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Swift Navigation and SIMCom Fuel Mass Market Outdoor Autonomy with Reliable, Affordable Centimeter-Accurate Positioning

　　SIMCom's GNSS Modules Now Integrated with Swift's Skylark Precise Positioning Service　　SAN FRANCISCO, CA – October 28, 2025 – Swift Navigation, a leader in precise positioning technology for mass-market applications, and SIMCom, a leading global IoT wireless modules and solutions supplier, today announced a partnership to deliver centimeter-level GNSS accuracy to high-volume robotics applications worldwide.　　The collaboration integrates Swift's Skylark™ Precise Positioning Service with SIMCom's high-performance SIM66MD and SIM66D GNSS modules.　　This powerful combination allows manufacturers and developers using these modules to easily activate centimeter-accurate satellite positioning, dramatically improving the performance, safety, and reliability of robotic lawnmowers, delivery robots, agricultural vehicles, and other autonomous systems. SIMCom's modules are renowned for their compact designs, low power consumption, and wide array of interfaces, making them ideal for seamless integration into diverse IoT and autonomous devices.　　Swift's Skylark Nx RTK, the highest-precision variant of Skylark, leverages a proprietary atmospheric model to deliver continuous 1-2 cm accuracy across vast geographic areas, including all of Western Europe. This carrier-grade network eliminates the need for developers to manage base stations or switch between multiple correction providers, simplifying the deployment of high-precision outdoor robots at scale.　　"SIMCom's commitment to high performance and versatile design in their GNSS modules aligns perfectly with Swift’s mission to make high-precision positioning accessible and scalable," said Daniel Optendrenk, Vice President of Sales and Business Development at Swift Navigation. "By integrating Skylark with the SIM66MD and SIM66D, we are directly addressing the critical need for reliable, low-cost precision in outdoor autonomous systems, giving developers the tools they need to achieve truly seamless operation."　　"The demand for high-accuracy, low-power positioning is growing across all our target segments, particularly in the emerging field of autonomous robotics," said Chunlin Zhu, GNSS Product Line Director at SIMCom. "This partnership ensures that our popular modules can immediately access Swift’s leading precise positioning network, providing a seamless path for our customers to achieve centimeter-level accuracy and gain a competitive edge in deploying fully autonomous solutions."　　Key benefits for autonomous navigation:　　● Autonomous Operation: Centimeter-level accuracy is essential for robots to execute complex tasks, such as following precise mowing patterns, planting seeds with exact spacing, or navigating narrow construction sites.　　● Safety and Geofencing: Precise localization enables reliable enforcement of virtual boundaries (geofencing), preventing robots from entering restricted zones or colliding with obstacles, which is critical for safety in public or shared spaces.　　● Improved Efficiency: Reliable 1-2 cm precision reduces path errors, minimizes overlap in coverage (e.g., in farming or lawn care), and ensures the robot consistently reaches its exact target destination, maximizing battery life and operational uptime.

Key word：

SIMCom

Release time：2026-01-13 17:01 reading：261 Continue reading>>

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Affordable Standard Precision Positioning GNSS Solutions for India's Connected Future

　　India's fast-growing digital ecosystem is fueling the need for reliable, and efficient positioning technologies across transportation, logistics, industrial IoT, and connected vehicles. To address these demands, SIMCom introduces the SIM66MD, a standard precision dual-band GNSS module that combines exceptional accuracy with compact design and low power consumption.　　Supporting multiple global navigation systems — GPS, GLONASS, BeiDou, Galileo, and QZSS — along with Navigation with Indian Constellation (NavIC), the SIM66MD ensures stable positioning across Indian regions. Its L1 + L5 dual-band capability enhances signal quality and reduces interference, delivering faster Time-to-First-Fix and improved reliability even in dense urban areas or challenging terrains.　　Compact in design at just 10.1 × 9.7 × 2.4 mm and weighing only 0.5 g, the SIM66MD adopts an LCC package that allows flexible integration into various devices. It features an integrated low-noise amplifier and supports AGNSS, DGPS (RTCM) to achieve meter-level accuracy with optimized power efficiency.　　With its balance of performance, precision, and cost-effectiveness, the SIM66MD empowers a wide range of IoT applications in India — from shared mobility to asset tracking and industrial automation. It delivers the accuracy and reliability developers need to build connected tracking solutions at scale.

Key word：

GigaDevice

Release time：2026-01-13 14:59 reading：218 Continue reading>>

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SIMCom：Affordable Standard Precision Positioning GNSS Solutions for India's Connected Future

　　India's fast-growing digital ecosystem is fueling the need for reliable, and efficient positioning technologies across transportation, logistics, industrial IoT, and connected vehicles. To address these demands, SIMCom introduces the SIM66MD, a standard precision dual-band GNSS module that combines exceptional accuracy with compact design and low power consumption.　　Supporting multiple global navigation systems — GPS, GLONASS, BeiDou, Galileo, and QZSS — along with Navigation with Indian Constellation (NavIC), the SIM66MD ensures stable positioning across Indian regions. Its L1 + L5 dual-band capability enhances signal quality and reduces interference, delivering faster Time-to-First-Fix and improved reliability even in dense urban areas or challenging terrains.　　Compact in design at just 10.1 × 9.7 × 2.4 mm and weighing only 0.5 g, the SIM66MD adopts an LCC package that allows flexible integration into various devices. It features an integrated low-noise amplifier and supports AGNSS, DGPS (RTCM) to achieve meter-level accuracy with optimized power efficiency.　　With its balance of performance, precision, and cost-effectiveness, the SIM66MD empowers a wide range of IoT applications in India — from shared mobility to asset tracking and industrial automation. It delivers the accuracy and reliability developers need to build connected tracking solutions at scale.

Key word：

SIMCom

Release time：2026-01-08 15:19 reading：356 Continue reading>>

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A Comprehensive Guide to Choosing Between LDO (Low Dropout Linear Regulators) and DC-DC (Switching Regulators)

　　Selecting the appropriate voltage regulator is critical for the stability and efficiency of various circuit systems. Among the numerous types available, LDO (Low Dropout Linear Regulators) and DC-DC (Switching Regulators) are two common voltage stabilizers. This article will thoroughly explore the selection methods for LDO and DC-DC regulators, covering concepts, operating principles, characteristics, and application scenarios.　　A Comprehensive Guide to Selecting LDO (Low Dropout Linear Regulators) and DC-DC (Switching Regulators)　　1. LDO (Low Dropout Linear Regulator)　　1.1 Concept　　LDO stands for Low Dropout Regulator, typically used to regulate high input voltages to lower output voltages. It achieves stable output voltage by adjusting the conduction resistance of its internal transistor.　　1.2 Working Principle　　When the input voltage exceeds the output voltage, the internal transistor enters an amplified state. It dissipates excess power to regulate the output voltage, maintaining it at the set value.　　1.3 Characteristics　　Simple design, low noise, relatively low cost, suitable for applications requiring high precision. However, it has low efficiency and significant thermal distortion.　　2. DC-DC (Switching Regulator)　　2.1 Concept　　DC-DC refers to a switching regulator (DC-to-DC Converter) that converts input voltage to the desired output voltage by switching the state of a switching element (e.g., MOSFET).　　2.2 Working Principle　　DC-DC operates by periodically turning the switching element on and off to control the output voltage magnitude, while a filter removes high-frequency noise from the output waveform.　　2.3 Features　　High efficiency, capable of delivering substantial output power, suitable for applications requiring large voltage drops or enhanced efficiency, but involves complex design and relatively higher cost.　　3. How to Select?　　3.1 Output Voltage Range　　For lower output voltages, an LDO is more suitable; whereas for large voltage drops or higher output power requirements, a DC-DC converter is more appropriate.　　3.2 Efficiency Requirements　　When prioritizing power efficiency, especially under large voltage drops, DC-DC converters typically outperform LDOs.　　3.3 System Complexity　　LDOs may be preferable for simplified design and cost reduction; DC-DC converters are necessary when higher output power and efficiency are required.　　3.4 Ripple and Noise　　In applications sensitive to output ripple and noise, LDOs are generally more suitable than DC-DC converters because they produce lower ripple and noise.　　4. Application Scenarios　　4.1 LDO Application Scenarios　　Applications requiring high output voltage accuracy, low output current, and strict ripple/noise specifications.　　4.2 DC-DC Applications　　Applications requiring large voltage drops, high output power, and high efficiency, such as mobile devices, power amplifiers, and communication equipment.　　4.3 Comprehensive Considerations　　In practical applications, the optimal regulator type must be selected by comprehensively evaluating system power consumption, output load conditions, stability requirements, and cost factors.　　As common voltage regulators, LDOs and DC-DC converters play vital roles in electronic product design. Selecting the appropriate regulator type depends on specific application requirements, including output voltage range, efficiency demands, system complexity, and ripple noise. During the selection process, a comprehensive evaluation of all factors is necessary to ensure the circuit system operates stably, reliably, and efficiently.

Key word：

Regulators

Release time：2025-12-31 17:31 reading：323 Continue reading>>

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Renesas丨Silicon to Software: RoX AI Studio Advances Software-Defined Vehicle Design

　　Software-defined vehicles (SDV) are upending traditional automotive design. While vehicle development is still highly iterative, the industry is in the throes of a historic transformation where manufacturers are compressing once-sequential hardware-to-software design cycles into more efficient software-first design flows.　　This so-called shift-left approach is exemplified by Renesas' adoption of digital tools and AI models as part of a broader digitalization and software strategy aimed at accelerating design and innovation, while simultaneously optimizing R&D efficiency. In the automotive sector, the evolution is driven by practical considerations given that a typical vehicle now embeds more than 100 million lines of code. Heavier software dependence requires continuous updating and deployment, multi-supplier integration, design validation at scale, and reflects an ecosystem where OEMs insource more software and chipmakers ship platforms, not parts. Renesas anticipated these changes with the scalable R-Car hardware and software development platform. R-Car supports the transition of E/E designs to more central processing architectures, including advanced driver assistance systems (ADAS) and autonomous vehicle design. Last year, we added R-Car Open Access (RoX), an extended platform for SDVs that provides a pre-integrated, out-of-the-box environment with hardware, operating systems, software stacks, and tools to accelerate next-generation vehicle development.　　R-Car leverages a heterogeneous architecture that features Arm® CPUs with multiple hardware accelerators. RoX includes a common set of toolchains that allows software reuse across electronic control units (ECUs) for ADAS, in-vehicle information (IVI) systems, and centralized data gateways. By enabling cloud-native development and customized design simulation, the RoX platform expands SDV lifecycle support through continuous updates that align with a modern value chain where OEMs and service providers increasingly co-own software.　　Introducing RoX AI Studio: Cloud-Native MLOps on R-Car　　Many of our automotive customers have embraced R-Car and the Renesas RoX platform as a means to accelerate SDV development and manage the complexity of in-vehicle embedded processing systems. In doing so, we found a persistent "lab-to-road" gap between how designers employ AI training in the cloud and how they deploy new features in automotive SoCs.　　RoX AI Studio, a new extension of the original RoX platform, closes that gap. The machine learning operations (MLOps) tool lets teams remotely evaluate AI models using a managed cloud control plane that connects engineers with hardware-in-the-loop (HIL) device farms so they can profile real-world performance without waiting for scarce lab boards. Continuous integration and deployment (CI/CD) keeps the full toolchain current, so improvements arrive automatically with no local installs required. The result is faster iteration, fewer surprises, and a direct line from model training to road-ready, HIL model validation.　　What Is MLOps – and How Does RoX AI Studio Enable It for SDVs?　　To define MLOps, it's important to understand what preceded it. MLOps builds on a concept called DevOps – short for development operations – in which tools and best practices are combined to shorten software design lifecycles. This is achieved by breaking down silos between development and IT operations teams to help them collaborate more effectively.　　DevOps governs deterministic integrate/test/deploy processes for conventional software code and services. MLOps adds AI data and models, where development lifecycles are iterative, experiments branch, and choices must be tracked, compared, and promoted. By anchoring model validation on R-Car silicon, RoX AI Studio becomes the bridge between model-in-training and model-in-production, turning the art and science of AI model development into repeatable and scalable engineering operations with targeted KPIs.　　RoX AI Studio operationalizes automotive MLOps for SDVs in several ways:　　Model Intake and Registry: Renesas provides a curated model zoo that includes many popular AI models. Users can also use a bring your own model (BYOM) approach to ingest their own custom or proprietary models and receive a quick performance evaluation on R-Car silicon.　　Automated Updates: Orchestration workflows in our MLOps tool simplify the user experience by abstracting model processing for silicon deployment, while CI/CD toolchains automate the release and deployment of the latest version of the AI toolchain for R-Car SoCs.　　HIL Evaluation: MLOps in the cloud connects to a physical lab hosting an array of R-Car silicon devices that run inference experiments on demand. This allows remote validation of AI models without requiring physical co-location with the hardware.　　Results and Artifacts: Collects metrics and logs from inference experiments and aggregates them as metric comparison tables and plots.　　Scaled Experimentation: Runs multiple models/variants in parallel to compare accuracy vs. latency under real-world operating constraints.　　Flexible Deployment: Will allow designers to begin on the Renesas cloud for speed and then mirror the same stack later in a private cloud when silicon is more widely available for individual projects.　　RoX AI Studio Is Advancing Automotive's "Shift Left" Strategy　　Automotive timelines are compressing. Manufacturers are moving from three to four-year platform development cycles to one to two-year cycles augmented by ongoing over-the-air (OTA) updates to provide on-road product feature enhancements. That means design teams adopting the shift-left philosophy need to test hardware and software earlier using target (remote or virtual) devices.　　That's a challenge for OEMs, many of which have invested heavily in AI model training and are striving to continuously improve their networks by deploying feature updates to their vehicles in the field. At the same time, shorter development cycles mean they must test many device options simultaneously – at scale and across multiple vectors – without over-investing in the wrong development path.　　When OEMs and Tier 1 suppliers use RoX AI Studio, they can quickly validate their devices by testing at scale and within the context of their specific MLOps network strategy. RoX AI Studio makes this practical by creating a simplified developer experience for managing cloud-to-lab infrastructure and automated workflows for pre-trained model deployment and evaluation on R-Car SoC targets. It runs experiments in parallel, as opposed to serially, and provides access to device farms that allow global teams to start development before boards arrive and continue at scale.　　For automotive OEMs, this means earlier starts and fewer late surprises, reusable software investments that move from cloud to vehicle, and a clean path to private-cloud deployment and virtual platforms that yield better results and shorten time to market.　　Platform Thinking for the Software-Defined Era　　Car makers designing SDVs are committed to developing hardware and software in parallel, and the market is converging on cloud-native machine learning tools – but with no universal MLOps winner yet.　　Renesas RoX AI Studio provides a standardized SDV design foundation and operationalizes AI development on that foundation by moving beyond DevOps to support a "one-stop studio" model. Together, the RoX platform and RoX AI Studio are enabling a shift-left culture change: validate earlier, iterate faster, deploy confidently.　　Renesas RoX AI Studio is currently available to select customers with a broad introduction planned in 2026.

Key word：

Renesas

Release time：2025-12-31 17:27 reading：380 Continue reading>>

Trade news

Renesas Fast-Tracks SDV Innovation with R-Car Gen 5 SoC-Based End-to-End Multi-Domain Solution Platform

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, is expanding its software-defined vehicle (SDV) solution offerings centered around the fifth-generation (Gen 5) R-Car family. The latest device in the Gen 5 family, the R-Car X5H is the industry’s first multi-domain automotive system-on-chip (SoC) manufactured with advanced 3nm process technology. It is capable of simultaneously running vehicle functions across advanced driver assistance systems (ADAS), in-vehicle infotainment (IVI), and gateway systems.　　Renesas has begun sampling Gen 5 silicon and now offers full evaluation boards and the R-Car Open Access (RoX) Whitebox Software Development Kit (SDK) as part of the next phase of development. Renesas is also driving deeper collaboration with customers and partners to accelerate adoption. At CES 2026, Renesas will showcase AI-powered multi-domain demonstrations of the R-Car X5H in action.　　The R-Car X5H leverages one of the most advanced process nodes in the industry to offer the highest level of integration, performance and power efficiency, with up to 35 percent lower power consumption than previous 5nm solutions. As AI becomes integral to next-generation SDVs, the SoC delivers powerful central compute targeting multiple automotive domains, with the flexibility to scale AI performance using chiplet extensions. It delivers up to 400 TOPS of AI performance, with chiplets boosting acceleration by four times or more. It also features 4 TFLOPS equivalent* of GPU power for high-end graphics and over 1,000k DMIPS powered by 32 Arm® Cortex®-A720AE CPU cores and six Cortex-R52 lockstep cores with ASIL D support. Leveraging mixed criticality technology, the SoC executes advanced features in multiple domains without compromising safety.　　As hardware and software become more tightly integrated early in development to support complex E/E architectures, Renesas is adding new capabilities to the RoX development platform. RoX dramatically simplifies development by combining all essential hardware, operating systems, software and tools required to rapidly develop next-generation vehicles with seamless software updates.　　Accelerating Automotive Innovation with an Open, Scalable RoX Whitebox SDK　　To accelerate time-to-market, Renesas now offers the RoX Whitebox Software Development Kit (SDK) for the R-Car X5H, an open platform built on Linux, Android, and XEN hypervisor. Additional support for partner OS and solutions is available, including AUTOSAR, EB corbos Linux, QNX, Red Hat and SafeRTOS. Developers can jumpstart development out of the box using the SDK to build ADAS, L3/L4 autonomy, intelligent cockpit, and gateway systems. An integrated stack of AI and ADAS software enables real-time perception and sensor fusion while generative AI and Large Language Models (LLMs) enable intelligent human-machine interaction for next-generation AI cockpits. The SDK integrates production-grade application software stacks from leading partners such as Candera, DSP Concepts, Nullmax, Smart Eye, STRADVISION and ThunderSoft, supporting end-to-end development of modern automotive software architectures and faster time to market.　　“Since introducing our most advanced R-Car device last year, we have been steadfast in developing market-ready solutions, including delivering silicon samples to customers earlier this year,” Vivek Bhan, Senior Vice President and General Manager of High Performance Computing at Renesas. “In collaboration with OEMs, Tier-1s and partners, we are rapidly rolling out a complete development system that powers the next generation of software-defined vehicles. These intelligent compute platforms deliver a smarter, safer and more connected driving experience and are built to scale with future AI mobility demands.”　　“Integrating Renesas’ R-Car X5 generation series into our high-performance compute portfolio is a natural next step that builds on our existing collaboration,” said Christian Koepp, Senior Vice President Compute Performance at Bosch’s Cross-Domain Computing Solutions Division. “At CES 2026, we look forward to showcasing this powerful solution with Renesas X5H SoC, demonstrating its fusion capabilities across multiple vehicle domains, including video perception for advanced driver assistance systems."　　“Innovative system-on-chip technology, such as Renesas’ R-Car X5H, is paving the way for ZF’s software-defined vehicle strategy,” said Dr. Christian Brenneke, Head of ZF’s Electronics & ADAS division. “Combining Renesas’ R-Car X5H with our ADAS software solutions enables us to offer full-stack ADAS capabilities with high computing power and scalability. The joint platform combines radar localization and HD mapping to provide accurate perception and positioning for reliable ADAS performance. At CES 2026, we’ll showcase our joint ADAS solution.”　　First Fusion Demo on R-Car X5H with Partner Solutions at CES 2026　　Renesas will showcase the capabilities of the R-Car X5H for the first time through a series of invitation-only demos at CES 2026. For more information about how to attend this event, contact sales at: CES26_Info@lm.renesas.com.　　The new multi-domain demo upscales from R-Car Gen 4 to the next-generation R-Car X5H on the RoX platform, integrating ADAS and IVI stacks, RTOS, and edge AI functionality on Linux and Android with XEN hypervisor virtualization. Supporting input from eight high-resolution cameras and up to eight displays with resolutions reaching 8K2K, the platform delivers immersive visualization and robust sensor integration for next-generation SDVs. Combined with the RoX Whitebox SDK and production-grade partner software stacks, the platform is engineered for real-world deployment covering multiple automotive domains.　　Availability　　Renesas is shipping R-Car X5H silicon samples and evaluation boards, along with the RoX Whitebox SDK, to select customers and partners.

Key word：

Renesas

Release time：2025-12-24 16:06 reading：481 Continue reading>>

Trade news

Now Standard in Siemens’ Flotherm™! ROHM Expands Its High-Accuracy EROM Models for Shunt Resistors

　　ROHM has expanded its lineup of EROM (Embeddable BCI-ROM) models for shunt resistors and has made them available on ROHM’s website. In addition, these models are now standard in Siemens’ electronic thermal design software, Simcenter™ Flotherm™*.　　ROHM’s shunt resistors are widely used in automotive and industrial equipment applications, where their high-accuracy current detection and superior reliability are highly valued. We have added the PMR series to the EROM lineup, alongside the previously available PSR series.　　The EROM models achieve high accuracy with a measurement deviation within ±5% for both surface temperature (ΔT) and thermal resistance, enabling thermal analysis that closely reflects actual operating conditions. This contributes to improved simulation accuracy in the thermal design phase and enhances overall development efficiency.　　Furthermore, by standard implementation in Simcenter™ Flotherm™, these models make it easier for component manufacturers and set manufacturers to share thermal analysis data. This allows for highly accurate and efficient simulations while maintaining the confidentiality of proprietary information.　　Going forward, ROHM will continue to enhance the support for customers’ design and development activities through both its high-performance components and advanced simulation models.　　*Standard in Simcenter™ Flotherm™ 2510 and later.　　Terminology　　EROM (Embeddable BCI-ROM)　　A reduced-order model that can be used within Simcenter™ Flotherm™ to perform thermal simulations. It allows sharing while keeping internal component structures (confidential design data) hidden, enabling fast and highly accurate analysis.　　Simcenter™ Flotherm™　　A CFD (Computational Fluid Dynamics) simulator developed by Siemens, specialized in thermal and cooling design for electronic devices. It enables fast and accurate thermal analysis from the early design stage through validation, supporting exceptionally reliable thermal design.　　Simcenter™ Flotherm™ is a registered trademark of Siemens.

Key word：

ROHM

Release time：2025-11-21 16:50 reading：472 Continue reading>>

Trade news

Renesas’ Industry-First Gen6 DDR5 Registered Clock Driver Sets Performance Benchmark by Delivering 9600 MT/s

　　Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that it has delivered the industry’s first sixth-generation Registered Clock Driver (RCD) for DDR5 Registered Dual In-line Memory Modules (RDIMMs). The new RCD is the first to achieve a data rate of 9600 Mega Transfers Per Second (MT/s), surpassing the industry standard. This breakthrough marks a significant leap from the 8800 MT/s performance of Renesas’ Gen5 RCD, setting a new standard for memory interface performance in data center servers.　　Key Features of Renesas’ Gen6 DDR5 RCD　　10% Bandwidth Increase over Renesas’ Gen5 RCD (9600 MT/s versus 8800 MT/s)　　Backward Compatibility with Gen5 Platforms: Provides seamless upgrade path　　Enhanced Signal Integrity and Power Efficiency: Enables AI, HPC, and LLM workloads　　Expanded Decision Feedback Equalization Architecture: Offers eight taps and 1.5mV granularity for superior margin tuning　　Decision Engine Signal Telemetry and Margining (DESTM): Improved system-level diagnostics provides real-time signal quality indication, margin visibility, and diagnostic feedback for higher speeds　　The new DDR5 RDIMMs are needed to keep pace with the ever-increasing memory bandwidth demands of Artificial Intelligence (AI), High-Performance Compute (HPC) and other data center applications. Renesas has been instrumental in the design, development and deployment of the new RDIMMs, collaborating with industry leaders including CPU and memory providers, along with end customers. Renesas is the leader in DDR5 RCDs, building on its legacy of signal integrity and power optimization expertise.　　“Explosive growth of generative AI is fueling higher SoC core count. This is driving unprecedented demand for memory bandwidth and capacity as a critical enabler of data center performance,” said Sameer Kuppahalli, Vice President of Memory Interface Division at Renesas. “Our sixth generation DDR5 Registered Clock Driver demonstrates Renesas’ continued commitment to memory interface innovation, path-finding and delivering solutions to stay ahead of market demand.”　　"Samsung has collaborated with Renesas across multiple generations of memory interface components, including the successful qualification of Gen5 DDR5 RCD and PMIC5030,” said Indong Kim, VP of DRAM Product Planning, Samsung Electronics. “We are now excited to integrate Gen6 RCD into our DDR5 DIMMs, across multiple SoC platforms to support the growing demands of AI, HPC, and other memory-intensive workloads."　　Availability　　The RRG5006x Gen6 RCD is designed to meet the stringent requirements of next-generation server platforms, offering robust performance, reliability, and scalability. Renesas is sampling the new RRG5006x RCD to select customers today, including all major DRAM suppliers. Production availability is expected in the first half of 2027.

Key word：

Renesas

Release time：2025-11-13 16:33 reading：800 Continue reading>>

Trade news

GigaDevice GD32F5xx and GD32G5xx Software Test Libraries (STL) Receive TÜV Rheinland IEC 61508 Functional Safety Certification

　　GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, announced that its GD32F5xx and GD32G5xx Software Test Libraries have received IEC 61508 SC3 (SIL 2/SIL 3) functional safety certification from TÜV Rheinland.　　This milestone expands GigaDevice’s functional safety portfolio, which already includes the GD32H7 and GD32F30x STLs, and now covers a broad range of MCUs with Arm® Cortex®-M7, Cortex®-M4, and Cortex®-M33 cores. Building on this foundation, GigaDevice will continue to deliver high-performance and safety-focused hardware and software solutions for key applications such as industrial control, energy and power, and humanoid robotics.　　With the growing emphasis on safety across industries like industrial automation, functional safety has become a critical consideration in embedded system design. The GD32F5xx and GD32G5xx MCUs, based on the Arm® Cortex®-M33 core, have become key solutions for high-performance applications requiring robust safety measures.　　The GD32F5xx series is optimized for applications in energy and power management, photovoltaic energy storage, and industrial automation, where high precision and reliable control are essential.　　The GD32G5xx series combines excellent processing performance with a wide range of digital and analog interfaces. It is available in compact packages such as 81-pin WLCSP81 (4x4mm), making it ideal for applications in humanoid robotics, digital power systems, charging stations, energy storage inverters, servo motors, and optical communications.　　The GigaDevice STLs monitor GD32F5xx and GD32G5xx MCU modules in real-time to detect hardware faults. If a fault is detected, predefined safety mechanisms will be triggered to ensure the MCU always remains in a safe state, reducing potential risks and enhancing system reliability.　　This certification highlights GigaDevice's deep expertise in functional safety system design and its commitment to meeting the highest international safety standards, reinforcing its position as a trusted provider of secure, high-performance solutions for mission-critical industries.　　About GigaDevice　　GigaDevice Semiconductor Inc. is a global leading fabless supplier. Founded in April 2005, the company has continuously expanded its international footprint and established its global headquarters in Singapore in 2025. Today, GigaDevice operates branch offices across numerous countries and regions, providing localized support at customers' fingertips. Committed to building a complete ecosystem with major product lines – Flash memory, MCU, sensor and analog – as the core driving force, GigaDevice can provide a wide range of solutions and services in the fields of industrial, automotive, computing, consumer electronics, IoT, mobile, networking and communications. GigaDevice has received the ISO26262:2018 automotive functional safety ASIL D certification, IEC 61508 functional safety product certification, as well as ISO9001, ISO14001, ISO45001, and Duns certifications. In a constant quest to expand our technology offering to customers, GigaDevice has also formed strategic alliances with leading foundries, assembly, and test plants to streamline supply chain management.

Key word：

GigaDevice

Release time：2025-11-04 17:01 reading：880 Continue reading>>

Trade news

ROHM Develops Breakthrough Schottky Barrier Diode Combining Low VF and IR for Advanced Image Sensor Protection

　　ROHM has developed an innovative Schottky barrier diode that overcomes the traditional VF / IR trade-off. This way, it delivers high reliability protection for a wide range of high-resolution image sensor applications, including ADAS cameras.　　Modern ADAS cameras and similar systems require higher pixel counts to meet the demand for greater precision. This has created a growing concern – the risk of damage caused by photovoltaic voltage generated under light exposure during power OFF. While low-VF SBDs are effective countermeasures, low IR is also essential during operation to prevent thermal runaway. However, simultaneously achieving both low VF and IR has been a longstanding technical challenge. ROHM has overcome this hurdle by fundamentally redesigning the device structure – successfully developing an SBD that combines low VF with low IR which is ideal for protection applications.　　The RBE01VYM6AFH represents a novel concept: leveraging the low-VF characteristics of rectification SBDs for protection purposes. By adopting a proprietary architecture, ROHM has achieved low IR that is typically difficult to realize with low VF designs. As a result, even under harsh environmental conditions, the device meets market requirements by delivering VF of less than 300mV (at IF=7.5mA even at Ta=-40°C), and an IR of less than 20mA (at VR=3V even at Ta=125°C.) These exceptional characteristics not only prevent circuit damage caused by high photovoltaic voltage generated when powered OFF, but also significantly reduce the risk of thermal runaway and malfunction during operation.　　The diode is housed in a compact flat-lead SOD-323HE package (2.5mm × 1.4mm / 0.098inch × 0.055inch) that offers both space efficiency and excellent mountability. This enables support for space-constrained applications such as automotive cameras, industrial equipment, and security systems. The RBE01VYM6AFH is also AEC-Q101 qualified, ensuring suitability as a protection device for next-generation automotive electronics requiring high reliability and long-term stability.　　Going forward, ROHM will focus on expanding its lineup with even smaller packages to address continuing miniaturization demands.　　Key Specifications　　Application Examples　　Image sensor-equipped sets such as ADAS cameras, smart intercoms, security cameras, and home IoT devices.　　Terminology　　Photovoltaic Voltage　　A term commonly used with optical sensors, referring to the voltage produced when exposed to light. In general, the stronger the light intensity or higher the pixel count the greater voltage generated.

Key word：

ROHM

Release time：2025-10-27 16:49 reading：598 Continue reading>>

model	brand	Quote
CDZVT2R20B	ROHM Semiconductor
RB751G-40T2R	ROHM Semiconductor
MC33074DR2G	onsemi
TL431ACLPR	Texas Instruments
BD71847AMWV-E2	ROHM Semiconductor

model	brand	To snap up
BU33JA2MNVX-CTL	ROHM Semiconductor
IPZ40N04S5L4R8ATMA1	Infineon Technologies
BP3621	ROHM Semiconductor
ESR03EZPJ151	ROHM Semiconductor
STM32F429IGT6	STMicroelectronics
TPS63050YFFR	Texas Instruments

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