<span style='color:red'>Fujitsu</span> Develops Single-Panel Antenna to Simultaneously Support Multiple 5G Communications
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Fujitsu Develops Single-Panel Antenna to Simultaneously Support Multiple 5G Communications

Fujitsu Laboratories Ltd. today announced the development of the world's first equipment technology to enable simultaneous communications to four users with a single antenna panel in the 28-GHz band, in the world's most compact structure. The equipment delivers high-speed communications in excess of 10 Gbps, as required by 5G mobile communication formats.The use of 5G is premised on deployment of base stations with comparatively small coverage areas placed every few tens of meters. Given this, it will be necessary to have equipment of a compact size that can be deployed anywhere.Conventional 5G system structures require use of an antenna panel for each terminal when simultaneously transmitting to multiple terminals. Now, by controlling with high accuracy the phase (angle) of signals separately emitted from 128 antenna elements, Fujitsu Laboratories has suppressed the interference between signals.This enables simultaneous communications in four directions using only one antenna panel. Moreover, the company can vary signals in both horizontal and vertical directions, successfully expanding the communications area.Fujitsu Laboratories developed a phased array chip using a technology that can regulate the phase of a signal propagated from an antenna element with accuracy of one degree or less, and built into the panel one phased array chip per eight antenna elements. The company also uses circuitry that detects the differences in phase between phased array chips, which enables highly accurate phase control for any size antenna panel that has between 64 and 256 antenna elements.As a result, by holding the difference in undesired emissions intruding between one radio wave communicating with a device and another radio wave with another device to 20dB or more, it makes it possible for a single antenna panel to carry out high-capacity communications of 10 Gbps or more. Detecting the phase differences from the signals produced by each antenna element and controlling the phase with high accuracy to concentrate the signal in the desired direction, these technologies successfully led to compact equipment that transmits to four users simultaneously with just one antenna panel. The compact equipment propagates radio waves on two axes, including horizontal and vertical directions, enabling wide-area communications with users.With these developments, components can now be fit on a single 13 cm2 printed circuit board, instead of two or more antenna panels required with conventional technology. This will enable the deployment of compact base stations and high-speed 5G communications in locations where many people gather, such as around train stations and in stadiums.
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Release time：2018-11-30 00:00 reading：1052 Continue reading>>
UMC Board Approves 100% Acquisition of MIFS Fab from <span style='color:red'>Fujitsu</span>
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UMC Board Approves 100% Acquisition of MIFS Fab from Fujitsu

United Microelectronics Corporation announced that its Board of Directors has approved for the company to fully acquire Mie Fujitsu Semiconductor Limited (MIFS), a 12-inch wafer foundry based in Mie, Japan, from Fujitsu Semiconductor Limited (Fujitsu Semiconductor). Based on the net value of MIFS on March 31, 2018, the purchase value will be no more than ¥ JPN 57.63 billion. UMC currently owns 15.9% of MIFS shares. Under the terms of the agreement, Fujitsu Semiconductor will transfer the remaining 84.1% of its shares in MIFS to UMC, making MIFS a wholly-owned subsidiary.UMC’s Board of Directors also approved plans for the company to apply with the China Securities Regulatory Commission for UMC’s mainland operations to be listed on the Shanghai Stock Exchange as an A-list offering. HeJian Technology (Suzhou) Co. will represent UMC’s China businesses, which include HeJian’s 8” fab, United Semi and its 12” fab in Xiamen and Shandong-based UDS, which provides IC design support services.Jason Wang, co-president of UMC said, “UMC is experiencing high demand from mature 12" processes. With new applications in 5G, IoT, automotive and AI requiring these technologies, we anticipate the market conditions driving this demand to remain strong. With existing 300mm fabs in Taiwan, China and Singapore, Japan-based MIFS will help customers further diversify their manufacturing risk with a robust production base to ensure business continuity while enhancing UMC’s worldwide service quality. We are excited that the strong partnership between UMC and Fujitsu Semiconductor will enable us to achieve further growth and provide customers with higher value through the acquisition of MIFS.”Co-president Wang continued, “An A-share listing on the Shanghai Stock Exchange for our HeJian-led China subsidiaries provides an ideal path for UMC to quickly capitalize on the rapid growth of China’s semiconductor market and facilitate long-term development. The raised capital would be allocated towards reinvestment in UMC’s successful China operations in order to provide customers with a complete, integrated IC manufacturing solution from chip design to manufacturing, which will help expand our market share and further increase production scale, technical quality, and overall competitiveness.”Listing of A-shares to provide a more diversified source of local funds improves the company’s financial structure and strengthens the company's asset and capital positions, while allowing more capital to remain in Taiwan. As part of the listing, UMC can also attract and retain top local talent through implementation of an Employee Stock Ownership Program (ESOP).The revenue of HeJian constitutes about 11% of UMC’s consolidated revenue, while the number of new shares planned for issue will also be around 11% of the total shares outstanding. UMC will remain the majority shareholder possessing approximately 87% of HeJian’s equity, with no meaningful dilution to the rights and interests of the parent company.Co-president Wang added, “UMC has always been committed to expanding its operating scale, strengthening customer competitiveness and enhancing shareholder value through globally diversified manufacturing. The Board of Directors’ approval to fully acquire MIFS from Fujitsu and publicly listing our China operations on the local stock exchange will help drive UMC’s long-term development and achieve global synergies that will strengthen the company's manufacturing competitiveness, while maintaining our established base in Taiwan.”
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Release time：2018-07-03 00:00 reading：2352 Continue reading>>
ON Semi Ups Stake in <span style='color:red'>Fujitsu</span> Fab
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ON Semi Ups Stake in Fujitsu Fab

　　ON Semiconductor increased its stake in a 200-mm Fujitsu wafer fab in Japan and said it would continue increasing its investment until it takes full ownership of the facility in 2020.　　Under the terms of a deal announced Tuesday (Oct. 10), Phoenix-based ON Semi increased its stake in the 200-mm fab to 40 percent. The company plans to increase its stake to 60 percent of the fab by the second half of next year and to 100 percent by the second half of 2020. Financial terms of the deal were not disclosed.　　The two companies originally entered into an agreement in 2014 under which ON Semi acquired a 10 percent stake in the fab, located in  Aizu-Wakamatsu, Japan. ON Semi wafers were in production at the fab by early 2015.　　"This is a strategic investment for ON Semiconductor to secure additional manufacturing capacity, in support of our accelerated production needs and for revenue growth in coming years," said Keith Jackson, ON Semi's president and CEO, in a statement.　　Also Tuesday, ON Semi launched two new 1 Mp CMOS image sensors said to simplify and speed adoption in applications such as rear and surround view cameras.
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Release time：2017-10-12 00:00 reading：1118 Continue reading>>

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