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Japan–U.S. NAND Alliance Steps Up Investment as Kioxia–SanDisk Capex Reportedly Rises 40% YoY

　　As South Korea’s memory giants shift focus toward 1c DRAM capacity expansion amid surging demand, Global Economic, citing German tech outlet ComputerBase, reports that the Kioxia–SanDisk alliance is moving fast to reassert its position in the NAND market, capitalizing on an investment gap as Samsung Electronics and SK hynix divert resources toward HBM.　　According to the reports, the U.S.–Japan NAND consortium is expected to execute total capital expenditure of $4.5 billion (about KRW 6.75 trillion) in the current fiscal year, marking a 41% year-on-year increase.　　Notably, a key focus of the alliance would likely be the 10th-generation NAND. Nikkei previously reported that Kioxia plans to begin mass production at its Kitakami site in Iwate Prefecture in 2026. However, given the jump to a 332-layer architecture—up from 218 layers in its 8th-generation devices—the company is expected to repurpose its newly operational Kitakami K2 facility, which began production in September, to support output, according to Nikkei.　　ComputerBase, cited by Global Economic, attributes the strong NAND demand supporting Kioxia–SanDisk’s investment to a structural shift in AI workloads: As AI moves from the training-heavy infrastructure build-out phase to large-scale inference deployment, demand is rising for high-performance, ultra-high-capacity storage.　　At the same time, storage is accounting for a growing share of hyperscaler data center capex, while SSD capacity per GPU is more than doubling year over year, the report notes. As a result, next-gen AI servers are increasingly being designed with tens of terabytes of storage per GPU, driving a sustained surge in NAND demand, the report adds.　　Fewer Layers, Comparable Density　　ZDNet also reports that in its recent earnings briefing, Kioxia identified the launch of 10th-generation BiCS NAND as a key priority for fiscal 2026 (April 2026–March 2027). The report adds that the company applies its proprietary BiCS (Bit Cost Scalable) architecture to its scaling roadmap, with the 10th-generation device delivering 59% higher storage density per unit area and a 33% improvement in data transfer speed compared with the 218-layer generation.　　According to ComputerBase, Kioxia’s stacking approach enables comparable density with fewer layers, translating into meaningful cost advantages. A lower stack height also simplifies vertical etching, reduces high-cost equipment runtime, and helps mitigate wafer warpage defects.　　Based on 3D NAND density estimates cited by Global Economic from ComputerBase, Kioxia / SanDisk BiCS10 is projected to reach 37.6Gb per square millimeter in QLC configuration, which would surpass Samsung Electronics’ upcoming 430-layer V10 TLC architecture at around 28.0Gb.　　Samsung, SK hynix Hold Back　　However, TrendForce indicates that major NAND Flash suppliers will add virtually no new production capacity in 2026, and it seems that South Korean memory players are taking a different approach with Kioxia and SanDisk.　　As highlighted by Global Economic, Samsung Electronics and SK hynix have both adjusted their 10th-generation NAND ramp-up schedules: Samsung has reportedly pushed back its V10 production timeline from the second half of 2025 to 2026, while SK hynix is targeting early 2027 for full-scale production.　　ZDNet also reports that Samsung Electronics had initially planned to begin mass production of its 430-layer 10th-generation NAND this year, but the timeline has been delayed to at least 2027, citing technical complexity and softer demand conditions. The report adds that Samsung is still reviewing investment timing, with no concrete equipment orders confirmed, and that SK hynix faces a similar situation.　　Global Economic notes that if the U.S.–Japan NAND alliance succeeds in lowering cost per terabyte and accelerating QLC enterprise SSD adoption, demand could shift more rapidly toward AI data center storage. Even so, Samsung and SK hynix remain competitive, supported by stable 9th-generation yields and strong enterprise SSD customer bases, the report adds.

Key word：

Kioxia

Release time：2026-06-01 10:45 reading：194 Continue reading>>

<span style='color:red'>SK</span> hynix Introduces iHBM Solution, Targets HBM5 Adoption with 30% Thermal Resistance Reduction

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SK hynix Introduces iHBM Solution, Targets HBM5 Adoption with 30% Thermal Resistance Reduction

　　As thermal management emerges as a key challenge for HBM, SK hynix has unveiled its iHBM solution, which integrates cooling elements (ICEs) directly into the HBM package. The company plans to adopt the technology in next-generation products, including HBM5, according to its press release.　　According to SK hynix, unlike conventional HBM designs that dissipate heat through the core die, iHBM integrates cooling elements (ICEs), made of thermally conductive, electrically non-conductive silicon-based materials, directly into the D2D PHY between HBM and GPUs, where heat is most concentrated. The company said the technology reduces thermal resistance by 30% and improves operating stability.　　As highlighted by SK hynix, the iHBM solution adopts a structural approach to thermal management by creating an additional heat dissipation path within the package. It also leverages the company’s wafer-level packaging (WLP) process and proven MR-MUF technology to enable stable high-volume manufacturing.　　In addition, its compatibility with existing System-in-Package (SiP) architectures allows customers to adopt the thermal solution with minimal design modifications, SK hynix adds.　　In terms of future roadmap, SK hynix plans to incorporate the iHBM solution into next-generation HBM products, including HBM5, with the goal of improving the stability and efficiency of HPC systems and AI data centers.　　Another Key Technology beyond Hybrid Bonding　　Alongside SK hynix’s latest iHBM solution, hybrid bonding is widely seen as a key approach to addressing heat dissipation challenges in 20-stack HBM, which, as previously reported by The Elec, are expected to become increasingly difficult.　　As explained in the report, hybrid bonding differs from conventional thermo-compression (TC) bonding, which connects chips through soldered micro-bumps. Instead, it bonds dielectric materials such as silicon dioxide (SiO₂) and copper through an annealing process at temperatures of roughly 200°C to 400°C.　　By heating and gradually cooling copper sealed within dielectric layers, thermal expansion and vertical pressure enable direct copper-to-copper diffusion bonding without reaching copper’s melting point, the report notes, adding this approach helps reduce thermal damage to semiconductor circuits while delivering improved thermal and electrical performance.

Key word：

SK hynix

Release time：2026-05-27 10:42 reading：375 Continue reading>>

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Murata’s Type 1SC-NTN module achieves Skylo U.S. certification for cellular and non-terrestrial network connectivity

　　Murata announced today that its Type 1SC-NTN has received Skylo U.S. certification for its dual-mode cellular and non-terrestrial network (NTN) capabilities, making it the first ultra-compact resin mold module to achieve this recognition from an NTN service provider. The product seamlessly integrates the latest Rel-17 NTN standard, enabling satellite data communication capabilities without necessitating any hardware design changes. When paired with Skylo's NTN service, it extends the reach of satellite connectivity, ensures uninterrupted communication, and delivers a new class of solution for the demanding satellite IoT market.　　Murata’s Type 1SC is the world’s smallest form factor LTE Cat M/NB-IoT module with both global regulatory and NTN certification. It supports GPS/GNSS, OpenMCU, and Integrated SIM to support the applications that are defining today’s market, such as dual-mode cellular IoT. In addition to its unmatched size, low power, and cost-efficiency, its high level of integration accelerates time to market while lowering development and deployment costs for customers. Target uses include wearable, tracking, and medical monitoring devices, as well as M2M communication, smart meters, and other size-limited IoT edge products.

Key word：

Murata

Release time：2024-10-15 13:19 reading：1004 Continue reading>>

<span style='color:red'>SK</span>J：at are Crystals for

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SKJ：at are Crystals for

Key word：

SKJ

Release time：2023-08-24 13:52 reading：2945 Continue reading>>

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AMEYA360:Distributors Boost Testing as Counterfeit Risks Rise

　　The risk of procuring counterfeit components always increases when electronic devices are in tight supply. Between 2021 and 2022 – the height of the unprecedented semiconductor shortage – reports of suspect or nonconforming parts increased by 35 percent, according to the ERAI, which collects data on counterfeits.　　Notably, global semiconductor sales were flat during that period.　　The reality is counterfeit components are omnipresent in the electronics supply chain. One of the most common scams is re-marking (or “blacktopping”) common or even sub-par components as pricier, high-reliability devices. Although the parts are authentic, they could fail in high-stress environments. Analog ICs, programmable logic ICs and microprocessor ICs are the most frequent targets of counterfeiters.　　Testing for counterfeit parts has been standard operating procedure at Sourceability since its founding in 2015　　Jens Gamperl, Sourceability　　Demand for component testing has increased significantly during the chip shortage despite costs — as much as $2,000 — and delays that are incurred during the process. Testing is often outsourced and can damage sample devices. But for a portion of the distribution market, test capabilities distinguish them as trusted sources of supply.　　Independent, non-franchised distributors source from the open market where component makers, OEMs, EMS providers and other organizations sell excess inventory. Components that can’t be traced back to a factory; arrive in opened or damaged packaging; or are heavily discounted could be counterfeit. Stringent quality control (QC) has become paramount for top-tier independents.　　However, testing has created a backlog of orders as shortages stretch on. Last year, independent distributor Fusion Worldwide acquired a test house based in Singapore. Another independent, Sourceability, has established test labs in each of its 4 global warehouses. From the company’s founding in 2015 testing has been standard operating procedure, according to Jens Gamperl, CEO and founder of Sourceability.　　“The tide is turning for independent distributors, which often get confused with brokers,” he noted. “They are clearly two different things.”　　Brokers are opportunistic organizations that buy low and sell high during supply disruptions and have been known to set up shop, take orders; and then disappear after payment. They are a common source of counterfeit parts. ERAI saw suspect capacitor reports spike over a 5-year period that included a severe shortage.　　Trust but verify　　Based on sources of components Sourceability has a 3-level verification process. One of the biggest challenges in the open market, Gamperl said, are parts that are authentic but have been re-marked as something else.　　“There are different sources of counterfeits,” Gamperl explained. “What what we see once in a while is that a manufacturer decides that product is not on their quality level, and they send it to a destruction facility, and on the way the shipment gets lost.”　　Even products that can be traced back to manufacturers (level 1) are verified by brand, part number, packaging, date code and dimensions. “We have a large database of known parts, so it’s relatively easy to test a component’s dimensions,” Gamperl said.　　Sourceability maintains data on components, suppliers and customers it has dealt with at one time or another. Customers sometimes ask distributors to procure parts on their behalf. “If we haven’t bought one part from a supplier in, say, 10 years, there’s usually a good reason,” Gamperl said.　　Level 2 testing is done on components bought from authorized distributors, which source directly from component factories. Sourceability checks for open packs, resealed packaging, cut tape or 3rd party packaging. Acceptable quality level sample inspection is done based on the quantity received, using various microscopy options to validate conformance.　　The risk of procuring counterfeit components always increases when electronic devices are in short supply“Where we have no traceability, we always do a level 3 inspection,” Gamperl said. These devices are sourced from independent distributors, contract manufacturers/other excess channels and brokers. Markings on components are tested for permanence – a destructive solvent test (heated solvent) is used to detect epoxy-based blacktopping.　　Devices are also analyzed through x-ray florescence (XRF), are tested for solderability and undergo chemical decapsulation.　　“This usually means we take the packaging off and go down to the die and view the wiring through x-rays,” Gamperl said. By removing external packaging on a semiconductor and exposing the semiconductor wafer or die, microscopic inspection of brand marks, trade marks, and laser die etching can be used to determine authenticity. These tests damage samples, but some customers in the automotive or defense industries, for example, will not accept shipments without seeing test results beforehand.　　Equipment or facility investment has become a cost of doing business for many independents. Sourceability’s labs use:　　High Power Microscopy Capabilities Keyence VHX5000, VHX7000, Olympus DSX1000　　Keyence IM-7020 Instant Measuring Equipment　　Heated Chemical Testing (HTC)　　Creative Electron TruView? Prime X-Ray Inspection System　　Glenbrook Technologies JEWEL BOX 70T　　RoHS Testing with X-Ray Fluorescence (XRF) Equipment Olympus : Xpert Model　　RoHS Testing with X-Ray Fluorescence (XRF) Equipment Fischer Technology-XDAL-237 SDD　　NISENE Jet-Etch Pro Acid Decapsulation System　　RPS Prelude Dip and Look Solderability Test System　　RPS Cadence Steam Aging System　　Memmert JEDEC J-STD-033 and UF260 Universal Drying Ovens　　Sometimes, functionality testing is the only way to spot a counterfeit part. Counterfeits are getting more sophisticated, Gamperl notes, and resellers are always a step behind. But out of 50,000 recent shipments, Sourceability caught 120 counterfeits. “That’s small portion, even if counterfeiting has increased,” he added.

Key word：

AMEYA360

Release time：2023-05-06 11:33 reading：2392 Continue reading>>

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Skyworks Solutions Inc. SI83004 & SI83014 Smart Switches

　　Skyworks Solutions Inc. SI83004 and SI83014 Smart Switches are designed to provide four high- or low-side switches with low RON. Skyworks Solutions Inc. SI83004 and SI83014 are excellent choices for driving resistive and inductive loads like solenoids, relays, and lamps commonly found in industrial control systems like Programmable Logic Controllers (PLC). The versatile switches can be interfaced directly with an MCU or controlled through a digital isolator or optocoupler-based isolation barrier. The devices have a logic interface that supports low-power 2.5V to 5V MCUs and is powered by the switch's high-voltage field power supply.　　FEATURES　　High-side or low-side switch　　9V–32V switch supply　　Fast (10s) update rate　　High continuous current (700mA) and low RON (150mΩ)　　Unique multi-voltage output clamp　　Unlimited demagnetization (EAS)　　Efficient and fast turn-OFF　　Current-limited overload protection　　Over temperature protection　　Undervoltage protection　　Three different diagnostics　　Overvoltage　　Over temperature　　Overcurrent　　Dedicated fault indicator　　Dedicated output enable input　　Designed to IEC 61131-2　　Compact TSSOP-24 package　　3.5kV ESD Protection　　–40°C to 125°C operating temperature　　APPLICATIONS　　Programmable logic controllers　　Industrial data acquisition　　Motion controllers　　Smart solid-state relays

Key word：

Skyworks,AMEYA360

Release time：2023-04-12 11:26 reading：2245 Continue reading>>

Trade news

AMEYA360:Skyworks Solutions Inc. OLC449 Optocoupler

　　Skyworks Solutions Inc OLC449 Optocoupler is a radiation-tolerant phototransistor non-hermetic surface-mount optocoupler. The optocoupler consists of an LED and N-P-N silicon phototransistor that is electrically isolated but optically coupled inside a non-hermetic six-pin Leadless Chip Carrier (LCC) package. This optocoupler offers electrical parameters similar to JEDEC registered 4N49 optocoupler, with a higher CTR and better CTR degradation characteristics due to radiation exposure. The hermetic surface mount variant is available as OLS449 in both high-reliability screened and non-screened catalog versions. This optocoupler is designed for a low LED operating current while providing excellent radiation tolerance margins. The OLC449 optocoupler features a radiation-tolerant version of the 4N49U. This optocoupler operates at 50mA continuous collector current and 40mA average input current.　　FEATURES　　Radiation tolerant version of the 4N49U　　High Current Transfer Ratio (CTR)　　Same processing and construction as the OLC249, but with a higher CTR　　SPECIFICATIONS　　1000VDC electrical isolation　　300mW power dissipation (output detector)　　70mW power dissipation (input diode)　　40mA average input current　　2V reverse voltage　　240°C lead temperature range for 10 sec　　50mA continuous collector current　　1mA LED current　　–55°C to 125°C operating temperature range　　–65°C to 125°C ambient temperature range　　APPLICATIONS　　Satellite constellation　　Avionics　　Radar　　Surveillance systems　　Space　　Communications

Key word：

AMEYA360,Skyworks

Release time：2023-03-15 11:10 reading：2572 Continue reading>>

Trade news

Ameya360:Skyworks and Sequans Launch Compact LTE-M/NB-IoT SIP Solution

　　Skyworks Solutions Inc. and Sequans Communications S.A. have launched the SKY66431, a 5G Massive IoT SiP (system-in-package) solution that combines Sequans’ Monarch 2 modem with Skyworks’ RF front-end solution, creating the world’s smallest LTE-M/NB-IoT connectivity platform in a single package.　　Essential to critical infrastructure, low-power wide-area network (LPWAN) products meet stringent operational requirements for durability, battery lifespan and reliability. Designed to address the increasing demand for form-factor driven cellular LPWAN end points, the SKY66431 is ideally suited for utility meters, asset trackers, security and alert systems and other battery-powered devices such as wearable medical and fleet management.　　The SKY66431 is a highly integrated multi-band, multi-chip SiP supporting 5G Massive IoT platforms, offering high performance connectivity with ultra-low power consumption. Its native 23dBm front-end module leverages Skyworks’ RF design and advanced packaging expertise that optimizes reliability in demanding environments and allows for extremely small footprint designs while maintaining simplified PCB design rules. With SiP form factor-enabling miniaturization and fully encapsulated silver-free conformal shielding, the SKY66431 package is a key differentiator enabling ultra-compact, flexible and robust end-product designs.　　The solution is being certified by a number of industry and regulatory agencies, as well as multiple network operators. This SiP is available now for select customers, with general availability expected in the first quarter of 2023.

Key word：

Ameya360

Release time：2023-01-17 11:50 reading：2415 Continue reading>>

Trade news

Chinese firms ask workers to shun iPhones, buy Huawei devices

Extending support to Huawei which is facing immense pressure from the US, Chinese companies have rallied behind the tech giant, offering hefty discounts to employees to buy Huawei devices and shun iPhones.According to a report in Nikkei Asian Review on Tuesday, the move came after the detention of Huawei's Chief Financial Officer Meng Wanzhou in Canada at the request of American prosecutors."Many Chinese businesses have told employees they will receive subsidies if they buy Huawei smartphones to aid the company. Most are subsidizing 10-20 per cent of the purchase price, with some even covering the full amount," said the report.Over 20 Chinese companies also took to social media to announce that they will increase purchases of other Huawei products, the report added.Some other Chinese companies are also boycotting Apple."According to Chinese media, a Shanghai-based business association said it would expel anyone who bought Apple products," said the report.The diplomatic row over Huawei has escalated after China reacted to its CFO's arrest, arresting a second Canadian in China in December in a potential act of retribution.The Canadian Foreign Ministry identified the national as Michael Spavor, founder of the Paektu Cultural Exchange, a Canadian-owned China-based company that helps to facilitate trips to North Korea.China earlier arrested Michael Kovrig, a former Canadian diplomat who currently works for the non-profit organization International Crisis Group as its northeast Asia senior adviser.A Chinese court in December banned the sale and import of most iPhone models after granting Qualcomm an injunction against Apple.Qualcomm claimed that Apple violated two of its patents.To avoid the ban, Apple released a small update to iOS last week, saying that iOS version 12.1.2 contains software changes exclusive to China.

Key word：

Huawei

Release time：2018-12-27 00:00 reading：1551 Continue reading>>

SST and <span style='color:red'>SK</span> hynix system ic partner to expand availability of embedded SuperFlash technology

Trade news

SST and SK hynix system ic partner to expand availability of embedded SuperFlash technology

IC designers are increasingly seeking ways to keep production costs down while implementing low power, high endurance embedded flash. Microchip Technology Inc. via its subsidiary Silicon Storage Technology(SST) has announced a strategic partnership with SK hynix system ic to expand the availability of SuperFlash® technology. The partnership will introduce SST’s embedded SuperFlash technology to SK hynix system ic’s 110 nanometer (nm) CMOS platform, providing designers a cost-effective and low-power embedded flash memory solution. SST’s embedded SuperFlash technology offers low power, high reliability, superior data retention and endurance for a range of applications, such as Internet of Things (IoT) devices, smart cards and microcontroller-based applications. The technology’s power efficiency and fast erase time are ideal for low-power applications such as remote IoT edge nodes and contactless payment devices. “The combination of area-efficient, low-power SuperFlash technology and the highly cost-effective 110 nm process node opens up exciting new product opportunities, especially for IoT and microcontroller-based applications,” said Mark Reiten, vice president of SST, a wholly owned subsidiary of Microchip. “This partnership will enable customers who require low power, high endurance embedded flash to keep their production costs down by using the highly optimised 8-inch CMOS platform.”SST’s SuperFlash technology complements SK hynix system ic’s embedded flash memory solutions with low power and high reliability IP. SK hynix system ic is a fully owned subsidiary spun off from SK hynix (000660: Korea SE) in July 2017. It is a pure 200 mm foundry specialised in Display Driver IC (DDI), CMOS Image Sensor (CIS), and Power IC with a process range of 500 nm to 57 nm. “We believe that the adoption of SST’s embedded SuperFlash will enable SK hynix system ic to expand our technology portfolio, and it will help to respond to customer requests for highly reliable and robust embedded non-volatile memory solutions,” said Dr. SB You, marketing vice president of SK hynix system ic. “Moreover, we will provide customers with a cost-effective embedded flash solution to support their competitiveness in the market. As the demand for embedded flash memory solutions increases, there will be many customers coming to us to use our 110nm CMOS technology-based embedded flash memory solution.” The process development commenced earlier this year and is expected to be completed in early 2019. Contact SST for more information on the company’s extensive custom library of off-the-shelf IP blocks optimised for smartcard System-on-Chips (SoCs).

Key word：

SST,SK hynix

Release time：2018-12-17 00:00 reading：4142 Continue reading>>

model	brand	Quote
CDZVT2R20B	ROHM Semiconductor
RB751G-40T2R	ROHM Semiconductor
MC33074DR2G	onsemi
BD71847AMWV-E2	ROHM Semiconductor
TL431ACLPR	Texas Instruments

model	brand	To snap up
ESR03EZPJ151	ROHM Semiconductor
IPZ40N04S5L4R8ATMA1	Infineon Technologies
BP3621	ROHM Semiconductor
STM32F429IGT6	STMicroelectronics
BU33JA2MNVX-CTL	ROHM Semiconductor
TPS63050YFFR	Texas Instruments

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