, filtering circuits utilize capacitors to remove the pulsation, resulting in stable DC.　　2. Output Voltage Regulation　　The converted DC enters a voltage regulation circuit for voltage regulation.　　The voltage regulation circuit operates using feedback control. Specifically, it compares the difference between the output voltage and a reference voltage and controls the regulator’s operation based on this difference.　　Through this regulation, the output voltage is maintained at the set stable value.　　3. Role of Switching Power Devices　　During the power conversion process of the power module, switching power devices (such as MOSFETs, BJTs, IGBTs, etc.) play a crucial role.　　When the switching device is conducting, the power module can convert input energy into output energy. The primary function of the switching device is to achieve intermittent energy conversion to provide the required stable voltage or current.　　When the switching device receives an input or control signal, it generates corresponding switch signals to control its state.　　4. Role of Control Circuits　　Control circuits are another important component of the power module responsible for precise regulation and stabilization.　　Feedback circuits monitor changes in output voltage or current and send feedback signals to comparators. This allows the power module to adjust output energy promptly based on the feedback signal to meet various circuit requirements.　　5. Protection Mechanisms　　Power modules typically feature various protection mechanisms such as overload protection, overvoltage protection, and short circuit protection.　　Overload protection monitors the output current and limits or cuts off the output when the current exceeds a set value.　　Overvoltage protection monitors the output voltage and automatically cuts off the output power when the voltage exceeds a set value.　　Short circuit protection similarly operates by monitoring the output current. When a short circuit is detected, it promptly cuts off the power to prevent damage.　　Structural Features of Power ModuleThe structural features of power modules are summarized as follows:　　1. Modular Design　　Power modules typically employ modular design, making the entire power system more compact and efficient. Each module has independent functionality, allowing for flexible combinations and extensions based on actual needs. This facilitates users in customizing power solutions according to specific application scenarios.　　2. High Integration　　Power modules integrate numerous electronic components and circuits internally, such as transformers, rectifiers, and filters. The optimized design of these components and circuits endows the power module with high efficiency and stability.　　3. High Reliability　　Power modules undergo rigorous production processes and quality control, resulting in high reliability. Additionally, internal redundancy design and protection circuits effectively prevent damage to the system due to abnormal conditions such as power fluctuations, overcurrent, and overvoltage.　　4. Ease of Maintenance　　Due to the modular design of power modules, when a fault occurs, users can conveniently replace the faulty module, thereby reducing maintenance costs and time. Furthermore, the modular structure facilitates upgrades and modifications to the power system.　　Process Flow of Power ModuleThe production process of power modules involves multiple steps, from material preparation to final testing and quality inspection, with each step being crucial. Below is a simplified description of the operation process of power module production:　　1. Material Preparation and Bill of Materials (BOM) Verification　　Based on the design drawings of the power module and the BOM (Bill of Materials) list, prepare the required components, PCB boards, connecting wires, insulation materials, etc.　　Check the quantity, model, and specifications of the materials to ensure accuracy.　　2. PCB Board Processing and Component Soldering　　Clean and dry the PCB board to remove surface stains and moisture.　　According to the design drawings, solder the components onto the PCB board. Pay attention to soldering temperature and time control to avoid solder joints or poor soldering.　　3. Power Circuit Connection and Insulation Processing　　Based on the circuit diagram of the power module, connect the power input and output lines.　　Insulate exposed wires and connection points to ensure safety.　　4. Functional Testing and Performance Debugging　　Conduct functional testing on the power module to check if input and output voltage and current are normal.　　Based on the test results, perform performance debugging to optimize the efficiency of the power module.　　5. Overall Assembly and Enclosure Installation　　Assemble the soldered PCB board, connecting wires, and other components into a complete power module.　　Install the enclosure of the power module to ensure reliable fastening.　　6. Final Testing and Quality Inspection　　Conduct final testing on the assembled power module, including voltage stability, ripple coefficient, load capacity, and other indicators.　　According to quality inspection standards, screen and classify the power modules to ensure product quality.　　7. Packaging and Warehouse Entry　　Package the qualified power modules, indicating model, specifications, quantity, etc.　　Store the packaged power modules in the warehouse, awaiting shipment or subsequent use.　　Selection Parameters of Power ModuleDuring the process of selecting power modules, it is essential to consider a series of key parameters to ensure that the chosen power module can meet specific application requirements. Below is a detailed consideration of these parameters:　　1. Input Voltage Range　　Firstly, it is necessary to determine the input voltage range of the power module, i.e., the range within which it can operate normally. This depends on the power supply situation in the application, such as battery-powered or AC grid-powered. Ensure that the selected module can adapt to the existing input voltage and maintain stability during voltage fluctuations.　　2. Output Voltage and Current　　The output voltage and current of the power module are critical parameters to meet load requirements. Depending on the power consumption and characteristics of the load, choose appropriate output voltage and current levels. Also, consider whether the current output capacity of the power module is sufficient to handle the startup impact of the load and the current requirements during normal operation.　　3. Efficiency and Power Consumption　　Efficiency is the ability of the power module to convert electrical energy, i.e., the ratio of output power to input power. High efficiency means less energy loss and lower heat generation. Additionally, pay attention to the module’s power consumption, especially during standby or light load, to optimize energy use.　　4. Ripple and Noise　　Ripple refers to the AC component in the output voltage, while noise is the interference signal generated by the power module. These parameters are crucial for sensitive applications such as signal processing or measurement equipment. Therefore, when selecting, ensure that the ripple and noise levels of the selected module are below the system’s acceptable threshold.　　5. Temperature Range　　The operating temperature range of the power module is also a factor to consider. In extreme temperature environments, the performance and reliability of the module may be affected. Therefore, choose a module that can operate stably within the temperature range of the application.　　6. Reliability and Lifespan　　The reliability and expected lifespan of the power module are important indicators for assessing its long-term performance. When choosing, consider the module’s MTBF (Mean Time Between Failures) and the manufacturer’s provided warranty period.　　7. Size and Packaging　　The size and packaging of the power module are also factors to consider during the selection process. Ensure that the selected module can fit within the space constraints of the application and is easy to integrate into existing systems.　　8. Certification and Compliance　　The selected power module should comply with relevant safety standards and regulatory requirements, such as UL, CE, etc. This helps ensure the safety and compliance of the power module.　　9. Cost　　Last but equally important is cost consideration. While meeting all performance requirements, strive to choose a cost-effective power module to optimize the overall cost-effectiveness of the system.　　During the design and use of power modules, the following operational issues should be noted:I. Design Phase Considerations1. Clarify Requirements and Specifications　　Before designing the power module, clarify the system’s requirements for power, including voltage, current, power, efficiency, and other specifications.　　Fully consider the working environment of the module, such as temperature, humidity, vibration, and other factors that may affect the performance of the power supply.　　2. Select Appropriate Topology　　Choose the appropriate power supply topology according to the requirements, such as linear power supply, switching power supply, etc., to achieve high efficiency, stability, and reliability.　　3. Optimize Circuit Layout and Wiring　　Reasonably layout circuit components to reduce interference and losses.　　Adopt the principle of wide and short wiring to reduce resistance and inductance, thereby improving power supply efficiency.　　4. Redundancy and Protection Design　　Consider redundancy design for the power module to improve system reliability and stability.　　Design overvoltage, overcurrent, overheating, and other protection measures to prevent module damage or safety accidents.　　5. Electromagnetic Compatibility (EMC) Design　　Consider the electromagnetic compatibility of the power module and use filtering, shielding, and other technologies to reduce interference with other devices.　　II. Considerations During Use1. Proper Installation and Connection　　Follow the manufacturer’s installation guide to ensure the power module is installed correctly and securely fixed.　　Carefully inspect the connections of input and output terminals to ensure good contact, no looseness, or short circuits.　　2. Adjust Parameters Reasonably　　According to actual needs, set the voltage, current, and other parameters of the power module reasonably to avoid overloading or underloading.　　Regularly check parameter settings to ensure consistency with actual requirements.　　3. Monitoring and Maintenance　　Regularly conduct status checks on the power module, including monitoring parameters such as voltage, current, and temperature.　　If any abnormal conditions are detected, take timely measures to address them, such as cleaning dust or replacing damaged components.　　4. Heat Dissipation and Working Environment　　Pay attention to the impact of electromagnetic interference and mechanical vibration in the working environment on the power module and take corresponding measures for protection.　　5. Training and Operational Standards　　Provide training for personnel using the power module to ensure they understand the working principle, operation methods, and safety precautions of the module.　　Establish operational standards to ensure that personnel operate in accordance with the standards, avoiding problems caused by improper operation.
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Release time：2024-08-22 13:33 reading：481 Continue reading>>

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