ROHM’s Three-Phase Brushless DC Motor Gate Driver Achieving FET Heat Reduction wh<span style='color:red'>ile</span> Suppressing EMI
  ROHM has developed the “BD67871MWV-Z” three-phase brushless DC motor gate driver for medium voltage applications (12 to 48V systems). By incorporating ROHM’s proprietary gate drive technology TriC3™, it greatly reduces FET’s switching loss while maintaining low EMI – traditionally a trade-off in motor driver ICs.  Motors account for approximately 60% of global electricity consumption, making control technology which affects energy efficiency, increasingly critical. In 12V to 48V motor drive applications, a simple configuration where an MCU controls three gate drivers has been the mainstream. However, in recent years, demands for high efficiency and precise control have grown, accelerating the adoption of solutions combining an MCU with an integrated three-phase motor driver. Further, a technical challenge in three-phase motor drivers has been the trade-off between “power consumption reduction” and “noise / EMI (electro-magnetic interference) reduction,”.  BD67871MWV-Z features ROHM's proprietary Active Gate Drive technology “TriC3™”, which rapidly senses voltage information from the external power FETs and adjust gate drive current accordingly in real-time. This greatly reduces FETs’ switching loss (and hence heat generation) FET power consumption during switching while simultaneously suppressing ringing to achieve low EMI.  Compared to ROHM's conventional constant-current drive products, TriC3™ gate drive has been demonstrated in actual motors that FET heat generation by approximately 35% while maintaining equivalent EMI levels. Furthermore, BD67871MWV-Z adopts UQFN28 package and pin layout which are commonly used in motor driver ICs for medium-voltage industrial equipment applications, contributing to reduced engineering effort required in circuit modifications and new designs.  Mass production of the new product commenced in September 2025 (sample price: $5.5/unit, tax excluded).  ROHM also offer general-purpose motor drivers (BD67870MWV-Z, BD67872MWV-Z) with the same package and pin configuration as the new product, designed for constant-voltage drive. From general-purpose types to the value-added types featuring the new TriC3™, we offer a comprehensive product lineup to supports a wide variety of applications and use cases. We are committed to contributing to improved motor efficiency, enhanced application functionality, and reduced power consumption.  Application Examples  •Industrial Equipment: Various motors such as electric drills/drivers and industrial fans  •Consumer Appliances: Various motors used in vacuum cleaners, air purifiers, air conditioners, ventilation fans and E-bikes (electric-assist sports bicycles)  TriC3™  A multi-step constant current drive technology developed by ROHM. By controlling gate current in three steps, it achieves high-speed, high-efficiency operation while minimizing EMI by suppressing ringing.  • TriC3™ is a trademark or registered trademark of ROHM Co., Ltd.  Terminology  EMI (Electromagnetic Interference)  EMI is used as an indicator of how much noise a product generates during operation, potentially causing malfunctions in surrounding ICs or systems. “Low EMI” means the product generates less noise.  Ringing  High-frequency oscillations or overshoot occurring during switching. This arises from the resonation between inductance and capacitance, including parasitic elements in the circuit. In the context of motor driving, ringing happens when the power MOSFETs are turned on and off.
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Release time:2025-11-21 16:54 reading:325 Continue reading>>
Panasonic Industry Commercializes Conductive Polymer Tantalum Solid Capacitors (POSCAP) with The Industry's Lowest Prof<span style='color:red'>ile</span>*1 to Support High-Output Power Delivery Required for USB Type-C Connections
  Panasonic Industry Co., Ltd., a Panasonic Group company, announced  that it will begin commercial production of its two models of Conductive Polymer Tantalum Solid Capacitors (POSCAP), 50TQT33M and 63TQT22M. These capacitors are incorporated into power circuits used for information and communication equipment, including laptops and tablets. They offer an ultra-high withstand voltage and high capacitance in a body with the industry’s lowest profile of 3 mm, supporting high-output power delivery through USB Type-C connectors. Mass production for these models is planned to start in December 2025.  These capacitors are ideal for voltage stabilization and noise reduction in power supplies compliant with USB Power Delivery (USB-PD)[1] 3.1. While previous USB-C connectors supplied up to 100 W (20 V/5 A), USB-PD 3.1 expands this to 240 W (48 V/5 A). This enables widespread use of USB-C connectors for high-speed data transfer and rapid charging, and is expected to further expand applications to larger equipment requiring high power output, such as displays.  On the other hand, information and communication equipment such as laptops are increasingly required to be thinner and more compact. Capacitors therefore must combine an ultra-high withstand voltage, high capacitance, and a low profile in order to fit into limited space. Panasonic Industry began mass production of Conductive Polymer Tantalum Solid Capacitors (POSCAP) in 1997 and, as an industry leader, has continuously delivered first-of-their-kind products. Leveraging proprietary powder molding technology and film formation technologies, the company has newly developed two models that achieve both an ultra-high withstand voltage and high capacitance in a package with the industry's lowest profile of 3 mm.  Through these unique device technologies, Panasonic Industry will continue to contribute to enhancing the functionality of electronic equipment, including laptops, while also reducing the environmental impact through smaller, lighter devices and lower material usage.  Key features:  1. Achieves both an ultra-high withstand voltage and high capacitance*2 to support high-output USB Type-C power delivery, in a 3 mm profile—the lowest in the industry*1—enabled by proprietary powder molding and film formation technologies  2. Lineup of USB-PD 3.1-compliant models rated at 50 V and 63 V  3. Contributes to reduced material usage lower environmental impact through low-profile design  *1 As of September 18, 2025, Conductive polymer tantalum solid capacitors with rated voltages of 50 V and 63 V and capacitance of 22 μF or higher (Panasonic Industry data)  *2 USB-Power Delivery 3.1 (180 W/240 W output) compliant high-capacitance conductive polymer tantalum solid capacitors with rated voltages of 50 V and 63 V, and a capacitance of 22 μF or higherDetailed features:  1. Achieves both an ultra-high withstand voltage and high capacitance to support high-output USB Type-C power delivery, in a 3 mm profile—the lowest in the industry—enabled by proprietary powder molding and film formation technologies  To achieve capacitor performance required for USB-PD 3.1 power supplies in a low-profile body, both high capacitance and a high withstand voltage must be ensured, despite their trade-off relationship. High-capacitance tantalum powder is necessary for electrode materials, but its fine particle size makes molding difficult, creating challenges for stable production. Forming a uniform dielectric film on the surface of the electrodes is important for enhancing the withstand voltage. However, since electrodes made with high-capacitance tantalum powder contain extremely small internal pores, dielectric oxide films tend to develop imperfections.  Panasonic Industry overcame these challenges by establishing proprietary technology to mold high-capacitance tantalum powder with uniform density, and by optimizing the film deposition process to create flawless dielectric films. This enabled the development of two new models that combine an ultra-high withstand voltage and high capacitance, meeting the USB-C high-output power delivery requirements in a 3 mm low-profile package.Cross-sectional view of POSCAP and enlarged view of the inside of the electrode body  2. Lineup of USB-PD 3.1-compliant models rated at 50 V and 63 V  Until now, Panasonic Industry’s POSCAP lineup extended only up to 35 V, with no models compatible with USB-PD 3.1, which extends the rated voltage specification to 36 V (180 W) and 48 V (240 W). The two new models, rated at 50 V and 63 V, each achieve a high capacitance of 22 μF or higher in a package with the industry's lowest profile of 3 mm. The full lineup provides flexibility to meet diverse applications and equipment specifications.  3. Contributes to reduced material usage lower environmental impact through low-profile design  Compared to the industry standard size*3, the new models reduce volume by 25%, contributing to a lower environmental impact through reduced material usage.  *3 Comparison with the industry standard size (7.3 mm × 4.3 mm × 4 mm) of conductive polymer tantalum solid capacitors used in USB-PD 3.1 compliant power suppliesApplications:  Voltage stabilization and noise reduction of USB-PD 3.1-compliant power supplies for laptops, displays, and peripheral equipment  Arc discharge[2] countermeasures for USB-PD 3.1-compliant connectors  Specifications:  Life: 2,000 hours at 105°C; guaranteed operating temperature range: -55°C to 105°C  Ripple current[3]: 100 kHz, 105°C  ESR[4]: 100 kHz, 20°C  *4 Product dimensional tolerance:  Length (L): ±0.3 mm; Width (W): ±0.2 mm; Height (H): ±0.2 mmTerm descriptions:  [1] USB-PD  The power delivery standards established by the standard-setting organization USB Implementers Forum, Inc. (USB-IF). With the launch of USB-PD 3.1 in 2021, USB Type-C cables and connectors can now deliver up to 240 W of power, supporting a wide range of applications—from smartphones and laptops to larger equipment such as monitors.  [2] Arc discharge  An electric spark or discharge phenomenon that occurs when a high current flows at low voltage in electrical circuits.  [3] Ripple current  When a voltage fluctuation is applied to a capacitor, a corresponding charging or discharging current flows through the capacitor. The current applied to this capacitor is referred to as a ripple current. The higher the ripple current, the higher the allowable current.  [4] ESR (Equivalent Series Resistance)  Represents the value of an internal resistance component that can cause heat generation. Capacitors with lower ESR allow higher ripple currents and provide excellent noise absorption.
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Release time:2025-11-06 15:35 reading:455 Continue reading>>
Fibocom Releases 5G AI Mob<span style='color:red'>ile</span> Hotspot Solution, Unlocking Intelligent Future for Mob<span style='color:red'>ile</span> Broadband Devices
  As 5G and AI technologies continue to converge, demand is growing for stable, high-speed, and intelligent mobile networks across various scenarios—from business travel and outdoor operations to global connectivity. Fibocom’s latest 5G AI Mobile Hotspot solution redefines the mobile broadband experience with cutting-edge technology and forward-thinking design.  Powered by Qualcomm’s advanced 4nm QCM4490 platform, the solution combines smartphone-grade ultra-low power consumption with precision circuit design. This results in a powerful yet energy-efficient platform that balances high performance with cost optimization.  In terms of connectivity, the solution supports 3GPP Release 16 and NR 2CC 120MHz. It delivers a downlink speed of up to 2.3 Gbps in SA mode and 2.5 Gbps in NSA mode. Customers can flexibly configure the solution with either AX3600-based Wi-Fi 6E or BE5800-based Wi-Fi 7 options. It supports dual-band simultaneous (DBS) modes of 2.4GHz+5GHz or 2.4GHz+6GHz, as well as high-band simultaneous (HBS) mode of 5GHz+6GHz.  Tailored for Mobile Hotspot applications, the solution runs an optimized Android 13 OS, significantly boosting system performance while reducing power consumption. With USB 3.1 support and a theoretical data transfer rate of up to 5 Gbps, it’s well-suited not only for 5G Mobile Hotspot devices but also for other mobile broadband terminals such as USB dongles.  Crucially, the solution leverages the QCM4490’s heterogeneous computing architecture, featuring a robust 8-core CPU (2x Cortex-A78 @ 2.4GHz + 6x Cortex-A55 @ 2.0GHz) and integrated Adreno 613 GPU (@ 1010MHz). Compared to GPU-less solutions, this powerful combination enables efficient on-device AI processing, expanding the possibilities for more edge intelligence applications. Internal tests have demonstrated the successful deployment of large-scale open-source AI models such as Qwen-1.8 B-Chat.  From business office to global travel these mobile broadband applied scenarios, Fibocom’s cost-effective 5G AI Mobile Hotspot solution—with optional Wi-Fi 7 support—paves the way for a new era of AI-enhanced mobile broadband.
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Release time:2025-06-06 15:38 reading:755 Continue reading>>
ROHM Develops a New Compact Thermal Printhead for A4-Sized Mob<span style='color:red'>ile</span> Printers
  ROHM has developed a new thermal printhead - KA2008-B07N70A - compatible with a 2-cell Li-ion battery (7.2V). Designed to deliver high print quality with low power consumption and optimized for A4 size printers (210mm width). Height has been reduced by approximately 16% from the conventional 14mm to a best-in-class* 11.67mm – contributing to a more compact printer design. Moreover, optimizing the heating element structure while improving the driver IC and wiring layout enables the support for 7.2V operation – reducing the applied energy required for printing by approximately 66% compared to conventional 12V drive (at 50 mm/s print speed). Adjustments to the individual wiring of the resistive elements ensure uniform heat generation, stabilizing print quality and enabling sharp and high-resolution 203dpi printing – even at speeds up to 100 mm/s.  In recent years, the thermal printer market has been expanding in response to increasing demand to print qualified invoices and customs labels fueled by the growth of overseas e-commerce, as well as prescriptions and drug information sheets in hospitals and pharmacies. The demand for mobile printers has surged, particularly in the logistics and business sectors, where portability and ease of maintenance are highly valued. Among these trends, the adoption of A4-sized thermal printers has been growing in Asian markets, particularly in China – driving the need for 8-inch thermal printheads.  A4-sized mobile printers face challenges such as high power consumption due to their wider print width, requiring larger battery capacities compared to smaller printers such as receipt printers. Moreover, the need for multiple driver ICs to control the heating elements in A4-sized printers often results in variations in heat generation due to the differences in wiring lengths between elements, which affect print quality, such as color development and uniformity.  The KA2008-B07N70A addresses these challenges through an optimized design that enhances mechanical strength and durability by mitigating the effects of expansion and contraction caused by temperature changes. This meets the stringent durability requirements of A4-sized printers (the primary target market) while supporting both thermal and transfer printing methods – offering versatile printing for a wide range of applications.  While thermal printheads are typically used in combination with connectors and a heat sink, the KA2008-B07N70A can also be supplied as a standalone board, providing greater design flexibility for printer manufacturers. For inquiries regarding the product as part of a set, please contact AMEYA360 or visit the contact page on ROHM’s website.  Going forward, ROHM plans to develop a 300dpi resolution thermal printhead for mobile A4-sized printers by spring 2025. The company also intends to expand its considerable lineup with products that deliver high-speed printing with superior efficiency.  Key Specifications  For more information on printheads for mobile printers, please refer to the following URL on ROHM’s website: https://www.rohm.com/products/printheads/mobile-printers  Sales Information        Pricing: $14.50/unit (excluding tax)  Availability: Now (OEM quantities)  Application Examples        • A4-sized mobile printers  • Industrial control label printers  • Tattoo stencil printers, etc.  Terminology        dpi (dots per inch)  A unit of print resolution and density, indicating the number of dots that can be placed within a one-inch length (2.54 cm).  Thermal Printing Method  A printing technique in which heat is directly applied to thermal paper, causing a reaction that produces color. Primarily used for receipts and labels, this method eliminates the need for ink or toner, ensuring easy maintenance and operation.  Thermal Transfer Printing Method  A printing method in which heat melts ink coated on a ribbon, transferring it onto paper. Ideal for high-precision printing, it is commonly used for documents and labels requiring long-term preservation.
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Release time:2025-03-31 15:36 reading:465 Continue reading>>
ROHM’s Compact SOT-223-3 600V MOSFETs Contribute to Smaller, Lower Prof<span style='color:red'>ile</span> Designs for Lighting Power Supplies, Pumps, and Motors
  ROHM has added a lineup of compact 600V Super Junction MOSFETs - the R6004END4 / R6003KND4 / R6006KND4 / R6002JND4 / R6003JND4. These devices are ideal for small lighting power supplies, pumps, and motors.  In recent years, power supplies for lighting and motors for pumps are required to be smaller as devices become more sophisticated - spurring the demand for compact MOSFETs that are essential for switching operation.  Generally, however, it has been difficult to reduce the size of Super Junction MOSFETs while maintaining an optimal balance between high breakdown voltage and low ON resistance. In response, after reviewing the shape of the mounted chip, ROHM was able to develop 5 models in the SOT-223-3 package (6.50mm × 7.00mm × 1.66mm) - providing a smaller, lower profile form factor without compromising the performance of conventional products.  Compared to the conventional TO-252 package (6.60mm × 10.00mm × 2.30mm), ROHM’s new products reduce area and thickness by 31% and 27% - contributing to smaller, lower profile applications. At the same time, the same land pattern (footprint) as the TO-252 package can be used, enabling mounting on existing circuit boards without modification.  Offering distinctive features, three of the models optimized for compact power supplies. The R6004END4, characterized by low noise, is suitable for applications where noise is a concern, while the R6003KND4 and R6006KND4, capable of high-speed switching, are ideal for sets requiring low loss, high efficiency operation. The R6002JND4 and R6003JND4 utilize proprietary PrestoMOS technology to achieve significantly lower switching losses by speeding up reverse recovery time (trr), making them well-suited for motors-equipped devices.  Supporting materials such as application notes, technical documents, and SPICE simulation models for each product are available on ROHM’s website free of charge to enable quick market introduction.  Going forward, ROHM will continue to expand its Super Junction MOSFET lineup in different packages and even lower ON resistances that contribute to solving social issues such as environmental protection by reducing power consumption in variety devices.  Product Lineup  For compact power supplies  Application Examples        • R6004END4 / R6003KND4 / R6006KND4: Lighting, Air conditioners, Refrigerators, etc.  • R6002JND4 / R6003JND4: Motors for pumps, fans, copiers, etc.  Online Sales InformationSales Launch Date: December 2023  Pricing: $3.0/unit (samples, excluding tax)  Online Distributors: DigiKey, Mouser, and Farnell  The products will be offered at other online distributors as they become available.  Online Distributors  For More Information about ROHM’s Super Junction MOSFETVarious resources are available on ROHM's website, including application notes on the SOT-223-3 package and other documents essential for circuit design.  https://www.rohm.com/support/super-junction-mosfet  PrestoMOS“Presto” is an Italian musical term meaning “very fast.”  PrestoMOS is ROHM’s original power MOSFET that maintains the high withstand voltage and low ON resistance of Super Junction MOSFETs while speeding up the reverse recovery time of the built-in diode. Reducing switching losses makes it ideal for a wider range of applications with inverter circuits, such as air conditioners and refrigerators.  TerminologySuper Junction MOSFET (Metal Oxide Semiconductor Field Effect Transistor)  A type of transistor, MOSFETs can be divided by device structure into DMOSFET (Double-diffused MOSFET), planar, and super junction topologies. Super Junction MOSFETs deliver superior breakdown voltage and output current than both DMOSFETs and planar types, featuring lower loss when handling large power.  trr (Reverse Recovery Time)  The time it takes for the built-in diode to switch from the ON state to completely OFF. The lower this value is, the smaller the loss during switching.
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Release time:2024-01-24 13:40 reading:2299 Continue reading>>
Murata and Mob<span style='color:red'>ile</span>Knowledge partnership brings accurate UWB position detection modules to complete and powerful UWB development kits
  Murata is pleased to announce its partnership with MobileKnowledge, combining market-leading Ultra-wideband (UWB) expertise with a range of comprehensive products and in-depth customer support. MobileKnowledge’s UWB development kits provide the most comprehensive and powerful tools to evaluate and design solutions for accurate position detection in IoT devices, leveraging NXP’s UWB TrimensionTM technology.  MobileKnowledge is an expert UWB engineering consultant and the market leader in UWB development kits offering a wide variety of tools, created to meet the demands and needs of specific segments of the IoT ecosystem. The MK UWB Kit SR150/SR040 is the most comprehensive reference design and development platform for UWB-based IoT solutions. The MK UWB Kit Mobile Edition is the first development kit that allows users to evaluate UWB interoperability with Apple® and AndroidTM mobile devices. The MK UWB Kit RTLS supports the deployment of accurate indoor localization systems using Time Difference of Arrival (TDoA) technique.  Each kit features ready-to-run demonstration apps, reference hardware including Arduino compatible development boards, 3D Angle of Arrival (AoA) support and reference software examples to enable fast prototyping with minimal effort. In this new partnership, MobileKnowledge and Murata will also develop specific IoT reference use cases to accelerate the adoption of UWB technology in the IoT ecosystem.  MobileKnowledge will offer UWB development kits integrating the Murata Type 2BP and Type 2DK NXP based modules. As the world’s smallest UWB module, the Type 2BP features NXP’s TrimensionTM SR150 UWB chipset, providing enhanced and secure ranging with 3D AoA. Designed for deployment in both larger infrastructures, such as indoor positioning anchors, and in consumer products like game consoles, Type 2BP is a perfect match for MobileKnowledge’s versatile solutions.  The Type 2DK is designed with minimal power draw in mind, enabling integration across several portable devices. Leveraging on NXP’s TrimensionTM SR040 UWB chipset and QN9090’s (Bluetooth® LE + MCU chipset) efficient power management, the Type 2DK can run off a single coin-cell battery. The combined UWB and Bluetooth® LE capabilities of Type 2DK make it ideal for location tags, such as personal and asset trackers, supporting the latest market requirements.  The flexibility provided by both modules, combined with Murata’s technical expertise, helps customers meet the evolving requirements of UWB for IoT. Both the Type 2BP and Type 2DK modules control PHY/MAC operation within the IC in accordance with the FiRa™ Consortium specifications, ensuring interoperability with the growing IoT ecosystem.  “Throughout the design process of the UWB modules, “ said Rui Ramalho, , Product Manager, Connectivity Module for Murata, “it was vital that the end products offered easy integration, high levels of reliability and unmatched flexibility. MobileKnowledge’s all-in-one platform is a perfect fit for both the Type 2DK and 2BP, and we are excited to see the future implementations of our modules”.  Pedro Martinez, CEO of MobileKnowledge, stated: “In partnering with Murata for our MK UWB Kits, we can use both their extensive wireless communication portfolio and knowledge as well as their manufacturing dependability and strong IoT market presence to provide the highest quality development solutions and increase our visibility to IoT solution providers. MobileKnowledge UWB development kits have already helped our customers to integrate accurate positioning in numerous IoT applications. Now with Murata’s innovative modules and technical experience, they will have access to the latest hardware, development tools and reference IoT use cases.”
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Release time:2023-09-18 16:11 reading:2578 Continue reading>>
AMEYA360:C&K Switches PTS381 Top-Actuated Tact<span style='color:red'>ile</span> Switches
AMEYA360:Nidec Sankyo Develops a New Automatic Open-Close Unit for To<span style='color:red'>ile</span>t Lids and Seats
Ameya360:Panasonic EVP-BD 6mm 4N Square Tact<span style='color:red'>ile</span> Switch
  Panasonic EVP-BD 6mm Square Tactile Switch offers an operating force of 4N with 0.7mm travel distance and 200,000 cycles of operation. This switch features a metal dome and rubber dome construction for a sharp tactile feeling with silent operation.       The high operating force and long travel distance reduce the chance of unintentional activation. This top-push SMD switch has two J-bent terminals and 6mm x 6mm external dimensions with a 4mm height. Panasonic EVP-BD 6mm Square Tactile Switch ensures operational safety for applications such as audio electronics and automotive equipment. Additional applications include consumer, medical, industrial, and lighting.  FEATURES  SMD mounting type  Snap-action / push-on type SPST  Top push  Middle stroke travel  High click ratio of operating force vs. travel distance offers crisp tactile feel  Rubber dome provides quiet operation  High endurance  High operating force and long travel distance for lower chance of unintentional activation  J-bent terminal  With push plate (actuator)  Reflow applicable soldering  APPLICATIONS  Automotive  Industrial  Consumer  Medical  Audio  Lighting  SPECIFICATIONS  4N operating force  0.7mm travel  6mm x 6mm external dimensions  4mm height  10ms maximum bouncing (ON, OFF)  200,000 cycles operating life  10μA 2VDC to 20mA 15VDC (resistive load) rating  500MΩ maximum contact resistance  100MΩ minimum insulation resistance at 100VDC  250VAC (1 minute) dielectric withstanding voltage  -40°C to +90°C operating temperature range
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Release time:2023-02-27 11:44 reading:2007 Continue reading>>
TE Connectivity Blind Mating Mob<span style='color:red'>ile</span> Charging Connectors
  TE Connectivity's (TE) Blind Mating Mobile Charging Connectors are intended for smaller mobile robots and autonomous vehicles typically used in warehouse environments. Autonomous mobile robots (AMR) are used mostly for material handling (picking, movement, storage, and sorting) in the warehouse automation space.         TE's Blind Mating Mobile Charging Connectors are available in 2- and 3-power contact options with up to eight signal contacts to ease installation and rework cycle times. The series offers a high mating cycle life and serves as a modular solution that will support different configurations, data, and sensing.  FEATURES  Robust design for high-cycle life  Designed for a minimum of 12,000 mating cycles  Low insertion force power contacts  Spring probe signal contacts  Connection flexibility  2 and 3 power contact options  Up to 50A and up to 125V  Up to 40A per line at up to 100V  Terminates to 10AWG or 8AWG stranded copper wire  First make, last break contact for use in grounding, system enabling, or applications that require charging two battery strings independently  Touch safe contacts for extra safety if rework is needed  Blind mate capability  Allows for the misalignment of at least ±15mm for x and ±10 for the y direction  ± Approx. 5° for z direction (mating)  Up to 8x signal contacts  Up to 0.5A per line  Terminates to 30AWG to 22AWG stranded wire  Rear pluggable interface to ease installation and rework cycle times  Spring probe contacts for high cycle life  Utilizes Mini Universal MATE-N-LOKII Connector interface for signal contact mating  APPLICATIONS  Charging for autonomous mobile robots/automated guided vehicles (AMR/AGV)  Blind mate battery charging  Industrial  Hospitality  Retail  Medical
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Release time:2023-01-31 14:38 reading:1721 Continue reading>>

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