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ROHM selected for CDP’s A List for Climate Change and Water <span style='color:red'>Security</span>

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ROHM selected for CDP’s A List for Climate Change and Water Security

　　ROHM Co., Ltd. has been recognized for leadership in corporate sustainability by CDP (Carbon Disclosure Project), an international environmental non-profit organization, securing a place on its prestigious ‘2024 A List’ for tackling both climate change and water security.　　This is the first time to be included in the Climate Change A list, the highest rating, for ROHM, as well as the fourth consecutive year to secure a position on the Water Security A list.　　CDP is an international environmental non-profit organization that operates a global environmental disclosure system for companies and municipalities. It conducts environmental information surveys and publishes data regarding Climate Change and Water Security. The survey is fully aligned with the TCFD, and its scores are widely used for decision-making regarding investments and purchasing in a sustainable and resilient net-zero economy. In 2024, more than 700 signatory financial institutions requested disclosure of data on environmental impacts, risks, and opportunities through the CDP platform, with a record number of nearly 24,800 companies responding. The survey employs an eight-tier evaluation scale with levels ranging from Leadership level (A, A-) to Management level (B, B-), Recognition level (C, C-), and Disclosure level (D, D-), based on criteria such as comprehensiveness of disclosure, identification and management of environmental risks, and ambitious target setting. Environmental Management at ROHM　　In the Environmental Vision 2050, ROHM has committed to achieving virtually zero greenhouse gas emissions and maximizing resource recycling to eliminate waste from all its business activities.　　・Water Resource Management　　ROHM has set a target to increase the proportion of water recovery and reuse by at least 5.5% by FY2030 (compared to FY2019), and is making efforts to reuse water resources and reduce factory wastewater by globally managing water withdrawal, wastewater, and water usage. In addition to addressing risks such as flooding, ROHM has implemented a business continuity management system, which predicts potential risks, and made production continuity plans for each site. ROHM is also taking ongoing measures, such as constructing new production buildings based on flood countermeasures.　　In 2024, ROHM received an independent verification of its water withdrawal and wastewater volume data in order to disclose information to society with higher transparency and reliability.　　・Climate Change Measures　　ROHM has set a target to reduce greenhouse gas emissions (Scope 1 and 2) by at least 50.5% byFY2030 (compared to FY2018), and is working globally to introduce environmentally-friendly equipment and reduce usage through energy conversion. In 2024, ROHM has expanded independent verification to achieve a 100% verification rate for its internally calculated greenhouse gas emissions (Scope 1 and 2). Additionally, ROHM has introduced an Internal Carbon Pricing (ICP) system to promote decarbonized management.　　Furthermore, ROHM has announced a plan to source 100% of the electricity used in all domestic and international business activities from renewable energy by FY2050. Several sites, including major overseas production plants, are already operating with 100% renewable energy. As of FY2023, ROHM has achieved a 43% adoption rate and plans to increase this to 65% by FY2030.　　Encouraged by the evaluation results, ROHM will continue promoting CSR activities and addressing social issues to achieve a sustainable society and become a company that meets the expectations of its stakeholders.

Key word：

ROHM

Release time：2025-03-21 13:52 reading：501 Continue reading>>

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SIMCom Achieves ISO/SAE 21434 Certification for Automotive Cybersecurity Management

　　SIMCom, a global leader in IoT communication, has proudly received the ISO/SAE 21434 certification for Automotive Cybersecurity Management from TÜV NORD, an international independent third-party testing, inspection, and certification organization. This certification marks a significant milestone in SIMCom’s commitment to advancing automotive cybersecurity and delivering top-tier solutions to the automotive industry.　　Importance of ISO/SAE 21434　　Achieving the ISO/SAE 21434 certification underscores SIMCom's ability to meet stringent cybersecurity risk management requirements across the entire product lifecycle—from conceptual design, development, and production to operation and maintenance. This critical achievement validates SIMCom's dedication to adhering to the highest standards of automotive cybersecurity. In an era of increasing vehicle connectivity, robust cybersecurity measures are paramount. The certification confirms that SIMCom’s products are designed to safeguard against evolving cyber threats, ensuring the safety and security of in-vehicle systems and communications.　　Comprehensive Automotive Solutions　　In alignment with automotive industry trends, SIMCom continues to expand its automotive product lineup, offering enhanced IoT solutions to car manufacturers and Tier 1 suppliers. This strategic expansion not only strengthens SIMCom's position in the connected vehicle industry but also underscores its commitment to providing secure and reliable products.　　SIMCom offers a complete range of automotive-grade cellular communication modules, including SIM7800X, SIM7805X, and SIM8800X and so on. Additionally, SIMCom provides smart modules, GNSS positioning modules, 5G modules and Wi-Fi & Bluetooth modules, delivering one-stop services to global car manufacturers and Tier 1 suppliers. These products are designed to meet diverse application scenarios, including in-vehicle communication, vehicle positioning, smart cockpits, and digital keys. The integration of various cybersecurity functions, such as encryption, authentication, and data integrity checks, ensures the security of in-vehicle systems and communications, preventing unauthorized access and data tampering.　　Future Outlook　　SIMCom will continue to align with market demands and industry standards, focusing on vehicle network and information security. By collaborating with industry partners, SIMCom aims to continually enrich its automotive product portfolio, offering compliant, reliable, and professional products and services. This commitment will drive the intelligent and secure development of the automotive industry chain.

Key word：

SIMCom

Release time：2024-08-23 13:13 reading：1010 Continue reading>>

GigaDevice Launches Advanced PC Fingerprint Solution, Promising Enhanced <span style='color:red'>Security</span> and User Experience

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GigaDevice Launches Advanced PC Fingerprint Solution, Promising Enhanced Security and User Experience

　　a leading provider of flash memory, 32-bit microcontrollers, sensors, and analog technology, introduces all-new PC fingerprint solutions, including GSL6186 MoC(Match-on-Chip) and GSL6150H0 MoH(Match-on-Host). Based on advanced biometric technology, the solutions allow users to effortlessly and securely access their Windows PC devices with a simple touch of fingerprint. The GSL6186 MoC solution has already received certification from Windows Hello Enhanced Sign-in Security (ESS) and Microsoft Windows Hardware Lab Kit (HLK), added to Microsoft Approved Vendor List (AVL).　　GigaDevice GSL6186 MoC fingerprint recognition solution utilizes System-in-package (SiP) technology, integrating fingerprint algorithm acceleration modules and storage modules within the chip. It combines excellent capacitive fingerprint hardware detection with proprietary algorithms, achieving an impressive high performance. The SiP system-level packaging ensures secure storage, minimizing privacy risks. Supporting POA and low latency, it enhances user experience and offers compatibility with USB, SPI interfaces, and various host platforms. Customizable in size and shape, it caters to diverse design preferences. Ideal for unlocking, system/APP software login, online payments, and various other scenarios, it delivers a convenient user experience.　　GigaDevice GSL6150H0 MoH fingerprint recognition solution also comes equipped with high-performance capacitive fingerprint sensors and proprietary biometric algorithms. Utilizing on-host fingerprint matching, it provides a cost-saving advantage.　　"We are committed to innovating in the next generation of intelligent terminal biometric sensing technology, delving into the research and development of human-machine interaction sensor chips and solutions", says Jun Zhi, Vice President and General Manager of Sensor BU in GigaDevice, "Our fingerprint products have become a popular selection in the smartphone market. The introduction of GSL6186 MoC and GSL6150H0 MoH signifies our further expansion into the PC domain. Regarding quality control, we are committed to delivering high-quality products and solutions to our customers, prioritizing comprehensive product lifecycle management and proactive risk control, alongside continuous process optimization. We have also established a stable and flexible supply chain system, which enables a quicker response to customer needs, enhancing the accuracy and timeliness of delivery. Furthermore, we offer integrated services and technical support, providing a convenient 'one-stop' solution to expedite customers' product launch process. We will accelerate product upgrades and continue to expand our presence in fields such as PC, smartphones, wearables, mobile health, IoT, etc., offering customers a broader array of innovative solutions."

Key word：

GigaDevice

Release time：2024-05-27 16:17 reading：1728 Continue reading>>

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Nidec Instruments Launches High-security Card Reader that Meets International Standard PCI PTS*1

　　Nidec Instruments Corporation (“Nidec Instruments”), a wholly owned subsidiary of Nidec Corporation, today announced the launch of a card reader that meets the latest Ver. 6 of the PCI PTS POI (Payment Card Industry PIN Transaction Security Point Of Interaction) mandated by the PCI SSC (PCI Security Standards Council), the organization jointly established by five globally recognized credit card companies.　　Nidec Instruments’ PCI Ver. 6-certified Security Card Reader　　The global credit card payment market was US$521.8 billion in size as of 2022, and it is expected to continue to grow sustainably. On the other hand, however, the amount of damage caused by credit card misuse is increasing yearly, making safety measures a critical task for credit card companies. Nidec Instruments’ latest card reader, developed to read magnetic strip-attached credit cards and contact-type IC cards, is anticipated to be installed in POS systems at gas stations and kiosk terminals at airports, among many other locations.　　Credit card readers installed outdoors are required to meet the PCI PTS, a security standard for credit cards and their security code readers, and the aforementioned product not only meets the latest Version 6 of the standard, but is equipped with a durable magnetic head and a contact-type IC chip interface as well.　　As a member of the world’s leading comprehensive motor manufacturer, Nidec Instruments stays committed to offering revolutionary solutions that contribute to creating a comfortable society.　　*1. PCI PTS: A security standard required of “venders” that develop mPOS payment terminals, and also a security requirement for PIN-entering payment terminals to meet.

Key word：

Nidec

Release time：2023-11-29 14:26 reading：2217 Continue reading>>

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novosns Digital isolators: Invisible guardians of system security and personal safety

　　If there are anything requiring 100% attention in circuit design, they must include isolators.　　Isolators themselves do not have special computing, processing or conversion capabilities, but its evolution is inextricably linked to the development of industry, automotive, medical, and home electronics, etc. In view of the fact that their high reliability and performance soundly underpins system security, you should not brush aside isolators in your circuit design.　　Isolators as invisible guardians　　Some may see isolation a too-often-heard topic, but it actually plays an important role in protecting circuit and personal safety.　　In simple terms, the voltage of the execution system and the control system in electronic devices varies greatly – hundreds VAC vs. low VDC. In life, we isolate low-voltage and high-voltage systems, which also applies to circuit design. High-voltage systems often are more prone to electrostatic discharge, radio frequency, switching pulse and power disturbance, which can cause a voltage surge that is a thousand times higher than the voltage limit of many electronic components. Most importantly, these voltage surges are more likely to cause harm to human body, in addition to the noise and damages to electronic circuit.　　Here’s a simple example. The battery voltage in an electric vehicle (EV) can reach 400V, or even 800V, but the driver can calmly and safely operate all devices, instruments and knobs inside it. Behind this calmness and safety, various forms of isolation play a crucial role – they build a safe and reliable connection between high and low voltage systems.　　Considering such a profound effect, the selection of isolation type particularly matters.　　Since the day one of electricity use by human, people have longed for safe and reliable means of power control. In the 1830s, Joseph Henry, an American physicist, invented the electromagnetic relay using the theory of electromagnetic induction when he studied circuit control. Inspired by the phenomenon of magnetic force generation and disappearance in power-on and power-off conditions, he used a electromagnet to control the opening and closing of another circuit with high voltage and high current, enabling remote control and protection of the circuit.　　By controlling the electromagnet using a dry cell, a 220V AC electric circuit can be driven to enable safe control (or information transmission), which has a ring of “moving a thousand pounds with four ounces”. This simple procedure is the underlying principle of isolation, i.e. two unrelated circuits that are insulated from each other are connected in certain way.　　However, electromagnetic relay has obvious disadvantages, such as large footprint, high power consumption, and easy vulnerability.　　To overcome the aforesaid shortcomings, optocoupler came into being. It uses photovoltaic conversion to enable transmission and control, and implements a similar function at IC level. Opto-isolator, based on photoresistor, was launched in 1968. Compared with transformers, optocoupler that featured small footprint, light weight, low cost and high reliability, quickly became the mainstream in the market. The era of optocoupler development also saw the evolution of integrated circuit (IC) and information technology. With increasing interaction between low-voltage control and computing units and high-power motors and power supplies, optocouplers have been greatly improved.　　Undoubtedly, performance, power consumption and footprint are never-to-evade topics in the microelectronics world, and any strong technology cannot steer away from them. Optocouplers now meet the same challenges with electromagnetic relay – constrained by laser and photosensitive diode, optocouplers lose their edge in terms of footprint, power consumption, and reliability.　　Thanks to the advances of semiconductor technology, digital isolators have become rising stars.　　Merits and demerits of digital isolators　　It’s not difficult to understand digital isolators. They are similar to optocouplers, except that the photovoltaic conversion and modulation is changed to other technologies. However, it’s noted that optical attenuation will not occur in digital isolators. Unlike optocouplers, digital isolators provide many benefits, including good switching characteristic, low vulnerability to aging, high reliability, high voltage withstand ability, high speed, and energy transferability. All these are underpinned by semiconductor technology.　　By underlying principles, digital isolators can be divided into capacitive isolators and magnetic ones.　　Capacitive isolator, as its name suggests, uses the micro-capacitors inside the IC for high voltage isolation on the left and right sides, and adopts highly dielectric materials in the middle for voltage isolation. Capacitor is a device that can store charge, and comprises two conductor plates and medium. It allows high frequency to pass through, but blocks low frequency. The intermediate medium can isolate low frequency or DC high voltage signals.　　Using capacitor’s characteristic of allowing high frequency to pass through but blocking low frequency, modulation and transmission of signals can be performed. When a High-Low digital signal is input, the signal will be modulated inside the IC – the high frequency signal will be modulated into low frequency signal, allowing it to be transmitted to the other side of the IC. Typical OOK (On Off Key) modulation is as follows: “0, 1” signals will be modulated using different frequencies. For example, 1 represents high-frequency signal, and 0 represents unmodulated DC signal, and then two state switching signals are transmitted.　　Magnetic isolators are similar to capacitive ones, except that the former uses coils and electromagnetic conversion to implement data transmission.　　In a nutshell, digital isolators further address the disadvantages of optocouplers in terms of reliability, transmission rate, robustness, footprint, and service life.　　Perfection never exists in the realm of technology. Digital isolators boast visible advantages, but there are always trade-offs.　　First, digital isolators are relatively new, so their reliability is continuously being improved and demonstrated. With the successive introduction of related international and domestic standards, a complete range of approval processes and standards have been established, and customers from various industries have gradually given their recognition.　　Second, optocouplers still account for a dominant share in the industry, especially in some conventional applications. Therefore, the shift from optocoupler to digital isolator cannot be done overnight, because the pins and input type of digital isolators are not fully compatible. This requires changes of design. Sometimes customers are not willing to switch to digital isolator because of risk considerations. To this end, there is an Pin to Pin replacement alternative in the industry. In this solution, the optocoupler can be directly replaced and pins are compatible, and the built-in circuit is implemented in the input characteristics to simulate the diode characteristics. In this way, digital isolator can function exactly same with a optocoupler device in same application settings, and direct design replacement can be achieved.　　At last, common mode interference may occur in capacitive isolators, which needs to be suppressed.　　A typical OOK technology is simple and clear, i.e. the input signal is directly and correspondingly modulated and then demodulated on the other side. After high-frequency modulation, the signal and high-frequency common mode circuit are transmitted through one same path, so there will be common mode interference. This is also a shortcoming of ordinary capacitive isolators.　　Considering the above-mentioned problems, particular attention should be paid to the selection of devices. There are several methods to significantly enhance the immunity to common-mode interference. Taking the Chinese isolator manufacturer NOVOSENSE as an example, it has developed the Adaptive OOK® proprietary modulation technology on the basis of OOK, which improves the capability of digital isolators to resist common-mode interference.　　The so-called Adaptive OOK® technology uses the common mode detection circuit inside the IC to detect the state of common mode signals, and then depending on the signals detected, dynamically and adaptively modulates the internal key circuit characteristics or gains. When the common mode noise is large, it can better suppress the noise, so as to provide higher robustness and enhanced immunity to common mode interference.　　Another benefit of adaptive modulation is that high common-mode interference resistance does not need to be guaranteed at full operation state. Only when the instantaneous interference is relatively high, the circuit needs to perform more functions to suppress interference. In most cases where there is no harsh conditions and a low requirement for common-mode interference resistance, Adaptive OOK® technology can strike a good balance between system properties and power consumption to optimize the overall performance.　　Bring isolators further　　In the digital isolator market segment, only a few companies provide magnetic isolators, and capacitive isolators are the preferred choice of more manufacturers. What’s more, the number of capacitive isolators sold is growing very fast. In addition to patent related reasons, the overall manufacturing process of capacitive isolators is relatively simple, and does not differ greatly from general non-isolated devices in terms of wafer production. This allows capacitive isolators to deliver a big cost advantage.　　Furthermore, the process capability and performance of capacitive isolators are constantly improved. Particularly, their voltage withstand and surge resistance capabilities have been basically comparable to magnetic isolators, allowing capacitive isolators to meet the requirements of a wide range of applications.　　The products from NOVOSENSE can prove the above-mentioned trend. For example, the first-generation NSI81xx series meets the basic isolation requirements. The second-generation NSI82xx series answers the requirements of enhanced isolation, and provides enhanced resistance to common-mode interference, EMC performance and other electrical properties. According to NOVOSENSE, its third-generation products will further improve the voltage withstand capability and robustness.　　When it comes to the design of a capacitive isolator, the theory is simple, but the optimization and innovation of some processes and microarchitectures will have highly great effects on the overall performance. A case in point, from OOK to Adaptive OOK®, NOVOSENSE has done a lot to realize this “one-step-further” effort.　　Performance. Process capability and microarchitecture optimization contribute to continuous improvement of voltage withstand capability. For example, assuming that highly dielectric SiO2 is filled, different elements are also needed to further improve the voltage withstand capability. In addition, the electric field strength distribution of the capacitor can greatly affect the voltage withstand capability of isolator. Therefore, the design of capacitor structure, shape and other micro-architectures of each manufacturer, will affect the performance.　　Robustness. Isolator products are more widely used in industry, automotive and other high-voltage applications. Isolators are required to meet safety specifications. In applications involving safety, the selection of isolators having safety approvals is mandatory.　　To match specific requirements of analog, interfaces and signal chains, manufacturers need to introduce different product families for more applications. Isolator makes no exception. By combining the basic isolation function with other interfaces, drives or sampling knowledge, isolator technology can have wider applications.　　Backward derivation of product definition from applications is the main idea of product development, and also the greatest challenge. The definition of “isolation+” product around applications is not exactly same with that of pure digital isolators.　　Take isolated driver for example, in addition to the digital signal processing capability, manufacturers are required to be familiar with the power knowledge related to the driver in specific applications and ensure compatibility with power tubes from different manufacturers. Furthermore, SiC and other third generation wide band gap semiconductor applications pose more security and data transmission requirements for isolated drivers.　　For isolated interface products, the ESD and anti-interference capabilities need to be considered. Isolated sampling also requires a good expertise in high-precision signal chain.　　In addition, isolators sometimes need to be used together with power supply. In this setting, isolators that integrate the isolated power supply were launched.　　According to our knowledge, NOVOSENSE and other Chinese and global manufacturers coincidentally plan more isolation product categories – shifting from single category to “isolation+” expansion strategy, so as to provide isolation capability for more products.　　An increasing number of new applications and new markets push digital isolators to the same starting line with optocouplers. More and more niche applications, including EV, photovoltaics, and energy storage, are emerging, and the demand for digital isolators is rocketing. Customers are more willing to select digital isolators in the design of these new applications.

Key word：

novosns

Release time：2023-10-09 13:42 reading：2434 Continue reading>>

Ameya360:Has Adoption of ‘Connected Devices’ Outpaced <span style='color:red'>Security</span>?

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Ameya360:Has Adoption of ‘Connected Devices’ Outpaced Security?

　　We’ve all seen the rush to deploy the new wave of connected devices but the speed at which these devices have been embraced may threaten fundamental security protocols.　　We love the convenience that ubiquitous connectivity brings us; our cars can reroute us based on traffic jams, we can adjust our lights or AC without leaving the couch, we can get up-to-the-minute blood glucose readings, and we can precisely monitor energy flow across a smart grid and optimize manufacturing with smart factory floors.　　Aided by technologies such as Bluetooth Low Energy, WiFi, and 5G, the pace of Internet of Things (IoT) deployment continues to accelerate. However, in a recent Forrester report, 69% of surveyed respondents estimate that at least half of all devices on their enterprise network or internet-of-things (IoT) are unmanaged, and 26% estimate that unmanaged devices outnumber managed devices on their network by three to one.　　Well, as with any new technology, there are going to be drawbacks. Among the most significant: our ability to build and deploy intelligent, connected devices has outpaced our understanding and practices of how to secure them.　　We’ve seen large botnets take over farms of IoT devices and shut down large chunks of the Internet, a recent escalation in healthcare organizations hit by ransomware attacks impacting connected medical devices, and privacy breaches impacting everything from baby monitors to smart watches.　　Lessons for ‘connected device’ security—Think like an attacker　　IoT devices really are special. For traditional IT devices, like Linux servers and Windows laptops, we have established best practices for security. It isn’t perfect, but in reality, if we keep the operating system and any endpoint security software up to date, we’ll eliminate the majority of system vulnerabilities. In fact, an analysis earlier in 2022 showed that flaws from 2017 and 2018 were still among the most commonly exploited today; a simple and free OS update would have blocked them.　　IoT devices, however, are more often black boxes – we don’t know which version of what operating system they’re running, or which versions of what libraries, and even if we have that information, we can’t force an update; we typically have to wait for a patch from the manufacturer.　　There are no standards or real consistency for tracking security flaws across connected devices; the only way we can understand where the problems are is to test them ourselves. Then, armed with a better understanding of how IoT devices are impacting our attack surface, we can deploy targeted mitigation strategies to address the vulnerabilities we’ve discovered.　　This is, of course, good information to have and a good strategy to pursue. But how do we know that our defensive tools, the stack of network, cloud, email, and endpoint security tools that we array to keep both our traditional and nontraditional IT devices safe, are working? How do we know if an emerging threat is able to slip through our firewall, or run undetected on an endpoint, or make it through our email gateway to target an unsuspecting phishing victim?　　The same principle applies; we really need to test our defensive stacks, on a continuous basis, to make sure they’re optimized and tuned to catch the latest attacks that threat actors are deploying against us. This lets us, finally, go on the offensive and think like an attacker – we can test and probe our networks and devices ourselves, discovering vulnerabilities and attack paths ourselves, rather than waiting for a bad guy to do it.　　We can get ahead of hackers by discovering and closing gaps in detection and visibility before they can be used against us.

Key word：

Connect

Release time：2023-02-10 13:38 reading：1992 Continue reading>>

Industrial IoT, Smart City <span style='color:red'>Security</span> to Drive Secure MCU Market to Over $2B by 2026

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Industrial IoT, Smart City Security to Drive Secure MCU Market to Over $2B by 2026

　　Despite facing an increasingly volatile semiconductor industry plagued by ongoing macroeconomic and political issues, the secure microcontroller (MCU) market should fare well in the long term.　　While the forecasted total available market has contracted, especially in the smart home, retail, advertising, and supply chain spaces, secure MCU shipments will only be temporarily adversely affected. According to a new report from ABI Research, the secure MCU market will grow to $2.2 billion by 2026.　　“In part, this is due to the niche nature of security demand which commands a higher value proposition,” said Michela Menting, Trusted Device Solutions Research Director at ABI Research. “In the short term, supply chain issues due to trade embargoes and pandemic quarantines at manufacturing sites will affect availability. Yet, demand for security, especially in general purpose microcontrollers, will ensure the secure MCU market continues to be a high priority for device OEMs.”　　Strong market demand will stem from utilities and industrial IoT and smart cities and buildings, notably for MCUs with Trusted Execution Technologies that can securely run mission-critical and highly-sensitive applications at the edge.　　Several opportunities will continue to drive demand for secure MCUs. On the one hand, a growing body of policy and regulation supports secure semiconductor investment, including a range of EU and U.S. tools such as the EU Cybersecurity Certification Framework, the EU Cyber Resilience Act, and the EU Chips and the U.S. CHIPS and Science Act. On the other hand, the demand for secure IoT lifecycle management capabilities, from provisioning and onboarding for cloud and network services to OTA firmware updates and patching, means security IP choice for MCUs become primary product differentiators in an increasingly competitive market.　　The secure MCU market is responding to this continued demand. An increasing number of semiconductors have launched numerous new products in the last two years, catering to various IoT device types and use case scenarios. These include Renesas (RA), NXP (i.MX), STMicroelectronics (STM32), Microchip (SAM), and Infineon/Cypress (PSoC), among many others.　　The market has coalesced around Arm Cortex processors, in part due to the rich security IP available with TrustZone. Still, there is growing competition from the secure RISC-V movement, directly challenging Arm’s dominance in the space.　　These findings are from ABI Research’s Secure MCU Market Overview report. This report is part of the company’s Trusted Device Solutions research service, which includes research, data, and ABI Insights.

Key word：

IoT,MCU

Release time：2023-01-10 11:00 reading：2404 Continue reading>>

NXP:Raising the Bar in <span style='color:red'>Security</span> and Performance for Automotive Bluetooth® Low Energy

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NXP:Raising the Bar in Security and Performance for Automotive Bluetooth® Low Energy

　　NXP：Bluetooth Low Energy (BLE) , with its cost-effective, low-power infrastructure and its ubiquitous availability in smartphones, has become an important tool for car makers. Over the past several years, what started as a way to give drivers a better way to make voice calls, send texts and stream music, has penetrated deeper into the vehicle architecture, serving to replace legacy technologies, increase efficiency and add convenience.　　For example, BLE can be used as an alternative to traditional LIN and CAN networks, replacing heavy cables with wireless connectivity. In hybrid and all-electric vehicles, BLE can be used to send temperature and voltage data from battery packs to the main vehicle computer, as part of battery management systems. In the infotainment system, BLE can increase efficiency, by using duty cycling to put other, more power-intensive communication formats—such as cellular or Wi-Fi—in sleep mode when not in use. BLE also gives tire pressure monitoring systems (TPMS) the ability to send notifications to your smartphone when the tires need air and can let you check tire pressure using an app instead of fiddling with a mechanical gauge.　　BLE for Smart Car Access　　Of the many ways that BLE can benefit automotive, few promise to improve the end-user experience more than BLE’s integration into smart access systems, where a BLE-enabled key fob or smartphone enables handsfree control of the car’s door locks and ignition along with digital-key car sharing capability.　　Handsfree access has been around for a while, but newer formats, based on a combination of BLE and ultra-wideband (UWB) , are much more secure and far less vulnerable to the relay attacks that have plagued earlier versions of remote access.　　These newly defined digital keys go beyond traditional key fobs, extending the usual features of locking and unlocking the car, opening the windows or starting the engine, to provide full control over the access rights to the car. Vehicle owners can share access among family and friends, no matter the physical distance, and can grant certain rights, ranging from access only to the car’s trunk to full driving capability. Using wireless protocols such as BLE and UWB for localization, digital key standards let you access your car without having to fish your phone out of your pocket or bag, and without having to open an app. Presence alone is all that’s needed to unlock or lock doors and start the engine.　　The Car Connectivity Consortium (CCC), for example, is a cross-industry organization, focused on smartphone-to-car connectivity solutions, that has defined a standard that enables mobile devices to securely store, authenticate and share digital keys for vehicles. The CCC’s Digital Key release 3.0 specification, released in 2021, adds BLE and UWB functional requirements for secure car access (NXP is a CCC board member and helped define the Digital Key 3.0 specification).　　Beyond the CCC, other standard bodies, such the Asia-Pacific Connected Vehicles Industry Association (ICCE) and the Smart Car Association Open Alliance (ICCOA), have proposed digital-key standards that use a combination of BLE and UWB.　　Taking Automotive BLE to The Next Level　　As a leading supplier of BLE solutions, NXP has played a key role in helping to add BLE to vehicles. In particular, our broad portfolio of BLE-enabled MCUs is designed specifically for automotive use. Most recently, we’ve introduced the KW45, a third-generation device that delivers an unmatched combination of security, flexibility, upgradability and performance.　　Building on the success of the KW3x, the KW45 offers a three-core architecture that includes a 96-MHz CM33 application core a dedicated CM3 64-MHz radio core, and an isolated EdgeLock Secure Enclave.　　Use this block diagram to see the interaction between the three cores in the KW45.　　App core: 1 MB of Flash and 128 kB of RAM to support advanced automotive applications, including communication over CAN, using an integrated FlexCAN module, as well as support for AutoSAR applications.　　Radio subsystem: Upgradeable Bluetooth 5.3 compliant, channel sounding-capable radio core with 256 kB of Flash memory and up to 88 kB of RAM.　　EdgeLock Secure Enclave: Isolated core with advanced security features such as secure lifecycle management, key-store operations and hardware-accelerated cryptographic functionality.　　By dividing responsibilities between application, radio and security cores, the KW45 ensures that connected automotive applications have the resources, upgradability and integration to evolve with changing standards and design requirements.　　Discover NXP's advanced Bluetooth solutions for Automotive, IoT and Industrial.　　The KW45’s advanced hardware is supported by a suite of software-enablement tools that target important automotive applications, including car sharing, sensors, wireless on-board diagnostics functions and, of course, CCC Digital Key 3.0 for secure car access. The KW45 is also the first to offer MCAL Drivers and a complex device driver for BLE enabling AutoSAR-compliant solutions.　　KW45 for Digital Key　　The KW45 is designed to meet the advanced security requirements of Digital Key 3.0. The KW45’s EdgeLock Secure Enclave enables secure trust provisioning and secure firmware updates, security lifecycle management and other security tasks associated with secure access. For Digital Key 3.0, the KW45 enables BLE with end-to-end security, so communications between the phone’s Secure Element and the car’s Secure Element are always protected.　　As part of a Digital Key 3.0 solution, along with NXP’s Secure Elements and NFC product families, the KW45 works seamlessly with NXP’s Trimension SR106, the industry’s first single-chip solution to combine UWB ranging and radar. Together, the KW45 and SR106 create a single-supplier solution that simplifies the design of Digital Key features. At the same time, the SR106 can do double duty, supporting in-cabin radar, as part of occupant-safety systems now being mandated in Europe, the US and elsewhere.　　KW45 for AUTOSTAR-Certified ECUs　　To streamline the development of automotive software and enable quick AUTOSAR certification for electronic control units (ECUs), the KW45 includes an NXP MCAL drivers, which maps all the on-chip MCU peripheral modules and external devices to memory, and makes the upper software layer independent of the MCU. KW45's MCAL driver package includes a complex device driver (CDD) for BLE. The KW45 can also be combined with NXP’s SBC offerings, for a streamlined, single-supplier solution for a broad range of ECU applications.　　KW45 for Future-Proof Development　　Using a Flash-based software core for radio operation adds a remarkable amount of flexibility and longevity to the design. The KW45 can evolve as BLE evolves, so vehicles can interface with smartphones today, tomorrow and for years to come—without expensive, time-consuming hardware upgrades or redesigns.　　Near-field communication (NFC) provides the backup entry for access when a smartphone runs out of power. Altogether, these smart technologies function collectively to give users a seamless experience.

Key word：

NXP

Release time：2022-12-27 17:14 reading：1579 Continue reading>>

<span style='color:red'>Security</span> routers make OT networks secure

Trade news

Security routers make OT networks secure

　　The new FL MGUARD 2102 and FL MGUARD 4302 Gigabit security routers from Phoenix Contact combine mGuard security software with powerful hardware.　　They are designed to protect industrial networks against unauthorized access or malware intrusion.　　With their increased data throughput of almost 1,000 Mbps, the security routers provide a higher level of security without any restrictions on data traffic. The mGuard security technology enables you to control and safeguard communication within production networks. The routers are functionally compatible with the current mGuard modules to the greatest possible extent. This makes it easy to use them in existing applications.　　The FL MGUARD 2102 is recommended for machine builders and system manufacturers who require fast integration into the production network in addition to secure remote maintenance. As well as ensuring the security of the OT network infrastructure, the FL MGUARD 4302 enables the efficient management of multiple mGuard security routers within a system.

Key word：

Phoenix

Release time：2022-12-26 16:52 reading：2270 Continue reading>>

5G Needs New Approach to <span style='color:red'>Security</span>

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5G Needs New Approach to Security

Planning for security in 5G networks requires a whole new approach compared to previous-generation networks to protect network infrastructure, according to a new technical report on 5G architecture and security published by the U.K. government.With 5G rollouts planned in some form or another around the world this year, the very fact that the architecture opens up opportunities for multiple players to operate on the network (rather than just a single network operator) could significantly increase the attack surface for connected devices, autonomous vehicles, and other use cases flagged up for 5G. Hence, the report suggests that a whole new mobile security strategy is needed and makes four significant security-based recommendations that the authors believe will protect vital infrastructure."Since the age of 2G, mobile networks have been some of the most secure things on the planet, helped by the fact that each one is controlled by a single network operator," said Peter Claydon, project director of AutoAir, one of the 5G testbeds in the U.K. that contributed to the report. "5G opens up mobile networks, allowing network operators to provide 'slices' of their networks to customers. Also, customers’ data can be offloaded and processed at the edge of the network without going through the secure network core. This report is a timely reminder of the security challenges that these new features raise."Regius Professor Rahim Tafazolli, founding director of the 5G Innovation Centre at the University of Surrey, added, 'Performance risk in such a complex network means that we need to reconsider many of our digital security processes."The report was produced as part of the U.K.’s 5G Testbed and Trials program, a government initiative to ensure that the U.K. plays a key role in 5G development. Three of the six 5G testbeds contributed to the report, along with the University of Surrey’s 5G Innovation Centre. The three testbeds were AutoAir, which is testing transport use cases; 5G RuralFirst, which is testing the use of 5G to enhance rural communities, and the Worcestershire 5G Testbed, which is testing industrial use cases of 5G.Key highlights are the challenges and inevitable trade-offs between cost, security, and performance in the development and deployment of 5G. In a new environment of multiple use cases, each with different performance requirements, along with the expected introduction of new market players, alignment and cooperation between parties will be essential. In addition, systems will need to be "secure by design," and new approaches, including the use of artificial intelligence (AI), will be required.New ways will be required to predict and pre-validate 5G network connections, leveraging mobile AI-based autonomous network technologies — from mobile phones and smart industrial machines to health-monitoring devices and smart home consumer devices. The networks will need to quickly and efficiently recognize these devices and confirm that they are secure without compromising user experience and performance. The paper also recommends:A cross-layered process that will allow end-to-end security for critical services such as the transport and logistics, health and social care, Industry 4.0, and rural connectivity solutions.An organization that is tasked to help monitor and encourage good security-by-design practice and set out and document an approach to designing secure 5G networks, applications, and services.Further testing of standards and security capability using existing U.K. test beds.The report highlights the scale of the challenge. The International Telecommunication Union (ITU) vision for 5G outlines use cases with very diverse technical performance and system requirements, requiring mobile networks to interconnect with different non-3GPP network technologies. It says that this cannot be achieved by a single network operator in their own domain, and hence, secured and trusted network-to-network interoperability is essential.The 3GPP’s 5G specifications define interfaces for inter-network communications, but further work is necessary to evolve interface functionality, performance, and security. To realize seamless interoperability, effective partnerships will be necessary between different network operators and equipment owners, such as transport companies, rural and local communities and authorities, and publicly funded organizations. To achieve end-to-end security, network boundaries need to be secured across all borders.Adding to the complexity are interconnection of 3GPP and non-3GPP networks, new 5G use cases with diverse requirements, and new 5G technologies, including evolutionary approaches in the mobile network. This adds new security vulnerabilities with a significantly larger attack surface, making it essential to thoroughly evaluate the risks and vulnerabilities and identify work items to alleviate them.The various challenges to deploy secure 5G networks while meeting the requirements of different 5G use cases also creates a trade-off challenge between network performance and security. The combination of increased network-to-network complexity, end-to-end cross-layer system security, and critical applications will mean that conventional security methods will not be feasible.Hence, new technology will be required to meet these challenges to prevent conventional security approaches compromising the required 5G performance. Context-aware networks and AI can process context transfer patterns and correlate them with user, device, application, and security context metadata to make predictive decisions. This will assist the network to make sure that the system setup is one step ahead of the dynamics of the user equipment behavior and context, therefore predicting and pre-validating the required end-to-end security and connection in advance of the device requesting the service.

Key word：

5G

Release time：2019-01-08 00:00 reading：1610 Continue reading>>

model	brand	Quote
MC33074DR2G	onsemi
BD71847AMWV-E2	ROHM Semiconductor
CDZVT2R20B	ROHM Semiconductor
RB751G-40T2R	ROHM Semiconductor
TL431ACLPR	Texas Instruments

model	brand	To snap up
IPZ40N04S5L4R8ATMA1	Infineon Technologies
BP3621	ROHM Semiconductor
TPS63050YFFR	Texas Instruments
STM32F429IGT6	STMicroelectronics
ESR03EZPJ151	ROHM Semiconductor
BU33JA2MNVX-CTL	ROHM Semiconductor

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