Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era
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Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, has developed three System-on-Chip (SoC) technologies for automotive multi-domain electronic control units (ECUs). They feature advanced AI processing capabilities and chiplet functions, serving as the core technology platform for next-generation automotive electrical/electronic (E/E) architectures. Renesas presented the results at the International Solid-State Circuits Conference 2026 (ISSCC 2026), held February 15–19 in San Francisco, USA.　　In the age of software-defined vehicles (SDVs), automotive SoCs require advanced performance to run multiple applications simultaneously and must offer scalability through chiplets. They must also meet the functional safety requirements of automotive SoCs. As multi-domain SoCs powering central computing are growing larger and more complex, maintaining automotive-grade quality is becoming more difficult. With increased performance in advanced SoCs, power consumption also rises, making improvements in power efficiency and safety vital. To meet these needs, Renesas has developed the following new technologies.　　1. Chiplet architecture that supports functional safety　　To meet the functional safety requirements of automotive SoCs, Renesas has developed a new, proprietary architecture that supports ASIL D even in a chiplet configuration. By combining the standard die-to-die UCIe interface with a proprietary RegionID mechanism, the architecture prevents interference with hardware resources, even when numerous applications run simultaneously, thereby achieving Freedom from Interference (FFI).　　Conventional UCIe interfaces lack functionality to transmit RegionIDs between dies. Renesas developed a method for mapping RegionIDs into physical address space, encoding them into the UCIe region, and transmitting them. This enables safe access control through the memory management unit (MMU) and real-time cores, and meets functional safety requirements across chiplets. Additionally, by maintaining bandwidth from processors to the memory bus, the UCIe interface was confirmed through testing to achieve a high transmission speed of 51.2 GB/s, approaching the upper limit of intra-SoC transfer speeds. This technology provides both scalability and safety for high-performance automotive SoCs.　　2. Advanced AI processing capabilities and automotive-grade quality　　Automotive-grade quality is vital for SDV systems. Renesas has created a 3 nm SoC design that improves the performance of neural processing units (NPUs) for AI processing, while maintaining automotive-grade quality. In recent years, NPUs have been growing larger, with their area expanding 1.5-fold compared to previous generations. This has led to increased clock latency between shared clock sources and individual circuits. To address this problem, Renesas has redesigned the clock architecture by splitting up clock pulse generators (CPGs), which in past designs were module-level units, and placing mini-CPGs (mCPGs) at the sub-module level. This greatly reduces clock latency and meets timing requirements.　　However, multi-layer mCPGs complicate test clock synchronization, which is critical for achieving zero defects in automotive applications. Renesas has integrated test circuits into the hierarchical CPG architecture and unified the signal path for user clocks and test clocks. The new design also synchronizes upper- and lower-level mCPGs under a single clock source in test mode. This makes unified phase adjustment possible. As a result, Renesas has been able to achieve quality aligned with zero-defect expectations, even for large-scale SoCs, providing the high reliability required for next-generation SDV automotive SoCs.　　3. Advanced power control and monitoring for improved power efficiency and safety　　To achieve the high level of performance required for automotive SoCs with improved power efficiency and safety, Renesas has developed advanced power gating technology that uses over 90 power domains. It enables precise power control, from several milliwatts to several tens of watts, depending on operating conditions. Furthermore, Renesas has split power switches (PSWs) into ring PSWs and row PSWs to reduce IR drops (voltage drops) associated with increasing current density from smaller process geometries. When power is turned on, the ring PSW suppresses rush currents. Then the row PSW equalizes impedance within the domain. Together, these reduce IR drops by roughly 13% compared with conventional designs.　　To meet ASIL D functional safety standards, the dual core lock step (DCLS) configuration controls the master and checker cores with independent power switches and controllers. With this design, even if one side fails, the failure can be detected through lockstep operation. Furthermore, loopback monitoring is performed for each PSW's gate signal, so OFF states are detected when a failure occurs. A digital voltage meter (DVMON), which is highly resistant to temperature drift, is used for voltage monitoring. This improves aging tolerance by 1.4 mV. These technologies enable high-performance automotive SoCs that offer both power efficiency and safety.　　These new technologies are being used in Renesas' R-Car X5H SoC for automotive multi-domain ECUs. With R-Car X5H, users can accelerate the evolution of SDVs while ensuring safety and enabling autonomous driving, digital cockpit and more.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at renesas.com. Follow us on LinkedIn, Facebook, X, YouTube, and Instagram.　　(Remarks) All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.
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Release time：2026-02-28 15:45 reading：244 Continue reading>>
TDK extends X2 portfolio with compact 350 V (AC) capacitors for industrial and <span style='color:red'>automotive</span>
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TDK extends X2 portfolio with compact 350 V (AC) capacitors for industrial and automotive

　　TDK Corporation (TSE:6762) extends its X2 safety film capacitor portfolio with the new B3292xU/V series,now supporting higher voltages and offering compact lead spacings of 15 mm and 22.5 mm, with capacitance values from 47 nF to 1.8 µF. Rated at 350 V (AC) and robust against peak voltage pulses up to 2.5 kV(IEC 60384-14), the series is designed for interference suppression in demanding, space-constrained industrial and automotive environments in series with the mains. Typical applications are on-board chargers, EV charging systems, PV inverters, energy meters, and capacitive power supplies.　　The entire series is now available with lead spacings from 15 mm to 52.5 mm, covering capacitance values from 47 nF to 20 µF. It passed the THB (temperature, humidity, bias) test at +85 °C, 85% RH, and rated voltage for 1000 h, meeting Grade III, Test Condition B requirements. In addition, the series offers AEC-Q200 compliance, excellent self-healing properties, and a maximum operating temperature of +110 °C, ensuring durability even under severe ambient conditions.　　With their compact dimensions and high DC testing voltage (1505 V for 2 s), the B3292xU/V series provides a balanced solution of performance and size for next-generation industrial drives and automotive power electronics, supporting the growing need for efficient and space-optimized EMI suppression solutions.　　For the B3292xU/V series, TDK offers a range of design tools and SPICE models.　　Main applications　　Capacitive power supplies, energy meters　　Industrial drives　　On-board chargers　　EV charging　　PV inverter　　Main features and benefits　　X2 class for interference (EMI) suppression　　“Across the line” applications　　For connections in series with the mains　　Severe ambient conditions　　Small dimensions　　Good self-healing properties　　AEC-Q200E compliant
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Release time：2026-02-27 16:14 reading：281 Continue reading>>
ROHM’s New Compact, Highly Reliable Package Added to Automotive 40V/60V MOSFET Lineup
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ROHM’s New Compact, Highly Reliable Package Added to Automotive 40V/60V MOSFET Lineup

　　ROHM has expanded its lineup of low-voltage (40V/60V) MOSFETs for automotive applications – such as main inverter control circuits, electric pumps, and LED headlights – by introducing latest products adopting the new HPLF5060 package (4.9mm × 6.0mm).　　In recent years, automotive low-voltage MOSFETs have been trending toward smaller packages, such as the 5060-size and even more compact options. However, this miniaturization introduces significant challenges for achieving reliable mounting, primarily due to narrow terminal spacing and leadless designs.　　To address these issues, the new HPLF5060 package offers a smaller footprint compared to the widely used TO-252 package (6.6mm × 10.0mm) while enhancing board-mount reliability through the adoption of gull-wing leads. Additionally, the use of copper clip junction technology enables high-current operation, making the HPLF5060 an ideal solution for demanding automotive environments.　　Mass production of new products using this package began in November 2025 (sample price: $3.5/unit, excluding tax).　　In addition to expanding the lineup of products using this package, mass production of the smaller DFN3333 (3.3mm × 3.3mm) package, which employs wettable flank technology, is scheduled to begin around February 2026. Furthermore, development has commenced on a TOLG (TO-Leaded with Gull-wing) package (9.9mm × 11.7mm) to further expand the lineup of high-power, high-reliability packages.　　☆ : Under Development　　Application Examples　　Main inverter control circuits, electric pumps, LED headlights, etc.　　EcoMOS™ Brand　　EcoMOS™ is ROHM's brand of silicon power MOSFETs designed for energy-efficient applications in the power device sector. Widely utilized in applications such as home appliances, industrial equipment, and automotive systems, EcoMOS™ provides a diverse lineup that enables product selection based on key parameters such as noise performance and switching characteristics to meet specific requirements.　　・EcoMOS™ is a trademark or registered trademark of ROHM Co., Ltd.　　Terminology　　Gull-Wing Leads　　A terminal structure that spreads outwards from both sides of the package. It achieves excellent heat dissipation along with increased mounting reliability. It is called “Gull-Wing” because its appearance resembles the wing of a seagull.　　Copper Clip Junction Technology　　A technology that uses copper clips (flat metal bridges) to connect chips and lead frames directly, replacing the conventional wire bonding method.　　Wettable Flank Technology　　A technology for plating the sides of the lead frame on bottom electrode packages such as QFN and DFN to improve mounting reliability.
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Release time：2026-02-25 17:46 reading：260 Continue reading>>
NOVOSENSE and Inovance Automotive Co-Develop IC Solutions for Next-Generation Electric Drive Platforms
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NOVOSENSE and Inovance Automotive Co-Develop IC Solutions for Next-Generation Electric Drive Platforms

　　NOVOSENSE Microelectronics announced that two highly integrated ICs—an isolated sensing IC and a logic ASC IC—developed in close collaboration with Inovance Automotive, a leading supplier of intelligent electric vehicle components and solutions, have entered mass production on Inovance Automotive’s next-generation electric drive (e-drive) platform. The customized IC solutions offer higher integration and optimized performance, supporting the ongoing shift toward more integrated electric drive systems while enabling designs that meet increasingly stringent functional safety requirements.　　Conventional discrete electric drive designs rely on widely distributed components and complex wiring, often resulting in larger system size, higher power losses, slower response, and constrained reliability. As electric vehicles continue to demand longer driving range and higher output power, electric drive architectures are moving rapidly toward multi-in-one and highly integrated designs. In this context, semiconductor solutions must deliver greater functional integration while maintaining accuracy, reliability, and functional safety margins within limited space, without constraining system-level design flexibility.　　Building on more than a decade of experience in motor controller system architectures and functional safety, Inovance Automotive proactively defined the key functional and performance requirements for the isolated sensing IC and logic ASC IC at an early stage of development. In response to these requirements, NOVOSENSE integrated high-voltage LDO, isolated sensing amplifier, and isolated comparator into a single isolated sensing IC. This integration significantly reduces external component while enabling high-precision isolated voltage sensing, fast OV/UV protection, and more compact electric drive designs.　　The customized logic ASC IC further integrates multiple logic functions and supports frequency detection, enabling centralized handling of interface-related logic. This approach simplifies interface design, improves overall system integration, and supports more compact inverter layouts. At the same time, it helps reduce BOM cost and provides a solid foundation for optimizing functional safety architectures in electric drive and traction inverter systems.　　By replacing mature discrete circuits with integrated IC solutions, the collaboration delivers clear system-level benefits.　　Simplified architectures and fewer components reduce potential failure points and improve overall product robustness.　　Higher integration lowers PCB area requirements, creating additional headroom for increased power density.　　Standardized IC solutions also streamline development by reducing design and validation effort, helping shorten development cycles and accelerate time-to-market.　　"Electric drive systems are entering a phase where higher integration is becoming essential, and progress at the chip level increasingly translates into system-level advantages," said Zheng Chao, Director of the R&D Center at Inovance Automotive. "This collaboration combines our strengths in electric drive systems with NOVOSENSE’s expertise in automotive semiconductors. More importantly, it reflects an important capability upgrade for Inovance Automotive—we are not only developing high-performance power electronics products, but also participating from the outset in defining system architectures and core chips. We look forward to continuing our work with NOVOSENSE to shape next-generation electric drive platforms and deliver more competitive system solutions to OEMs."　　"NOVOSENSE and Inovance Automotive have established a strong foundation for collaboration," said Ye Jian, Product Line Director at NOVOSENSE. "This project demonstrates both our customer's confidence in our technology and our application-driven approach to innovation. By drawing on our long-standing expertise in isolation and interface technologies, we will continue to deliver high-precision, high-performance, and high-reliability IC solutions to support Inovance Automotive's next-generation electric drive platforms."　　NOVOSENSE's Isolation+ portfolio covers digital isolator, isolated sensing, isolated driver, isolated power, and isolated interface, with cumulative shipments exceeding two billion units as of October 2025. The company also offers a broad automotive interface portfolio—including CAN, LIN, SerDes, logic ICs, and level shifters—providing customers with one-stop automotive-grade isolation and interface solutions. Across the new energy vehicle electrical system, NOVOSENSE works with hundreds of component suppliers, delivering semiconductor solutions for traction inverter, onboard charger (OBC), DC/DC converter, and battery management system (BMS), spanning sensor, signal chain, power management IC, and MCU.
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Release time：2026-02-25 17:36 reading：318 Continue reading>>
NOVOSENSE launches <span style='color:red'>automotive</span>- and industrial-grade NSCSA240-Q series current sense amplifiers to address PWM transient interference challenges
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NOVOSENSE launches automotive- and industrial-grade NSCSA240-Q series current sense amplifiers to address PWM transient interference challenges

　　NOVOSENSE announced the launch of its new bidirectional current sense amplifier series, NSCSA240-Q, covering both industrial and automotive versions, designed for high-voltage PWM systems in vehicles and industrial equipments. The NSCSA240-Q series integrates enhanced PWM rejection technology, supporting bidirectional current sensing with exceptional transient immunity, automotive-grade precision, and flexible configurability. Featuring an ultra-wide input common-mode range from –4V to 80V, a typical input offset voltage of ±5μV, and a 135dB DC Common-Mode Rejection Ratio (CMRR). This series effectively tackles the challenge of high-frequency transient interference in PWM systems, providing a highly reliable current monitoring solution for automotive electronic power steering (EPS), motor drive, industrial automation and other applications. The NSCSA240-Q series meets the AEC-Q100 automotive reliability standard.　　Superior Transient Immunity: Reliable Performance in High-Voltage PWM Environments　　In PWM systems, rapid switching can cause severe common-mode voltage fluctuations that distort output signals in conventional amplifiers. The NSCSA240-Q series achieves an AC CMRR of 90dB at 50kHz, effectively suppressing ΔV/Δt transients. Its proprietary transient suppression design reduces output disturbances by up to 80%, achieving a recovery time of less than 10μs under 80V common-mode voltage transients. With a bandwidth ranging from 450kHz to 600kHz (gain-dependent), it supports both high-speed overcurrent protection and accurate low-frequency PWM signal capture—ensuring stable, low-noise signal performance for EPS, motor drive and industrial motor control systems. The wide –4V to 80V input common-mode range offers broad dynamic capability and robust tolerance across 12V, 24V, and 48V vehicle power architectures. Furthermore, ±2000V ESD protection (HBM/CDM) enhances resistance to external electrical disturbances, ensuring overall system reliability.NSCSA240-Q Series Application Diagram　　Automotive-Grade Precision: ±5μV Offset and ±0.1% Accuracy Across –40°C to 125°C　　Designed to meet the increasingly stringent current measurement requirements of automotive electronics, the NSCSA240-Q series delivers exceptional measurement stability. It features a typical input offset voltage of only ±5μV (maximum ±25μV) and achieves ±0.1% accuracy over a wide temperature range (–40°C to 125°C). With a typical gain error of 0.05%, it ensures reliable and consistent current monitoring even under harsh conditions. Fully qualified to the AEC-Q100 automotive standard, the series guarantees long-term reliability in demanding in-vehicle environments.　　Flexible Integration: Multiple Gain and Package Options for Design Optimization　　As automotive systems trend toward miniaturization and integration, the NSCSA240-Q series is engineered for flexible and space-efficient design. It offers four fixed gain options—20V/V, 50V/V, 100V/V, and 200V/V—supporting shunt resistors ranging from 10mΩ to 0.1mΩ for flexible current detection. The series is available in two compact packages: SOIC-8 (4.9mm × 3.91mm) and TSSOP-8 (3mm × 4.4mm), allowing easy integration into space-constrained motor controller PCBs and helping designers optimize system layouts within limited board area.NSCSA240-Q Series Package
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Release time：2026-01-12 13:52 reading：999 Continue reading>>
GigaDevice Achieves ISO/SAE 21434 Certification and ASPICE CL2 Assessment, Strengthening Automotive Cybersecurity Together with TÜV Rheinland
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GigaDevice Achieves ISO/SAE 21434 Certification and ASPICE CL2 Assessment, Strengthening Automotive Cybersecurity Together with TÜV Rheinland

　　GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, has been awarded the ISO/SAE 21434 Road Vehicles Cybersecurity Engineering certification by TÜV Rheinland. In parallel, the MCAL (Microcontroller Abstraction Layer) software of GD32A7 automotive-grade MCUs successfully passed the ASPICE Capability Level 2 (CL2) assessment. These milestones demonstrate GigaDevice’s alignment with internationally recognized practices in automotive cybersecurity and software project management, reinforcing its competitiveness in the global automotive electronics market.　　ISO/SAE 21434, jointly issued by ISO and SAE, defines a comprehensive cybersecurity risk-management framework that spans the entire vehicle lifecycle. As vehicles become increasingly connected and intelligent, cybersecurity has emerged as a foundational requirement for protecting user privacy and ensuring a secure, reliable mobility experience. Achieving this certification confirms that GigaDevice has established an end-to-end cybersecurity governance framework across the design, development, and mass-production phases of its automotive product portfolio—helping customers streamline compliance, accelerate program approvals, and enhance market competitiveness.　　The ASPICE assessment model, governed by the German Association of the Automotive Industry (VDA), is one of the industry's most important standards for evaluating software development capability. ASPICE CL2 requires companies to adopt structured processes for project planning, monitoring, and traceability. Developed in full compliance with AUTOSAR, the GD32A7 MCAL software supports major compilers and debugging toolchains while meeting both functional-safety and cybersecurity requirements. Passing ASPICE CL2 affirms the maturity of GigaDevice’s software-development lifecycle and underscores its commitment to high-reliability automotive solutions.　　Driven by new infrastructure such as 5G, AI, and the IoT, vehicles are evolving into interactive intelligent terminals. Automotive-grade chips play a central role in this transition, enabling continuous advancements in vehicle intelligence. Designed for next-generation automotive platforms, the GD32A7 series leverages the Arm® Cortex®-M7 core and offers multiple configurations, including single-core, multi-core, and lockstep architectures. With a maximum frequency of 320MHz and up to 1300 DMIPS of compute performance, the devices support 2.97V–5.5V operation and deliver stable performance across a –40°C to +125°C temperature range. The series are well suited for applications such as body electronics, intelligent cockpit systems, chassis control, and powertrain subsystems.　　The GD32A71x/GD32A72x families comply with ISO 26262 ASIL B, while the GD32A74x series supports ASIL D requirements. All product lines integrate a Hardware Security Module (HSM) with TRNG, AES, HASH, ECC/RSA, and Chinese SM2/SM3/SM4 cryptographic engines, meeting the Evita Full information-security architecture and providing robust data protection for in-vehicle systems.　　Wenxiong Li, Vice President of GigaDevice and General Manager of the Automotive BU, stated: “Achieving ISO/SAE 21434 certification and ASPICE CL2 capability assessment marks an important milestone in elevating our automotive-grade MCU development to higher standards of security and process maturity. GigaDevice will continue to expand the GD32 MCU automotive portfolio and deepen our collaboration with TÜV Rheinland to deliver higher-performance, higher-security products and a more complete ecosystem for our customers.”　　Bin Zhao, General Manager of Industrial Services and Cybersecurity at TÜV Rheinland Greater China commented: “GigaDevice has demonstrated exceptional execution and technical competence in establishing automotive cybersecurity systems and software development processes. Obtaining ISO/SAE 21434 certification and ASPICE CL2 capability assessment provides strong validation for its entry into global automotive supply chains. We look forward to further collaboration to advance innovation and deployment in automotive electronics safety.”　　GigaDevice and TÜV Rheinland also announced the establishment of a strategic partnership focused on functional safety, cybersecurity, personnel training, and certification services. The collaboration aims to integrate both parties' strengths to enhance competitiveness across automotive, industrial, and emerging markets—delivering safer and more reliable products and solutions to customers worldwide.
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Release time：2025-12-26 16:25 reading：1106 Continue reading>>
Murata expands lineup of high cutoff frequency chip common mode choke coils in 0504-inch size for <span style='color:red'>automotive</span> high-speed differential interfaces
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Murata expands lineup of high cutoff frequency chip common mode choke coils in 0504-inch size for automotive high-speed differential interfaces

　　Murata Manufacturing Co., Ltd. (hereinafter ‘Murata’) has added a high cutoff frequency*1 product to its lineup of noise suppression components, the 0504-inch size (1.25 x1.0mm) chip common mode choke coils ‘‘DLM11C_HH2 Series’’ (hereinafter, ‘the product’), suitable for automotive high-speed differential interfaces such as LVDS*2, SerDes*3, USB, and HDMI. Murata has already started mass production of this product.　　*1High cutoff frequency: Reduces high-frequency noise.　　*2LVDS (Low Voltage Differential Signaling): An interface used for LCD panels.　　*3SerDes (Serializer/Deserializer): Circuits that convert between the serial and parallel signals in each direction.　　In recent years, the automotive market has seen multiple USB ports installed in each vehicle seat as interfaces for connecting smartphones and PCs, and data transfer speeds have increased from conventional USB 2.0 to Gbps-class USB 3.2. For these differential interfaces, common mode noise suppression is essential, and small common mode choke coils that support high-speed signals are required. In response, Murata developed this product using proprietary lamination technology to reduce high-frequency noise above 7.5 GHz in a compact 0504-inch size.　　Specifications　　*4AEC-Q200: One of the standards defined by the Automotive Electronics Council (AEC).
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Release time：2025-11-10 17:12 reading：678 Continue reading>>
NOVOSENSE launches NSUC1612: Fully Integrated Embedded Motor Drive SoC for Smarter, Cost-Efficient Automotive Actuators
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NOVOSENSE launches NSUC1612: Fully Integrated Embedded Motor Drive SoC for Smarter, Cost-Efficient Automotive Actuators

　　NOVOSENSE has released the NSUC1612, a next-generation motor driver SoC designed to address the limitations of traditional discrete solutions in automotive smart actuators, such as system complexity, high cost, and limited reliability.　　With its fully integrated single-chip architecture, the NSUC1612 can simplify design, reduce cost, and enhance stability. It supports a wide range of applications, including automotive water valves, automotive air-conditioning vent, active grille shutters, as well as stepper motors, DC brushed motors, and DC brushless motors—delivering an efficient and scalable solution for automotive electronics.　　1.Fully Integrated Architecture: Simplified Design, Reduced Complexity　　Conventional actuator control systems often require multiple components, including MCU, motor drivers, communication interfaces, and protection circuits, leading to complex PCB layout, increased solder joints, and compatibility issues.The NSUC1612 integrates a 32-bit ARM® Cortex®-M3 MCU with 4- or 3-channel half-bridge drivers, LIN/CAN controller communication interfaces, a 12-bit ADC, temperature sensors, and other essential modules, all in a single-chip. This eliminates the need for additional companion ICs while covering the full motor control, communication, and protection process.By reducing external components and simplifying hardware design, the NSUC1612 shortens development cycles and minimizes EMI risk through optimized internal signal routing.　　2.Excellent EMC Performance: Reliable Operation in Harsh Environments　　Automotive electronics operate in complex electromagnetic conditions where EMC performance directly impacts actuator precision and system stability. The NSUC1612 provides simplified reference circuits and optimized PCB layout. In compliance with CISPR 25:2021 Class 5, it passes stringent automotive EMC/EMI tests, compliant with the automotive standardsSelected Test Results Based on CISPR 25:2021　　This ensures stable motor control signals and helps prevent malfunctions such as actuator stalls or misoperation caused by electromagnetic interference.　　3.Strong Performance: Balanced Drive Capability and Processing Power　　The NSUC1612 is designed to deliver both reliable motor driving capability and efficient computation: NSUC1612B: 4 half-bridge outputs, peak current up to 500 mA NSUC1612E: 3 half-bridge outputs, peak current up to 2.1 AThese options support brushed DC, BLDC, and stepper motors across diverse applications, from HVAC air vent adjustment to seat ventilation.　　The ARM® Cortex®-M3 core with Harvard architecture integrates 32 KB Flash, 2 KB SRAM, and 15 KB ROM with Bootloader, supporting OTA upgrades. A 32 MHz high-precision oscillator with PLL ensures stable computation, while low-power sleep mode consumes less than 50 μA across the full operation temperature range, balancing performance with energy efficiency.　　4.Automotive-Grade Reliability: Built for Demanding Conditions　　The NSUC1612 is designed with comprehensive reliability features to withstand harsh operating environments. It is compliant with AEC-Q100 Grade 1, supporting junction temperatures up to 150°C and ensuring stable operation across a wide temperature range from -40°C to +125°C. The device’s LIN port can tolerate up to ±40 V, while the BVDD pin supports -0.3 V to 40 V, enabling direct connection to 12V automotive batteries. In addition, integrated protection mechanisms such as over-voltage and over-temperature safeguards provide robust defense against voltage fluctuations and transient surges, delivering system-level reliability under real-world automotive conditions.　　The NSUC1612 extends its value through broad application compatibility, making it suitable for automotive actuator systems. It supports brushed DC, BLDC, and stepper motors, while integrated communication interfaces—including LIN PHY (compliant with LIN 2.x, ISO 17987, and SAE J2602), FlexCAN, and SPI—allow seamless integration into existing automotive network architectures.　　The NSUC1612 is ideal for a wide range of applications, including thermal management components (e.g., automotive water valves and expansion valves), cabin comfort modules (automotive air-conditioning vent), and smart body systems (active grille shutters and charging port actuators). By integrating these functions into a single device, it helps reduce design costs and simplify development.
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Release time：2025-09-23 13:12 reading：1810 Continue reading>>
Adapting to challenging magnetic environments: MT73xx 3D dual-output Hall latches from NOVOSENSE enable precise <span style='color:red'>automotive</span> motor control
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Adapting to challenging magnetic environments: MT73xx 3D dual-output Hall latches from NOVOSENSE enable precise automotive motor control

　　The NOVOSENSE MT73xx series dual-output Hall latches, based on 3D Hall technology, support SS (Speed & Speed) or SD (Speed & Direction) dual-channel outputs and complies with Automotive Grade 0 standards. Ideal for motor control systems such as power windows, liftgates, and sunroofs, this product family enhances the accuracy and stability of speed and position detection, optimizing overall in-vehicle comfort.　　In motor control systems, precise detection of speed and direction signals directly influences system response speed and operational stability. Traditional solutions typically rely on a combination of two separate Hall latches, requiring high magnetic ring installation precision. This often leads to issues such as signal phase deviation, poor synchronization, and structural complexity.　　Integrates a 3D Hall sensing structure with inherent orthogonal output characteristics, the MT73xx series can simultaneously deliver dual-channel speed signals (SS output) with a 90° phase difference or speed and direction signals (SD output), making it widely suitable for “speed-direction” detection applications. This design reduces dependency on precise positioning of magnetic poles, mitigates dual-channel phase deviation, simplifies system architecture, and improves overall system stability, providing a more flexible and reliable solution for motion control detection.　　Compatibility with diverse magnetic ring configurations enabled by VHS technology　　To achieve high-precision 3D sensing, the MT73xx series adopts NOVOSENSE’s proprietary VHS (Vertical Hall Sensor) technology. Through combinations of XY, YZ, and XZ axial sensing, any two axes naturally deliver orthogonal outputs, enhancing signal synchronization.　　Additionally, the MT73xx series offers excellent compatibility with various magnetic ring configurations – whether axial, radial, or irregularly shaped magnets – maintaining robust duty cycle performance. This allows customers to adapt designs flexibly depending on magnetic ring characteristics and installation environments, further reducing development complexity and tuning costs.　　Dual-output design for optimized system integration　　Regarding system integration, the MT73xx’s dual-output capability allows it to replace traditional single- or dual-Hall solutions by directly transmitting SS (Speed & Speed) or SD (Speed & Direction) signals to ECU, minimizing the requirements for peripheral redundant position sensors.　　This approach not only saves PCB space and simplifies structural layouts, but also enhances solution integration, offering greater design flexibility for innovative applications in motor control and intelligent cockpit systems.
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Release time：2025-08-13 15:35 reading：1883 Continue reading>>
PRI Certification, the #2 Certification Body in China, Launches IATF 16949 Services to Support Growing Automotive Industry
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PRI Certification, the #2 Certification Body in China, Launches IATF 16949 Services to Support Growing Automotive Industry

　　PRI Certification Expands by Adding IATF 16949 Certification Services in China and Enhances Position as One of the Top Two Chinese CBs with 18% Market Share　　PRI Certification proudly announces the official launch of IATF 16949 certification services in China. The expansion through PRI China’s Beijing office allows the organization to offer IATF 16949 services directly to the Chinese marketplace. In addition to this stronger presence in China, PRI Certification also holds the #2 market share in the United States. This dual-market leadership underscores PRI’s global credibility and trusted reputation across two of the world’s most significant manufacturing regions.　　This strategic move solidifies PRI Certification’s commitment to delivering high-quality, industry-specific certification solutions throughout Asia. While the Beijing office will serve as the local hub for client engagement and auditing, all technical and certification decisions will continue to be supported through PRI’s team in Warrendale, Pennsylvania, USA—ensuring global consistency, technical rigor, and impartial oversight.　　Over a Decade of Experience in Asia　　PRI Certification has been delivering IATF 16949 certification in Japan for over 10 years, earning a strong reputation for excellence and reliability in the region. Expanding into China is a natural progression that aligns with growing demand in the Asian automotive market.　　Expert Auditors with Deep Automotive Knowledge　　PRI’s auditors bring unmatched technical expertise and practical insight to each audit. This ensures clients receive not just compliance evaluations but also process improvements that contribute to lasting business value.　　Tailored Audits Across 30+ Industries　　PRI Certification has successfully delivered certification services across more than 30 industries worldwide. The organization’s approach to auditing is tailored to the specific needs of the automotive sector, making PRI a trusted partner for companies pursuing or maintaining IATF 16949 Certification.　　Continuing a Legacy of Quality in China　　PRI has been providing certification services in China since 2010, helping organizations achieve international quality benchmarks across a wide range of sectors. The introduction of IATF 16949 services marks a significant milestone, strengthening PRI’s ongoing commitment to the region’s automotive manufacturing excellence.
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Release time：2025-08-05 14:46 reading：763 Continue reading>>

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AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.

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