Ameya360:Renesas Expands Low-power WAN Portfolio

Release time：2023-01-29
author：Ameya360
source：网络
reading：2327

　　Renesas Electronics Corp. is expanding its low-power WAN product line as part of its strategy to deliver connectivity devices used for smart cities, smart homes, medical devices and industrial applications.

Ameya360:Renesas Expands Low-power WAN Portfolio

　　The new RYZ024A supports Cat-M1 and NB-IoT (Narrowband Internet of Things) internet connectivity without the need for a gateway and consumes just 1?A while in power savings mode, significantly less than competing products. The RYZ024A supports extended discontinuous reception (eDRX) and has an extended voltage range from 2.2V to 5.5V, which makes it ideal for battery-powered applications.

　　Similar to its predecessor, the RYZ014A module, the RYZ024A offers seamless Cat-M1 wireless connection capability, but the new module adds the option to integrate NB-IoT. While Cat-M1 and NB-IoT are both Low Power Wide Area Network (LPWAN) technologies, NB-IoT uses only a portion of the available spectrum, making it more power efficient and therefore extending the operational life of battery-powered systems. NB-IoT also offers excellent coverage depth, including underground and in enclosed spaces. The module provides two power amplifier output levels: 20dBm and 23dBm, ensuring coverage at the cellular network’s edge as well as deep indoor environments.

　　The RYZ024A is being developed in collaboration with Sequans, a leader in cellular IoT technology, and will be fully tested and certified to work with all major radio frequency regulatory specifications defined by organizations such as the Global Certification Forum (GFC) and the PCS Type Certification Review Board (PTCRB). The certification ensures compliance with complex RF regulatory and carrier-specific requirements so that engineers can immediately start building IoT systems for leading carriers in North America, Asia Pacific and Europe.

　　“Cellular LTE-M and NB-IoT categories are now the de-facto wireless standards for connecting low-power IoT devices with global network coverage,” said Georges Karam, CEO of Sequans. “Renesas’ second-generation wireless module based on our Monarch 2 platform offers a certified hardware and software combination with all of the advanced features needed to accelerate the implementation of wireless IoT systems around the world.”

　　Renesas will provide all the tools and software that engineers need to design IoT-ready, power sensitive systems based on the RYZ024A, including an evaluation kit, a software stack and RF certifications. Compared to conventional chipset-based designs, designing in the RYZ024A module will reduce the PCB size by 60 percent and cut development time by up to 90 percent, since the product offers full hardware and software support to integrate the RA or RX family of MCUs.

　　“Renesas has been aggressively expanding its connectivity portfolio with strategic partnerships and acquisitions for the past five years,” said Roger Wendelken, Senior Vice President in Renesas’ IoT and Infrastructure Business Unit. “The RYZ024A is a great example of our expansive connectivity solution offerings that complement our broad range of embedded microcontrollers and microprocessors to deliver performance, scalability and exceptional reliability.”


（"Note: The information presented in this article is gathered from the internet and is provided as a reference for educational purposes. It does not signify the endorsement or standpoint of our website. If you find any content that violates copyright or intellectual property rights, please inform us for prompt removal."）

Previous：OMRON Announces Representative Directors Changes

Next：Ameya360:Global Chip Revenue Forecast to Decline 3.6% in 2023

Online messageinquiry

reading
Renesas’ Industry-First Gen6 DDR5 Registered Clock Driver Sets Performance Benchmark by Delivering 9600 MT/s
Trade news

Renesas’ Industry-First Gen6 DDR5 Registered Clock Driver Sets Performance Benchmark by Delivering 9600 MT/s

　　Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that it has delivered the industry’s first sixth-generation Registered Clock Driver (RCD) for DDR5 Registered Dual In-line Memory Modules (RDIMMs). The new RCD is the first to achieve a data rate of 9600 Mega Transfers Per Second (MT/s), surpassing the industry standard. This breakthrough marks a significant leap from the 8800 MT/s performance of Renesas’ Gen5 RCD, setting a new standard for memory interface performance in data center servers.　　Key Features of Renesas’ Gen6 DDR5 RCD　　10% Bandwidth Increase over Renesas’ Gen5 RCD (9600 MT/s versus 8800 MT/s)　　Backward Compatibility with Gen5 Platforms: Provides seamless upgrade path　　Enhanced Signal Integrity and Power Efficiency: Enables AI, HPC, and LLM workloads　　Expanded Decision Feedback Equalization Architecture: Offers eight taps and 1.5mV granularity for superior margin tuning　　Decision Engine Signal Telemetry and Margining (DESTM): Improved system-level diagnostics provides real-time signal quality indication, margin visibility, and diagnostic feedback for higher speeds　　The new DDR5 RDIMMs are needed to keep pace with the ever-increasing memory bandwidth demands of Artificial Intelligence (AI), High-Performance Compute (HPC) and other data center applications. Renesas has been instrumental in the design, development and deployment of the new RDIMMs, collaborating with industry leaders including CPU and memory providers, along with end customers. Renesas is the leader in DDR5 RCDs, building on its legacy of signal integrity and power optimization expertise.　　“Explosive growth of generative AI is fueling higher SoC core count. This is driving unprecedented demand for memory bandwidth and capacity as a critical enabler of data center performance,” said Sameer Kuppahalli, Vice President of Memory Interface Division at Renesas. “Our sixth generation DDR5 Registered Clock Driver demonstrates Renesas’ continued commitment to memory interface innovation, path-finding and delivering solutions to stay ahead of market demand.”　　"Samsung has collaborated with Renesas across multiple generations of memory interface components, including the successful qualification of Gen5 DDR5 RCD and PMIC5030,” said Indong Kim, VP of DRAM Product Planning, Samsung Electronics. “We are now excited to integrate Gen6 RCD into our DDR5 DIMMs, across multiple SoC platforms to support the growing demands of AI, HPC, and other memory-intensive workloads."　　Availability　　The RRG5006x Gen6 RCD is designed to meet the stringent requirements of next-generation server platforms, offering robust performance, reliability, and scalability. Renesas is sampling the new RRG5006x RCD to select customers today, including all major DRAM suppliers. Production availability is expected in the first half of 2027.
2025-11-13 16:33 reading：444
Renesas Adds Two New MCU Groups to Blazing Fast RA8 Series with 1GHz Performance and Embedded MRAM
Trade news

Renesas Adds Two New MCU Groups to Blazing Fast RA8 Series with 1GHz Performance and Embedded MRAM

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RA8M2 and RA8D2 microcontroller (MCU) groups. Based on a 1 GHz Arm® Cortex®-M85 processor with an optional 250 MHz Arm® Cortex®-M33 processor, the new MCUs are the latest Renesas offerings to deliver an unmatched 7300 Coremarks of raw compute performance, the industry benchmark for MCUs. The optional Cortex-M33 processor enables efficient system partitioning and task segregation.　　Both RA8D2 and RA8M2 devices are ultra-high performance MCUs as part of the second generation of the RA8 Series – the RA8M2 are general-purpose devices, and the RA8D2 MCUs are packed with a variety of high-end graphics peripherals. They are built on the same high-speed, low-power 22-nm ULL process used for the RA8P1 and RA8T2 devices introduced earlier this year. The devices include single and dual core options, and a specialized feature set to address the needs of a broad base of compute intensive applications. They take advantage of the high performance of the Arm Cortex-M85 processor and Arm’s Helium™ technology to offer a significant performance boost for digital signal processor (DSP) and machine learning (ML) implementations.　　The RA8M2 and RA8D2 devices offer embedded MRAM that has several advantages over Flash technology - high endurance & data retention, faster writes, no erase needed, and byte addressable with lower leakage and manufacturing costs. SIP options with 4 or 8 MB of external flash in a single package are also available for more demanding applications. Both the RA8M2 and RA8D2 MCUs include Gigabit Ethernet interfaces and a 2-port TSN switch to address industrial networking use cases.　　Both of the MCU Groups provide a combination of the high performance of the Cortex-M85 core, together with large memory and a rich peripheral set, making them particularly suitable for a wide range of IoT and industrial use cases. The lower power CM33 core can act as a housekeeping MCU, executing system tasks while the high performance CM85 core stays in sleep mode, to be woken up only as needed for high compute tasks, thus lowering the system power consumption.　　“The RA8M2 and RA8D2 complete Renesas’ new generation of RA8 MCUs, purpose-built for the high-performance microcontroller market,” said Daryl Khoo, Vice President of the Embedded Processing Marketing Division at Renesas. “This portfolio empowers Renesas to deliver scalable, secure and AI-enabled embedded processing solutions that accelerate customer innovation and time-to-market across a broad spectrum of industrial, IoT and select automotive applications. Renesas’ commitment to innovation is reflected in the RA8 Series’ ability to address complex processing requirements while maintaining lower power consumption and minimizing total cost of ownership to future-proof customers’ designs.”　　RA8D2 Feature Set Optimized for Graphics and HMI Applications　　The RA8D2 MCUs provide a plethora of features and functions for graphics and HMI applications:　　High resolution Graphics LCD Controller supports up to 1280x800 displays with both parallel RGB and 2-lane MIPI DSI interfaces　　Two-Dimensional Drawing Engine offloads the graphics rendering tasks from the CPU and supports graphics primitives　　Multiple camera interface options enable camera and vision AI applications,　　16-bit camera interface (CEU) with support for image data fetch, processing and format conversion　　MIPI CSI-2 interface offers a low pin-count interface with 2 lanes, each up to 720Mbps　　A VIN module performs vertical and horizontal scaling and format and color space conversions of YUV and RGB data inputs received from the MIPI CSI-2 interface　　Audio interfaces such as I2S and PDM support digital microphone inputs for audio and voice AI applications　　Comprehensive graphics solution with industry-leading embedded graphics GUI packages from SEGGER emWin and Microsoft GUIX, integrated into Renesas’ FSP　　Software JPEG decoder optimized for Helium, available with both emWin and GUIX solutions, allows decode of JPEG images with up to 27fps end-to-end graphics performance with Helium acceleration　　Multiple graphics ecosystem partners such as Embedded Wizard, Envox, LVGL and SquareLine Studio are offering solutions that employ RA8D2 using Helium to accelerate graphics functions and JPEG decoding　　Key Features of the RA8M2 and RA8D2 Group MCUs　　Core: 1 GHz Arm Cortex-M85 with Helium; Optional 250 MHz Arm Cortex-M33　　Memory: Integrated 1MB high-speed MRAM and 2MB SRAM (including 256KB TCM for the Cortex-M85 and 128KB TCM for the M33). 4MB and 8MB SIP devices coming soon.　　Analog Peripherals: Two 16-bit ADC with 23 analog channels, two 3-channel S/H, 2-channel 12-bit DAC, 4-channel high-speed comparators　　Communications Peripherals: Dual Gigabit Ethernet MAC with DMA, USB2.0 FS Host/Device/OTG, CAN2.0 (1Mbps)/CAN FD (8Mbps), I3C (12.5Mbps), I2C (1Mbps), SPI, SCI, Octal serial peripheral I/F　　Advanced Security: RSIP-E50D Cryptographic engine, robust secure boot with FSBL in immutable storage on-chip, secure debug, secure factory programming, DLM support, tamper protection, DPA/SPA protection,　　The new RA8M2 and RA8D2 Group MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS (FreeRTOS and Azure RTOS) with FSP, thus providing full flexibility in application development. In addition, Zephyr support is now included. Using the FSP will ease migration of existing designs to the new RA8 Series devices.　　Winning Combinations　　Renesas has combined the new RA8 Group MCUs with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations, including the Smart Glasses and Pet Camera Robot for the RA8M2, and both Ki Wireless Power Transceiver System (Tx) and Ki Wireless Power Receiver System (Rx) for the RA8D2. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. 　　Availability　　The RA8M2 and RA8D2 Group MCUs are available now, along with the FSP software. The RA8M2 devices are available in 176-pin LQFP, 224-pin and 289-pin BGA packages. The RTK7EKA8M2S00001BE Evaluation Kit is also available. The RA8D2 MCUs are offered in 224-pin and 289-pin BGA packages. The RTK7EKA8D2S01001BE Evaluation Kit supports the RA8D2 devices.
2025-10-30 15:45 reading：539
Renesas Powers 800 Volt Direct Current AI Data Center Architecture with Next-Generation Power Semiconductors
Trade news

Renesas Powers 800 Volt Direct Current AI Data Center Architecture with Next-Generation Power Semiconductors

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, announced that it is supporting efficient power conversion and distribution for the 800 Volt Direct Current power architecture announced by NVIDIA, helping fuel the next wave of smarter, faster AI infrastructure.　　As GPU-driven AI workloads intensify and data center power consumption scales into multi-hundred megawatt territory, modern data centers must adopt power architectures that are both energy optimized and scalable. Wide bandgap semiconductors such as GaN FET switches are quickly emerging as a key solution thanks to their faster switching, lower energy losses, and superior thermal management. Moreover, GaN power devices will enable the development of 800V direct current buses within racks to significantly reduce distribution losses and the need for large bus bars, while still supporting reuse of 48V components via DC/DC step-down converters.　　Renesas’ GaN based power solutions are especially suited for the task, supporting efficient and dense DC/DC power conversion with operating voltages of 48V to as high as 400V, with the option to stack up to 800V. Based on the LLC Direct Current Transformer (LLC DCX) topology, these converters achieve up to 98 percent efficiency. For the AC/DC front-end, Renesas uses bi-directional GaN switches to simplify rectifier designs and increase power density. Renesas REXFET MOSFETs, drivers and controllers complement the BOM of the new DC/DC converters. 　　“AI is transforming industries at an unprecedented pace, and the power infrastructure must evolve just as quickly to meet the explosive power demands,” said Zaher Baidas, Senior Vice President and General Manager of Power at Renesas. “Renesas is helping power the future of AI with high-density energy solutions built for scale, supported by our full portfolio of GaN FETs, MOSFETs, controllers and drivers. These innovations will deliver performance and efficiency, with the scalability required for future growth.”　　Renesas Power Management Leadership　　A world leader in power management ICs, Renesas ships more than 1.5 billion units per year, with increased shipments serving the computing industry, and the remainder supporting industrial and Internet of Things applications as well as data center and communications infrastructure. Renesas has the broadest portfolio of power management devices, delivering unmatched quality and efficiency with exceptional battery life. As a trusted supplier, Renesas has decades of experience designing power management ICs, backed by a dual-source production model, the industry’s most advanced process technology, and a vast network of more than 250 ecosystem partners.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. 
2025-10-13 13:29 reading：607
Renesas Adds Capacitive Touch to Ultra-Low-Power RA0 MCUs
Trade news

Renesas Adds Capacitive Touch to Ultra-Low-Power RA0 MCUs

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RA0L1 microcontroller (MCU) Group based on the Arm® Cortex®-M23 processor. The new devices offer extremely low power consumption and the industry’s best solution for quickly and economically implementing capacitive touch in battery-powered and other consumer electronics, appliances, white goods and industrial system controls.　　Renesas introduced the RA0 MCU series in 2024 and it has quickly become very popular with a wide range of customers due to its affordability and low power consumption. With the addition of capacitive touch functionality, RA0L1 devices offer designers the ability to create responsive, attractive, low-power user interfaces at very low cost.　　RA0L1 MCUs deliver industry-leading power consumption of only 2.9mA current in active mode, and 0.92mA in sleep mode. In addition, an integrated High-speed On-Chip Oscillator (HOCO) enables the fastest wake-up time for this class of microcontroller. The fast wake-up enables the RA0L1 MCUs to stay in Software Standby mode more of the time, where power consumption drops to a minuscule 0.25 µA. With this feature, current consumption can be reduced by up to 90 percent compared with other solutions.　　Feature Set Optimized for Low Cost　　The RA0L1 devices have a feature set optimized for cost-sensitive applications. They offer a wide operating voltage range of 1.6V to 5.5V so customers don’t need a level shifter/regulator in 5V systems. The RA0L1 MCUs also integrate multiple communications interfaces, analog functions, safety functions and security functionality to reduce customer BOM cost. A wide range of packaging options is also available, including a tiny 4mm x 4mm 24-pin QFN.　　In addition, the new MCU’s high-precision (±1.0%) HOCO improves baud rate accuracy and enables designers to forego a standalone oscillator. Unlike other HOCOs in the industry, it maintains this precision in environments from -40°C to 125°C. This wide temperature range enables customers to simplify thermal design by avoiding costly and time-consuming “trimming,” even after the reflow process.　　Renesas Capacitive Touch Leadership　　Renesas provides industry-leading capacitive touch technology, ensuring customers can quickly and cost-effectively implement high-quality touch interfaces in a variety of systems. Its self-capacitance method simplifies waterproof design, offering simpler design and reduced complexity compared to mutual capacitance solutions. Renesas’ multi-frequency measurement meets IEC61000 4-3 Level 4 standards, making it ideal for medical applications that demand robust protection from electromagnetic interference. Renesas also offers specialized development resources for capacitive touch, including the QE for Capacitive Touch that streamlines sensitivity adjustments for capacitive touch buttons, speeding up development.　　“The RA0L1 combines the industry-leading power consumption and cost-effectiveness of our RA0 Series MCUs with our unmatched capacitive touch technology and tools,” said Daryl Khoo, Vice President of the Embedded Processing Marketing Division at Renesas. “We look forward to the many innovative touch interface solutions that our customers will create using these devices.”　　Key Features of the RA0L1 Group MCUs　　Core: 32MHz Arm Cortex-M23　　Memory: Up to 64KB integrated Code Flash memory and 16KB SRAM　　Extended Temperature Range: Ta -40°C to 125°C　　Timers: Timer array unit (16b x 8 channels), 32-bit interval timer (8b x 4 channels), RTC　　Communications Peripherals: 3 UARTs, 2 Async UART, 6 Simplified SPIs, 2 I2C, 6 Simplified I2Cs　　Analog Peripherals: 12-bit ADC, temperature sensor, internal reference voltage　　HMI: Capacitive Touch (up to 24 channels), Controlled Current Drive Port (up to 8)　　Safety: SRAM parity check, invalid memory access detection, frequency detection, A/D test, output level detection, CRC calculator, register write protection　　Security: Unique ID, TRNG, Flash access window, Flash read protection　　Packages: 24-, 32- and 48-pin QFNs, 32-, 48-pin LQFP, 20-pin LSSOP　　The new RA0L1 Group MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. Using the FSP will ease migration to and from other RA family devices.　　Winning Combinations　　Renesas has combined the new RA0L1 Group MCUs with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations, including the Capacitive Touch Remote Controller. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly.　　Availability　　The RA0L1 Group MCUs are available now, along with the FSP software, the RA0L1 Fast Prototyping Board and the RA0L1 Renesas Solution Starter Kit for Cap Touch. Samples and kits can be ordered either on the Renesas website or through AMEYA360.
2025-09-18 16:11 reading：727
Popular categories
Boxes, Enclosures, Racks Cables, Wires Circuit Protection Connectors, Interconnects Development Kits Electromechanical Embedded Solutions Fans, Thermal Management Optoelectronics Others Passive Components Power Semiconductors Sensors, Transducers Test and Measurement
  • Week of hot material
  • Material in short supply seckilling
model brand Quote
CDZVT2R20B ROHM Semiconductor
BD71847AMWV-E2 ROHM Semiconductor
RB751G-40T2R ROHM Semiconductor
MC33074DR2G onsemi
TL431ACLPR Texas Instruments
model brand To snap up
IPZ40N04S5L4R8ATMA1 Infineon Technologies
BP3621 ROHM Semiconductor
TPS63050YFFR Texas Instruments
STM32F429IGT6 STMicroelectronics
ESR03EZPJ151 ROHM Semiconductor
BU33JA2MNVX-CTL ROHM Semiconductor
Hot labels
ROHM
IC
Averlogic
Intel
Samsung
IoT
AI
Sensor
Chip
Original authorized brand
More Licensed Brands>>
Information leaderboard
  • Week of ranking
  • Month ranking

About us

Qr code of ameya360 official account

Identify TWO-DIMENSIONAL code, you can pay attention to

AMEYA360 weixin Service Account AMEYA360 weixin Service Account
AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.

Please enter the verification code in the image below：

verification code