GigaDevice's Dual-Power Supply SPI <span style='color:red'>NOR</span> Flash for 1.2V SoCs Halves Read Power Consumption
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GigaDevice's Dual-Power Supply SPI NOR Flash for 1.2V SoCs Halves Read Power Consumption

　　GigaDevice, a leading semiconductor company specializing in flash Memory, 32-bit microcontrollers (MCUs), sensors, analog products and solutions, has unveiled the GD25NE series of dual-power supply SPI NOR Flash, designed specifically for 1.2 V system-on-chip (SoC) applications.　　The GD25NE series strengthens GigaDevice's strategic dual-power supply Flash roadmap, providing seamless compatibility with next-generation 1.2 V SoCs and eliminating the need for an external booster circuit. With its higher performance and lower power consumption, the GD25NE series addresses the growing demand for advanced embedded storage, making it an ideal choice for wearable devices, healthcare, IoT, data center and Edge AI applications.　　Combining a 1.8 V core voltage with a 1.2 V I/O interface voltage, GD25NE supports single, dual, quad STR (single transfer rate) and quad DTR (double transfer rate) operation. It achieves high-speed clock frequencies of up to 133 MHz in STR mode and 104 MHz in DTR mode.　　With a typical page program time of 0.15ms and sector erase time of 30ms, the GD25NE series significantly outperforms conventional 1.2 V-only Flash solutions—offering up to 20% faster read performance, over 60% faster program speed, and 30% reduction in erase time. Due to these advances, it makes the GD25NE series an outstanding choice for emerging embedded applications.　　The GD25NE series is engineered with ultra-low power consumption by design, making it ideal for energy-sensitive applications. It features a typical deep power-down current of just 0.2 µA, a Quad I/O DTR read current of 9mA at 104 MHz, and program/erase currents as low as 8 mA. Compared to conventional 1.8 V solutions, the 1.2 V design reduces power consumption by up to 50%. This optimized power architecture not only enhances power efficiency but also simplifies system design while maintaining higher performance.　　“The GD25NE series represents a new class of dual-supply SPI NOR Flash, delivering an optimal balance of high performance and ultra-low power consumption," said Ruwei Su, GigaDevice vice president and general manager of Flash BU, "With significantly reduced power usage, faster read speeds, and enhanced program/erase efficiency, this solution is designed to meet the evolving demands of next-generation 1.2 V SoCs. As part of our ongoing commitment to innovation, we continue to expand our portfolio, providing customers with more efficient, reliable, and future-ready Flash solutions for new leading-edge applications”
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Release time：2025-03-12 10:59 reading：410 Continue reading>>
GigaDevice GD25/55 Serial <span style='color:red'>NOR</span> Flash Automotive-Grade Product Family Certified for ISO 26262 ASIL D
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GigaDevice GD25/55 Serial NOR Flash Automotive-Grade Product Family Certified for ISO 26262 ASIL D

　　GigaDevice, a leading semiconductor company specializing in Flash Memory, 32-bit Microcontrollers (MCUs), Sensors, Analog products and solutions, announced its GD25/55 SPI NOR Flash Automotive-Grade Product Family has received ISO 26262:2018 ASIL D Automotive Functional Safety certification from SGS, the world's leading Testing, Inspection and Certification company. This achievement not only strongly validates the outstanding safety performance and reliability of the GD25/55 SPI NOR Flash product in demanding automotive applications but also further solidifies the company's leadership position in the SPI NOR Flash field.　　With the exponential growth in the number of automotive electronics and electrical components, the demand for safety is becoming increasingly critical. As the internationally recognized standard for automotive functional safety, ISO 26262 aims to reduce the risks associated with automotive electronics and electrical systems and ensure the safety performance of vehicles. Under the ISO 26262 framework, the ASIL (Automotive Safety Integrity Level) classification system divides functional safety into four levels, ranging from A (lowest) to D (highest). Level D represents the highest level of safety, meaning that development processes at this level are subject to the most stringent requirements.　　GigaDevice has always maintained a focus on precision and excellence in the automotive electronics field, with product quality at the core of its business development. In terms of quality management, the company’s automotive-grade Flash aims for a 0 PPM defect rate, continuously driving quality improvements and earning widespread trust from customers. To date, global shipments have surpassed 200 million units. In terms of functional safety, GigaDevice has strengthened its process systems and personnel management, continuously enhancing its functional safety management capabilities. After achieving ISO 26262 ASIL D process certification in 2023, the company’s automotive-grade SPI NOR Flash has now also received ASIL D functional safety certification. This demonstrates that GigaDevice has established a rigorous development process for automotive-grade chips, and based on this foundation, has developed the mature capability to design products that meet functional safety standards.　　The GD25/55 SPI NOR Flash Automotive-Grade Product Family strictly adheres to the AEC-Q100 Grade 1 standard and is manufactured using 55nm/45nm process technology. It supports operating voltages of 3V, 1.8V, and a range from 1.65V to 3.6V, with capacities ranging from 2Mb to 2Gb, fully meeting the code storage requirements of automotive electronics. In terms of read/write performance, it offers single-channel, dual-channel, quad-channel, and octal-channel communication modes, with data throughput rates of up to 400MB/s, ensuring efficient data transmission. The product also boasts 100,000 erase/write cycles and a data retention period of up to 20 years. For enhanced safety, products with capacities of 64Mb and above feature built-in ECC algorithms and CRC check functions, improving reliability and extending the product's lifespan.　　Currently, GD25/55 SPI NOR Flash Automotive-Grade Product Family are widely used by numerous domestic and international automakers and Tier 1 suppliers, serving key automotive electronics applications across a range of fields including In-Vehicle Infotainment, Intelligent Cockpits, Connected Car Systems, Advanced Driver Assistance Systems (ADAS), Autonomous Driving, Battery Management System, Domain Controllers, Central Computing, Central Gateways, and Zone Control Systems.　　Ruwei Su, GigaDevice Vice President and General Manager of Flash BU, stated: “As a critical medium for storing key code in automotive electronics, the functional safety of NOR Flash is essential to ensure the reliability and integrity of data in extreme environments, directly impacting the safety and stable operation of vehicles. GigaDevice GD25/55 SPI NOR Flash Automotive-Grade Product Family has obtained the ISO 26262:2018 ASIL D automotive functional safety certification, which fully demonstrates the company's strong capabilities in automotive-grade chip design. Moving forward, GigaDevice will continue to uphold high standards of automotive functional safety, strictly adhere to relevant process specifications, and provide global customers with more high-quality, highly reliable automotive-grade storage products.”
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Release time：2024-12-17 16:03 reading：879 Continue reading>>
Jiangsu Runic Technology Co., Ltd Honored with China IC Design Achievement Award & Selected in China Fabless100 List
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Jiangsu Runic Technology Co., Ltd Honored with China IC Design Achievement Award & Selected in China Fabless100 List

　　On March 29th, the award ceremony of "2024 China IC Design Achievement Award" organized by ASPENCORE was held in Zhangjiang Science Hall, Shanghai. Jiangsu Runic RS50XX series of low noise, high accuracy and ultra-low temperature-drift precision voltage references were awarded the Best Amplifier/Data Converter/Isolator of the Year in China IC Design Achievement Award.　　Jiangsu Runic Technology Co., Ltd has been listed as one of the "Top 10 Analog Signal Chain Companies" for two consecutive years.　　Jiangsu Runic Technology Co., Ltd as China's high-performance, high-quality analog/mixed-signal IC R&D and sales of high-tech semiconductor design company has been selected for two consecutive years in the China Fabless100 list of Top 10 analog signal chain companies, fully demonstrates Runic in the analog signal chain market area of technical strength and competitive advantage, and has been widely recognized by the industry.　　The China IC Design Fabless 100 list is based on quantitative mathematical models, corporate public information, vendor questionnaires, and first-hand interviews by a team of AspenCore analysts, who carefully select the companies with the strongest overall strength and growth potential in China's IC design industry; the Top 10 companies are selected according to the category (each company is categorized into one category only); and the criteria for selecting the Top 10 companies in each category are as follows The selection criteria for each category of Top 10 companies are as follows:　　Companies headquartered in mainland China and Hong Kong/Macau, but excluding Taiwan enterprises　　Fabless companies only, IDM companies with fabs are excluded from screening　　Self-developed and designed chip products have been mass-produced and have been put into commercial use or entered the supply chain of mainstream OEMs.　　Owns a number of patents for Invention Technology, and has strong chip R&D and application design capabilities
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Release time：2024-04-10 13:24 reading：606 Continue reading>>
GigaDevice Unveils the Industry's Smallest 128Mb SPI <span style='color:red'>NOR</span> Flash in 3x3x0.4mm FO-USON8 Package
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GigaDevice Unveils the Industry's Smallest 128Mb SPI NOR Flash in 3x3x0.4mm FO-USON8 Package

　　GigaDevice a semiconductor industry leader in flash memory, 32-bit microcontrollers, sensors, and analog technology, announces the launch of the industry’s smallest 128Mb SPI NOR Flash, GD25LE128EXH, in the ultra-compact 3x3x0.4mm FO-USON8 package. With its thickness of only 0.4mm, the GD25LE128EXH offers designers unparalleled flexibility in designing compact applications, making it the ideal code storage unit for IoT, wearables, healthcare, and networking products that demand high functionality and low power consumption.　　As a flagship product of GigaDevice's low power SPI NOR Flash series, the GD25LE128EXH features outstanding performance, with a maximum frequency of 133MHz and a data throughput of up to 532Mbit/s, significantly enhancing system access speed and instant-on capability. Compared to other industry products, the GD25LE128EXH operates at a lower read current of only 6mA when running at 4-channel 133MHz frequency, reducing the power consumption by 45% and effectively extending battery life. The GD25LE128EXH achieves an ultra-small size for 128Mb products by using the new FO-USON8 package, which reduces area by 70% and thickness by 50%, compared to the conventional 6x5x0.8mm WSON8 package typically used for such products. As a result, GD25LE128EXH takes up 85% less space and reduces material cost.　　The 3x3x0.4mm FO-USON8 GD25LE128EXH is also pin compatible with 64Mb and lower capacity 3x4x 0.6mm USON8 products, enabling quick density upgrades to 128Mb without changing the PCB layout.　　"As a leading fabless company, GigaDevice not only advocates for innovative technology, but also applies it in practice," said Mike Chen, Executive Director of GigaDevice Memory Business Unit, " Our new GD25LE128EXH, the industry's first 128Mb SPI NOR Flash in an ultra-small package, with its lower power consumption, perfectly suitable for any battery-powered design. We anticipate an increase in demand for high-density SPI NOR Flash that is small and power-efficient, and we are planning to develop a more comprehensive product portfolio using advanced package technology to address such needs in the near future.”　　The GD25LE128EXH is currently in mass production, please contact our sales and distributors for order information. The 3mmx2mmx0.4mm FO-USON8 GD25LE64E will be expected to provide samples in the end of May, contact our sales to get more details.
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Release time：2024-01-08 14:51 reading：2562 Continue reading>>
Fibocom Smart Module SC126-NA Received Certification from a Leading Carrier in North America
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Fibocom Smart Module SC126-NA Received Certification from a Leading Carrier in North America

　　Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, is proud to announce a pivotal achievement for its 4G smart module SC126-NA receiving the certification from one of the leading carriers in North America. Integrated with a quad-core processor and leveraged 11nm technology, SC126-NA is a high-performance smart module designed for the entry-level intelligent IoT market, now the module is fully capable of providing an integrated, seamless connectivity service to a wide range of AIoT terminals including smart wireless payment terminals, industrial handhelds, 4G PTT-over-cellular terminals by gaining the certification.　　The global artificial intelligence IoT market is projected to reach high demand with the expansion of AI technology. As an essential in fostering the AIoT market growth, smart module empowers IoT devices with mobile computing capabilities, allowing real-time data processing and analysis, greatly reducing the decision-making timeline in critical scenarios for industry customers and improving overall efficiency. The validation of Fibocom's SC126-NA smart module can shorten the certification cycle of customers' terminal devices and ease the investment concerns for customers' IoT projects.　　Notably, Fibocom SC126-NA is equipped with an open Android operating system with rich multimedia processing capabilities. It can be connected to an FHD (1920 x 1080 @30fps) touchscreen, supporting multi-channel camera input, plus H.265 / H.264 encoding and decoding capabilities and integrating with facial recognition algorithm. Packaged in LCC + LGA form factor, the module offers maximum flexibility for customers to develop terminal devices for various market demands. In addition, SC126-NA is capable of providing precise positioning and navigation with GNSS. Furthermore, with the scalability to support a rich set of interfaces including MIPI / USB / UART / SPI / I2C, etc, Fibocom SC126-NA is an ideal smart wireless solution for various applications that require the integration of cellular communication and multimedia features. With the expanding landscape of AIoT applications in the global market, Fibocom developed a series of regional versions of SC126 to support the frequency bands in Europe and APAC, as well as Wi-Fi only version to satisfy the booming market demands.
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Release time：2023-11-14 13:26 reading：2228 Continue reading>>
GigaDevice Introduces 1.2V SPI <span style='color:red'>NOR</span> Flash Product to Meet Advanced SoCs' Need for ultra-Low Power and High Performance
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GigaDevice Introduces 1.2V SPI NOR Flash Product to Meet Advanced SoCs' Need for ultra-Low Power and High Performance

　　GD25UF series featuring single 1.2V supply offers industry's lowest Active Read power consumption　　GD25UF's 1.2V capability enables a direct interface to SoCs and processors produced on advanced process nodes, reducing their die size and simplifying their power supply architecture　　Nuremberg, Germany – 14 March 2023 – GigaDevice, a semiconductor industry leader in Flash memory and 32-bit microcontrollers serving a broad range of technology innovations, today introduced the GD25UF series of SPI NOR Flash in its strategic roadmap of 1.2V Flash products supporting systems-on-chip (SoCs) and applications processors built on advanced process nodes. The GD25UF SPI NOR Flash products are optimized for applications that require ultra-low power consumption or a small board footprint.　　The GD25UF products operate at a supply-voltage range of 1.14V-1.26V .This is ideal for devices built on advanced process nodes and operating at a core voltage of 1.2V, as it provides for a simpler power system architecture, and for direct interfacing between the I/O pins of the SoC or processor and the GD25UF device.　　With the GD25UF products, GigaDevice provides better specifications than other competing 1.2V products in the parameters that manufacturers of mobile communications devices, wireless modems and wearable devices care most about. In low-power mode at a frequency of up to 50MHz, Active Read current can be as low as 0.4mA at slower frequencies. Deep power-down current of 0.1µA makes the GD25UF ideal for any battery-powered or wearable application. In addition, industry-best program and erase times help increase device manufacturing throughput while reducing system power consumption.　　In Fast Read mode, these Flash devices operate at up to 120MHz and achieve a data-transfer rate of up to 640Mbits/s. In low EMI mode, operating at 80MHz over a double transfer-rate (DTR) quad I/O interface, the GD25UF products achieve the same data-transfer rate of 640Mbits/s while minimizing clock-generated noise, an ideal feature for noise-sensitive wireless applications.　　The 64Mbit GD25UF64E is in production now. It is supplied in SOP8, 3mm x 4mm or 4mm x 4mm USON8 and WLCSP packages, or as a known good die. The 128Mbit GD25UF128E is sampling. Products with memory capacity of 32Mbits and 256Mbits are in development.　　Syed S. Hussain, Flash BU Global Segment Marketing of GigaDevice said: 'Users of chips manufactured at advanced process nodes require a new generation of low-voltage Flash memory products that are optimized for the demanding applications that they support, such as IoT devices, mobile phones, PCs and laptops, and consumer devices, e.g. portable healthcare, smart watch and battery-based devices. Today’s launch of the GD25UF64E 1.2V Flash product marks the start of a comprehensive roadmap of low-voltage Flash products from GigaDevice, providing OEMs with the mix of memory capacities, serial interfaces and security functions that they need for the next generation of system designs. There is a Megatrend, where one shrinks SoCs down to lowest process geometry a must requirement is peripherals needs to support 1.2VIO also. GigaDevice is uniquely positioned to win Ultra-low power and performance megatrend in new designs.'　　GigaDevice will be exhibiting its portfolio of Flash memory and microcontroller products at Embedded World　　Come and visit GigaDevice in person or through LIVESTREAM:　　GigaDevice Booth Hall 3A – 527: Embedded World, March 14 – 16, 2023, Exhibition Center Nuremberg, Germany.　　Conference Presentations:　　Performance, Efficiency and Reliability: GigaDevice's Arm® Cortex®-M33-based MCU Family.　　GigaDevice Flash Journey in Automotive: Flashes Low Voltage Mega-Trend
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Release time：2023-11-01 16:22 reading：1904 Continue reading>>
AMEYA360:NanoLED Research Exploits Northern Roots
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AMEYA360:NanoLED Research Exploits Northern Roots

　　NS Nanotech’s recent opening of a research and development center in Montreal represents a homecoming of sorts, as the company’s technology is based on research conducted at McGill University.　　NS Nanotech Canada will take advantage of exclusive licenses to a portfolio of groundbreaking patents owned by McGill as part of its advanced research efforts to support commercialization of next-generation nanoLED technologies for televisions, mobile phones, smartwatches, augmented-reality headsets and other applications, the company said in prepared remarks.　　In an interview with EE Times, NS Nanotech CEO Seth Coe-Sullivan said the R&D center is a critical enablement of the company’s long-term mission to develop the world’s first efficient submicron-scale nanoLEDs.　　NS Nanotech, which is based in Ann Arbor, Michigan, has created samples of submicron-sized LEDs in its laboratory research that are radically smaller than any other LEDs available in the world today—these submicron nanoLEDs are much smaller than a strand of human hair, at less than one micron. By comparison, today’s “miniLEDs” are generally between 100 and 200 microns, while new “microLEDs” are smaller than 100 microns.Coe-Sullivan said McGill is a global center of excellence in nanotechnologies that will help NS Nanotech overcome the cost and performance limitations of 20th century technologies.　　The McGill University campus in Montreal (Source: Neale McDevitt/McGill University)　　“What happens to conventional technology is you make the LED smaller, and the efficiency gets smaller as well,” he said. “That’s where a nanoLED comes in.” By building the LED from the nano up, no efficiency is lost. “The efficiency versus size curve is very favorable.”　　NS Nanotech’s strategy since its founding was to be “capital light,” despite being in the capital-intensive semiconductor industry, Coe-Sullivan said. “Raising a lot of capital is great. You get to buy a lot of shiny new toys.” But as much as engineers love their toys, he added, it’s not desirable from a financial point of view. “It’s a big hole to be digging yourself.”　　By collaborating with universities like McGill and the University of Michigan, NS Nanotech can send its engineers to the necessary equipment, such as a molecular beam epitaxy (MBE) chamber, rather than making huge capital investments, Coe-Sullivan said. “We scoured the world for that.”　　The company was already a licensee of McGill IP and technology, which meant it already had a formal relationship with the university and its technology transfer office.　　Derrick Wong, COO of NS Nanotech, played a key role in the original technology transfer license. It’s fitting that he’s back in the picture at NS Nanotech after retiring from McGill, as he knows many of the people at NS Nanotech. This includes some who are repatriating back to Canada for the R&D center, such as senior research scientist David Laleyan, a McGill graduate who received his Ph.D. from the University of Michigan in 2020.　　David Laleyan, senior scientist at NS Nanotech Canada (left); Derrick Wong, COO of NS Nanotech Canada (center); and McGill University professor Songrui Zhao (right) work with nanoLED fabrication equipment at Professor Zhao’s research laboratory.　　“Although we started this officially in November, people have been working together on this project in various forms for the last nine years,” Wong said in the same interview with EE Times. “McGill University has been very supportive. It still views NS Nanotech as a McGill startup, even though it’s located in Ann Arbor. It’s very much a McGill success story.”　　Also collaborating with NS Nanotech is Songrui Zhao, assistant professor in the Department of Electrical and Computer Engineering at McGill University, whose research is contributing to solving the challenges related to nanoLEDs. Over the past few years, McGill has been working with MBE, which is a material growth technique to grow nanowires for very small-scale LEDs and lasers because nanowires provide better material quality, Zhao said in the same interview with Coe-Sullivan and Wong. “If you are using this molecular beam epitaxy technique to grow nanowires, it’s very, very unique, and there are not many players.”　　Zhao added that a chief benefit of conducting this research in a university environment is that there’s a lot of frank interaction with students to discuss many different ideas. “We are not driven by revenue,” he said. University/industrial partnerships can accelerate the technology development and facilitate international connections. “One team cannot solve all the problems.”　　While McGill can handle MBE, materials and even initial device development, Zhao said testing and scaling up requires more resources beyond the university—be it people or equipment.　　Coe-Sullivan said the immediate goal is to grow the team in Montreal to work with the research equipment available there. “At McGill, we’ve got access to great research tools, but they’re research tools. These are not places where we’re ever going to mass-produce a product or be able to truly scale a technology.”　　He said NS Nanotech is talking to foundries that have the same type of equipment, but at a much larger scale and throughput to be able to bring its product all the way to market through partnerships and contract manufacturing. “We’ve got access to foundries here in North America that can take this all the way to the end market.”　　In late April, NS Nanotech Canada announced it received matching funding support from McGill University’s Office of Innovation & Partnerships to accelerate the commercialization of its nanoLED technologies.
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Release time：2023-06-09 13:16 reading：1354 Continue reading>>
Ameya360:Nordic Expands PMIC Portfolio
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Ameya360:Nordic Expands PMIC Portfolio

　　Nordic Semiconductor is adding three new product variants to its nPM1100 power management IC product range. Until now, the range has only been available in an ultra-compact 2.1-by-2.1mm chip-scale package (CSP) form factor.　　The first new variant comes in a more mainstream 4-by-4mm QFN component package. CSPs are an absolute requirement for products defined by extreme size constraints. However, when this is not a factor, QFNs allow for easier and cheaper manufacturing as well as simplified design, development, and verification. QFNs also offer greater thermal and vibration robustness compared to CSPs.　　The second and third new nPM1100 variants support higher maximum (termination) battery charging voltages (VTERM) that are required to fully charge certain types of lithium-ion cells commonly used in portable wireless products. These variants will also be offered in either a CSP or QFN package.　　Termination voltage is the maximum voltage a battery should reach during charging. It is used by the battery charger circuit to switch from constant current charging to constant voltage charging and is ultimately used to determine when a battery is fully charged, and so when to stop charging.　　All Nordic nPM1100 variants require no configuration software to operate as all settings are pin configurable.　　“Chip-scale packages are amazing in their miniaturization,” said Geir Kjosavik, Product Director PMIC at Nordic Semiconductor. “In its smallest CSP configuration, the nPM1100 solution only takes up 23mm2 of board space including passive components. However, the product’s ultra-high power management efficiency and ease-of-use bring tremendous value to battery-powered applications where space constraints are not so strict, and so the use of a QFN package is often preferable.”　　Kjosavik said the previous nPM1100’s maximum termination voltage was below that of some increasingly popular lithium-ion batteries used in wearable products. The new nPM1100 variants with higher termination voltage will now maximize the application range and power optimization potential of Nordic’s power management ICs to all portable electronics products.　　The all new nPM1100 product variants are in volume production and available to order now. A new version of the existing evaluation kit (nPM1100 EK) for evaluating the higher termination voltage will be available end of Q1 (nPM1100 EKHV).
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Release time：2023-02-17 13:59 reading：3117 Continue reading>>
Nordic Launches Wi-Fi 6 Companion IC and Dev Kit
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Nordic Launches Wi-Fi 6 Companion IC and Dev Kit

　　Nordic Semiconductor has launched the nRF7002 Wi-Fi 6 companion IC and its associated nRF7002 Development Kit (DK). The nRF7002 is the first in Nordic’s Wi-Fi product family and is a low power Wi-Fi 6 companion IC providing seamless dual band (2.4GHz and 5GHz) connectivity. It can be used together with Nordic’s nRF52 and nRF53 Series multiprotocol Systems-on-Chip (SoCs) and the nRF9160 cellular IoT (LTE-M/NB-IoT) System-in-Package (SiP), but can equally be used in conjunction with non-Nordic host devices. The DK makes it easy for developers to get started on nRF7002-based IoT projects.　　Wi-Fi 6 brings significant benefits to IoT applications—such as smart-home products, industrial sensors, asset trackers, and wearables—including power efficiency gains for battery powered Wi-Fi operation, and management of large IoT networks comprising hundreds of devices.　　“The nRF7002 Wi-Fi 6 companion IC is a testament to Nordic Semiconductor’s leadership in low-power wireless technology,” said Svein-Egil Nielsen, CTO/EVP of R&D and Strategy at Nordic. “This highly integrated and flexible solution will empower developers to create new, innovative Wi-Fi 6-enabled products. Supported with the nRF7002 DK and the award-winning nRF Connect SDK, combined with Nordic’s best in class technical support, I believe it has never been easier to develop great Wi-Fi products.”　　“The nRF7002 is designed to work alongside Nordic’s nRF52 and nRF53 Series making it a perfect fit for Matter, a smart-home standard backed by Amazon, Apple, Google, Nordic, Samsung, and hundreds of other companies,” said Finn Boetius, Product Marketing Engineer with Nordic. “The introduction of the IC and the nRF7002 DK now makes it easy for developers to get started on Matter and any other Wi-Fi based applications.” Matter uses Thread and Wi-Fi for data transport, and Bluetooth LE for commissioning.　　The nRF7002 brings low power and secure Wi-Fi to the IoT. The dual-band IC complies with Station (STA), Soft Access Point (AP), and Wi-Fi Direct operation, and meets the IEEE 802.11b, a, g, n (Wi-Fi 4), ac (Wi-Fi 5), and ax (Wi-Fi 6) Wi-Fi standards. The product also offers excellent coexistence with Bluetooth LE, Thread, and Zigbee. The nRF7002 supports Target Wake Time (TWT) a key Wi-Fi 6 power saving feature. Interfacing with a host processor is done via Serial Peripheral Interface (SPI) or Quad SPI (QSPI). The IC offers a single spatial stream, 20 MHz channel bandwidth, 64 QAM (MCS7), OFDMA, up to 86 Mbps PHY throughput, and BSS coloring.　　In addition to its suitability for general IoT applications and Matter, the nRF7002 is the ideal choice for implementing low power SSID-based Wi-Fi locationing when used together with Nordic’s nRF9160 SiP and the company’s nRF Cloud Location Services. SSID-based Wi-Fi locationing supplements GNSS- or cell-based locationing by providing accurate positioning indoors and in places with a high density of Wi-Fi access points.　　The introduction of the nRF7002 is accompanied by the launch of the nRF7002 DK, a development kit for the Wi-Fi 6 companion IC. The DK includes an nRF7002 IC and features an nRF5340 multiprotocol SoC as a host processor for the nRF7002. The nRF5340 embeds a 128 MHz Arm Cortex-M33 application processor and a 64 MHz high efficiency network processor. The DK supports the development of low-power Wi-Fi applications and enables Wi-Fi 6 features like OFDMA, Beamforming, and TWT. The DK includes: Arduino connectors; two programmable buttons; a Wi-Fi dual-band antenna and a Bluetooth LE antenna, and current measurement pins.　　Together with the DK, developing nRF7002-based designs is made simpler by the support for the IC in the nRF Connect SDK, Nordic’s scalable and unified software development kit for building products based on the company’s wireless devices. With the nRF7002 IC, nRF7002 DK, and nRF Connect SDK, developers can quickly and easily add Wi-Fi connectivity to their products, allowing them to connect to the Internet and communicate with other devices over a Wi-Fi network. Example applications for the nRF7002 DK are included with nRF Connect SDK.
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Release time：2023-02-09 15:39 reading：2979 Continue reading>>
Ameya360:Nordic Semiconductor Multi-function PMIC Simplifies System Design
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Ameya360:Nordic Semiconductor Multi-function PMIC Simplifies System Design

　　Nordic Semiconductor is expanding its power management IC (PMIC) portfolio by releasing a third PMIC in mid-2023. The nPM1300 expands the company’s PMIC offering by adding support for both charging of larger batteries and four regulated power rails.　　Optimized for efficiency, the compact nPM1300 (3.1-by-2.4mm WL-CSP or 5-by-5mm QFN) is digitally configurable through an I2C-compatible Two Wire Interface (TWI). The digital interface provides access to several system management functions that are usually implemented as discrete functions in Bluetooth Low Energy (LE) embedded designs, such as hard reset, battery fuel gauge, system-level watchdog, power loss warning, and recovery from failed boot.　　“Nordic entered the PMIC market because existing power management solutions were not optimized for compact, ultra-low power IoT applications. Available PMICs leave it up to the designer to implement vital functionality using discrete components—functions that naturally belong inside a PMIC and can be implemented at almost no cost,” says Geir Kjosavik, Product Director – PMIC, Nordic Semiconductor. “So, we did just that. Nordic’s customers will be delighted to have access to on-chip functions that enhance product safety and provide additional ways of conserving battery energy.”　　The nPM1300 is designed to provide highly efficient power regulation for Nordic’s nRF52 and nRF53 Series advanced wireless multiprotocol Systems-on-Chip (SoCs). The PMIC’s four regulated power rails and battery charger make it ideal for compact and advanced IoT products based on, for example, an nRF5340 SoC host and multiple peripheral functions such as sensors. Examples include advanced wearables and portable medical applications.　　The nPM1300 PMIC operates from an external power supply of 4V to 5.5V and can operate from a battery voltage down to 2.4V. Two power rails are regulated by separate DC/DC buck converters that are configurable between 1V and 3.3V and up to 200mA maximum current. The other two power rails operate as load switches—switching currents of up to 100mA from external sources—but can also perform as Low Drop Out (LDO) voltage converters when powered directly by the nPM1300. When operating as LDOs, these power rail outputs are configurable between 1V and 3.3V with a maximum output current of 50mA. The unregulated input voltage is also available as an output from the nPM1300.　　The nPM1300 charges single-cell Li-ion, Li-Pol, and LiFePO4 batteries with a linear charging module that supports up to 800mA charge current. The termination voltage is programmable from 3.5V to 4.45V. The battery charger features automatic thermal regulation with programmable maximum chip temperature during charging to enable simple thermal management that can be adapted to any system requirement.　　The nPM1300 brings other new advanced features to Nordic’s PMIC range including: USB port detection with automatic current limits of 100mA or 500mA through standard USB or up to 1.5A through USB-C PD (Power Delivery); dynamic power path management which automatically switches to battery power if a mains power connection is removed; voltage, current and temperature monitoring for accurate fuel gauging; and ultra-low current hibernate mode with a programmable wake-up timer in addition to the other system management features already mentioned. The PMIC also features three LED drivers and five GPIOs that can be re-purposed to direct control lines to time-critical control functions as an alternative to serial commands.　　The nPM1300 is available for limited sampling now, and will be available to order from Nordic’s distributors mid-2023.
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Release time：2023-01-19 13:38 reading：2926 Continue reading>>

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