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Electronic Components Purchasing steps and processes

　　Electronics is an integral field for the sustenance and development of home appliances and smart devices for consumers. Several small to big electronic parts like transistors, diodes, capacitors, and resistors come together to form a whole new electronic product later.　　However, it is important to rely on fresh and durable electronic components, or else the electronics cannot function properly.　　Electronic Components Purchasing steps and processes　　There are some crucial steps in electronic component development that you need to follow for flawless dependence on industrial-grade parts for your projects.　　Requirements Assemblage: The first step, to begin with, is equipping yourself with enough information so that you can proceed with the process further. Confusion and misunderstanding at this first step can complicate the process for you. You even might be unable to develop electronics easily.　　Choosing Manufacturers: The next step is to look for a supplier that adheres to your project requirements and honors your principles. Therefore, a good choice of supplier is crucial to make electronic component procurement feasible for you. You will be able to complete your projects on time.　　Checking the Price and Quality: After this, you also need to pay attention to the costs and pricing for the electronic component procurement. See if there are any hidden costs or if the shipment comes under your budget. It will make the entire process much easier for you.　　Online Platforms for Sourcing: The next step is to check online sourcing platforms too. So that you can have options right there, some platforms are good for sourcing, electronic datasheet sharing, and much more. Choose the right platforms as per your needs.　　Checking for Different Solutions or Alternatives: Sometimes life happens, and you cannot find your desired or much-needed electronic part from your hired supplier. Therefore, in this case, it is better to see if you can work out alternatives or not.　　Lead times: The final step is to pay attention to lead times and see if you are able to meet the deadlines easily or not. If not, then how can you devise ways to deliver quickly to your clients to maintain long-term collaborations with them.

Key word：

Electronic component

Release time：2023-08-22 13:56 reading：2478 Continue reading>>

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Microchip Introduces Its First Automotive-Qualified 10BASE-T1S Ethernet Devices

　　To support new automotive functionality while keeping system complexity low, OEMs are moving away from domain-based solutions and toward zonal architectures. Many of these new architectures rely on the widespread rollout of Ethernet in vehicles, and the recently-released 10BASE-T1S Ethernet standard has been a game changer in expanding and unifying this network. This week, Microchip announced the release of its first automotive-qualified 10BASE-T1S PHY transceivers.　　The LAN8670/1/2 10BASE-T1S Ethernet PHYs are functional safety ready and designed for use in ISO 26262 applications. These devices now make it possible to connect low-speed devices that previously required their own communication systems into a standard Ethernet system in automotive applications.　　“Microchip continues to prioritize connectivity solutions for the automotive industry with the expansion of its line of 10BASE-T1S products,” said Matthias Kaestner, vice president of Microchip’s automotive products business unit. “This new technology will connect the sensors and actuators used in the physical world all the way to the cloud, and it will enable a seamless Ethernet architecture everywhere.”　　The ability to connect multiple Ethernet PHYs to a common bus line makes it simpler to implement automotive applications on a single, well-known architecture and saves implementation costs by reducing cabling and switch ports. The LAN8670/1/2 enables the network edges to use Ethernet and Internet Protocol (IP) to easily communicate with the rest of the network infrastructure. These devices include advanced PHY diagnostics to provide the user with troubleshooting capabilities. In addition, sleep/wake functionality allows for low-power modes.　　The 10BASE-T1S device specifications include 10 Mbps, half-duplex mode, flexible topology with multidrop bus line and point-to-point and use a single balanced pair of conductors. These devices also feature enhanced electromagnetic compatibility/electromagnetic interference (EMC/EMI) performance. Time-Sensitive Networking (TSN) support allows for synchronized timing across far-reaching Ethernet networks. Time synchronization is critical for many applications throughout automotive zonal architectures.　　Microchip Extends Support for 10BASE-T1S　　To support the future of 10BASE-T1S systems, Microchip Technology recently announced the launch of a series of new automotive-qualified 10BASE-T1S devices. The company's new portfolio of 10BASE-T1S devices includes the LAN8670, LAN8671, and LAN8672 PHYs.　　With support for 10BASE-T1S, the LAN8670/1/2 devices (datasheet linked) can transmit and receive data at a rate of 10 Mbit/s over a single balanced pair of conductors. This capability enables efficient data transmission, even in environments where space and resources are limited. The devices can also connect multiple PHYs to a common mixing segment. This not only reduces weight and implementation costs by requiring fewer connectors, individual cables, and switch ports but also simplifies the implementation of automotive applications.　　These devices are said to feature enhanced EMC/EMI performance to help meet the stringent standards for automotive environments. Other features include support for time-sensitive networking (TSN) and qualification to AEC-Q1000 Grade 1.　　Microchip hopes this new series will help simplify the design of far-reaching Ethernet networks that are common to zonal architectures.

Key word：

Microchip

Release time：2023-07-27 09:14 reading：2870 Continue reading>>

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Datang NXP Semicorductors introduces DNB1100, a battery management chip

　　DNB1100 is a single-cell Li-ion battery monitoring chip that can detect and equalize voltage and temperature for a single cell or parallel battery pack. The integrated on-chip temperature sensor can be used to test the temperature of the cell, eliminating the need for additional thermocouple NTC for temperature monitoring.　　Characteristics and advantages　　peculiarity　　This chip is a single-cell battery management chip, providing battery voltage detection, temperature detection and balancing functions. The temperature detection function of the chip does not require NTC and related peripheral circuits. The chip supports internal equalization without the need for external circuits. The chip has a certain self-diagnosis ability, supporting over and under voltage alarm, high and low temperature alarm, and other chip related abnormal alarm.　　advantage　　1) The chip can be directly labeled to the flexible PCB(FPCB), simplifying the circuit while eliminating the slave board.　　2) Chip built-in temperature sensor, no need for NTC and related peripheral circuits, save materials.　　3) Provide more temperature detection coverage points than traditional NTC solutions.

Key word：

Datang NXP Semicorductors

Release time：2023-07-18 10:14 reading：2354 Continue reading>>

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What are the differences between a chip, a semiconductor, and an integrated circuit?

　　A chip generally is the one you can see with the naked eye that has many small feet or the feet are not visible, but are square. However, a chip also includes various kinds of chips, such as base band, voltage conversion, and, so on.　　Semiconductor integrated circuits are active components such as transistors, diodes, etc., and passive components such as resistors and capacitors, which are "integrated" into a single semiconductor wafer according to a certain circuit interconnection, thus completing a specific circuit or system function.　　Integrated circuits are much broader in scope, as they can be integrated with resistors, capacitors and diodes, and can be a chip that converts analog signals or a chip that controls logic, but in general, the concept is more of an under-the-hood thing.　　A semiconductor device is made by etching and wiring a semiconductor chip to perform a certain function. Not only silicon chips but also commonly includes gallium arsenide, germanium, and other semiconductor materials. Semiconductors also have trends like cars.　　Chip is short for an integrated circuit the word chip means a little bit of a large semiconductor chip inside the integrated circuit package, that is, the tube core. Strictly speaking chips and integrated circuits are not interchangeable. Integrated circuits are manufactured through semiconductor technology, thin-film technology, and thick-film technology, and any circuit that is miniaturized for a certain function and then made in the form of a certain packaged circuit can be called an integrated circuit. A semiconductor is a substance that is somewhere between a good conductor and a non-good conductor.　　Semiconductor integrated circuits include semiconductor chips and peripheral-related circuits.　　At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as we continue to pioneer advances in integrated circuits. Each generation of innovation builds upon the last to make technology smaller, more efficient, more reliable and more affordable. Contact us today to learn more about the services provided by Ameya360.

Key word：

chip

Release time：2023-07-04 11:37 reading：2604 Continue reading>>

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AMEYA360:Analog Devices Inc. EVAL-CN0566 Evaluation Board

　　Analog Devices Inc. EVAL-CN0566 Evaluation Board is a low-cost, phased-array beamforming antenna demonstration platform. This board offers an opportunity to explore beamforming, beam steering, antenna impairments, Frequency-Modulated Continuous Wave (FMCW) radar, and synthetic aperture imaging. The CN0566 board features an 8-element phased array, 10GHz to 10.5GHZ operating range, 360° phase adjustment with 2.8° resolution, and 31dB gain adjustment with 0.5dB resolution. The CN0566 evaluation board is ideally used for satellite communications, 5G mobile communications, automotive, military, and commercial radars.　　FEATURES　　10GHz to 10.5GHZ (X band) beamforming platform　　8-element phased array antenna　　2.2GHz frequency　　360-degree phase shift w/2.8 degree resolution　　31dB amplitude tuning range w/0.5dB resolution　　Digitized with PlutoSDR　　USB to micro-USB cable　　Attached Raspberry Pi 4 and PlutoSDR　　5V, 3A, USB-C power adapter　　RoHS compliant　　APPLICATIONS　　Satellite communications　　Commercial radar systems　　5G mobile communications　　Military　　Automotive

Key word：

Analog Devices

Release time：2023-04-27 13:09 reading：2950 Continue reading>>

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AMEYA360：Renesas Electronics launched 10 new successful product portfolios

　　Renesas Electronics, a global semiconductor solutions provider, announced the launch of 10 new "winning product portfolios" that combine Renesas's broad portfolio of products -- including electric vehicle (EV) charging, dashboard control and low-voltage converter capabilities for traction motors, among other applications.　　The Renesas "Portfolio of Successful Products" is a technologically proven design excellence that enables users to implement their design concepts with a high-level platform, shortening product development cycles and reducing the overall risk of bringing a design to market. Renesas now has over 300 "successful product portfolios" for a wide range of users and markets.　　In November 2022, Renesas announced the creation of a unified global sales and marketing organization, combining teams from its Automotive Electronics Solutions Business Unit (ABU) and Internet of Things and Infrastructure Business Unit (IIBU) to accelerate collaboration across business units. The new organization allows Renesas to leverage scale by facilitating cross-selling opportunities and wider user coverage. The new "Portfolio of Successful Products" is the first to combine automotive and non-automotive products.　　"　　Chris Allexandre, Senior Vice President and Chief Sales and Marketing Officer of Renesas Electronics, said: "These 'portfolio of successful products' are outstanding examples of how Renesas can leverage synergies from a new organizational structure. By combining Renesas's deep experience in technology, markets and customers, we can deliver solutions at the best value for the large, rapid growth opportunities in all geographies."　　"　　Nitin Bhambri, Senior Manager, Renesas Systems and Solutions Team, introduces the OCPP Interface Card (OIC) solution for smart electric vehicle chargers. Click below to view the video:　　The 10 new "winning Product portfolios" include the following solutions　　The OCPP interface card (OIC) for intelligent electric vehicle chargers and the Open charging Protocol (OCPP) are used for communication between networked charging stations and networked charge management systems. Today, charging stations can connect to OCPP, but with this new solution, stand-alone EV chargers will also be able to connect to OCPP servers to authorize vehicles, remotely manage charger configurations, get real-time alerts, and more. This gives users and manufacturers the flexibility to use any charger for any EV system that supports multiple charging technologies. This "portfolio of success" includes Renesas Bluetooth Low Power? , Wi-Fi and MCU products.　　3 kw non-on-board electric vehicle charger　　High power non-on-board chargers are functional modules that support battery pack solutions. The charger combination operates within a universal input range, using a high-end MCU to control power factor correction (PFC) and manage zero voltage switches (ZVS). This "portfolio of successful products" includes Renesas's MCU, analog, power and PWM controller products.　　Connected Android dashboard　　This networked cockpit design provides developers with all the modules and peripherals needed for full cockpit application development. The custom board comes with a variety of wireless connectivity options including Wi-Fi, LTE and GPS. Information from outside the vehicle CAN be fed via dual CAN/FD communication channels. It supports three display connections and a variety of startup options, support for Android-based infotainment systems, and dashboard apps via FreeRTOS. This "portfolio of successful products" includes Renesas R-Car Automotive System-on-chip (SoC), power management devices, timing products, Wi-Fi, modules and Bluetooth products.　　Other "winning portfolios" include:　　Charging and communication unit of electric vehicle charging pile　　Vehicle control unit　　Low-cost TFT dashboard with telematics system　　Low voltage inverter for 2/3 wheel traction motor control　　Vehicle telematics box module　　High-performance electric vehicle charging wall box solution　　Portable electric car charger　　Supply with more information　　In addition to the existing "successful portfolio" of over 300 models, the new Renesas EV "successful Portfolio" includes block diagrams, product information, as well as sample acquisition and product purchase information.

Key word：

AMEYA360,Renesas

Release time：2023-03-10 11:45 reading：2767 Continue reading>>

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Ameya360:Advanced Thermal Solutions fanSINK™ Designed for Analog Devices Eval Boards

　　Advanced Thermal Solutions fanSINK is a high-performance 21.0mm x 21.0mm x 13.5mm BGA heat sink with a superGRIP? attachment. The ATS superGRIP is a proven high-reliability mechanical attachment system. The superGRIP hardware includes a high-performance plastic frame clip and 300 series stainless steel spring clip, avoiding PCB through holes.　　The Advanced Thermal Solutions fanSINK is designed for Analog Devices evaluation boards AD9166, AD9986, AD9988, AD9081, AD9082, and the quad-MxFE design, which is 4x AD9081/2. The device does not include a fan.　　FEATURES　　Heat sink includes 7/8" screws, which fit 10mm thick fans　　Product hole pattern is 20mm C-C (center-to-center)　　Component attachment, ATS superGRIP?, is a proven high-reliability mechanical attachment system　　superGRIP hardware includes a high-performance plastic frame clip and 300 Series stainless steel spring clip, avoiding PCB through holes　　Provided with pre-assembled Thermal Interface Material (TIM) centered on the base　　“Keep-Out” requirements - An “Un-Populated” border zone of 3.5mm around the component is necessary to facilitate the installation/removal of the superGRIP?　　Fan not included　　ADDITIONAL RESOURCES　　superGRIP Clearance Guidelines　　superGRIP Installation Guide

Key word：

Ameya360,ATS

Release time：2023-03-09 11:21 reading：2043 Continue reading>>

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Ameya360:Analog Devices to Showcase the Future of Connectivity at MWC 2023

　　Analog Devices Inc. will feature interactive demonstrations and expert discussions at the upcoming Mobile World Congress (MWC) 2023. Visitors to its booth (Hall 2, Booth #2B18) will learn how ADI aims to minimize environmental impact, enable and accelerate breakthrough innovations, and enrich customers’ lives through solutions which reduce energy consumption, shorten design cycles, and enable the future of work.　　ADI’s solutions enable customers to deliver innovative, advanced Radio Units (RUs) faster using conformance tested reference design platforms with commercial grade RU IP. ADI’s experts will be on hand to discuss RAN energy saving solutions and demonstrate platform interoperability. Furthermore, ADI’s Consumer team will demonstrate their latest innovations in connectivity with applications such as mixed reality (MR) headsets and audible wearables.　　Radio unit demonstration highlights include:　　• ADI’s next-generation massive MIMO (mMIMO) Reference Design with 40% power savings: This 32Tx/32Rx mMIMO radio unit reference design is based on the latest ADI RadioVerse ADRV904x system on chip (SoC) with fully integrated digital front end and collaborator’s advanced baseband processor. This design solution provides 40% power savings compared to competing solutions, enabling lighter, smaller radios and faster time to market.　　• Creating more sustainable networks with advanced micro-sleep modes: Since the Radio Access Network (RAN) consumes 70% to 80% of total network energy, energy savings modes are critical to reducing the carbon footprint across 5G networks and lowering OPEX spending. ADI RadioVerse solutions provide the path forward to meeting the upcoming 3GPP Rel. 18 network energy saving (NES) modes for 5G RAN. See how these potential energy savings are realized in an interactive model of micro-sleep and hibernation modes across multiple Open Remote Unit (O-RU) configurations.　　• Next-generation 5G mmWave beamforming platform: Upgrade macro, small cell, and indoor 5G deployments across the entire 24 to 47GHz bands. This 8T8R 400MHz solution highlights ADI’s latest O-RAN 7.2 split compliant mmWave reference platform, with a proven 25% efficiency improvement in analog beamforming based entirely on ADI silicon solutions.　　In a world where virtual connections are increasingly part of everyday life, ADI will present several advancements in consumer technology which enrich the sensory experience with realistic human interactions:　　• MR headset: Enabling the future of work with the Metaverse – Integrating emerging virtual worlds into everyday lives take a huge technological effort: Intelligent Edge devices, 5G/6G infrastructure, and the green energy to power it all. ADI advancements are making this possible.　　• Hearable solutions: Life, exactly how it is supposed to sound – Filtering out, amplifying, or enhancing the sounds of life when appropriate helps people experience perfect sound, every day. Context-aware, hearable solutions change how people work, play, and rest from anywhere.　　• USB-C fast charging, battery insights, and protection: Fast charging your life’s work – Improving charging efficiency puts less wear on batteries and extends the lifespan of devices. USB-C fast charging technology keeps phones, headphones, or gaming devices going at the speed of daily life, with the highest efficiency and safety in the smallest footprint.

Key word：

Analog Devices,MWC,ADI

Release time：2023-02-21 15:10 reading：2276 Continue reading>>

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Ameya360:Baiwei introduces industrial wide temperature DDR4 SODIMM

　　Baiwei industrial wide temperature DDR4 SODIMM (Small Outline DIMM) memory module conforms to JEDEC standard design, using high-quality original DRAM wafers, after rigorous performance and reliability testing, can work stably in the temperature range of -40℃~85℃, speed up to 3200Mbps, Suitable for all kinds of small industrial computers, monitoring equipment, automation and embedded systems.　　Focusing on 5G base stations, edge computing, AI equipment, vehicle-mounted applications, industrial control security and other fields, more and more industrial applications and equipment have put forward higher requirements for storage solutions: In a long time of high-speed computing and strict operating environment, storage products must have high stability and reliability, and must also be adapted to extreme temperature changes, dust resistance, shock resistance, shock resistance, vulcanization resistance and other tests to maintain high durability and long service life. Recently, Baiwei launched industrial wide temperature SODIMM memory strips to enable a variety of industrial applications under harsh environmental challenges.　　The product has the following characteristics:　　01　　Strict medium screening + high and low temperature test, wide temperature operation without fear of inflammation and cold　　In order to make the product work at -40℃~85℃, Baiwei has made strict wide temperature screening of the wafer particles to ensure the consistency of the product; For the finished product, strict high and low temperature repeated testing is carried out to ensure that the product can operate stably in various temperature environments such as high temperature, low temperature, high and low temperature changes, and not afraid of the influence of outdoor temperature difference between day and night and seasonal changes, so as to ensure the stability of the product in extreme environment.　　02　　Bottom filling + anti-vulcanization + three anti-paint coating, stable, reliable, strong and durable　　For some high intensity vibration environment, Baiwei can provide IC bottom filling technology, improve the reliability of products under high pressure, high impact, high vibration; For high temperature, high humidity, high pollution and other sulfur gas concentration environment, the memory module will occur vulcanization and affect the function of the parts, in advance to prevent curing, to ensure the normal operation of the module; With three anti - paint coating, can further ensure the durability of the product to adapt to the industrial application of equipment longer replacement cycle.

Key word：

Ameya360,Baiwei,DDR4 SODIMM

Release time：2023-02-20 17:16 reading：2993 Continue reading>>

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Ameya360:Li-ion Battery Material Prices Drop in January Amid Slowing Growth in Chinese NEV Market

　　There was an across-the-board decline in prices of upstream (raw) materials for lithium ion (Li-ion) batteries in January as participants in the industry chain in China were focusing on inventory consumption, according to TrendForce. The decline was especially significant for upstream materials related to cathodes, cathode materials, and battery electrolytes.　　The average price of lithium carbonate, which is the most costly among the upstream materials related to cathodes, fell by 12% month-on-month (MoM). Lithium hydroxide also suffered a price drop, but the demand for this material was bolstered by orders from regions outside China. Compared with lithium carbonate, lithium hydroxide experienced a more moderate price slide. Nevertheless, the average prices of battery-grade lithium carbonate and lithium hydroxide both dipped below Rmb500,000 per metric tons. Turning to electrolytes and related upstream materials, the average price of LiPF6 (lithium hexafluorophosphate) fell by 11% MoM for January. This, in turn, caused the average price of electrolytes to drop by 11~15% MoM for the same month.　　TrendForce points out that China initiated the phase-out of its NEV (new energy vehicle) subsidy at the start of 2023. Other regions of the country have introduced other subsidy policies in the hope of stimulating consumption, and the preferential rate for the purchase tax on NEV purchase has been extended to the end of 2023.　　However, a significant portion of Chinese consumers’ demand for new vehicles was expended in 4Q 2022 when the country saw energetic promotional activities that aimed to spur NEV sales. Moving into this first quarter, the Chinese car market has been affected by the low season. On the whole, NEV sales in China has slowed down recently and thereby caused a general decline in prices of upstream materials for Li-ion batteries. On the other hand, the drop in material prices has reduced some of the cost pressure on the manufacturing of Li-ion batteries.　　Regarding price trends of NEV power battery products in China, prices of battery cells on the whole fell by about 1% MoM for January. Various cell types including ternary cells and prismatic LFP (lithium iron phosphate) cells experienced a MoM decline of 1~2%. TrendForce projects that their prices will go down further in February.　　In the market for energy storage battery cells, most products are LFP cells, and their prices fell by 2% MoM for January to reach the average of Rmb0.94 per watt-hour. Also, due to the policy support that the Chinese government has been providing for the development of energy storage technologies, the demand for Li-ion energy storage batteries is expected to rebound slightly going forward. Prices of energy storage battery cells are currently projected to remain mostly flat or drop a bit for 1Q23.　　Lastly, looking at Li-ion battery cells for consumer electronics, the average price of LCO (lithium cobalt oxide) cells in China came to around Rmb9.9 per amp-hour in January. Transactions were low in the market for consumer batteries due to the slumping demand for electronic devices. Furthermore, prices of the upstream materials for LCO cathodes kept sliding.　　Looking ahead, the market for LCO materials is expected to remain weak in the short term, it will witness a further price decline in February.

Key word：

Li-ion,Battery

Release time：2023-02-17 13:58 reading：2087 Continue reading>>

model	brand	Quote
MC33074DR2G	onsemi
CDZVT2R20B	ROHM Semiconductor
BD71847AMWV-E2	ROHM Semiconductor
TL431ACLPR	Texas Instruments
RB751G-40T2R	ROHM Semiconductor

model	brand	To snap up
BP3621	ROHM Semiconductor
IPZ40N04S5L4R8ATMA1	Infineon Technologies
ESR03EZPJ151	ROHM Semiconductor
BU33JA2MNVX-CTL	ROHM Semiconductor
STM32F429IGT6	STMicroelectronics
TPS63050YFFR	Texas Instruments

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