Qualcomm and Other Major Players Unveil New Arm-Based Processors, Targeting a Slice of the PC CPU Market
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Qualcomm and Other Major Players Unveil New Arm-Based Processors, Targeting a Slice of the PC CPU Market

　　During the Snapdragon Summit 2023 in October, Qualcomm made a big announcement by introducing the Snapdragon X Elite chip, built on TSMC’s cutting-edge 4nm process. Qualcomm’s claim is bold; they assert that the chip will deliver superior performance compared to Intel’s x86 architecture and Apple’s M2 chip. Simultaneously, towards the end of October, Apple revealed its own Arm-based M3 chip. Notably, semiconductor giants AMD and NVIDIA are rumored to be exploring the development of new PC processors on the Arm architecture. The future outlook suggests that Arm-based processors may gradually cut in the market share traditionally held by x86 architecture processors.　　TrendForce’s Insights:　　Qualcomm’s New PC Processor Poised to Expand the Arm-Based PC Processor Market　　Following Intel’s September 2023 Meteor Lake processor release, Qualcomm introduced the Snapdragon X Elite, its latest Arm-based PC processor in October. This chip leverages TSMC’s advanced 4nm technology. Qualcomm is forging partnerships with Taiwanese heavyweights such as Quanta, Compal, Wistron, Acer, Asus, Realtek, Nuvoton and others, aiming to secure a foothold in the CPU market within the PC supply chain. This collaborative effort is expected to yield new PC products hitting the market in 2024.　　As of 2023, Arm commands approximately 11% of the market share. Apple, a pioneer in PC chips built on the Arm architecture, has seen success with the release of three generations of processors since the 2020 debut of M1 chip.　　With Qualcomm entering the Arm architecture group, AMD also intends to step into Arm architecture with the upcoming Phoenix processor, set for launch in 2025. There are also whispers of NVIDIA partnering with MediaTek to develop a chip processor featuring SoC+GPU capabilities on the Arm architecture, with an initial focus on ChromeBook market, where MediaTek boasts years of experience.　　In the PC market, significant factors include processor development timelines, product performance, power efficiency, extended battery life, and compatibility with software and hardware. High-end CPUs and GPUs have become indispensable components for high-end computers. Currently, Intel leads the CPU market, with AMD following closely in the x86 landscape. As more companies delve into the development of Arm-based processors, there is potential for them to carve a share from the x86 market in the future.　　Arm Architecture Processors Gain Momentum, Intel Focusing on AI Software Application Processor Development　　Apple’s M-series chips demonstrate their efficiency and extended battery life. Microsoft recognizes the advantages of the Arm architecture and is dedicated to fostering a strategic collaboration for Windows on Arm. This collaboration involves integrating operating systems with processors to attract leading manufacturers to engage in Arm-based processor development, aligning with the growing demands for AI PCs.　　In the realm of x86 architecture, Intel enjoys a dominant position in the CPU market. To tap into the opportunities arising from AI PCs, Intel has integrated AI acceleration engine features into its processors, introducing a new generation of AI application processors that combine CPU, GPU, and NPU (Neural Processing Unit) functionalities. This caters to the growing demand for generative AI applications in enterprise mobile PCs. Furthermore, Intel has joined forces with major laptop brands to launch new AI PCs, aiming to seize a substantial share of the market.　　As momentum grows in Arm-based processor development, Intel maintains confidence that their immediate effect on the demand for x86 architecture processors will be restrained. It is unlikely to hinder Intel’s continuous advancement in developing new processors. Unlike competitors concentrating on Arm architecture processor development, Intel places a stronger focus on AI software applications and the market opportunities arising from its partnership with the Microsoft platform.
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Release time：2023-11-07 14:45 reading：2505 Continue reading>>
Top 10 Processors CPU and GPU Chip Companies in China
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Top 10 Processors CPU and GPU Chip Companies in China

　　China is home to some of the leading processor chip manufacturers in the world. These companies are responsible for producing some of the most advanced and innovative CPU, GPU, FPGA, and ASIC chips available on the market. In this article, we will be discussing the top 10 processor chip companies in China. Let’s get started!　　1、Unigroup Guoxin Microelectronics Co., Ltd.　　Unigroup Guoxin Microelectronics Co., Ltd. focuses on the design and development of integrated circuits chips. It is a leading provider of integrated circuit chip products and solutions. Its products and applications are all over the world. Its core business areas such as chips, safe independent FPGA, power semiconductor devices, and ultra-stable crystal frequency devices have formed a leading competitive situation and market position.　　2、Hygon information Technology Co., Ltd.　　Hygon information Technology Co., Ltd. was established in 2014. It is mainly engaged in the research and development of computing chip products and systems such as high-end processors and accelerators. It aims to become a world-class chip company and provide core computing engines for Digital China.　　3、Amlogic(Shanghai) Co., Ltd.　　Amlogic is a world leading fabless semiconductor company that specializes in the design, development and application of high-performance, multimedia system-on-chip (SoC). As a result of its cutting-edge technologies and best-in-class solutions, it has actively expanded into new areas including smart vision, wireless connectivity and automotive electronics, ushering in a new era of smart life.　　By providing complete turnkey solutions in combination with industry-leading software and hardware technologies, including UHD multimedia processing, content security protection, advanced CPU and GPU, customers can rapidly optimize and develop market-leading products with state-of-the-art performance and power consumption.　　4、Hunan Goke Microelectronics Co., Ltd.　　Established in 2008, Goke Microelectronics Co., Ltd. has its headquarters in Changsha and subsidiary offices in Chengdu, Shanghai, Shenzhen, Beijing and Changzhou.GOKE spends more than 20% of its annual revenue on research and development.　　GOKE is committed to developing mass-volume integrated circuit solutions for storage,smart set-top boxes and IOT. It has introduced a series of products with in-house IP. These include ASICs and SOCs that incorporate the NDS advanced security decoder, the H.265 high-definition codec, high-performance acoustic processor, enterprise solid-state drive controller.　　5、Shanghai Fullhan Microelectronics Co., Ltd.　　Fullhan Microelectronics was established in April 2004 and focus on video semiconductor design.The mission of Fullhan is providing the most competitive chips and solutions for video products.　　Fullhan provides H.264 codec SoC,image signal processor IC and various solutions of video products.　　Fullhan works closely with solution providers and equipment manufacturers from domestic and worldwide to provide high performance, cost-effective products and services, increase market shares and achieve substantial business success.　　6、Shanghai Anlogic Infotech Co., Ltd.　　Shanghai Anlogic Infotech Co., Ltd. founded in November 2011, is a leading integrated circuit design company in China.　　The company has the independent research and development capabilities of FPGA chip hardware and FPGA compilation software, focusing on the development of general programmable logic chip technology and system solutions. The SALPHOENIX® high-performance product series, SALEAGLE® high-efficiency product series, SALELF® low-power product series and SALSWIFT® system chip series FPSoC® produced by the company have been successfully used in industrial control, consumer electronics, medical equipment, and networks with excellent quality. communications and other fields.　　7、Rockchip Electronic Co., Ltd.　　Rockchip Electronics Co., Ltd., established in 2001, is headquartered in Fuzhou, with branches and subsidiaries in Shenzhen, Shanghai, Beijing, Hangzhou, and Hong Kong. Rockchip is a leading fabless IC design company that focuses on Intelligent IoT.　　Rockchip specializes in SoC design, analog circuit chip design, and algorithm research. It has extensive experience in processor and analog-digital mixed chip design, multimedia processing, image algorithm. Rockchip has expertise in system software development. In addition to processor chips, it also provides full solutions including PMICs, analog-digital mixed chips, optoelectronic products, and development boards.　　8、Allwinner Technology Co., Ltd.　　Allwinner Technology, founded in 2007, is an outstanding designer dedicated to intelligent application SoC, high performance analog component and wireless connectivity IC. It is headquartered in Zhuhai China, with other R&D centers and offices in Shenzhen, Xi’an,Shanghai,Chengdu,Hengqin,Guangzhou,Beijing and HongKong,.　　Motivated by customer-oriented strategy, Allwinner aligns remarkable R&D teams with long-term core-technology investment in UHD video processing, high-performance multi-core CPU/GPU integration with AI and advanced manufacturing process in terms of high integration , ultra-low power consumption and full-stack integration platform, providing competitive turnkey solutions with considerate services. The products powered by Allwinner spread across from industry control, smart home, smart hardware, tablet, automotive electronics, robot, virtual reality, OTT box, wireless communication to analog products.　　9、Changsha Jingjia Microelectronics Co., Ltd.　　Changsha Jingjia Microelectronics Co., Ltd. was established in April 2006. It is committed to technology and comprehensive applications in the field of information detection, processing and transmission, and provides customers with highly reliable and high-quality solutions, products and supporting services.　　The company’s products cover integrated circuit design, graphics and image processing, computing and storage products, small radar systems, wireless communication systems, electromagnetic spectrum application systems, etc., and are widely used in professional fields such as aviation, aerospace, navigation, and vehicles that require high reliability.　　10、Loongson Technology Corparation　　In response to the demands for information development, Loongson Technology always stays abreast of international IT trends and focuses on industry development and system construction based on independent innovation. Until now, it has mastered core computing technologies on CPU instruction set architecture (ISA) design (LoongArch®), processor IP core, and operating system.　　On this basis, Loongson Technology strives to create an independent and open software and hardware ecosystem and information industry system so as to provide self-developed, safe, and reliable processors to meet national strategic needs as well as high-performance, low-cost processors and basic software and hardware solutions to boost the innovative development of the information industry.
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Release time：2023-10-19 14:23 reading：1624 Continue reading>>
Microchannels cool high performance <span style='color:red'>processors</span>
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Microchannels cool high performance processors

　　As part of the CarriCool project, Fraunhofer researchers have worked with IBM to develop what is said to be an effective method for cooling processors. According to the team, by integrating microchannels into the silicon interposer, a significant increase in performance can be achieved. Meanwhile, the team has also integrated passive components for voltage regulators, photonic ICs and optical waveguides into the interposer.　　The team, from Fraunhofer’s Institute for Reliability and Microintegration (IZM) in Berlin and Dresden developed an interposer with microchannel structures and hermetically sealed vias. The structure allows coolant to be pumped through the microchannels, channelling heat away from the processor.　　“Until now, the cooling structures have not been very close to the computer core itself, which means the coolers are mostly applied from above,” says Dr Hermann Oppermann, group leader at Fraunhofer IZM. “The closer you get to the heat source, the better the temperature can be limited or the output increased. In high performance computing in particular, data rates are increasing continuously. Therefore, it is important to have effective cooling in order to ensure a higher clock rate. Previous cooling systems were not so effective in this context. With this new cooling system, performance can be increased significantly.”　　The challenge was not only to integrate the small channels into the interposer, but also to seal them hermetically. The solution is an interposer featuring horizontal cooling channels and vertical channels for the electrical connections. In order to prevent contact between the water and the electrical vias, each individual contact is specially sealed.　　The researchers also integrated voltage regulators for the power supply, as well as optoelectronic components for data transmission into the interposer. “By combining interposer, cooling, voltage regulators and optical interconnection technology, we have reached a new level of integration that allows smaller circuits with more power,” said Dr Oppermann. “This is an important step in high-performance computing, as we achieve higher clock speeds in the same amount of space.”
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Release time：2017-10-16 00:00 reading：1148 Continue reading>>

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