MediaTek, ITRI Claim Firsts in 5G Technology

Release time:2017-12-20
author:Ameya360
source:Alan Patterson
reading:1215

  MediaTek and Taiwan’s Industrial Technology Research Institute (ITRI) have developed a range of technologies that include what they say is the world’s first LWA (LTE / Wi-Fi Link Aggregation) prototype system in preparation for commercialization of 5G by 2020.

  The partners have developed LWA technology that can improve network bandwidth in the 38/39 GHz millimeter range to overcome limitations with high-frequency transmission, according to a press statement today from MediaTek. In addition, the partners announced their Multi-User Superposition Transmission (MUST) technology for 5G base stations as part of an effort to build an ecosystem for Taiwan’s telecommunications industry.

  “In 2017, we have developed the world's first dual-mode base station prototype that combines LTE with 4G and 5G, breaking through with a technology for access at high-frequencies," said Chiueh Tzi-cker, vice president of ITRI’s Information and Communications Laboratories.

  The announcement is the latest milestone in several years of work by ITRI and MediaTek. At the 2016 Mobile World Conference in Barcelona, the partners demonstrated the world's first LWA system with network access speeds of up to 700 Mbps.

  MediaTek said that it will work with ITRI this year to focus more on the development of MUST technology.

  “MediaTek is the world's first company to employ technology for multi-user interference cancellation in mobile phone equipment,” said MediaTek Chief Technology Officer Yu Chun Chou. “By using ITRI’s test environment supporting MUST technology, MediaTek has completed the validation of this technology in a wireless environment, laying a solid foundation for its commercial use on 5G systems."

  The partners said they developed LWA technology to prepare for an uptake in 5G demand by helping to reduce telecommunication service providers’ operating and construction costs. LWA will allow mobile handsets to use both LTE and LTE Wi-Fi transmission data, thereby enhancing network transmission bandwidth and efficiency, according to MediaTek and ITRI.

  The partners plan to work with Taiwan service provider Chunghwa Telecom (CHT) on the early completion of interoperability testing as part of CHT’s aim to become the world's first commercial LWA system operator.

  Prior to the establishment of the 5G standard in 2018, MediaTek and ITRI have engaged in MUST technology R&D to create such capabilities as non-orthogonal multiple access (NOMA) and multi-user interference cancellation (MUIC). Functional testing and performance measurements of MUST on MediaTek's handsets within the 4G spectrum show an improvement in network efficiency of up to 40 percent under ordinary circumstances, according to MediaTek.

  ITRI, one of the world’s largest R&D organizations, is funded by the Taiwan government. The institute is credited with the establishment of Taiwan’s semiconductor industry, spinning off companies such as Taiwan Semiconductor Manufacturing Co. (TSMC) and United Microelectronics Corp. (UMC).

  Taiwan’s development of 5G technology won’t be the first time the nation has bet on next-generation wireless standards. In 2005, Taiwan launched its WiMAX Project aimed at bootstrapping its domestic tech industry into the 4G industry.

  Instead of WiMAX, also known as Worldwide Interoperability for Microwave Access, the rest of the world adopted long-term evolution (LTE) as the industry standard for 4G.

  MediaTek made WiMAX chips as a member of the Taiwan project, but the company later shifted development into LTE products. By July 2010, MediaTek signed an agreement with Japan’s largest phone operator, NTT DoCoMo, to develop LTE chips for Japan and global markets.

("Note: The information presented in this article is gathered from the internet and is provided as a reference for educational purposes. It does not signify the endorsement or standpoint of our website. If you find any content that violates copyright or intellectual property rights, please inform us for prompt removal.")

Online messageinquiry

reading
MediaTek to Win the 5G Competition by Alliance and Independent R&D
  The 3GPP standard conference will be held in Taipei, Taiwan, next week. To foster the local 5G supply chain in Taiwan, MediaTek, a key organizer of the conference, strove for keeping the event to be held in Taiwan with the aim of developing universal standards. Huang He-qi, general manager of the design and development department of MediaTek's communication system, pointed out that for the current situation of 5G, MediaTek will adopt the countermeasures of "wide-scale alliance and independent R&D".  The 3rd Generation Partnership Project (3GPP) is a standard organization dedicating to the development of 5G mobile communication in the world. There are more than 200 international companies participate in and even been called the Olympia Committee of communication standards. Because the standard drafting is like a tug-of-war match, major international companies are hoping to stand in a favorable position to seize the opportunity. Huang He-qi described: "It is a kind of competition, and everybody has their own strategies in it."  He pointed out that because each company has its technical position, therefore they will push their own technical proposals in the specifications to win its best interests. Huang explained that by pushing the proposal into a standard, in addition to being able to apply for a patent, it is also beneficial for the company to establish a technical threshold, so that competitors have no way to break through, and thus make their products more competitive.  Facing of this situation, Huang said that MediaTek will take the countermeasure of " wide-scale alliance and independent research" strategy. But he pointed out that the forming alliance is only a short term approach, and more importantly is to build deep technology and with flexible strategies.  MediaTek emphasizes that the development of 5G technology should not be a solo play, but needs to join hands with industrial partners to create an ecosystem.  Huang said that the Release 15 version was released in December last year. This year, it will be adjusted for more detail. The Release 16 version is expected to be announced in March 2020. He revealed that MediaTek is also expected to launch related products in 2020 to meet customer needs.
2019-01-21 00:00 reading:1438
MediaTek Launches Newest Combo Chip with Wi-Fi 6 and AP+Bluetooth
MediaTek announced its newest intelligent connectivity chipset to support the next generation of Wi-Fi technology - Wi-Fi 6 (802.11ax) - for home and enterprise wireless network services. It will support a range of products including wireless access points, routers, gateways and repeaters, bringing faster and more reliable connectivity throughout the smart home.MediaTek’s Wi-Fi 6 chips support 2x2 and 4x4 which comply with the most updated standards. The Wi-Fi 6 chip also has a flexible architecture to support updated features when the Wi-Fi 6 specification is finalized later in 2019.“Consumers rely on our high performance connectivity portfolio to power their favorite intelligent devices, and now with support for next generation Wi-Fi 6 we deliver an even more, robust and seamless connectivity experience,” said Jerry Yu General Manager of MediaTek’s Intelligent Devices business unit. “We will continue to innovate and bring the most advanced technology and standards to consumer and enterprise markets.” MediaTek currently holds market-leading positions in powering TVs, streaming devices, smart speakers, voice assistant devices and tablets.MediaTek also brings unique built-in solutions to its chipset along with meeting the newest Wi-Fi standard to improve the end-users experience. MediaTek connectivity technology, empowered with OFDMA, 1024QAM solves data traffic conflicts. It reschedules multi-user’s packets and provides a higher internet data rate so there is no lag while playing on-line games or streaming video.It also delivers better concurrent performance between Wi-Fi and Bluetooth with the latest Wi-Fi 6 access point + Bluetooth combo chip to guarantee spectrum efficiency when two radios work simultaneously.MediaTek also supports and is leading the deployment of the Wi-Fi Alliance EasyMesh standard for extended Wi-Fi coverage. MediaTek’s family of smart home chipsets will be EasyMesh compatible. The new standard extends the Wi-Fi signal for total access in the home or even into the backyard.
2019-01-11 00:00 reading:1303
Mediatek Targets China, Snapdragon
Mediatek announced its next-generation smartphone SoC just one week after archrival Qualcomm did the same. The Helio P90 falls short of the Snapdragon 855 in many respects but is likely to provide fierce competition a notch below flagship handsets, especially among China’s cost-conscious OEMs.Made in a 12-nm node, the P90 sports two Cortex-75 cores running at up to 2.2 GHz and six A55 cores at 2.0 GHz. By contrast, the 7-nm Snapdragon 855 uses four large cores, one running up to 2.84 GHz and three at 2.42 GHz, and four of the A55 cores at 1.80 GHz.Mediatek switched from a 4 × 4 configuration in its former P70, in which it ran A73 and A53 cores at 2.1 and 2.2 GHz, respectively, apparently not wringing much speed gains out of the 12-nm process. The use of a 2 × 6 configuration signals a strategy focused more on power efficiency.In connectivity, the P90 supports LTE Category 13 with 3× carrier aggregation (CA) up from Cat 7 with 2× CA, claiming downloads at up to 600 Mbits/s. It also supports 802.11ac Wi-Fi with 2 × 2 MIMO.For its part, the Snapdragon 855 integrates a Category 20 LTE modem supporting 7× carrier aggregation and two flavors of Wi-Fi — the 60-GHz 802.11ay and the pre-standard .11ax, both claiming to be capable of 10-Gbit/s data rates. In addition, Qualcomm pitches the 855 with its separate 5G modem, powering first-generation 5G handsets from Samsung and OnePlus early next year in sub-6-GHz and millimeter-wave bands.Mediatek has an M70 standalone 5G modem, but “we’re not certain how widely it will be made available commercially … we’re looking at going directly to an integrated SoC product rather than a standalone modem and focus on sub-6 GHz, aiming for customer products launching in late 2019 or early 2020,” said Russ Mestechkin, senior director of sales and business development at Mediatek.“Our focus is to commercialize our SoC for mainstream handsets at $500+ as opposed to ultra-premium models at $1,000+,” he added.Mediatek won sockets in the 2016 and 2017 models of China’s rising handset makers, but Qualcomm has been regaining ground with them this year. It’s a pitched battle in which Mediatek is “starting to win back share with Xiaomi and Vivo … Oppo and Vivo are also using its P50 in mid- to high-end products, which will bear fruit in 4Q18,” said Phil Solis, who tracks handset SoCs at International Data Corp.When it comes to 5G, “I expect they will gain back some market share by 1H20, but they are far behind” he said. “In the meantime, Mediatek will focus on its growth areas of smart speakers, TVs, IoT devices, and other consumer products for their processors and connectivity.”Both Mediatek and Qualcomm made AI acceleration a focus in multiple blocks of their latest chips.For the P90, Mediatek doubled the size of the so-called APU in the P70, which includes multiply-accumulate arrays for running machine-learning jobs. It also added a proprietary AI accelerator. The two blocks, combined with a PowerVR GM 9446 GPU running at 970 MHz, deliver 1,127 GMACs/s with software optimizations still ahead.The number falls far short of the 7 Tera tensor operations/s on 8-bit integer jobs that Qualcomm claims for its 855. But both sides agree that the benchmarks are less telling than performance on actual AI workloads, which vary widely.The Helio P90 beat the Snapdragon 845 and others on one AI benchmark. Click to enlarge. (Source: Mediatek)Mediatek is focusing on deep-learning applications such as face detection, object and scene identification, and accelerating augmented and virtual reality. Its NeuroPilot software can dynamically assign AI jobs and supports third-party frameworks, said the company without listing which ones.The P90 can drive dual 24- and 16-MP cameras or one 48-MP camera with video capture at up to 30 fps. It includes dedicated blocks to speed face recognition as well as accelerators for processing 3D depth maps, multi-frame noise reduction, and lens correction.
2018-12-14 00:00 reading:1514
MediaTek Adopts Qualtera’s Silicondash Platform to Enhance Semiconductor Yield and Quality
Qualtera today announced that MediaTek’s deployment of Qualtera’s Silicondash Smart Manufacturing Platform has gone live in June 2018 and is now handling the manufacturing operations. Silicondash is used as MediaTek’s primary corporate data analytics solution with data integration across the global supply chain of worldwide manufacturing and test suppliers. With a vision to further enhance manufacturing excellence, MediaTek has implemented Silicondash to further improve overall operational efficiency, yield management, quality control and IC-level traceability.The Silicondash Big Data platform uses embedded expertise, algorithms, analytical engines, machine learning techniques for data preparation, automated analytics and decision-making. Silicondash cloud-based technologies and collaborative features ensure effective collaboration with supply chain partners so that issues can be detected early and appropriate actions are taken swiftly.Qualtera EVP Marketing and Asia Business Operations, Paul Simon comments, “We have been collaborating with MediaTek since November 2017 and I am delighted to see that the Silicondash platform is now in high volume production handling analytics and IC level traceability across the manufacturing volume of MediaTek’s supply chain. The platform’s mix of real-time data collection, stream computing and big data analytics engines provides a host of high speed data visualizations, analytics and modeling capabilities giving semiconductor manufacturers and their supply chain partners the opportunity to improve operational KPIs, yields and product quality”
2018-12-11 00:00 reading:1550
  • Week of hot material
  • Material in short supply seckilling
model brand Quote
TL431ACLPR Texas Instruments
CDZVT2R20B ROHM Semiconductor
MC33074DR2G onsemi
BD71847AMWV-E2 ROHM Semiconductor
RB751G-40T2R ROHM Semiconductor
model brand To snap up
BP3621 ROHM Semiconductor
TPS63050YFFR Texas Instruments
ESR03EZPJ151 ROHM Semiconductor
IPZ40N04S5L4R8ATMA1 Infineon Technologies
STM32F429IGT6 STMicroelectronics
BU33JA2MNVX-CTL ROHM Semiconductor
Hot labels
ROHM
IC
Averlogic
Intel
Samsung
IoT
AI
Sensor
Chip
About us

Qr code of ameya360 official account

Identify TWO-DIMENSIONAL code, you can pay attention to

AMEYA360 weixin Service Account AMEYA360 weixin Service Account
AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.

Please enter the verification code in the image below:

verification code