SIMCom Powers Smart Terminals with <span style='color:red'>5G</span> + Wi-Fi 7 for Commercial Applications
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SIMCom Powers Smart Terminals with 5G + Wi-Fi 7 for Commercial Applications

　　As AI-driven smart devices evolve, reliable connectivity remains essential for advanced applications. During MWC25 and EW25, SIMCom introduced its 5G + Wi-Fi 7 wireless communication solution, engineered for smart router applications. This solution delivers solid performance, fast speeds, and dependable wireless communication, and it is already being used in commercial products to help manufacturers optimize both cost and time-to-market.　　5G + Wi-Fi 7: Unlocking the Full Potential of Smart Terminals　　Based on the Qualcomm® Snapdragon™ X62 5G Modem-RF System, a key component of the world's first 3GPP Release 16 modem-RF family. Designed with an upgradable architecture, this technology enables rapid commercialization of 5G Release 16, extending 5G connectivity to various applications, including mobile broadband, fixed wireless, industrial IoT, and private 5G networks. By integrating Wi-Fi 7, this solution enhances the wireless experience for smart devices, providing higher capacity, lower latency, and greater efficiency.　　Showcasing Real-World Applications　　During MWC25 and EW25 , SIMCom partnered with LUXSHARE ICT to demonstrate the real-world capabilities of 5G + Wi-Fi 7. A key highlight was the 5G CPE BE17000 Wi-Fi 7 Mesh Router, featuring SIMCom's SIM8262E-M2 module. By inserting a 5G SIM card, this router utilizes advanced 5G connectivity, allowing users to share ultra-fast networks with multiple Wi-Fi devices. The Wi-Fi 7 Mesh technology further enhances:　　● Network coverage and capacity　　● Ultra-HD streaming without buffering　　● Lightning-fast file downloads　　● Seamless video conferencing and online collaboration　　This deployment underscores SIMCom's commitment to delivering high-speed, uninterrupted connectivity for AI-driven applications, addressing the increasing demand for reliable smart networking solutions.　　( 5G CPE BE17000 WiFi 7 Mesh Router with LUXSHARE ICT )　　Global 5G Adaptability for Diverse Market Needs　　One of the key advantages of SIMCom’s 5G + Wi-Fi 7 solution is its ability to support both NSA and SA network architectures, ensuring robust cellular performance and high data transmission rates. The Snapdragon X62 5G Modem-RF System enables full compatibility with global 5G frequency bands, covering high, mid, and low spectrum ranges. This allows SIMCom to offer customized regional solutions, catering to the specific connectivity requirements of different global markets.　　Driving the Future of Smart Connectivity　　With the integration of 5G and Wi-Fi 7, SIMCom is revolutionizing AI-powered smart terminals, enabling faster, more intelligent, and always-connected experiences. As AI-driven applications continue to expand, high-speed, stable, and adaptive connectivity will play a pivotal role in unlocking new possibilities across industries.　　By leading the way in advanced 5G and Wi-Fi solutions, SIMCom empowers device manufacturers, businesses, and end users to fully embrace the next generation of smart, connected experiences.　　About LUXSHARE ICT:　　Established on May 24, 2004, Luxshare Precision successfully listed on the ChiNext Board of Shenzhen Stock Exchange on September 15, 2010 (stock code: 002475). The Company is committed to providing integrated intelligent solutions, parts, modules and systems for enterprise communication products (high-speed interconnect, optical module, heat dissipation module, base station antenna, base station filter), consumer electronic products (TWS wireless headphones, smart wear, wireless charging module, 5G router, VR headsets, smart speaker), and automobile systems (automobile wiring harness, connector, intelligent cabin, intelligent driving) and central gateway, etc　　About SIMCom:　　SIMCom Wireless Solutions Limited is a global leading IoT wireless modules and solutions supplier. Since established in 2002, SIMCom has been fully committed to providing a variety of wireless modules and terminal level solutions worldwide, such as 5G,4G, LTE-A, LTE-M(CAT-M1), NB-IoT, 3G, 2G, and GPS/GLONASS/BEIDOU satellite positioning technology.　　SIMCom insists on providing high-quality modules and industry solutions. With 23 years of professional technical innovation and service experiences, it continuously meets the needs of customers in all industries of the Internet of Things. While deepening the vertical industry, we continue to define advantageous products and build core competitiveness. With the Group's continuous investment in research and development, technology and production, we will continue to innovate and enrich our technology roadmap, and promote the development of the industry in the next few years.
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Release time：2025-03-20 13:58 reading：205 Continue reading>>
MWC Barcelona 2025: Fibocom Launches Qualcomm X85/X82 <span style='color:red'>5G</span> Modem-RF-Powered <span style='color:red'>5G</span> Modules, Enhancing FWA AI Capabilities
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MWC Barcelona 2025: Fibocom Launches Qualcomm X85/X82 5G Modem-RF-Powered 5G Modules, Enhancing FWA AI Capabilities

　　Barcelona, Spain – March.4th 2025 - Fibocom (Stock code:300638), a global leading provider of AIoT solutions and wireless communication modules, announced the launch of its new 5G modules and solutions based on Qualcomm Technologies, Inc.s latest Qualcomm® X85/X82 5G Modem-RF. These new solutions are set to help industry customers seamlessly transition to next-generation Fixed Wireless Access (FWA) technologies and rapidly accelerate the commercialization of new platforms.　　The latest Qualcomm X85/X82 5G Modem-RF delivers significant performance upgrades over the previous X75/X72 generation, including:　　l Supports 3GPP 5G Advanced standards, enabling key 5G Advanced features.　　l Enhanced NR Sub-6GHz downlink carrier aggregation (CA), upgraded from 5CA to 6CA, with carrier bands exceeding 400 MHz.　　l Support for Intra-band ULCA (uplink carrier aggregation) TDD, boosting uplink data rates and optimizing network efficiency.　　l Advanced software capabilities, supporting OpenWRT version 24.x, with compatibility for RDK-B and prplOS.　　l Major AI advancements, including Modem AI functionality and support for external AI NPUs (Neural Processing Units).　　Powered by a quad-core processor, new software suite, and several industry-leading innovations, Fibocom’s 5G modules deliver remarkable capabilities in network coverage, latency, energy efficiency, and mobility. Harnessing advanced AI capabilities, these modules drive 5G FWA solutions to an unprecedented level of intelligence.　　These 5G modules support six-carrier aggregation in the NR Sub-6GHz downlink, offering bandwidth exceeding 300 MHz for faster transmission speeds and broader signal coverage. In addition, Intra-Band uplink carrier aggregation ensures faster data rates, optimizing overall network performance and addressing bandwidth-intensive applications like video conferencing, online gaming, and virtual collaboration.　　In addition to hardware upgrades, the Qualcomm X85 Modem-RF introduces software innovations. The modules will support OpenWRT 24.x, a popular open-source router operating system known for robust features and scalability. Support for RDK-B and prplOS provides users with the flexibility to select the platform that best suits their needs.　　The Qualcomm® 5G AI Suite and Qualcomm® Networking AI Suite combine to deliver QoS management and intelligently prioritized network traffic. These powerful AI Suite capabilities automatically identify high-priority tasks—such as streaming HD video or online gaming—and allocate necessary bandwidth, significantly enhancing the user experience.　　“We are thrilled to collaborate with Fibocom on the launch of their new 5G modules and solutions, powered by our latest Qualcomm X85/X82 5G Modem-RF. Together, we are proud to set new benchmarks with solutions offering exceptional network coverage, low latency, energy efficiency, and enhanced mobility, ultimately paving the way for a more connected and efficient future,” said Gautam Sheoran, VP & GM, Wireless Broadband & Communications, Qualcomm Technologies, Inc.
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Release time：2025-03-20 13:55 reading：216 Continue reading>>
SIM8230: Advanced and Flexible <span style='color:red'>5G</span> Connectivity for Demanding IoT Applications
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SIM8230: Advanced and Flexible 5G Connectivity for Demanding IoT Applications

　　The 5G RedCap specification, introduced in version R17 of the 3GPP standard, addresses the growing need for efficient connectivity in IoT devices that do not require the full performance of 5G. Also known as "Reduced Capability," this technology offers a more cost-effective and energy-efficient alternative to 4G, LTE-M, and NB-IoT.　　RedCap provides an optimal balance between speed and energy efficiency, making it ideal for applications that demand constant connectivity without requiring maximum 5G capacity.　　The SIM8230 module from SIMCom fits perfectly into this context, offering multi-band compatibility, intensive data transmission, and easy integration into IoT devices. Its efficient design meets the needs for economical connectivity, providing a viable solution for a wide range of IoT applications.　　The SIM8230 is a multi-band 5G NR/LTE-FDD/LTE-TDD module that supports 5G SA according to version R17 (3GPP), providing advanced connectivity capabilities. It stands out for its compatibility with a wide range of protocols, facilitating integration into various platforms.　　Compact and Easy to Integrate　　Equipped with interfaces like PCIe, USB 2.0, and GPIO, the SIM8230 offers developers great flexibility to customize their projects. Its LGA format optimizes design and installation, allowing for a more durable assembly and improving heat dissipation, saving space and simplifying installation.　　Rapid 5G Implementation with Minimal Reprogramming　　The compatibility of the SIM8230’s AT commands with the SIM7600/8200/8260 series reduces costs and accelerates time to market. This is especially advantageous for companies that need to implement 5G solutions quickly without requiring extensive reprogramming.　　Additionally, the SIM8230 is based on the Qualcomm X35 platform, which introduces the world's first 5G NR-Light modem-RF system, designed to enhance connectivity at the intelligent edge. This optimized architecture combines energy efficiency and lower complexity design, allowing compact devices to make the most of 5G connectivity. Thanks to its energy- saving features and improved performance, the X35 not only facilitates a smooth migration from LTE CAT-4+ devices but also enables a new wave of use cases for IoT devices, facilitating the rollout of 5G solutions with minimal reprogramming.　　Technical Specifications of the SIM8230　　- The SIM8230 is available in different regional versions to adapt to connectivity needs in various markets: The SIM8230C, SIM8230E, SIM8230G, SIM8230JP, SIM8230NA, and SIM8230SA models are presented in an LGA+LCC format with dimensions of 30.0x30.0x2.5 mm, optimized for compact devices. For M2 formats, the SIM8230C-M2, SIM8230E-M2, SIM8230G-M2, and SIM8230JP-M2 models have dimensions of 42.0x31.4x3.4 mm. Additionally, the SIM8230C-PCIE, SIM8230E-PCIE, SIM8230G-PCIE, and SIM8230JP-PCIE models are available in PCIe format with dimensions of 50.8x31.0x3.6 mm.　　- Supported Frequencies: 5G NR (Sub6G), LTE-FDD, LTE-TDD.　　- GNSS: Compatibility with global navigation systems, ideal for geolocation applications (GPS/GLONASS/BeiDou).　　- Temperature Range: Operates between -40℃ and +85℃, ensuring reliability in extreme weather conditions.　　- Electrical Characteristics: Operates with a voltage of 3.3 to 4.4 V, providing wide compatibility.　　- Data Transfer Performance: Sub-6G SA with speeds of up to 220 Mbps download and 100 Mbps upload; LTE with up to 200 Mbps download and 75 Mbps upload, providing solid performance on LTE networks.　　- Software Functions: Support for protocols such as TCP/IP, IPV4, IPV6, Multi-PDP, FTPS, HTTPS, MQTTS, and DNS, as well as USB/FOTA functionality for remote firmware updates.　　- Interfaces and Connectivity: Includes interfaces such as USB, UART, PCM, GPIO, I2C, and PCIe. Supports SIM cards of 1.8V/2.95V, expanding its compatibility.　　- Certifications: The SIM8230 is currently in the process of obtaining international certifications such as CE (RED), FCC, GCF, PTCRB and MNO TA.　　Versatile and Robust Applications　　The SIM8230 stands out as a key module in CPE and MiFi applications, offering efficient 5G connectivity and FWA access that meet the needs of both industrial and residential sectors. Its optimized design and low energy consumption make it ideal for remote environments, providing high-speed internet access in MiFi devices and converting 5G signals into WiFi in CPE installations.　　Moreover, its versatility makes it a preferred option for emerging sectors such as telemedicine, smart cities, and connected automotive, opening new possibilities for innovative IoT solutions. Its high efficiency, security, and flexibility make it an adaptable solution for future demands, ensuring fast and reliable connections in an increasingly interconnected world.
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Release time：2024-12-19 10:34 reading：613 Continue reading>>
Fibocom Fosters Local <span style='color:red'>5G</span> AIoT Market with Newly Launched <span style='color:red'>5G</span> Module FG370-KR at AIoT Korea 2024
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Fibocom Fosters Local 5G AIoT Market with Newly Launched 5G Module FG370-KR at AIoT Korea 2024

　　wireless communication modules, announces the launch of FG370-KR, a regional version of the FG370 series module, which is positioned to accelerate the commercial development of Korean’s 5G AIoT industries such as Fixed Wireless Access (FWA), live streaming, and industrial automation, etc. By adopting the advancements from FG370-KR, the solution allows local customers to benefit from the seamless 5G experience and fast-to-market industry solutions.　　5G subscribers in South Korea reached around 33 million as of the end of March 2024, according to the latest report from Statista. SK Telecom accounted for 15.9 million of the total 5G subscribers, followed by KT with 9.9 million and LG U+ with 7.2 million. At present, the country accelerates the rollout of commercial 5G services to industry-related field and shows strong growing trends. Fibocom's 5G Sub-6GHz module FG370-KR is compatible with Korea's mainstream 5G frequency bands, supports both 5G SA and NSA network architecture, making it an ideal 5G solution for industry customers that require high-transmission speed, large capacity, and ultra-low latency.　　Developed from the MediaTek T830 chipset platform, the FG370-KR is a 3GPP Release 16 compliant module that adopts a 4nm process integrated with an Arm Cortex-A55 quad-core CPU, leading to a 10% improvement in speed performance compared to the previous generation. In terms of data transmission, FG370-KR supports NR 4CA (Carrier Aggregation) with up to 300MHz bandwidth on the downlink, and NR 2CA in FDD and TDD hybrid mode on the uplink, reaches a maximum speed of up to 7.01Gbps DL and 1.25Gbps UL. In addition, it also supports PC2 of HPUE (High Power User Equipment) technology, significantly enhances 5G uplink capability and network coverage. It is worth highlighting that, FG370-KR can greatly reducing the time-to-market of customers’ devices with the support of a wide range of peripheral interfaces, including three PCI-Express, USB 3.2, two USXGMII interfaces along with software features such as Kernel, OpenWRT drivers.　　“The launch of the FG370-KR signifies that Fibocom will provide a Korea-dedicated solution for local customers, boosting the 5G adoption towards a larger-scale of industries with optimal network connectivity and enhanced operational efficiency, said Simon Tao, VP of Product Management Dept., Head of MBB BU at Fibocom. “We have the confidence in helping enterprises to accomplish the 5G commercialization with our industry know-how and expertise accumulated, without doubt, Korea’s 5G deployment will keep experiencing a fast-growing rate and Fibocom will continually invest in cutting-edge 5G module solutions and delivering superior wireless experience.”　　To learn more about 5G Sub-6GHz module and its demos, welcome to visit Fibocom booth #G101 on the 3rd Floor of Hall D in COEX at the AIoT Korea from October 30 to November 1 2024.
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Release time：2024-12-13 10:55 reading：823 Continue reading>>
Fibocom Accelerates <span style='color:red'>5G</span> RedCap FWA Commercialization by Offering Wi-Fi-Ready Solutions
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Fibocom Accelerates 5G RedCap FWA Commercialization by Offering Wi-Fi-Ready Solutions

　　Shenzhen,China – November 25th 2024 – Fibocom (Stock code: 300638), a global leading provider of wireless communication modules and solutions, today debuts the ready-to-market 5G RedCap plus Wi-Fi 5/6 solution developed from the 5G RedCap module FG131, which is positioned to accelerate the commercialization of 5G FWA in the form of CPE, mobile hot-spot, and USB dongle, etc., satisfying the diverse market demands.　　According to a report updated in September 2024, GSA has identified 143 operators in 61 countries and territories worldwide that have been investing in public 5G SA networks through trials, planned or actual deployments. With the implementation of 5G SA network infrastructure, 5G-enabled FWA shipments became mainstream, reaching 10.2 million in 2023. The growth of 5G FWA CPE shipments is expected to accelerate further, accounting for 42% of shipments in 2024 compared with 34% in 2023, according to the CPE Vendor Survey released by GSA in August 2024.The launch of Fibocom’s ready-to-market 5G RedCap plus Wi-Fi 5/6 solution is the ideal 5G lightweight solution accelerating the migration from 4G FWA to 5G FWA, elevating the Quality-of-Service with faster network connection, more-agile network slices services and reliability in 5G SA network environment.　　Key takeaways　　Advanced 5G RedCap plus Wi-Fi 6 (AX3600): The FG131 5G RedCap module integrates with a Wi-Fi 6 module developed from the Qualcomm WCN6856, reaching maximum 3600Mbps data throughput with the support of 2x2-40MHz@2.4GHz and 2x2-160MHz@5/6GHz dual-band concurrently and the support of 4K QAM for enhanced data transmission efficiency.　　Medium 5G RedCap plus Wi-Fi 6 (AX1800): The FG131 5G RedCap module integrates with a Wi-Fi 6 module developed from the Qualcomm QCA2064, reaching maximum 1800Mbps data throughput with the support of 2x2-40MHz@2.4GHz and 2x2-80MHz@5/6GHz dual-band concurrently.　　Entry-level 5G RedCap plus Wi-Fi 5: The FG131 5G RedCap module integrates with a Wi-Fi module developed from the Qualcomm QCA6174 through a serial port, delivers maximum 867Mbps speed with the support of dual-band 2.4GHz and 5GHz simultaneously.　　Leveraging 5G SA network coverage, optimized power-saving, and reduced complexity, 5G RedCap is gaining more and more attention within the IoT industry. The Fibocom5G RedCap module FG131 offers a high-performance and ultra-reliable wireless solution for application scenarios that are cost-sensitive and power-enduring. Packaged in LGA form factor at the size of 37mm*39.5mm, Fibocom FG131 is pin-compatible with Fibocom LTE Cat 6 module FG101 and FG621 series that allows smooth migration from 4G to 5G RedCap. Compliant with 3GPP Release 17, it supports 5G SA and reaches peak rates of up to 223Mbps downlink and 123Mbps uplink theoretically. With these key features combined, the Fibocom 5G RedCap module FG131 series delivers a new level of 5G network experience while maintaining high reliability and cost-effectiveness, especially for terminal devices used in mobile scenarios. Apart from the hardware optimization, FG131also supports the OpenCPU and OpenWRT software features and an abundant of rich interfaces to realize the flexible and easy integration of FWA devices.
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Release time：2024-12-11 13:26 reading：669 Continue reading>>
simcom：MWC Shanghai 2024: A New Avenue for <span style='color:red'>5G</span> Popularization
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simcom：MWC Shanghai 2024: A New Avenue for 5G Popularization

　　Under the theme "Future First," as we all know, 5G-Advanced is the next step in the evolution of cellular technologies, enabling advanced use cases for various verticals such as government and security, transportation, oil and gas, airlines and logistics, and healthcare to realize the full potential of 5G.　　As a hallmark technology of 5G evolution, RedCap has garnered extensive attention from the industry since its inception during MWC Shanghai. 5G RedCap offers advantages such as lowering the complexity, cost, size, and power consumption of 5G products. This not only fills the middle ground of 5G capabilities but also opens a new avenue for 5G to empower various industries.　　At MWC Shanghai, SIMCom aims at 5G ultra-high-speed scenarios and has the 5G module series SIM8270 and SIM8390, providing a maximum speed of over 10Gbps. These modules are suitable for applications that have strict requirements on speed and latency, such as broadband access, video monitoring and industrial control.　　Also, SIMCom has launched the SIM8230 and SIM8230-M2 series RedCap modules based on the Qualcomm platform. The SIM8230 module supports multi-frequency bands for 5G R17 SA, comes with a variety of functional interfaces for external device expansion, and boasts advantages such as lightweight, energy efficiency, compactness, and cost-effectiveness. It can be widely utilized in various domains including 5G CPE, wearable devices, industrial routers, high-definition streaming devices, AR/VR, drones, and remote-controlled robots.　　SIMCom has already fully deployed and accelerated the commercial scale of 5G RedCap. As market recognition of RedCap technology continues to increase, the popularization of 5G will further accelerate. SIMCom is committed to developing more diverse and reliable products based on advanced technology, promoting the large-scale commercialization of technologies like 5G RedCap, and contributing to the digital transformation and development of various industries with 5G technology.
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Release time：2024-08-27 15:56 reading：831 Continue reading>>
Fibocom Builds AI-specialized 'π' Shape Strategy upon <span style='color:red'>5G</span>, AI, IoT to Empower Industry Transformation
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Fibocom Builds AI-specialized 'π' Shape Strategy upon 5G, AI, IoT to Empower Industry Transformation

　　The wave of intelligence is revolutionizing industries globally, with 5G, AI, and IoT playing key roles in this trend. During Computex 2024, Fibocom CEO - Tiger Ying shared his insights during the tradeshow.　　Fibocom, as China's first stock-listed wireless communication modules and solutions provider (stock code: 300638), has continuously employed innovative thinking and strategic market positioning in recent years. CEO Tiger Ying pointed out that, regardless of the technological or application aspects, in facing the transformative effects brought by these three major technologies, the company is well-prepared and ready to assist clients in seizing vast smart business opportunities.　　Remain Industry-Focused and is Confident to Accelerate 5G Deployment　　In the realm of 5G, this communication standard garnered significant market attention upon its release. The industry believes that 5G'sfeatures such as high speed, low latency, and large-scale connectivity not only enhance user experiences in the consumer sector but also serve as a crucial driver for deepening communication technology applications across industries.　　While the development of 5G has not been as fast as initially expected, communication giant Ericsson predicted in its 2023 report that the golden crossover period between 4G and 5G would be delayed until 2028.However, Tiger Ying pointed out that from the perspective of technical standards' development speed, this delay is still within a normal cycle.　　He mentioned that 5G's current development is focused on Enhanced Mobile Broadband (eMBB), Massive Machine Type Communications (mMTC), and Ultra-Reliable Low Latency Communications (URLLC). However, large-scale commercialization has not been achieved. This trend also highlights the versatility of 5G IoT architecture and applications.　　With the acceleration of 5G Advanced, it will truly replace4G as the mainstream technology for IoT applications and successfully drive market development within five years.　　Fibocom has responded to the trend of 5G development by formulating product strategies and solutions, actively expanding into different market sectors. Tiger Ying stated that the company's primary task is to promote the large-scale commercialization process of eMBB.　　They have already launched a diverse range of product portfolios. This includes the RedCap module, closely following the development of 5G technology and fully advancing the implementation of commercial plans.　　In terms of application areas, Fibocom is focused on industrial intelligence and smart cities, primarily because these two major application scenarios have diverse demands for 5G technology. For instance, in machine vision, which integrates edge computing with 5G's high bandwidth and low latency capabilities, it has been widely used in industrial quality inspection, promoting the development of industrial automation and intelligence.　　In response, Fibocom provides a complete product portfolio, such as the 5G smart module SC171 with computing power up to 12TOPS, to meet specific demands in application scenarios. In addition, endpoint devices with AI capabilities will also become a driving force in accelerating industrial intelligence processes.　　Fibocom has invested significant research and development resources in these products, aiming to integrate 5G and on-device AI technologies, thus strengthening the company's core competitiveness in industrial intelligence and smart city domains.　　Strengthening Edge AI Performance to Optimize Overall Cost-effectiveness　　AI has become a recent global industrial focus, and Fibocom's AI strategy centers on edge computing and the AI endpoint device solutions mentioned above. Since AI computing power can significantly increase the cost of endpoint devices, leading to reluctance from enterprises with implementation needs, cost control is crucial.　　Tiger Ying pointed out that the solution to this problem varies depending on the AI architecture. Devices using an offline AI architecture require precise control of edge computing power to balance cost and effectiveness, while devices using an online AI architecture require strong communication capabilities to avoid affecting user experience due to communication delays.　　Tiger Ying further stated that Fibocom has integrated the above two solutions into one through long-term research and development. The company has invested in smart module development, leveraging the computational efficiency and heterogeneous algorithm capabilities of modules to assist clients in rapidly deploying AI-capable terminal devices and optimizing costs.　　Its product portfolio includes 5G data modems, SoC 5G solutions based on Linux, and Android, and built-in AI computing capabilities. He mentioned that while AI may slightly increase device costs, its excellent performance leads to overall cost optimization considering macroscopic aspects such as user experience and value creation.　　He also mentioned that Fibocom has constructed heterogeneous computing on the network, enabling the scheduling of CPU, GPU, NPU, and DSP processor performance as needed. In addition, Fibocom has developed its toolchain and integrated it with heterogeneous algorithms, RTK, high-precision positioning, and other functions into firmware.　　Its products based on Linux, Android, and Windows architectures can meet the needs of different industry customers. Looking ahead, Fibocom will focus on areas such as robotic lawnmowers, low-speed autonomous vehicles, PCs, and robotic development platforms, providing deeper vertical domain solutions.　　Enhancing π-shaped Capabilities to Meet Three Major IoT Demands　　Regarding IoT, Tiger Ying pointed out that although the IoT architecture and concept have been around for over a decade and have become increasingly widespread in recent years, practical constraints mean that adoption varies across industries. To accelerate IoT adoption, several key factors are necessary.　　First is the ability to apply AI capability to IoT devices, as AI significantly impacts data collection costs and processing quality. IoT leveraging AI will be more readily accepted by enterprises, thus speeding up adoption in specific fields.　　Second is security design, which has become a major focus in IoT in recent years. Only IoT architectures that can ensure data integrity and privacy protection will be able to deploy in vertical markets.　　Lastly, communication technology is crucial. Advanced technologies like 5G-Advanced (5.5G) and Non-terrestrial Networks (NTN) ensure that communication coverage is no longer a weak point, broadening the scope of IoT applications.　　Fibocom has introduced corresponding products to address AI, data privacy, and satellite communications needs. In terms of AI, the company's 5G smart module SC171 and SC151 series are suitable for various 5G smart terminal devices.　　For security, blockchain technology was deployed on 4G networks and commercialized. On the satellite communications front, Fibocom released NTN-supported communication modules in 2023.　　Moving forward, the company plans to integrate these technologies and products, working with ecosystem partners to focus on specific vertical solutions, providing customers with high-quality and high-performance IoT solutions.　　Fibocom consistently prioritizes intelligence in product innovation. Tiger Ying stated that this will continue to be the foundation for future development, with a market-driven approach to introducing cross-domain AI solutions.　　He emphasized that while the market previously demanded "T-shaped" capabilities combining vertical telecommunication expertise to serve the horizontal industries, the AI era requires an additional vertical capability—AI specialization. Through "π-shaped" capabilities, which integrate horizontal and dual vertical expertise, Fibocom aims to create high-performance IoT architectures tailored to customers' needs.　　The company is progressively enhancing these "π-shaped" capabilities. It will continue to collaborate with ecosystem partners, integrating 5G, AI, and IoT technologies to help clients seize smart business opportunities.
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Release time：2024-06-06 11:47 reading：1024 Continue reading>>
Fibocom’s <span style='color:red'>5G</span> RedCap Module Solution to Ensure the Predictable Growth of <span style='color:red'>5G</span> FWA
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Fibocom’s 5G RedCap Module Solution to Ensure the Predictable Growth of 5G FWA

　　Introduction　　The latest statistic from GSA’s 5G Infographic reveals that as of August 2023, there were 265 commercial 5G launches globally, and 543 operators are investing in 5G network rollout. Driven by technological innovations, it is expected to add new 5G network deployments in more than 30 countries in 2023, most of which will be 5G standalone networks. While the operators are propelling the implementation of 5G infrastructure, the adoption of 5G applications will be presented in a more mature business model for consumers, and enterprises to engage in the beneficiary bandwidth and millisecond latency.　　Another statistic from GSA has identified 535 operators from 186 countries and territories are providing FWA service using LTE or 5G worldwide. These powerful figures also mark the stance of FWA as the "Killer App" in 5G's commercialization attributed to the rapid deployment in recent years.　　Why RedCap and How to Position the Role in the FWA Market?　　The evolution of 5G technology is an ongoing process, from 3GPP Release 15 to 17, every evolution empowers 5G with multiple advancements. RedCap was introduced under the category of 5G NR in 3GPP Release 17 but leveraged fewer 5G NR capabilities for the balance of 5G functions and costs. This new tier of 5G will technically contribute to the acceleration of the 5G use cases adoption rate by providing optimized hardware design, extended battery life, lower power consumption and better spectrum utilization.　　Source: Ericsson FWA Handbook 2023 Edition　　FWA (Fixed Wireless Access), is addressed to close the digital divide and offer fiber-like wireless connectivity services eliminating the barriers led by geography locations. 4G FWA has benefited from the comprehensive 4G infrastructure built in the past ten years, the shipment accounted for more than 70% of the total FWA device shipments. Driven by the implementation of 5G network deployments, 5G share is predicted to exceed 4G in the next few years, and the 4G existing market will seek for a 5G solution for smooth transition. Therefore, 5G RedCap is considered to be the ideal solution to take over the 4G FWA market with the multiple enhancements introduced at the beginning.　　Fibocom’s 5G RedCap Module Solution to Ensure the Predictable Growth of 5G FWA　　As the industry-leading provider of wireless modules and solutions, Fibocom launched the 5G RedCap module solution for the global FWA market earlier this year. Integrated with Snapdragon X35 5G Modem-RF, which is the world's 1st 5G NR-Light Modem-RF, Fibocom FG131 is a high-performance RedCap module with a maximum peak rate of up to 226Mbps on the downlink and 121Mbps on the uplink in 5G SA. Furthermore, it is also backward compatible with LTE networks, delivering up to 195Mbps downlink and 105Mbps uplink speed. Adopting an LGA form factor measured at 39.5*37mm, the package ensures the 100% compatibility of Fibocom LTE Cat 6 module series FG101 and FG621, and is also pin-compatible with Fibocom LTE Cat 4 module series, greatly reducing the barriers for customers to replace the 4G FWA devices with the latest 5G technology. Notably, FG131 incorporated numerous hardware innovations by employing a highly-integrated PCB layout, enabling customers' devices to support more frequency bands at a global scale, encompassing regions such as North America, Latin America, Europe, Australia, Japan, China, etc.　　The simplified design of the 5G RedCap module will ultimately lead to cost optimization. In hardware utilization, FG131 realize the balance of cost performance and end device scalability. Catering to the demand for larger bandwidth and higher throughput in the FWA scenarios, FG131 is equipped with a 1.25Gbps SGMII portal for users to develop the wired connection. Additionally, it expands wireless capability to Wi-Fi 5/Wi-Fi 6 by docking to QCA6174/WCN6856 Wi-Fi chipset via a PCIe 2.0 port. In terms of software comparability, FG131 supports OpenWRT, allowing customer who adapts Open CPU to develop the FWA end devices flexibly. Most importantly, Fibocom FG131 RedCap module shows no compromise on the 5G capability such as network slicing, 5G LAN, which is essential for specific use cases like private networks, industrial automation, mission-critical applications, etc.　　In Conclusion　　Among the plenty of capabilities outlined in the above chapter, 5G RedCap will shine as the spotlight in the FWA industry as it eases the way for customers to build a more competitive terminal based on the up-to-date 5G technologies. Fibocom has the confidence to provide the best-in-class RedCap module solutions to help our customer's FWA devices such as CPE, ODU, mobile hot spot, USB dongle adapt to the transition seamlessly.
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Release time：2024-01-05 16:11 reading：2344 Continue reading>>
New Murata Power Solutions Product Designed to Meet the Latest Demands of Wireless Infrastructure Equipment Including RFPAs, <span style='color:red'>5G</span> Base Stations, and Wireless Repeaters
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New Murata Power Solutions Product Designed to Meet the Latest Demands of Wireless Infrastructure Equipment Including RFPAs, 5G Base Stations, and Wireless Repeaters

　　Murata Power Solutions today announced a new product for growing telecommunications and networking equipment needs. The MPQ600 was designed to enable hardware engineers the flexibility to meet demanding RFPA (Radio Frequency Power Amplifier) system design goals. The solution features a Vin range of 36-75Vdc, a Vout range of 14V to 35V, and offers 96.5 percent efficiency. It was developed specifically for powering wireless infrastructure equipment such as RFPA, 5G base stations, wireless repeaters, distributed antenna systems, industrial (robotics, transportation, digital signage, communications), infrastructure point-to-point radios, networking equipment, public safety wireless equipment, and test and measurement equipment.　　Additional features include remote on/off control, remote sense and trim functions, input under voltage, over-current, over temperature, and short circuit protection. Additionally, the MPQ600 module features a PMBusTM interface that can be used to monitor input and output voltages, output current, and device temperature. The PMBusTM also allows users to configure many operational parameters including output voltage, current limit, Vout ramp rate, Vout delay, soft start/stop and optimization of the modules for stable operation under a wide range of conditions.　　The solution was designed, tested, and qualified according to the industry standard IPC9592 design for reliability requirements. Electrical performance is state-of-the-art with an efficiency rating of 96.5+ percent typical at full load, Pre-Bias protection under all conditions, and tight line and load regulation. The MPQ600 has low output ripple and noise and fast load transient response all packaged in an industry standard quarter brick package measuring just 58.4 x 36.8 x 14.4mm (2.3 x 1.45 x 0.57 in). All I/O isolated MPS modules are designed and comply with IEC/EN/UL 62368-1 safety standards.　　“Murata Power Solutions is proud to offer the MPQ600-28V21-D48NBMC modules to power systems architects around the world. We employ a highly rigorous reliability design and manufacturing process, advanced digital control platform with Murata’s proprietary firmware, providing the power system designer the tools for the next generation, high performance systems,” said Bill Smith, Sr. Product Manager, Murata Power Solutions.
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Release time：2023-10-11 13:40 reading：1774 Continue reading>>
TSMC’s 3nm Wins Big Qualcomm <span style='color:red'>5G</span> Deal, Outshines Samsung, Intel
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TSMC’s 3nm Wins Big Qualcomm 5G Deal, Outshines Samsung, Intel

　　According to a report from Economic Daily, TSMC’s 3-nanometer technology has attracted another heavyweight client. Following Apple and MediaTek, it is rumored that Qualcomm will also commission TSMC to produce its next-generation 5G flagship chip using the 3-nanometer process. The chip is expected to be unveiled in late October, making Qualcomm the third client for TSMC’s 3-nanometer technology.　　In response to these rumors, Qualcomm has not provided any comments, while TSMC has chosen to remain silent. Industry experts speculate that TSMC’s 3-nanometer technology will likely attract additional orders from major players such as NVIDIA and AMD in the future. With various leading-edge fabs continuously seeking TSMC’s services, it appears that TSMC’s 3-nanometer technology remains the top choice for international giants.　　Last year, Qualcomm unveiled its annual 5G flagship chip, the “Snapdragon 8 Gen 2,” manufactured using TSMC’s 4-nanometer process. The previous-generation Snapdragon “8 Gen 1” was produced using Samsung’s 4-nanometer process, but it encountered issues related to heat dissipation. Consequently, Qualcomm released an upgraded version, the “Snapdragon 8+ Gen 1,” using TSMC’s 4-nanometer process.　　Qualcomm has traditionally adopted a multi-supplier strategy for semiconductor manufacturing. It is rumored in the industry that Qualcomm has privately informed its smartphone brand customers about the upcoming next-generation 5G flagship chip, the “Snapdragon 8 Gen 3,” expected to be announced in late October. This chip will be available in two process versions: TSMC’s 4-nanometer (N4P) and 3-nanometer (N3E).
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Release time：2023-09-26 14:52 reading：1629 Continue reading>>

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