Top 10 IC Design Houses’ Combined Revenue Grows 12% in 2023, NVIDIA Takes Lead for the First Time, Says <span style='color:red'>TrendForce</span>
  In 2023, the combined revenue of the world’s top ten IC design houses reached approximately $167.6 billion, marking a 12% annual increase. This growth was primarily driven by NVIDIA, which saw a remarkable 105% increase in revenue, significantly boosting the overall industry. While Broadcom, Will Semiconductor, and MPS experienced only marginal revenue growth, other companies faced declines due to economic downturns and inventory reductions, says TrendForce.  Looking ahead to 2024, TrendForce predicts that with IC inventory levels returning to healthy standards and driven by the AI boom, major CSPs will continue to expand the construction of LLMs. Additionally, AI applications are expected to penetrate personal devices, potentially leading to the introduction of AI-powered smartphones and AI PCs. Consequently, the global IC design industry's revenue growth is expected to continue its upward trajectory.  NVIDIA, Broadcom, and AMD benefit from a surge in demand for AI  The top five IC design houses boosted their 2023 revenues to $55.268 billion—a 105% year-over-year increase—primarily driven by NVIDIA’s AI GPU H100. Currently, NVIDIA captures over 80% of the AI accelerator chip market, and its revenue growth is expected to continue in 2024 with the release of the H200 and next-generation B100/B200/GB200. Broadcom’s revenue reached $28.445 billion in 2023 (semiconductor segment only), growing by 7%, with AI chip income accounting for nearly 15% of its semiconductor solutions. Despite stable wireless communications revenue, Broadcom expects a near-double-digit decline in broadband and server storage connectivity this year.  AMD’s revenue fell by 4% to $22.68 billion in 2023, due to declining PC demand and inventory reductions, affecting most of its business segments. Only its data center and embedded businesses, boosted by the acquisition of Xilinx, grew by 17%. AMD’s AI GPU MI300 series, launched in the fourth quarter of 2023, is expected to be a major revenue driver in 2024.  Conversely, Qualcomm and MediaTek were impacted by the downturn in the smartphone market. Qualcomm’s 2023 revenue decreased by 16% YoY to $30.913 billion (QCT only) due to weak demand in the handheld device and IoT sectors, with China’s smartphone shipments hitting a decade low. However, Qualcomm is actively promoting the automotive market, expecting automotive revenues to more than double by 2030.  MediaTek’s revenue also fell in 2023, dropping 25% YoY to $13.888 billion, with declines in smartphone, power management IC, and smart edge businesses. Nevertheless, due to the adoption of its Dimensity 9300 by several Chinese clients and expected growth in high-end smartphone shipments, the company predicts a return to double-digit growth for all of 2024.  Two significant changes in the ranking from sixth to tenth took place: First, Cirrus Logic fell off the list from its last place spot and was replaced by MPS, whose 2023 revenue rose 4% YoY to $1.821 billion thanks to automotive, enterprise data, and storage computing businesses—offsetting declines in communication and industrial sectors.  Secondly, Realtek’s revenue fell by 19% annually to $3.053 billion in 2023, dropping the company down to eighth place. The decline was mainly due to a sharp decrease in PC shipments, a suspension of telecom tenders in China, and early inventory write-offs. However, after clearing inventory, Realtek saw a slight improvement in PC and automotive shipments in the first quarter of 2024 over networking and consumer electronics. With the launch of WiFi-7 in the third quarter, the restart of telecom tenders, and participation in the development of edge computing frameworks through the Arm alliance, Realtek’s revenues are poised for growth.
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Release time:2024-05-13 14:48 reading:840 Continue reading>>
Earthquake Temporarily Halts Silicon Wafer, MLCC, and Semiconductor Facilitie sin Japan, Impact Expected to be Controllable, Says <span style='color:red'>TrendForce</span>
  TrendForce’s investigation into the impact of the recent strong earthquake in the Noto region of Ishikawa Prefecture, Japan, reveals that several key semiconductor-related facilities are located within the affected area. This includes MLCC manufacturer TAIYO YUDEN, silicon wafer (raw wafer) producers Shin-Etsu and GlobalWafers, and fabs such as Toshiba and TPSCo (a joint venture between Tower and Nuvoton).  Given the current downturn in the semiconductor industry and the off-peak season, along with existing component inventories and the fact that most factories are located in areas with seismic intensities of level 4 to 5—within the structural tolerance of these plants—preliminary inspections indicate no significant damage to the machinery, suggesting the impact is manageable.  In terms of silicon wafer production, Shin-Etsu and GlobalWafers' facilities in Niigata are currently shut down for inspection. The crystal growth process in raw wafer manufacturing is particularly sensitive to seismic activity. However, most of Shin-Etsu's crystal growth operations are primarily in the Fukushima area, thus experiencing limited impact from this earthquake. SUMCO reported no effects.  On the semiconductor front, Toshiba's Kaga facility in the southwestern part of Ishikawa Prefecture is currently undergoing inspections. This site includes a six-inch and an eight-inch factory, along with a twelve-inch facility slated for completion in the 1H24. Additionally, the three TPSCo factories in Uozu, Tonami, and Arai—co-owned by Tower and Nuvoton (formerly Panasonic)—are all undergoing shutdowns for inspections. In contrast, USJC (UMC's acquisition of the Mie Fujitsu plant area in 2019) was not affected.  MLCC manufacturer TAIYO YUDEN’s new Niigata plant, designed to withstand seismic activity up to level 7, reported no equipment damage. Murata (MLCC fabs only) and TDK’s MLCC plants experienced seismic intensities below level 4 and were not notably affected. However, Murata’s other factories (Non-Production MLCC) in Komatsu, Kanazawa, and Toyoma, which are in the areas with seismic intensity above 5, were closed for the New Year holiday, and staff are currently assessing any damage.
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Release time:2024-01-03 16:49 reading:1648 Continue reading>>
Top Ten IC Design Houses Ride Wave of Seasonal Consumer Demand and Continued AI Boom to See 17.8% Increase in Quarterly Revenue in 3Q23, Says <span style='color:red'>TrendForce</span>
  TrendForce reports that 3Q23 has been a historic quarter for the world’s leading IC design houses as total revenue soared 17.8% to reach a record-breaking US$44.7 billion. This remarkable growth is fueled by a robust season of stockpiling for smartphones and laptops, combined with a rapid acceleration in the shipment of generative AI chips and components. NVIDIA, capitalizing on the AI boom, emerged as the top performer in revenue and market share. Notably, analog IC supplier Cirrus Logic overtook US PMIC manufacturer MPS to snatch the tenth spot, driven by strong demand for smartphone stockpiling.  NVIDIA’s revenue soared 45.7% to US$16.5 billion in the third quarter, bolstered by sustained demand for generative AI and LLMs. Its data center business—accounting for nearly 80% of its revenue—was a key driver in this exceptional growth.  Qualcomm, riding the wave of its newly launched flagship AP Snapdragon 8 Gen 3 and the release of new Android smartphones, saw its third-quarter revenue climb by 2.8% QoQ to around US$7.4 billion. However, NVIDIA’s rapid growth eroded Qualcomm’s market share to 16.5%. Broadcom, with its strategic emphasis on AI server-related products like AI ASIC chips, high-end switches, and network interface cards, along with its seasonal wireless product stockpiling, managed to offset weaker demand in server storage connectivity and broadband. This strategic maneuvering led to a 4.4% QoQ revenue boost to US$7.2 billion.  AMD witnessed an 8.2% increase in its 3Q revenue, reaching US$5.8 billion. This success was due to the widespread adoption of its 4th Gen EPYC server CPUs by cloud and enterprise customers and the favorable impact of seasonal laptop stockpiling. MediaTek's revenue rose by 8.7% to US$3.5 billion in the third quarter, buoyed by a healthy replenishment demand for smartphone APs, WiFi6, and mobile/laptop PMIC components, as inventories across brand clients stabilized.  Cirrus Logic ousts MPS from tenth position thanks to smartphone inventory replenishment  Marvell also made significant gains, with its third-quarter revenue hitting US$1.4 billion, a 4.4% QoQ increase. This growth was primarily driven by increasing demand for generative AI from cloud clients and the expansion of its data center business—despite declines in sectors like enterprise networking and automotive. However, the outlook for some sectors remains mixed, with areas like TV and networking still facing uncertainties, leading to a cautious approach from clients. This resulted in some IC design companies, such as Novatek and Realtek, witnessing a decline in revenues by 7.5% and 1.7%, respectively.  Will Semiconductor benefited from the demand for Android smartphone components, breaking free from past inventory corrections with a 42.3% increase in 3Q revenue to US$752 million. Cirrus Logic, similarly capitalizing on the smartphone component stockpiling trend, saw a significant 51.7% jump in revenue to US$481 million, ousting MPS from the top ten.  In summary, TrendForce forecasts sustained growth for the top ten IC design houses in the upcoming fourth quarter. This optimistic outlook is underpinned by a gradual normalization of inventory levels and a modest seasonal rebound in the smartphone and notebook market. Additionally, the global surge in LLMs extends beyond CSPs, internet companies, and private enterprises, reaching regional countries and small-to-medium businesses, further bolstering this positive revenue trend.
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Release time:2023-12-22 16:13 reading:1898 Continue reading>>
Top 10 Foundries Experience 7.9% QoQ Growth in 3Q23, with a Continued Upward Trend Predicted for Q4, Says <span style='color:red'>TrendForce</span>
  TrendForce’s research indicates a dynamic third quarter for the global foundry industry, marked by an uptick in urgent orders for smartphone and notebook components. This surge was fueled by healthy inventory levels and the release of new iPhone and Android devices in 2H23. Despite persisting inflation risks and market uncertainties, these orders were predominantly executed as rush orders. Additionally, TSMC and Samsung’s high-cost 3nm manufacturing process had a positive impact on revenues, driving the 3Q23 value of the top ten global foundries to approximately US$28.29 billion—a 7.9% QoQ increase.  Looking ahead to 4Q23, the anticipation of year-end festive demand is expected to sustain the inflow of urgent orders for smartphones and laptops, particularly for smartphone components. Although the end-user market is yet to fully recover, pre-sales season stockpiling for Chinese Android smartphones appears to be slightly better than expected, with demand for mid-to-low range 5G and 4G phone APs and continued interest in new iPhone models. This scenario suggests a continued upward trend for the top ten global foundries in Q4, potentially exceeding the growth rate seen in Q3.  TSMC’s 3nm process contributes substantially to revenue as it claims 58% market share in Q3  TSMC’s revenue grew by 10.2%—reaching US$17.25 billion—supported by strong demand in the PC sector and for smartphone components, including new iPhones and Android devices, as well as urgent orders for restocking mid-to-low end 5G and 4G inventories. The 3nm process alone contributed 6% to TSMC’s Q3 revenue, with advanced processes (≤7nm) accounting for nearly 60% of its total revenue.  Samsung Foundry also experienced robust growth, with its revenue reaching US$3.69 billion in Q3, a 14.1% QoQ increase. This was driven by orders for Qualcomm’s mid-to-low range 5G AP SoC, 5G modems, and mature 28 nm OLED DDI processes.  GlobalFoundries maintained a stable performance in Q3, with its revenue approximating US$1.85 billion, similar to the previous quarter. The company's revenue was predominantly supported by the home and industrial Internet of Things (IoT) sectors, which accounted for approximately 20% of its total revenue. Furthermore, a significant portion of this revenue boost was due to orders from the US aerospace and defense sectors.  UMC benefited from the support of urgent orders, which largely offset adjustments in automotive orders. Despite a slight decline in overall wafer shipments, UMC’s revenue experienced a minor quarterly decrease of 1.7%, amounting to approximately US$1.8 billion. Notably, the revenue from its 28/22 nm products saw a near 10% increase, representing 32% of UMC’s total revenue.  SMIC benefited from seasonal consumer product demands, especially urgent smartphone-related orders, leading to a 3.8% revenue increase fo US$1.62 billion in Q3. However, due to the diversification of the supply chain and the relocation of American customers outside China, the revenue share from American clients decreased to 12.9%. Conversely, revenue from Chinese clients increased to 84% due to the government’s localization initiatives and urgent orders for smartphone components.  IFS makes debut in rankings with highest revenue growth in Q3  Notable changes in the rankings from sixth to tenth position include VIS and IFS, with the latter entering the global top for the first time since Intel’s financial restructuring. VIS’ Q3 revenue increased by 3.8% to US$333 million—surpassing PSMC to take the eighth position—thanks to a recovery in LDDI and panel-related PMIC orders and prebuilt wafer shipments. IFS benefited from seasonal laptop orders in 2H23 and contributions from its advanced high-priced processes, recording a 34.1% increase in revenue to approximately US$311 million.  Other companies like HuaHong Group saw a 9.3% decrease in Q3 revenue to about US$766 million. HHGrace maintained steady wafer shipment levels from the previous quarter, but a roughly 10% decrease in ASP led to a decline in revenue. Tower Semiconductor saw stable demand in the smartphone, automotive, and industrial sectors, maintaining revenue at around US$358 million in Q3. PSMC witnessed a 7.5% drop in revenue to US$305 million, with PMIC and Power Discrete revenues declining nearly 10% and 20%, respectively, impacting overall performance.
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Release time:2023-12-07 15:58 reading:1897 Continue reading>>
Ameya360:<span style='color:red'>TrendForce</span> Forecasts 4% YoY Drop in Foundry Revenue This Year
  As demand continues to slide for all types of mature and advanced nodes, major IC design houses have cut wafer input for the first quarter of 2023 (1Q 2023) and will likely scale back further for 2Q 2023, according to TrendForce’s recent analysis of the foundry market.  Currently, foundries are expected to maintain a lower-than-ideal level of capacity utilization rate in the first two quarters of this year. Some nodes could experience a steeper demand drop in 2Q 2023 as there are still no signs of a significant rebound in wafer orders. Looking ahead to the second half of this year, orders will likely pick up for some components that underwent an inventory correction at an earlier time. However, the state of the global economy will remain the largest variable that affect demand, and the recovery of individual foundries’ capacity utilization rates will not occur as quickly as expected.  Taking these factors into account, TrendForce currently forecasts that global foundry revenue will drop by around 4% year-on-year (YoY) for 2023. The projected decline for 2023 is more severe when compared with the one that was recorded for 2019.  TrendForce also points out that the latest geopolitical risks have led to a geographical realignment across the supply chain. In the case of IC design houses, they are preparing to lower the share of chip production based in China, and the effect of this reallocation of foundry orders will be increasingly noticeable in 2H 2023 and become quite obvious by 2024. The supply and demand conditions of the foundry market will gradually become regionalized as well. This, in turn, will cause divergences among foundries with respect to capacity utilization. Hence, the recovery of the whole foundry industry’s capacity utilization will be influenced by not only seasonal patterns and clients’ inventory levels but also geographical distribution of orders within the supply chain. This last factor warrants greater attention as well.  Now, entering 1Q 2023, sales of consumer electronics including smartphones, notebook (laptop) computers, and TVs are in a slump because of the traditional low season. Moreover, the sluggish pace of inventory consumption will affect foundry orders from IC design houses for components such as consumer-grade PMICs and MOSFETs, to name a few. Due to these developments, 8-inch wafer foundries still suffer an ongoing decline in capacity utilization rate. On the other hand, the 8-inch wafer orders for 2Q 2023 show a slight demand rebound. This is mainly attributed to some orders involving special industrial computers and a few clients adjusting order allocation among foundry partners. Nevertheless, the contribution from these sources of demand to the utilization of the overall 8-inch wafer foundry capacity is limited. TrendForce’s latest investigation indicates that 8-inch wafer foundries’ capacity utilization rates will remain mostly constant between 1Q 2023 and 2Q 2023. For now, TrendForce does not believe a substantial recovery will occur in the near future.  Turning to 12-inch wafer foundries operating with the advanced nodes, TSMC is expected to keep a lower-than-ideal level of capacity utilization rate in 1H 2023. Then, TSMC should be able to raise the rate of its 7nm node in 2H 2023, though the increase will still be limited. As for TSMC’s 5nm node, its rate will eventually return to the optimal level in 2H 2023 thanks to stock-up activities related to the releases of new devices during the traditional peak season. Looking at Samsung, capacity utilization rate will stay low for its ≤8nm nodes through 2023 chiefly because its main clients Qualcomm and NVIDIA have opted to reallocate orders to other foundries.  Regarding 12-inch wafer foundries operating with the mature nodes, they will mostly retain a capacity utilization rate of 75~85% in 1H 2023. These foundries, which include TSMC, UMC, and GlobalFoundries, are actively expanding into application segments that offer a more stable level of demand. Examples include automotive electronics, industrial equipment, and medical devices. Thus, the mature nodes are able to maintain a relatively high capacity utilization rate. TrendForce has also observed that the 28nm node has a higher rate compared with the 55/40nm nodes. Furthermore, foundries that have a higher proportion of consumer-grade chips in the product mix have experienced a larger rate drop. Their rates have mostly dipped to around 65~75%.  In 2H 2023, significant geopolitical risks will likely persist. Furthermore, some major OEMs have initiated a review of supply partners so that they can meet the requirements of the tenders released by the US government. Therefore, they are going to continue with their efforts to relocate their supply chains. Also, IC design houses have successively moved portions of their orders to foundries based outside China. Most of these reallocated orders are for 8-inch wafer foundry. Therefore, non-Chinese foundries such as UMC and Vanguard will likely see a slightly above-average hike in the utilization rate of 8-inch wafer foundry capacity during the second half of the year.  The market for end products as a whole has gone through about a year of inventory corrections. Therefore, the momentum of stock-up activities will get stronger for certain consumer-grade chips later in 2023 as OEMs prepares for the traditional peak season. TrendForce says some urgent orders and a few other orders involving products with special specifications will arrive and slightly boost foundry demand in 2Q 2023. Then, starting in 3Q 2023, capacity utilization rate will climb more noticeably in both the 8- and 12-inch wafer segments. However, this rise in foundries’ capacity utilization rates could be constrained by the uncertain economic outlook. Thus, foundries are not expected to return to the fully-loaded status within the short term.  More than 20 new wafer fabs to be built  In the medium to long term, the foundry market will become more fragmented because the building and diversification of production capacity will take place across different regions. TrendForce’s research finds that plans for a total of more than 20 new wafer fabs have been initiated in recent years. Regarding the geographical distribution of these new fabs, Taiwan will have five, the US will have five, China will have six, Europe will have four, and another four will be located among South Korea, Japan, and Singapore.  Governments worldwide are now much more aware of the importance of local manufacturing due to recent geopolitical events, and semiconductor chips have gradually emerged as a strategic resource. Therefore, apart from commercial interests and cost structure, foundries now have to give a greater consideration to certain countries’ subsidy policies and their clients’ need for local content. At the same time, they will still need to maintain a healthy supply-demand balance for the whole market. TrendForce believes a diverse range of offerings and an effective pricing strategy are the key factors that will enable foundries to maintain a successful operation in the future.
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Release time:2023-01-20 13:25 reading:1923 Continue reading>>
LED Packaging Companies Work on Niche Markets, Says <span style='color:red'>TrendForce</span>
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Release time:2019-01-24 00:00 reading:3842 Continue reading>>
<span style='color:red'>TrendForce</span> Announces Top 10 Trends in Information and Communication Technology Industry for 2019
In this release, TrendForce provides predictions of the information and communication technology industry for 2019, focusing on 10 key themes. Some of these themes continue from last year but will show significant evolution in the upcoming year.The memory industry will show acceleration and evolution, driven by next-generation products and advanced die-stacking technologyFor the semiconductor industry, the migration to each new process node is becoming much more difficult due to the physical limitations. The industry has been exploring advancements following the Moore’s Law, while increasing the productivity through next-generation products and advanced die-stacking technology like 3D packaging. Manufacturers have applied through-silicon via (TSV) techniques for chip stacking, and launched High Bandwidth Memory (HBM) in order to increase the throughput within a single package, overcoming the limits of bandwidth. Looking forward to 2019, they will continue to invest in the R&D of advanced solutions. In addition to saving space in the package, next-generation products are also intended to meet the demand from edge computing applications, which require shorter reaction time and different structures. Compared with existing DRAM products, next-generation solutions may fit into different architectures, for example, in the embedded systems, memory products are closer to CPU. The solutions may also offer significant performance improvements, such as power saving resulted from the non-volatility of memory.Commercial 5G to rollout in 2019Deployment of optical communication infrastructure, the foundation of 5G network, has been ongoing in the past years. The 5G architecture has been gradually expanded from backbone network to metropolitan area network and access network, providing 5G-compatible bandwidth at a low cost. Commercialization of 5G is expected to roll out in 2019, with 5G telecom services to be launched in United States, South Korea, Japan, and China. Smartphones and other devices supporting 5G technology are also expected to be available some time in 2019. The major advances in 5G mobile wireless solutions will support higher bandwidth and faster connection, enriching the telecom ecosystems. The arrival of 5G may also generate demand for a wider range of technology-based services, including high resolution (4K/8K) of video, mobile AR/VR gaming and immersive multimedia applications, industrial automation, telesurgery robots, massive Internet of Things, and automated control of vehicles, etc.Smartphone specs to be upgraded, foldable and 5G smartphones to be launched in 2019The global smartphone market expects specs upgrades in the coming year, with more models featuring all-screen design, narrower borders, a smaller notch, and subsequent smaller front-facing camera modules to fit the smaller notch. Moreover, the smartphone market will expect increasing penetration of biometric recognition, with triple cameras emerging. The advanced solutions for flexible AMOLED may allow brands to launch single-screen foldable smartphones next year, while 5G smartphones are also expected to be launched in 2019. Brands are now planning for the 5G-fueled market, expecting commercial 5G to open up more opportunities and growth momentum. Offerings combining 5G and foldable screen may also see great potential and would make a splash in the smartphone market.Under-display fingerprint sensor to be embedded in mid and high-end smartphonesWith increasing demand from smartphone vendors, design houses have invested heavily to increase the yield rates of fingerprint sensors and seek more cost-effective solutions. Optical under-display fingerprint sensors are normally found in flagship smartphones currently, but are expected to be embedded in mid and high-end Android models in the coming year. Ultrasonic in-display fingerprint sensors also have a chance to be adopted by Android phone vendors. TrendForce estimates that ultrasonic and optical under-display fingerprint sensors will account for 13% of all fingerprint sensor technologies in 2019, significantly up from 3% in 2018. Particularly, some design houses also consider moving the fingerprint sensors to the very edge of the screen, trying to break through the bottlenecks of technology and yield rates. The edge solutions may change the landscape of industry if they manage to hit the market in the next few years. However, the target market and acceptance of products remain to be seen.Mini LED making its way into displays of consumer electronicsWith advantages in brightness and contrast, Mini LED has a chance to compete with OLED in segments of cinema display and home theater display. Compared with self-emitting RGB LED digital display (video wall), Mini LED-based backlight units use blue LED as the basic light source, making it more cost-effective, so Mini LED has higher potential to make its way into the blue ocean of displays of consumer electronics, including smartphone, tablets, desktops, TVs, and automotive displays. The next two years (2019-2020) will likely see acceleration in the development of Mini LED, which may record a market value of US$1699 million in 2022.More applications to enable voice interaction, opening up new opportunitiesSmart speakers remain in the spotlight of the market in 2018, drawing attention to applications enabling voice interaction, such as vehicles, smart TVs, and smart headsets. Looking forward to 2019, increasing number of applications will enable voice interaction, including virtual assistant, voice recognition, voice shopping, etc. Companies will continue to develop new voice-activated applications to explore the market potential.eSIM to provide added value to smartwatches, driving the market growthDriven by major companies like Apple, Huawei, and Qualcomm, eSIM has been introduced into the market, making smart devices more independent from smartphones and driving the growth of smartwatches at a pace faster than smart bracelets. The eSIM has been already embedded in smartwatches and always connected PCs to allow Internet connection, and more applications will adopt eSIM in 2019 to enable functions like streaming music, making calls, sending messages, and virtual assistant, etc.A key year for IoT with intensified competitionThis year has witnessed a rapid growth of the Internet of Things (IoT) solutions, with the commercial use of low power wide area networks (LPWAN) becoming popular worldwide. Edge computing and AI have been integrated to IoT architectures, enabling transformation in vertical industries. With technology movements and global deployments in the following years, IoT is expected to come strong in operation of enterprises, making 2019 a key year for them to evaluate the outcome of adopting IoT in their businesses. Meanwhile, however, the competition is also intensified, thus enterprises are poised to consider whether investments in IoT operation are cost effective enough to enhance their profitability in the longer run.New technologies to change the landscape of healthcare industryFollowing the 21st Century Cures Act, the U.S. Food and Drug Administration (FDA) announces new regulations on next-generation sequencing (NGS) and digital medicine this year. The new technologies may change the landscape of biotechnology industry and attach increasing importance to software in the healthcare industry. Particularly, digital therapeutics has evolved, integrating ICT, software and drugs in treatment. Moreover, surgical robots and surgical navigation systems (SNS) are expected to integrate various medical imaging technologies including hybrid imaging, molecular imaging, AR and MR to optimize minimally invasive surgery. In terms of gene sequencing, NGS has been adopted in clinical application. FDA has been building genetic databases ClinVar and ClinGen, as well as PrecisionFDA that verifies the algorithms of sequencing. Gene sequencing data analysis and gene variants application will become the focus of the future NGS clinical market. In conjunction with new treatments, NGS will help achieve precision medicine in the future.Smart grid, energy management and energy storage system to be keys of global photovoltaic marketThis year witnessed constant expansion of installed PV supply capacity in China, but the policy updates by the Chinese government have led to oversupply in the market, resulting in global module price declines and cost pressures in the supply chain. Therefore, the global PV industry may expect a changing landscape in the upcoming year. On the other hand, the levelized cost of electricity (LCOE) of PV projects have seen significant decline, and grid-parity has been observed in the global PV market. With the constant decrease in PV feed-in tariff (FiT), smart grid, energy management and energy storage systems will become the key considerations for PV system developers. They will need to achieve effective energy storage to balance loads of power plants and stabilize the overall power quality in connection with grids and power plants. 
Release time:2018-10-09 00:00 reading:2176 Continue reading>>
<span style='color:red'>TrendForce</span>'s Comments on New iPhone Models
As Apple unveils its new iPhone models, TrendForce has provided the following comments for your reference.Apple unveiled new versions of its iPhone on Wednesday and the specs are consistent with earlier expectations of the new models, says TrendForce. While last year’s premium-priced iPhone X sparked discussion in the market, Apple again moved towards a higher price range, passing the US$1,000 threshold. TrendForce believes that the aggressive pricing point Apple has chosen seems to be challenging the upper limit of prices that consumers are willing to pay for a premium smartphone. New iPhone Xs and iPhone Xs Max feature optimized photo quality, AR experiences, and dual-SIM, but they are less likely to boost the demand significantly due to the higher-than-expected prices, because consumers still need time to adjust to the price set for the premium models.As for iPhone XR, the more budget-friendly model, its pricing point is much lower than its OLED partners, iPhone Xs and iPhone Xs Max. Positioned as Apple’s main product this year to revive its sluggish smartphone sales, the iPhone XR with an LCD display will account for nearly 50% in the production capacity of the new iPhone series. However, this LCD model is also faced with uncertainties related to trade issues, the stronger US dollar, as well as even higher pricing outside the U.S. Therefore, it remains to be seen whether or not this LCD model could help Apple boost iPhone sales growth and profits.Meanwhile, the prices of older versions of iPhone, including iPhone7 and iPhone 8, are adjusted downwards to US$449 and US$599 respectively, which may create higher-than-expected demand for the older models.
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Release time:2018-09-14 00:00 reading:1089 Continue reading>>
Stagnant PC DRAM Contract Prices in August; <span style='color:red'>TrendForce</span> Anticipates Sliding Prices for 4Q18 Contracts
DRAMeXchange, a division of TrendForce, reports that most 3Q18 contracts in the PC DRAM market were completed in July. With contracts being mainly quarterly deals, the agreed prices for 3Q18 are generally slightly higher than those for 2Q18. Therefore, the overall trajectory of contract prices in the PC DRAM market has been relatively stable in August and is expected to remain so in September. The average contract price of mainstream 4GB PC DRAM modules has stayed at US$34.5 in August, while the average contract price of 8GB PC DRAM modules has also stayed at US$68. DRAMeXchange maintains its forecast that the average QoQ price increase for PC DRAM products in 3Q18 will be around 2%.The spot market, where developments are an early indicator of the contract price trend, shows that prices of mainstream chips have kept falling in August, and their general difference with contract prices continues to widen, says Avril Wu, senior research director of DRAMeXchange. Currently, DRAM suppliers are heading into negotiations with their clients to arrange the contracts for 4Q18. However, they will have more difficulties in maintaining their prices going forward. After examining the latest changes in bit supply and demand, DRAMeXchange anticipates sliding prices for 4Q18 contracts.In anticipation of falling ASPs during 2019, clients for now are reluctant to stock upAlthough 3Q18 is part of the traditional busy season, the demand growths of various end products are limited and not up to their usual seasonal levels. For instance, some smartphone brands and a few server manufacturers have marked down their shipment projections. Although end-product manufacturers as a whole are seeing a gradual drop in their DRAM inventories after posting shipment growths in this year’s first half, they are also noticing that the supply situation in the DRAM market is shifting from tight to loose. At the same time, most end-product manufacturers are highly uncertain about their own demand situations in 2H18 and the later period. As the DRAM supply expands, clients in the end market are actually hesitant to stock up and if the prices of DRAM products are likely to go down. If so, there is no urgency to replenish the DRAM inventory despite the seasonal influence.In the case of the server DRAM market, where demand has been fairly strong, impasse on prices is now appearing in the latest rounds of contract negotiations. This is an indication that DRAM suppliers may have to lower prices to maintain or increase sales volumes for their fourth-quarter deals. Also, there are now more discounts on high-density memory modules (high-density here is defined as 8GB or above for PC DRAM modules and 32GB or above for server DRAM modules). On the whole, suppliers are showing greater flexibility in their pricing strategies because they want to lock in the shipment volumes going into 2019 and capture more market share.
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Release time:2018-09-04 00:00 reading:1112 Continue reading>>
Major TV Brands to Increase Panel Purchases by up to 15% QoQ in 3Q18, Says <span style='color:red'>TrendForce</span>
The stock up for the World Cup has come to an end in 1Q18, earlier than expected. The market grows weak in 2Q18 with no particular demand for TV panels. WitsView, a division of TrendForce, estimates that the major branded TV makers will reduce their panel purchases by 4% quarterly in 2Q18.“The TV industry will enter the traditional peak season in the third quarter, so TV makers will be more active in panel purchase in order to achieve the annual shipment goals”, says Jeff Yang, the assistant research manager of WitsView. Therefore, WitsView estimates that the major TV brands’ panel purchases will increase by 10~15% quarter-on-quarter.Gap between demand and supply continues to expand in 2Q18TV brands have already prepared for demand brought by the World Cup in advance. Considering the time for preparing raw materials, shipping and distribution, the brands have stocked up panels before 1Q18. However, the panel purchases decrease by 4% QoQ in 2Q18, with the World Cup coming to an end and lower-than-expected sales of TVs during Chinese New Year and May 1st holiday. In addition, the uncertainties about U.S.’s tariffs on Chinese products also influenced the brands’ purchase plans.Moreover, Chinese panel makers, including Gen 10.5 of BOE and Gen 8.6 of CEC-CHOT, have begun to ship panels to the market, making the supply and demand situation even more imbalanced. As the panel prices continue to drop, TV brands may adopt more conservative purchase strategies in 2Q18. Through the conservative purchase plans, TV makers would not only avoid stock depreciation, but also be more prepared for the peak season in the second half.Branded TV makers will be more aggressive in sales with higher panel purchase plan in 3Q18Looking forward to the peak season in 3Q18, TV brands will be more aggressive in sales in order to achieve their annual shipment goals, says WitsView. According to the recently proposed tariffs on Chinese products exported to the U.S., TV sets are not in the tariff list. Therefore, for the short term, TV brands are faced with lower risks for stock up, they can also further plan for the promotion in Europe and the U.S.Particularly, WitsView notices that the prices of large-size 4K TVs have been decreased in the 618 mid-season sales of China. In the promotion, there were limited offers of 55-inch and 65-inch TVs at the price of RMB 1,999 and RMB 2,999 respectively. This trend shows that TV brands aim to boost the demand for large-size TVs with the help of lower panel prices. As for the supply, TV panel prices have been decreasing for over a year due to the oversupply in market, even approaching the cash costs of panel makers. For the short term, there has been no sign that panel makers would cut the production, but they have been optimizing the production mixes to reduce the share of 32-inch or smaller panels and increase the share of 43-inch or larger ones. This strategy will help panel makers stay in line with the TV set makers’ product plans, and consume more capacity at the same time.Looking forward, WitsView stays optimistic about the 3Q18 TV market, since the U.S.-China trade war will not impact the TV set market for the short term. Together with the lower and lower prices of large-size TVs, WitsView estimates that the major TV brands’ panel purchases will increase by 10~15% quarterly.
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Release time:2018-06-26 00:00 reading:1101 Continue reading>>

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