Fibocom FWA-dedicated 5G Module FG370 be the First to Receive CE Certification Based on MediaTek’s T830
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Fibocom FWA-dedicated 5G Module FG370 be the First to Receive CE Certification Based on MediaTek’s T830

　　Fibocom announces that its FWA-dedicated 5G module based on MediaTek T830 Platform FG370 has passed CE test and receive CE Certification after it is first launched in October 2022, which marks a significant achievement for the module to march into the global FWA market.　　Shenzhen, China – November 30th, 2022 -Fibocom Wireless Inc., a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, announces major product updates of its FWA-dedicated 5G module FG370, successfully received CE Certification after the first launched in October during Broadband World Forum 2022. Up-to-date, FG370 is fully capable of providing powerful connectivity service to FWA customers worldwide.　　Compliant with 3GPP Release 16 (R16) standard, Fibocom FG370 based on MediaTek’s T830 chipset platform is designed to empower the 5G FWA market worldwide. Integrated with a powerful quad-core Arm Cortex-A55 CPU, FG370 supports 4CC CA (Carrier Aggregation) and up to 300MHz of spectrum, which improves the utilization of spectrum resources and ensures an extended 5G coverage. With the significant progress certified by CE, it is now available to offer seamless connectivity to CPE, MiFi, UFi, Dongle, etc.　　It is worth mentioning that the 5G Sub-6GHz module FG370 supports 8RX (Receive Antennas) and Power Class 1.5 (PC1.5) High Power User Equipment (HPUE), significantly improving data transmission performance up to 7.01Gbps on the downlink and 2.5Gbps on the uplink. With the enhancements, FG370 is featuring to offer three combinations for FWA application scenarios, unleashing the extreme wireless experience and consistent low latency.　　5G Cellular + Tri-band 4×4 Wi-Fi 7 (BE19000) for 5G IDU Solution　　5G Cellular + Dual-band 2×2 Wi-Fi 7 (BE6500) for 5G ODU Solution　　5G Cellular + Ethernet 10Gbps for Wired Solution　　“MediaTek T830 brings the best of 5G and Wi-Fi 7 technologies into homes and enterprises, giving them extreme speeds with the freedom of an untethered device,” said Martin Lin, Deputy General Manager of the Wireless Communications Business Unit at MediaTek. “Fibocom continues to be our alpha partner with its new FG370 module series, which we anticipate will begin to enter new devices from tier-1 partners worldwide in 2023.”　　“We are delighted to announce the breakthrough on CE test in such a short time after FG370’s first launch in October,” said Simon Tao, General Manager of MBB Product Management Dept., Fibocom. “The recent progress we achieved will furtherly accelerate the deployment of FG370 into the projects. By working closely with MediaTek, we believe that the FG370 FWA-dedicated 5G module solution based on MediaTek’s T830 is expected to achieve great success in the global FWA market.”　　The engineering sample of FG370 is now ready for international shipping.
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Release time：2023-02-14 15:04 reading：2691 Continue reading>>
Ameya360: Fibocom’s MediaTek-based 5G Module FG370-EAU
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Ameya360: Fibocom’s MediaTek-based 5G Module FG370-EAU

　　Fibocom FWA-dedicated 5G module FG370-EAU has received CE and GCF certifications successfully. With its high performance and extended capabilities, FG370-EAU is set to empower a various of FWA devices such as:CPE, IDU, ODU, MiFi, UFi, Dongle, etc.　　 Fibocom Wireless Inc., a global leading provider of IoT (Internet ofThings) wireless solutions and wireless communication modules, announces that the FG370-EAU 5G module has received CE and GCF certifications in December 2022. Fibocom FG370-EAU is a FWA-dedicated 5G module designed to provide ultra-reliable connectivity to FWA devices such as: CPE, IDU, ODU, MiFi, UFi, Dongle, etc. It is now fully capable of boosting the global FWA market by receiving both certifications, accelerating the worldwide deployment of FWA devices.　　Compliant with 3GPP Release 16 (R16) standard,Fibocom FG370-EAU based on MediaTek’s T830 chipset platform is designed to empower the 5G FWA market worldwide. By leveraging the powerful quad-core Arm Cortex-A55 CPU, FG370-EAU supports 4CC CA (Carrier Aggregation) and up to 300MHz of spectrum, as well as 2CC CA and up to 200MHz of spectrum, which improves the utilization of spectrum resources and ensures an extended 5G coverage. Helping customers to improve the device performance and enhance 5G network experience.　　It is worth mentioning that the 5G Sub-6GHz module FG370 supports 8RX (Receive Antennas) and Power Class 1.5 (PC1.5) High Power User Equipment (HPUE), significantly improving data transmission performance up to 7.01Gbps on the downlink and 2.5Gbps on the uplink. With the enhancements, FG370 is featuring to offer three combinations for FWA application scenarios, unleashing the extreme wireless experience and consistent low latency.　　5G Cellular + Tri-band 4×4 Wi-Fi 7 (BE19000) for 5G IDU Solution　　5G Cellular + Dual-band 2×2 Wi-Fi 7 (BE6500) for 5G ODU Solution　　5G Cellular + Ethernet 10Gbps for Wired Solution　　“Obtaining the CE and GCF certifications ensures Fibocom’s commitment to provide the best-in-the-market products and solutions to our customers worldwide,” said Simon Tao, General Manager of MBB Product Management Dept., Fibocom. “Fibocom FG370-EAU is one of the most selected solution by major FWA device vendors in the global market, with continuous efforts, we believe that we will help customers to achieve great success in future.”　　The engineering sample of FG370-EAU is now ready for international shipping.
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Release time：2023-02-14 15:00 reading：2792 Continue reading>>
MediaTek to Win the 5G Competition by Alliance and Independent R&D
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MediaTek to Win the 5G Competition by Alliance and Independent R&D

　　The 3GPP standard conference will be held in Taipei, Taiwan, next week. To foster the local 5G supply chain in Taiwan, MediaTek, a key organizer of the conference, strove for keeping the event to be held in Taiwan with the aim of developing universal standards. Huang He-qi, general manager of the design and development department of MediaTek's communication system, pointed out that for the current situation of 5G, MediaTek will adopt the countermeasures of "wide-scale alliance and independent R&D".　　The 3rd Generation Partnership Project (3GPP) is a standard organization dedicating to the development of 5G mobile communication in the world. There are more than 200 international companies participate in and even been called the Olympia Committee of communication standards. Because the standard drafting is like a tug-of-war match, major international companies are hoping to stand in a favorable position to seize the opportunity. Huang He-qi described: "It is a kind of competition, and everybody has their own strategies in it."　　He pointed out that because each company has its technical position, therefore they will push their own technical proposals in the specifications to win its best interests. Huang explained that by pushing the proposal into a standard, in addition to being able to apply for a patent, it is also beneficial for the company to establish a technical threshold, so that competitors have no way to break through, and thus make their products more competitive.　　Facing of this situation, Huang said that MediaTek will take the countermeasure of " wide-scale alliance and independent research" strategy. But he pointed out that the forming alliance is only a short term approach, and more importantly is to build deep technology and with flexible strategies.　　MediaTek emphasizes that the development of 5G technology should not be a solo play, but needs to join hands with industrial partners to create an ecosystem.　　Huang said that the Release 15 version was released in December last year. This year, it will be adjusted for more detail. The Release 16 version is expected to be announced in March 2020. He revealed that MediaTek is also expected to launch related products in 2020 to meet customer needs.
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Release time：2019-01-21 00:00 reading：1259 Continue reading>>
MediaTek Launches Newest Combo Chip with Wi-Fi 6 and AP+Bluetooth
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MediaTek Launches Newest Combo Chip with Wi-Fi 6 and AP+Bluetooth

MediaTek announced its newest intelligent connectivity chipset to support the next generation of Wi-Fi technology - Wi-Fi 6 (802.11ax) - for home and enterprise wireless network services. It will support a range of products including wireless access points, routers, gateways and repeaters, bringing faster and more reliable connectivity throughout the smart home.MediaTek’s Wi-Fi 6 chips support 2x2 and 4x4 which comply with the most updated standards. The Wi-Fi 6 chip also has a flexible architecture to support updated features when the Wi-Fi 6 specification is finalized later in 2019.“Consumers rely on our high performance connectivity portfolio to power their favorite intelligent devices, and now with support for next generation Wi-Fi 6 we deliver an even more, robust and seamless connectivity experience,” said Jerry Yu General Manager of MediaTek’s Intelligent Devices business unit. “We will continue to innovate and bring the most advanced technology and standards to consumer and enterprise markets.” MediaTek currently holds market-leading positions in powering TVs, streaming devices, smart speakers, voice assistant devices and tablets.MediaTek also brings unique built-in solutions to its chipset along with meeting the newest Wi-Fi standard to improve the end-users experience. MediaTek connectivity technology, empowered with OFDMA, 1024QAM solves data traffic conflicts. It reschedules multi-user’s packets and provides a higher internet data rate so there is no lag while playing on-line games or streaming video.It also delivers better concurrent performance between Wi-Fi and Bluetooth with the latest Wi-Fi 6 access point + Bluetooth combo chip to guarantee spectrum efficiency when two radios work simultaneously.MediaTek also supports and is leading the deployment of the Wi-Fi Alliance EasyMesh standard for extended Wi-Fi coverage. MediaTek’s family of smart home chipsets will be EasyMesh compatible. The new standard extends the Wi-Fi signal for total access in the home or even into the backyard.
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Release time：2019-01-11 00:00 reading：1119 Continue reading>>
<span style='color:red'>Mediatek</span> Targets China, Snapdragon
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Mediatek Targets China, Snapdragon

Mediatek announced its next-generation smartphone SoC just one week after archrival Qualcomm did the same. The Helio P90 falls short of the Snapdragon 855 in many respects but is likely to provide fierce competition a notch below flagship handsets, especially among China’s cost-conscious OEMs.Made in a 12-nm node, the P90 sports two Cortex-75 cores running at up to 2.2 GHz and six A55 cores at 2.0 GHz. By contrast, the 7-nm Snapdragon 855 uses four large cores, one running up to 2.84 GHz and three at 2.42 GHz, and four of the A55 cores at 1.80 GHz.Mediatek switched from a 4 × 4 configuration in its former P70, in which it ran A73 and A53 cores at 2.1 and 2.2 GHz, respectively, apparently not wringing much speed gains out of the 12-nm process. The use of a 2 × 6 configuration signals a strategy focused more on power efficiency.In connectivity, the P90 supports LTE Category 13 with 3× carrier aggregation (CA) up from Cat 7 with 2× CA, claiming downloads at up to 600 Mbits/s. It also supports 802.11ac Wi-Fi with 2 × 2 MIMO.For its part, the Snapdragon 855 integrates a Category 20 LTE modem supporting 7× carrier aggregation and two flavors of Wi-Fi — the 60-GHz 802.11ay and the pre-standard .11ax, both claiming to be capable of 10-Gbit/s data rates. In addition, Qualcomm pitches the 855 with its separate 5G modem, powering first-generation 5G handsets from Samsung and OnePlus early next year in sub-6-GHz and millimeter-wave bands.Mediatek has an M70 standalone 5G modem, but “we’re not certain how widely it will be made available commercially … we’re looking at going directly to an integrated SoC product rather than a standalone modem and focus on sub-6 GHz, aiming for customer products launching in late 2019 or early 2020,” said Russ Mestechkin, senior director of sales and business development at Mediatek.“Our focus is to commercialize our SoC for mainstream handsets at $500+ as opposed to ultra-premium models at $1,000+,” he added.Mediatek won sockets in the 2016 and 2017 models of China’s rising handset makers, but Qualcomm has been regaining ground with them this year. It’s a pitched battle in which Mediatek is “starting to win back share with Xiaomi and Vivo … Oppo and Vivo are also using its P50 in mid- to high-end products, which will bear fruit in 4Q18,” said Phil Solis, who tracks handset SoCs at International Data Corp.When it comes to 5G, “I expect they will gain back some market share by 1H20, but they are far behind” he said. “In the meantime, Mediatek will focus on its growth areas of smart speakers, TVs, IoT devices, and other consumer products for their processors and connectivity.”Both Mediatek and Qualcomm made AI acceleration a focus in multiple blocks of their latest chips.For the P90, Mediatek doubled the size of the so-called APU in the P70, which includes multiply-accumulate arrays for running machine-learning jobs. It also added a proprietary AI accelerator. The two blocks, combined with a PowerVR GM 9446 GPU running at 970 MHz, deliver 1,127 GMACs/s with software optimizations still ahead.The number falls far short of the 7 Tera tensor operations/s on 8-bit integer jobs that Qualcomm claims for its 855. But both sides agree that the benchmarks are less telling than performance on actual AI workloads, which vary widely.The Helio P90 beat the Snapdragon 845 and others on one AI benchmark. Click to enlarge. (Source: Mediatek)Mediatek is focusing on deep-learning applications such as face detection, object and scene identification, and accelerating augmented and virtual reality. Its NeuroPilot software can dynamically assign AI jobs and supports third-party frameworks, said the company without listing which ones.The P90 can drive dual 24- and 16-MP cameras or one 48-MP camera with video capture at up to 30 fps. It includes dedicated blocks to speed face recognition as well as accelerators for processing 3D depth maps, multi-frame noise reduction, and lens correction.
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Release time：2018-12-14 00:00 reading：1247 Continue reading>>
MediaTek Adopts Qualtera’s Silicondash Platform to Enhance Semiconductor Yield and Quality
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MediaTek Adopts Qualtera’s Silicondash Platform to Enhance Semiconductor Yield and Quality

Qualtera today announced that MediaTek’s deployment of Qualtera’s Silicondash Smart Manufacturing Platform has gone live in June 2018 and is now handling the manufacturing operations. Silicondash is used as MediaTek’s primary corporate data analytics solution with data integration across the global supply chain of worldwide manufacturing and test suppliers. With a vision to further enhance manufacturing excellence, MediaTek has implemented Silicondash to further improve overall operational efficiency, yield management, quality control and IC-level traceability.The Silicondash Big Data platform uses embedded expertise, algorithms, analytical engines, machine learning techniques for data preparation, automated analytics and decision-making. Silicondash cloud-based technologies and collaborative features ensure effective collaboration with supply chain partners so that issues can be detected early and appropriate actions are taken swiftly.Qualtera EVP Marketing and Asia Business Operations, Paul Simon comments, “We have been collaborating with MediaTek since November 2017 and I am delighted to see that the Silicondash platform is now in high volume production handling analytics and IC level traceability across the manufacturing volume of MediaTek’s supply chain. The platform’s mix of real-time data collection, stream computing and big data analytics engines provides a host of high speed data visualizations, analytics and modeling capabilities giving semiconductor manufacturers and their supply chain partners the opportunity to improve operational KPIs, yields and product quality”
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Release time：2018-12-11 00:00 reading：1391 Continue reading>>
Qualcomm, MediaTek eye slice of India’s IoT market; focus on NBIoT
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Qualcomm, MediaTek eye slice of India’s IoT market; focus on NBIoT

US-based chipmaker Qualcomm and Taiwan’s MediaTek are betting big on India’s Internet of Things (IoT) market, and are said to be working with various device makers and telecom service providers to drive the IoT ecosystem in India, especially focusing on the narrow-band IoT (NB-IoT) segment.“We do see a big potential in the IoT space, especially NB-IoT. We are one of the leading players as the processor vendors for NB-IoT. The progress is critical,” MediaTek India's country head for corporate sales international Kuldeep Malik, told ET. He said that MediaTek already has an IoT ecosystem ready with its module or device vendors.Jim Cathey, SVP and president, APAC & India, Qualcomm recently told ET that the company is focused on driving IoT through its collaboration with small startups to enable consumer and industrial IoT along with smart city use cases in India.Qualcomm’s director of business development, Uday Dodla separately said that the company has been building an “effective ecosystem of OEM and ODM collaborators to serve both consumer and industrial IoT segment.”In India, Qualcomm is collaborating its device partners to serve both consumer and industrial IoT segments, across applications like smart wearables, vision-intelligent cameras, extended reality devices, point-of-sale products and smart energy metering. It also has a “Design in India” program to give a push to the IoT space.Mukesh Ambani-led Reliance Jio’s NB-IoT network is already live in cities like Mumbai, while other telcos like Vodafone are mulling over launching their respective NB-IoT networks in the country.Analysts say that NB-IoT reduces device complexity, enables multi-year battery life, and provides deep coverage to reach sensors and meters in challenging locations such as remote rural areas or inside buildings.Qualcomm’s Dodla said that NB-IoT is important as the stakeholders work towards designing smarter cities and buildings. “For Qualcomm, IoT and security represent one of our largest serviceable addressable opportunities in 2020,” he said.India's IoT Policy drafted by the Ministry of Electronics and Information Technology has set an ambitious goal to create a $15 billion IoT industry in India by 2020. “Qualcomm is well poised to be a leading contributor towards that intent,” Dodla said.Both chipmakers are currently working with Indian telecom operators for certification, and compliance testing of devices on their IoT networks.MediaTek said that that it is working with its device partners to conduct interoperability tests with Indian telecom operators, and is targeting various segments with various partners.“Once certification and compliance testing is done, deployment will happen,” Malik said.Qualcomm’s solutions and close association with Indian network operators help OEMs provide devices that bridge between traditional cellular technologies and newer technologies like LTE- IoT, Dodla said.There are times where there is a huge load in terms of users in a particular area. These AI-powered technologies can identify patterns and with the inclusion of IoT, these systems can effectively know, with the precise data available, how to route traffic. SK telecom's Telecom Advanced Next Generation Operational Supporting System (TANGO) uses big data analytics and machine learning to improve traffic management and network operations more broadly.In India, MediaTek is driving discussions with its ODM and OEM partners for the deployment of smart meters and tracking solution with GSM fallback. It also sees a big revenue opportunity in the country’s smart city project that aims to transform 100 cities.“A lot of discussion is happening on prepaid meters when it comes to smart city project. These re key areas we see huge potential. For the smart city projects, our device partners bid for tenders and participate in RFPs, and we support them accordingly,” Malik said.Qualcomm’s Dodla said that the Indian IoT ecosystem is poised to grow rapidly, supported by the government’s heightened focus on developing Smart City projects and Digital India campaigns. “The emergence of smart homes, increasing internet penetration and a strong community of tech-savvy professionals and population will also drive the growth,” he added.Malik, however, said that the IoT market is “fragmented and unorganized”, and it will only start to shape-up properly by early next year.As per consultancy firm Deloitte, the IoT units in India are expected to see a growth of 31 times to reach 1.9 billion in 2020 from its current base of 0.06 billion. In terms of revenue, this opportunity could represent $9 billion by 2020 from $1.3 billion in 2016 -- a growth of 700%. 
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Release time：2018-07-25 00:00 reading：1017 Continue reading>>
MediaTek Introduces New Helio A Series Chipset Family for Mid-Market Affordable Smartphones
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MediaTek Introduces New Helio A Series Chipset Family for Mid-Market Affordable Smartphones

MediaTek today unveiled its Helio A series, expanding its Helio family of feature-packed and power-efficient chipsets with the company's new Helio A22 system-on-chip (SoC). MediaTek's commitment to continuing to "change everything" can be seen throughout the "Advanced" Helio A series and its mission to power more innovative and more capable smartphones designed to meet the demands of today's mid-market consumer.The Helio A series is optimized for devices that offer a great value without sacrificing modern capabilities and features. MediaTek's new Helio A22, the first chipset in its Helio A Series, is set to redefine what consumers can expect and demand in their smart devices."The Helio A Series continues our vision of a mobile marketplace that is accessible to everyone, where high-end features are not limited to high-end devices. As we've seen, mid-market growth continues to explode and there continues to be consumer interest in powerful and quality devices that offer them the best value," said TL Lee, General Manager of MediaTek's Wireless Communication business unit at MediaTek. "With Helio A22, device makers can bring to market innovative devices that provide consumers unparalleled mobile experiences in the mid-range, including incredible performance, long battery life and advanced photography and AI enhancements."The Helio A22 is built with advanced 12nm FinFET fabrication technology to deliver high performance with greater power efficiency. Equipped with MediaTek's CorePilot technology, the chipset optimizes power for each task to extend device battery life, enabling users to do more with their devices for longer. Helio A22 also has AI features to take advantage of the MediaTek NeuroPilot software development kit (SDK) extensions and third-party AI applications.MediaTek's Helio A22 offers exceptional camera capabilities, taking photography to the next level with AI enhancements. The chipset supports up to 13+8 megapixels dual-camera setups at 30 frames per second (FPS) and a single camera operating mode of up to 21 megapixels. Device makers can create stunning, large-screen devices with the Helio A22's 20:9 HD+ display support.The chipset supports the latest AI frameworks, including Google Android Neural Networks API (Android NNAPI), so developers can seamlessly build AI applications for Helio A22-powered devices.Advanced connectivity is at the heart of the Helio A22 with an innovative RF design for Bluetooth and Wi-Fi co-existence. The chipset both Cat-4 and Cat-7 4G LTE performance for fast connectivity and packs a dual 4G SIM with VoLTE and ViLTE. Also A22 supports both LPDDR3 and the newer, faster LPDDR4 for more customer design flexibility.The Helio A22's GNSS location enhancements enable 57 percent faster TTFF, a 10 percent improvement in accuracy and up to 24 percent lower power operation compared to previous generation chipsets. With 802.11 ac Wi-Fi, MediaTek's Helio A22 offers higher bandwidth and throughput, resulting in improved online gaming, multimedia and communications experiences for users. Also, the chipset supports BT5.0 for longer transport distance and higher speeds suitable for smart home devices.The Helio A Series is in volume production now with the availability of the Helio A22-powered Xiaomi Redmi 6A in China.
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Release time：2018-07-18 00:00 reading：1311 Continue reading>>
MediaTek to deploy 5G modem 'Helio M70' in 2019
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MediaTek to deploy 5G modem 'Helio M70' in 2019

Mobile phone chipmaker MediaTek on Tuesday announced its first 5G modem "Helio M70" which, the company said, would be ready for commercial deployment in 2019."Commercial availability of the modem would start from 2019. Some of the partners are Nokia, NTT Docomo and Huawei," Joe Chen, President, Mediatek, told reporters here.Notably, Helio M70 would be a new "radio modem" for 5G and the upcoming modem would provide a speed of 5Gbps.The upcoming modem would also "support critical carrier features".According to MediaTek, the modem would be available as a discrete solution.The company will also launch an integrated SoC with a 5G modem but it might not come with the Helio M70.Regarding the smartphones that would feature Mediatek's recently-launched Helio P22 processor, Chen said: "The company cannot reveal the name of the devices."He, however, added that the mobile phone makers themselves would announce the same.Expanding its "Helio P" family of power-efficient chips for mid-range devices, MediaTek launched Helio P22 processor in India last month.MediaTek Helio P22 is the first to bring the 12nm manufacturing process to the mid-range mobile segment.With P22 chipset, the chip maker would offer the benefits of Artificial Intelligence (AI) accelerated experiences, brilliant photography and reliable, high-speed connectivity to more affordable devices, thus, expanding the "new premium" market.
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Release time：2018-06-06 00:00 reading：1228 Continue reading>>
MediaTek launches Helio P22 chip for mid-range devices
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MediaTek launches Helio P22 chip for mid-range devices

MediaTek Helio P22 is the first to bring the 12nm manufacturing process to the mid-range mobile segment. According to the company the P60 has already seen strong customer adoption, including with Vivo and Oppo device launches in India and China. "With support for high-quality dual camera photography, AI enhancements, and incredible power efficiency, the Helio P22 sets a new bar for accessibility to premium features. We expect continued device maker wins and consumer growth in this segment with MediaTek's new Helio P22 chipset," TL Lee, General Manager, Wireless Communication Business Unit, MediaTek. Helio P22 delivers the benefits of AI at a remarkably affordable price. AI accelerated camera experiences including Face ID, smart photo album, and single-camera as well as the dual-camera depth of field features are all supported, the chip maker said. Helio P22 also supports incredible photography and outstanding connectivity on dual 4G SIM cards. The chipset's octa-core Arm Cortex A53 processors operate up to 2.0 GHz and offer sustainable high CPU performance while requiring low power inputs. In addition to that, the Helio P22 brings hardware-driven dual-camera support for 13+8 megapixel setups at a fast 30 frames per second (FPS). With a low-power, highly capable hardware depth engine for real-time Bokeh preview, the chipset is equipped to minimize grain, noise, aliasing, chromatic aberration and more; enabling crisp and clear images under varying lighting conditions. Advanced 3A and MediaTek's Camera Control Unit (CCU) hardware with high auto-exposure convergence speeds allow for users to capitalize on quick-capture moments on the move. Additionally, 20:9 HD+ (1600 x 720) display support can create beautiful, full-screen smartphones. Users can enjoy the fast LTE connectivity on both SIM cards and 802.11ac WiFi for high Internet throughputs. Helio P22 also supports BT5.0, the latest version of the Bluetooth wireless communication standard, and a 4-Satellite system GNSS allows for faster, more efficient and more accurate connectivity locally and globally. The Helio P22 is in volume production now, and is expected to be available in consumer devices by the end of Q2 2018, Mediatek added.
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Release time：2018-05-25 00:00 reading：1092 Continue reading>>

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