GigaDevice Achieves ISO/SAE 21434 Certification and A<span style='color:red'>SPICE</span> CL2 Assessment, Strengthening Automotive Cybersecurity Together with TÜV Rheinland
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GigaDevice Achieves ISO/SAE 21434 Certification and ASPICE CL2 Assessment, Strengthening Automotive Cybersecurity Together with TÜV Rheinland

　　GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, has been awarded the ISO/SAE 21434 Road Vehicles Cybersecurity Engineering certification by TÜV Rheinland. In parallel, the MCAL (Microcontroller Abstraction Layer) software of GD32A7 automotive-grade MCUs successfully passed the ASPICE Capability Level 2 (CL2) assessment. These milestones demonstrate GigaDevice’s alignment with internationally recognized practices in automotive cybersecurity and software project management, reinforcing its competitiveness in the global automotive electronics market.　　ISO/SAE 21434, jointly issued by ISO and SAE, defines a comprehensive cybersecurity risk-management framework that spans the entire vehicle lifecycle. As vehicles become increasingly connected and intelligent, cybersecurity has emerged as a foundational requirement for protecting user privacy and ensuring a secure, reliable mobility experience. Achieving this certification confirms that GigaDevice has established an end-to-end cybersecurity governance framework across the design, development, and mass-production phases of its automotive product portfolio—helping customers streamline compliance, accelerate program approvals, and enhance market competitiveness.　　The ASPICE assessment model, governed by the German Association of the Automotive Industry (VDA), is one of the industry's most important standards for evaluating software development capability. ASPICE CL2 requires companies to adopt structured processes for project planning, monitoring, and traceability. Developed in full compliance with AUTOSAR, the GD32A7 MCAL software supports major compilers and debugging toolchains while meeting both functional-safety and cybersecurity requirements. Passing ASPICE CL2 affirms the maturity of GigaDevice’s software-development lifecycle and underscores its commitment to high-reliability automotive solutions.　　Driven by new infrastructure such as 5G, AI, and the IoT, vehicles are evolving into interactive intelligent terminals. Automotive-grade chips play a central role in this transition, enabling continuous advancements in vehicle intelligence. Designed for next-generation automotive platforms, the GD32A7 series leverages the Arm® Cortex®-M7 core and offers multiple configurations, including single-core, multi-core, and lockstep architectures. With a maximum frequency of 320MHz and up to 1300 DMIPS of compute performance, the devices support 2.97V–5.5V operation and deliver stable performance across a –40°C to +125°C temperature range. The series are well suited for applications such as body electronics, intelligent cockpit systems, chassis control, and powertrain subsystems.　　The GD32A71x/GD32A72x families comply with ISO 26262 ASIL B, while the GD32A74x series supports ASIL D requirements. All product lines integrate a Hardware Security Module (HSM) with TRNG, AES, HASH, ECC/RSA, and Chinese SM2/SM3/SM4 cryptographic engines, meeting the Evita Full information-security architecture and providing robust data protection for in-vehicle systems.　　Wenxiong Li, Vice President of GigaDevice and General Manager of the Automotive BU, stated: “Achieving ISO/SAE 21434 certification and ASPICE CL2 capability assessment marks an important milestone in elevating our automotive-grade MCU development to higher standards of security and process maturity. GigaDevice will continue to expand the GD32 MCU automotive portfolio and deepen our collaboration with TÜV Rheinland to deliver higher-performance, higher-security products and a more complete ecosystem for our customers.”　　Bin Zhao, General Manager of Industrial Services and Cybersecurity at TÜV Rheinland Greater China commented: “GigaDevice has demonstrated exceptional execution and technical competence in establishing automotive cybersecurity systems and software development processes. Obtaining ISO/SAE 21434 certification and ASPICE CL2 capability assessment provides strong validation for its entry into global automotive supply chains. We look forward to further collaboration to advance innovation and deployment in automotive electronics safety.”　　GigaDevice and TÜV Rheinland also announced the establishment of a strategic partnership focused on functional safety, cybersecurity, personnel training, and certification services. The collaboration aims to integrate both parties' strengths to enhance competitiveness across automotive, industrial, and emerging markets—delivering safer and more reliable products and solutions to customers worldwide.
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Release time：2025-12-26 16:25 reading：388 Continue reading>>
ROHM Releases New Level 3 <span style='color:red'>SPICE</span> Models Featuring Enhanced Simulation Speed
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ROHM Releases New Level 3 SPICE Models Featuring Enhanced Simulation Speed

　　ROHM has announced the release of new Level 3 (L3) SPICE models that deliver significantly improved convergence and faster simulation performance.　　Since power semiconductor losses greatly impact overall system efficiency, simulation accuracy during the design phase is critical. ROHM’s earlier Level 1 SPICE models for SiC MOSFETs addressed this need by precisely replicating key device characteristics. However, challenges such as simulation convergence issues and prolonged computation times revealed the need for further refinement.　　The new L3 models utilize a simplified approach that maintains both computational stability and accurate switching waveforms while reducing simulation time by approximately 50% compared to the L1 models. This allows for high-accuracy transient analysis of the entire circuits at significantly faster speed, streamlining device evaluation and loss assessment in the application design phase.　　As of April 2025, ROHM has released 37 L3 models for its 4th Generation SiC MOSFETs, available for download directly from the Models & Tools section of each product page. The L1 models will continue to be offered alongside the new versions. A comprehensive white paper is also provided that facilitates model adoption.　　The models can be downloaded from the Models & Tools section on individual 4th Generation SiC MOSFET product pages　　Related Information　　• White Papers　　• Design Model Support Page　　• SiC MOSFET Technical Documentation　　Looking ahead, ROHM remains committed to advancing simulation technology to enable the design for higher-performance and more efficient applications, driving continued innovation in power conversion systems.
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Release time：2025-07-10 13:36 reading：682 Continue reading>>
ROHM Offers the Industry’s Largest* Library of LTspice® Models at Over 3,500 by Adding SiC and IGBTs
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ROHM Offers the Industry’s Largest* Library of LTspice® Models at Over 3,500 by Adding SiC and IGBTs

　　ROHM has expanded the library of SPICE model lineup for LTspice® of its circuit simulator. LTspice® is also equipped with circuit diagram capture and waveform viewer functions that make it possible for designers to check and verify in advance whether the circuit operation has been achieved as designed. In addition to the existing lineup of bipolar transistors, diodes, and MOSFETs, ROHM has added SiC power devices and IGBTs that increases its number of LTspice® models to more than 3,500 for discretes (which can be downloaded from product pages). This brings the amount of coverage of LTspice® models on ROHM’s website to over 80% of all products - providing greater convenience to designers when using circuit simulators that incorporate discrete products, now including power devices.　　In recent years, the increasing use of circuit simulation for circuit design has expanded the number of tools being utilized. Among these, LTspice® is an attractive option for a range of users, from students to even seasoned engineers at well-known companies. To support these and other users, ROHM has expanded its library of LTspice® models for discrete products.　　Besides product pages, ROHM has added a Design Models page in October that allows simulation models to be downloaded directly. Documentation on how to add libraries and create symbols (schematic symbols) is also available to facilitate circuit design and simulation execution.　　Going forward, ROHM will continue to contribute to solving circuit design issues by expanding the number of models compatible with various simulators while providing web tools such as ROHM Solution Simulator to meet growing customer needs.　　TerminologySPICE Model　　Data that expresses the operating characteristics of elements in mathematical equations for use in electronic circuit simulations. The SPICE model format may differ depending on the simulator (usually in the form of a text file).　　Circuit Simulator　　A software-based tool that makes it possible to design and verify electronic circuits without the need for actual electronic components.　　MOSFET (Metal Oxide Semiconductor Field Effect Transistor)　　The most commonly used structure in FETs.　　IGBT (Insulated Gate Bipolar Transistor)　　A power transistor that combines the high-speed switching characteristics of a MOSFET with the low conduction loss of a bipolar transistor.　　ROHM Solution Simulator　　A free electronic circuit simulation tool that runs on ROHM’s website. A wide variety of simulations are supported, from component selection and standalone device verification to system-level operational testing.
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Release time：2023-12-06 11:52 reading：2136 Continue reading>>
AMEYA360:<span style='color:red'>SPICE</span> Simulators and <span style='color:red'>SPICE</span> Models
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AMEYA360:SPICE Simulators and SPICE Models

　　Points of this article　　Free SPICE simulator versions are provided by simulator vendors, and can be downloaded and used.　　In order to simulate circuits using ICs or other components, SPICE models for the components, which provide parameter information for the devices, are necessary.　　Many SPICE models are provided by different manufacturers for downloading from websites.　　This article introduces sources for downloading SPICE-based simulators and SPICE models. It is after all best to actually run a simulator in order to come to understand it. The simulators run on general-use PCs and OSes; please give one a try.　　SPICE Models　　In order to execute a simulation, the simulator software, and SPICE models (macro models) that provide parameters for the devices and elements, are necessary. SPICE models of general-use transistors, resistors, capacitors and other basic components may be included with the simulator. SPICE models of specific transistors, ICs and so on are provided on the websites of the manufacturers.　　Moreover, SPICE models of different manufacturers can be downloaded from the PSpice Community managed by Cadence. Also, circuit examples in which external components required by specific ICs and devices are positioned and optimized are provided by manufacturers, in the guise of evaluation circuits and demo circuits; these can be used to greatly speed up design. Nearly all evaluation circuits and demo circuits are for use with specific simulators, and so it is important to check the simulator for which the circuit is intended.　　Below, details for downloading SPICE models and evaluation circuits from the ROHM website and from the PSpice Community are provided.
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Release time：2023-04-06 14:18 reading：2749 Continue reading>>

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