Mazda and ROHM Begin Joint Development of Automotive Components Using Next-Generation S<span style='color:red'>emi</span>conductors
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Mazda and ROHM Begin Joint Development of Automotive Components Using Next-Generation Semiconductors

　　Mazda Motor Corporation (hereinafter “Mazda”) and ROHM Co., Ltd. (hereinafter “ROHM”) have commenced joint development of automotive components using gallium nitride (GaN) power semiconductors, which are expected to be the next-generation semiconductors.　　(Left) Ichiro Hirose, Director, Senior Managing Executive Officer and CTO of MAZDA / (Right) Katsumi Azuma, Member of the Board and Senior Managing Executive Officer of ROHM　　Since 2022, Mazda and ROHM have been advancing the joint development of inverters using silicon carbide (SiC) power semiconductors under a collaborative framework for the development and production of electric drive units. Now, they have also embarked on the development of automotive components using GaN power semiconductors, aiming to create innovative automotive components for next-generation electric vehicles.　　GaN is attracting attention as a next-generation material for power semiconductors. Compared to conventional silicon (Si) power semiconductors, GaN can reduce power conversion losses and contribute to the miniaturization of components through high-frequency operation.　　Both companies will collaborate to transform these strengths into a package that considers the entire vehicle, and into solutions that innovate in weight reduction and design. Mazda and ROHM aim to materialize the concept and unveil a demonstration model within FY2025, with practical implementation targeted for FY2027.　　“As the shift towards electrification accelerates in pursuit of carbon neutrality, we are delighted to collaborate with ROHM, which aims to create a sustainable mobility society with its outstanding semiconductor technology and advanced system solution capabilities, in the development and production of automotive components for electric vehicles” said Ichiro Hirose, Director, Senior Managing Executive Officer and CTO of Mazda. “We are excited to work together to create a new value chain that directly connects semiconductor devices and cars. Through collaboration with partners who share our vision, Mazda will continue to deliver products filled with the 'joy of driving' that allows customers to truly enjoy driving, even in electric vehicles.”　　“We are very pleased to collaborate with Mazda, which pursues the 'joy of driving,' in the development of automotive components for electric vehicles” said Katsumi Azuma, Member of the board and Senior Managing Executive Officer of ROHM. “ROHM's EcoGaN™, capable of high-frequency operation, and the control IC that maximizes its performance are key to miniaturization and energy-saving. To implement this in society, collaboration with a wide range of companies is essential, and we have established various partnerships for the development and mass production of GaN. By collaborating with Mazda, which aims to create 'cars that coexist sustainably with the earth and society,' we will understand the requirements for GaN from the perspective of application and final product development, contributing to the spread of GaN power semiconductors and the creation of a sustainable mobility society.”　　EcoGaN™ is a trademark or registered trademark of ROHM Co., Ltd.
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Release time：2025-03-31 15:46 reading：208 Continue reading>>
Valeo & ROHM S<span style='color:red'>emi</span>conductor co-develop the next generation of power electronics
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Valeo & ROHM Semiconductor co-develop the next generation of power electronics

　　Valeo, a leading automotive technology company, and ROHM Semiconductor, a major semiconductor and electronic component manufacturer, collaborate to propose and optimize the next generation of power modules for electric motor inverters using their combined expertise in power electronics management. As a first step, ROHM will provide its 2-in-1 Silicon Carbide (SiC) molded module TRCDRIVE pack™ to Valeo for future powertrain solutions.　　Valeo is broadening access to efficient, electrified mobility across various vehicle types and markets from the smallest one (ebikes), through the mainstream (passenger cars) to the biggest one (eTrucks). By combining Valeo’s expertise in mechatronics, thermal management and software development with ROHM’s power modules, Valeo drives the power electronics solution forward, contributing to the performance, efficiency, and decarbonization of automotive systems worldwide.　　Valeo and ROHM have been collaborating since 2022, initially focusing on technical exchanges aimed at improving the performance and efficiency of the motor inverter – a key component in the propulsion systems of electric vehicles (EVs) and plug-in hybrids (PHEVs). By refining power electronics, both companies aim to offer optimized cost/performance by delivering higher energy efficiency, reducing heat generation thanks to an optimized cooling and mechatronic integration, and increasing overall reliability with a SiC packaging.　　“This partnership marks, for Valeo Power Division, a significant step forward in delivering advanced and high-efficient power electronics,” says Xavier DUPONT, Valeo Power Division CEO. “Together, we aim to set new industry standards for high voltage inverters and accelerate the transition towards more efficient and affordable electric mobility.”　　“We are pleased to support Valeo, a renowned automotive supplier, with our power semiconductors. ROHM’s TRCDRIVE pack™ provides high power density, leading to an improved power efficiency. Together, we contribute to the development of highly efficient powertrains by fostering the collaboration with Valeo,” says Wolfram HARNACK, President ROHM Semiconductor GmbH.　　These evolutions are all essential to supporting the growing demand for longer range, faster charging capabilities, and, overall a high-performance and an affordable inverter for BEVs and PHEVs.　　Valeo will start supplying a first series project in early 2026. Valeo and ROHM will contribute to the improvement of efficiency and downsizing of Valeo’s next generation of xEV inverters.　　Background on the TRCDRIVE pack™　　TRCDRIVE pack™ is a trademark for the SiC molded module developed for traction inverter drives. This product features high power density and a unique terminal configuration – solving the key challenges of traction inverters in terms of miniaturization, higher efficiency, and fewer person-hours. Because SiC enables low-loss power conversion under high voltage conditions, combining Valeo's component technology, casing design and thermal management expertise with ROHM's power module creates a synergistic effect. Through both companies’ collaboration in automotive power electronics, they contribute to achieving a decarbonized society by enhancing the performance and efficiency of the motor inverter.　　More information is available via:　　https://www.rohm.com/news-detail?news-title=2024-06-11_news_trcdrive-pack&defaultGroupId=false　　TRCDRIVE pack™ are trademarks or registered trademarks of ROHM Co., Ltd.　　About Valeo　　Valeo is a technology company and partner to all automakers and new mobility players worldwide. Valeo innovates to make mobility safer, smarter and more sustainable. Valeo enjoys technological and industrial leadership in electrification, driving assistance systems, reinvention of the interior experience and lighting everywhere. These four areas, vital to the transformation of mobility, are the Group's growth drivers.　　Valeo in figures: 22 billion euros in sales in 2023 | 109 600 employees, 28 countries, 159 plants, 64 research and development centers and 19 distribution platforms at June 30, 2024.　　https://www.valeo.com/　　Valeo is listed on the Paris stock Exchange.
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Release time：2024-11-29 10:49 reading：362 Continue reading>>
Renesas and Indian Institute of Technology Hyderabad Sign Agreement to Accelerate India’s S<span style='color:red'>emi</span>conductor Independence
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Renesas and Indian Institute of Technology Hyderabad Sign Agreement to Accelerate India’s Semiconductor Independence

　　TOKYO, Japan and HYDERABAD, India, June 05, 2024 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and the Indian Institute of Technology Hyderabad (IITH) have signed a three-year memorandum of understanding (MOU) for research and collaboration in the field of VLSI and embedded semiconductor systems. The engagement with IITH professors and staff will focus on R&D and academic interactions with a goal to drive innovation in India’s semiconductor industry and advance the nation’s “Make in India” strategy.　　The signing ceremony of the agreement was held on June 3, 2024 at the IITH in Telangana state between Malini Narayanamoorthi, Country Head of India and Senior Director of Engineering, Analog & Connectivity Product Group, Renesas, and Prof. B.S. Murty, Director, IITH.　　The MOU will help the IITH foster talent development in support of India’s ambition to build a self-reliant semiconductor industry while enabling Renesas to add talented employees in India through closer collaboration with the country’s educational institutions to capture huge market opportunities.　　Under the MOU, Renesas this year will begin supporting university course curriculum development, hands-on learning using Renesas development boards and various outreach programs designed to advance lab work and proof-of-concept projects. IITH engineering students will be eligible to apply for six-month Renesas internships and pursue full-time employment with the company.　　“India holds significant importance within our business operations, and we appreciate its dynamic innovation environment and strong potential for growth,” said Julie Pope, Senior Vice President and Chief Human Resources Officer, Renesas. “We are delighted to partner with IITH in its goal to be the cradle for semiconductor innovation in India. We aim to strengthen India's semiconductor product ecosystem, and support the “Make in India” objective of providing increasing semiconductor content for India and the world.”　　“Recognizing the importance of India at the forefront of the semiconductor industry in influencing the future, our collaboration with Renesas will provide a chance for our students to gain exposure and learn directly from Renesas experts about constructing products with cutting-edge technologies. IITH is pioneering several initiatives to foster talent development in Electronic System Design and Manufacturing (ESDM) sector across India. This synergistic collaboration is a booster to that effort. This is also a pathway for R&D collaboration as IITH boasts several expert faculty spanning across several departments who can co develop next generation electronic products with Renesas,” said Prof. B.S. Murty, Director, IITH. “The opportunity for employment at a leading global company is a tremendous additional benefit.”　　About Renesas Electronics Corporation　　Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.　　About IIT Hyderabad　　Indian Institute of Technology Hyderabad (IITH) is one of the eight IITs established by the Government of India in 2008. In a short span of 15 years, the institute has become one of the top-ranked institutions in the country and has received global recognition. It has 300+ full-time faculty, 4,700+ students (60% of them being PG+PhD students), 18 Departments + 1 Centre for Interdisciplinary Programs, nearly 500+ state-of-the-art Research Facilities, and five research and entrepreneurship centres. The institute has a strong research focus with approx. Rs. 1,100+ Cr of sanctioned research funding (Rs. 250+ Cr in 2023-24). IITH has more than 10,500+ research publications with 1,60,000+ Citations, 275+ Published Patents, 3,700+ sponsored/consultancy projects with 500+ running projects, and about 190+ startups that have generated 1,100+ jobs and a revenue of Rs. 1,500+ Cr.
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Release time：2024-06-12 13:37 reading：1230 Continue reading>>
Analogy S<span style='color:red'>emi</span> wins
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Analogy Semi wins "The Best New Company of the Year Award"

　　中国IC设计初创公司类比半导体凭借出色的产品和创新能力，在2023年中国半导体投资联盟(CSIA)年会暨中国集成电路大会上成为荣获“年度最佳新公司奖”的10家公司之一最高奖颁奖典礼于12月17日在中国东部安徽省合肥市举行。　　获奖公告显示，Analogy Semi凭借其技术优势和创新能力，在2022年推出了多款新产品，涵盖模拟前端(AFE)、线性产品、电源管理、数据转换器等，获得了客户的高度认可。　　例如，其锂电池AFE产品在2022年获得了该细分市场大多数客户的设计胜利。Analogy Semi的AFE芯片服务的公司包括CATL(宁德时代)、EVE Energy(亿纬锂能)和LG等公司。　　同时，公司还发布了汽车级智能驱动器DR70xQ芯片，广泛应用于汽车、电子驻车制动(EPB)等系统。该产品实现了国内突破，解决了我国汽车芯片短缺的问题。　　上海IC设计公司Analogy Semi成立于2018年，主要从事工业、通信、医疗和汽车市场信号链、电源管理和MCU/DSP领域的模拟和混合信号芯片设计。　　年度最佳新公司奖旨在表彰具有关键技术和较强创新能力的中国半导体行业顶尖新兴企业。今年共有10家企业获奖。
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Release time：2024-05-07 14:26 reading：658 Continue reading>>
murata：Cutting Edge Ceramic Catalyst Material Cuts Emissions and Eliminates Precious Metal Reliance
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murata：Cutting Edge Ceramic Catalyst Material Cuts Emissions and Eliminates Precious Metal Reliance

　　Murata is pleased to announce a revolutionary ceramic catalyst material designed to reduce the impact of industrial gas exhaust systems. A Chinese manufacture (F-Tech), called Shanghai FT Technology Co., Ltd, makes and sells ceramic catalysts using this material. Unlike traditional catalysts in exhaust treatment systems, this ceramic solution does not contain any precious metals, and it significantly reduces both the consumption of the natural gas used for treatment and CO2 emissions.　　Across a wide range of industrial production processes, exhaust gasses must be treated in order to prevent harmful particulate matter from entering the atmosphere. In many applications, regenerative thermal oxidizers (RTO) are used to decompose, and therefore treat, the exhaust gas by burning it with natural gas, eliminating volatile organic compounds (VOCs), hazardous air pollutants (HAPs) and odorous emissions produced during industrial processes.　　Given the rise in natural gas prices and the urgent need to prioritize global sustainability, industrial production facilities are now more determined than ever to find ways to decrease their fuel consumption and reduce their carbon footprint.　　Built from Murata’s extensive ceramic capacitor knowledge, the catalyst exhibits exceptional heat resistance and can be used to treat highly concentrated exhaust gas. In terms of performance, by installing Murata’s ceramic catalyst into an existing exhaust gas treatment equipment the set temperature can be lowered from around 850°C to 700°C. Through the reduction in the set temperature system, heat loss is reduced and the Self-combustion rate is increased, reducing natural gas consumption by up to 53% (Figure 1).　　Figure 1 - And RTO with the ceramic catalyst can offer a significant reduction in natural gas consumption (Source: Murata)　　Additionally, this change in operational conditions results in a decrease in CO2 emissions originating from natural gas usage, contributing to a decrease in environmental impact, as well as significantly lowering running costs.　　The ceramic material also brings a number of advantages. Primarily, the initial system cost is far more predictable, free from the price fluctuations seen with precious metals. Furthermore, the performance of precious metal catalysts can become compromised when subjected to extremely high temperatures, as the active element can move and group into larger clusters. This process, referred to as sintering, reduces the number and area of active sites and deteriorates the catalyst’s performance. Alternatively, ceramic catalyst materials have active elements dispersed in their crystal structure and do not degrade even in high-temperature operation, leading to an extended lifespan compared to precious metal catalysts.　　In real-world applications at both Murata’s manufacturing and partner sites the ceramic catalyst has had a significant impact on the environmental impact of RTO systems and operating costs, with the installation at Wuxi Murata Electronics Co. achieving full system payback in just 13 months.　　“With Murata’s patented ceramic catalyst material, we have taken our extensive ceramic capacitor knowledge and applied it to another market to create a truly innovative solution,” said Koichi Kawakita, Vice President Manufacturing Group Ceramic Capacitor Business Unit. He continued, “In terms of operation, it can help factory designers and exhaust gas treatment manufacturers achieve significant reductions in natural gas consumption and carbon emissions, while also cutting dependence on precious metals.”　　Production is now underway and engineering samples are available for both the 100cpsi and 200cpsi variants.
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Release time：2024-04-15 14:05 reading：486 Continue reading>>
GigaDevice：Introducing the GD32E235 series: The Pr<span style='color:red'>emi</span>er Choice for Entry-Level Applications
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GigaDevice：Introducing the GD32E235 series: The Premier Choice for Entry-Level Applications

　　GigaDevice has officially announced the expansion of their Cortex®-M23 core product lineup with the introduction of the cost-effective GD32E235 series MCU. Since its debut in 2018, the Arm® Cortex®-M23 core GD32E230 series MCU, the first product in the series, has successfully replaced Cortex®-M0/M0+ products in various market segments with its outstanding cost-performance advantages. It has garnered significant market share and industry recognition, earning the trust and support of a broad user base. Expanding upon the strengths of its predecessor, the new generation GD32E235 MCU boasts improved performance and competitive pricing. It is positioned to become the preferred choice for entry-level development across a wide array of applications including motor control, portable devices, industrial automation, household appliances, power tools, and smart homes.　　The GD32E235 series MCU, powered by the Arm® Cortex®-M23 core, operates at clock frequencies of up to 72MHz. It comes equipped with embedded flash memory ranging from 16 KB to 128 KB and SRAM from 4 KB to 16 KB. With expanded storage capacity compared to the GD32E230 series, it can meet the growing storage space requirements in applications such as communication modules, graphic displays, wireless detectors, and other scenarios. The GD32E235 series MCU integrates multiple general-purpose interfaces, including two USART, two SPI, two I2C interfaces, and one I2S interface. Additionally it provides a 12-bit ADC, a comparator, as well as other analog peripherals. Compared to the GD32E230 series, the ADC of the GD32E235 series has enhanced stability and consistency, making it suitable for industrial applications requiring mixed-signal processing and motor control. In addition, it features five 16-bit general-purpose timers, a 16-bit advanced timer, and a 16-bit basic timer. Furthermore, the GD32E235 series MCU can meet the high reliability requirements for products in extreme or harsh conditions with its excellent electrostatic protection and anti-interference capabilities.　　Maintaining perfect software code and hardware pin compatibility with the existing GD32E230 series and the GD32F3x0 series, the GD32E235 series MCU provides developers with development documents such as "Porting from GD32E230 series to GD32E235 series" and "Differences between GD32E235 and GD32E230 series", facilitating seamless product transitions for developers. Furthermore, inheriting the comprehensive ecosystem of GD32, the GD32E235 series MCU offers various debugging and mass production tools, detailed technical documentation, and a comprehensive software and hardware platform, along with other development resources. The associated documentation and software libraries have been uploaded to the official website for user access and download.　　With seven packaging options comprising a total of 22 models, including LQFP48/32, QFN48/32/28, TSSOP20, and LGA20, the GD32E235 series MCU is now officially in mass production and available for purchase. A range of supporting development tools tailored to different packages and pin configurations have been simultaneously released, including the GD32E235C-EVAL full-featured evaluation board and entry-level learning kits such as GD32E235K-START, GD32E235G-START, GD32E235F-START, and GD32E235V-START, providing users with convenient development and debugging experiences.　　About GigaDevice　　GigaDevice Semiconductor Inc. (SSE Stock Code 603986) is a leading global fabless supplier. The company was founded in April 2005 with branch offices in many countries and regions worldwide, providing local support at customers' fingertips. Committed to building a complete ecosystem with major product lines – Flash memory, MCU, sensor, and power as the core driving force, GigaDevice can provide a wide range of solutions and services in the fields of industrial, automotive, computing, consumer electronics, IoT, mobile, networking, and communications. GigaDevice management system has achieved ISO 9001:2015 and ISO 14001:2015 certifications. Constantly looking to expand the technology offering to customers, GigaDevice has also formed multiple strategic alliances with leading foundries, assembly, and test plants to streamline supply chain management. 
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Release time：2024-03-28 13:48 reading：1211 Continue reading>>
CG Power and Industrial Solutions Limited, Renesas and Stars Microelectronics, to Jointly Build Outsourced S<span style='color:red'>emi</span>conductor Assembly and Test Facility in India
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CG Power and Industrial Solutions Limited, Renesas and Stars Microelectronics, to Jointly Build Outsourced Semiconductor Assembly and Test Facility in India

　　CG Power and Industrial Solutions Limited (“CG”), a part of Tube Investments of India Limited and the Murugappa Group; Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions; and Stars Microelectronics (Thailand) Public Co. Ltd (“Stars Microelectronics”), a Thailand-based Outsourced Semiconductor Assembly and Test (OSAT) provider; had recently signed a Joint Venture Agreement (JVA) to establish a Joint Venture (JV) to build and operate an OSAT facility in India. The Union Cabinet, chaired by Prime Minister Shri Narendra Modi, approved the project of the JV under India’s Semiconductor scheme on February 29, 2024.　　The JV brings together unique capabilities of the partners with a vision to “Make in India for the World.” CG, with around 86 years of manufacturing expertise, is keen to build semiconductor capabilities and ecosystem in India. Renesas, a leading semiconductor company headquartered in Japan, will provide advanced semiconductor technology and expertise. Stars Microelectronics, a Thai based OSAT, will provide both technology for legacy packages and training and enablement.　　The JV will be 92.3% owned by CG, with Renesas and Stars Microelectronics each holding equity capital of approximately 6.8% and 0.9%, respectively. The JV plans to invest INR 7,600 crores over a five-year period, which will be financed through a mix of subsidies, equity, and potential bank borrowings as required.　　The JV will set up a state-of-the-art manufacturing facility in Sanand, Gujarat, with a capacity that will ramp up to 15 million units per day. The JV will manufacture a wide range of products – ranging from legacy packages such as QFN and QFP to advanced packages such as FC BGA, and FC CSP. The JV will cater to industries such as automotive, consumer, industrial, 5G, to name a few.　　Commenting on this new venture, Mr. S. Vellayan, Chairman, CG Power and Industrial Solutions Limited, said, “CG’s entry into the semiconductor manufacturing marks a strategic diversification for us. Our partners, Renesas and Stars Microelectronics, will make our learning curves steeper and help us focus on innovation and excellence.　　This is a very exciting phase for the entire nation, and we are very keen to build out India’s semiconductor capability and ecosystem.”　　Mr. Natarajan Srinivasan, Managing Director, CG Power and Industrial Solutions Limited, added, “It is a matter of great pride for CG to implement this project of National importance.”　　Commenting on the partnership, Mr. Hidetoshi Shibata, CEO of Renesas said, “India is a critical part of Renesas’ business. We value its innovative landscape and robust potential growth and are committed to accelerating our investment in India. By partnering with the Murugappa Group and Stars Microelectronics, we will bolster India’s semiconductor ecosystem and address the growing semiconductor demand for the customers worldwide.”　　Mr. Prompong Chaikul, Chairman of Executive Committee of Stars Microelectronics (Thailand) Public Co., Ltd added, "We are deeply honored to join forces in this thrilling venture. Leveraging our expertise and experience in OSAT, we are committed to providing robust support to ensure the success of this project in India."　　About CG Power and Industrial Solutions Limited　　CG Power and Industrial Solutions Limited is an engineering conglomerate headquartered in Mumbai, India. The Company is a leader in the Electrical Engineering Industry and has two business lines—Industrial Systems and Power Systems. It manufactures Traction Motors, Propulsion systems, Signaling Relays etc., for the Indian Railways, and wide range of Induction Motors, Drives, Transformers, Switchgears, and other allied products for the Industrial and Power sectors. Recently, the Company also made a foray into the business of Consumer Appliances such as Fans, Pumps and Water Heaters.　　The Company has world-class manufacturing plants across 9 locations in India and one in Sweden, and a Pan India network of 4 Regional and 15 Branch offices, with around 3000 employees. The Company’s consolidated revenue for FY23 was Rs 6,973 crores (USD 838 million).　　The Company continues to excel and maintain its leadership position across its businesses, backed by its outstanding expertise, customer-centric approach, and enhanced focus on innovation and sustainability.　　Since November 2020, the Company has become a part of the renowned Murugappa Group.　　About Murugappa Group　　A 123-year-old conglomerate with presence across India and the world, the INR 742 billion Murugappa Group has diverse businesses in agriculture, engineering, financial services and more.　　The Group has 9 listed companies under its umbrella — Carborundum Universal Limited, CG Power & Industrial Solutions Limited, Cholamandalam Financial Holdings Limited, Cholamandalam Investment & Finance Company Limited, Cholamandalam MS General Insurance Company Limited, Coromandel International Limited, EID Parry (India) Limited, Shanthi Gears Limited, Tube Investments of India Limited and Wendt India Limited. Brands such as Ajax, Hercules, BSA, Montra, Montra Electric, Mach City, Gromor, Paramfos, Parry’s are part of the Group’s illustrious stable.　　Abrasives, technical ceramics, electro minerals, electric vehicles, auto components, fans, transformers, signaling equipment for railways, bicycles, fertilizers, sugar, tea and several other products make up the Group’s business interests.　　Guided by the five lights — integrity, passion, quality, respect and responsibility — and a culture of professionalism, the Group has a workforce of over 73,000 employees.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation  empowers a safer, smarter and more sustainable future where technology helps make our lives easier. The leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.
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Release time：2024-03-05 13:10 reading：2541 Continue reading>>
3PEAK Wins Prestigious VDE Pr<span style='color:red'>emi</span>um Quality Award!
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3PEAK Wins Prestigious VDE Premium Quality Award!

　　On December 5, 3PEAK was honored with the Premium Quality Award by the Verband Deutscher Elektrotechniker (VDE), an internationally renowned and authoritative testing and certification organization.　　This award reflects 3PEAK's commitment to providing reliable, high-quality, and high-standard products and services to its global customers. Dr. Ying Feng, a co-founder of 3PEAK, and Mr. Wu Zhongxuan, General Manager of VDE China, along with representatives from both parties, attended the award ceremony. Additionally, they engaged in thorough discussions on industry insights and future collaboration, exploring new opportunities to jointly drive the high-quality advancement of 3PEAK's products and serve their global customers.　　VDE Safety Certification　　VDE, with a history spanning over 125 years, has always been at the forefront in its field, setting standards, promoting safety, and driving innovation. As a globally authoritative testing and certification body and standard setter, VDE is dedicated to fostering cross-disciplinary development in electrical engineering and electronic information technology. It promotes the growth of innovative applications, offering high-quality technical exchanges, education and training, standard setting, and professional testing and certification services. VDE ensures the safety and efficiency of electronic and electrical equipment usage, safeguarding high-quality living standards. VDE safety certification is highly regarded internationally in the electrical and electronics industry. It is widely recognized and respected by manufacturers and official bodies in Europe and globally for its credibility and authority.　　Since 2020, 3PEAK and VDE have collaborated on product exchanges and cooperation in isolation series products. To date, several categories have undergone VDE safety certification, including basic digital isolators, enhanced digital isolators, isolated CAN, isolated I2C, isolated ADC, isolated RS-485, isolated operational amplifiers, and isolated drivers. Furthermore, 3PEAK has established a Time-Dependent Dielectric Breakdown (TDDB) lab specially for isolation series products. The lab houses the high-voltage TDDB test system independently developed by 3PEAK. This system can implement 24/7 fully automatic TDDB testing for isolation products for months or even longer.
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Release time：2024-01-11 17:52 reading：2606 Continue reading>>
NOVOSENSE Won VDE Pr<span style='color:red'>emi</span>um Quality Award for High Quality Development
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NOVOSENSE Won VDE Premium Quality Award for High Quality Development

　　VDE (Verband Deutscher Elektrotechnikere), an internationally recognized testing and certification organization, was invited to visit NOVOSENSE's Shanghai office and presented NOVOSENSE with the Premium Quality Award, which fully affirmed NOVOSENSE's outstanding achievements in the field of quality over the years. NOVOSENSE CTO, Sheng Yun, and General Manager of VDE China, Wu Zhongxuan, together with representatives from both parties, attended the award ceremony and had in-depth exchanges on future cooperation.　　Left: NOVOSENSE CTO, Sheng Yun; Right: General Manager of VDE China, Wu Zhongxuan　　As one of the first chip companies in China to apply for VDE certification, NOVOSENSE started its cooperation with VDE on safety certification of isolation series products in 2017. In 2020, NOVOSENSE's isolation series products successfully passed the VDE reinforced isolation certification, becoming the first IC company in China to pass the VDE reinforced isolation certification, which allows it to help customers pass the isolation certification access standard in the European market more easily and thus better support customers' products to go global. Up to now, NOVOSENSE has obtained 3 VDE certificates covering nearly 700 products, and is in a leading position in the industry.　　Wu Zhongxuan, General Manager of VDE China remarked, "China's IC industry has witnessed rapid development in recent years. With the continuous progress of the industry and the requirements for transformation and upgrading as well as quality and efficiency improvement in all walks of life, end customers' pursuit of chip quality in systems has also reached a new level. We see that NOVOSENSE maintains a consistent focus on product quality. VDE is honored to support NOVOSENSE in terms of safety certification and to further help a wider customer base quickly pass the relevant certification requirements in global markets and capture the best market windows."　　Sheng Yun, NOVOSENSE CTO remarked, "VDE provides NOVOSENSE with professional guidance and references in product safety certification, enabling us to benchmark against world-class standards at the product definition stage and driving our continuous innovation at the product level. NOVOSENSE always adheres to the quality policy of 'Robust and Reliable', and we hope to provide safe, stable, reliable and high-quality chip products to our global customers with the support of VDE's authoritative certification, and to go global with our partners with high quality."　　About VDE:　　VDE (Verband Deutscher Elektrotechnikere) has a long history of more than 130 years. Since its inception, VDE has been at the forefront of setting standards, promoting safety and driving innovation in related fields. As an internationally authoritative testing and certification organization and standard setter, VDE aims to promote the cross-field development of electrical engineering and electronic information technology, advance the technological development of innovative applications, provide high-quality technical exchanges, education and training, standard setting as well as professional testing and certification services, and ensure the safe and efficient use of electronic and electrical equipment as well as the high quality of life.
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Release time：2024-01-04 13:58 reading：2878 Continue reading>>
Earthquake Temporarily Halts Silicon Wafer, MLCC, and S<span style='color:red'>emi</span>conductor Facilitie sin Japan, Impact Expected to be Controllable, Says TrendForce
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Earthquake Temporarily Halts Silicon Wafer, MLCC, and Semiconductor Facilitie sin Japan, Impact Expected to be Controllable, Says TrendForce

　　TrendForce’s investigation into the impact of the recent strong earthquake in the Noto region of Ishikawa Prefecture, Japan, reveals that several key semiconductor-related facilities are located within the affected area. This includes MLCC manufacturer TAIYO YUDEN, silicon wafer (raw wafer) producers Shin-Etsu and GlobalWafers, and fabs such as Toshiba and TPSCo (a joint venture between Tower and Nuvoton).　　Given the current downturn in the semiconductor industry and the off-peak season, along with existing component inventories and the fact that most factories are located in areas with seismic intensities of level 4 to 5—within the structural tolerance of these plants—preliminary inspections indicate no significant damage to the machinery, suggesting the impact is manageable.　　In terms of silicon wafer production, Shin-Etsu and GlobalWafers' facilities in Niigata are currently shut down for inspection. The crystal growth process in raw wafer manufacturing is particularly sensitive to seismic activity. However, most of Shin-Etsu's crystal growth operations are primarily in the Fukushima area, thus experiencing limited impact from this earthquake. SUMCO reported no effects.　　On the semiconductor front, Toshiba's Kaga facility in the southwestern part of Ishikawa Prefecture is currently undergoing inspections. This site includes a six-inch and an eight-inch factory, along with a twelve-inch facility slated for completion in the 1H24. Additionally, the three TPSCo factories in Uozu, Tonami, and Arai—co-owned by Tower and Nuvoton (formerly Panasonic)—are all undergoing shutdowns for inspections. In contrast, USJC (UMC's acquisition of the Mie Fujitsu plant area in 2019) was not affected.　　MLCC manufacturer TAIYO YUDEN’s new Niigata plant, designed to withstand seismic activity up to level 7, reported no equipment damage. Murata (MLCC fabs only) and TDK’s MLCC plants experienced seismic intensities below level 4 and were not notably affected. However, Murata’s other factories (Non-Production MLCC) in Komatsu, Kanazawa, and Toyoma, which are in the areas with seismic intensity above 5, were closed for the New Year holiday, and staff are currently assessing any damage.
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Release time：2024-01-03 16:49 reading：1647 Continue reading>>

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