Commercialized high precision agricultural CO2 sensors with superior long-term stability
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Commercialized high precision agricultural CO2 sensors with superior long-term stability

　　Murata Manufacturing Co., Ltd. (hereinafter "Murata") has commercialized "IMG-CA0012-12" (hereinafter "this product"), a case and cable type CO2 sensor. This high precision product primarily connects to environment measurement equipment in agricultural greenhouses and stably measures CO2 concentration. Through linkage with photosynthesis accelerators, this product will contribute to improving crop quality and increasing yield. Additionally, it improves energy efficiency by injecting an optimal amount of CO2 at an optimal timing. Mass production and supply for this product has begun in Hakui Murata Manufacturing.　　In the field of agriculture, increased yield and quality improvement per unit area are required since there is a reduction in yield and decline in quality due to global warming as well as a drop in agricultural worker population. Technology for accelerating crop photosynthesis using CO2 application is an effective means of addressing these challenges. Furthermore, due to the recent increase in energy costs, effective CO2 application based on environmental data measurements is crucial. As a result, high-precision CO2 sensors, which offer long-term stability, require no calibration, and are resistant to malfunction, play a crucial role in photosynthesis accelerator technology.　　This product is equipped with an automatic calibration function that runs on our unique calibration curve algorithm and dual wavelength (for measurement and reference) NDIR*1. Therefore, atmospheric calibration is not required. This ensures high precision and long-term stability, making it maintenance-free. Furthermore, its case and cable type design enhances user handling and ease of installation.　　*1NDIR: Non-Dispersive Infrared Absorption　　Specifications　　CO2 sensors were installed in greenhouses and were used for a year for tomato cultivation and 2 years for rose cultivation. After use, CO2 concentration characteristics and temperature characteristics were evaluated.　　It was discovered that CO2 concentration differences were minimal even when they were used for a long period of time in actual fields.　　CO2 concentration characteristics　　Temperature characteristics
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Release time：2025-04-02 15:44 reading：196 Continue reading>>
ROHM and TSMC Launch Strategic Gallium Nitride Technology Collaboration for Automotive Industry
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ROHM and TSMC Launch Strategic Gallium Nitride Technology Collaboration for Automotive Industry

　　ROHM Co., Ltd. (ROHM) announced today that ROHM and TSMC have entered a strategic partnership on development and volume production of gallium nitride (GaN) power devices for electric vehicle applications.　　The partnership will integrate ROHM's device development technology with TSMC's industry-leading GaN-on-silicon process technology to meet the growing demand for superior high-voltage and high-frequency properties over silicon for power devices.　　GaN power devices are currently used in consumer and industrial applications such as AC adapters and server power supplies. TSMC, a leader in sustainability and green manufacturing, supports GaN technology for its potential environmental benefits in automotive applications, such as on-board chargers and inverters for electric vehicles (EVs).　　The partnership builds on ROHM and TSMC’s history of collaboration in GaN power devices. In 2023, ROHM adopted TSMC’s 650V GaN high-electron mobility transistors (HEMT), whose process is increasingly being used in consumer and industrial devices as part of ROHM's EcoGaN™ series, including the 45W AC adapter (fast charger) "C4 Duo" produced by Innergie, a brand of Delta Electronics, Inc.　　"GaN devices, capable of high-frequency operation, are highly anticipated for their contribution to miniaturization and energy savings, which can help achieve a decarbonized society. Reliable partners are crucial for implementing these innovations in society, and we are pleased to collaborate with TSMC, which possesses world-leading advanced manufacturing technology" said Katsumi Azuma, Member of the Board and Senior Managing Executive Officer at ROHM. “In addition to this partnership, by providing user-friendly GaN solutions that include control ICs to maximize GaN performance, we aim to promote the adoption of GaN in the automotive industry."　　“As we move forward with the next generations of our GaN process technology, TSMC and ROHM are extending our partnership to the development and production of GaN power devices for automotive applications,” said Chien-Hsin Lee, Senior Director of Specialty Technology Business Development at TSMC. “By combining TSMC's expertise in semiconductor manufacturing with ROHM's proficiency in power device design, we strive to push the boundaries of GaN technology and its implementation for EVs.”　　About TSMC　　TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.　　        TSMC deployed 288 distinct process technologies, and manufactured 11,895 products for 528 customers in 2023 by providing broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan.　　EcoGaN™ is a trademark or registered trademark of ROHM Co., Ltd.
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Release time：2025-04-02 15:36 reading：224 Continue reading>>
Renesas Introduces Highly Integrated LCD Video Processor that Enables Next-Generation ASIL B Automotive Display Systems
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Renesas Introduces Highly Integrated LCD Video Processor that Enables Next-Generation ASIL B Automotive Display Systems

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RAA278830 Video Diagnostics Bridge IC, a highly integrated dual Low-Voltage Differential Signal (LVDS) LCD video processor. The new IC integrates many of the features necessary to design ISO 26262-compliant ASIL B automotive display systems such as heads-up-displays (HUD), digital instrument clusters, camera monitor systems (CMS), and electronic mirrors.　　As automotive safety systems are increasingly dependent on display systems, it has become more critical that clear, uncorrupted images be presented to the driver. Missing frames, frozen images, and even incorrect warning icons can seriously compromise driver safety. The RAA278830 addresses these concerns with Functional Safety features built into the device specifically to avoid any corruption of images through monitoring of the signal integrity as well as the video content itself. The internal diagnostics and measurement engines can detect frozen video, incorrect colors, broken or corrupt video images, as well as flashing, flickering, and video images that could obstruct the driver’s view of the road (in the case of HUD systems).　　Renesas’ Automotive Video Signal Processing Expertise　　Renesas has a long and successful track record of providing video signal processing solutions for the automotive market. In addition to standard analog video decoders, Renesas offers the award-winning Automotive HD-Link (AHL) family of products that enables high-resolution images to be transported over low-cost cables and connectors. The RAA278830 adds to Renesas’ leading line of integrated LCD controllers that have been implemented worldwide.　　Key Features of the RAA278830　　Dual Open-LDI Input/Output　　ISO 26262 Functional Safety ASIL B rating　　CRCs, parity, BIST, and redundancy safety mechanisms implemented throughout the entire data path　　Video Diagnostic Capabilities　　Input/Output monitoring of video timing, signal integrity, and content　　Flickering, flashing, occlusion, and glare detection　　Spread Spectrum for lower system level EMI profile　　Image enhancement engine for superior image quality　　Dual host interface: I2C & SPI (configurable)　　SPI-Flash based OSD as well as an embedded font based OSD　　SPI boot capability (boot from SPI Flash, no MCU needed)　　Supports multi-bank for fail-safe OTA updates　　Space-efficient 72SCQFN, 10mm x 10mm　　AEC-Q100 Grade 2 qualified　　“Our automotive customers have consistently asked us to add functional safety features to our industry-leading video processing technology,” said Jason Kim, Vice President and General Manager of the Configurable Mixed-Signal Division at Renesas. “The RAA278830 delivers all of the features needed to create safe, easy-to-implement and economical LCD display for all types of passenger vehicles.”
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Release time：2025-04-01 14:36 reading：215 Continue reading>>
ROHM Develops a New Compact Thermal Printhead for A4-Sized Mobile Printers
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ROHM Develops a New Compact Thermal Printhead for A4-Sized Mobile Printers

　　ROHM has developed a new thermal printhead - KA2008-B07N70A - compatible with a 2-cell Li-ion battery (7.2V). Designed to deliver high print quality with low power consumption and optimized for A4 size printers (210mm width). Height has been reduced by approximately 16% from the conventional 14mm to a best-in-class* 11.67mm – contributing to a more compact printer design. Moreover, optimizing the heating element structure while improving the driver IC and wiring layout enables the support for 7.2V operation – reducing the applied energy required for printing by approximately 66% compared to conventional 12V drive (at 50 mm/s print speed). Adjustments to the individual wiring of the resistive elements ensure uniform heat generation, stabilizing print quality and enabling sharp and high-resolution 203dpi printing – even at speeds up to 100 mm/s.　　In recent years, the thermal printer market has been expanding in response to increasing demand to print qualified invoices and customs labels fueled by the growth of overseas e-commerce, as well as prescriptions and drug information sheets in hospitals and pharmacies. The demand for mobile printers has surged, particularly in the logistics and business sectors, where portability and ease of maintenance are highly valued. Among these trends, the adoption of A4-sized thermal printers has been growing in Asian markets, particularly in China – driving the need for 8-inch thermal printheads.　　A4-sized mobile printers face challenges such as high power consumption due to their wider print width, requiring larger battery capacities compared to smaller printers such as receipt printers. Moreover, the need for multiple driver ICs to control the heating elements in A4-sized printers often results in variations in heat generation due to the differences in wiring lengths between elements, which affect print quality, such as color development and uniformity.　　The KA2008-B07N70A addresses these challenges through an optimized design that enhances mechanical strength and durability by mitigating the effects of expansion and contraction caused by temperature changes. This meets the stringent durability requirements of A4-sized printers (the primary target market) while supporting both thermal and transfer printing methods – offering versatile printing for a wide range of applications.　　While thermal printheads are typically used in combination with connectors and a heat sink, the KA2008-B07N70A can also be supplied as a standalone board, providing greater design flexibility for printer manufacturers. For inquiries regarding the product as part of a set, please contact AMEYA360 or visit the contact page on ROHM’s website.　　Going forward, ROHM plans to develop a 300dpi resolution thermal printhead for mobile A4-sized printers by spring 2025. The company also intends to expand its considerable lineup with products that deliver high-speed printing with superior efficiency.　　Key Specifications　　For more information on printheads for mobile printers, please refer to the following URL on ROHM’s website: https://www.rohm.com/products/printheads/mobile-printers　　Sales Information        Pricing: $14.50/unit (excluding tax)　　Availability: Now (OEM quantities)　　Application Examples        • A4-sized mobile printers　　• Industrial control label printers　　• Tattoo stencil printers, etc.　　Terminology        dpi (dots per inch)　　A unit of print resolution and density, indicating the number of dots that can be placed within a one-inch length (2.54 cm).　　Thermal Printing Method　　A printing technique in which heat is directly applied to thermal paper, causing a reaction that produces color. Primarily used for receipts and labels, this method eliminates the need for ink or toner, ensuring easy maintenance and operation.　　Thermal Transfer Printing Method　　A printing method in which heat melts ink coated on a ribbon, transferring it onto paper. Ideal for high-precision printing, it is commonly used for documents and labels requiring long-term preservation.
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Release time：2025-03-31 15:36 reading：220 Continue reading>>
ROHM Apollo Yukuhashi Plant received the Japan Greenery Research and Development Center Chairperson's Award at National Award for Greenery Factory
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ROHM Apollo Yukuhashi Plant received the Japan Greenery Research and Development Center Chairperson's Award at National Award for Greenery Factory

　　ROHM Apollo Co., Ltd. (Headquarters: Fukuoka Prefecture, hereafter ROHM Apollo) Yukuhashi Plant received “the Japan Greenery Research and Development Center Chairperson's Award“ in the 2024 Factory Greening Award Program (commonly called the National Green Factory Award) sponsored by the Ministry of Economy, Trade and Industry, and at the award ceremony held on January 22, Yukuhashi Plant was awarded the certificate of commendation.　　Toshiyuki Hashimoto, General Manager, LSI Engineering Department, ROHM Apollo Yukuhashi Plant(left)　　Masatoshi Kaku, Chairperson, Japan Greenery Research and Development Center(right)　　The Awards Program has been organized annually since 1982, sponsored by the Ministry of Economy, Trade and Industry and operated by the Japan Greenery Research and Development Center, with the aim of further promoting factory greening. The Awards program recognizes factories, organizations, and individuals for their outstanding achievements in promoting factory greening and improving the environment inside and outside their factories.　　Yukuhashi Plant has been focusing on the creation of a “greenery factory” that takes the ecosystem into consideration and was recognized for the maintenance of cherry blossom trees along the road on the plant premises and the completion of a vast green space and a multipurpose ground on the site in 2023. This is the first time that a plant which is based on Yukuhashi City has received this award.　　In ROHM Group, The ROHM Head Office and Plant received the “Japan Greenery Research and Development Center Chairperson's Award” in 2021 and “Kinki Bureau of Economy, Trade and Industry Director General's Award” in 2022.　　ROHM Group formulated “Environmental Vision 2050” in April 2021. Based on its three themes - “Climate change," "Resource recycling," and "Coexistence with nature", we aim to achieve Net Zero greenhouse gas emissions by 2050 and conduct business activities in harmony with the natural cycle to protect biodiversity. Based on our company mission of "contribute to the advancement and progress of culture" and our Environmental Vision, we will continue to work to conserve the environment and biodiversity toward the realization of a sustainable society while promoting sound cooperation with society by contributing to the local environment and appropriately disclosing environmental information.
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Release time：2025-03-24 11:32 reading：241 Continue reading>>
ROHM selected for CDP’s A List for Climate Change and Water Security
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ROHM selected for CDP’s A List for Climate Change and Water Security

　　ROHM Co., Ltd. has been recognized for leadership in corporate sustainability by CDP (Carbon Disclosure Project), an international environmental non-profit organization, securing a place on its prestigious ‘2024 A List’ for tackling both climate change and water security.　　This is the first time to be included in the Climate Change A list, the highest rating, for ROHM, as well as the fourth consecutive year to secure a position on the Water Security A list.　　CDP is an international environmental non-profit organization that operates a global environmental disclosure system for companies and municipalities. It conducts environmental information surveys and publishes data regarding Climate Change and Water Security. The survey is fully aligned with the TCFD, and its scores are widely used for decision-making regarding investments and purchasing in a sustainable and resilient net-zero economy. In 2024, more than 700 signatory financial institutions requested disclosure of data on environmental impacts, risks, and opportunities through the CDP platform, with a record number of nearly 24,800 companies responding. The survey employs an eight-tier evaluation scale with levels ranging from Leadership level (A, A-) to Management level (B, B-), Recognition level (C, C-), and Disclosure level (D, D-), based on criteria such as comprehensiveness of disclosure, identification and management of environmental risks, and ambitious target setting.        Environmental Management at ROHM　　In the Environmental Vision 2050, ROHM has committed to achieving virtually zero greenhouse gas emissions and maximizing resource recycling to eliminate waste from all its business activities.　　・Water Resource Management　　ROHM has set a target to increase the proportion of water recovery and reuse by at least 5.5% by FY2030 (compared to FY2019), and is making efforts to reuse water resources and reduce factory wastewater by globally managing water withdrawal, wastewater, and water usage. In addition to addressing risks such as flooding, ROHM has implemented a business continuity management system, which predicts potential risks, and made production continuity plans for each site. ROHM is also taking ongoing measures, such as constructing new production buildings based on flood countermeasures.　　In 2024, ROHM received an independent verification of its water withdrawal and wastewater volume data in order to disclose information to society with higher transparency and reliability.　　・Climate Change Measures　　ROHM has set a target to reduce greenhouse gas emissions (Scope 1 and 2) by at least 50.5% byFY2030 (compared to FY2018), and is working globally to introduce environmentally-friendly equipment and reduce usage through energy conversion. In 2024, ROHM has expanded independent verification to achieve a 100% verification rate for its internally calculated greenhouse gas emissions (Scope 1 and 2). Additionally, ROHM has introduced an Internal Carbon Pricing (ICP) system to promote decarbonized management.　　Furthermore, ROHM has announced a plan to source 100% of the electricity used in all domestic and international business activities from renewable energy by FY2050. Several sites, including major overseas production plants, are already operating with 100% renewable energy. As of FY2023, ROHM has achieved a 43% adoption rate and plans to increase this to 65% by FY2030.　　Encouraged by the evaluation results, ROHM will continue promoting CSR activities and addressing social issues to achieve a sustainable society and become a company that meets the expectations of its stakeholders.
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Release time：2025-03-21 13:52 reading：278 Continue reading>>
How Will BIWIN BGA SSD Break Through in the Intelligent Upgrade Path of Edge Devices?
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How Will BIWIN BGA SSD Break Through in the Intelligent Upgrade Path of Edge Devices?

　　In the wave of edge intelligence upgrades, as products are continuously evolving toward miniaturization and high integration, the device systems are confronted with dual challenges of physical space compression and surging computing power. Over the past years, BIWIN has invested significant effort in advancing research and development in storage technologies and advanced packaging and testing processes, providing it with competitive advantages in delivering tailored, miniaturized, and highly integrated storage solutions, including a diverse product portfolio, patented proprietary technologies, and a robust manufacturing and supply chain system.　　Notably, the BIWIN-launched EP410 BGA SSD, with its innovative architectural design, exemplifies a breakthrough solution for edge devices upgrades by offering three key capabilities: a compact and lightweight design, outstanding performance, and high reliability. While offering form factors as compact as those of embedded chips to meet the rigorous dimension requirements of portable devices, these SSDs are able to deliver superior performance and flexible capacity options compared to UFS/eMMC standards.　　Ultra-Thin, Compact Design to Maximize System Spatial Efficiency　　The increasing inference frequencies across smartphones and PCs have made the large capacity a fundamental configuration. Meanwhile, in order to deliver optimized user experience and robust operation under complicated environments, the terminal manufacturers are striving to achieve maximized hardware efficiency and capacity utilization within constrained system dimensions.　　Aligned with the trends in product iteration, BGA SSD EP410 is equipped with advanced packaging processes such as 16-layer die stacking and 40μm ultra-thin die, realizing the compact form factor measuring only 16×20×1.4mm—merely 1/14 the volume of conventional M.2 2280 SSDs (80×22×3.5mm). Surprisingly, it’s able to deliver uncompromising capacity up to 2TB, supporting the smooth image recognition and natural language processing in edge devices and free of capacity limitations. The adopted packaging processes not only reduces board footprint, providing more design flexibility for terminal manufacturers, but also enhances electrical performance to accommodate greater data throughput, enabling device manufacturers to develop more streamlined, competitively advantageous products.　　Uncompromised Performance, Establishing a Robust Foundation for Edge Intelligence Inference　　In terms of performance, BIWIN has harnessed its integrated R&D and packaging and testing business model, along with the optimization and tuning of firmware algorithm, to satisfy the critical demands for error correction, data security and integrity in storage products across various application scenarios.　　The BIWIN EP410 BGA SSD is compatible with PCIe 4.0 interface and NVMe protocol, with its sequential read/write speed reaching 7350MB/s and 6600MB/s respectively, far surpassing the theoretical bandwidth capability of UFS 4.0. Incorporated with self-developed flash memory management algorithm and dynamic bandwidth allocation technology, BIWIN BGA SSD has demonstrated excellent bandwidth stability, qualifying for edge intelligence devices’ access to high-speed data and transfers of high-load requirements with low latency, as well as the responsive handling of sophisticated intelligent tasks. From the application perspective, BIWIN BGA SSD has been included in the list of Google approved suppliers; on the compatibility front, it offers a cross-platform advantage, compatible with a variety of mainstream SoC solutions, which simplifies the design and introduction processes for clients.　　Intelligent Thermal Control and Reliability Design, Ensuring the Stable Operation of Critical Applications　　With the characteristics of chip miniaturization and high integration becoming more pronounced, the increases in power consumption and thermal output have presented challenges for devices’ operational stability and lifespan. Considering this, BIWIN EP410 BGA SSD has further strengthened its reliability design, verification, analysis and management processes. In order to ensure efficient heat dissipation, the product is engineered with DRAM-less architecture with intelligent thermal throttling, as well as in-house LDPC, dynamic and static wear leveling, bad block management and multi-environmental adaptability, contributing to significantly improving the data integrity and security, ensuring long-term stable operations and preventing disconnection during critical usage scenarios including gaming, productivity applications, and content creation.　　Having been subjected to BIWIN’s thorough testing procedures, including electrical performance, SI, application, compatibility, and reliability testings, the products have been validated with their MTBF exceeding 1,500,000 hours and operating temperature ranging from 0℃ to 70℃, enabling the flagship intelligent terminals, for example the 2-in-1 laptops, UAVs, automotive IVI, to catch the wave of edge intelligence upgrades.　　Conclusion　　From the successful mass production of its first PCIe BGA SSD in 2018 to the latest generation EP410 BGA SSD featuring the PCIe Gen4 x4 interface, BIWIN’s continuously evolving products demonstrate its deep expertise in miniaturization and high-integration technologies, while also highlighting its visionary foresight in the ecosystem of edge intelligence. As AI and storage technologies progress toward deeper ecological integration, BIWIN will further leverage its early-mover advantages in mobile terminal storage chips and extend this advantage into the edge intelligence era. Whether in hardware design, software optimization, or ecosystem construction, BIWIN remains committed to advancing industry progress and delivering increasingly intelligent, efficient, and reliable storage solutions to users.
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Release time：2025-03-20 14:01 reading：230 Continue reading>>
SIMCom Powers Smart Terminals with 5G + Wi-Fi 7 for Commercial Applications
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SIMCom Powers Smart Terminals with 5G + Wi-Fi 7 for Commercial Applications

　　As AI-driven smart devices evolve, reliable connectivity remains essential for advanced applications. During MWC25 and EW25, SIMCom introduced its 5G + Wi-Fi 7 wireless communication solution, engineered for smart router applications. This solution delivers solid performance, fast speeds, and dependable wireless communication, and it is already being used in commercial products to help manufacturers optimize both cost and time-to-market.　　5G + Wi-Fi 7: Unlocking the Full Potential of Smart Terminals　　Based on the Qualcomm® Snapdragon™ X62 5G Modem-RF System, a key component of the world's first 3GPP Release 16 modem-RF family. Designed with an upgradable architecture, this technology enables rapid commercialization of 5G Release 16, extending 5G connectivity to various applications, including mobile broadband, fixed wireless, industrial IoT, and private 5G networks. By integrating Wi-Fi 7, this solution enhances the wireless experience for smart devices, providing higher capacity, lower latency, and greater efficiency.　　Showcasing Real-World Applications　　During MWC25 and EW25 , SIMCom partnered with LUXSHARE ICT to demonstrate the real-world capabilities of 5G + Wi-Fi 7. A key highlight was the 5G CPE BE17000 Wi-Fi 7 Mesh Router, featuring SIMCom's SIM8262E-M2 module. By inserting a 5G SIM card, this router utilizes advanced 5G connectivity, allowing users to share ultra-fast networks with multiple Wi-Fi devices. The Wi-Fi 7 Mesh technology further enhances:　　● Network coverage and capacity　　● Ultra-HD streaming without buffering　　● Lightning-fast file downloads　　● Seamless video conferencing and online collaboration　　This deployment underscores SIMCom's commitment to delivering high-speed, uninterrupted connectivity for AI-driven applications, addressing the increasing demand for reliable smart networking solutions.　　( 5G CPE BE17000 WiFi 7 Mesh Router with LUXSHARE ICT )　　Global 5G Adaptability for Diverse Market Needs　　One of the key advantages of SIMCom’s 5G + Wi-Fi 7 solution is its ability to support both NSA and SA network architectures, ensuring robust cellular performance and high data transmission rates. The Snapdragon X62 5G Modem-RF System enables full compatibility with global 5G frequency bands, covering high, mid, and low spectrum ranges. This allows SIMCom to offer customized regional solutions, catering to the specific connectivity requirements of different global markets.　　Driving the Future of Smart Connectivity　　With the integration of 5G and Wi-Fi 7, SIMCom is revolutionizing AI-powered smart terminals, enabling faster, more intelligent, and always-connected experiences. As AI-driven applications continue to expand, high-speed, stable, and adaptive connectivity will play a pivotal role in unlocking new possibilities across industries.　　By leading the way in advanced 5G and Wi-Fi solutions, SIMCom empowers device manufacturers, businesses, and end users to fully embrace the next generation of smart, connected experiences.　　About LUXSHARE ICT:　　Established on May 24, 2004, Luxshare Precision successfully listed on the ChiNext Board of Shenzhen Stock Exchange on September 15, 2010 (stock code: 002475). The Company is committed to providing integrated intelligent solutions, parts, modules and systems for enterprise communication products (high-speed interconnect, optical module, heat dissipation module, base station antenna, base station filter), consumer electronic products (TWS wireless headphones, smart wear, wireless charging module, 5G router, VR headsets, smart speaker), and automobile systems (automobile wiring harness, connector, intelligent cabin, intelligent driving) and central gateway, etc　　About SIMCom:　　SIMCom Wireless Solutions Limited is a global leading IoT wireless modules and solutions supplier. Since established in 2002, SIMCom has been fully committed to providing a variety of wireless modules and terminal level solutions worldwide, such as 5G,4G, LTE-A, LTE-M(CAT-M1), NB-IoT, 3G, 2G, and GPS/GLONASS/BEIDOU satellite positioning technology.　　SIMCom insists on providing high-quality modules and industry solutions. With 23 years of professional technical innovation and service experiences, it continuously meets the needs of customers in all industries of the Internet of Things. While deepening the vertical industry, we continue to define advantageous products and build core competitiveness. With the Group's continuous investment in research and development, technology and production, we will continue to innovate and enrich our technology roadmap, and promote the development of the industry in the next few years.
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Release time：2025-03-20 13:58 reading：205 Continue reading>>
SGP.32 remote provisioning firmware being added to all SIMCom L<span style='color:red'>TE</span> Cat 1 bis IoT modules
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SGP.32 remote provisioning firmware being added to all SIMCom LTE Cat 1 bis IoT modules

　　SIMCom, a leading provider ofcellular wireless modules and solutions for IoT and M2M applications, has announced that all its range of Cat 1 bis IoT modules are now being prepared with the firmware necessary to support SGP.32 functionality, facilitating simple remote provisioning of IoT modules. Developed by the GSMA, the SGP.32 standard enables connectivity with IoT devices without the need for physical SIM cards or other user interfaces.　　Comments Mads Fischer, European Sales Director. SIMCom: “ SGP.32 allows IoT devices that have no displays, buttons or SIM cards to be deployed and updated. Cat 1 bis has been rolled out globally, so by implementing SGP.32 firmware in our Cat 1 bis modules, we are enabling IoT network designers to easily and seamlessly operate their systems remotely and securely using an eSIM only.”　　SIMCom's key LTE Cat 1 bis modules that have integrated SGP.32 firmware include the A7672 series, SIM7672 series, and A7683E. These modules offer strong connectivity, global certification compliance, and enhanced power efficiency, making them ideal for various IoT applications.　　Based on the ASR1603 platform, the A7672 series supports LTE-FDD, LTE-TDD, GSM, GPRS, and EDGE communication modes. With a comprehensive certification portfolio—including RoHS, REACH, CE-RED, RCM, FCC, Anatel, and Deutsche Telekom—this series ensures compliance with global regulations, facilitating smooth deployment across international markets.　　Powered by the QCX216 chipset, the SIM7672 series supports LTE-FDD and LTE-TDD communication. It boasts a wide range of certifications, including CE-RED, RoHS, REACH, FCC, TELEC, JATE, GCF, PTCRB, IC, KC, CCC, AT&T, and T-Mobile, ensuring reliability in diverse regions. A key feature of the SIM7672 series is its support for 3GPP Rel-14 Power Saving Mode (PSM), which allows power consumption to drop as low as 3µA in PSM mode, making it an excellent choice for battery-sensitive applications. The A7683E module is designed for LTE-FDD applications and carries certifications such as RoHS, REACH, CE-RED, and Anatel. All three modules offering a 10Mbps(maximum)downlink rate and 5Mbps uplink rate.　　Available in theLCC+LGA form factor,A7672 series and SIM7672 series are compatible with SIMComNB/Cat Mand/or2G modules,enabling a smooth migration to LTE Cat 1 products,enabling end-product scalability and upgradability. Modules alsosupport both multiple built-in network protocols and the drivers for main operation systems (USB driver for Windows, Linux and Android).The inclusion of industrial standard interfaces such as UART, USB, I2C and GPIO suit the modules for IoT applications such as telematics, POS, surveillance devices, industrial routers, and remote diagnostics etc.　　SIMCom's A7672 series, SIM7672 series, and A7683E modules, powered by SGP.32 firmware, provide a cost-effective and scalable solution for large-scale IoT deployments, particularly in metering and tracking, by enabling remote SIM provisioning that eliminates the need for physical SIM insertion—thereby reducing costs and simplifying deployment in remote locations. With global certifications and ultra-low power consumption, these modules deliver reliable, energy-efficient performance and long-term deployment stability, making them the ideal choice for massive IoT applications due to their flexibility and efficiency.
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Release time：2025-03-18 16:38 reading：265 Continue reading>>
ROHM selected as a Constituent of the Dow Jones Sustainability Asia Pacific Index for the First Time
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ROHM selected as a Constituent of the Dow Jones Sustainability Asia Pacific Index for the First Time

　　ROHM has been selected for the first time as a constituent of the Dow Jones Sustainability Asia Pacific Index (DJSI Asia Pacific), one of the Dow Jones Sustainability Indices (DJSI), a leading global ESG (Environment, Social, Governance) investment indices, which is composed of companies in the Asia-Pacific region.　　Jointly developed by U.S.-based company S&P Dow Jones Indices and RobecoSAM AG, a Swiss investment advisory firm, the DJSI is an index that evaluates companies worldwide from three perspectives - Governance & Economic, Environmental and Social. It is designed to select those that excel in terms of sustainability. It is one of the most important indicators for investors who are interested in ESG. In FY2024, 161 companies (78 companies of which are Japanese companies and 3 are in the semiconductor sector) were selected for DJSI Asia Pacific from approximately 610 major companies in the Asia-Pacific region.　　ROHM Group will continue to strive to address social issues through our business activities and meet the expectations of our stakeholders, aiming to realize a sustainable society.
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Release time：2025-03-17 14:09 reading：261 Continue reading>>

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