Proudly Made in India: Fibocom & Kaynes Technology Join Forces to Drive <span style='color:red'>IoT</span> Innovation, Policy Compliance, and Local Growth
Trade news

Proudly Made in India: Fibocom & Kaynes Technology Join Forces to Drive IoT Innovation, Policy Compliance, and Local Growth

　　Fibocom,a leading global provider of wireless communication modules and AI solutions,today announced a strategic manufacturing partnership with Kaynes Technology, oneof India’s foremost electronics and semiconductor manufacturing pioneers. Thiscollaboration underscores Fibocom’s commitment to India’s national initiatives,including Make in India and Atmanirbhar Bharat,while addressing the growing demand for locally produced IoT components.　　Equipped withhigh-speed SMT lines, automated testing systems, and precision assemblyequipment, the state-of-the-art facility in Karnataka, Hyderabad, and Gujaratstrengthens Fibocom’s integration into India’s dynamic manufacturing ecosystem.This initiative represents more than capacity expansion — it reflects Fibocom’svision to embrace India, grow with India, and empower the world through India.　　Strategic PolicyAlignment and Market Commitment　　Fibocom’sinvestment in local manufacturing is fully aligned with India’s industrial developmentagenda, supporting technological self-reliance, accelerating time-to-market forIndian OEMs, and delivering long-term value to both domestic and globalcustomers.　　Partnering with India’s ManufacturingLeader　　With decades ofexpertise in precision manufacturing, supply chain integration, and world-classquality systems, Kaynes Technology provides the foundation for this strategicpartnership. Together, Fibocom and Kaynes Technology are advancing India as aglobal force for next-generation connectivity solutions.　　“Kaynes Technologyis proud to join forces with Fibocom to deliver critical IoT componentsmanufactured in India,” said Raghu Panicker, CEO, Kaynes Technology.“This collaboration enables local industries to innovate faster, scale smarter,and compete more effectively on the global stage.”　　Trusted & Proudly Made in India　　Fibocom’s locallyproduced modules are designed to global standards while proudly bearing the'Made in India' mark. This not only enhances trust among Indian OEMs andgovernment stakeholders but also reinforces India’s growing reputation as areliable center for IoT innovation and exports.　　“Thispartnership is a statement of intent — Fibocom is here not just to sell, but tobuild, invest, and grow with India,” said Ragin Kallanmar Thodikai, Country SalesManager, India, Fibocom. “We are proud to contribute to afuture where intelligent connectivity is Madein India and trusted worldwide.“
Key word：
Release time：2025-09-02 15:36 reading：557 Continue reading>>
Murata Launches iSIM <span style='color:red'>IoT</span> Module with Built-In Global Connectivity from 1NCE
Trade news

Murata Launches iSIM IoT Module with Built-In Global Connectivity from 1NCE

　　Murata today introduced a new iSIM-compatible LPWA module, the Type 1SC, pre-integrated with out-of-the-box connectivity from 1NCE, one of the world’s fastest-growing IoT companies. The collaboration delivers simplified, scalable global connectivity, making it easier to launch and manage low-power IoT devices. Optimized for low-power, low-data applications, the solution comes bundled with 50 MB of data and optional top-ups, enabling rapid, cost-effective deployment for applications such as asset tracking, fleet management, and healthcare monitoring. Supporting both LTE-M and NB-IoT, the module offers broad compatibility across networks in 173 countries.　　By embedding 1NCE’s cloud-based connectivity directly into the module, Murata eliminates the need for separate SIM provisioning, streamlining the design and manufacturing process for compact, energy-efficient devices. The result is a faster, more reliable path to market. Additionally, with over 30 million devices managed across 23,000+ customers, its platform simplifies lifetime IoT connectivity – bringing seamless integration, global reach, and built-in scalability to the next generation of connected products.　　“Murata’s Type 1SC module represents our commitment to driving innovation in the IoT space,” said Hiro Hyogo, Senior Manager, Corporate Technology and Innovation at Murata Americas. “By having connectivity pre-installed on our modules, we’re reducing the complexities and costs associated with global IoT deployments while ensuring strong security and performance.”　　"IoT will be dominated by software players, which is why Murata chose and trusted in 1NCE," said Fabian Kochem, Head of Global Product Strategy at 1NCE. “The supply chain of IoT is bloated, but our two companies save our customers time and money.”
Key word：
Release time：2025-08-13 15:33 reading：514 Continue reading>>
SIMCom：A7663E Achieves Key Global Certifications, Enabling Scalable 4G <span style='color:red'>IoT</span> Deployments
Trade news

SIMCom：A7663E Achieves Key Global Certifications, Enabling Scalable 4G IoT Deployments

　　As the global demand for LTE Cat 1 modules continues to rise in industrial IoT, asset tracking, and metering applications, SIMCom (as a global leader in IoT communication and solution)'s A7663E stands out with a balanced mix of performance, integration flexibility, and certification readiness. The module has recently secured a comprehensive set of international certifications, including RoHS, REACH, CE (RED) for the European market, Anatel for Brazil, and Cybersecurity compliance, paving the way for faster IoT deployment in regulated global markets.　　The A7663E is built LGA form factor, offering high integration capability while maintaining reliability. It supports LTE-FDD with downlink speeds up to 10 Mbps and uplink up to 5 Mbps, making it suitable for medium-data-rate IoT scenarios that demand efficient wireless performance and long lifecycle support. The inclusion of integrated multi-constellation GNSS (GPS, GLONASS, BeiDou) further enhances its value for location-based applications like asset tracking, smart mobility, telematics, surveillance devices, industrial routers, and remote diagnostics and so on.　　Additionally, A7663E provides a rich set of interfaces to support diverse product architectures. Its software feature set includes FOTA (Firmware Over-The-Air), SSL encryption, and LBS—ensuring devices stay secure and up-to-date throughout their lifecycle. This greatly reduces time-to-market and engineering cost.　　With global compatibility, the A7663E is an ideal LTE Cat 1 solution for IoT developers aiming to scale deployments across multiple regions with confidence.
Key word：
Release time：2025-07-24 10:37 reading：510 Continue reading>>
SGP.32 remote provisioning firmware being added to all SIMCom LTE Cat 1 bis <span style='color:red'>IoT</span> modules
Trade news

SGP.32 remote provisioning firmware being added to all SIMCom LTE Cat 1 bis IoT modules

　　SIMCom, a leading provider ofcellular wireless modules and solutions for IoT and M2M applications, has announced that all its range of Cat 1 bis IoT modules are now being prepared with the firmware necessary to support SGP.32 functionality, facilitating simple remote provisioning of IoT modules. Developed by the GSMA, the SGP.32 standard enables connectivity with IoT devices without the need for physical SIM cards or other user interfaces.　　Comments Mads Fischer, European Sales Director. SIMCom: “ SGP.32 allows IoT devices that have no displays, buttons or SIM cards to be deployed and updated. Cat 1 bis has been rolled out globally, so by implementing SGP.32 firmware in our Cat 1 bis modules, we are enabling IoT network designers to easily and seamlessly operate their systems remotely and securely using an eSIM only.”　　SIMCom's key LTE Cat 1 bis modules that have integrated SGP.32 firmware include the A7672 series, SIM7672 series, and A7683E. These modules offer strong connectivity, global certification compliance, and enhanced power efficiency, making them ideal for various IoT applications.　　Based on the ASR1603 platform, the A7672 series supports LTE-FDD, LTE-TDD, GSM, GPRS, and EDGE communication modes. With a comprehensive certification portfolio—including RoHS, REACH, CE-RED, RCM, FCC, Anatel, and Deutsche Telekom—this series ensures compliance with global regulations, facilitating smooth deployment across international markets.　　Powered by the QCX216 chipset, the SIM7672 series supports LTE-FDD and LTE-TDD communication. It boasts a wide range of certifications, including CE-RED, RoHS, REACH, FCC, TELEC, JATE, GCF, PTCRB, IC, KC, CCC, AT&T, and T-Mobile, ensuring reliability in diverse regions. A key feature of the SIM7672 series is its support for 3GPP Rel-14 Power Saving Mode (PSM), which allows power consumption to drop as low as 3µA in PSM mode, making it an excellent choice for battery-sensitive applications. The A7683E module is designed for LTE-FDD applications and carries certifications such as RoHS, REACH, CE-RED, and Anatel. All three modules offering a 10Mbps(maximum)downlink rate and 5Mbps uplink rate.　　Available in theLCC+LGA form factor,A7672 series and SIM7672 series are compatible with SIMComNB/Cat Mand/or2G modules,enabling a smooth migration to LTE Cat 1 products,enabling end-product scalability and upgradability. Modules alsosupport both multiple built-in network protocols and the drivers for main operation systems (USB driver for Windows, Linux and Android).The inclusion of industrial standard interfaces such as UART, USB, I2C and GPIO suit the modules for IoT applications such as telematics, POS, surveillance devices, industrial routers, and remote diagnostics etc.　　SIMCom's A7672 series, SIM7672 series, and A7683E modules, powered by SGP.32 firmware, provide a cost-effective and scalable solution for large-scale IoT deployments, particularly in metering and tracking, by enabling remote SIM provisioning that eliminates the need for physical SIM insertion—thereby reducing costs and simplifying deployment in remote locations. With global certifications and ultra-low power consumption, these modules deliver reliable, energy-efficient performance and long-term deployment stability, making them the ideal choice for massive IoT applications due to their flexibility and efficiency.
Key word：
Release time：2025-03-18 16:38 reading：505 Continue reading>>
Simcom：E7025 R3 High-Performance, Cost-Effective NB-<span style='color:red'>IoT</span> Connectivity
Trade news

Simcom：E7025 R3 High-Performance, Cost-Effective NB-IoT Connectivity

　　Narrowband IoT (NB-IoT), also known as Low-Power Wide-Area Network (LPWAN), is transforming how IoT devices connect by enabling low-power, wide-area communication with extended battery life and reliable network performance. SIMCom's E7025 R3 exemplifies this innovation, offering a compact, versatile, and high-performing solution tailored for diverse IoT applications.　　Compact Design for Modern IoT Solutions　　Measuring just 15.7mm × 17.6mm × 2.1mm, the E7025 R3 is perfectly tailored for space-constrained devices such as smart meters, remote control systems, asset tracking, and remote monitoring applications. Its compact size supports sleek, efficient product designs while reducing manufacturing costs, making it an ideal choice for IoT communication needs. This small yet powerful module is a cornerstone for creating innovative, cost-effective IoT solutions across industries.　　Enhanced Performance and Broader Applications　　As the third generation of the E7025 series, the E7025 R3 takes optimization to the next level, offering improvements in both cost efficiency and power consumption. Now with an optional low-power Bluetooth feature, it caters to a wider range of application scenarios. Compliant with 3GPP R13 and R14 standards, this NB-IoT module provides robust communication capabilities, including significantly enhanced signal gain and extensive coverage compared to GSM. This ensures reliable connectivity even in challenging environments like basements or other signal-restricted locations. Designed for static or low-mobility use cases that require low-latency, real-time data transmission, the E7025 R3 excels in applications such as gas meters, smoke detectors, and gas alarms, demonstrating its immense potential in these specialized markets.　　Power Efficiency for Extended Operations　　Equipped with Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX), the E7025 R3 achieves up to 10 years of battery life, minimizing the need for frequent maintenance. This makes it an exceptional choice for remote and low-maintenance applications, including environmental monitoring, smart agriculture, and remote asset tracking.　　The E7025 R3 excels in connectivity, supporting frequency bands B1/B3/B5/B8/B20/B28 for deeper network penetration and enhanced indoor coverage. This ensures reliable operation in environments like underground parking, shielded utility meters, or urban smart city deployments. Its compatibility with protocols such as IPv4, IPv6, MQTT, CoAP, LwM2M, and FOTA allows seamless integration into diverse IoT applications.　　Reliable and Easy Integration　　The E7025 R3 uses an LCC+LGA package that enhances reliability and simplifies assembly. Combined with SIMCom’s reference designs, evaluation boards, and technical support, the module accelerates time-to-market for IoT innovations.　　Global Coverage with CE Certification　　Designed for global markets, the E7025 R3 has CE certification with its robust performance, cost-efficiency, and reliability are particularly valued. The E7025 R3’s ability to balance affordability with advanced capabilities has made it a standout choice to scale their IoT deployments.　　With its advanced capabilities, compact size, and exceptional performance, the SIMCom E7025 R3 is a versatile solution poised to lead the way in IoT innovation. Whether for smart meters, remote control systems, asset tracking, and remote monitoring applications. E7025 R3 empowers to create more connected world.　　Unlock the future of IoT with SIMCom’s E7025 R3—where innovation meets reliability.
Key word：
Release time：2024-12-25 11:39 reading：839 Continue reading>>
SIM8230: Advanced and Flexible 5G Connectivity for Demanding <span style='color:red'>IoT</span> Applications
Trade news

SIM8230: Advanced and Flexible 5G Connectivity for Demanding IoT Applications

　　The 5G RedCap specification, introduced in version R17 of the 3GPP standard, addresses the growing need for efficient connectivity in IoT devices that do not require the full performance of 5G. Also known as "Reduced Capability," this technology offers a more cost-effective and energy-efficient alternative to 4G, LTE-M, and NB-IoT.　　RedCap provides an optimal balance between speed and energy efficiency, making it ideal for applications that demand constant connectivity without requiring maximum 5G capacity.　　The SIM8230 module from SIMCom fits perfectly into this context, offering multi-band compatibility, intensive data transmission, and easy integration into IoT devices. Its efficient design meets the needs for economical connectivity, providing a viable solution for a wide range of IoT applications.　　The SIM8230 is a multi-band 5G NR/LTE-FDD/LTE-TDD module that supports 5G SA according to version R17 (3GPP), providing advanced connectivity capabilities. It stands out for its compatibility with a wide range of protocols, facilitating integration into various platforms.　　Compact and Easy to Integrate　　Equipped with interfaces like PCIe, USB 2.0, and GPIO, the SIM8230 offers developers great flexibility to customize their projects. Its LGA format optimizes design and installation, allowing for a more durable assembly and improving heat dissipation, saving space and simplifying installation.　　Rapid 5G Implementation with Minimal Reprogramming　　The compatibility of the SIM8230’s AT commands with the SIM7600/8200/8260 series reduces costs and accelerates time to market. This is especially advantageous for companies that need to implement 5G solutions quickly without requiring extensive reprogramming.　　Additionally, the SIM8230 is based on the Qualcomm X35 platform, which introduces the world's first 5G NR-Light modem-RF system, designed to enhance connectivity at the intelligent edge. This optimized architecture combines energy efficiency and lower complexity design, allowing compact devices to make the most of 5G connectivity. Thanks to its energy- saving features and improved performance, the X35 not only facilitates a smooth migration from LTE CAT-4+ devices but also enables a new wave of use cases for IoT devices, facilitating the rollout of 5G solutions with minimal reprogramming.　　Technical Specifications of the SIM8230　　- The SIM8230 is available in different regional versions to adapt to connectivity needs in various markets: The SIM8230C, SIM8230E, SIM8230G, SIM8230JP, SIM8230NA, and SIM8230SA models are presented in an LGA+LCC format with dimensions of 30.0x30.0x2.5 mm, optimized for compact devices. For M2 formats, the SIM8230C-M2, SIM8230E-M2, SIM8230G-M2, and SIM8230JP-M2 models have dimensions of 42.0x31.4x3.4 mm. Additionally, the SIM8230C-PCIE, SIM8230E-PCIE, SIM8230G-PCIE, and SIM8230JP-PCIE models are available in PCIe format with dimensions of 50.8x31.0x3.6 mm.　　- Supported Frequencies: 5G NR (Sub6G), LTE-FDD, LTE-TDD.　　- GNSS: Compatibility with global navigation systems, ideal for geolocation applications (GPS/GLONASS/BeiDou).　　- Temperature Range: Operates between -40℃ and +85℃, ensuring reliability in extreme weather conditions.　　- Electrical Characteristics: Operates with a voltage of 3.3 to 4.4 V, providing wide compatibility.　　- Data Transfer Performance: Sub-6G SA with speeds of up to 220 Mbps download and 100 Mbps upload; LTE with up to 200 Mbps download and 75 Mbps upload, providing solid performance on LTE networks.　　- Software Functions: Support for protocols such as TCP/IP, IPV4, IPV6, Multi-PDP, FTPS, HTTPS, MQTTS, and DNS, as well as USB/FOTA functionality for remote firmware updates.　　- Interfaces and Connectivity: Includes interfaces such as USB, UART, PCM, GPIO, I2C, and PCIe. Supports SIM cards of 1.8V/2.95V, expanding its compatibility.　　- Certifications: The SIM8230 is currently in the process of obtaining international certifications such as CE (RED), FCC, GCF, PTCRB and MNO TA.　　Versatile and Robust Applications　　The SIM8230 stands out as a key module in CPE and MiFi applications, offering efficient 5G connectivity and FWA access that meet the needs of both industrial and residential sectors. Its optimized design and low energy consumption make it ideal for remote environments, providing high-speed internet access in MiFi devices and converting 5G signals into WiFi in CPE installations.　　Moreover, its versatility makes it a preferred option for emerging sectors such as telemedicine, smart cities, and connected automotive, opening new possibilities for innovative IoT solutions. Its high efficiency, security, and flexibility make it an adaptable solution for future demands, ensuring fast and reliable connections in an increasingly interconnected world.
Key word：
Release time：2024-12-19 10:34 reading：811 Continue reading>>
E7025 R3: High-Performance, Cost-Effective NB-<span style='color:red'>IoT</span> Connectivity
Trade news

E7025 R3: High-Performance, Cost-Effective NB-IoT Connectivity

　　Narrowband IoT (NB-IoT), also known as Low-Power Wide-Area Network (LPWAN), is transforming how IoT devices connect by enabling low-power, wide-area communication with extended battery life and reliable network performance. SIMCom's E7025 R3 exemplifies this innovation, offering a compact, versatile, and high-performing solution tailored for diverse IoT applications.　　Compact Design for Modern IoT Solutions　　Measuring just 15.7mm × 17.6mm × 2.1mm, the E7025 R3 is perfectly tailored for space-constrained devices such as smart meters, remote control systems, asset tracking, and remote monitoring applications. Its compact size supports sleek, efficient product designs while reducing manufacturing costs, making it an ideal choice for IoT communication needs. This small yet powerful module is a cornerstone for creating innovative, cost-effective IoT solutions across industries.　　Enhanced Performance and Broader Applications　　As the third generation of the E7025 series, the E7025 R3 takes optimization to the next level, offering improvements in both cost efficiency and power consumption. Now with an optional low-power Bluetooth feature, it caters to a wider range of application scenarios. Compliant with 3GPP R13 and R14 standards, this NB-IoT module provides robust communication capabilities, including significantly enhanced signal gain and extensive coverage compared to GSM. This ensures reliable connectivity even in challenging environments like basements or other signal-restricted locations. Designed for static or low-mobility use cases that require low-latency, real-time data transmission, the E7025 R3 excels in applications such as gas meters, smoke detectors, and gas alarms, demonstrating its immense potential in these specialized markets.　　Power Efficiency for Extended Operations　　Equipped with Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX), the E7025 R3 achieves up to 10 years of battery life, minimizing the need for frequent maintenance. This makes it an exceptional choice for remote and low-maintenance applications, including environmental monitoring, smart agriculture, and remote asset tracking.　　The E7025 R3 excels in connectivity, supporting frequency bands B1/B3/B5/B8/B20/B28 for deeper network penetration and enhanced indoor coverage. This ensures reliable operation in environments like underground parking, shielded utility meters, or urban smart city deployments. Its compatibility with protocols such as IPv4, IPv6, MQTT, CoAP, LwM2M, and FOTA allows seamless integration into diverse IoT applications.　　Reliable and Easy Integration　　The E7025 R3 uses an LCC+LGA package that enhances reliability and simplifies assembly. Combined with SIMCom’s reference designs, evaluation boards, and technical support, the module accelerates time-to-market for IoT innovations.　　Global Coverage with CE Certification　　Designed for global markets, the E7025 R3 has CE certification with its robust performance, cost-efficiency, and reliability are particularly valued. The E7025 R3’s ability to balance affordability with advanced capabilities has made it a standout choice to scale their IoT deployments.　　With its advanced capabilities, compact size, and exceptional performance, the SIMCom E7025 R3 is a versatile solution poised to lead the way in IoT innovation. Whether for smart meters, remote control systems, asset tracking, and remote monitoring applications. E7025 R3 empowers to create more connected world.　　Unlock the future of IoT with SIMCom’s E7025 R3—where innovation meets reliability.
Key word：
Release time：2024-12-18 11:00 reading：6863 Continue reading>>
Fibocom Fosters Local 5G A<span style='color:red'>IoT</span> Market with Newly Launched 5G Module FG370-KR at A<span style='color:red'>IoT</span> Korea 2024
Trade news

Fibocom Fosters Local 5G AIoT Market with Newly Launched 5G Module FG370-KR at AIoT Korea 2024

　　wireless communication modules, announces the launch of FG370-KR, a regional version of the FG370 series module, which is positioned to accelerate the commercial development of Korean’s 5G AIoT industries such as Fixed Wireless Access (FWA), live streaming, and industrial automation, etc. By adopting the advancements from FG370-KR, the solution allows local customers to benefit from the seamless 5G experience and fast-to-market industry solutions.　　5G subscribers in South Korea reached around 33 million as of the end of March 2024, according to the latest report from Statista. SK Telecom accounted for 15.9 million of the total 5G subscribers, followed by KT with 9.9 million and LG U+ with 7.2 million. At present, the country accelerates the rollout of commercial 5G services to industry-related field and shows strong growing trends. Fibocom's 5G Sub-6GHz module FG370-KR is compatible with Korea's mainstream 5G frequency bands, supports both 5G SA and NSA network architecture, making it an ideal 5G solution for industry customers that require high-transmission speed, large capacity, and ultra-low latency.　　Developed from the MediaTek T830 chipset platform, the FG370-KR is a 3GPP Release 16 compliant module that adopts a 4nm process integrated with an Arm Cortex-A55 quad-core CPU, leading to a 10% improvement in speed performance compared to the previous generation. In terms of data transmission, FG370-KR supports NR 4CA (Carrier Aggregation) with up to 300MHz bandwidth on the downlink, and NR 2CA in FDD and TDD hybrid mode on the uplink, reaches a maximum speed of up to 7.01Gbps DL and 1.25Gbps UL. In addition, it also supports PC2 of HPUE (High Power User Equipment) technology, significantly enhances 5G uplink capability and network coverage. It is worth highlighting that, FG370-KR can greatly reducing the time-to-market of customers’ devices with the support of a wide range of peripheral interfaces, including three PCI-Express, USB 3.2, two USXGMII interfaces along with software features such as Kernel, OpenWRT drivers.　　“The launch of the FG370-KR signifies that Fibocom will provide a Korea-dedicated solution for local customers, boosting the 5G adoption towards a larger-scale of industries with optimal network connectivity and enhanced operational efficiency, said Simon Tao, VP of Product Management Dept., Head of MBB BU at Fibocom. “We have the confidence in helping enterprises to accomplish the 5G commercialization with our industry know-how and expertise accumulated, without doubt, Korea’s 5G deployment will keep experiencing a fast-growing rate and Fibocom will continually invest in cutting-edge 5G module solutions and delivering superior wireless experience.”　　To learn more about 5G Sub-6GHz module and its demos, welcome to visit Fibocom booth #G101 on the 3rd Floor of Hall D in COEX at the AIoT Korea from October 30 to November 1 2024.
Key word：
Release time：2024-12-13 10:55 reading：1132 Continue reading>>
Fibocom Drives the Rapid Growth in the Economics of <span style='color:red'>IoT</span> Scale with Ultra-compact size Cat 1 bis Module MC610-GL at MWC Shanghai 2024
Trade news

Fibocom Drives the Rapid Growth in the Economics of IoT Scale with Ultra-compact size Cat 1 bis Module MC610-GL at MWC Shanghai 2024

　　Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, announces the new member of its LTE Cat 1 bis module portfolio featuring high reliability, ultra-compact size and cost-effectiveness at MWC Shanghai 2024. The MC610-GL is positioned to foster the economics of IoT scale in vertical markets across asset tracking, E-mobility, AMI (Advanced Metering Infrastructure), etc.　　The Global Cellular IoT Module market shows a 7% year-over-year (YoY) growth in Q1 2024, according to the latest reports by IoT Analytics. Despite ongoing inventory and demand issues in several other regions globally, technologies like 5G and LTE Cat-1 bis have seen a combined market growth of 67% year-over-year, signifying their substantial contribution to the cellular IoT module market's overall growth. “The statistics have verified Cat 1 bis’ driving forces in bringing affordable and reliable wireless connectivity service to a diversified IoT landscape, even though 5G remains strong performance in the data-intensive scenarios, and Cat 1 bis takes the lead in the mainstream low and medium speed market thanks to the worldwide 4G infrastructure,” said Kevin Guan, Director of MTC Product Marketing at Fibocom. “Without a doubt, we are optimistic in expanding the utilization of Cat 1 bis technology in segment areas and providing the value-added reference design service to industry customers. Looking forward, the MC610-GL is expected to address its top performance in the global market and accelerate the large-scale IoT deployment worldwide.”　　Developed from the UNISOC 8910DM platform, the MC610-GL supports major carrier frequency bands worldwide and complies with rich network standards, thus ensuring uninterrupted wireless connection anywhere, anytime, especially catering to asset tracking scenarios. It adopts an ultra-compact LCC+LGA form factor design measured at 24.2 x 26.2 x 2.1mm with dual-mode (4G+2G) supported, providing great convenience for customers to switch from LTE Cat M to Cat 1 bis at the minimum investment. Equipped with rich standard interfaces, the module empowers a wide range of low-to-medium speed IoT industries with up to 10Mbps downlink data transmission rate while conserving significant cost. Leveraging the industry capabilities within Fibocom, customers are catered to the reference design service and support, reducing the lead time to market. In addition, regional versions for EMEA (MC610-EU) and Latin America (MC610-LA) are flexibly adjustable in request to customers’ cost concerns.
Key word：
Release time：2024-07-03 13:57 reading：997 Continue reading>>
Murata commercializes low-power Wi-Fi®/Bluetooth® combo module:Helping proliferate battery-powered <span style='color:red'>IoT</span> equipment
Trade news

Murata commercializes low-power Wi-Fi®/Bluetooth® combo module:Helping proliferate battery-powered IoT equipment

　　Murata Manufacturing Co., Ltd. (hereinafter, “Murata”) has developed and begun mass-producing the low-power compact wireless module “Type 2GF” (hereinafter “this product”) with built-in Infineon Technologies (hereinafter “Infineon”) “CYW43022” Wi-Fi®/Bluetooth®/Bluetooth® Low Energy combo chip.　　With the expansion of applications in the IoT market in recent years, there has been a rise in IoT equipment with wireless communication functions. There has been a diversification in the different specifications wireless communication functions need to have depending on the application. For battery-powered devices, wireless communication functions are also being required to have lower power consumption.　　In response to this demand, Murata has applied proprietary wireless design technology and product processing technology to develop this product with CYW43022 built in to have low power consumption capabilities. Because CYW43022 can maintain connectivity even when a host processor is in sleep mode due to its connectivity processing capability with the chip’s Bluetooth® stack and Wi-Fi® network offloading, the chip helps this product consume less power at the system level. Space was also saved on the module by using often space-occupying noise shields in a smaller size, which allowed us to make this product more compact.　　Specifications
Key word：
Release time：2024-06-28 11:31 reading：789 Continue reading>>

Turn to

/ 11

Popular categories
Semiconductors Circuit Protection Electromechanical Embedded Solutions Connectors, Interconnects Sensors, Transducers Optoelectronics Development Kits Test and Measurement Power Fans, Thermal Management Boxes, Enclosures, Racks Cables, Wires Passive Components Others
  • Week of hot material
  • Material in short supply seckilling
model brand Quote
TL431ACLPR Texas Instruments
MC33074DR2G onsemi
RB751G-40T2R ROHM Semiconductor
CDZVT2R20B ROHM Semiconductor
BD71847AMWV-E2 ROHM Semiconductor
model brand To snap up
BP3621 ROHM Semiconductor
IPZ40N04S5L4R8ATMA1 Infineon Technologies
BU33JA2MNVX-CTL ROHM Semiconductor
STM32F429IGT6 STMicroelectronics
TPS63050YFFR Texas Instruments
ESR03EZPJ151 ROHM Semiconductor
Hot labels
ROHM
IC
Averlogic
Intel
Samsung
IoT
AI
Sensor
Chip
Original authorized brand
More Licensed Brands>>
Information leaderboard
  • Week of ranking
  • Month ranking

About us

Qr code of ameya360 official account

Identify TWO-DIMENSIONAL code, you can pay attention to

AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.

Please enter the verification code in the image below：

verification code