ROHM Releases a New Compact PFC + Flyback Control Reference <span style='color:red'>Design</span> for Power
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ROHM Releases a New Compact PFC + Flyback Control Reference Design for Power

　　ROHM’s new reference design (REF67004) is capable of controlling two commonly used power converter types in consumer and industrial power supply applications by using a single MCU :critical conduction mode PFC (Power Factor Correction) and quasi-resonant flyback. This is part of ROHM’s LogiCoA™ Power Supply Solution, that leverages analog-digital hybrid control technology. It combines an analog-controlled power stage circuit featuring ROHM’s superior silicon MOSFETs and gate driver ICs with a digitally managed power supply circuit built around the low-power LogiCoA™ MCU.　　Analog-controlled power supplies are widely used in small- to medium-power industrial applications, such as industrial robots and semiconductor manufacturing equipment. However, growing demands for higher reliability and more precise control have made it increasingly difficult for analog-only configurations to meet market expectations. On the other hand, while fully digital power supplies offer fine control and greater flexibility, their adoption in the small to medium power range has been limited due to the high cost and power consumption of digital controllers.　　To overcome these challenges, ROHM has developed the LogiCoA™ Power Supply Solution, a hybrid approach that integrates the advantages of both analog and digital control. Combined with ROHM’s high-performance, the low power LogiCoA™ MCUs enable easy control of various power topologies. As the first step, ROHM has released the REF66009 evaluation reference design, allowing users to explore the LogiCoA™ Power Supply Solution using a non-isolated buck converter circuit. This was followed by the launch of the REF67004, a reference design incorporating both PFC and flyback converters – topologies commonly used in consumer and industrial equipment.　　The newly introduced REF67004 is a reference design that boosts AC input using a Critical Conduction Mode PFC converter, followed by a Quasi-Resonant Flyback converter to deliver a regulated DC 24V output. Features include a calibration function that compensates for variations in the external component characteristics, enabling the LogiCoA™ MCU to perform high-precision voltage configuration and overcurrent protection. This allows for reduced design margins, making it possible to select more compact (low power) power devices and inductors, ultimately helping to minimize PCB area and lower overall system costs.　　The REF67004 also includes a logging function that allows the LogiCoA™ MCU to store operational data, such as input/output voltage, current, temperature, pre-shutdown system status, and cumulative operating time, in its built-in non-volatile memory. This data can be analyzed to easily identify the root cause of power supply failures. On top, various power control parameters and operational history can be easily configured and retrieved from a PC via UART (with a signal conversion device) using sample programs, including the RMOS (Real-time Micro Operating System) power control OS, available on ROHM's website. Practical evaluation is possible through the use of the reference design board LogiCoA003-EVK-001. Going forward, ROHM will continue to provide a variety of power supply reference designs to support and accelerate customer power supply development.　　LogiCoA™ Brand　　LogiCoA™ is a brand that embodies a design philosophy of fusing digital elements to maximize the performance of analog circuits. By combining the advantages of analog circuitry with those of digital control, it is possible to maximize the potential of circuit topologies, contributing to more efficient power utilization. As LogiCoA™ is a design concept that can be applied not only to the power supply field, but also to power solutions as a whole, ROHM is considering its application in future products and solutions.　　・LogiCoA™ is a trademark or registered trademark of ROHM Co., Ltd.　　LogiCoA™ Power Supply Solution Page　　The basic architecture and key features of the LogiCoA™ Power Supply Solution are available on ROHM’s website.　　https://www.rohm.com/support/logicoa　　LogiCoA™ Power Supply Solution Reference Design Lineup　　In addition to sample software, a variety of tools necessary for evaluation, such as circuit diagrams, PCB layouts, parts lists, and support documents are available on ROHM’s website, while actual device evaluation is also possible using the reference design board. Going forward, ROHM will continue to expand its lineup of reference designs to support a wide range of power topologies.　　● Reference Design Part No.　　• PFC + Flyback Converter: REF67004　　• Buck Converter: REF66009　　LogiCoA™ MCU  Lineup　　Key features include a built-in 3ch analog comparator that can be synchronized with timers, along with a D/A converter that enables digital control of various parameters to support different power supply topologies.　　LogiCoA™ MCU Development Support System　　Built on a ROHM’s proprietary 16bit RISC CPU core, LogiCoA™ MCUs are fully supported by a dedicated integrated development environment and emulator tools.　　For more information on the LogiCoA™ development support system and a product overviews, please visit ROHM’s LogiCoA™ MCU development system support page (link below).　　https://www.rohm.com/lapis-tech/product/micon/logicoa-software　　Online Sales Information　　Reference design boards, reference board and LogiCoA™ MCUs are available for purchase through online distributors such as AMEYA360.　　• Reference Design Board P/N:　　LogiCoA003-EVK-001*, LogiCoA001-EVK-001　　• Reference Board P/N:　　RB-D62Q2035TD20, RB-D62Q2045GD24　　• LogiCoA™ MCU P/N:　　ML62Q2035-NNNTDZWATZ, ML62Q2045-NNNGDZW5BY　　Pricing : $677/unit (samples for LogiCoA003- EVK-001, excluding tax)　　Application Examples　　• Industrial robots　• Semiconductor manufacturing equipment　• Gaming devices　　The LogiCoA™ Power Supply Solution is also suitable for integration into general industrial equipment and consumer devices with power requirements ranging from approximately 50W to 1kW.　　Terminology　　Critical Conduction Mode PFC (Power Factor Correction) Converter　　A configuration used in AC-DC converters within switching power supplies, Critical Conduction Mode PFC offers a high-power factor (indicating efficient utilization of supplied power) while generating less noise compared to Continuous Conduction Mode PFC. A power factor of ‘1’ signifies that all supplied power is being effectively used without waste.　　Quasi-Resonant Flyback Converter　　A DC-DC converter topology commonly used in isolated power supply designs, these converters leverage a quasi-resonant control technique to minimize switching losses and noise. Ideal for applications up to 100W, it offers advantages in terms of reduced component count and cost. While other forward-type topologies exist, advancements in the components used in these designs have led to smaller, more efficient isolated power supply solutions.　　Analog Control Power Supply　　A power supply configuration built with analog components, commonly used for applications up to 1kW due to its simplicity and low power consumption. However, implementing advanced features such as customizable parameter settings and data logging is challenging with analog control alone, often requiring fully digital solutions that tend to increase both cost and power consumption.　　Digital Control Power Supply　　A power supply is managed using digital technology. High-speed CPUs and DSPs are used to precisely monitor and control key parameters such as voltage and current, improving power supply efficiency and reliability. Digital control also enables advanced functions, such as operation log data acquisition, that are difficult to implement with analog control alone. However, CPUs and DSPs tend to be expensive and consume significant power, posing challenges in terms of cost effectiveness and energy efficiency.　　• CPU (Central Processing Unit): The core processor responsible for executing programs and performing data processing.　　• DSP (Digital Signal Processor): A processor that converts analog signals into digital form and performs operations such as filtering and amplification.　　Topology　　Refers to the circuit configuration. Power topology defines how electrical energy is transformed and managed within a circuit. The specific configuration depends on factors such as input and output voltage levels, power requirements, and whether electrical isolation is necessary.
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Release time：2025-08-25 14:24 reading：272 Continue reading>>
NOVOSENSE Launches High-Performance 2-Wire Hall Switch MT72xx Series: Compact <span style='color:red'>Design</span> with System-Level Reliability
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NOVOSENSE Launches High-Performance 2-Wire Hall Switch MT72xx Series: Compact Design with System-Level Reliability

　　NOVOSENSE Microelectronics ("NOVOSENSE") has launched the MT72xx series, 2-wire current output Hall switches. The switches feature superior EMC performance, multiple sensing polarity options, and highly integrated design, achieving ASIL-A functional safety certification and full compliance with AEC-Q100 Grade 0 standards. Designed for long-wiring scenarios in vehicle body electronics and domain controller systems, the MT72xx series provides optimized solutions for seatbelt buckle detection, window lift motor control, and other automotive applications.　　Addressing Long Wiring Harness Challenges in Automotive　　With rapid advancement of automotive intelligence and electrification, increasingly complex vehicle body functions and highly integrated domain controllers have significantly extended wiring harnesses between sensors and control units. This introduces critical challenges including elevated signal interference risks, increased costs, and compromised system reliability.　　NOVOSENSE's MT72xx series delivers robust signal integrity while effectively reducing wiring complexity and lowering harness costs. Designed for long-wiring scenarios such as door lock detection, anti-pinch window control, power tailgate position sensing, seat adjustment, and seatbelt buckle detection, these devices provide stable current output with superior anti-interference capabilities, maintaining signal reliability even in extended wiring conditions.　　High Integration & Robustness for Automotive-Grade Standards　　Engineered for harsh automotive environments with strong EMI interference, the MT72xx series integrates a 100nF(only TO92S package)capacitor to enhance EMC/ESD performance, simplify peripheral configuration, and optimize BOM space, enabling flexible system architecture design. Compliant with AEC-Q100 Grade 0, the devices ensure long-term stability under extreme high-temperature conditions.　　Featuring multiple sensing polarity options (unipolar, omnipolar, latch) and adjustable sensitivity thresholds, the MT72xx series offers design flexibility to accommodate diverse magnet solutions and vehicle architectures, streamlining development and debugging processes.　　Comprehensive Resources to Accelerate Time-to-Market　　To expedite customer development, NOVOSENSEN provides dedicated MT72xx demo boards and magnetic simulation services. These resources enable rapid device validation, magnet solution matching, and cost-effective debugging, significantly shortening product deployment cycles.
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Release time：2025-07-14 14:25 reading：548 Continue reading>>
ROHM Develops New High Power Density SiC Power Modules Compact high heat dissipation design sets a new standard for OBCs
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ROHM Develops New High Power Density SiC Power Modules Compact high heat dissipation design sets a new standard for OBCs

　　ROHM has developed the new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for PFC and LLC converters in onboard chargers (OBC) for xEVs (electric vehicles). The lineup includes six models rated at 750V (BSTxxx1P4K01) and seven products rated at 1200V (BSTxxx2P4K01). All basic circuits required for power conversion in various high-power applications are integrated into a compact module package, reducing the design workload for manufacturers and enabling the miniaturization of power conversion circuits in OBCs and other applications.　　In recent years, the rapid electrification of cars is driving efforts to achieve a decarbonized society. Electric vehicles are seeing higher battery voltages to extend the cruising range and improve charging speed, creating a demand for higher output from OBCs and DC-DC converters. At the same time, there is an increasing need in the market for greater miniaturization and lighter weight for these applications, requiring technological breakthroughs to improve power density - a key factor - while enhancing heat dissipation characteristics that could otherwise hinder progress. ROHM’s HSDIP20 package addresses these technical challenges that were previously becoming difficult to overcome with discrete configurations, contributing to both higher output and the downsizing of electric powertrains.　　The HSDIP20 features an insulating substrate with excellent heat dissipation properties that suppresses the chip temperature rise even during high power operation. When comparing a typical OBC PFC circuit utilizing six discrete SiC MOSFETs with top-side heat dissipation to ROHM’s 6-in-1 module under the same conditions, the HSDIP20 package was verified to be approx. 38°C cooler (at 25W operation). This high heat dissipation performance supports high currents even in a compact package, achieving industry-leading power density more than three times higher than top-side cooled discretes and over 1.4 times that of similar DIP type modules. As a result, in the PFC circuit mentioned above, the HSDIP20 can reduce mounting area by approx. 52% compared to top-side cooled discrete configurations, greatly contributing to the miniaturization of power conversion circuits in applications such as OBCs.　　Going forward, ROHM will continue to advance the development of SiC modules that balance miniaturization with high efficiency while also focusing on the development of automotive SiC IPMs that provide higher reliability in a smaller form factor.　　Product Lineup　　*1: Tc=25°C VGS=18V *2: Combines chips with different ON resistances　　*3: Q1, Q4 pins *4: Q2, Q3, Q5, Q6 pins　　Application Examples　　Power conversion circuits like PFC and LLC converters are commonly used in the primary side circuits of industrial equipment, allowing the HSDIP20 to also contribute to the miniaturization of applications in both the industrial and consumer electronics fields.　　◇ Automotive systems　　Onboard chargers, electric compressors and more.　　◇ Industrial equipment　　EV charging stations, V2X systems, AC servos, server power supplies, PV inverters, power conditioners, etc.　　Sales Information　　Pricing: $100/unit (samples, excluding tax)　　Availability: OEM quantities (April 2025)　　Supporting Information　　ROHM is committed to providing application-level support, including the use of in-house motor testing equipment. A variety of supporting materials are also offered such as simulations and thermal designs that enable quick evaluation and adoption of HSDIP20 products. Two evaluation kits are available as well, one for double-pulse testing and the other for 3-phase full bridge applications, enabling evaluation under close to actual circuit conditions.　　For more information, please contact AMEYA360 or visit the contact page on ROHM’s website.　　EcoSiC™ Brand　　EcoSiC™ is a brand of devices that utilize silicon carbide, which is attracting attention in the power device field for performance that surpasses silicon. ROHM independently develops technologies essential for the advancement of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, we have established an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.　　・EcoSIC™ is a trademark or registered trademark of ROHM Co., Ltd.　　Terminology　　Power Factor Correction (PFC)　　A circuit that enhances the power factor by shaping the waveform of input power in the power supply circuit. By using a PFC circuit, the input power is made closer to a sine wave (power factor = 1), improving power conversion efficiency. While PFC circuits typically rely on diode rectification, OBCs often employ active bridge rectification using MOSFETs or bridgeless PFC. This approach is favored because MOSFETs offer lower switching losses, and especially in high power PFCs, using SiC MOSFETs reduces heat generation and power losses.　　LLC Converter　　A type of resonant DC-DC converter known for its high efficiency with low noise power conversion. The name LLC comes from its basic configuration, which combines two inductors (L) and a capacitor (C) in the circuit. By forming a resonant circuit, switching losses are significantly reduced, making it ideal for applications requiring high efficiency, such as OBCs, power supplies for industrial equipment, and server power supplies.
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Release time：2025-04-24 17:23 reading：436 Continue reading>>
NOVOSENSE Launches NSIP3266 Full-Bridge Transformer Driver with Integrated Crystal Oscillator, Simplifying Isolated Driver Power Supply <span style='color:red'>Design</span>
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NOVOSENSE Launches NSIP3266 Full-Bridge Transformer Driver with Integrated Crystal Oscillator, Simplifying Isolated Driver Power Supply Design

　　NOVOSENSE today announced the launch of the NSIP3266 full-bridge transformer driver with integrated crystal oscillator, multiple protection functions and soft start support, which can be widely used in isolated driver power supply circuits in automotive on-board chargers (OBCs), traction inverters and charging piles, photovoltaic power generation and energy storage, server power supply and other systems. NSIP3266 supports a full-bridge topology with a wide range of inputs, and with clever pin and function design, it greatly simplifies the design of isolated driver’s power supply circuits, facilitating system manufacturers to optimize system circuits and shorten product time to market.　　Currently, isolated driver's power supply in high-voltage systems is available in three architectural forms: centralized, fully distributed, and semi-distributed. Centralized architecture has only one stage of power supply, and the auxiliary power input voltage has a wide input range, requiring closed-loop operation. At the same time, the transformer design is complicated, and especially when a single low-cost isolated power supply is used, there are problems of multi-output load regulation and long wiring, which increase the difficulty of system design and debugging.　　Fully distributed architecture uses independent isolated power modules to supply power to isolated drivers. The advantage is that 1-to-1 power supply and targeted protection can be achieved for isolated drivers, but a corresponding number of isolated power modules need to be configured, and the system cost is high.　　Semi-distributed architecture adopts a balanced strategy. Through a two-stage auxiliary power architecture, the first stage uses devices with a wide input voltage range to generate regulated rails, and the second stage can be a compact open-loop form using other devices to provide isolated power supply for isolated drives. Semi-distributed architecture is gaining popularity among engineers because of its simplicity in design and balance of system cost, performance, and protection requirements.　　Simplified circuit design with full-bridge topology　　NOVOSENSE's NSIP3266 full-bridge transformer driver is designed for semi-distributed architecture with isolated driver power supply. Common topology options for semi-distributed architecture include push-pull, LLC, and full-bridge. NSIP3266 adopts full-bridge topology. Compared with other solutions, the principle of full-bridge topology is simple, the transformer structure does not require a center tap, the working principle does not involve the design and selection of external L and C, and the peripheral BOM is often minimal. At the same time, the full-bridge topology is more tolerant to transformer design, including leakage inductance and parasitics, which saves engineers' efforts in system design and debugging.　　Ingenious design releases MCU resources　　It is worth mentioning that NSIP3266, through the internal integrated crystal oscillator circuit and RT pin design, allows engineers to complete the switching frequency configuration with only external resistors, achieving decoupling of MCU control and more flexible layout. At the same time, it can still provide safe power supply when the MCU fails, promoting higher system safety. In addition, the built-in soft-start function of NSIP3266 also eliminates the need for MCU control. While not requiring MCU domain routing, it saves secondary-side current limiting resistors, greatly simplifying board design and improving architectural flexibility.　　Wide voltage input and comprehensive protection　　NSIP3266 supports a wide operating voltage range of 6.5V~26V. No additional TVS protection tube is required in the system circuit, allowing engineers to choose the pre-stage power supply more flexibly. In addition, NSIP3266 provides multiple protection functions, including undervoltage protection, overcurrent protection, over-temperature protection, etc. The comprehensive protection functions enable engineers to focus on the optimization and innovation of the core system functions, and to design the system quickly and efficiently to meet the reliability requirements.　　Packaging and selections　　NSIP3266 is available in EP-MSOP8 package (3.0 x 3.0mm x 0.65mm, with thermal pad). The industrial version, NSIP3266-D, and the automotive version, NSIP3266-Q1, which meets the requirements of AEC-Q100, will be mass-produced in the first half of 2025. Please contact NOVOSENSE's sales team (sales@novosns.com) for product details or to request samples.　　Rich isolation products meet diverse needs　　With its expertise and leadership in isolation technology, NOVOSENSE provides a series of isolation and "isolation+" products covering digital isolators, isolated sampling, isolated interfaces, isolated power supply, and isolated drivers. NSIP3266 is a new addition to NOVOSENSE's isolated power supply family. NOVOSENSE also offers a selection of other cost-effective and high-performance, high-integration options, including: the NSIP605x series of push-pull transformer drivers; the NSIP88/89xx and NIRSP31x series with integrated transformers and multi-channel digital isolators; the NSIP83086 isolated RS485 transceiver and the NSIP1042 isolated CAN transceiver with integrated transformers and isolated interfaces. NOVOSENSE's comprehensive "isolation+" product portfolio can meet the diverse system design needs of various types of customers and provide one-stop chip solutions for them.
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Release time：2025-02-19 09:59 reading：1162 Continue reading>>
ROHM’s PMICs for SoCs have been Adopted in Reference <span style='color:red'>Design</span>s for Telechips’ Next-Generation Cockpits
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ROHM’s PMICs for SoCs have been Adopted in Reference Designs for Telechips’ Next-Generation Cockpits

　　ROHM has announced the adoption of its PMICs in power reference designs focused on the next-generation cockpit SoCs ‘Dolphin3’ (REF67003) and ‘Dolphin5’ (REF67005) by Telechips, a major fabless semiconductor manufacturer for automotive applications headquartered in Pangyo, South Korea. Intended for use inside the cockpits of European automakers, these designs are scheduled for mass production in 2025.　　ROHM and Telechips have been engaged in technical exchanges since 2021, fostering a close collaborative relationship from the early stages of SoC chip design. As a first step in achieving this goal, ROHM’s power supply solutions have been integrated into Telechips’ power supply reference designs. These solutions support diverse model development by combining sub-PMICs and DrMOS with the main PMIC for SoCs.　　For infotainment applications, the Dolphin3 application processor (AP) power reference design includes the BD96801Qxx-C main PMIC for SoCs. Similarly, the Dolphin5 AP power reference design developed for next-generation digital cockpits combines the BD96805Qxx-C and BD96811Fxx-C main PMICs for SoC with the BD96806Qxx-C sub-PMIC for SoC, improving overall system efficiency and reliability.　　Modern cockpits are equipped with multiple displays, such as instrument clusters and infotainment systems, with each automotive application becoming increasingly multifunctional. As the processing power required for automotive SoCs increases, power ICs like PMICs must be able to support high currents while maintaining high efficiency. At the same time, manufacturers require flexible solutions that can accommodate different vehicle types and model variations with minimal circuit modifications. ROHM SoC PMICs address these challenges with high efficiency operation and internal memory (One Time Programmable ROM) that allows for custom output voltage settings and sequence control, enabling compatibility with large currents when paired with a sub-PMIC or DrMOS.　　Moonsoo Kim,　　Senior Vice President and Head of System Semiconductor R&D Center, Telechips Inc.“Telechips offers reference designs and core technologies centered around automotive SoCs for next-generation ADAS and cockpit applications. We are pleased to have developed a power reference design that supports the advanced features and larger displays found in next-generation cockpits by utilizing power solutions from ROHM, a global semiconductor manufacturer. Leveraging ROHM’s power supply solutions allows these reference designs to achieve advanced functionality while maintaining low power consumption. ROHM power solutions are highly scalable, so we look forward to future model expansions and continued collaboration.”　　Sumihiro Takashima,　　Corporate Officer and Director of the LSI Business Unit, ROHM Co., Ltd.“We are pleased that our power reference designs have been adopted by Telechips, a company with a strong track record in automotive SoCs. As ADAS continues to evolve and cockpits become more multifunctional, power supply ICs must handle larger currents while minimizing current consumption. ROHM SoC PMICs meet the high current demands of next-generation cockpits by adding a DrMOS or sub-PMIC in the stage after the main PMIC. This setup achieves high efficiency operation that contributes to lower power consumption. Going forward, ROHM will continue our partnership with Telechips to deepen our understanding of next-generation cockpits and ADAS, driving further evolution in the automotive sector through rapid product development.”　　・ Telechips SoC [Dolphin Series]　　The Dolphin series consists of automotive SoCs tailored to In-Vehicle Infotainment (IVI), Advanced Driver Assistance Systems (ADAS), and Autonomous Driving (AD) applications. Dolphin3 supports up to four displays and eight in-vehicle cameras, while Dolphin5 enables up to five displays and eight cameras, making highly suited as SoCs for increasingly multifunctional next-generation cockpits. Telechips is focused on expanding the Dolphin series of APs (Application Processors) for car infotainment, with models like Dolphin+, Dolphin3, and Dolphin5, by leveraging its globally recognized technical expertise cultivated over many years.　　・ ROHM 's Reference Design Page　　Details of ROHM’s reference designs and information on equipped products are available on ROHM’s website, along with reference boards. Please contact a sales representative or visit ROHM’s website for more information.　　https://www.rohm.com/contactus　　■ Power Supply Reference Design [REF67003] (equipped with Dolphin3)　　Reference Board No. REF67003-EVK-001　　https://www.rohm.com/reference-designs/ref67003　　■ Power Supply Reference Design [REF67005] (equipped with Dolphin5)　　Reference Board No. REF67005-EVK-001　　https://www.rohm.com/reference-designs/ref67005　　About Telechips Inc.Telechips is a fabless company specialized in designing system semiconductors that serve as the “brains” of automotive electronic components. The South Korean firm offers reliable, high-performance automotive SoCs. In response to the industry’s transition toward SDVs (Software Defined Vehicles), Telechips is broadening its core portfolio beyond car infotainment application processors (APs) to include MCUs, ADAS, network solutions, and AI accelerators.　　As a global, comprehensive automotive semiconductor manufacturer, Telechips adheres to international standards such as ISO 26262, TISAX, and ASPICE, leveraging both hardware and software expertise for future mobility ecosystems, including not only automotive smart cockpits, but also E/E architectures. What’s more, Telechips provides optimal solutions for In-Vehicle Infotainment systems (IVI), digital clusters, and ADAS, all compliant with key automotive standards (AEC-Q100, ISO 26262). Telechips has established business relationships with major automakers both domestically and internationally, supported by a strong track record of shipments.　　One flagship product is the Dolphin5 automotive SoC that integrates an Arm®-based CPU, GPU, and NPU to meet high-performance requirements. As a fabless company, Telechips outsources the manufacturing of its SoCs to Samsung Electronics’ foundry, delivering high-quality semiconductor products to domestic and overseas manufacturers. For more information, please visit Telechips’ website:　　https://www.telechips.com/　　*Arm® is a trademark or registered trademark of Arm Limited.　　TerminologyPMIC (Power Management IC)　　An IC that contains multiple power supply systems and functions for power management and sequence control on a single chip. It is becoming more commonplace in applications with multiple power supply systems in both the automotive and consumer sectors by significantly reducing space and development load vs conventional circuit configurations using individual components (i.e. DC-DC converter ICs, LDOs, discretes).　　SoC (System-on-a-Chip)　　A type of integrated circuit that incorporates a CPU (Central Processing Unit), memory, interface, and other elements on a single substrate. Widely used in automotive, consumer, and industrial applications due to its high processing capacity, power efficiency, and space savings.　　AP (Application Processor)　　Responsible for processing applications and software in devices such as smartphones, tablets, and automotive infotainment systems. It includes components such as a CPU, GPU, and memory controller to efficiently run the Operating System (OS), process multimedia, and render graphics.　　DrMOS (Doctor MOS)　　A module that integrates a MOSFET and gate driver IC. The simple configuration is expected to reduce design person-hours along with mounting area and to achieve efficient power conversion. At the same time, the built-in gate driver ensures high reliability by stabilizing MOSFET drive.
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Release time：2024-12-20 13:56 reading：892 Continue reading>>
ROHM’s New SiC Schottky Barrier Diodes for High Voltage xEV Systems: Featuring a Unique Package <span style='color:red'>Design</span> for Improved Insulation Resistance
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ROHM’s New SiC Schottky Barrier Diodes for High Voltage xEV Systems: Featuring a Unique Package Design for Improved Insulation Resistance

　　ROHM has developed surface mount SiC Schottky barrier diodes (SBDs) that improve insulation resistance by increasing the creepage distance between terminals. The initial lineup includes eight models - SCS2xxxNHR - for automotive applications such as onboard chargers (OBCs), with plans to deploy eight models - SCS2xxxN - for industrial equipment such as FA devices and PV inverters in December 2024.　　The rapidly expanding xEV market is driving the demand for power semiconductors, among them SiC SBDs, that provide low heat generation along with high-speed switching and high-voltage capabilities in applications such as onboard chargers. Additionally, manufacturers increasingly rely on compact surface mount devices (SMDs) compatible with automated assembly equipment to boost manufacturing efficiency. Compact SMDs tend to typically feature smaller creepage distances, fact that makes high-voltage tracking prevention a critical design challenge.　　As leading SiC supplier, ROHM has been working to develop high-performance SiC SBDs that offer breakdown voltages suitable for high-voltage applications with ease of mounting. Adopting an optimized package shape, it achieves a minimum creepage distance of 5.1mm, improving insulation performance when contrasted with standard products.　　The new products utilize an original design that removes the center pin previously located at the bottom of the package, extending the creepage distance to a minimum of 5.1mm, approx. 1.3 times greater than standard products. This minimizes the possibility of tracking (creepage discharge) between terminals, eliminating the need for insulation treatment through resin potting when surface mounting the device on circuit boards in high voltage applications. Additionally, the devices can be mounted on the same land pattern as standard and conventional TO-263 package products, allowing an easy replacement on existing circuit boards.　　Two voltage ratings are offered, 650V and 1200V, supporting 400V systems commonly used in xEVs as well as higher voltage systems expected to gain wider adoption in the future. The automotive-grade SCS2xxxNHR are AEC-Q101 qualified, ensuring they meet the high reliability standards this application sector demands.　　Going forward, ROHM will continue to develop high-voltage SBDs using SiC, contributing to low energy consumption and high efficiency requirements in automotive and industrial equipment by providing optimal power devices that meet market needs.　　Application Examples◇ Automotive applications: Onboard chargers (OBCs), DC-DC converters, etc.　　◇ Industrial Equipment: AC servo motors for industrial robots, PV inverters, power conditioners, uninterruptible power supplies (UPS), and more　　Online Sales InformationAvailability: The SCS2xxxxNHR for automotive applications are available now.　　The SCS2xxxN for industrial equipment are scheduled in December 2024.　　Pricing: $10.50/unit (samples, excluding tax)　　Online Distributors: DigiKey™, Mouser™ and Farnell™　　The products will be offered at other online distributors as they become available.　　EcoSiC™ BrandEcoSiC™ is a brand of devices that leverage silicon carbide, which is attracting attention in the power device field for performance that surpasses silicon. ROHM independently develops technologies essential for the advancement of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, we have established an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.　　TerminologyCreepage Distance　　The shortest distance between two conductive elements (terminals) along the surface of the device package. In semiconductor design, insulation measures with such creepage and clearance distances must be taken to prevent electric shocks, leakage currents, and short-circuits in semiconductor products.　　Tracking (Creepage Discharge)　　A phenomenon where discharge occurs along the surface of the package (insulator) when high voltage is applied to the conductive terminals. This can create an unintended conductive path between patterns, potentially leading to dielectric breakdown of the device. Package miniaturization increases the risk of tracking by reducing creepage distance.　　Resin Potting　　The process of encapsulating the device body and the electrode connections between the device and circuit with resin, such as epoxy, to provide electrical insulation. This provides durability and weather resistance by protecting against water, dust, and other environmental conditions.　　AEC-Q101 Automotive Reliability Standard　　AEC stands for Automotive Electronics Council, a reliability standard for automotive electronic components established by major automotive manufacturers and US electronic component makers. Q101 is a standard that specifically applies to discrete semiconductor products (i.e. transistors, diodes).
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Release time：2024-11-20 14:00 reading：637 Continue reading>>
Murata：Commercialized polymer aluminum electrolytic capacitors that have achieved low ESR 4.5 mΩ with a thin design and high capacitance
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Murata：Commercialized polymer aluminum electrolytic capacitors that have achieved low ESR 4.5 mΩ with a thin design and high capacitance

　　Key features　　Achieved low ESR 4.5 mΩ with a thin design and high capacitance　　A low ESR product with high output noise level reduction effects　　Contributes to stable power supply for CPU, GPU, and FPGA of data centers and accelerators that require high currents　　Key applications: Server, accelerator, laptop PC　　Request a free sample on the “my Murata” registered members-only portal website　　Murata Manufacturing Co., Ltd. (hereinafter “Murata”) has developed the “ECASD40E477M4R5KA0” (hereinafter “this product”) polymer aluminum electrolytic smoothing capacitor that achieves low ESR (4.5 mΩ) while maintaining a thin design (2.0 mm Max) and large capacitance (470 μF) in a D case (7.3 x 4.3 mm), equivalent to conventional products*1. Mass production has already begun, and samples can also be provided.　　*1ECASD40E477M006KA0 (470uF/2.5V/6mΩ)　　In recent years, IT devices such as servers and accelerators used in data centers are being created to support larger currents. Since IC voltage fluctuation and heat generation are major issues that must be tackled to achieve stable device operation, it is necessary to both increase the capacitance of the capacitors used to suppress voltage fluctuations and to mount large, high-performance heat sinks (cooling units) on the ICs. Murata has proposed component costs reduction through problem solving using conventional low-profile and high-capacitance products as well as by reducing the number of components used.　　However, there is a growing demand for lower ESR products as a response to noise amplification due to the application of larger currents. Murata has now developed this product with a ESR value improved by 25% while maintaining the height and high-capacitance of conventional products. With this product, Murata contributes to providing stable device power supply while suppressing mounting areas and costs of electronic components.　　Specifications
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Release time：2024-06-11 15:13 reading：820 Continue reading>>
NOVOSENSE Introduces the NSIP605x Series of Cost-Effective Push-Pull Transformer Drivers to Support Customers' Diverse and Flexible <span style='color:red'>Design</span>s
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NOVOSENSE Introduces the NSIP605x Series of Cost-Effective Push-Pull Transformer Drivers to Support Customers' Diverse and Flexible Designs

　　NOVOSENSE today announced the launch of the NSIP605x series of cost-effective push-pull transformer drivers, consisting of NSIP6051 with an output power of 1W and NSIP6055 with an output power of 5W. NSIP6055 is available in two versions: NSIP6055A with a switching frequency of 160kHz, for system applications with more stringent EMI requirements; and NSIP6055B with a switching frequency of 420kHz, for system applications that require improved conversion efficiency and reduced transformer size.　　The cost-effective NSIP605x series is designed for cost-sensitive systems with no particular requirements for footprint size, and offers a higher cost effectiveness than comparable devices with internally integrated transformers while providing similar system performance. The NSIP605x series complements NOVOSENSE's existing product portfolio and supports customers' diverse system design needs with flexible, lightweight configurations in a wide range of industrial, automotive and renewable energy applications.　　Excellent EMI and ESD performance helps reduce system design time　　Thanks to NOVOSENSE's proven EMI optimization technology, the NSIP605x series achieves ultra-low noise and EMI through slew rate control of output switching voltage and spread spectrum clocking (SSC), and the peripheral circuit requires only simple configuration to meet CISPR25 Class 5 requirements. In terms of ESD performance, NSIP605x achieves ±8kV ESD (HBM) and ±2kV ESD (CDM) performance. Excellent EMI and ESD characteristics enable customers to complete overall system debugging more quickly and easily, shortening design time.　　NOVOSENSE's extensive product portfolio meets different design needs　　The NSIP605x series of push-pull transformer drivers is a new addition to the cost-effective product line introduced by NOVOSENSE. NOVOSENSE also offers a selection of other high-performance, highly-integrated products, including: the NSIP88/89xx series and the NIRSP31x series with integrated transformers and multi-channel digital isolators; the NSIP83086 series of isolated RS485 transceivers and the NSIP1042 series of isolated CAN transceivers, integrated with transformers and isolation interfaces. NOVOSENSE's comprehensive product portfolio can meet the diverse system design needs of various types of customers, providing one-stop semiconductor solutions for different customers.
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Release time：2024-05-21 17:27 reading：2029 Continue reading>>
Top 10 IC <span style='color:red'>Design</span> Houses’ Combined Revenue Grows 12% in 2023, NVIDIA Takes Lead for the First Time, Says TrendForce
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Top 10 IC Design Houses’ Combined Revenue Grows 12% in 2023, NVIDIA Takes Lead for the First Time, Says TrendForce

　　In 2023, the combined revenue of the world’s top ten IC design houses reached approximately $167.6 billion, marking a 12% annual increase. This growth was primarily driven by NVIDIA, which saw a remarkable 105% increase in revenue, significantly boosting the overall industry. While Broadcom, Will Semiconductor, and MPS experienced only marginal revenue growth, other companies faced declines due to economic downturns and inventory reductions, says TrendForce.　　Looking ahead to 2024, TrendForce predicts that with IC inventory levels returning to healthy standards and driven by the AI boom, major CSPs will continue to expand the construction of LLMs. Additionally, AI applications are expected to penetrate personal devices, potentially leading to the introduction of AI-powered smartphones and AI PCs. Consequently, the global IC design industry's revenue growth is expected to continue its upward trajectory.　　NVIDIA, Broadcom, and AMD benefit from a surge in demand for AI　　The top five IC design houses boosted their 2023 revenues to $55.268 billion—a 105% year-over-year increase—primarily driven by NVIDIA’s AI GPU H100. Currently, NVIDIA captures over 80% of the AI accelerator chip market, and its revenue growth is expected to continue in 2024 with the release of the H200 and next-generation B100/B200/GB200. Broadcom’s revenue reached $28.445 billion in 2023 (semiconductor segment only), growing by 7%, with AI chip income accounting for nearly 15% of its semiconductor solutions. Despite stable wireless communications revenue, Broadcom expects a near-double-digit decline in broadband and server storage connectivity this year.　　AMD’s revenue fell by 4% to $22.68 billion in 2023, due to declining PC demand and inventory reductions, affecting most of its business segments. Only its data center and embedded businesses, boosted by the acquisition of Xilinx, grew by 17%. AMD’s AI GPU MI300 series, launched in the fourth quarter of 2023, is expected to be a major revenue driver in 2024.　　Conversely, Qualcomm and MediaTek were impacted by the downturn in the smartphone market. Qualcomm’s 2023 revenue decreased by 16% YoY to $30.913 billion (QCT only) due to weak demand in the handheld device and IoT sectors, with China’s smartphone shipments hitting a decade low. However, Qualcomm is actively promoting the automotive market, expecting automotive revenues to more than double by 2030.　　MediaTek’s revenue also fell in 2023, dropping 25% YoY to $13.888 billion, with declines in smartphone, power management IC, and smart edge businesses. Nevertheless, due to the adoption of its Dimensity 9300 by several Chinese clients and expected growth in high-end smartphone shipments, the company predicts a return to double-digit growth for all of 2024.　　Two significant changes in the ranking from sixth to tenth took place: First, Cirrus Logic fell off the list from its last place spot and was replaced by MPS, whose 2023 revenue rose 4% YoY to $1.821 billion thanks to automotive, enterprise data, and storage computing businesses—offsetting declines in communication and industrial sectors.　　Secondly, Realtek’s revenue fell by 19% annually to $3.053 billion in 2023, dropping the company down to eighth place. The decline was mainly due to a sharp decrease in PC shipments, a suspension of telecom tenders in China, and early inventory write-offs. However, after clearing inventory, Realtek saw a slight improvement in PC and automotive shipments in the first quarter of 2024 over networking and consumer electronics. With the launch of WiFi-7 in the third quarter, the restart of telecom tenders, and participation in the development of edge computing frameworks through the Arm alliance, Realtek’s revenues are poised for growth.
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Release time：2024-05-13 14:48 reading：1001 Continue reading>>
Unveiling the Intricacies of IC <span style='color:red'>Design</span>
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Unveiling the Intricacies of IC Design

　　In the realm of modern technology, Integrated Circuits (ICs) stand as the cornerstone of electronic innovation. These miniature marvels, also known as microchips or chips, serve as the fundamental building blocks of countless electronic devices, from smartphones and laptops to medical devices and automotive systems. Behind every IC lies a complex process of design and development, encompassing a myriad of disciplines, methodologies, and challenges. In this comprehensive exploration, we delve deep into the fascinating world of IC design.　　What is an IC design?At its essence, IC design is the process of creating the blueprint for a microelectronic device that integrates multiple electronic components, such as transistors, capacitors, resistors, and interconnects, onto a single semiconductor substrate. The design process involves translating functional requirements and specifications into a detailed circuit layout that meets performance, power, area, and cost targets. IC designers employ a combination of theoretical knowledge, simulation tools, and engineering principles to conceptualize, model, simulate, and validate complex circuitry.　　What are the different styles of IC design?IC design encompasses a diverse range of styles and methodologies tailored to various applications, technologies, and design objectives. These styles of IC design differ in their approach, complexity, and implementation, catering to the specific requirements and constraints of different projects. Here are some common styles of IC design:　　Analog IC Design　　Digital IC Design　　Mixed-Signal IC Design　　RF IC Design　　Power IC Design　　ASIC (Application-Specific Integrated Circuit) Design　　FPGA (Field-Programmable Gate Array) Design　　System-on-Chip (SoC) Design　　How to design an IC?The IC design process encompasses several key stages, each of which contributes to the realization of a functional and manufacturable microelectronic device. These stages typically include:　　Specification and Requirements Analysis: Define the functional requirements, performance targets, power constraints, and other specifications for the IC based on market needs and application scenarios.　　Architecture Design: Develop the high-level architecture of the IC, including block diagrams, functional partitioning, and interface definitions, to achieve the desired system-level functionality.　　Circuit Design: Design and optimize the individual circuit blocks, such as amplifiers, oscillators, logic gates, and memory cells, using analog, digital, and mixed-signal design techniques.　　Layout Design: Translate the circuit schematics into a physical layout on the semiconductor substrate, considering factors such as placement, routing, parasitic effects, and manufacturability.　　Simulation and Verification: Perform extensive simulation and verification tests to validate the functionality, performance, and reliability of the IC design under various operating conditions and corner cases.　　Prototyping and Fabrication: Fabricate prototype ICs using semiconductor manufacturing processes, such as CMOS (Complementary Metal-Oxide-Semiconductor) technology, through foundries or in-house fabrication facilities.　　Testing and Characterization: Conduct comprehensive testing and characterization of the fabricated ICs to assess their electrical characteristics, functionality, yield, and adherence to specifications.　　Iterative Optimization: Iterate on the design, incorporating feedback from testing and characterization results, to improve performance, yield, and manufacturability for subsequent design iterations.　　Which software is used to design IC?　　Cadence Virtuoso: Cadence Virtuoso is a widely used platform for analog, digital, and mixed-signal IC design. It offers a comprehensive suite of tools for schematic capture, layout design, simulation, and verification, supporting complex IC design workflows.　　Synopsys Design Compiler: Synopsys Design Compiler is a synthesis tool used for RTL (Register Transfer Level) synthesis in digital IC design. It enables designers to convert high-level RTL descriptions into gate-level netlists optimized for area, power, and timing.　　Mentor Graphics Calibre: Mentor Graphics Calibre is a suite of tools for physical verification, DRC (Design Rule Check), LVS (Layout versus Schematic), and DFM (Design for Manufacturability) checks in IC design. It ensures compliance with foundry-specific rules and manufacturing constraints.　　Ansys HFSS: Ansys HFSS (High-Frequency Structure Simulator) is an electromagnetic simulation tool commonly used for RF (Radio Frequency) and microwave IC design. It enables designers to analyze and optimize the electromagnetic performance of RF circuits, antennas, and interconnects.　　Silvaco TCAD: Silvaco TCAD (Technology Computer-Aided Design) is a suite of simulation tools used for process and device simulation in semiconductor fabrication. It allows designers to model semiconductor processes, device behavior, and electrical characteristics at the device level.　　Tanner L-Edit: Tanner L-Edit is a layout editor commonly used for analog and mixed-signal IC design. It provides intuitive tools for drawing and editing IC layouts, enabling designers to create complex physical layouts with ease.　　Keysight ADS: Keysight ADS (Advanced Design System) is a simulation and design platform for RF, microwave, and high-speed digital IC design. It offers a wide range of simulation capabilities, including harmonic balance, transient analysis, and EM simulation, for RF circuit design and optimization.　　CircuitMaker: CircuitMaker is a free, community-driven PCB design tool that can be used for simple IC design and prototyping. It offers basic schematic capture and PCB layout capabilities, making it suitable for hobbyists, students, and small-scale projects.　　ConclusionIC design represents the pinnacle of engineering ingenuity and innovation, fueling progress and breakthroughs in diverse fields of technology. From conceptualization to realization, the IC design process embodies a synthesis of creativity, expertise, and perseverance, culminating in the creation of groundbreaking microelectronic devices that power our interconnected world. As technology continues to evolve and redefine the boundaries of possibility, the role of IC design remains indispensable, driving the forefront of innovation and shaping the trajectory of the digital age.
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Release time：2024-04-29 16:13 reading：704 Continue reading>>

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