NAND Market Expected to Regain Balance in 2018
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NAND Market Expected to Regain Balance in 2018

　　The NAND flash market is expected to move into better equilibrium in 2018 as the production of NAND ramps up to meet demand, according to DRAMeXchange, a market research firm that tracks memory chip price.　　Demand has exceeded supply in NAND for sixth consecutive quarters since the third quarter of 2016. According to DRAMeXchange, demand for NAND has continued to increase through 2017 due to a strong server market and the increasing memory content in smartphones. Meanwhile, supply has been constrained by NAND flash markers technology migrations, principally to 3D NAND.　　However, DRAMeXchange predicts that NAND flash bit growth will be about 43 percent in 2018, while bit demand growth is projected to be about 38 percent.　　According to  Alan Chen, senior research manager at DRAMeXchange, NAND suppliers other than market leader Samsung Electronics have experienced losses of production capacity as they moved to improve their 3D NAND production processes. "At the same time, suppliers have been unable to effectively utilize the additional capacity that they have taken on," Chen said, in a press statement.　　But Chen expects suppliers to reach maturity on their respective 64- and 72-layer NAND stacking technologies next year. Chen expects the market to briefly shift into oversupply in the first quarter of 2018 as production of consumer electronics goods such as smartphones and PCs drop sharply from fourth quarter holiday season levels.　　DRAMeXchange expects 3D NAND to make up 70 percent of global NAND bit output next year, the firm said.　　Samsung has been in mass production of 64-layer 3D NAND since the recently concluded third quarter. By the fourth quarter, DRAMeXchange expects 3D NAND  to be more than 50 percent of the company's NAND capacity, a number that could rise to as high as 60 to 70 percent next year.　　SK Hynix now uses mainly 48-layer NAND stacking technology, but its 72-layer stacking will account for a larger share of its production capacity next year, according to DRAMeXchange. The firm expects about 20 to 30 percent of SK Hynix's total NAND flash production capacity to be 3D NAND in the fourth quarter of this year, a figure that could rise to 40 to 50 percent by the fourth quarter of 2018, DRAMeXchange said.　　Toshiba and partner Western Digital mainly produced 48-layer 3D NAND during the first half of this year. About 30 percent of the joint venture's total NAND capacity will be based on 3D NAND in the fourth quarter, with that number expected to surpass 50 percent by the fourth quarter of 2018, according to DRAMeXchange.
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Release time：2017-10-09 00:00 reading：1447 Continue reading>>
TSMC Chairman Morris Chang Announces Retirement
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TSMC Chairman Morris Chang Announces Retirement

　　Taiwan Semiconductor Manufacturing Co. (TSMC) Chairman Morris Chang has announced his retirement from the company in June next year. He will turn over leadership to the current co-CEOs.　　Chang, who is 86 this year, is a semiconductor industry veteran who rose to the top management of Texas Instruments and General Instruments Corp. before he was recruited by the Taiwan government to become chairman of the Industrial Technology Research Institute, an organization that helped to spin off a number of Taiwan’s largest chip companies.　　Chang founded TSMC in 1987 as one of the world’s first pure-play foundries, a business which at the time was a tiny startup that was met with a great deal of skepticism within the semiconductor industry. Today, TSMC has become one of the largest companies in the industry by offering advanced process technology and ample production capacity to customers that range from Apple to ZTE.　　“From early June 2018 on, TSMC will be under the dual leadership of Mark Liu and C.C. Wei.” Chang said in a press statement. “Liu will be the chairman of the board, and C.C. Wei will be the chief executive officer.”　　Chang said he will not remain on the board of directors after his retirement, nor will he participate in any TSMC management activities after the annual shareholders meeting in June next year.　　Liu and Wei have been co-CEOs of TSMC since 2013, and have performed outstandingly, Chang said. After his retirement, with the continued supervision and support of an essentially unchanged board, and under the dual leadership of Liu and Wei, TSMC will continue to perform exceptionally, Chang said.　　Chang was born in Ningbo, China and spent his early childhood in the throes of the Chinese Civil War, moving with his family to Hong Kong and other cities in South China before escaping to the U.S.　　In the U.S., Chang attended Harvard University and transferred to the Massachusetts Institute of Technology, where he received bachelor’s and master’s degrees in mechanical engineering. During his 25-year career at Texas Instruments, he rose up in the ranks to become the group vice president responsible for TI's worldwide semiconductor business. During his tenure with TI, the company sent him to Stanford University, where he received a PhD in electrical engineering.　　Chang earlier this year became a billionaire for the first time after his stock holdings in TSMC soared in value. TSMC’s market capitalization of $184.7 billion now exceeds that of Intel at $178.9 billion.
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Release time：2017-10-09 00:00 reading：1612 Continue reading>>
TSMC Aims to Build World’s First 3-nm Fab
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TSMC Aims to Build World’s First 3-nm Fab

　　Taiwan Semiconductor Manufacturing Co. (TSMC) will build the world’s first 3-nm fab in the Tainan Science Park in southern Taiwan, where the company does the bulk of its manufacturing.　　The announcement lays to rest speculation that the company might build its next chip facility in the U.S., attracted by incentives offered by the administration of President Donald Trump to bring more manufacturing to America.　　About a year ago, TSMC said it planned to build its next fab at the 5-nm to 3-nm technology node as early as 2022. The more recent one-paragraph announcement from TSMC on Sept. 29 didn’t provide a timeframe for the opening of the 3-nm fab.　　“TSMC recognizes and is grateful for the (Taiwan) government’s clear commitments to resolve any issues, including land, water, electricity and environmental protection,” the statement said.　　TSMC previously estimated it would need 50 to 80 hectares (123 to 198 acres) of land for an investment worth about NT$500 billion ($15.7 billion). The company’s earlier 2022 timeframe for the fab takes into account potentially unanticipated delays in construction. Some of TSMC’s recent projects in Taiwan have been set back by as much as a year by public hearings on environmental impact.　　TSMC has also faced shortages of water and power in Taiwan, where the company does most of its production.　　Process Leaders　　TSMC, Samsung and Intel have been in a tight race to lead process technology development and grab profits from fabless customers such as Apple and Qualcomm.　　Earlier this year, TSMC logged its first revenue from 10nm products, trailing Samsung, its main rival in the foundry business, by nearly four months.　　TSMC said its 7-nm yield is ahead of schedule and it expects a fast ramp in 2018. The company plans to insert several extreme ultraviolet (EUV) layers at 7 nm, but declined to provide details. The company plans to offer a 7-nm plus node that it expects will allow customers easy migration from 7 nm.　　TSMC has also said its 5-nm roadmap is on track for a launch in the first quarter of 2019.
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Release time：2017-10-09 00:00 reading：1657 Continue reading>>
Monthly Chip Sales Hit $35 Billion for First Time
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Monthly Chip Sales Hit $35 Billion for First Time

　　Monthly semiconductor sales hit $35 billion for the first time in August, increasing on a sequential basis for the 13th consecutive month, according to the Semiconductor Industry Association (SIA).　　The three-month moving average of chip sales increased by 4 percent sequentially and 24 percent year-to-year in August, as the semiconductor sales rally that began in the second half of 2016 continues to steam along, according to the SIA. The industry association reports sales figures compiled by the World Semiconductor Trade Statistics organization, a group of 55 semiconductor firms that provide sales data on a monthly basis.　　"Sales in August increased across the board, with every major regional market and semiconductor product category posting gains on a month-to-month and year-to-year basis," said John Neuffer, SIA president and CEO, in a press statement. "Memory products continue be a major driver of overall market growth, but sales were up even without memory in August."　　Led by strong sales of memory chips, the semiconductor industry is enjoying its strongest growth year since at least 2010. The latest forecast from the WSTS calls for chip sales to be  up 11.5 percent this year compared with last year. Other market watchers, such as market research firm IC Insights, are even more bullish.　　The Americas region posted growth of 8.8 percent sequentially and 39 percent year-over-year in August, the strongest of any major region, according to the SIA. Sales in China were up 3.7 percent sequentially and 23.3 percent year-over-year, the SIA said.　　Neuffer again urged the U.S. Congress to enact corporate tax reform that makes the U.S. competitive with other nations, echoing a message the SIA put out last week in support of the tax reform proposal advanced by President Donald Trump and Republican leaders in Congress.　　"With about half of global market share, the U.S. semiconductor industry is the worldwide leader, but U.S. companies face intense global competition," Neuffer said.
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Release time：2017-10-09 00:00 reading：1929 Continue reading>>
ByteSnap gets the nod from NXP
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ByteSnap gets the nod from NXP

　　Birmingham based electronics consultancy ByteSnap Design has become the first UK based Approved Engineering Consultant for NXP Semiconductors. According to the company, NXP Approved Engineering Consultants are trusted design contractors, software service providers, and training centres that offer experienced consulting or design services to implement NXP technology solutions.　　“We are delighted to be awarded this recognition of our expertise with NXP devices. NXP have long been the leader in embedded application processors and we are looking forward to using the power of the exciting new devices they are launching,” said ByteSnap director Dunstan Power, pictured.　　“ByteSnap Design, with its extensive experience in electronic board design and microprocessor software development, enables NXP’s customers to rapidly get from concept to end product with an optimised usage of the resources we are integrating in our high-performance application processors.” said Gérard Maniez, director of NXP’s third party technical support network.
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Release time：2017-09-30 00:00 reading：1674 Continue reading>>
3PEAK_Selection Guide ( download only for english page )
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3PEAK_Selection Guide ( download only for english page )

http://res.ameya360.com/basedata/oldassets/images/20171125/20171125161808_394.docx
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Release time：2017-10-02 00:00 reading：3679 Continue reading>>
Tessera Files Infringement Suits Against Samsung
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Tessera Files Infringement Suits Against Samsung

　　Intellectual property licensor Tessera Technologies Inc. said it initiated legal proceedings against South Korea's Samsung Electronics, alleging infringement of 24 patents covering a range of semiconductor processing, bonding and packaging technologies as well as imaging technologies.　　Tessera, a wholly owned subsidiary of Xperi Corp., said it filed the complaints in multiple venues, including the U.S. International Trade Commission, three U.S. federal district courts and some international jurisdictions.  Tessera maintains that Samsung infringes on the 24 patents in its semiconductors as Galaxy S6, S7, S8, and Note 8 smartphones, as well as other products.　　Tessera derives its revenue from licensing its technology for semiconductor packaging and image analysis to tech firms. The company is considered "a patent troll" by some in the industry.　　John Kirchner, Tessera's CEO, said in a statement that Samsung has been a Tessera customer since 1997, but that its most recent license agreement expired in December 2016. "We believe it is continuing to use our patented technologies without authorization, and without paying us fair compensation," Kirchner said.　　Kirchner said Tesera has been in talks with Samsung on the issues but that it felt like it had "no choice" but to initiate legal proceedings.　　Samsung did not immediately respond to a request for comment.
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Release time：2017-09-30 00:00 reading：1917 Continue reading>>
Samsung, Xilinx Back Programmable Chip Startup
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Samsung, Xilinx Back Programmable Chip Startup

　　Programmable logic vendor Xilinx Inc. and the venture capital arm of Samsung Electronics were among a handful of firms to provide $9.5 million in funding to Efinix, a developer of silicon-based programmable product platforms based in Silicon Valley.　　Efinix (Santa Clara, Calif.), founded in 2012, has raised a total of $16 million. The company says its Quantum programmable technology delivers a four-fold power, performance and area advantage over traditional technologies. The technology is based on what Efinix calls an XLR (exchangeable logic and routing) cell that can function as either a look-up table (LUT)-based logic cell or  routing switch encoded with a scalable, flexible routing structure.　　According to Efinix, this technology improves the active area utilization by 4X compared with traditional FPGAs, resulting in up to 4X area efficiency and 2X power consumption advantage.　　According to the company's website, Efinix is currently developing silicon products based on Quantum and expects to begin sampling in Decemeber of this year.　　The funding round was led by Xilinx and Hong Kong X Technology Fund, an investment firm supported by Sequoia Capital China and focused on fast-growing tech firms. Samsung Ventures, Hong Kong Inno Capital and Brizan Investments also participated in the funding round, according to Efinix.　　Sammy Cheung, co-founder, CEO, and president of Efinix, said in a press statement that the company plans to use the funding to launch a number of joint development projects in the coming months in addition to the chips.　　"High-volume applications and markets are prime targets for our Quantum-accelerated products," Cheung said.　　Also in the press statement, Salil Raje, senior vice president of the software and IP products group at Xilinx, said, "Efinix’s solution can address a wide variety of applications that are typically not served by today’s FPGAs."　　An unnamed representative from Samsung Ventures said Samsung envisions many applications that feature Quantum technology embedded inside ASICs, ASSPs or FPGAs.
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Release time：2017-09-30 00:00 reading：4279 Continue reading>>
Semiconductor Industry Backs Trump's Tax Reform Plan
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Semiconductor Industry Backs Trump's Tax Reform Plan

　　The semiconductor industry's largest trade association has come out in favor of a framework for revising the U.S. corporate tax structure released this week by the Trump Administration and Republican leaders in Congress.　　The framework — many details of which are still unknown — would reduce the U.S. corporate tax rate to 20 percent from the current 35 percent. This would be in line with Republicans' goal to cut the corporate tax rate below the 22.5 percent average in the industrialized world.　　The framework also calls for eliminating a 35 percent tax that multinational firms currently pay for bringing profits back to the U.S. from overseas.　　John Neuffer, president of the Semiconductor Industry Association (SIA), called the tax reform framework "a step forward to make the U.S. corporate tax system more competitive and allow U.S. semiconductor companies to continue to grow and innovate here at home."　　Neuffer said the plan would advance the U.S. semiconductor industry’s core priorities for tax reform, including a lower, globally competitive rate, a modern international tax system and strong R&D incentives.　　"While there are many details of importance to our industry that need to be fleshed out, we support the plan as a framework for advancing corporate tax reform," Neuffer said in a statement.
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Release time：2017-09-30 00:00 reading：1614 Continue reading>>
IBM Uses Deep Learning to Train Raspberry Pi
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IBM Uses Deep Learning to Train Raspberry Pi

　　Computations requiring high performance computing (HPC) power may soon be done in the palm of your hand thanks to work done this summer by IBM Research in Dublin, Ireland.　　While scientists have come a long away in teaching machines how to process images for facial recognition and understand language to translate texts, IBM researchers focused on a different problem: how to use artificial intelligence (AI) techniques to forecast a physical process. In this case, the focus was on ocean waves, using traditional physics-based models driven by external forces, such as the rise and fall of tides, winds blowing in different directions, the depth and physical properties of water influence the speed and height of the waves.　　HPC is normally essential to resolve the differential equations that encapsulate these physical processes and their relationships, and the expense often limits the spatial resolution, physical processes and time-scales that can be investigated by a real-time forecasting platform. In an interview with EE Times, IBM Research Senior Research Manager Sean McKenna said an HPC cluster using Big Iron has generally been the solution to dealing with the heavy computational load. IBM Research wanted to see if it could do the same work more quickly and more simply, he said.　　The differential equations approach has developed over the course of a century or more, he said. Machine learning through AI is not rule based. “It's non-linear mapping of one input space to an output space," McKenna said. "That's what everything is in AI right now."　　Researchers developed a deep-learning framework that provides a 12,000 percent acceleration over these physics-based models at comparable levels of accuracy. McKenna said the validated deep-learning framework can be used to perform real-time forecasts of wave conditions using available forecasted boundary wave conditions, ocean currents, and winds.　　“The deep learning method is more of a black box," he said. "It's a little bit of paradigm shift."　　Deep learning isn't about physical modeling and science to figure out what's leading to a set of results, it's about using engineering to solve a problem, and being able to do it more efficiently and faster, said McKenna. “We can build a model, train that model and put in on a more computationally-efficient device," he said.　　What is clear are the significant benefits. Massively reducing the computational expense means simulations can be done on a Raspberry Pi rather HPC infrastructure.　　The deep-learning framework was trained to forecast wave conditions at a case-study site at Monterey Bay, Calif., using the physics-based Simulating WAves Nearshore (SWAN) model to generate training data for the deep learning network. Driven by measured wave conditions, ocean currents from an operational forecasting system, and wind data, the model was run between the beginning of April 2013 and end of July 2017, generating forecasts at three-hour intervals to provide a total of 12,400 distinct model outputs. The study expands and builds on a collaboration between IBM Research-Ireland, Baylor University and the University of Notre Dame.　　The deep learning model has yet to be deployed to a physical device, said McKenna, but the study demonstrates that the reduction in computational expense means the simulation of a physics model could be done an Raspberry Pi or any other low-end computing device that's trained by HPC.　　“That opens up possibilities as to where that model can be deployed," McKenna said.　　Being able to accurately forecast ocean wave heights and directions are a valuable resource for many marine-based industries as they often operate in harsh environments where power and computing facilities are limited. One scenario includes a shipping company using highly accurate forecasts to determine the best voyage route in rough seas to minimize fuel consumption or travel time. A surfer could get data localized to a specific beach to ride the best waves, said McKenna.　　IBM Research's deep learning model could potentially be leveraged to use existing HPC infrastructure to train cheaper computing devices, even a smartphone, he said. “HPC resources are becoming more available in the cloud, so even if you don't own that resource you probably have access to it," he said.
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Release time：2017-09-29 00:00 reading：1533 Continue reading>>

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