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Renesas：Enhance HMI User Experience with Built-in Large Memory <span style='color:red'>MPU</span>

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Renesas：Enhance HMI User Experience with Built-in Large Memory MPU

　　The HMI market continues to drive growth in better user experience and increased automation with the expansion of HMI applications. This results in a strong demand for improved functionality and performance in display-based applications, such as real-time plotting, smooth animation, and USB camera image capture, in affordable systems. Microprocessors (MPUs) with high-speed, large-capacity built-in memory that can be used like microcontrollers (MCUs) are gaining attention in the market. Renesas' RZ/A3M MPU with a built-in 128MB DDR3L SDRAM and a compatible package for a two-layer PCB design is the ideal solution for realizing smooth animation and high-quality HMI at a reasonable system cost.　　High-Performance HMI and Real-Time Graphics　　Integrating high-speed, large-capacity memory directly into the MPU package offers several advantages, including mitigating concerns about high-speed signal noise on the PCB and simplifying PCB design for the users. The large-capacity memory needed for high-performance HMIs is externally connected to the MPU in the conventional way. Additionally, PCBs equipped with DDR memory and high-speed signal interfaces require multi-layer PCB designs to account for signal noise, making it challenging to reduce PCB costs. Also, the common capacity of on-chip SRAM is typically between 1MB and 10MB, which is too small for high-performance HMIs that need to include a reasonable number of tasks in the near future. To overcome these issues, Renesas released an industry-leading RZ/A3M MPU with a large built-in 128MB DDR3L memory to support high-performance HMI and real-time graphics performance to enhance better and faster user experiences. Most importantly, the board does not require a high-speed signal interface and supports two-layer PCB design to reduce board noise and simplify system development for users.Figure 1. Strengths of Built-in DDR Memory　　Designing High-Performance PCBs at a Reasonable System Cost　　The number of PCB layers and the ease of design significantly impact the cost of system implementation and maintenance in user applications. As shown in Figure 2, using a wide pin pitch of 0.8mm allows for the layout of signal lines and placement of VIAs between the balls. Additionally, placing the balls handling the main signals in the outer rows of the 244-pin 17mm x 17mm LFBGA package and positioning the GND and power pins as inner balls allows for efficient routing of the necessary signal lines for the system (Figure 3). The RZ/A3M MPU is designed to build cost-effective systems with two-layer PCBs through its innovative packaging and pin assignments.Figure 2. Signal Wiring and Ball LayoutImageFigure 3. Optimized Ball Arrangement for a Two-Layer Board Layout　　User-Friendly Interface Enabling Smooth GUI Display　　The high-resolution graphic LCD controller integrated into the RZ/A3M supports both parallel RGB and 4-lane MIPI-DSI interfaces, accommodating displays up to 1280x800. Additionally, the 2D graphics engine, high-speed 16-bit 1.6Gbps DDR3L memory, and 1GHz Arm® Cortex®-A55 CPU enable high-performance GUI displays, including smooth animations and real-time plotting that increase the possibility of automation in HMI applications. Connecting a USB camera to the USB 2.0 interface enables smooth capture of camera images, making it easy to check inside of an apparatus, for example, the doneness of the food in the oven or the condition in the refrigerator.　　The EK-RZ/A3M is an evaluation kit for the RZ/A3M. It includes an LCD panel with a MIPI-DSI interface. With this kit, users can immediately start evaluation. Renesas also has several graphics ecosystem partners – LVGL, SquareLine Studio, Envox, Crank, RTOSX – who deliver GUI solutions utilizing the EK-RZ/A3M to further accelerate your development cycle.Figure 4. High-Definition HMI Example with the EK-RZ/A3M　　The RZ/A3M MPU, equipped with high-speed 128MB DDR3L memory and a 1GHz Arm Cortex-A55, excels in developing cost-effective HMI applications with real-time plot UIs, smooth animations, and USB camera capture. The integrated memory simplifies PCB design by removing the need for high-speed signal interface design. Visit www.renesas.com/rza3m to learn more about the technical details and how to start developing the next HMI applications for consumer electronics, smart home, building automation, healthcare, industrial applications, and office automation.

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Renesas

Release time：2025-06-06 15:27 reading：397 Continue reading>>

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Renesas Extends RZ/A MPU Line-up with RZ/A3M for Cost-Sensitive, Advanced HMI Solutions

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced a new high-performance microprocessor (MPU) in the RTOS-based RZ/A series that meets the growing demands of advanced human-machine interface (HMI) systems. The new RZ/A3M MPU comes with large SDRAM, SRAM and RTOS support to facilitate the seamless execution of complex tasks and real-time graphical displays. The RZ/A3M drives video and camera output on large LCD panels with resolutions up to 1280x800, addressing the display requirements in next-generation home appliances, industrial and office automation, healthcare devices and building control systems.　　Similar to its existing RZ/A3UL, the RZ/A3M features a 64-bit Arm® Cortex®-A55 core with a maximum operating frequency of 1 GHz and 128 KB (kilobytes) of on-chip SRAM. By integrating high-speed 128MB DDR3L-SDRAM in a single System-in-Package (SiP), the device eliminates the complex task of designing a high-speed signal interface for connecting external memory.　　Reducing System Cost with Built-in Memory and Simplified PCB Design　　The RZ/A3M is designed to reduce system costs and accelerate development. It supports both external NAND and NOR flash via QSPI for data and code storage. Paired with a driver, high-capacity NAND flash offers a cost-effective option for memory expansion. Additionally, the RZ/A3M's BGA package has a unique pin layout with two main rows positioned on the outside edge. This layout simplifies PCB routing and enables a low-cost, dual-layer printed wiring board design, providing significant cost and time savings. This memory integration simplifies PCB design by reducing the routing complexity and minimizing layout constraints.　　“I’m pleased to launch the RZ/A3M, the first RZ product with large built-in memory targeting high-function video/animation HMI performance while keeping overall system costs low,” said Daryl Khoo, Vice President of the Embedded Processing Marketing Division at Renesas. “In addition, we aim to deliver a highly responsive user experience with high-quality, real-time graphics, and provide the ease of design and cost efficiency to help our customers build advanced HMI solutions quickly.”　　Comprehensive Development Environment　　Renesas offers a comprehensive HMI development environment that includes the Flexible Software Package (FSP), evaluation kits, development tools, and sample software. Graphical user interface (GUI) solutions from partner companies such as LVGL, Crank, SquareLine Studio, and Envox will be available for the RZ/A3M to facilitate rapid HMI graphics development.　　Key Features of RZ/A3M　　Arm Cortex-A55 CPU with a maximum operating frequency of 1GHz　　128KB SRAM with error correction, Built-in 128MB DDR3L SDRAM　　Graphics capabilities: LCD controller supporting resolutions up to 1280x800 (WXGA), parallel RGB and MIPI-DSI (4-lane) interfaces, 2D graphics drawing engine　　Peripheral functions: QSPI interface for serial NOR/NAND flash memory, SPI, I2C, SDHI, USB2.0, I2S, temperature sensor, timer　　Package: 244-pin LFBGA, 17mm x 17mm, 0.8mm pitch　　Renesas’ Comprehensive HMI Solutions　　Renesas offers a wide variety of HMI solutions ranging from the 32-bit RX and RA MCU families to the 64-bit RZ family supporting 4K displays. The RZ/A series, built on RTOS-based MPUs with fast startup, includes the new RZ/A3M, which delivers high-performance HMI capabilities with the same ease of use offered by MCUs using large memory capacity.　　Multi-HMI Winning Combination　　Renesas offers Multi-HMI Solution which combines the new RZ/A3M MPU with numerous compatible devices from its portfolio to offer HMI functions for appliances. These Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.

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Renesas

Release time：2025-05-26 14:49 reading：433 Continue reading>>

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Fibocom Launches a Series of On-device AI Solutions for Compute-intensive Applications powered by Qualcomm-based Platforms at Computex 2024

　　Inevitably, the adoption of generative AI and LLM (Large Language Model) has fueled more intelligence and efficiency in our lives and works than in the past decade. Moving forward, the demand for running AI and LLM at the edge devices is growing as it provides lower latency, higher privacy, and more flexibility, which is set to redefine the level of intelligence of smart devices as well as broaden the landscape of mobile scenarios.　　Taipei, Taiwan – June 7th 2024 – Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, launches a series of on-device AI solutions powered by Qualcomm® QCS8550 and QCM6490 processors from Qualcomm Technologies, Inc. The solutions are designed to satisfy compute-intensive application scenarios such as robotics, automated vehicles, video collaborations, smart retailing, etc., accelerating industrial digitalization and intelligent transformation.　　Flagship on-device AI solution powered by Qualcomm QCS8550 processor　　Utilizing the powerful Qualcomm QCS8550 processor, Fibocom’s flagship on-device AI solution is designed to deliver strong performance and unparalleled multimedia capabilities. Equipped with an octa-core CPU and an Adreno™ 740 GPU, the solution can support up to 4 concurrent displays, and 8K video encoding and decoding. It serves as a strong core for industries requiring high-definition video playing, fast data analytics and lower latency like automated vehicles, robotics, remote medical surgery, computer vision systems, live streaming, videoconference systems, and more.　　Premium on-device AI solution powered by Qualcomm QCM6490 processors, piloting the high-end AIoT market　　The solution developed using the Qualcomm QCM6490 processor, features an octa-core processor with high-speed HVX (Hexagon Vector Extension) technology, and a high-performance graphics engine to allow smooth 4K video playing and multi-channel camera inputs. In addition, the solution is capable of allowing a maximum of 5 ISPs (Image Signal Processing) and up to 5-8 camera streams simultaneously, helping customers to ease their concerns on multi-camera deployments as well as dual-screen display scenarios. The solution offers flexible wireless connections such as 5G, Wi-Fi, Bluetooth, and is equipped with a GNSS receiver for precise navigation both indoors and outdoors. In terms of software, the solution supports the mainstream operating systems: Android, Linux, and Windows. Leveraging the computing power of up to 13 TOPS, the solution efficiently helps customers handle data-intensive computation and processing, running various 1.3B/3B/7B open-source LLMs on the device, making it an ideal solution for smart retail, in-vehicle infotainment (IVI) and industrial inspection.　　“We are excited to see our powerful Qualcomm processors, the QCS8550 and QCM6490, being utilized in Fibocom's innovative on-device AI solutions,” stated Dev Singh, Vice President of Business Development and Head of building, enterprise & industrial automation at Qualcomm Technologies, Inc. “This collaboration is a testament to our commitment to advancing AI capabilities at the edge, enhancing performance and efficiency across a range of applications from industrial automation to smart retail.”　　"It is paramount to master the productivity of AI and create value-added solutions from the edge side for our customers that are in urgent need of building their smart devices based on our solutions. We are thrilled to develop these solutions based on the advanced and powerful chipsets from Qualcomm Technologies, as it not only provides the fundamental architecture of edge intelligence, also enriches flexibility in network connections such as 5G/Wi-Fi/Bluetooth," said Ralph Zhao, VP of MC BU at Fibocom. "In collaboration with Qualcomm Technologies, Fibocom is dedicated to injecting new versatility to the future of intelligence, and accelerating the implementation of our collaboration in robotics, industrial automation, live streaming, and more."

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Fibocom

Release time：2024-06-18 16:12 reading：967 Continue reading>>

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Tech Giants Launch AI Arms Race, Aiming to Spark a Wave of Smartphone and Computer Upgrades

　　According to CNA’s news, the potential business opportunities in artificial intelligence have spurred major tech giants, with NVIDIA, AMD, Intel, MediaTek, and Qualcomm sequentially launching products featuring the latest AI capabilities.　　This AI arms race has expanded its battleground from servers to smartphones and laptops, as companies hope that the infusion of AI will inject vitality into mature markets.　　Generative AI is experiencing robust development, with MediaTek considering this year as the “Generative AI Year.” They anticipate a potential paradigm shift in the IC design industry, contributing to increased productivity and significantly impacting IC products.　　This not only brings forth new applications but also propels the demand for new algorithms and computational processors.　　MediaTek and Qualcomm recently introduced their flagship 5G generative AI mobile chips, the Dimensity 9300 and Snapdragon 8 Gen 3, respectively. The Dimensity 9300, integrated with the built-in APU 790, enables faster and more secure edge AI computing, capable of generating images within 1 second.　　MediaTek points out that the smartphone industry is experiencing a gradual growth slowdown, and generative AI is expected to provide new services, potentially stimulating a new wave of consumer demand growth. Smartphones equipped with the Dimensity 9300 and Snapdragon 8 Gen 3 are set to be released gradually by the end of this year.　　Targeting the AI personal computer (PC) market, Intel is set to launch the Meteor Lake processor on December 14. Two major computer brands, Acer and ASUS, are both customers for Intel’s AI PC.　　High-speed transmission interface chip manufacturer Parade and network communication chip manufacturer Realtek are optimistic. The integration of AI features into personal computers and laptops is expected to stimulate demand for upgrades, leading to a potential increase in PC shipments next year.　　In TrendForces’ report on November 8th, it has indicated that the emerging market for AI PCs does not have a clear definition at present, but due to the high costs of upgrading both software and hardware associated with AI PCs, early development will be focused on high-end business users and content creators.　　For consumers, current PCs offer a range of cloud AI applications sufficient for daily life and entertainment needs. However, without the emergence of a groundbreaking AI application in the short term to significantly enhance the AI experience, it will be challenging to rapidly boost the adoption of consumer AI PCs.　　For the average consumer, with disposable income becoming increasingly tight, the prospect of purchasing an expensive, non-essential computer is likely wishful thinking on the part of suppliers. Nevertheless, looking to the long term, the potential development of more diverse AI tools—along with a price reduction—may still lead to a higher adoption rate of consumer AI PCs.　　Read more　　Key Development Period for AI PCs in 2024; Global Notebook Market Set to Rebound to Healthy Supply-Demand Cycle with an Estimated Growth Rate of 3.2%, Says TrendForce。

Key word：

AI

Release time：2023-11-21 10:41 reading：501 Continue reading>>

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AMD Discusses Future of High-performance and Adaptive Computing at CES 2023

　　AMD Chair and CEO Dr. Lisa Su detailed the significant role high-performance and adaptive computing plays in creating solutions to the world’s most important challenges during her live keynote at CES 2023.　　“It is an honor to kick off CES 2023 and highlight all the ways AMD is pushing the envelope in high-performance and adaptive computing to help solve the world’s most important challenges,” said Dr. Su. “Together with our partners, we highlighted how AMD technology is advancing what is possible in AI, hybrid work, gaming, healthcare, aerospace and sustainable computing. We also launched multiple new mobile, gaming and AI chips that will make 2023 an exciting year for AMD and the industry.”　　AMD Product Innovation at CES 2023　　AMD announced new mobile and desktop processors to serve every type of user, from casual gamers and content creators to professionals and hybrid workers, along with new graphics solutions to bring the power of high-performance gaming to mobile.　　The AMD Ryzen 7000X3D Series processors with AMD 3D V-Cache technology, the fastest gaming processors in the world2.　　AMD Radeon RX 7000 Series Graphics for Laptops based on the AMD RDNA 3 architecture offering exceptional energy efficiency and performance to power 1080p gaming at ultra settings and advanced content creation applications on next-generation premium laptops.　　Dr. Su also shared the company’s latest advances to enable pervasive AI, including previewing new products to broaden its AI product portfolio from edge to cloud.　　AMD adaptable computing and AI technology powers the world’s most important medical solutions, enabling faster diagnoses and drug discoveries and better patient care. At CES, AMD announced the AMD Vitis Medical Imaging libraries to bring premium medical imaging products to market faster by reducing development times. These software libraries accelerate premium medical imaging on AMD Versal SoC devices with AI Engines to deliver healthcare providers and their patients high-quality, low-latency imaging.　　Finally, AMD adaptive computing solutions help satellites and spacecraft compute data and leverage pervasive AI to derive insights. During the keynote, Dr. Su shared how AMD FPGAs and adaptive SoCs are helping to shape the future of space exploration, powering recent space missions from Mars Curiosity and Perseverance to the recently launched Artemis moon mission.

Key word：

AMD

Release time：2023-01-11 13:50 reading：3191 Continue reading>>

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Imec, CEA-Leti Form AI and Quantum Computing Hub

Two of Europe’s key electronics and nanotechnologies research institutes — imec in Belgium and CEA-Leti in France — will collaborate to develop a European hub for artificial intelligence and quantum computing.As security and privacy issues rise up the agenda in almost every organization, the race is on to process more at the edge and put more intelligence at endpoints. For electronics systems design, most of the major chip companies now offer or are developing deep learning and edge AI devices or intellectual property. The edge AI devices are often complete computer sub-systems displaying intelligent behavior locally on the hardware devices (chips), analyzing their environment and taking required actions to achieve specific goals.Edge AI is considered now to hold the promise of solving many societal challenges — from treating diseases that cannot yet be cured today, to minimizing the environmental impact of farming. Decentralization from the cloud to the edge is a key challenge of AI technologies applied to large heterogeneous systems. This requires innovation in the components industry with powerful, energy-guzzling processors.This is where imec and CEA-Leti hope to develop a European center of excellence. The two organizations signed a memorandum of understanding during the state visit of French president Emmanuel Macron to Belgium, laying the foundation for a strategic partnership in AI and quantum computing, two key strategic value chains for European industry, to strengthen European strategic and economic sovereignty.The joint efforts of imec and CEA-Leti underline Europe’s ambition to take a leading role in the development of these technologies. The research centers’ increased collaboration will focus on developing, testing and experimenting neuromorphic and quantum computing — and should result in the delivery of a digital hardware computing toolbox that can be used by European industry partners to innovate in a wide variety of application domains — from personalized healthcare and smart mobility to the new manufacturing industry and smart energy sectors."The ability to develop technologies such as AI and quantum computing — and put them into industrial use across a wide spectrum of applications — is one of Europe’s major challenges," said Luc Van den hove, president and CEO of imec, in a press statement. "Both quantum and neuromorphic computing (to enable artificial intelligence) are very promising areas of innovation, as they hold a huge industrialization potential.” Van den hove said a stronger collaboration in these domains between imec and CEA-Leti would help to speed up the technologies’ development time, providing them with the critical mass needed to create faster impact.Emmanuel Sabonnadière, CEA-Leti CEO, said the collaboration with imec as well as previous innovation-collaboration agreements with Germany's the Fraunhofer Group for Microelectronics "will focus all three institutes to the task of keeping Europe at the forefront of new digital hardware for AI, HPC and cyber-security applications.”Imec and CEA-Leti are inviting partners from industry as well as academia to join them and benefit from access to the research centers’ technology — enabling a much higher degree of device complexity, reproducibility and material perfection while sharing the costs of precompetitive research.

Key word：

AI

Release time：2018-11-22 00:00 reading：1263 Continue reading>>

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Imec and CEA-Leti join forces on Artificial Intelligence and Quantum Computing

The Belgian research centre imec and the French research institute CEA-Leti, two leading research and innovation hubs in nanotechnologies for industry, have signed a memorandum of understanding (MoU) that lays the foundation of a strategic partnership in the domains of Artificial Intelligence and quantum computing.The joint efforts of imec and CEA-LETI underline Europe’s ambition to take a leading role in the development of these technologies and this increased collaboration will focus on developing, testing and experimenting neuromorphic and quantum computing – and should result in the delivery of a digital hardware computing toolbox that can be used by European industry partners to innovate in a wide variety of application domains – from personalised healthcare and smart mobility to the new manufacturing industry and smart energy sectors.Edge Artificial Intelligence (eAI) commonly refers to computer systems that display intelligent behavior locally on the hardware devices (e.g chips). They analyse their environment and take the required actions to achieve specific goals.Edge AI is poised to become a key driver of economic development. And, even more importantly perhaps, it holds the promise of solving many societal challenges – from treating diseases that cannot yet be cured today, to minimising the environmental impact of farming.Decentralisation from the cloud to the edge is a key challenge of AI technologies applied to large heterogeneous systems. This requires innovation in the components industry with powerful, energy-guzzling processors.“The ability to develop technologies such as AI and quantum computing – and put them into industrial use across a wide spectrum of applications – is one of Europe’s major challenges. Both quantum and neuromorphic computing (to enable artificial intelligence) are very promising areas of innovation, as they hold a huge industrialisation potential,” said Luc Van den hove, president and CEO of imec.“A stronger collaboration in these domains between imec and CEA-Leti, two of Europe’s leading research centers, will undoubtedly help to speed up the technologies’ development time: it will provide us with the critical mass that is required to create more – and faster – impact, and will result in plenty of new business opportunities for our European industry partners.”“Two European microelectronics pioneers today are joining forces to raise the game in both high-performance computing and trusted AI at the edge, and ultimately to fuel European industry success through innovations in aeronautics, defence, automobiles, Industry 4.0 and health care,” said Emmanuel Sabonnadière, Leti CEO. “This collaboration with imec following earlier innovation-collaboration agreements with the Fraunhofer Group for Microelectronics of the Fraunhofer-Gesellschaft, the largest organization for applied research, will focus all three institutes to the task of keeping Europe at the forefront of new digital hardware for AI, HPC and Cyber-security applications.”Imec and CEA-Leti are inviting partners from industry as well as academia to join them and benefit from access to the research centers’ state-of-the-art technology with proven reproducibility – enabling a much higher degree of device complexity, reproducibility and material perfection while sharing the costs of precompetitive research.

Key word：

AI

Release time：2018-11-21 00:00 reading：1092 Continue reading>>

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Apple announces new iPad Pro and Mac computers at its Brooklyn launch event

Apple unveiled its latest iPad Pro models and Mac computers at an event in Brooklyn on Tuesday, offering long-awaited updates to some of its most popular devices.The new iPad Pros eliminate the home button and incorporate Apple's facial recognition technology, Face ID, that was introduced with the company's iPhone X product line last year.The tablets feature the same edge-to-edge LCD display that Apple introduced with the recently released iPhone XR, and they come with 11- and 12.9-inch displays. The Pro is thinner than ever and comes with sharper edges.The iPads run on A12X bionic chips, a notch more powerful than Apple's high-end iPhone XS and XS Max smartphones. They ship with up to 1 terabyte of storage, and trade out Apple's typical Lightning port for a USB-C port, similar to high-end computers. The USB-C port will also let users connect accessories like digital cameras and high-resolution desktop displays to the iPad Pro. It does not have a traditional headphone jack, which means you will need an adapter to plug in your headphones.The new iPad Pro starts at $799 for the 11-inch model and $999 for the 12.9-inch model. Both models are available to order Tuesday and will arrive on Nov. 7.Apple updated its high-tech stylus, the Apple Pencil, as well. It now magnetically attaches to the tablet to charge wirelessly. It also has touch gestures for switching between digital drawing tools on the iPad.MacBook AirThe new MacBook Air comes with a 13.3-inch, edge-to-edge retina display, as well as Touch ID that allows users to unlock the device with the scan of a fingerprint. The sensor sits in the keyboard and enables touch-based Apple Pay.Apple revamped the keyboard and track pad, too, and upgraded the microphones and speakers for better audio. The new MacBook Air offers up to 16GB of storage — double the memory capacity of its predecessor.Apple said it has made the computer lighter and reduced its overall volume by 17 percent. Every new MacBook Air is made entirely from recycled aluminum, the company said.The new MacBook Air starts at $1,199, about $100 cheaper than the baseline MacBook computer, but more expensive than the last generation of MacBook Air, which started at $999. It's available to order Tuesday, and will be available for pickup Nov. 7.Apple shows off new MacBook Air in Brooklyn.Mac miniApple also introduced a new Mac mini Tuesday, in the first update to the smaller Mac model in four years.The Mac mini is a desktop computer that connects to an external monitor. It comes with up to 64GB of memory and works five times faster than its predecessor, Apple said. Like the new Air, it's made entirely of recycled aluminum.It starts at $799, and it too is available to order Tuesday. It will be available for pickup Nov. 7.Finally on Tuesday, Apple announced its latest operating system, iOS 12.1 is available to install for iPhone and iPad users.

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Apple

Release time：2018-10-31 00:00 reading：1156 Continue reading>>

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TSMC says computer virus will slow shipments and cause additional costs

TSMC anticipates that a recent computer virus outbreak, which occurred due to misoperation during the software installation process for a new tool and affected a number of computer systems and fab tools in Taiwan, will cause shipment delays and additional costs. The degree of infection varied by fab, according to TSMC, who said it has since contained the problem and found a solution. About 80% of the company’s impacted tools have been recovered, and the company expects full recovery on August 6.In a statement, TSMC said: “We estimate the impact to third quarter revenue to be about three per cent, and impact to gross margin to be about one percentage point. The company is confident shipments delayed in third quarter will be recovered in the fourth quarter 2018, and maintains its forecast of high single-digit revenue growth for 2018 in U.S. dollars given on July 19, 2018.”TSMC has said data integrity and confidential information was not compromised during the breach and it has now taken actions to close this security gap and further strengthen security measures.

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TSMC

Release time：2018-08-08 00:00 reading：1266 Continue reading>>

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Edge Computing Will Drive the Growth of Micro Server, Boosting the Demand for Server DRAM

DRAMeXchange, a division of TrendForce, estimates that x86-based solutions will continue to be the market mainstream in 2018, with a global shipment share of 97%. Intel and AMD will continue to lead the development of server. Particularly, in the sector of Internet Datacenter, solutions based on the x86 architecture will still dominate the market due to its wide product range.According to Mark Liu, senior analyst at DRAMeXchange, enterprise servers contribute to around 60% of the global server shipments, while hyperscale server applications account for around 30%. The demand for micro servers used in edge computing is projected to see significant growth in the next 3 to 5 years due to the construction of data center and the implementation of 5G after 2020. This trend is also expected to drive the demand for related components and DRAM products considerably.The average content per box continues to see 20% annual growth in 2019 as Intel and AMD promote new platformsCurrently, x86-based solutions are still the market mainstream, while the penetration rate of Intel’s Purley platform has reached about 50%. Meanwhile, AMD has been migrating to products based on 14nm process. Previous product lines will be phased out as the wafer starts of 14nm process gradually increase. As for ARMv8 and RISC architecture, products are built to order at this stage with small production volume, mainly for the data center market. These two architectures are not able to compete with x86 servers until 2020, but may be adopted in more applications after that as the penetration rate of micro servers increases.In terms of the product roadmap, Intel's Cascade Lake will still be based on the third-generation 14nm process, but would not become the mainstream until the second half of 2019. AMD's new solution will migrate to the 7nm process, with its EPYC Series becoming the main product line this year. The AMD Rome platform server processor will also have a chance to come onto the market in the second half of next year.DRAMeXchange notes that, the penetration of new platforms may drive the average content per box. The average density of DRAM in servers will continue to see 20% annual growth in 2019.

Key word：

DRAM

Release time：2018-07-26 00:00 reading：1087 Continue reading>>

model	brand	Quote
MC33074DR2G	onsemi
RB751G-40T2R	ROHM Semiconductor
BD71847AMWV-E2	ROHM Semiconductor
TL431ACLPR	Texas Instruments
CDZVT2R20B	ROHM Semiconductor

model	brand	To snap up
BU33JA2MNVX-CTL	ROHM Semiconductor
BP3621	ROHM Semiconductor
IPZ40N04S5L4R8ATMA1	Infineon Technologies
TPS63050YFFR	Texas Instruments
ESR03EZPJ151	ROHM Semiconductor
STM32F429IGT6	STMicroelectronics

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