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GigaDevice Achieves ISO/SAE 21434 Certification and ASPICE CL2 Assessment, Strengthening Automotive Cybersecurity Together with TÜV Rheinland

　　GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, has been awarded the ISO/SAE 21434 Road Vehicles Cybersecurity Engineering certification by TÜV Rheinland. In parallel, the MCAL (Microcontroller Abstraction Layer) software of GD32A7 automotive-grade MCUs successfully passed the ASPICE Capability Level 2 (CL2) assessment. These milestones demonstrate GigaDevice’s alignment with internationally recognized practices in automotive cybersecurity and software project management, reinforcing its competitiveness in the global automotive electronics market.　　ISO/SAE 21434, jointly issued by ISO and SAE, defines a comprehensive cybersecurity risk-management framework that spans the entire vehicle lifecycle. As vehicles become increasingly connected and intelligent, cybersecurity has emerged as a foundational requirement for protecting user privacy and ensuring a secure, reliable mobility experience. Achieving this certification confirms that GigaDevice has established an end-to-end cybersecurity governance framework across the design, development, and mass-production phases of its automotive product portfolio—helping customers streamline compliance, accelerate program approvals, and enhance market competitiveness.　　The ASPICE assessment model, governed by the German Association of the Automotive Industry (VDA), is one of the industry's most important standards for evaluating software development capability. ASPICE CL2 requires companies to adopt structured processes for project planning, monitoring, and traceability. Developed in full compliance with AUTOSAR, the GD32A7 MCAL software supports major compilers and debugging toolchains while meeting both functional-safety and cybersecurity requirements. Passing ASPICE CL2 affirms the maturity of GigaDevice’s software-development lifecycle and underscores its commitment to high-reliability automotive solutions.　　Driven by new infrastructure such as 5G, AI, and the IoT, vehicles are evolving into interactive intelligent terminals. Automotive-grade chips play a central role in this transition, enabling continuous advancements in vehicle intelligence. Designed for next-generation automotive platforms, the GD32A7 series leverages the Arm® Cortex®-M7 core and offers multiple configurations, including single-core, multi-core, and lockstep architectures. With a maximum frequency of 320MHz and up to 1300 DMIPS of compute performance, the devices support 2.97V–5.5V operation and deliver stable performance across a –40°C to +125°C temperature range. The series are well suited for applications such as body electronics, intelligent cockpit systems, chassis control, and powertrain subsystems.　　The GD32A71x/GD32A72x families comply with ISO 26262 ASIL B, while the GD32A74x series supports ASIL D requirements. All product lines integrate a Hardware Security Module (HSM) with TRNG, AES, HASH, ECC/RSA, and Chinese SM2/SM3/SM4 cryptographic engines, meeting the Evita Full information-security architecture and providing robust data protection for in-vehicle systems.　　Wenxiong Li, Vice President of GigaDevice and General Manager of the Automotive BU, stated: “Achieving ISO/SAE 21434 certification and ASPICE CL2 capability assessment marks an important milestone in elevating our automotive-grade MCU development to higher standards of security and process maturity. GigaDevice will continue to expand the GD32 MCU automotive portfolio and deepen our collaboration with TÜV Rheinland to deliver higher-performance, higher-security products and a more complete ecosystem for our customers.”　　Bin Zhao, General Manager of Industrial Services and Cybersecurity at TÜV Rheinland Greater China commented: “GigaDevice has demonstrated exceptional execution and technical competence in establishing automotive cybersecurity systems and software development processes. Obtaining ISO/SAE 21434 certification and ASPICE CL2 capability assessment provides strong validation for its entry into global automotive supply chains. We look forward to further collaboration to advance innovation and deployment in automotive electronics safety.”　　GigaDevice and TÜV Rheinland also announced the establishment of a strategic partnership focused on functional safety, cybersecurity, personnel training, and certification services. The collaboration aims to integrate both parties' strengths to enhance competitiveness across automotive, industrial, and emerging markets—delivering safer and more reliable products and solutions to customers worldwide.

Key word：

GigaDevice

Release time：2025-12-26 16:25 reading：390 Continue reading>>

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Murata：SCH16T-K20 High-Precision 6-Axis IMU for Robotics and Camera Systems

　　Murata Manufacturing Co., Ltd. has announced the expansion of its SCH16T series of high-performance inertial measurement units (IMUs) with the introduction of the SCH16T-K20, targeting industrial, prosumer, and consumer markets worldwide. Designed for OEMs in robotics, drones, and camera systems, as well as IMU module manufacturers and system integrators requiring safety-critical IMUs, the SCH16T-K20 delivers market-leading precision, mechanical robustness, and reliability.　　In demanding inertial measurement applications such as dead-reckoning navigation as well as drone and camera stabilization, small measurement errors can accumulate over time leading to unpredictable measurement results. In these applications, key IMU parameters such as noise density, offset bias drift, and vibration rectification ultimately limit the end-application performance and achievable response speed. Murata improves all the key areas with the new SCH16T-K20, which features a brand-new MEMS accelerometer and improved gyroscope temperature calibration.　　The SCH16T-K20 is a 6 axis IMU with a typical gyroscope noise density of 0.0004 (°/s)/√Hz, gyroscope bias instability of 0.3 °/h, and accelerometer noise density as low as 33 µg/√Hz. Like all other SCH16T products, the SCH16T-K20 has a wide operating temperature range from -40 °C to +110 °C, a supply voltage of 3.0–3.6 V, and I/O voltage of 1.7–3.6 V, and a compact size of 0.46 × 0.53 × 0.11 inch (11.8 × 13.4 × 2.9 mm).　　The driver behind the SCH16T-K20 accelerometer performance improvement is the brand-new accelerometer MEMS based on Murata’s proven 3D MEMS technology. The new MEMS uses a double-differential measurement principle, familiar from current SCA3400 and legacy SCA103T series sensors. The double differential measurement enables SCH16T-K20’s market leading low noise density, as well as thermal and lifetime stability.　　The SCH16T-K20 also includes an enhanced version of the market-leading low-noise SCH16T gyroscope, now tuned specifically for the -40 °C to +85 °C temperature range to enable low offset bias shift across that range. All SCH16T series products are carefully validated with a test set based on AEC-Q100 operating temperature Grade 1 (-40 °C to +125 °C) standards*, ensuring reliable operation over a wide temperature window. The series sensors include market-leading self-diagnostic features, making them suitable for safety-critical applications. Murata’s unique MEMS stands out in the competitive IMU market for its exceptional mechanical resilience to shocks and vibration rectification. The series’ robust design and reliability contribute to longer device lifespans and reduced waste.　　The SCH16T-K20 becomes the highest-performing variant in the SCH16T lineup while maintaining pin-to-pin and software compatibility. This compatibility makes integration of different SCH16T variants easy for OEMs and module designers. Mass production of the SCH16T-K20 is scheduled to begin in the first half of 2026. Murata will continue developing sensor solutions aligned with evolving market demands, contributing to safer, more sustainable, and higher-performing technologies across industrial and consumer markets.

Key word：

Murata

Release time：2025-12-26 16:09 reading：344 Continue reading>>

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Renesas Fast-Tracks SDV Innovation with R-Car Gen 5 SoC-Based End-to-End Multi-Domain Solution Platform

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, is expanding its software-defined vehicle (SDV) solution offerings centered around the fifth-generation (Gen 5) R-Car family. The latest device in the Gen 5 family, the R-Car X5H is the industry’s first multi-domain automotive system-on-chip (SoC) manufactured with advanced 3nm process technology. It is capable of simultaneously running vehicle functions across advanced driver assistance systems (ADAS), in-vehicle infotainment (IVI), and gateway systems.　　Renesas has begun sampling Gen 5 silicon and now offers full evaluation boards and the R-Car Open Access (RoX) Whitebox Software Development Kit (SDK) as part of the next phase of development. Renesas is also driving deeper collaboration with customers and partners to accelerate adoption. At CES 2026, Renesas will showcase AI-powered multi-domain demonstrations of the R-Car X5H in action.　　The R-Car X5H leverages one of the most advanced process nodes in the industry to offer the highest level of integration, performance and power efficiency, with up to 35 percent lower power consumption than previous 5nm solutions. As AI becomes integral to next-generation SDVs, the SoC delivers powerful central compute targeting multiple automotive domains, with the flexibility to scale AI performance using chiplet extensions. It delivers up to 400 TOPS of AI performance, with chiplets boosting acceleration by four times or more. It also features 4 TFLOPS equivalent* of GPU power for high-end graphics and over 1,000k DMIPS powered by 32 Arm® Cortex®-A720AE CPU cores and six Cortex-R52 lockstep cores with ASIL D support. Leveraging mixed criticality technology, the SoC executes advanced features in multiple domains without compromising safety.　　As hardware and software become more tightly integrated early in development to support complex E/E architectures, Renesas is adding new capabilities to the RoX development platform. RoX dramatically simplifies development by combining all essential hardware, operating systems, software and tools required to rapidly develop next-generation vehicles with seamless software updates.　　Accelerating Automotive Innovation with an Open, Scalable RoX Whitebox SDK　　To accelerate time-to-market, Renesas now offers the RoX Whitebox Software Development Kit (SDK) for the R-Car X5H, an open platform built on Linux, Android, and XEN hypervisor. Additional support for partner OS and solutions is available, including AUTOSAR, EB corbos Linux, QNX, Red Hat and SafeRTOS. Developers can jumpstart development out of the box using the SDK to build ADAS, L3/L4 autonomy, intelligent cockpit, and gateway systems. An integrated stack of AI and ADAS software enables real-time perception and sensor fusion while generative AI and Large Language Models (LLMs) enable intelligent human-machine interaction for next-generation AI cockpits. The SDK integrates production-grade application software stacks from leading partners such as Candera, DSP Concepts, Nullmax, Smart Eye, STRADVISION and ThunderSoft, supporting end-to-end development of modern automotive software architectures and faster time to market.　　“Since introducing our most advanced R-Car device last year, we have been steadfast in developing market-ready solutions, including delivering silicon samples to customers earlier this year,” Vivek Bhan, Senior Vice President and General Manager of High Performance Computing at Renesas. “In collaboration with OEMs, Tier-1s and partners, we are rapidly rolling out a complete development system that powers the next generation of software-defined vehicles. These intelligent compute platforms deliver a smarter, safer and more connected driving experience and are built to scale with future AI mobility demands.”　　“Integrating Renesas’ R-Car X5 generation series into our high-performance compute portfolio is a natural next step that builds on our existing collaboration,” said Christian Koepp, Senior Vice President Compute Performance at Bosch’s Cross-Domain Computing Solutions Division. “At CES 2026, we look forward to showcasing this powerful solution with Renesas X5H SoC, demonstrating its fusion capabilities across multiple vehicle domains, including video perception for advanced driver assistance systems."　　“Innovative system-on-chip technology, such as Renesas’ R-Car X5H, is paving the way for ZF’s software-defined vehicle strategy,” said Dr. Christian Brenneke, Head of ZF’s Electronics & ADAS division. “Combining Renesas’ R-Car X5H with our ADAS software solutions enables us to offer full-stack ADAS capabilities with high computing power and scalability. The joint platform combines radar localization and HD mapping to provide accurate perception and positioning for reliable ADAS performance. At CES 2026, we’ll showcase our joint ADAS solution.”　　First Fusion Demo on R-Car X5H with Partner Solutions at CES 2026　　Renesas will showcase the capabilities of the R-Car X5H for the first time through a series of invitation-only demos at CES 2026. For more information about how to attend this event, contact sales at: CES26_Info@lm.renesas.com.　　The new multi-domain demo upscales from R-Car Gen 4 to the next-generation R-Car X5H on the RoX platform, integrating ADAS and IVI stacks, RTOS, and edge AI functionality on Linux and Android with XEN hypervisor virtualization. Supporting input from eight high-resolution cameras and up to eight displays with resolutions reaching 8K2K, the platform delivers immersive visualization and robust sensor integration for next-generation SDVs. Combined with the RoX Whitebox SDK and production-grade partner software stacks, the platform is engineered for real-world deployment covering multiple automotive domains.　　Availability　　Renesas is shipping R-Car X5H silicon samples and evaluation boards, along with the RoX Whitebox SDK, to select customers and partners.

Key word：

Renesas

Release time：2025-12-24 16:06 reading：481 Continue reading>>

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Murata Launches World’s First Inner Cavity-Structure Ultra-Low-Loss LCP Flexible Substrate, Achieving Dk below 2.0, Contributing to 6G Realization

　　Murata Manufacturing Co., Ltd announces the World’s First LCP (liquid crystal polymer) flexible substrate with an Inner Cavity structure, ULTICIRC, and has already begun mass production*. Murata’s proprietary design incorporates an Inner Cavity within the substrate to achieve a dielectric constant (Dk) below 2.0, dramatically reducing transmission loss.Cross-Section Image　　With 6G expected to leverage the FR3 (Frequency Range 3) band—roughly 7–24 GHz—substrates with minimal transmission loss are essential to enable high-speed, high-capacity communications at high frequencies. At the same time, demand is growing for thin, space-saving flexible substrates that support free-form mechanical design to meet the ongoing miniaturization of smartphones and communication equipment. Murata has provided LCP flexible substrates with excellent high-frequency characteristics, featuring a proprietary high-performance resin that eliminates spring-back and an adhesive-free, one-shot press multilayer lamination process; building on this expertise for 6G readiness, Murata has developed and launched ULTICIRC. Conventional flexible substrates faced the challenge that making them thinner resulted in increased transmission loss, but this product incorporates an Inner Cavity structure within the substrate, achieving a dielectric constant (Dk) below 2.0, which is significantly lower than Murata's conventional products, enabling both thin profiles and ultra-low transmission loss simultaneously.　　Furthermore, thanks to an adhesive-free proprietary manufacturing method and the excellent barrier properties of LCP, the Inner Cavity structure maintains high moisture resistance.　　For inquiries regarding this product, please contact us.

Key word：

Murata

Release time：2025-12-18 16:00 reading：476 Continue reading>>

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ROHM’s Flexible Brushed DC Motor Driver ICs for a Wide Range Applications

　　ROHM has developed two new motor driver ICs for brushed DC motors, BD60210FV (20V, 2ch) and BD64950EFJ (40V, 1ch). They are intended for use in home and office appliances such as refrigerators, air conditioners, printers, and robotic vacuum cleaners.　　In recent years, the electrification of consumer and industrial equipment - especially white goods - has accelerated, increasing the demand for energy-efficient brushed DC motors. At the same time, motor drivers are expected to support multiple applications and use cases while reducing external component count and size.　　To address these needs, these new products adopt highly versatile packages, making them ideal not only for new platform designs but also for redesigns and derivative products. Additionally, they achieve ultra-low standby current (Typ: 0.0μA, Max: 1.0μA), significantly contributing to power savings during standby operation.　　The BD60210FV can function as a dual H-bridge (2ch) motor driver with direct PWM control, capable of driving two DC brush motors, a bipolar stepper motor driver, or solenoid driver. Its H-bridge circuit configuration eliminates the need for a boost circuit, minimizing external components and contributing to space-saving and simplified design. It supports input voltage from 8V to 18V and 1A/phase continuous current and 4A/phase peak current.　　The BD64950EFJ features a single H-bridge (1ch) that supports both direct PWM control and constant current PWM control. Its low on-resistance design reduces heat generation, enabling efficient motor drive. With a 40V withstand voltage and 3.5A continuous current (6A peak), it is suitable for high-powered, high-voltage (24V) DC brush motor applications.　　Both products are now in mass production (sample price: $1.5/unit, tax excluded). Online sales have also started, and they (BD60210FV, BD64950EFJ) can be purchased from online distributors such as AMEYA360. Evaluation boards (BD60210FV-EVK-001, BD64950EFJ-EVK-001) are also available to support application development and design.　　ROHM will continue to expand its motor drive solutions for consumer and industrial equipment, contributing to greater comfort and energy savings in society.　　Application Examples　　•Consumer Equipment: Refrigerators (ice maker rotation, fan valve control), Air conditioners (louver control), Printers (carriage movement), Robotic vacuum cleaners (brush rotation), Water heaters and rice cookers (valve control), Humidifiers (fan control)　etc.　　•Industrial Equipment: Automatic doors and shutters (operation control), Small conveyors (transport control), Power tools (rotation control), Other small motor control applications, etc.　　Terminology　　H-Bridge　　An electronic circuit used to control the rotation direction of a motor. It is called an H-bridge because it comprises four electronic switches (MOSFETs) whose arrangement resembles the letter “H”.　　Direct PWM Control　　A method where a PWM (Pulse Width Modulation) signal is directly applied to the H-bridge to control motor speed. The voltage supplied to the motor is adjusted by the PWM duty cycle. This method offers a simple circuit configuration and high responsiveness.　　Constant Current PWM Control　　A control method that uses PWM to maintain a constant current to the motor. It allows the motor to maintain torque even at low speeds and is used in applications requiring precise control.

Key word：

ROHM

Release time：2025-12-18 15:39 reading：513 Continue reading>>

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GigaDevice Launches GD25NX Series xSPI NOR Flash with Dual-Voltage Design Optimized for high-speed, low-power 1.2 V SoC applications

　　GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, today announced the launch of its new generation of high-performance dual-voltage xSPI NOR Flash products – the GD25NX series. Featuring a 1.8 V core and 1.2 V I/O design, the GD25NX series connects directly to 1.2 V system on chips (SoCs) without an external booster circuit, significantly reducing system power consumption and BOM cost.　　Building on the success of the 1.2 V I/O GD25NF and GD25NE series, the new GD25NX further extends GigaDevice's expertise in dual-voltage Flash design. With high-speed data transfer performance and outstanding reliability, the GD25NX series is ideal for demanding applications such as wearables, data centers, edge AI, and automotive electronics that require exceptional stability, responsiveness, and power efficiency.　　The GD25NX xSPI NOR Flash supports an octal SPI interface with a maximum clock frequency of 200 MHz in both single transfer rate (STR) and double transfer rate (DTR) modes, delivering data throughput of up to 400 MB/s. It achieves a typical page program time of 0.12 ms and a sector erase time of 27 ms, offering 30% faster programming speed and 10% shorter erase time compared with conventional 1.8 V octal Flash products.　　To safeguard data reliability, the GD25NX series integrates error correction code (ECC) algorithms and cyclic redundancy check (CRC) verification to enhance data integrity and extend product lifespan. In addition, the series supports a data strobe (DQS) functionality to ensure signal integrity in high-speed system designs, meeting the stringent data transfer stability requirements of SoCs use on data center and automotive applications.　　Built on an innovative 1.2 V I/O architecture, the GD25NX series delivers outstanding performance while maintaining exceptional power efficiency. At a frequency of 200 MHz, the device achieves read currents as low as 16 mA in Octal I/O STR mode and 24 mA in Octal I/O DTR mode. Compared with the conventional 1.8 V Octal I/O SPI NOR Flash devices, the 1.2 V I/O design reduces read power consumption by up to 50%, significantly improving system energy efficiency while sustaining high-speed operation—an ideal choice for power-sensitive applications.　　"The GD25NX series sets a new benchmark for combining low voltage with high performance in SPI NOR Flash," stated by Ruwei Su, GigaDevice Vice President and General Manager of Flash BU. "Its design aligns closely with mainstream SoC requirements for low-voltage interfaces, enabling higher integration and lower BOM costs for customers. Moving forward, GigaDevice will continue to expand its dual-voltage portfolio with broader density and package options to help customers build the next generation of efficient and reliable low-power storage solutions."　　The GD25NX series is available in 64 Mb and 128 Mb densities, meeting diverse storage needs across various applications. These devices are supported on TFBGA24 8×6 mm (5×5 ball array) and WLCSP (4×6 ball array) packages. Samples of the 128 Mb GD25NX128J are now available for customer evaluation, while the 64 Mb GD25NX64J samples are currently being prepared. For detailed technical information or pricing inquiries, please contact your local authorized GigaDevice sales representative.

Key word：

GigaDevice

Release time：2025-12-15 15:57 reading：563 Continue reading>>

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Renesas Releases its First Wi-Fi 6 and Wi-Fi/Bluetooth LE Combo MCUs for IoT and Connected Home Applications

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RA6W1 dual-band Wi-Fi 6 wireless microcontroller (MCU), along with the RA6W2 MCU that integrates both Wi-Fi 6 and Bluetooth® Low Energy (LE) technologies. These connectivity devices address the growing demand for always-connected, ultra-low-power IoT devices across smart home, industrial, medical and consumer applications. Renesas also launched fully integrated modules that accelerate development with built-in antennas, wireless protocol stacks, and pre-validated RF connectivity.　　Ultra Low Power Operation for Always-Connected IoT　　Today’s IoT devices must stay always connected to improve application usability and response time, while maintaining the lowest possible power consumption to extend battery life or to meet eco-friendly regulations. Renesas’ Wi-Fi 6 MCUs offer features such as Target Wake Time (TWT), which enables extended sleep times without compromising cloud connectivity and power consumption. This is critical for applications such as environmental sensors, smart locks, thermostats, surveillance cameras, and medical monitors, where real-time control, remote diagnostics and over-the-air (OTA) updates are critical.　　Additionally, both MCU Groups are optimized for ultra-low power consumption, consuming as little as 200nA to 4µA in sleep mode and under 50µA in Delivery Traffic Indication Message (DTIM10). With the “sleepy connected” Wi-Fi functionality, these devices stay connected with minimal power draw, meeting the growing requirements of modern energy efficiency standards.　　Scalable RA MCU Architecture with Full Software Support　　Built on the Arm® Cortex®-M33 CPU core running at 160 MHz with 704 KB of SRAM, the MCUs enable engineers to develop cost-effective, standalone IoT applications using integrated communication interfaces and analog peripherals, without the need for an external MCU. Customers also have the option to design with a host MCU that can be selected from Renesas’ broad RA MCU offerings and attach the RA6W1 and RA6W2 as connectivity and networking add-ons. Both RA6W1 and RA6W2 are designed to work with Renesas’ Flexible Software Package (FSP) and e² studio integrated development environment. As the first Wi-Fi MCUs in the RA portfolio, they offer a scalable platform that supports seamless software reuse across the RA family.　　High Performance Dual-Band Wi-Fi 6 with 2.4 and 5 GHz Connectivity　　With support for both 2.4 and 5 GHz bands, both MCUs deliver superior throughput, low latency, and reduced power consumption. The dual-band capability dynamically selects the most suitable band based on real-time conditions, ensuring a stable and high-speed connection even in environments with many connected devices. Advanced features such as Orthogonal Frequency Division Multiple Access (OFDMA) and TWT boost performance and energy efficiency, making these solutions well suited for dense urban environments and battery-powered devices.　　Robust Security and Matter-Certified Interoperability　　The RA6W1 and RA6W2 devices offer advanced built-in security including AES-256 encryption, secure boot, key storage, TRNG, and XiP with on-the-fly decryption to keep data safe from unauthorized access. The RA6W1 is RED certified (Radio Equipment Directive), which makes it easier for developers to future-proof their design. Additionally, the device is Matter ready and certified with Matter 1.4, and is compatible across smart home platforms. Renesas supports both MCUs and modules through the Renesas Product Longevity Program, offering 15-year support for MCUs and 10 years for modules.　　“We’re offering our customers the flexibility to design with a standalone Wi-Fi device, a Wi-Fi/Bluetooth LE combo, or fully integrated modules depending on their needs,” said Chandana Pairla, VP of the Connectivity Solutions Division at Renesas. “These wireless solutions save power, simplify system design and lower BOM cost. With hosted or hostless implementation options, customers can confidently begin their wireless onboarding journey and seamlessly integrate into next-generation connected systems.”　　Two types of modules, Wi-Fi 6 (RRQ61001) and Wi-Fi/Bluetooth LE combo (RRQ61051) simplify design by integrating certified RF components and wireless connectivity stacks that comply with global network standards. Supported RF certification standards include the U.S. (FCC), Canada (IC), Brazil (ANATEL), Europe (CE/RED), UK (UKCA), Japan (Telec), South Korea (KCC), China (SRRC) and Taiwan (NCC). By integrating connectivity at the system level, the modules significantly reduce design effort and accelerate time to market.　　Winning Combinations　　Renesas offers “Advanced Low-Power Wireless HMI for Household Appliances” and “Automatic Pet Door & Tracking System” that combine the new Wi-Fi 6 MCU and Wi-Fi/Bluetooth LE MCU with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.　　Availability　　The RA6W1 MCU is now available in FCQFN and WLCSP packages, along with the RRQ61001 and RRQ61051 modules. The RA6W2 MCU (BGA package) will be available in Q1/2026. The devices are supported by the FSP, e² studio, evaluation kit and software development kit (SDK) that include flash memory, PCB trace antennas, connectors and embedded power profiler for power consumption analysis. Renesas also offers comprehensive software tools to aid system application development, as well as the Production Line Tool (PLT) for production testing of wireless MCUs.

Key word：

Renesas

Release time：2025-12-12 16:28 reading：654 Continue reading>>

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ROHM launches SiC MOSFETs in TOLL package that achieves both miniaturization and high-power capability

　　ROHM has begun mass production of the SCT40xxDLL series of SiC MOSFETs in TOLL (TO-Leadless) packages. Compared to conventional packages (TO-263-7L) with equivalent voltage ratings and on-resistance, these new packages offer approximately 39% improved thermal performance. This enables high-power handling despite their compact size and low profile. It is ideal for industrial equipment such as server power supplies and ESS (Energy Storage Systems) where the power density is increasing, and low-profile components are required to enable miniaturized product design.　　In applications like AI servers and compact PV inverters, the trend toward higher power ratings is occurring simultaneously with the contradictory demand for miniaturization, requiring power MOSFETs to achieve higher power density. Particularly in totem pole PFC circuits for slim power supplies, often called “the pizza box type,” stringent requirements demand thicknesses of 4mm or less for discrete semiconductors.　　ROHM's new product addresses these needs by reducing component footprint by approximately 26% and achieving a low profile of 2.3mm thickness – roughly half that of conventional packaged products. Furthermore, while most standard TOLL package products are limited by a drain-source rated voltage of 650V, ROHM's new products support up to 750V. This allows for lower gate resistance and increased safety margin for surge voltages, contributing to reduced switching losses.　　The lineup consists of six models with on-resistance ranging from 13mΩ to 65mΩ, with mass production started in September 2025 (sample price: $37.0/unit, tax excluded). 　　Product Lineup　　Application Examples　　・Industrial equipment: Power supplies for AI servers and data centers, PV inverters, ESS (energy storage systems)　　・Consumer equipment: General power supplies　　EcoSiC™ Brand　　EcoSiC™ is a brand of devices that utilize silicon carbide (SiC), which is attracting attention in the power device field for performance that surpasses silicon (Si). ROHM independently develops technologies essential for the evolution of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, we have established an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.• EcoSiC™ is a trademark or registered trademark of ROHM Co., Ltd.　　Terminology　　Totem Pole PFC Circuit　　A highly efficient power factor correction circuit configuration that reduces diode losses by using MOSFETs as rectifier elements. The adoption of SiC MOSFETs enables high voltage withstand capability, high efficiency, and high-temperature operation for the power supply.

Key word：

ROHM

Release time：2025-12-04 17:10 reading：524 Continue reading>>

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ROHM launches RPR-0730: High-Speed, High-Precision Optical Sensor Featuring VCSEL Technology

　　ROHM has developed the “RPR-0730”, analog compact optical sensor, capable of high-precision detection of fast-moving objects. This sensor can be widely utilized in consumer and industrial equipment applications, including printers and conveyor systems.　　As industrial and office equipment becomes increasingly sophisticated and automated, there is a growing demand for improved sensing technology accuracy. In applications such as label printers, material or product transport systems, and copiers, the need for technology that can identify objects more accurately is essential. Moreover, increased speed driven by productivity improvements makes the introduction of high-speed, high-precision optical sensors crucial.　　The RPR-0730 is a compact reflective optical sensor (photo reflector). It employs an infrared VCSEL, which offers higher directionality than LEDs, enabling detection of finer objects. Furthermore, by using a phototransistor with analog output as the receiver, the sensor achieves a response time of 10µs. This dual combination enables high-speed, accurate identification of fine lines as narrow as 0.1mm - previously difficult to detect with conventional LED light sources. As an addition to the existing digital output sensor “RPR-0720” series, RPR-0730 expands capability to applications requiring faster sensing, such as print detection in copiers, label printers, or rotational detection in motors and gears.　　The package is ultra-compact at 2.0mm × 1.0mm × 0.55mm and employs a visible light filtering resin to suppress interference from ambient light or sunlight. This enables stable detection even in environments with varying light conditions, such as factories or outdoors. The sensor can also be easily integrated into equipment requiring installation in small, confined spaces, like inside conveyors or precision instruments, making it suitable for a wider range of applications.　　Mass production of the new product commenced in October 2025 (sample price: $2.2/unit, tax excluded).　　Going forward, ROHM will continue to leverage its development expertise in light-emitting and light-receiving elements to create sensing products that meet customer needs, contributing to the miniaturization and enhanced convenience of various devices.　　Application Examples　　•Print detection, paper feed/jam detection in label printers, copiers, shredders, etc.　　•Object detection of packages/specimens, workpiece position detection in conveyance systems, automatic inspection equipment, etc.　　•Motor/gear rotational detection in industrial robots, etc.　　Terminology　　Photo reflector　　A type of optical sensor combining an emitting element and a receiving element. It illuminates an object and detects the intensity of the reflected light to measure the presence or distance of an object.　　VCSELL　　Abbreviation for Vertical Cavity Surface Emitting LASER. A type of laser light source, it is a semiconductor laser that can emit light directly from its surface. Compared to LEDs, it offers higher directionality and is suitable for high-precision sensing. Originally adopted for optical communication applications, its use as a light source for proximity sensors and distance sensors has been expanding in recent years.　　Phototransistor　　A transistor-type photoelectric conversion element that converts optical signals into electrical signals. It integrates a photodiode and a transistor, controlling the base current with light to output an amplified collector current.

Key word：

ROHM

Release time：2025-12-04 17:04 reading：433 Continue reading>>

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Panasonic Industry Commercializes Conductive Polymer Tantalum Solid Capacitors (POSCAP) with The Industry's Lowest Profile*1 to Support High-Output Power Delivery Required for USB Type-C Connections

　　Panasonic Industry Co., Ltd., a Panasonic Group company, announced that it will begin commercial production of its two models of Conductive Polymer Tantalum Solid Capacitors (POSCAP), 50TQT33M and 63TQT22M. These capacitors are incorporated into power circuits used for information and communication equipment, including laptops and tablets. They offer an ultra-high withstand voltage and high capacitance in a body with the industry’s lowest profile of 3 mm, supporting high-output power delivery through USB Type-C connectors. Mass production for these models is planned to start in December 2025.　　These capacitors are ideal for voltage stabilization and noise reduction in power supplies compliant with USB Power Delivery (USB-PD)[1] 3.1. While previous USB-C connectors supplied up to 100 W (20 V/5 A), USB-PD 3.1 expands this to 240 W (48 V/5 A). This enables widespread use of USB-C connectors for high-speed data transfer and rapid charging, and is expected to further expand applications to larger equipment requiring high power output, such as displays.　　On the other hand, information and communication equipment such as laptops are increasingly required to be thinner and more compact. Capacitors therefore must combine an ultra-high withstand voltage, high capacitance, and a low profile in order to fit into limited space. Panasonic Industry began mass production of Conductive Polymer Tantalum Solid Capacitors (POSCAP) in 1997 and, as an industry leader, has continuously delivered first-of-their-kind products. Leveraging proprietary powder molding technology and film formation technologies, the company has newly developed two models that achieve both an ultra-high withstand voltage and high capacitance in a package with the industry's lowest profile of 3 mm.　　Through these unique device technologies, Panasonic Industry will continue to contribute to enhancing the functionality of electronic equipment, including laptops, while also reducing the environmental impact through smaller, lighter devices and lower material usage.　　Key features:　　1. Achieves both an ultra-high withstand voltage and high capacitance*2 to support high-output USB Type-C power delivery, in a 3 mm profile—the lowest in the industry*1—enabled by proprietary powder molding and film formation technologies　　2. Lineup of USB-PD 3.1-compliant models rated at 50 V and 63 V　　3. Contributes to reduced material usage lower environmental impact through low-profile design　　*1 As of September 18, 2025, Conductive polymer tantalum solid capacitors with rated voltages of 50 V and 63 V and capacitance of 22 μF or higher (Panasonic Industry data)　　*2 USB-Power Delivery 3.1 (180 W/240 W output) compliant high-capacitance conductive polymer tantalum solid capacitors with rated voltages of 50 V and 63 V, and a capacitance of 22 μF or higherDetailed features:　　1. Achieves both an ultra-high withstand voltage and high capacitance to support high-output USB Type-C power delivery, in a 3 mm profile—the lowest in the industry—enabled by proprietary powder molding and film formation technologies　　To achieve capacitor performance required for USB-PD 3.1 power supplies in a low-profile body, both high capacitance and a high withstand voltage must be ensured, despite their trade-off relationship. High-capacitance tantalum powder is necessary for electrode materials, but its fine particle size makes molding difficult, creating challenges for stable production. Forming a uniform dielectric film on the surface of the electrodes is important for enhancing the withstand voltage. However, since electrodes made with high-capacitance tantalum powder contain extremely small internal pores, dielectric oxide films tend to develop imperfections.　　Panasonic Industry overcame these challenges by establishing proprietary technology to mold high-capacitance tantalum powder with uniform density, and by optimizing the film deposition process to create flawless dielectric films. This enabled the development of two new models that combine an ultra-high withstand voltage and high capacitance, meeting the USB-C high-output power delivery requirements in a 3 mm low-profile package.Cross-sectional view of POSCAP and enlarged view of the inside of the electrode body　　2. Lineup of USB-PD 3.1-compliant models rated at 50 V and 63 V　　Until now, Panasonic Industry’s POSCAP lineup extended only up to 35 V, with no models compatible with USB-PD 3.1, which extends the rated voltage specification to 36 V (180 W) and 48 V (240 W). The two new models, rated at 50 V and 63 V, each achieve a high capacitance of 22 μF or higher in a package with the industry's lowest profile of 3 mm. The full lineup provides flexibility to meet diverse applications and equipment specifications.　　3. Contributes to reduced material usage lower environmental impact through low-profile design　　Compared to the industry standard size*3, the new models reduce volume by 25%, contributing to a lower environmental impact through reduced material usage.　　*3 Comparison with the industry standard size (7.3 mm × 4.3 mm × 4 mm) of conductive polymer tantalum solid capacitors used in USB-PD 3.1 compliant power suppliesApplications:　　Voltage stabilization and noise reduction of USB-PD 3.1-compliant power supplies for laptops, displays, and peripheral equipment　　Arc discharge[2] countermeasures for USB-PD 3.1-compliant connectors　　Specifications:　　Life: 2,000 hours at 105°C; guaranteed operating temperature range: -55°C to 105°C　　Ripple current[3]: 100 kHz, 105°C　　ESR[4]: 100 kHz, 20°C　　*4 Product dimensional tolerance:　　Length (L): ±0.3 mm; Width (W): ±0.2 mm; Height (H): ±0.2 mmTerm descriptions:　　[1] USB-PD　　The power delivery standards established by the standard-setting organization USB Implementers Forum, Inc. (USB-IF). With the launch of USB-PD 3.1 in 2021, USB Type-C cables and connectors can now deliver up to 240 W of power, supporting a wide range of applications—from smartphones and laptops to larger equipment such as monitors.　　[2] Arc discharge　　An electric spark or discharge phenomenon that occurs when a high current flows at low voltage in electrical circuits.　　[3] Ripple current　　When a voltage fluctuation is applied to a capacitor, a corresponding charging or discharging current flows through the capacitor. The current applied to this capacitor is referred to as a ripple current. The higher the ripple current, the higher the allowable current.　　[4] ESR (Equivalent Series Resistance)　　Represents the value of an internal resistance component that can cause heat generation. Capacitors with lower ESR allow higher ripple currents and provide excellent noise absorption.

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Release time：2025-11-06 15:35 reading：737 Continue reading>>

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