Toshiba, WD Settle Dispute, Extend JV

Release time:2017-12-14
author:Ameya360
source:Dylan McGrath
reading:1161

  Toshiba and Western Digital announced a deal to settle all ongoing litigation and arbitration, extending their existing partnership and NAND flash development and manufacturing.

  The deal, which was expected this week, extends the joint venture agreements between the firms to 2027 and beyond and gives WD the right to fully participate in Toshiba Memory's Fab 6 at its Yokkaichi Operations site, which will be devoted to the mass production of bit cost scalable BiCS 3D NAND.

  "It's really a very positive thing," said Jim Handy, principal analyst at Objective Analysis, of the settlement.

  Walter Coon, an analyst and director for technology, media and telecom at IHSMarkit, said a settlement of the dispute was in the best interest of both parties. "From the WD perspective, they had to get resolution to this [to secure future supply of NAND]," Coon said. "In the long term, even if they felt like they would prevail in the courts, I think the risk was too high."

  WD had maintained that the joint venture agreements between Toshiba and SanDisk — which WD acquired in 2016 — required Toshiba to seek WD's approval before it could sell its memory chip business. Toshiba announced in September that it reached an agreement to sell its memory chip business, Toshiba Memory, to a consortium led by private equity firm Bain Capital for $18 billion.

  WD had sought to acquire Toshiba's memory business when the Japanese conglomerate announced it would sell to offset massive losses incurred by its U.S. nuclear power business. But Toshiba repeatedly said it preferred other bids, reportedly owing to the Japanese government's desire to keep Toshiba's technology in Japanese hands. The structure of the Bain-led consortium — which also includes state-backed entities Innovation Network Corp. of Japan (INCJ) and the Development Bank of Japan, in addition to Hoya, Apple, Dell and South Korean memory chip vendor sk Hynix — means that Toshiba Memory will be more than half owned by Japanese entities.

  Western Digital initiated legal action in June to block the sale, an event which started a volley of litigation between the firms that threatened to undermine the sale to the Bain-led consortium.

  Both Toshiba Memory and Bain were also involved in the settlement deal announced Tuesday, WD said.

  "This agreement is a win for all parties," said Steve Milligan, WD's CEO, in a conference call to discuss the settlement on Tuesday. Milligan and other executives said WD hadn't wanted to initiate legal action, but did so only after they felt their concerns were not being heard by Toshiba.

  Handy said that Toshiba, after being rocked by an accounting scandal last year and reporting huge losses at its Westinghouse U.S. nuclear power subsidiary earlier this year, was reeling. "Toshiba was trying to do triage to the extent that they weren't giving the time and attention to WD that they thought they deserved," Handy said.

("Note: The information presented in this article is gathered from the internet and is provided as a reference for educational purposes. It does not signify the endorsement or standpoint of our website. If you find any content that violates copyright or intellectual property rights, please inform us for prompt removal.")

Online messageinquiry

reading
Toshiba Building New Facility to Expand Power Semiconductor Production Capacity
Toshiba announces next-generation superjunction power MOSFETs
2018-08-21 00:00 reading:3527
Toshiba Memory announces merger with K. K. Pangea
Toshiba Memory Corporation develops 96-layer BiCS FLASH with QLC technology
Toshiba Memory Corporation today announced that it has developed a prototype sample of 96-layer BiCS FLASH, its proprietary 3D flash memory, with 4-bit-per-cell (quad level cell, QLC) technology that boosts single-chip memory capacity to the highest level yet achieved.Toshiba Memory will start to deliver samples to SSD and SSD controller manufacturers for evaluation from the beginning of September, and expects to start mass production in 2019.The advantage of QLC technology is pushing the bit count for data per memory cell from three to four and significantly expanding capacity. The new product achieves the industry’s maximum capacity [1] of 1.33 terabits for a single chip which was jointly developed with Western Digital Corporation.This also realizes an unparalleled capacity of 2.66 terabytes with a 16-chip stacked architecture in one package. The huge volumes of data generated by mobile terminals and the like continue to increase with the spread of SNS and progress in IoT, and the need to analyze and utilize that data in real time is expected to increase dramatically. That will require even faster than HDD, larger capacity storage and QLC products using the 96-layer process will contribute a solution.A packaged prototype of the new device will be exhibited at the 2018 Flash Memory Summit in Santa Clara, California, USA from August 6th to 9th.Looking to the future, Toshiba Memory will continue to improve memory capacity and performance and to develop 3D flash memories that meet diverse market needs, including the fast expanding data center storage market.
2018-07-24 00:00 reading:3440
  • Week of hot material
  • Material in short supply seckilling
model brand Quote
RB751G-40T2R ROHM Semiconductor
BD71847AMWV-E2 ROHM Semiconductor
TL431ACLPR Texas Instruments
MC33074DR2G onsemi
CDZVT2R20B ROHM Semiconductor
model brand To snap up
IPZ40N04S5L4R8ATMA1 Infineon Technologies
TPS63050YFFR Texas Instruments
BU33JA2MNVX-CTL ROHM Semiconductor
ESR03EZPJ151 ROHM Semiconductor
STM32F429IGT6 STMicroelectronics
BP3621 ROHM Semiconductor
Hot labels
ROHM
IC
Averlogic
Intel
Samsung
IoT
AI
Sensor
Chip
About us

Qr code of ameya360 official account

Identify TWO-DIMENSIONAL code, you can pay attention to

AMEYA360 weixin Service Account AMEYA360 weixin Service Account
AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.

Please enter the verification code in the image below:

verification code