ROHM’s <span style='color:red'>PMIC</span>s for SoCs have been Adopted in Reference Designs for Telechips’ Next-Generation Cockpits
  ROHM has announced the adoption of its PMICs in power reference designs focused on the next-generation cockpit SoCs ‘Dolphin3’ (REF67003) and ‘Dolphin5’ (REF67005) by Telechips, a major fabless semiconductor manufacturer for automotive applications headquartered in Pangyo, South Korea. Intended for use inside the cockpits of European automakers, these designs are scheduled for mass production in 2025.  ROHM and Telechips have been engaged in technical exchanges since 2021, fostering a close collaborative relationship from the early stages of SoC chip design. As a first step in achieving this goal, ROHM’s power supply solutions have been integrated into Telechips’ power supply reference designs. These solutions support diverse model development by combining sub-PMICs and DrMOS with the main PMIC for SoCs.  For infotainment applications, the Dolphin3 application processor (AP) power reference design includes the BD96801Qxx-C main PMIC for SoCs. Similarly, the Dolphin5 AP power reference design developed for next-generation digital cockpits combines the BD96805Qxx-C and BD96811Fxx-C main PMICs for SoC with the BD96806Qxx-C sub-PMIC for SoC, improving overall system efficiency and reliability.  Modern cockpits are equipped with multiple displays, such as instrument clusters and infotainment systems, with each automotive application becoming increasingly multifunctional. As the processing power required for automotive SoCs increases, power ICs like PMICs must be able to support high currents while maintaining high efficiency. At the same time, manufacturers require flexible solutions that can accommodate different vehicle types and model variations with minimal circuit modifications. ROHM SoC PMICs address these challenges with high efficiency operation and internal memory (One Time Programmable ROM) that allows for custom output voltage settings and sequence control, enabling compatibility with large currents when paired with a sub-PMIC or DrMOS.  Moonsoo Kim,  Senior Vice President and Head of System Semiconductor R&D Center, Telechips Inc.“Telechips offers reference designs and core technologies centered around automotive SoCs for next-generation ADAS and cockpit applications. We are pleased to have developed a power reference design that supports the advanced features and larger displays found in next-generation cockpits by utilizing power solutions from ROHM, a global semiconductor manufacturer. Leveraging ROHM’s power supply solutions allows these reference designs to achieve advanced functionality while maintaining low power consumption. ROHM power solutions are highly scalable, so we look forward to future model expansions and continued collaboration.”  Sumihiro Takashima,  Corporate Officer and Director of the LSI Business Unit, ROHM Co., Ltd.“We are pleased that our power reference designs have been adopted by Telechips, a company with a strong track record in automotive SoCs. As ADAS continues to evolve and cockpits become more multifunctional, power supply ICs must handle larger currents while minimizing current consumption. ROHM SoC PMICs meet the high current demands of next-generation cockpits by adding a DrMOS or sub-PMIC in the stage after the main PMIC. This setup achieves high efficiency operation that contributes to lower power consumption. Going forward, ROHM will continue our partnership with Telechips to deepen our understanding of next-generation cockpits and ADAS, driving further evolution in the automotive sector through rapid product development.”  ・ Telechips SoC [Dolphin Series]  The Dolphin series consists of automotive SoCs tailored to In-Vehicle Infotainment (IVI), Advanced Driver Assistance Systems (ADAS), and Autonomous Driving (AD) applications. Dolphin3 supports up to four displays and eight in-vehicle cameras, while Dolphin5 enables up to five displays and eight cameras, making highly suited as SoCs for increasingly multifunctional next-generation cockpits. Telechips is focused on expanding the Dolphin series of APs (Application Processors) for car infotainment, with models like Dolphin+, Dolphin3, and Dolphin5, by leveraging its globally recognized technical expertise cultivated over many years.  ・ ROHM 's Reference Design Page  Details of ROHM’s reference designs and information on equipped products are available on ROHM’s website, along with reference boards. Please contact a sales representative or visit ROHM’s website for more information.  https://www.rohm.com/contactus  ■ Power Supply Reference Design [REF67003] (equipped with Dolphin3)  Reference Board No. REF67003-EVK-001  https://www.rohm.com/reference-designs/ref67003  ■ Power Supply Reference Design [REF67005] (equipped with Dolphin5)  Reference Board No. REF67005-EVK-001  https://www.rohm.com/reference-designs/ref67005  About Telechips Inc.Telechips is a fabless company specialized in designing system semiconductors that serve as the “brains” of automotive electronic components. The South Korean firm offers reliable, high-performance automotive SoCs. In response to the industry’s transition toward SDVs (Software Defined Vehicles), Telechips is broadening its core portfolio beyond car infotainment application processors (APs) to include MCUs, ADAS, network solutions, and AI accelerators.  As a global, comprehensive automotive semiconductor manufacturer, Telechips adheres to international standards such as ISO 26262, TISAX, and ASPICE, leveraging both hardware and software expertise for future mobility ecosystems, including not only automotive smart cockpits, but also E/E architectures. What’s more, Telechips provides optimal solutions for In-Vehicle Infotainment systems (IVI), digital clusters, and ADAS, all compliant with key automotive standards (AEC-Q100, ISO 26262). Telechips has established business relationships with major automakers both domestically and internationally, supported by a strong track record of shipments.  One flagship product is the Dolphin5 automotive SoC that integrates an Arm®-based CPU, GPU, and NPU to meet high-performance requirements. As a fabless company, Telechips outsources the manufacturing of its SoCs to Samsung Electronics’ foundry, delivering high-quality semiconductor products to domestic and overseas manufacturers. For more information, please visit Telechips’ website:  https://www.telechips.com/  *Arm® is a trademark or registered trademark of Arm Limited.  TerminologyPMIC (Power Management IC)  An IC that contains multiple power supply systems and functions for power management and sequence control on a single chip. It is becoming more commonplace in applications with multiple power supply systems in both the automotive and consumer sectors by significantly reducing space and development load vs conventional circuit configurations using individual components (i.e. DC-DC converter ICs, LDOs, discretes).  SoC (System-on-a-Chip)  A type of integrated circuit that incorporates a CPU (Central Processing Unit), memory, interface, and other elements on a single substrate. Widely used in automotive, consumer, and industrial applications due to its high processing capacity, power efficiency, and space savings.  AP (Application Processor)  Responsible for processing applications and software in devices such as smartphones, tablets, and automotive infotainment systems. It includes components such as a CPU, GPU, and memory controller to efficiently run the Operating System (OS), process multimedia, and render graphics.  DrMOS (Doctor MOS)  A module that integrates a MOSFET and gate driver IC. The simple configuration is expected to reduce design person-hours along with mounting area and to achieve efficient power conversion. At the same time, the built-in gate driver ensures high reliability by stabilizing MOSFET drive.
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Release time:2024-12-20 13:56 reading:722 Continue reading>>
3PEAK Launches TPU25401, a Highly Integrated Auto-Grade <span style='color:red'>PMIC</span> Chip
  With the rapid development of automotive technology, the electrification and intelligence of automobiles continue to advance, and intelligent cockpits and Advanced Driver Assistance Systems (ADAS) are becoming more prevalent. As a core component in automotive electronic systems, BMS devices directly impact the stability and efficiency of the entire system.  In response to these demands, 3PEAK has released TPU25401, a highly integrated auto-grade Power Management Integrated Circuit (PMIC). It is designed to power the main System-on-Chips (SoCs) in automotive intelligent cockpits, ADAS, and other systems, providing a new choice for power management in automotive electronic systems.TPU25401 adopts innovative technology and a compact design to meet the need for stable, efficient, and flexible power management in automotive intelligent cockpits, ADAS, and other systems. It introduces a breakthrough auto-grade power management solution for automotive electronics.  Typical Application Circuit of TPU25401  Key features of TPU25401 for application in automotive intelligent cockpits and ADAS systems include:  High Performance, High Integration  Includes 5 buck converters and 5 Low-Dropout Regulators (LDOs), with a total current output capacity exceeding 22 A.  Output voltage adjusted from 0.6 V to 3.7 V, with a 10 mV adjustment step.  Non-linear control internally, providing a fast dynamic load response speed, especially suitable for core digital chips such as SoCs.  6 × 6 mm 48-pin QFN package.  Flexible Configuration  Configurable default output voltage and power on/off sequence through One-Time Programmable (OTP) settings.  Programmable maximum output current capacity.  Dual-buck channel merging to meet the application requirements of a single high-current channel.  Master-slave architecture, allowing two PMICs to operate synchronously, providing more power rails with synchronous on/off sequences.  Safe and Reliable  Integrated with multiple protection mechanisms, including current limit protection, short-circuit protection, overload protection, and over-temperature protection. Automatic cut-off output in abnormal situations, protecting the automotive electronic system from damage and ensuring vehicle safety.  The flexible configuration of TPU25401 addresses the limitations of traditional PMICs that can only adapt to a single SoC platform. According to feedback from SoC partners and related Tier 1 feedback, TPU25401 can easily adapt to different SoCs in the automotive market. Taking the intelligent cockpit SoC X9M platform from SemiDrive as an example, only one TPU25401 is needed to meet all the power requirements of the system.  Minimum Functional Block Diagram of TPU25401 in Conjunction with SemiDrive's X9M Single-Chip Platform  Evaluation Board for TPU25401 in Conjunction with SemiDrive's X9M Single-Chip Platform  The TPU25401 BMS device for automotive intelligent cockpits, ADAS, and other systems offers a new solution.Through its highly integrated design, the TPU25401 ensures stable and efficient power for various hardware components in the complex automotive environment. Additionally, it responds rapidly to abnormal situations and provides automatic protection, significantly enhancing the system's safety and stability.TPU25401 includes features such as high integration, flexible configuration, and safety reliability, providing robust hardware support for the development of automotive electronics.
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Release time:2023-12-26 13:20 reading:2695 Continue reading>>
NXP Semiconductors PF5030 Fail-Safe System Basis Chip <span style='color:red'>PMIC</span>s
  NXP Semiconductor PF5030 Fail-Safe System Basis Chip PMICs with multiple switch-mode power supplies (SMPSs) and low-dropout regulators (LDOs) are designed for S32Z2/E2 processors. A maximum input voltage of up to 5.25V makes the PF5030 PMICs ideal for working with NXP front system supply families (FS86, FS6x) or any other front supply in the automotive drive train market.       Built-in One-Time Programmable (OTP) memory stores key start-up configurations that drastically reduce external components typically used to set external regulators' output voltage and sequence. Regulator parameters are adjustable through the I2C after start-up, offering flexibility for different system states.  FEATURES  Voltage  5.25VDC maximum operating voltage  Supports operating voltage range down to 3.3V  Low power OFF mode with low sleep current (15?A typical)  Power supplies  BUCK1/2 low voltage integrated synchronous buck converter  Configurable output voltage from 0.7V to 1.5V and current capability up to 3.5ADC  Capable of multiphase operation up to 7.0ADC  BUCK3 low voltage integrated synchronous buck converter  Configurable output voltage from 1.0V to 4.1V and current capability up to 2.5ADC  LDO1/2 low voltage LDO regulator for MCU I/O and system peripheral  Configurable output voltage from 1.1V to 4.1V and current capability up to 400mADC  System support  1x input pin for power-ON detection, 1.8V, 3.3V, and 5.0V compatible  Analog multiplexer with full system voltages and temperature monitoring  Enhanced leader/follower power-up sequencing management through XFAILB pin  10ms optional RSTB release delay during power-up for certain MCU compliance  Device control via 32-bit I2C interface with 8-bit CRC  Compliance  EMC optimization techniques on switching regulators, including spread spectrum and manual frequency tuning  EMI robustness supporting various automotive EMI test standards  IEC 61967-4 conducted emission  IEC 62132-4 conducted immunity  Functional safety  ASIL D capability on safety goal 1 (SG1/CSG_01) on UV/OV for all S32Z2/E2 power rails (0.8V, 1.1V, 1.8V, and 3.3V)  Configurable ASIL from QM to ASIL D on safety goal 2 (SG2/CSG_02) on MCU monitoring function (watchdog)  Independent voltage monitoring circuitry  Up to 6x voltage monitoring inputs with 1.0% target accuracy  Logical and analog built-in self-test (LBIST/ABIST)  Safety outputs with latent fault detection mechanism (PGOOD, RSTB, FS0B)  Configuration and enablement  40-pin QFN with exposed pad for optimized thermal management  OTP programming for device customization  APPLICATIONS  EV propulsion and power train domain controllers  Chassis-integrated systems  S32Z2/E2 companion chips
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Release time:2023-04-26 11:35 reading:1271 Continue reading>>
AMEYA360:NXP Semiconductors PCA9451AHN <span style='color:red'>PMIC</span>
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Release time:2023-04-19 13:36 reading:2191 Continue reading>>
Ameya360:Nordic Expands <span style='color:red'>PMIC</span> Portfolio
  Nordic Semiconductor is adding three new product variants to its nPM1100 power management IC product range. Until now, the range has only been available in an ultra-compact 2.1-by-2.1mm chip-scale package (CSP) form factor.  The first new variant comes in a more mainstream 4-by-4mm QFN component package. CSPs are an absolute requirement for products defined by extreme size constraints. However, when this is not a factor, QFNs allow for easier and cheaper manufacturing as well as simplified design, development, and verification. QFNs also offer greater thermal and vibration robustness compared to CSPs.  The second and third new nPM1100 variants support higher maximum (termination) battery charging voltages (VTERM) that are required to fully charge certain types of lithium-ion cells commonly used in portable wireless products. These variants will also be offered in either a CSP or QFN package.  Termination voltage is the maximum voltage a battery should reach during charging. It is used by the battery charger circuit to switch from constant current charging to constant voltage charging and is ultimately used to determine when a battery is fully charged, and so when to stop charging.  All Nordic nPM1100 variants require no configuration software to operate as all settings are pin configurable.  “Chip-scale packages are amazing in their miniaturization,” said Geir Kjosavik, Product Director PMIC at Nordic Semiconductor. “In its smallest CSP configuration, the nPM1100 solution only takes up 23mm2 of board space including passive components. However, the product’s ultra-high power management efficiency and ease-of-use bring tremendous value to battery-powered applications where space constraints are not so strict, and so the use of a QFN package is often preferable.”  Kjosavik said the previous nPM1100’s maximum termination voltage was below that of some increasingly popular lithium-ion batteries used in wearable products. The new nPM1100 variants with higher termination voltage will now maximize the application range and power optimization potential of Nordic’s power management ICs to all portable electronics products.  The all new nPM1100 product variants are in volume production and available to order now. A new version of the existing evaluation kit (nPM1100 EK) for evaluating the higher termination voltage will be available end of Q1 (nPM1100 EKHV).
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Release time:2023-02-17 13:59 reading:3111 Continue reading>>
DIOO <span style='color:red'>PMIC</span> DIO8018 with 7-channel high-performance LDO
  DIOO has recently launched the PMIC DIO8018, an integrated 7-channel high-performance LDO which is specially designed to provide power supply solutions for multi-camera application scenarios such as mobile phones, tablet computers and extended reality (XR).  In one camera module, CMOS image sensors generally require three-way power supplies (Core, I/O, and Analog), and some cameras also have power supply requirements for auxiliary functions such as Optical Image Stabilization (OIS) and Auto Focus (AF). A single camera module needs 3~5 channels of power supply, and the tablet computer, mobile phone, and XR require more than one camera module.  The load characteristics and requirements of the power supply differs by camera modules. There are digital circuit power supply DVDD that requires high current and fast dynamic response, and analog circuit power supply AVDD that is very sensitive to power supply noise. Different types of cameras may also require different output voltages and currents. The camera sensor power supply generally supplies the nearest components. However, the main PMIC of the platform is generally far away from the position of the camera, and it does not have enough channels to supply multiple cameras.  The use of multiple discrete LDOs is a solution, but it will occupy a large amount of PCB area, which is a huge challenge to the structural design and PCB layout of multi-camera module equipment.  The DIO8018 can not only meet the high current and fast dynamic response required by DVDD, but also meet the high PSRR and low noise required by AVDD, and also satisfies the need for an ultra-small size. It is a perfect solution for multi-camera applications.  图1:Typical Applications  Integrated 7-channel LDO  The DIO8018 is a PMIC with an integrated 7-channel LDO. It has a 2-channel low-dropout LDO for high-current power supply (LDO1/2 output current up to 1.5 A, can power the DVDD of a high-pixel camera) and multi-channel high-voltage power supply for noise sensitive power supply PSRR LDO power rail (Vsys to Vout of LDO3-7, PSRR can reach more than 92dB at 1KHz, which can power the AVDD of the camera).  The DIO8010 is a PMIC with an integrated 7-channel LDO. It has a 2-channel, low-dropout LDO for high-current power supplies and a multi-channel, high PSRR, LDO power rail for noise-sensitive power supplies. The LDO 1/2 has an output current of up to 1.5 A and can supply the DVDD of a high-pixel camera. The PSRR of LDO 3 to 7, which is Vsys to Vout, can reach more than 92 dB at 1kHz.
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Release time:2023-02-16 15:25 reading:1885 Continue reading>>
Ameya360:Renesas ASIL B <span style='color:red'>PMIC</span> Suited to Automotive Camera Applications
  Renesas Electronics Corp.’s RAA271082 automotive power management IC (PMIC) for next-gen automotive camera applications is a versatile ISO-26262 compliant multi-rail power IC with a primary high voltage synchronous buck regulator, two secondary low voltage synchronous buck regulators, and a low voltage LDO regulator.  The device offers four overvoltage and undervoltage (OV/UV) monitors, I2C communications, a configurable general-purpose I/O pin, and a dedicated reset output/fault indicator. To meet stringent ASIL B metrics, the RAA271082 includes a second independent reference for OV/UV monitors, built-in self-test at power-up, independent OV/UV monitoring, and continuous CRC error checking on internal registers and I2C communications.  The highly integrated RAA271082 provides a universal power solution for automotive cameras. It is an ideal companion for Renesas’ Automotive High-Definition Link (AHL) technology that enables car manufacturers to deliver high-definition video using low-cost cables and connectors. The new PMIC simplifies power supply design for automotive camera applications requiring functional safety compliance, modules that include surround view/satellite, rearview, driver monitor, and e-mirror. The RAA271082 supports the power requirements of almost any combination of image sensor, image signal processor (ISP) and encoder technology, while also supporting direct-from-battery as well as power-over coax supply.  In addition to imaging systems, the RAA271082’s high integration and comprehensive safety features make it an excellent solution for 16- and 32-bit automotive MCUs in a variety of applications.  “Cameras are now an indispensable feature for all new vehicles,” said Niall Lyne, Vice President of the Automotive Analog Power and Video Business Division at Renesas. “Our new PMIC delivers all the functionality our customers need in a compact form factor suitable for almost all automotive camera modules. It is an excellent companion for our AHL solution, recently named as one of the most innovative applications of computer vision technology.”  Developed on an ISO-26262 compliant process, the RAA271082 PMIC supports system safety goals reaching ASIL B; features high degree of programmability; and provides 1A output current capability per switching regulator to support the growing power demands of the latest generation of high-resolution automotive image sensors. It also supports general-purpose automotive MCUs with integrated reset generation, watchdog timer and programmable GPIO; as well as integrates multiple components and functions to reduce overall power consumption.
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Release time:2023-02-01 11:19 reading:1956 Continue reading>>
Ameya360:Nordic Semiconductor Multi-function <span style='color:red'>PMIC</span> Simplifies System Design
  Nordic Semiconductor is expanding its power management IC (PMIC) portfolio by releasing a third PMIC in mid-2023. The nPM1300 expands the company’s PMIC offering by adding support for both charging of larger batteries and four regulated power rails.  Optimized for efficiency, the compact nPM1300 (3.1-by-2.4mm WL-CSP or 5-by-5mm QFN) is digitally configurable through an I2C-compatible Two Wire Interface (TWI). The digital interface provides access to several system management functions that are usually implemented as discrete functions in Bluetooth Low Energy (LE) embedded designs, such as hard reset, battery fuel gauge, system-level watchdog, power loss warning, and recovery from failed boot.  “Nordic entered the PMIC market because existing power management solutions were not optimized for compact, ultra-low power IoT applications. Available PMICs leave it up to the designer to implement vital functionality using discrete components—functions that naturally belong inside a PMIC and can be implemented at almost no cost,” says Geir Kjosavik, Product Director – PMIC, Nordic Semiconductor. “So, we did just that. Nordic’s customers will be delighted to have access to on-chip functions that enhance product safety and provide additional ways of conserving battery energy.”  The nPM1300 is designed to provide highly efficient power regulation for Nordic’s nRF52 and nRF53 Series advanced wireless multiprotocol Systems-on-Chip (SoCs). The PMIC’s four regulated power rails and battery charger make it ideal for compact and advanced IoT products based on, for example, an nRF5340 SoC host and multiple peripheral functions such as sensors. Examples include advanced wearables and portable medical applications.  The nPM1300 PMIC operates from an external power supply of 4V to 5.5V and can operate from a battery voltage down to 2.4V. Two power rails are regulated by separate DC/DC buck converters that are configurable between 1V and 3.3V and up to 200mA maximum current. The other two power rails operate as load switches—switching currents of up to 100mA from external sources—but can also perform as Low Drop Out (LDO) voltage converters when powered directly by the nPM1300. When operating as LDOs, these power rail outputs are configurable between 1V and 3.3V with a maximum output current of 50mA. The unregulated input voltage is also available as an output from the nPM1300.  The nPM1300 charges single-cell Li-ion, Li-Pol, and LiFePO4 batteries with a linear charging module that supports up to 800mA charge current. The termination voltage is programmable from 3.5V to 4.45V. The battery charger features automatic thermal regulation with programmable maximum chip temperature during charging to enable simple thermal management that can be adapted to any system requirement.  The nPM1300 brings other new advanced features to Nordic’s PMIC range including: USB port detection with automatic current limits of 100mA or 500mA through standard USB or up to 1.5A through USB-C PD (Power Delivery); dynamic power path management which automatically switches to battery power if a mains power connection is removed; voltage, current and temperature monitoring for accurate fuel gauging; and ultra-low current hibernate mode with a programmable wake-up timer in addition to the other system management features already mentioned. The PMIC also features three LED drivers and five GPIOs that can be re-purposed to direct control lines to time-critical control functions as an alternative to serial commands.  The nPM1300 is available for limited sampling now, and will be available to order from Nordic’s distributors mid-2023.
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Release time:2023-01-19 13:38 reading:2918 Continue reading>>
Apple Pays $600 Million for Dialog's <span style='color:red'>PMIC</span> Business
Apple will acquire the majority of U.K.-based chipmaker Dialog Semiconductor's power management IC business for a total of $600 million, including $300 million for 300 Dialog engineers already focused on Apple chip development — plus assets — and a $300 million prepayment for Dialog products to be delivered over the next three years.Announced as a partnership and technology licensing agreement, Dialog will have guaranteed contracts for products over the three-year deal. Its 2018 revenue from Apple for PMICs is expected to be $875 million but will start declining from the second half of 2019 and be phased out by 2022.Dialog says that it expects no new revenue contribution from main PMICs for 2019 iPhone models and for the 2020 iPad or Watch models. Beyond this period, Dialog expects to continue to work with Apple to deliver sub-PMIC products, but that will be a much smaller proportion of its business.The transaction is expected to close by the end of the first half of 2019, said Dialog. The company currently employs 2,100 people, so it will lose 16% of its workforce once the deal is done. At that point, Dialog expects to reduce operating expenses by about $35 million.As part of the deal, Apple will take over Dialog facilities in Livorno, Italy, Swindon, U.K., and Nabern and Neuaubing, Germany.“We believe that this transaction is in the best interests of our employees and shareholders who will benefit from a business with enhanced focus, strong growth prospects, and additional financial flexibility to invest in strategic growth initiatives,” said Jalal Bagherli, Dialog CEO, in a press statement.A Dialog spokesperson told EE Times that the deal essentially helps bring clarity to the company’s relationship with Apple.Apple seemed pleased to be able to take control of PMIC development. “Dialog has deep expertise in chip development, and we are thrilled to have this talented group of engineers who’ve long supported our products now working directly for Apple," said Johny Srouji, Apple’s senior vice president of hardware technologies.
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Release time:2018-10-15 00:00 reading:1004 Continue reading>>

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