Renesas Introduces Power Management with Voltage Monitoring Solution for Space-Grade <span style='color:red'>AMD</span> Versal AI Edge Adaptive SoC
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Renesas Introduces Power Management with Voltage Monitoring Solution for Space-Grade AMD Versal AI Edge Adaptive SoC

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced a complete space-ready reference design for the AMD Versal™ AI Edge XQRVE2302 Adaptive SOC. Developed in collaboration with AMD, the ISLVERSALDEMO3Z power management reference design integrates key space-grade components for power management. It targets the cost-effective AI Edge with both rad-hard & rad-tolerant plastic solutions specifically designed to support a wide range of power rails for next-generation space avionics systems that demand tight voltage tolerances, high current, and efficient power conversion.　　The new ISLVERSALDEMO3Z power management reference design is fully qualified, enabling easy integration into satellite payload architectures. It includes a PMBus interface, giving users control of fault behaviors, protection levels and output regulation voltage. The new reference design also offers telemetry readouts of internal signals for system diagnostics. It is the industry’s only space-qualified power management system with a digital wrapper to optimize information transmission. The core power solution of this reference design is easily scalable with regard to output power, optimizing customers’ investments in design and qualification over time.　　As the number of Low-Earth Orbit (LEO) satellites increases, the need for lower cost space-grade systems is growing rapidly. Customers traditionally concerned with minimizing SWaP (Size, Weight and Power consumption) are now interested in reducing cost as well (SWaP-C). Renesas’ new ISLVERSALDEMO3Z power management reference design optimally addresses all of these factors. Space-grade plastic components decrease size, weight and cost while wide-bandgap GaN FETs enable the highest efficiency power conversion.　　The new Versal AI Edge Adaptive SoC converts raw sensor data into useful information, making the XQRVE2302 ideal for anomaly and image detection applications. It has a nearly 75% smaller board area and power savings over the previous-generation XQRVC1902. It also integrates the enhanced AMD AI Engine (AIE) technology, known as AIE-ML, which has been optimized for machine learning (ML) applications. Unlike competitive offerings, it supports unlimited reprogramming.　　“We’re proud to team with AMD to deliver this advanced solution that addresses the most pressing concerns of space customers,” said Josh Broline, Sr. Director, Marketing and Applications of the HiRel Business Division at Renesas. “Along with our hallmark power management expertise, this reference design meets SWaP-C objectives, enables real-time system monitoring and control, and unlocks the power of AI.”　　“The Versal™ AI Edge XQRVE2302 Adaptive SOC delivers unprecedented features and performance for the rapidly growing space market,” said Minal Sawant, senior director, Aerospace & Defense Vertical Market, AMD. “We’re pleased that Renesas offers advanced power management functionality that enables our customers to take full advantage of this solution.”　　Renesas’ new ISLVERSALDEMO3Z power management reference design comes with power management devices that have been tested and verified to withstand exposure to high levels of radiation. These include Pulse Width Modulation (PWM) controllers, GaN FET half-bridge drivers, point-of-load (POL) regulators, and power sequencers. The devices come in small-footprint packages, so the core power rail components take up just 67 square centimeters of board area.　　Also, the ISLVERSALDEMO3Z mates seamlessly with the ISL71148VMREFEV1Z voltage monitor reference design with 14-bit resolution to accurately monitor all 11 core power rails of the Versal AI Edge Adaptive SOC. The high resolution enables reliable system health monitoring. It includes a “dual-footprint” to accommodate both space plastic and rad-hard hermetic solutions.
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Release time：2024-07-19 14:24 reading：1084 Continue reading>>
<span style='color:red'>AMD</span> Closes In on NVIDIA, Securing Major Deals with Oracle and IBM
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AMD Closes In on NVIDIA, Securing Major Deals with Oracle and IBM

　　As Jiwei reported, AMD, although trailing NVIDIA in AI, has recently clinched significant deals, earning the trust of two major clients, Oracle and IBM. Oracle plans to integrate AMD’s Instinct MI300X AI chips into their cloud services, complemented by HPC GPUs. Additionally, as per insights from Ming-Chi Kuo, TF International Securities analyst, IBM is set to leverage AMD’s Xilinx FPGA solutions to handle artificial intelligence workloads.　　Oracle’s extensive cloud computing infrastructure faces challenges due to a shortage of NVIDIA GPUs. Nonetheless, Oracle maintains an optimistic outlook. They aim to expand the deployment of the H100 chip by 2024 while considering AMD’s Instinct MI300X as a viable alternative. Oracle has decided to postpone the application of their in-house chips, a project with a multi-year timeline. Instead, they are shifting their focus to AMD’s high-performance AI chip, the MI300X, well-regarded for its impressive capabilities.　　Reports indicate that Oracle intends to introduce these processor chips into their infrastructure in early 2024.　　Similarly, IBM is exploring chip options beyond NVIDIA. Their new AI inference platform relies on NeuReality’s NR1 chip, manufactured on TSMC’s 7nm process. AMD plays a pivotal role in NeuReality’s AI solution by providing the essential FPGA chips. Foxconn is gearing up for AI server production using this technology in the Q4 2023.　　Guo also pointed out that, although Nvidia remains the dominant AI chip manufacturer in 2024, AMD strengthens partnerships with platform service providers/CSPs like Microsoft and Amazon while acquiring companies like Nod.ai. This positions AMD to potentially narrow the AI gap with Nvidia starting in 2025. This collaboration also affirms that AMD remains unaffected by the updated U.S. ban on shipping AI chips to China.
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Release time：2023-10-24 16:33 reading：2125 Continue reading>>
Ameya360:Renesas and <span style='color:red'>AMD</span> to Demo Full RF, Digital Front-End Design for 5G AAS Radios at MWC 2023
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Ameya360:Renesas and AMD to Demo Full RF, Digital Front-End Design for 5G AAS Radios at MWC 2023

　　Renesas Electronics Corp. will showcase a full RF front end solution for 5G Active Antenna Systems (AAS) radios in collaboration with AMD at the Mobile World Congress in Barcelona, February 27–March 2.　　Paired with the field-proven AMD Zynq UltraScale+ RFSoC Digital Front End OpenRAN Radio (O-RU) Reference Design, the RF front end includes RF switches, low-noise amplifiers and pre-drivers. It offers a complete solution to meet the demand of the growing mobile network infrastructure market. The reference platform will be demonstrated at the AMD booth (#2M61 Hall 2).　　The new 5G design platform integrates all the essential RF and digital front-end hardware for base stations operating in the Open Radio Access Network (O-RAN) ecosystem. This includes a high-isolation multi-throw DPD (Digital Pre-Distortion) switch, a high-gain and linearity pre-driver in a compact package, an integrated switch and Low Noise Amplifier (LNA) with input signal coupling functionality. This full RF front end platform is designed to efficiently process and transmit data to wireless networks with optimized power levels. Moreover, it has been integrated with the AMD RFSoC DFE ZCU670 Evaluation Kit for quick prototyping and rapid development of wireless network systems. The platform offers superior RF performance, while minimizing DPD resources for TX channel linearization, improving radio efficiency and ultimately reducing operating costs for wireless network providers.　　The RF front-end solution is the latest 5G solution to be jointly developed by Renesas and AMD. Previously, the two companies collaborated on the high-performance RF timing solution for 5G Next-Gen Radio (5G NR), which incorporates Renesas’ IEEE 1588-enabled System Synchronizer as part of the DFE ZCU670 Evaluation Kit.　　“We are thrilled to be collaborating with AMD once again to demonstrate our latest RF capabilities at the upcoming Mobile World Congress,” said Naveen Yanduru, Vice President of RF Engineering at Renesas’ Infrastructure Business Division. “Using our turnkey hardware solution, developers of 5G RF wireless infrastructure systems can reduce development time and cost. We are confident that this solution will set a new standard in RF performance and efficiency for the wireless communication market.”　　“The RFMC expansion connectors on the ZCU670 evaluation board allow our customers to quickly prototype and evaluate a complete RF line up design for their Radio. To demonstrate, we have collaborated with Renesas again to develop an optimized RF Front End reference design targeting the N78 band,” said Brendan Farley, Corporate Vice President of Wireless Engineering at AMD. “As the market for OpenRAN 5G Radio (O-RU) continues to grow, these reference designs will help accelerate our mutual customers’ time to market with proven solutions.”
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Release time：2023-02-22 15:52 reading：3417 Continue reading>>
ASRock Mini PCs Based on <span style='color:red'>AMD</span> Ryzen 7000U-Series
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ASRock Mini PCs Based on AMD Ryzen 7000U-Series

　　ASRock Industrial has launched the 4X4 BOX 7000/D5 Series Mini PCs powered by AMD Ryzen 7000U-Series APUs with up to 8 Zen 3+ cores.　　Featuring maximum dual DDR5 4800MHz memory up to 64GB, the 4X4 BOX 7000/D5 Series bring about performance enhancement through unleashing higher standards of power, speed, and energy efficiency. Now poised with enriched IOs and expansions, the Series also provide quad-display outputs of up to 8K outstanding graphics with one HDMI 2.1, three DisplayPort 1.4a, and five USB ports, including two USB4 for versatile connectivity. Moreover, dual storages with one SATA 3.0, one M.2 Key M, plus dual LAN ports up to 2.5 Gigabit, Wi-Fi 6E, and Bluetooth 5.2 are supported for reliable communications.　　The unleashed features make this Series the leading choice for a wide range of top-notch applications such as gaming, entertainment, content creation, office productivity, business, and AIoT use cases.　　AMD Ryzen 7000 U-Series APUs and the first DDR5 support　　Powered by AMD Ryzen 7 7735Uand Ryzen 5 7535U, ASRock Industrial presents the 4X4 BOX 7000/D5 Series selections: 4X4 BOX-7735U/D5 and 4X4 BOX-7535U/D5. Featuring up to 8 Zen 3+ cores and next-generation AMD Radeon Graphics, the Series guarantee optimal power, speed, and performance upgrades.　　The 4X4 BOX 7000/D5 Series showcase the very first dual-channel DDR5 4800MHz SO-DIMM memory up to 64GB with new features that unleash effortless multitasking abilities for higher performance, lower power consumption, and more robust data integrity for future computing.　　Quad-display up to 8K, USB4, and dual LAN up to 2.5G　　The 4X4 BOX 7000/D5 Series support dual Realtek LAN ports up to 2.5 Gigabit and one 1 Gigabit with DASH function for remote management, plus Intel? Wi-Fi 6E support of 6GHz band and Bluetooth 5.2 to enable smooth real-time communications. For connections, the Series are equipped with two USB4 (Type C), one USB 3.2 Gen 2 (Type A), and two USB 2.0.　　With quad-display outputs up to 8K and integrated AMD Radeon Graphics, the Series support one HDMI 2.1 holding up to 7680×4320@60Hz and three DisplayPort 1.4a (two from Type C) holding 4096×2160@60Hz for you to enjoy uncompromised graphics. In addition, the expansion of dual storages support one SATA 3.0 and one M.2 Key M (2242/2260/2280) with PCIe Gen4 x4. There is also TPM 2.0 onboard for enhanced security support of Windows 11 upgrade, plus VESA mounting to easily mount your Mini PC and save space.　　The Series unleash incredible speed and power in the compact size of 110.0 x 117.5 x 47.85mm with fanned barebone, making them exceptionally easy to be carried around.　　Unleashed new potentials　　The new 4X4 BOX 7000/D5 Series powered by AMD Ryzen 7000U-Series APUs are here to unleash the advanced potentials in power and speed that you have been waiting for. Featuring next-generation DDR5 4800MHz memory, USB4 in conjunction with up to 8K quad-display, dual LANs up to 2.5G, Wi-Fi 6E, and dual storages support.　　This time, the compact Mini PCs provide greater energy efficiency for reduced environmental impact and operation costs, higher power, and faster speed in high-end gaming, content creation, office productivity, business, and AIoT applications.
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Release time：2023-02-09 15:40 reading：3086 Continue reading>>
<span style='color:red'>AMD</span> Discusses Future of High-performance and Adaptive Computing at CES 2023
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AMD Discusses Future of High-performance and Adaptive Computing at CES 2023

　　AMD Chair and CEO Dr. Lisa Su detailed the significant role high-performance and adaptive computing plays in creating solutions to the world’s most important challenges during her live keynote at CES 2023.　　“It is an honor to kick off CES 2023 and highlight all the ways AMD is pushing the envelope in high-performance and adaptive computing to help solve the world’s most important challenges,” said Dr. Su. “Together with our partners, we highlighted how AMD technology is advancing what is possible in AI, hybrid work, gaming, healthcare, aerospace and sustainable computing. We also launched multiple new mobile, gaming and AI chips that will make 2023 an exciting year for AMD and the industry.”　　AMD Product Innovation at CES 2023　　AMD announced new mobile and desktop processors to serve every type of user, from casual gamers and content creators to professionals and hybrid workers, along with new graphics solutions to bring the power of high-performance gaming to mobile.　　The AMD Ryzen 7000X3D Series processors with AMD 3D V-Cache technology, the fastest gaming processors in the world2.　　AMD Radeon RX 7000 Series Graphics for Laptops based on the AMD RDNA 3 architecture offering exceptional energy efficiency and performance to power 1080p gaming at ultra settings and advanced content creation applications on next-generation premium laptops.　　Dr. Su also shared the company’s latest advances to enable pervasive AI, including previewing new products to broaden its AI product portfolio from edge to cloud.　　AMD adaptable computing and AI technology powers the world’s most important medical solutions, enabling faster diagnoses and drug discoveries and better patient care. At CES, AMD announced the AMD Vitis Medical Imaging libraries to bring premium medical imaging products to market faster by reducing development times. These software libraries accelerate premium medical imaging on AMD Versal SoC devices with AI Engines to deliver healthcare providers and their patients high-quality, low-latency imaging.　　Finally, AMD adaptive computing solutions help satellites and spacecraft compute data and leverage pervasive AI to derive insights. During the keynote, Dr. Su shared how AMD FPGAs and adaptive SoCs are helping to shape the future of space exploration, powering recent space missions from Mars Curiosity and Perseverance to the recently launched Artemis moon mission.
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Release time：2023-01-11 13:50 reading：3107 Continue reading>>
<span style='color:red'>AMD</span> Takes Center Stage at CES
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AMD Takes Center Stage at CES

AMD President and CEO Lisa Su took to the stage at CES to give what some analysts suggested was the most important appearance by AMD at a tradeshow since a keynote at the now-defunct Comdex by then-CEO Hector Ruiz in 2002. She did not disappoint.Su announced that the Radeon VII GPU would be available starting next month and that its second-generation Ryzen mobile processors would begin showing up in ultrathin and gaming laptops by the end of the first quarter. Su also teased AMD's third-generation Ryzen desktop processor and its second-generation EPYC server processor, both of which are implemented in 7nm and will be available starting later this year.Analysts were enthusiastic about the announcements made by Su Wednesday in the first CES keynote by AMD since 2009, though at least some of the news had been revealed previously. Last November at an event in San Francisco, AMD first announced the 7nm Radeon 7 GPU and the 7nm server processor, which is codenamed "Rome" and based on AMD's Zen 2 x86 microarchitecture. The second-generation Ryzen mobile processors were announced by AMD on Sunday, prior to the start of CES.But Su provided more details Wednesday on all three chips."I think this was a landmark event for AMD," said Kevin Krewell, a principal analyst at Tirias Research. "It was quite dramatic for AMD to usurp the leadership role from Intel."Indeed, with 7nm silicon available next month, AMD will beat both Intel and Nvidia to the most advanced technology node. And by returning to the CES keynote stage, AMD also upstaged its rival, which lost its most coveted CES keynote spot this year to LG Electronics. (Intel, which has yet to replace CEO Brian Krzanich after he abruptly resigned in June, instead held a press conference event Monday).AMD President and CEO Lisa Su shows a 7nm Radeon VII graphics card. (Source: CES)Radeon VII, built on AMD's second-generation Vega architecture, boasts twice the memory and memory bandwidth compared to AMD's current top-of-the-line Radeon. It also improves gaming performance by up to 29% and offers up to 36% better content creation performance compared to the incumbent, AMD said.The device features 60 compute units (or 3,840 stream processors) running at up to 1.8GHz. It also has 16GB of HBM2 memory and 1 TB/s memory bandwidth."We really believe at the high end enthusiast market, you need great hardware," said Su, who devoted most of her 90-minute keynote to the gaming sector.She stressed that gaming requires cutting edge technology and brings people closer together. "Gamers love great technology and they provide us great feedback," Su said.The second-generation mobile Ryzen processors, AMD's Ryzen 3000 Series, are designed for both ultrathin and gaming laptops. The initial 3000 Series chips feature two or four cores with eight or four threads and boost performance of up to 4.0GHz. They will be available in laptops starting later in the first quarter and throughout the rest of the year from the likes of Acer, ASUS, Dell, HP, Huawei, Lenovo and Samsung.Perhaps most notable about the Ryzen 3000 Series is that the devices enable up to 12 hours of general productivity and 10 hours of video playback battery life, according to AMD."If it can actually provide 12 hours of 'productivity battery life" — not fake MobileMark or video playback — this would be big," Moorhead said. "It would be longer than any other notebook. I am looking forward to the reviews and testing myself."Details on the third-generation Ryzen desktop processors remain sketchy. Su showed an early version of the 7nm device going head-to-head with a top-of-the-line Intel Core i9 processor. The third-generation Ryzen desktop processors are based on AMD's Zen 2 microarchitecture and are expected to be the first PC processors to support PCIe 4.0 connectivity. Su said they would be introduced in mid-2019."As a desktop processor, it will absolutely set the bar" in performance, features, and power efficiency, Su said.Su also showed the Rome 7nm datacenter CPU, which is also based on the Zen 2 microarchitecture. She showed a demonstration pitting a pre-production EPYC Rome processor against two high-end Intel Xeon Platinum 8180 processors, with the EPYC processor showing about 15% greater performance.Among other things, Su said the second-generation EPYC offers four times the floating point performance and twice the computing performance per socket compared to its predecessor. "I will go so far as to say we believe it is the best server processor the world has ever seen," Su said."AMD has achieved phenomenal performance with Zen 2, something that we haven't seen in the x86 architecture for the past decade," said Jim McGregor, principal analyst at Tirias Research. "We finally have competition in PCs and servers from top to bottom. This bodes well for the future in products from both AMD and Intel."Speaking generally about the importance of high-performance computing at the beginning of the keynote, Su said the dramatic increases in the number of connected devices and data generated by them demand dramatic innovation to keep pace, particularly with Moore's Law scaling slowing to a comparative crawl."We are absolutely determined to drive high-performance computing innovation at the bleeding edge," Su said. "This is our job one."
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Release time：2019-01-10 00:00 reading：1425 Continue reading>>
CES 2019: <span style='color:red'>AMD</span> announces new mobile processor line-up
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CES 2019: AMD announces new mobile processor line-up

Semiconductor company AMD has unveiled latest processors for its mobility line-up, including the 2nd-generation Ryzen3000 Series Mobile, which are the world's fastest processor for ultra-thin laptops..The semiconductor major also unveiled AMD Athlon 300 Series Mobile Processors that power mainstream notebooks with "Zen" core and optimised 7th-Gen AMD A-Series chips for the first ever AMD-powered mainstream Chromebooks at the CES 2019 here."Starting this quarter, gamers, creators, and enthusiasts would be able to install Radeon Software Adrenalin to bring the latest GPU features and game optimisations to all systems powered by AMD Ryzen Processors with Radeon Graphics," the company said in a statement.The AMD Ryzen 3000 Series Mobile processors line-up includes AMD Ryzen 7 3750H with 10 GPU cores, AMD Ryzen 7 3700U, AMD Ryzen 5 3550H, AMD Ryzen 5 3500U, AMD Ryzen 3 3300U, AMD Ryzen 3 3200U and AMD Athlon 300U.The 7th Gen AMD A-Series processors powering Chromebooks from global Original Equipment Manufacturers (OEMs) such as Acer and HP, deliver fluid web browsing and effortless everyday productivity for social media, streaming, and web gaming, the company added.
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Release time：2019-01-08 00:00 reading：1444 Continue reading>>
x86 Server CPUs Remain Market Mainstream, 7nm Platform May Help <span style='color:red'>AMD</span> to Increase Market Share
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x86 Server CPUs Remain Market Mainstream, 7nm Platform May Help AMD to Increase Market Share

DRAMeXchange, a division of TrendForce, notes that x86 continues to be the mainstream architecture for server CPUs this year, with Intel and AMD being the market leaders. Particularly, Intel dominantly represents around 98% of the total server CPU shipments worldwide in 2018. For the next year, the market share of AMD x86 server CPUs is expected to go up to 5%, after the company’s introduction of 7nm CPUs to the market.“Generally speaking, Intel will remain the leader in server CPU market”, says Mark Liu, senior analyst from DRAMeXchange. However, competitions will come from AMD, who is on pace to migrate to more advanced processes and to offer solutions with better performances and lower power consumption. AMD’s solutions have been adopted by a small scale of cloud service providers like Baidu, Ali Cloud and AWS. AMD may have a chance to scale up in volumes after 7nm products are launched in the future.Purley Gen 2 remains in 14nm process, AMD 7nm solutions may be released in 2H19The latest survey of mainstream server CPU platforms finds that the market penetration rate of product lines based on Intel Purley Gen 1 (Sky Lake) has already reached 60% and is estimated to reach 65% at the end of 2018. Current consumers of Sky Lake products are mainly cloud service providers and alike, which require high-performance computing server products.In terms of product plan for the next year, Purley Gen 2 Cascade Lake will be still produced on 14nm process, the same as Gen 1. The new solution will not become the market mainstream until 2H19. For customized premium products, Intel will release Cascade Lake Xeon-AP (Advance Performance) in 2019. Currently, this product line still remains in the stage of verifying, so its small-scale market release will be delayed to the end of 2019.Around 70% of AMD's product lines have been transferred to new EPYC systems this year, while the company’s Naples solutions have migrated from 28/32nm to 14nm process, with computing performance improved significantly. However, AMD takes only about 2% in the current server CPU market. This is because AMD provides mainly 1-socket solutions, and the limited offerings have constrained the company’s market expansion compared with Intel.AMD's new solution, Rome, will migrate to the 7nm process. The company will also switch from GlobalFoundries to TSMC for future collaboration of product development on 7nm process. Previous problems of high power consumption will also be corrected. The Rome platform server processors are expected to enter production in 1Q19 and have a chance to come onto the market in the second half of next year.DRAMeXchange notes that the penetration of new platforms may drive the average content per box in servers. In 2019, the average density of DRAM in a server will see an annual growth of 25% YoY, significantly lower than almost 40% growth in 2018.
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Release time：2018-11-29 00:00 reading：1049 Continue reading>>
Lattice Semi Names Ex-<span style='color:red'>AMD</span> Exec CEO
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Lattice Semi Names Ex-AMD Exec CEO

Lattice Semiconductor named former AMD executive Jim Anderson its president and chief executive, effective Sept. 4.Anderson, who since 2015 was the general manager of AMD's computing and graphics group, succeeds Glenn Hawk, who had been serving as Lattice's CEO since March, when Darin Billerbeck announced his retirement.Jeff Richardson, Lattice chairman, said through a statement that the transformation Anderson brings a strong combination of business and technical leadership with a deep understanding of Lattice's target end markets and customers."We are excited to bring Jim’s proven leadership to Lattice as we accelerate all aspects of the company in order to capture the enormous opportunity that lies ahead,” Richardson said.Hawk, who has been Lattice's chief operating officer prior to becoming interim CEO, has agreed to stay with the company as a special advisor through Oct. 31, Lattice said."Lattice has a compelling combination of ground-breaking hardware and software solutions, global reach, and talented employees that forms a strong foundation for industry leadership and success," Anderson said.Prior to working at AMD, Anderson held a range of executive positions spanning general management, engineering, sales, marketing, and strategy at companies including, Intel, Broadcom (formerly Avago) and LSI Corp. He holds an MBA and two master's degrees in computer science, as well as four patents for innovations in computer architecture.
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Release time：2018-08-29 00:00 reading：1190 Continue reading>>
<span style='color:red'>AMD</span> Will Drive AI to the Edge
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AMD Will Drive AI to the Edge

Advanced Micro Devices is gearing up to join a race to accelerate deep-learning jobs in client and embedded systems. However, AMD is not yet ready to provide any specifics on the 7-nm x86 and GPU chips that it aims to deliver over the next year — or its roadmap beyond 7 nm.“There is a need for high performance with what we call the edge [of the network] … closer to the source where data is coming in and [needing] to be analyzed — often in real time,” said Mark Papermaster, AMD’s chief technology officer, in an interview. “AMD’s machine-learning strategy is holistic and provides engines of AI for both the data center and the edge.”In late 2016, AMD released its first GPU accelerators for deep learning in the data center. Since then, Google’s TensorFlow Processing Unit and other designs have shown the advantages of adding arrays of multiply-accumulate units (MACs) in hardware to speed deep-learning algorithms.In May 2017, graphics rival Nidia rolled out Volta, its first GPU with embedded MACs that it called tensor cores. AMD’s CPU rival, Intel, said earlier this year that it plans to move its Movidius accelerator to PC motherboards running Windows ML. Analysts believe that Intel will embed Movidius-inspired cores into its PC processors eventually.Papermaster would not say whether AMD plans to add MAC arrays to the 7-nm Vega GPU that it will launch later this year or the Zen-2 x86 processors that it will release early next year. However, he did say that Vega will support additional formats beyond the 16-bit floating point that the company’s GPUs support today.A lively debate rages over ways to simplify neural networks to speed deep-learning jobs. Arm will support 8-bit operations in its ML Core, Nvidia has done research on 2-bit operations, and Imec is researching a single-bit alternative.So far, AMD’s public roadmap only extends to use of a second-generation 7-nm process with extreme ultraviolet lithography for its Zen 3 products, probably starting in 2020. Papermaster declined to comment on what lies beyond.In an interview earlier this year, the chief executive of Globalfoundries, AMD’s main foundry partner for x86 chips, downplayed talk of a 5-nm node, suggesting that the company is seeking investors for a 3-nm fab. TSMC, which traditionally makes AMD’s graphics chips, is ramping up both 5-nm and 3-nm processes, and rival Samsung is even filling the gaps in between those nodes.Foundries “are advancing performance, performance per watt, and density, but it’s slowing versus the traditional Moore’s Law pace that the industry has become accustomed to … we will take advantage of full-node transitions as they come … in addition, we have a heterogeneous approach of using CPU, GPU, and other cores,” said Papermaster.Meanwhile, AMD is still waiting on so-called 2.1D packaging options such as versions of the wafer-level fan-out packages used in smartphones suitable for high-performance PC and server chips. Last year, Papermaster said that such options are two to three years away. This year, they don’t seem much closer.“We see OSATS push new techniques,” he said. “2.5D is proven … and experiments with other multilayer stacking techniques will bear fruit over time … I think we will see [alternatives to 2.5D packaging] in the next several years.”AMD beat rival Nvidia in 2015 by releasing Fiji, a graphics processor and memory stack on a 2.5D package. But the technique is relatively expensive and, so far, has not been suitable for mainstream users such as PC gamers.Separately, Papermaster offered no update on the progress of AMD’s joint venture partner, Tianjin Haiguang Advanced Technology Investment Co., said to be designing Zen-based x86 processors for the China market at AMD’s site in Austin. Papermaster was optimistic about the JV’s future despite the fact that versions of Arm, Power, and x86 processors designed by China companies have not gotten market traction there yet.“Just as the AMD Ryzen and Epyc has had uptake, I suspect our JV partner should see ready adoption of its x86,” he said. “There’s a massive installed base, so the barrier to adoption is low.”
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Release time：2018-07-19 00:00 reading：1615 Continue reading>>

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