BIWIN Built-in BGA <span style='color:red'>SSD</span> Plus Mini <span style='color:red'>SSD</span> Make Robots Smarter, Easier to Use, and Longer-Lasting
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BIWIN Built-in BGA SSD Plus Mini SSD Make Robots Smarter, Easier to Use, and Longer-Lasting

　　With the maturation of on-device AI computing, multimodal perception fusion, and reinforcement learning frameworks, robots are evolving from being merely reactive to becoming truly adaptive, with requirements of accumulating experience to achieve autonomous evolution, far beyond just executing commands.　　AI models are growing larger.What to do when data loading is too slow and affects decision-making?　　Devices are becoming increasingly compact, with every bit of internal space at a premium. How to balance tiny size with high-performance transmission?　　Training data keeps piling up, but memorycapacity isn’t enough and can’t be upgraded?　　Conventional embedded storage solutions (such as UFS, eMMC, M.2 SSD, MicroSD cards) are limited by trade-offs among performance, form factor, and scalability, making them insufficient for the evolving demands of humanoid robotics handling sustained high-load operation, long lifecycle, high system integration, and incremental learning.　　BIWIN BGA SSD, with its superior performance, compact form factor and excellent shock-resistance, has become one of the preferred solutions for robots; Mini SSD, positioned as an expandable storage choice with superb upgradability and flexibility, strikes a perfect balance between high performance and compact package. The combination of the built-in BGA SSD plus expandable Mini SSD constructs a new integrated storage architecture, working as a complete solution to provide stability, expandability, and systemic efficiency for intelligent robots.　　Built-in BGA SSD + External Mini SSD　　Supporting high-frequency data writes for advanced perception and decision-making　　The “brain” of a humanoid robot—the core computing motherboard—is the hardware hub for advanced perception, cognitive reasoning, and autonomous decision-making. Relying on high-performance AI computing chips, it runs multimodal large models and processes massive sensor data in real time to understand environments and plan tasks. This process demands fast and reliable storage for the operating system.　　BIWIN BGA SSD uses a PCIe 4.0 ×4 interface, delivering sequential read speeds up to 7350 MB/s and capacities up to 2TB, enabling “second-level” boot times for the OS and AI models.　　Robots operate under write-intensive workloads that far exceed typical consumer SSD applications. In some high-load systems, daily write volumes can reach 300 GB. Once the initial onboard storage (such as UFS or fixed SSD) becomes saturated, there’s no room left for ongoing data feeding and model iteration.　　Designed for effortless scalability, BIWIN Mini SSD features a SIM-card-style, slot-in design that enables a true “plug-and-play” experience. No disassembly or specialized tools are required to add up to 2 TB of high-speed storage (with higher capacities planned), ensuring long-term data accumulation, incremental learning, and intelligent evolution for robotic systems.　　While achieving extreme miniaturization and large capacity, BIWIN Mini SSD also delivers high-performance transfer rates. Equipped with a PCIe 4.0 ×2 interface, its read/write speeds reach up to 3700 MB/s and 3400 MB/s respectively, and future seamless upgrades to higher-performance versions (such as PCIe 5.0) are supported.　　SIM-card-sized, as light as 1g　　Saving device space and reducing weight　　As humanoid robots move toward practical deployment, lightweight design is not just about “shedding weight”; it’s more about simplifying mechanical structures, lowering manufacturing costs, improving mobility, and expanding application scenarios. As an essential hardware component, the size and weight of memory module directly impact overall device design.　　Both the BIWIN BGA SSD and Mini SSD feature a coin-sized footprint with an ultra-slim thickness of just 1.4 mm. The Mini SSD weighs as little as 1 g and can be directly inserted into a pre-designed socket, significantly reducing constraints on mechanical layout and overall system weight. For humanoid robots that demand high dynamic performance and extended battery life, BIWIN BGA SSD and Mini SSD deliver a “minimal physical presence” while enabling a “lightweight system design”—resulting in more compact architectures and greater motion agility.　　Dual Storage, Reshaping Industry Cooperation　　Safeguarding the Full Lifecycle Storage Needs of Robots　　Mini SSD, defined as an expandable memory solution, goes far beyond its storage function; its design concepts of modularization and standardization bring a brand-new product architecture mindset to intelligent terminal industries such as robots and notebooks.　　Manufacturer Enablement: Simplified Design, Faster Iteration　　BIWIN delivers a Mini SSD + socket solution based on a modular integration approach, enabling device manufacturers to optimize internal system layouts, reduce form-factor constraints, and develop thinner, lighter end products with clear differentiated competitiveness.　　The host-side socket offers strong compatibility across multiple capacity SKUs, requiring minimal hardware changes. This significantly lowers development effort, integration complexity, and overall system cost for device manufacturers.　　User Value: Plug-and-Play, Maximum Flexibility　　Storage expansion or replacement can be completed on-site without tools or specialized expertise. Designed for repeated, reliable insertion and removal, the solution allows end users to easily expand or swap TB-class storage, delivering a flexible and efficient storage experience.　　When paired with BIWIN’s in-house RD510 card reader (USB4.0 Type-C), users gain high-performance, portable storage for mobile productivity, content creation, and other data-intensive scenarios.　　Mini SSD has already entered mass production and is now integrated into multiple intelligent devices, including the OneXPlayer X1 Air, APEX, Super X, and GPD Win 5. It is also officially available for purchase in the consumer market.　　Since its debut, Mini SSD has been validated by several international honors, consisting of “Best Inventions of 2025” from TIME, “Best-in-Show” from Embedded World 2025, and “2026 CES Picks Awards” in the TWICE category. And BIWIN is also recognized as a winner of 2025 “China Chip” Outstanding Supporting Service Enterprise by right of this new innovation.　　Currently, BIWIN is collaborating with multiple SoC platforms and terminal brands to jointly promote Mini SSD interface specifications and ecosystem standards, accelerating its large-scale adoption in cutting-edge fields such as AI terminals and humanoid robots.
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Release time：2026-02-06 17:47 reading：456 Continue reading>>
BIWIN Mini <span style='color:red'>SSD</span> Earns Dual Honors: TWICE Picks Award and AVRONA Most Innovative Award
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BIWIN Mini SSD Earns Dual Honors: TWICE Picks Award and AVRONA Most Innovative Award

　　Recently, BIWIN’s innovative product Mini SSD was honored with multiple international awards at CES 2026, earning the TWICE 2026 Picks Awards Winner as well as the AVRONA Most Innovative Award.　　With its breakthrough design philosophy and strong technical capabilities, this “small form factor, superior performance” storage solution not only continues BIWIN’s legacy of technological innovation, but also aligns seamlessly with the accelerating evolution of edge AI.　　Technological Breakthroughs Addressing Core Storage Challenges　　Conventional consumer storage solutions have long struggled to balance performance, portability, and expandability. BIWIN Mini SSD overcomes these limitations through three key innovations:　　AdvancedLGA packaging, compressing the form factor to just 15 × 17 × 1.4 mm (approximately the size of half a coin) and supporting capacities from 512GB to 2TB;　　PCIe 4.0 ×2interface with NVMe 1.4 protocol, delivering read speeds of up to 3700MB/s and write speeds of 3400MB/s, far surpassing traditional storage card solutions and rivaling mainstream consumer-grade M.2 SSDs;　　An industry-first standardized slot-in SSD design, enabling effortless TB-level expansion through a simple “open – insert – lock” three-step process, dramatically simplifying storage upgrades.　　Small in Size, Big in Capability: Empowering Two Key Tracks　　For consumers, BIWIN Mini SSD introduces a new level of convenience as no specialized tools are required for individuals to expand storage capacity, and its flagship-class performance is capable of supporting smooth operation of intelligent devices.　　For device manufacturers, its standardized interface, modular architecture, and scalability significantly streamline BOM management, reduce manufacturing, inventory, and after-sales costs, and support optimization across the entire product lifecycle.　　The product has already entered deep collaborations with well-known brands such as One-Netbook (ONEXPLAYER) and GPD, helping partners build differentiated competitive advantages in the market.　　Global Recognition Validating Technical Excellence　　Leveraging its ultra-compact design, high scalability, and reliable performance, BIWIN Mini SSD is redefining the integrated paradigm between AI terminals and storage technologies. Thanks to its disruptive innovation, the product was selected for TIME’s “Best Inventions of 2025”, becoming the only storage product worldwide to make the list.　　It subsequently won the “Best-in-Show” Award at Embedded World North America 2025, earning strong endorsement from industry authorities for both its technological advancement and commercialization potential. The dual awards at CES 2026 further reinforce the product’s real-world value and promising market outlook.　　Most notably, the latest achievement marks another milestone: BIWIN Mini SSD has been shortlisted as a finalist for the 2026 Edison Awards, often referred to as the “Oscars of Innovation.” This prestigious recognition, honoring the world’s most outstanding innovations, adds another heavyweight accolade to BIWIN Mini SSD’s growing global honors portfolio.
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Release time：2026-02-06 17:44 reading：436 Continue reading>>
BIWIN Spec TDP200 Series Industrial-Grade PCIe <span style='color:red'>SSD</span> Hits the Market
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BIWIN Spec TDP200 Series Industrial-Grade PCIe SSD Hits the Market

　　With profound insights into the strict requirements for stability, reliability, and uninterrupted operations under industrial-based scenarios, BIWIN Spec introduces newly-available TDP200 series industrial-grade M.2 PCIe SSD designed for industrial data transfer demands. Featured with industrial-grade hardware and software design and optimized firmware algorithms, this innovation supports 24/7 high-frequency writes and is especially resistant to strong mechanical impacts and shocks, serving as efficient and reliable storage solutions for data communications, smart healthcare, industrial automation, industrial robots and AIoT.　　Tough and Reliable Industrial-Grade Design　　Engineered with selected industrial hardware and optimized circuit design, the TDP200 series supports stable operations under temperature ranging from -20℃ to +70℃, helping keep data safe and secure. More specialized designs such as high-quality 3D TLC NAND, high performance controller and capacity up to 2TB make the SSD qualified to handle massive, data-intensive workloads.　　Specialized Firmware for Long-Lasting Reliability　　Packed with advanced reliability features like 4K LDPC, SRAM ECC, RAID, and power loss protection, the TDP200 series boasts an impressive 3000 P/E cycles endurance, making it ideal for relentless 24/7 operations without downtime. A high-precision thermal sensor paired with S.M.A.R.T. health monitoring tracks temperature in real time, automatically adjusting performance to ensure consistent reliability under heavy workloads.　　Rigorous Testing for Uncompromising Quality　　The TDP200 series has been verified with robust quality through over 1000 tests of aging, extreme temperatures and reliability. While strictly in line with the international standards, the product is also continuously monitored in all aspects of performance, reliability and quality through ORT, ensuring top-tier excellence throughout its lifecycle. Moreover, the Series is tested seamlessly compatible with global mainstream platforms and operating systems.　　From product design and hardware architecture to component selection, firmware algorithms, and manufacturing, every detail of BIWIN’s industrial-grade SSD is crafted to deliver a stable, reliable, and durable foundation for industrial data.
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Release time：2025-07-29 15:40 reading：1126 Continue reading>>
How Will BIWIN BGA <span style='color:red'>SSD</span> Break Through in the Intelligent Upgrade Path of Edge Devices?
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How Will BIWIN BGA SSD Break Through in the Intelligent Upgrade Path of Edge Devices?

　　In the wave of edge intelligence upgrades, as products are continuously evolving toward miniaturization and high integration, the device systems are confronted with dual challenges of physical space compression and surging computing power. Over the past years, BIWIN has invested significant effort in advancing research and development in storage technologies and advanced packaging and testing processes, providing it with competitive advantages in delivering tailored, miniaturized, and highly integrated storage solutions, including a diverse product portfolio, patented proprietary technologies, and a robust manufacturing and supply chain system.　　Notably, the BIWIN-launched EP410 BGA SSD, with its innovative architectural design, exemplifies a breakthrough solution for edge devices upgrades by offering three key capabilities: a compact and lightweight design, outstanding performance, and high reliability. While offering form factors as compact as those of embedded chips to meet the rigorous dimension requirements of portable devices, these SSDs are able to deliver superior performance and flexible capacity options compared to UFS/eMMC standards.　　Ultra-Thin, Compact Design to Maximize System Spatial Efficiency　　The increasing inference frequencies across smartphones and PCs have made the large capacity a fundamental configuration. Meanwhile, in order to deliver optimized user experience and robust operation under complicated environments, the terminal manufacturers are striving to achieve maximized hardware efficiency and capacity utilization within constrained system dimensions.　　Aligned with the trends in product iteration, BGA SSD EP410 is equipped with advanced packaging processes such as 16-layer die stacking and 40μm ultra-thin die, realizing the compact form factor measuring only 16×20×1.4mm—merely 1/14 the volume of conventional M.2 2280 SSDs (80×22×3.5mm). Surprisingly, it’s able to deliver uncompromising capacity up to 2TB, supporting the smooth image recognition and natural language processing in edge devices and free of capacity limitations. The adopted packaging processes not only reduces board footprint, providing more design flexibility for terminal manufacturers, but also enhances electrical performance to accommodate greater data throughput, enabling device manufacturers to develop more streamlined, competitively advantageous products.　　Uncompromised Performance, Establishing a Robust Foundation for Edge Intelligence Inference　　In terms of performance, BIWIN has harnessed its integrated R&D and packaging and testing business model, along with the optimization and tuning of firmware algorithm, to satisfy the critical demands for error correction, data security and integrity in storage products across various application scenarios.　　The BIWIN EP410 BGA SSD is compatible with PCIe 4.0 interface and NVMe protocol, with its sequential read/write speed reaching 7350MB/s and 6600MB/s respectively, far surpassing the theoretical bandwidth capability of UFS 4.0. Incorporated with self-developed flash memory management algorithm and dynamic bandwidth allocation technology, BIWIN BGA SSD has demonstrated excellent bandwidth stability, qualifying for edge intelligence devices’ access to high-speed data and transfers of high-load requirements with low latency, as well as the responsive handling of sophisticated intelligent tasks. From the application perspective, BIWIN BGA SSD has been included in the list of Google approved suppliers; on the compatibility front, it offers a cross-platform advantage, compatible with a variety of mainstream SoC solutions, which simplifies the design and introduction processes for clients.　　Intelligent Thermal Control and Reliability Design, Ensuring the Stable Operation of Critical Applications　　With the characteristics of chip miniaturization and high integration becoming more pronounced, the increases in power consumption and thermal output have presented challenges for devices’ operational stability and lifespan. Considering this, BIWIN EP410 BGA SSD has further strengthened its reliability design, verification, analysis and management processes. In order to ensure efficient heat dissipation, the product is engineered with DRAM-less architecture with intelligent thermal throttling, as well as in-house LDPC, dynamic and static wear leveling, bad block management and multi-environmental adaptability, contributing to significantly improving the data integrity and security, ensuring long-term stable operations and preventing disconnection during critical usage scenarios including gaming, productivity applications, and content creation.　　Having been subjected to BIWIN’s thorough testing procedures, including electrical performance, SI, application, compatibility, and reliability testings, the products have been validated with their MTBF exceeding 1,500,000 hours and operating temperature ranging from 0℃ to 70℃, enabling the flagship intelligent terminals, for example the 2-in-1 laptops, UAVs, automotive IVI, to catch the wave of edge intelligence upgrades.　　Conclusion　　From the successful mass production of its first PCIe BGA SSD in 2018 to the latest generation EP410 BGA SSD featuring the PCIe Gen4 x4 interface, BIWIN’s continuously evolving products demonstrate its deep expertise in miniaturization and high-integration technologies, while also highlighting its visionary foresight in the ecosystem of edge intelligence. As AI and storage technologies progress toward deeper ecological integration, BIWIN will further leverage its early-mover advantages in mobile terminal storage chips and extend this advantage into the edge intelligence era. Whether in hardware design, software optimization, or ecosystem construction, BIWIN remains committed to advancing industry progress and delivering increasingly intelligent, efficient, and reliable storage solutions to users.
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Release time：2025-03-20 14:01 reading：1109 Continue reading>>
BIWIN SPEC TGS20x Industrial-Grade <span style='color:red'>SSD</span>: Built for Extreme Conditions with High Reliability
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BIWIN SPEC TGS20x Industrial-Grade SSD: Built for Extreme Conditions with High Reliability

　　Industrial equipment demands uninterrupted long-term operation while enduring extreme environmental conditions such as frequent vibrations, wide temperature and humidity variations, and unexpected power failures. These conditions impose stringent requirements on data processing reliability and durability to ensure continuous and stable system operation.　　BIWIN Spec has specifically designed the TGS20x and TGP20x series of wide-temperature industrial-grade SSDs to address these extreme environments. Compatible with SATA III, PCIe 3.0, and other interface standards, these solutions cover multiple form factors including 2.5", mSATA, and M.2 2280/2242, catering to diverse industrial scenarios. The TGS20x series SSDs have been widely adopted in industrial control, rail transit, data communications, and electric power sectors, providing highly reliable data storage support for various high-demand equipment.　　【Supporting Wide Temperature -40℃~85℃ to Ensure Stable Operation】　　Utilizes flash memory chips, controllers, and components that meet wide-temperature standards; supports operational temperatures from -40°C to 85°C and storage temperatures from -55°C to 95°C　　Rigorously tested with Mean Time Between Failures (MTBF) exceeding 3 million hours　　Enhanced through multiple firmware and hardware optimizations, including RAID, SRAM ECC, E2E, 4K LDPC, and power loss protection　　【Domestic Core Components with Customized Technical Support】　　Employs domestic NAND and controllers; leverages in-house firmware and hardware design with advanced packaging and testing; Achieves read/write speeds of up to 560MB/s and 510MB/s respectively; Supports capacities up to 2TB　　P/E cycles up to 3,000 times, featuring high durability　　Offers customized protective technologies including anti-sulfuration, protective coating, anddispensing reinforcement　　【5-Year Supply Cycle with Nationwide Efficient Service】　　Ensures high quality and consistency through fixed-BOM, automated production, rigorous testing, and comprehensive product lifecycle management　　Service centers located in major cities nationwide, including Beijing, Xi'an, Chengdu, Shanghai, Shenzhen, and Hangzhou, providingrapid response and FAE technical support
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Release time：2024-12-23 15:51 reading：1618 Continue reading>>
Hiksemi Launches PCIe 4.0 <span style='color:red'>SSD</span> FUTURE Series, 7450MB/S Leads The Next Generation Of Gaming <span style='color:red'>SSD</span>s
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Hiksemi Launches PCIe 4.0 SSD FUTURE Series, 7450MB/S Leads The Next Generation Of Gaming SSDs

　　As a global provider of ultimate storage products and solutions,Hangzhou Hikstorage Technology Co.,Ltd.("Hiksemi") is committed to constantly exploring and inventing to meet the demand of consumers.　　Seeing that SSDs have emerged as the mainstream technology in digital data storage,Hiksemi has made full efforts in the field of PCIe 4.0 SSDs with the rich technical experience. Recently,Hiksemi has launched high-performance PCIe 4.0 SSD,FUTURE Series,designed for PC enthusiasts,gamers and content creators.　　Just as the name FUTURE,this series is born to break limits and embrace the future. With the ultimate performance and speed,it brings the ultimate experience to users. FUTURE SSD has faster speed,stronger performance,larger capacity,making users even more powerful in the world of game entertainment and content creation.　　Faster Speed　　The maximum sequential reading speed of up to 7450MB/S can significantly improve the speed and fluency of game startup,screen loading and file access.　　To demonstrate the capabilities of FUTURE SSD,Hiksemi benchmarked the 2TB model on CrystalDiskMark software. The test result is shown in the figure,the sequential read speed exceeds 7450MB/S. In addition,after loading it into PS5,the file transfer speed and game loading speed become significantly faster. It is enough to reflect excellent speed and performance.　　Stronger Performance　　It adopts customized main controller,advanced process technology and the DRAM-less design to bring high-performance bandwidth and throughput.　　In terms of heat dissipation,the new generation of graphene heat sink guarantees the better temperature control. In terms of durability,the MTBF(Mean Time Between Failures) can reach 2 million hours,and the 5-year long warranty service provides users with greater peace of mind.　　Larger Capacity　　The compact M.2 2280 single-sided PCB design,with a variety of capacity options,up to 4TB,can well meet the expansion needs of PS5,notebooks,desktops and other devices.　　With the continuous development of information technology and the increase of massive data,higher requirements are placed on the speed and capacity of storage devices. With the efforts of brands such as Hiksemi,consumers can purchase SSD products with better performance,faster speed,larger capacity,and better cost effectiveness. Hiksemi will continue to invest in R&D resources,improve the supply chain,and conduct technology and product iterations based on consumer demand,striving to become an emerging force leading the development of the storage industry.
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Release time：2023-12-13 14:12 reading：4056 Continue reading>>
BIWIN to Launch Wide-temperature <span style='color:red'>SSD</span>s for Industrial Storage
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BIWIN to Launch Wide-temperature SSDs for Industrial Storage

　　Recently, BIWIN introduced a series of wide-temperature SSDs for extreme environments, including GP303, GP304, GS301, GS302, GS303, and GS304. Crafted with high quality 3D NAND and controller, BIWIN wide-temperature SSDs have the advantages of performance, stability, reliability and security. This series is a strong choice for electric power, Internet of Things, 5G, intelligent manufacturing, rail transit, industrial control and more.　　Supported by self-developed firmware, sequential read / write speeds up to 3400 MB/s / 2700 MB/s and full-drive write speed remains at 1000 MB/s　　With BIWIN self-developed firmware, BIWIN products release their excellent performance. BIWIN GP30 Series SSDs adopt PCIe Gen3x4 and NVMe 1.4 to deliver sequential read / write speeds up to 3400 MB/s / 2700 MB/s and is armed with capacity of up to 2 TB. The GP30 / GS30 Series SSDs have optimized the firmware to provide stable performance. The speed of GP30 and GS30 reaches 1000 MB/s / 450 MB/s on FIO.　　Work faultlessly in -40℃ to 85℃, 3 million hour MTBF　　To ensure great reliability, wide-temperature SSDs adopt quality NAND and have undergone strict tests to bring excellent performance in extreme temperatures. They are rigorously tested to perform well in temperature ranging from -40℃ to 85℃ with a more than 3 million hours MTBF. In addition, this series adopts Corner Fill and Anti-sulfuration for better data integrity in extreme environments.　　Secure your data with power loss protection and end-to-end data protection　　BIWIN wide-temperature SSDs have made great optimization of firmware and hardware in terms of power-down data protection, data patrol, end-to-end data protection, and soft data destruction in terms of security, the series products have multiple optimizations of firmware and hardware in terms of PLP, data patrol, end-to-end data protection, and data erase, effectively guaranteeing data integrity and stability.　　Local service team offers quick response　　Other than its headquarters in Shenzhen, BIWIN has established its overseas headquarters in Miami, USA and local sales teams in Los Angeles, Mexico City, Bogotá, Buenos Aires, Amsterdam, Frankfurt, Istanbul, New Delhi, Taiwan and more territories. We have a strong local support team to make quick response to our clients' needs, providing customized service, real-time FAE technical support, and full supply. Also, we have a globally distributed network that connecting customers across the globe.　　BIWIN GP30 / GS30 SSDs provide wide temperature technology, stable performance, and high reliability, meeting the demanding requirement of industrial applications. BIWIN will make greater efforts to maintain its advantages in R&D, advanced manufacturing, and product quality, bringing our customers quality products and worry-free services.
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Release time：2023-09-04 16:02 reading：3703 Continue reading>>
Baiwei launched a number of industrial grade wide temperature <span style='color:red'>SSD</span>
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Baiwei launched a number of industrial grade wide temperature SSD

　　Li Zhenhua, vice general manager of Marketing Department of Baiwei Storage, said: Based on the company's rich development experience in the field of industrial storage, Baiwei industrial wide temperature SSD products adopted optimized and upgraded hardware design, advanced flash memory management firmware algorithm, after more than 3000 test cases, combined with the company's advanced manufacturing capabilities, products have high reliability, long life, stable performance and other characteristics. It is especially suitable for system operation and data saving in harsh environments such as high and low temperatures, abnormal power failure, humidity, vibration, and shock.　　Recently, Baiwei launched a number of industrial wide temperature SSD products for extreme temperature and other working environments, including GP303, GP304, GS301, GS302, GS303, GS304 and so on. Series products adopt domestic brand 3D NAND wafers and master control, while relying on the company's storage solution development endowment of media characteristics research and screening, firmware algorithm development, hardware design, advanced manufacturing capabilities, making products with high performance, high stability, high reliability and more secure and other advantages. It is widely used in electric power, Internet of Things, 5G, intelligent manufacturing, rail transit, industrial control and other fields.　　1, fully self-developed firmware, sequential read/write speed up to 3400MB/s, 2700MB/s, overall write speed maintained at 1000MB/s　　Equipped with self-developed firmware, the GP30 SSD series has excellent performance. The SSD series uses PCIe Gen3.0x4 interface and NVMe1.4 protocol, with the maximum sequential read/write speed of 3400MB/s and 2700MB/s, respectively, and the maximum capacity of 2TB. In addition, based on multiple optimization of firmware, GP30/GS30 series SSDS have stable data reading and writing performance. In FIO test, the overall write speed of GP30 series SSDS is maintained at about 1000MB/s, while that of GS30 series SSDS is maintained at about 450MB/s.　　2, support -40℃~85℃ wide temperature work, MTBF>3 million hours　　In terms of reliability, the series of products adopt high-specification wide-temperature flash particles, and the company abandons the traditional component screening method to ensure that all components in the products meet the requirements of wide-temperature. At the same time, the series of products have been tested in high and low temperature, functional testing, hardware testing, performance testing, stability testing, reliability testing, compatibility testing and other strict testing verification, support -40℃~85℃ operating temperature, MTBF(mean time to failure) is more than 3 million hours. The products are reinforced with Corner Fill, anti-vulcanization and other technologies to ensure reliable storage of data in extreme temperature and other harsh environments.　　3. Support power failure protection, end to end data protection and other functions and features　　In terms of security, multiple firmware and hardware optimizations are implemented for power failure data protection, data inspection, end-to-end data protection, and data soft destruction, effectively ensuring the security and integrity of SSD data transmission.　　Baiwei GP30/GS30 series SSDS feature wide temperature resistance, stable read/write, and high reliability, fully meeting the strict requirements of industrial applications for data storage. Relying on the integrated layout of research and development, encapsulation and testing, Baiwei will continue to deepen the company's important advantages in technology research and development, advanced manufacturing, quality assurance and other aspects, continue to deepen industrial storage, vehicle gauge storage and other fields, to provide customers with more professional, higher quality customized storage products and services.
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Release time：2023-05-22 14:25 reading：2817 Continue reading>>
Diodes’ Power Switch Enhances Power-rail Management in <span style='color:red'>SSD</span>s
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Diodes’ Power Switch Enhances Power-rail Management in SSDs

　　Diodes' new single-channel high-side power switch features three different selectable slew rates so that wider capacitance loads can be handled while keeping inrush currents down.　　Diodes Inc. has launched a new versatile single-channel high-side power switch that features three different selectable slew rates so that wider capacitance loads can be handled while keeping inrush currents down, ensuring system stability. The DIODES AP22980 power switch is targeted at the solid-state data storage systems used in portable electronic equipment, computer hardware, and edge-based data center deployments.　　The N-channel MOSFET, with a built-in charge pump inside the AP22980, has an extremely low Rds(ON) of 5.1m? enabling loads reaching 6A while minimizing voltage drops and power losses in high current loading applications. By having a separate VBIAS pin, the minimum input voltage that it is capable of supporting is significantly lower, resulting in a wider input voltage range that can be covered—from 0.285V to 5.5V—enabling greater application flexibility.　　With 60?A (typical) quiescent supply current, the AP22980 is highly optimized for situations where keeping standby power consumption down is a priority. This device has an operational temperature range of -40°C to 105°C. If the junction temperature exceeds 150°C, an overtemperature protection mechanism is triggered.　　The AP22980 three-level selectable slew rate power switches are supplied in the compact W-QFN1520 package that takes up little board space and eases integration.
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Release time：2022-12-27 13:27 reading：2533 Continue reading>>
Global Ranking of Branded <span style='color:red'>SSD</span> Module Makers for 2017; Kingston, ADATA, and Tigo Took Top 3 Positions
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Global Ranking of Branded SSD Module Makers for 2017; Kingston, ADATA, and Tigo Took Top 3 Positions

DRAMeXchange, a division of TrendForce, announces the global ranking of SSD module makers (NAND Flash manufacturers excluded) for 2017 based on the shipments of their own-branded SSD products in the channel market. Kingston, ADATA, and Tigo took the top three positions in the ranking, with market shares of 23%, 8%, and 7% respectively.According to DRAMeXchange, the global shipments of SSD products in the channel market recorded a total of 55 million units in 2017, which represented a decrease of 3-4% compared with 2016 shipments. The total annual SSD shipments from all branded NAND Flash manufacturers (including Samsung, Toshiba, WDC, Micron, SK Hynix, Intel and so on) fell by nearly 10% YoY in 2017, whereas the total annual SSD shipments from all memory module makers grew by 2-3% YoY for the same year. Branded NAND Flash manufacturers jointly accounted for 40% of the global SSD shipments for 2017, while the other 60% was contributed by memory module makers.The changing landscape in the SSD market is due to the undersupply of NAND Flash in 1H17, which was not eased until 2H17. Faced with the tight supply, the NAND Flash manufacturers made adjustments to their SSD product mixes and allocated more capacity to PC OEM and Server/Data Center OEM sectors, where the gross margins are higher.In terms of the 2017 raking, Kingston secured the first place with a remarkable market share of 23%. As one of the top suppliers of flash drives and memory cards, Kingston manages to retain its advantages in the SSD sector. As for the other nine SSD module makers in the top 10 ranking, their shares were very close to each other, which indicated that the ranking may change significantly from time to time. The top 10 SSD module makers in the ranking accounted for 67% of the total SSD shipment worldwide.ADATA Technology took the second place as it managed to expand its market share by actively exploring the potential markets other than Europe, the United States, and China. In addition, ADATA has increased the retail prices of its products together with the rising costs of NAND Flash.Tigo’s SSD business mainly focuses on the fast-growing Chinese market, where the company deploys comprehensive product lines to expand its share and to build the brand image. Therefore, Tigo managed to take third place in the ranking despite the rising costs and undersupply of NAND Flash.Taiwan-based manufacturers attach importance to product mix and profitability, while Chinese manufacturers focus on expanding market share and gaining popularityPositions in the ranking from the fourth to the tenth place were taken by manufacturers from China and Taiwan. Specifically, Transcend Information and Apacer Technology put the most focus on the Industrial SSD market with high profitability and stable orders, while Lite-On Technology has shifted its business to Enterprise SSD market to make full use of its advantages. All the three companies adopted relatively conservative sales strategies in the channel market in 2017, and took profitability as the priority in sales.In comparison, Chinese companies tend to be more aggressive. Teclast, Galaxy, Colorful, and Sunspeed retained their advantages in the gaming sector and continued to explore the channel market in China. In addition, they have outsourced SSD assembly to reduce the production costs. With the price decline and sufficient supply of NAND Flash in 2018, these Chinese manufacturers will have a chance to improve their rankings.It should be noted that BIWIN, the leading module maker in China, was not in the top 10 ranking because it puts more focuses on the OEM and industrial SSD sectors rather than the channel market. Longsys was not included in this ranking either, because its business is mainly OEM orders from branded Chinese memory companies, which does not meet the criteria of this ranking. Nevertheless, its OEM shipments are comparable to the top 10 SSD module makers.Chinese module makers show great potential; SSD controller chip makers continue to optimize their solutionsDRAMeXchange notes that Chinese module makers show great potential in the channel market, motivating SSD controller chip manufacturers to optimize their solutions in order to obtain orders from these module makers. According to DRAMeXchange, products in demand include master controller chips that fully support 64/72L 256/512Gb Flash and 64L QLC 1Tb Flash which may enter mass production in 4Q18. The product lines are expected to include SATA DRAMless as well as mid- and low-end PCIe G3 solutions.DRAMeXchange notes that some leading module makers in China have extra specs requirements for gaming. SMI SM2258XT, Phison S11 and Marvell 88SS1120 used to be the mainstream controller chip solutions adopted by Chinese module factories in 2017. However, more competitive solutions have emerged in 2018, including Realtek RT5732DL, Maxiotek MAS0902, SAGE INIC6081 and ASolid AS2258. Particularly, ASolid aims to catch up with its major competitors, so the specs of AS2258 are almost the same as solutions by other leading module makers. This controller chip not only features SATAIII DRAMless, LDPC of Error Correction Code and Die RAID for better performance and data protection, but also supports 64/72L TLC 256Gb/512Gb Flash and 64L QLC 1Tb Flash. In addition, to meet the demand for gaming SSD, ASolid also provides the total solution of M.2 and 2.5-inch SSD, with programmable RGB-LED to realize different lighting patterns.
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