<span style='color:red'>Toshiba</span> Building New Facility to Expand Power Semiconductor Production Capacity
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Toshiba Building New Facility to Expand Power Semiconductor Production Capacity

　　Toshiba will construct a new back-end production facility for power semiconductors to boost its production capacity.　　Toshiba Electronic Devices & Storage Corp. will construct a new back-end production facility for power semiconductors at its Himeji Operations – Semiconductor, in Hyogo Prefecture in western Japan. Construction will start in June 2024, with production scheduled to start in spring 2025. The project will more than double Toshiba’s automotive power semiconductor production capacity at Himeji, against fiscal 2022.　　Power devices are essential components for managing and reducing power consumption in all kinds of electronic equipment, and for saving energy. Above all other products, demand for low-voltage MOSFETs (metal oxide semiconductor field effect transistors), a Toshiba focus technology, is expected to see continued growth with the progress of vehicle electrification and the automation of industrial equipment. Toshiba has decided to meet this demand growth with construction of the new back-end facility.　　Going forward, Toshiba will expand its power semiconductor business and boost competitiveness by offering high efficiency, high reliability products in response to fast growing demand, and to contribute to carbon neutrality.
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Release time：2022-12-26 13:44 reading：3508 Continue reading>>
<span style='color:red'>Toshiba</span> Develops High-Speed Algorithm and Hardware Architecture for Deep Learning Processor
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Toshiba Develops High-Speed Algorithm and Hardware Architecture for Deep Learning Processor

Toshiba Memory Corporation today announced the development of a high-speed and high-energy-efficiency algorithm and hardware architecture for deep learning processing with less degradations of recognition accuracy. The new processor for deep learning implemented on an FPGA achieves 4 times energy efficiency compared to conventional ones. The advance was announced at IEEE Asian Solid-State Circuits Conference 2018 (A-SSCC 2018) in Taiwan on November 6.Deep learning calculations generally require large amounts of multiply-accumulate (MAC) operations, and it has resulted in issues of long calculation time and large energy consumption. Although techniques reducing the number of bits to represent parameters (bit precision) have been proposed to reduce the total calculation amount, one of proposed algorithm reduces the bit precision down to one or two bit, those techniques cause degraded recognition accuracy.Toshiba Memory developed the new algorithm reducing MAC operations by optimizing the bit precision of MAC operations for individual filters in each layer of a neural network. By using the new algorithm, the MAC operations can be reduced with less degradation of recognition accuracy.Furthermore, Toshiba Memory developed a new hardware architecture, called bit-parallel method, which is suitable for MAC operations with different bit precision. This method divides each various bit precision into a bit one by one and can execute 1-bit operation in numerous MAC units in parallel. It significantly improves utilization efficiency of the MAC units in the processor compared to conventional MAC architectures that execute in series.Toshiba Memory implemented ResNet50, a deep neural network, on an FPGA using the various bit precision and bit-parallel MAC architecture. In the case of image recognition for the image dataset of ImageNet, the above technique supports that both operation time and energy consumption for recognizing image data are reduced to 25 % with less recognition accuracy degradation, compared to conventional method.
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Release time：2018-11-07 00:00 reading：1153 Continue reading>>
<span style='color:red'>Toshiba</span> announces next-generation superjunction power MOSFETs
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Toshiba announces next-generation superjunction power MOSFETs

Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has launched a new series of next-generation 650V power MOSFETs that are intended for use in server power supplies in data centers, solar (PV) power conditioners, uninterruptible power systems (UPS) and other industrial applications.The first device in the DTMOS VI series is the TK040N65Z, a 650V device that supports continuous drain currents (ID) up to 57A and 228A when pulsed (IDP). The new device offers an ultra-low drain-source on-resistance RDS(ON) of 0.04Ω (0.033Ω typ.) which reduces losses in power applications. The enhancement mode device is ideal for use in modern high-speed power supplies, due to the reduced capacitance in the design.Power supply efficiency is improved as a result of reductions in the key performance index / figure-of-merit (FoM) – RDS(ON) x Qgd. The TK040N65Z shows a 40% improvement in this important metric over the previous DTMOS IV-H device, which represents a significant gain in power supply efficiency in the region of 0.36%[1] – as measured in a 2.5kW PFC circuit.The new device is housed in an industry-standard TO-247 package, ensuring compatibility with legacy designs as well as suitability for new projects.Toshiba will continue to expand their product lineup to meet market trends and help improve the efficiency of power supplies and systems.The new device enters mass production today and shipments begin immediately.
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Release time：2018-08-21 00:00 reading：3192 Continue reading>>
<span style='color:red'>Toshiba</span> Memory announces merger with K. K. Pangea
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Toshiba Memory announces merger with K. K. Pangea

Toshiba Memory Corporation today announced that it consummated the merger with K. K. Pangea which is its parent company on August 1, 2018. The company name after the merger is Toshiba Memory Corporation. Today the company also introduces the executive officer system to improve the efficiency of business execution and strengthen the corporate governance. The outline of Toshiba Memory and the list of its directors, executive officers and statutory auditors as of August 1, 2018 are as follows.Toshiba Memory Corporation is dedicated to the development, production and sales of flash memory and SSDs. In April 2017, Toshiba Memory was spun off from Toshiba Corporation, the company that invented NAND flash memory in 1987. Toshiba Memory pioneer cutting-edge memory solutions and services that enrich people’s lives and expand society’s horizons.
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Release time：2018-08-02 00:00 reading：3192 Continue reading>>
<span style='color:red'>Toshiba</span> Memory Corporation develops 96-layer BiCS FLASH with QLC technology
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Toshiba Memory Corporation develops 96-layer BiCS FLASH with QLC technology

Toshiba Memory Corporation today announced that it has developed a prototype sample of 96-layer BiCS FLASH, its proprietary 3D flash memory, with 4-bit-per-cell (quad level cell, QLC) technology that boosts single-chip memory capacity to the highest level yet achieved.Toshiba Memory will start to deliver samples to SSD and SSD controller manufacturers for evaluation from the beginning of September, and expects to start mass production in 2019.The advantage of QLC technology is pushing the bit count for data per memory cell from three to four and significantly expanding capacity. The new product achieves the industry’s maximum capacity [1] of 1.33 terabits for a single chip which was jointly developed with Western Digital Corporation.This also realizes an unparalleled capacity of 2.66 terabytes with a 16-chip stacked architecture in one package. The huge volumes of data generated by mobile terminals and the like continue to increase with the spread of SNS and progress in IoT, and the need to analyze and utilize that data in real time is expected to increase dramatically. That will require even faster than HDD, larger capacity storage and QLC products using the 96-layer process will contribute a solution.A packaged prototype of the new device will be exhibited at the 2018 Flash Memory Summit in Santa Clara, California, USA from August 6th to 9th.Looking to the future, Toshiba Memory will continue to improve memory capacity and performance and to develop 3D flash memories that meet diverse market needs, including the fast expanding data center storage market.
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Release time：2018-07-24 00:00 reading：3100 Continue reading>>
<span style='color:red'>Toshiba</span> avoids being fined over its accounting practices
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Toshiba avoids being fined over its accounting practices

Toshiba Corporation has said that it has not been fined by US regulators following the conclusion of an investigation into its accounting practices.The US Securities and Exchange Commission (SEC) was investigating alleged accounting irregularities at the Japanese firm's US businesses.According to Toshiba, "We understand that all SEC investigations regarding our accounting have been completed.”Speaking to Reuters a spokesman for the company said that there was no penalty or censure.Toshiba's accounting scandal, which broke in 2015 and went back over seven years, uncovered widespread errors at the Japanese laptops-to-nuclear conglomerate.The scandal resulted in the company recognising huge cost overruns at its now-bankrupt U.S. nuclear unit Westinghouse, and forced it to sell its memory chip unit for $18 billion.The SEC has not yet commented on the investigation.
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Release time：2018-06-27 00:00 reading：3091 Continue reading>>
Sharp to buy <span style='color:red'>Toshiba</span>'s PC business and issue $1.8 billion in new shares
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Sharp to buy Toshiba's PC business and issue $1.8 billion in new shares

Sharp said it will buy Toshiba's personal computer business and issue $1.8 billion in new shares to buy back preferred stock from banks, highlighting a swift recovery under the control of Foxconn.The acquisition of the PC business for $36 million marks a return by Sharp to a market it quit eight years ago, even if its comparatively low cost underscores dwindling demand in a world where many consumers spend more money on their smartphones.The Osaka-based electronics maker will be able to use the scale of parent Foxconn, the world's biggest contract manufacturer, to produce PCs more cheaply — just as it has done with TVs."Foxconn is a PC contract manufacturer and has a great deal of expertise and production capacity," said Hiromi Yamaguchi, senior analyst at Euromonitor International."This acquisition will prove a further catalyst for more Sharp and Foxconn synergies."Sharp said it will take an 80.1 percent stake in Toshiba's PC unit on Oct. 1, and will retain its Dynabook brand.Toshiba, which launched the world's first laptop PC in 1985, sold 17.7 million PCs at its peak seven years ago. That has shrunk to just 1.4 million units last year.Bought by Foxconn, known formally as Hon Hai Precision Industry Co Ltd, two years ago, Sharp recently posted its first annual net profit in four years, helped in large part by cost cuts but also by Foxconn's sales network in China.Sharp said it was buying back the preferred shares, which were issued to banks in a return for a financial bailout, to reduce high-interest payments.Although the new issue will result in dilution of more than 10 percent, it is not expected to be as great as any potential dilution that could have resulted had the preferred shares been converted into regular stock.Shares in Sharp pared steep losses after the share issue news to close 4 percent lower, giving it a market value of around $12.8 billion.Sharp was once known as a major supplier of high-end TVs and smartphone displays but struggled to compete with Asian rivals before it was bought by Foxconn.It is now seeking to get back the license of the Sharp brand for TVs in North America it previously sold to China's Hisense Group.Embattled conglomerate Toshiba sold its television business to Hisense and its white-goods business to China's Midea Group as it scrambled for funds to cover billions of dollars in liabilities arising from now-bankrupt U.S. nuclear unit Westinghouse.The $18 billion sale of its chips business to a group led by U.S. private equity firm Bain Capital was completed last week.Toshiba outsourced PC production until 2015, and currently builds PCs at its own plant in China.
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Release time：2018-06-06 00:00 reading：3153 Continue reading>>
<span style='color:red'>Toshiba</span> Retains 40% Stake in Chip Unit
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Toshiba Retains 40% Stake in Chip Unit

Japan's Toshiba Corp. said it retained ownership of a 40 percent stake in its semiconductor business following the close of an $18 billion deal to sell the majority of the unit to a consortium led by U.S. private equity firm Bain Capital.Closure of the deal, announced Friday (June 1), was expected after Toshiba announced last month that it had finally secured the approval of Chinese antitrust regulators. The announcement brings to a close a lengthy saga that began early last year when Toshiba announced it would spin off and then sell its semiconductor business to help offset massive losses incurred by its U.S. nuclear power business.Toshiba Memory Corp. is the second-ranked supplier of NAND flash, after South Korea's Samsung Electronics. In addition to Bain, the consortium that acquired the business includes Apple, Dell, Seagate Technology, Kingston Technologies and SK Hynix.
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Release time：2018-06-05 00:00 reading：3073 Continue reading>>
<span style='color:red'>Toshiba</span> NAND chip business to Bain capital consortium including Apple completes
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Toshiba NAND chip business to Bain capital consortium including Apple completes

The sale of memory chip business of Toshiba has ultimately come to an end. The company has announced its deal with Bain Capital consortium, consisting of Apple and various other tech companies.According to reports, the deal is worth two trillion, three hundred million yen – which is roughly $18 billion. Concluding this business has been very necessary for Toshiba because the deal gives Toshiba a much-needed cash infusion since the company earlier lost billions of dollars through its Westinghouse division.Though the consortium includes Apple, Dell, Hoya, Hynix, Seagate, and Kingston, Toshiba will retain 40% of the ownership of the unit.Now the share of Toshiba has been transferred to K.K. Pangea, a purpose-built company controlled by the consortium and under Bain Capital’s umbrella. Since Toshiba has been able to repurchase 40.2 percent of common stock, the right to vote has been given to the tech giant Pangea. Although the unit is no longer under Toshiba’s majority rule, it says the new company is “expected” to become an affiliate in the future without confirming when it would happen.Apart from this, it is completely under mystery that how much each of these companies has invested in the acquisition. On the basis of earlier reports, Apple may have put up as much as $3 billion yet which has not been officially confirmed.Apple is known to have an intense desire in the acquisition as it is one of the world’s leading manufacturers of NAND chips. Since supply issues have plagued the NAND chip market in the last six months which increased the pricing and shipment delay of the gadgets. So this shortage could be the main reason behind the step that Apple took by increasing the price of its high-capacity iPad Pro models last year.According to reports, there were bids from three separate groups interested in acquiring Toshiba’s NAND chip business among which Apple was a part in each of the three. But as the deal closed, it was Bain Capital consortium with whom Toshiba merged its business.
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Release time：2018-06-04 00:00 reading：2991 Continue reading>>
<span style='color:red'>Toshiba</span> Memory to Build New Fab to Produce BiCS 3D NAND
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Toshiba Memory to Build New Fab to Produce BiCS 3D NAND

Toshiba Memory Corp., which is set to become independent from Toshiba in a few days, has announced their intention to start construction of a new BiCS 3D NAND fab in July. TMC expects Western Digital to participate in the new project. Overall, this is the latest in a number of NAND fab announcements across the industry in the last year that, at long last, signals surging interest in building additional capacity.The new fab will be located near Kitakami City, Iwate prefecture. By contrast, the existing NAND flash production facilities operated by TMC and Western Digital are located near Yokkaichi, Mie prefecture. Traditionally for Japan, the new fab will feature a quake absorbing structure and an environmentally friendly design, which includes materials used and energy efficient production equipment. Just like the Fab 6, the new production facility will use an AI-powered production system to boost productivity.Toshiba expects to complete the building sometimes in 2019 (most probably in summer 2019 as it takes around a year to construct a fab building) and then start with equipment move-in. This process usually takes two to three quarters, so expect the new fab to come online in 2020, if everything goes as planned.Until the company makes its final decision regarding the manufacturing tools to be used, the actual production capacity of the new fab is unknown. Meanwhile, decisions regarding equipment will be made based on multiple factors, including predicted demand for NAND and Western Digital’s participation in the project. Speaking of Western Digital. Late last year Western Digital announced that it would participate in building the fab in Iwate, but so far, the company has not made any announcements regarding its exact plans on the matter.Toshiba last week announced that it had received all the required anti-trust regulatory approvals regarding its sale of Toshiba Memory Corp. (TMC) to Pangea consortium of investors. The last regulator to approve the $18-billion transaction was China. The deal is now expected to close on June 1, as planned by the Japanese company.
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Release time：2018-05-30 00:00 reading：3095 Continue reading>>

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