Fibocom Fosters Local 5G AIoT Market with Newly Launched 5G Module FG370-KR at AIoT Korea 2024
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Fibocom Fosters Local 5G AIoT Market with Newly Launched 5G Module FG370-KR at AIoT Korea 2024

　　wireless communication modules, announces the launch of FG370-KR, a regional version of the FG370 series module, which is positioned to accelerate the commercial development of Korean’s 5G AIoT industries such as Fixed Wireless Access (FWA), live streaming, and industrial automation, etc. By adopting the advancements from FG370-KR, the solution allows local customers to benefit from the seamless 5G experience and fast-to-market industry solutions.　　5G subscribers in South Korea reached around 33 million as of the end of March 2024, according to the latest report from Statista. SK Telecom accounted for 15.9 million of the total 5G subscribers, followed by KT with 9.9 million and LG U+ with 7.2 million. At present, the country accelerates the rollout of commercial 5G services to industry-related field and shows strong growing trends. Fibocom's 5G Sub-6GHz module FG370-KR is compatible with Korea's mainstream 5G frequency bands, supports both 5G SA and NSA network architecture, making it an ideal 5G solution for industry customers that require high-transmission speed, large capacity, and ultra-low latency.　　Developed from the MediaTek T830 chipset platform, the FG370-KR is a 3GPP Release 16 compliant module that adopts a 4nm process integrated with an Arm Cortex-A55 quad-core CPU, leading to a 10% improvement in speed performance compared to the previous generation. In terms of data transmission, FG370-KR supports NR 4CA (Carrier Aggregation) with up to 300MHz bandwidth on the downlink, and NR 2CA in FDD and TDD hybrid mode on the uplink, reaches a maximum speed of up to 7.01Gbps DL and 1.25Gbps UL. In addition, it also supports PC2 of HPUE (High Power User Equipment) technology, significantly enhances 5G uplink capability and network coverage. It is worth highlighting that, FG370-KR can greatly reducing the time-to-market of customers’ devices with the support of a wide range of peripheral interfaces, including three PCI-Express, USB 3.2, two USXGMII interfaces along with software features such as Kernel, OpenWRT drivers.　　“The launch of the FG370-KR signifies that Fibocom will provide a Korea-dedicated solution for local customers, boosting the 5G adoption towards a larger-scale of industries with optimal network connectivity and enhanced operational efficiency, said Simon Tao, VP of Product Management Dept., Head of MBB BU at Fibocom. “We have the confidence in helping enterprises to accomplish the 5G commercialization with our industry know-how and expertise accumulated, without doubt, Korea’s 5G deployment will keep experiencing a fast-growing rate and Fibocom will continually invest in cutting-edge 5G module solutions and delivering superior wireless experience.”　　To learn more about 5G Sub-6GHz module and its demos, welcome to visit Fibocom booth #G101 on the 3rd Floor of Hall D in COEX at the AIoT Korea from October 30 to November 1 2024.
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Release time：2024-12-13 10:55 reading：849 Continue reading>>
Renesas’ R-Car Open Access Platform Accelerates Software-Defined Vehicle Development With Market-Ready Software
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Renesas’ R-Car Open Access Platform Accelerates Software-Defined Vehicle Development With Market-Ready Software

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today launched R-Car Open Access (RoX), a development platform for software-defined vehicles (SDVs) that integrates all essential hardware, operating systems (OS), software and tools needed for automotive developers to rapidly develop next-generation vehicles with secure and continuous software updates. Designed for the Renesas R-Car family of system on chips (SoCs) and microcontrollers (MCUs), the SDV platform includes comprehensive tools for the seamless deployment of AI applications. By pre-integrating all fundamental layers required to develop SDVs, RoX drastically reduces the complexities for car OEMs and Tier 1 suppliers, saving time and money.　　The advent of SDVs represents a major step forward in automotive technology – accelerating toward more driving autonomy, electrification and connected experiences. Cars have to be aware of the 360-degree surrounding space with ASIL D levels of sensing, processing and control to deliver safety and autonomy applications. The in-cabin experiences for drivers and passengers are being revolutionized. As a result, modern electrical/electronics (E/E) architecture depends on software to control vehicle functions, manage real-time data networks across different ECU zones, and provide customer differentiation. It has become more difficult to maintain and upgrade these complex software stacks while ensuring the highest levels of safety. Renesas’ customizable solution solves these challenges by offering a cloud-native development environment and a simulation platform, supporting the software-first approach and parallel hardware and software development.　　Out-of-box Platform with Market-Ready Software Stacks　　The flexible RoX SDV platform is available in two versions. “RoX Whitebox” is an open, easily accessible software package that includes royalty-free OS and hypervisor software such as Android Automotive OS, FreeRTOS, Linux, Xen and Zephyr RTOS, as well as reference applications designed for specific domain systems. “RoX Licensed” is based on industry-proven commercial software solutions, such as QNX and Red Hat In-Vehicle Operating System, as well as AUTOSAR-compliant software and SAFERTOS®. It is pre-integrated and tested to run on Renesas’ R-Car SoCs and MCUs and includes pre-validated software stacks from STRADVISION for Advanced Driver Assistance Systems (ADAS) and Candera CGI Studio for in-vehicle infotainment (IVI), to name a few. These software solutions can be easily productized and customized or expanded depending on OEMs’ needs.　　With the RoX SDV platform, automotive system engineers can start building their software immediately using a highly integrated toolchain even before the hardware is available. This is made possible through the cloud environment and the virtual development platform, which let developers design, debug in simulation, and verify their software before deploying on live SoCs and MCUs. The virtual development platform includes the Renesas Fast Simulator (RFS) as well as partner solutions such as ASTC VLAB VDM and Synopsys Virtualizer Development Kit (VDK) to provide broad coverage of simulation speed, features and use cases.　　For seamless end-to-end AI development, RoX offers the AI Workbench to enable developers to validate and optimize their models and test their AI applications all in the cloud, either on the virtual development platform or on Renesas board farms. A wide range of AI models, automated pipelines, as well as a specific hybrid compiler toolchain (HyCo) are available to support the rapid AI deployment on the R-Car heterogeneous compute platform across generations of SoCs.　　AWS Cloud Services Now Available　　The RoX SDV platform now supports Amazon Web Services (AWS) cloud computing services as part of the AI Workbench development environment. With the Renesas R-Car SDK (Software Development Kit) containerized in the AWS cloud environment, developers can innovate and optimize their designs more efficiently. This tight integration allows them to simulate and test hardware and software combinations instantly and deploy AI applications that seamlessly run on R-Car devices.　　Scalable R-Car Gen 5 Family　　The RoX SDV platform is designed for current generation R-Car SoCs, the upcoming R-Car Gen 5 MCU/SoC Family, and future devices. The SDV platform provides car OEMs and Tier1 suppliers the flexibility to design a broad range of scalable compute solutions for ADAS, IVI, gateway and cross-domain fusion systems as well as body control, domain and zone control systems.　　Renesas’ R-Car Gen 5 is currently the only hardware architecture in the industry that can accommodate the full range of processing requirements – from zonal ECUs to high-end central compute, serving from entry-level vehicles to luxury-class models. Thanks to a new unified hardware architecture based on Arm® CPU cores, customers developing with the R-Car Gen 5 devices will be able to reuse the same software and tools across diverse E/E applications that span car models and generations, preserving their engineering investments. Renesas’ high-performance SoC products will offer both domain-specific and cross-domain solutions using application processing, large display capabilities, sensor connectivity, GPU and AI processing.　　“RoX is a significant advancement that will speed up the shift-left approach for software-defined vehicles,” said Vivek Bhan, Senior Vice President and General Manager of High Performance Computing at Renesas. “Today, car OEMs and Tier1 suppliers are heavily investing in software development and maintenance. Renesas understands this challenge and is closely working with them to deliver a flexible, ready-to-deploy development solution that can be maintained throughout the vehicle’s lifespan. The RoX platform empowers our customers to design vehicles that deliver new value and bring improved safety and delightful comfort experiences to drivers and passengers.”　　“At AWS, we’re committed to helping our customers and partners accelerate development and bring innovation to drivers faster than ever before,” said Andrea Ketzer, Director of Technology Strategy, Automotive & Manufacturing at AWS. “With Renesas’ R-Car Gen 5 devices supported by the AI Workbench on AWS, customers will achieve faster and more validated simulations and the ability to develop independently of hardware. This step change in development will drive the industry forward and place software innovation at the forefront of mobility.”　　According to TechInsights, the market shift to domain, zonal and centralized architectures will translate to a growing processor market, incorporating SoCs and MCUs, worth $25.9 billion by 2031. “Being able to maintain and upgrade complex software stacks that incorporate operating systems, hypervisors and other functional software stacks will thus become an increasingly critical element of the supply chain,” said Asif Anwar, Executive Director of Automotive End Market Research at TechInsights. “By also being able to offer cloud-native environments to support a software-first approach to development and testing of the hardware, the Renesas RoX SDV platform offers a ready-built ecosystem that encompasses these elements in support of a scalable portfolio of next generation R-Car Gen 5 processors to address this sizable market.”　　Renesas’ R-Car Open Access Platform is being demonstrated at the AWS Summit Japan in Tokyo from June 20-21.　　RoX SDV Platform Partners:　　Operating System/Hypervisor Partners　　QNX　　Red Hat　　Vector AUTOSAR　　WITTENSTEIN SAFERTOS®　　Software Stack Partners　　Candera CGI Studio　　EPAM AosEdge　　Excelfore eSync　　MM Solutions　　STRADVISION SVNet　　Nullmax　　Development Tools Partners　　ASTC VLAB Works　　Synopsys Virtualizer Development Kit (VDK)　　Cloud Partners　　AWS　　Microsoft Azure　　Availability　　The R-Car Open Access Platform is available today with the option to license. Open-source OS, commercial OS, full application software stacks, virtual development, cloud infrastructure and debugging and emulation tools are available by Renesas or through partners. Additional information about the development platform is available here and information about the R-Car Gen 5 Family can be found here. Please contact your local sales teams for more details.
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Release time：2024-06-20 10:53 reading：1238 Continue reading>>
NVIDIA Confirms Development of “Compliance Chips” for the Chinese Market
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NVIDIA Confirms Development of “Compliance Chips” for the Chinese Market

　　According to IJIWEI’s report, NVIDIA recently confirmed that it is actively working on new “compliant chips” tailored for the Chinese market. However, these products are not expected to make a substantial contribution to fourth-quarter revenue.　　On November 21, during NVIDIA’s earnings briefing for the third quarter of 2024, executives acknowledged the significant impact of tightened U.S. export controls on AI. They anticipated a significant decline in data center revenue from China and other affected countries/regions in the fourth quarter. The controls were noted to have a clear negative impact on NVIDIA’s business in China, and this effect is expected to persist in the long term.　　NVIDIA’s Chief Financial Officer, Colette Kress, also noted that the company anticipates a significant decline in sales in China and the Middle East during the fourth quarter of the 2024 fiscal year. However, she expressed confidence that robust growth in other regions would be sufficient to offset this decline.　　Kress mentioned that NVIDIA is collaborating with some customers in China and the Middle East to obtain U.S. government approval for selling high-performance products. Simultaneously, NVIDIA is attempting to develop new data center products that comply with U.S. government policies and do not require licenses. However, the impact of these products on fourth-quarter sales is not expected to materialize immediately.　　Previous reports suggested that NVIDIA has developed the latest series of computational chips, including HGX H20, L20 PCIe, and L2 PCIe, specifically designed for the Chinese market. These chips are modified versions of H100, ensuring compliance with relevant U.S. regulations.　　As of now, Chinese domestic manufacturers have not received samples of H20, and they may not be available until the end of this month or mid-next month at the earliest. IJIWEI’s report has indicated that insiders have revealed the possibility of further policy modifications by the U.S., a factor that NVIDIA is likely taking into consideration.
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Release time：2023-11-23 13:24 reading：2573 Continue reading>>
Tech Giants Launch AI Arms Race, Aiming to Spark a Wave of Smartphone and Computer Upgrades
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Tech Giants Launch AI Arms Race, Aiming to Spark a Wave of Smartphone and Computer Upgrades

　　According to CNA’s news, the potential business opportunities in artificial intelligence have spurred major tech giants, with NVIDIA, AMD, Intel, MediaTek, and Qualcomm sequentially launching products featuring the latest AI capabilities.　　This AI arms race has expanded its battleground from servers to smartphones and laptops, as companies hope that the infusion of AI will inject vitality into mature markets.　　Generative AI is experiencing robust development, with MediaTek considering this year as the “Generative AI Year.” They anticipate a potential paradigm shift in the IC design industry, contributing to increased productivity and significantly impacting IC products.　　This not only brings forth new applications but also propels the demand for new algorithms and computational processors.　　MediaTek and Qualcomm recently introduced their flagship 5G generative AI mobile chips, the Dimensity 9300 and Snapdragon 8 Gen 3, respectively. The Dimensity 9300, integrated with the built-in APU 790, enables faster and more secure edge AI computing, capable of generating images within 1 second.　　MediaTek points out that the smartphone industry is experiencing a gradual growth slowdown, and generative AI is expected to provide new services, potentially stimulating a new wave of consumer demand growth. Smartphones equipped with the Dimensity 9300 and Snapdragon 8 Gen 3 are set to be released gradually by the end of this year.　　Targeting the AI personal computer (PC) market, Intel is set to launch the Meteor Lake processor on December 14. Two major computer brands, Acer and ASUS, are both customers for Intel’s AI PC.　　High-speed transmission interface chip manufacturer Parade and network communication chip manufacturer Realtek are optimistic. The integration of AI features into personal computers and laptops is expected to stimulate demand for upgrades, leading to a potential increase in PC shipments next year.　　In TrendForces’ report on November 8th, it has indicated that the emerging market for AI PCs does not have a clear definition at present, but due to the high costs of upgrading both software and hardware associated with AI PCs, early development will be focused on high-end business users and content creators.　　For consumers, current PCs offer a range of cloud AI applications sufficient for daily life and entertainment needs. However, without the emergence of a groundbreaking AI application in the short term to significantly enhance the AI experience, it will be challenging to rapidly boost the adoption of consumer AI PCs.　　For the average consumer, with disposable income becoming increasingly tight, the prospect of purchasing an expensive, non-essential computer is likely wishful thinking on the part of suppliers. Nevertheless, looking to the long term, the potential development of more diverse AI tools—along with a price reduction—may still lead to a higher adoption rate of consumer AI PCs.　　Read more　　Key Development Period for AI PCs in 2024; Global Notebook Market Set to Rebound to Healthy Supply-Demand Cycle with an Estimated Growth Rate of 3.2%, Says TrendForce。
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Release time：2023-11-21 10:41 reading：426 Continue reading>>
Fibocom Unveils 4G Premium Smart Module SC228 to Drive AIoT Applications in the Global Market
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Fibocom Unveils 4G Premium Smart Module SC228 to Drive AIoT Applications in the Global Market

　　Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, announces the release of a new LTE smart module SC228 for the acceleration of digital transformation in smart retailing, smart wearable camera, Industrial IoT, In-vehicle infotainment market. Integrated with a 6nm processor, the module utilizes the powerful CPU and GPU to deliver superior multimedia performance while conserving power. Compatible with frequency bands worldwide, the module also supports Bluetooth and dual-band Wi-Fi for short-distance wireless communication.　　The integration of AI and IoT is reshaping the way that decision-makers from various industries operate and respond to real-time information. The highly integrated smart module SC228 is capable of offering a comprehensive solution for industry customers to improve product performance and facilitate the decision-making process. Equipped with a powerful CPU, SC228 can support the smooth running of AI algorithms, which ensures the terminals realize a bunch of functionalities such as facial recognition, HMI (Human-machine Interaction), etc. In terms of multimedia processing, the SC228 is integrated with a low-power island DSP (Digital Signal Processors) for sensors and audio, furthermore, it also supports multi-camera input and output with up to three of them working simultaneously. To cater to diverse IoT application scenarios, the SC228 is designed with rich interfaces including MIPI/ USB/ UART/ SPI/ I2C to help customers develop the terminals flexibly. In software design, the SC228 is preset with an upgradable Android 14 operating system in cope with the ever-evolving software innovations, which can help our customers quickly meet the requirements for GMS (Google Mobile Service) certification and continuous development for long lifecycle terminals. Notably, the premium smart module is also built-in with GNSS for fast and accurate positioning for mobile scenarios.　　“AI-driven productivity is inevitably evolving as an essential to extend the capabilities of IoT devices, significantly improve the operational efficiency by enriching the IoT device with edge computing,” said Eden Chen, General Manager of MC BU at Fibocom. “We are pleased to be at the forefront of the AIoT market to provide a comprehensive, highly integrated SC228 smart module solution for various industries, looking forward, we are optimistic to unleash the interconnected intelligence with our powerful smart module portfolio.”　　Engineering sample will be available by late December 2023.
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Release time：2023-11-21 10:22 reading：2254 Continue reading>>
Qualcomm and Other Major Players Unveil New Arm-Based Processors, Targeting a Slice of the PC CPU Market
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Qualcomm and Other Major Players Unveil New Arm-Based Processors, Targeting a Slice of the PC CPU Market

　　During the Snapdragon Summit 2023 in October, Qualcomm made a big announcement by introducing the Snapdragon X Elite chip, built on TSMC’s cutting-edge 4nm process. Qualcomm’s claim is bold; they assert that the chip will deliver superior performance compared to Intel’s x86 architecture and Apple’s M2 chip. Simultaneously, towards the end of October, Apple revealed its own Arm-based M3 chip. Notably, semiconductor giants AMD and NVIDIA are rumored to be exploring the development of new PC processors on the Arm architecture. The future outlook suggests that Arm-based processors may gradually cut in the market share traditionally held by x86 architecture processors.　　TrendForce’s Insights:　　Qualcomm’s New PC Processor Poised to Expand the Arm-Based PC Processor Market　　Following Intel’s September 2023 Meteor Lake processor release, Qualcomm introduced the Snapdragon X Elite, its latest Arm-based PC processor in October. This chip leverages TSMC’s advanced 4nm technology. Qualcomm is forging partnerships with Taiwanese heavyweights such as Quanta, Compal, Wistron, Acer, Asus, Realtek, Nuvoton and others, aiming to secure a foothold in the CPU market within the PC supply chain. This collaborative effort is expected to yield new PC products hitting the market in 2024.　　As of 2023, Arm commands approximately 11% of the market share. Apple, a pioneer in PC chips built on the Arm architecture, has seen success with the release of three generations of processors since the 2020 debut of M1 chip.　　With Qualcomm entering the Arm architecture group, AMD also intends to step into Arm architecture with the upcoming Phoenix processor, set for launch in 2025. There are also whispers of NVIDIA partnering with MediaTek to develop a chip processor featuring SoC+GPU capabilities on the Arm architecture, with an initial focus on ChromeBook market, where MediaTek boasts years of experience.　　In the PC market, significant factors include processor development timelines, product performance, power efficiency, extended battery life, and compatibility with software and hardware. High-end CPUs and GPUs have become indispensable components for high-end computers. Currently, Intel leads the CPU market, with AMD following closely in the x86 landscape. As more companies delve into the development of Arm-based processors, there is potential for them to carve a share from the x86 market in the future.　　Arm Architecture Processors Gain Momentum, Intel Focusing on AI Software Application Processor Development　　Apple’s M-series chips demonstrate their efficiency and extended battery life. Microsoft recognizes the advantages of the Arm architecture and is dedicated to fostering a strategic collaboration for Windows on Arm. This collaboration involves integrating operating systems with processors to attract leading manufacturers to engage in Arm-based processor development, aligning with the growing demands for AI PCs.　　In the realm of x86 architecture, Intel enjoys a dominant position in the CPU market. To tap into the opportunities arising from AI PCs, Intel has integrated AI acceleration engine features into its processors, introducing a new generation of AI application processors that combine CPU, GPU, and NPU (Neural Processing Unit) functionalities. This caters to the growing demand for generative AI applications in enterprise mobile PCs. Furthermore, Intel has joined forces with major laptop brands to launch new AI PCs, aiming to seize a substantial share of the market.　　As momentum grows in Arm-based processor development, Intel maintains confidence that their immediate effect on the demand for x86 architecture processors will be restrained. It is unlikely to hinder Intel’s continuous advancement in developing new processors. Unlike competitors concentrating on Arm architecture processor development, Intel places a stronger focus on AI software applications and the market opportunities arising from its partnership with the Microsoft platform.
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Release time：2023-11-07 14:45 reading：2327 Continue reading>>
Focus on the Industrial Equipment Market: ROHM launches ‘Product Longevity Program’
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Focus on the Industrial Equipment Market: ROHM launches ‘Product Longevity Program’

　　ROHM has recently launched a dedicated page for a new Product Longevity Program. It provides information on the estimated supply periods for products scheduled for long-term supply – suitable for industrial equipment and other applications with long life cycles.　　In recent years, semiconductors and electronic components are being increasingly installed in long-life applications, such as industrial equipment and automotive systems – requiring the disclosure of applicable products and clarification of supply periods to facilitate product selection.　　Products formally placed under the program (selected after considering the production system, equipment, material procurement status, and other factors) are disclosed along with the estimated supply periods. The goal: improving searchability by increasing the efficiency of customer product selection.　　The PLP sets supply periods of 10 to 20 years for products (mainly power and analog) requiring long-term supply, with relevant information such as supply status posted on ROHM’s website. This information (target products, supply periods) will be updated once a year to ensure the continuity of customer operations.　　As the role of semiconductors in the industrial equipment and automotive markets continues to grow, ROHM will strive to provide long-term supply that meets market needs and contributes to the creation of a sustainable society through an expanding lineup of superior products.　　‘Quality is our top priority at all times’ has always been ROHM’s goal. In line with a corporate objective of ‘contributing to the advancement and progress of culture through a consistent supply, under all circumstances, of high quality products in large volumes to the global market,’ ROHM has been supplying products that meet customer demands to achieve a sustainable society.
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Release time：2023-09-07 14:06 reading：2494 Continue reading>>
Current Situation and Prospect Analysis of Electronic Components Market in 2023
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Current Situation and Prospect Analysis of Electronic Components Market in 2023

　　According to data, the scale of China’s electronic components market has increased from 1.831 billion RMB in 2017 to 2.2095 billion RMB in 2021, with a compound annual growth rate of 4.8%. It is expected to reach 2.3769 billion RMB in 2023. The global electronic components market will grow from US$2.5 trillion in 2017 to US$2.9 trillion in 2021, with a compound annual growth rate of 3.8%. It is expected to reach US$3.1 trillion in 2023. The proportion of China’s electronic components market in the global market has increased from 23.2% in 2017 to 24.1% in 2021, and is expected to reach 24.6% in 2023.　　From the perspective of different types of electronic components, semiconductor devices are the largest market segment, accounting for nearly half of the global electronic components market, followed by passive devices and optoelectronic devices. Among semiconductor devices, memory chips are the largest single category, accounting for more than 20% of the global semiconductor market. Among passive devices, capacitors are the largest single category, accounting for more than 30% of the global passive device market. Among optoelectronic devices, LED is the largest single category, accounting for more than 60% of the global optoelectronic device market.　　Electronic components market structureFrom the perspective of geographical distribution, Asia is the main consumption area of the global electronic components market, accounting for more than 60% of the global market. Among them, China is the largest consumer of electronic components in Asia and the world, accounting for more than 40% of the Asian market. Europe and North America accounted for 15% and 14% of the global market, respectively, while other regions accounted for 11%.　　From the perspective of industry applications, consumer electronics is the largest terminal demand field in the global electronic components market, accounting for more than 30% of the global market. Among them, mobile phones, smart homes, and personal computers are the main application products in the field of consumer electronics. Automobile is the fastest-growing terminal demand field in the global electronic components market, accounting for about 15% of the global market. Among them, new energy vehicles, smart cars, and Internet of Vehicles are the main application directions in the automotive field. Other industry applications include communications, industry, medical, military, etc., each accounting for about 10% of the global market.　　Development trend of electronic components marketThroughout 2023, the global electronic components market will be affected by the following aspects:　　(1) Demand in emerging fields. With the rapid development of emerging fields such as 5G communications, new energy vehicles, the Internet of Things, and artificial intelligence, the demand for electronic components will continue to grow. The requirements for electronic components in these emerging fields are not only an increase in quantity, but also an improvement in quality, requiring higher performance, lower power consumption, smaller size, and higher integration. This will promote the electronic components industry to accelerate technological innovation and product upgrading.　　(2) Acceleration of domestic substitution. Affected by the United States export controls on China’s semiconductor technology, China’s electronic components industry is facing the challenge of supply chain disruption and security risks. In order to protect its own development and national security, the Chinese government and enterprises will increase investment and support for the electronic components industry, and promote breakthroughs in core technologies and independent innovation. It is expected that by 2023, China’s domestic substitution rate in subdivided fields such as memory chips, power chips, and analog chips will increase significantly, and some products will achieve self-sufficiency or export.　　(3) Impact of trade frictions. The U.S. escalation of China’s semiconductor technology export control not only affects the development of China’s electronic components industry but also has an impact on the supply-demand balance and price stability of the global electronic components market. In the short term, this may lead to a shortage of supply and higher prices in the global electronic components market, putting cost pressure on downstream industries. In the long run, this may prompt the adjustment and reorganization of the global electronic components industry chain, forming a multi-polar competition pattern.　　(4) Promotion of digital transformation. With the development of technologies such as the Internet, big data, and cloud computing, the electronic components industry will also accelerate digital transformation, using digital platforms to improve production efficiency, reduce operating costs, optimize supply chain management, and improve customer experience. Especially under the influence of the pandemic, the electronic components industry will pay more attention to the development and operation of online channels, and use e-commerce platforms to expand market coverage and service scope.
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Release time：2023-08-28 16:00 reading：3151 Continue reading>>
AMEYA360:A Refutation of “China’s Underground Market of Chips Draws Desperate Automakers” by Bloomberg 2
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AMEYA360:A Refutation of “China’s Underground Market of Chips Draws Desperate Automakers” by Bloomberg 2

　　In China, cars are basically standardized products when they leave the factory. In order to meet the personalized and diversified needs of car owners, there is a huge "car aftermarket", namely 4S stores, maintenance stations, and modification plants, where automobile enthusiasts can modify or add some products into their vehicles. Products in the aftermarket do not have to pass the vehicle regulations. These parts will never change the core electronic components or interfere with the car safety, as they belongs to peripheral products. I did a survey and found that most so-called car chips speculated in Huaqiangbei belong to this category! They do not belong to the ABS, ESP, and other parts asserted by Bloomberg in the article!　　Introduction to Slkor in Chinese and English　　III.Inspection of electronic components　　I, SONG Shiqiang, as a stall economist in Huaqiangbei and the General Manager of Kinghelm and Slkor, explored some rules by using the basic theories of "Kondratieff waves" and "Fiboracci Arc" in Macroeconomics. With due consideration of the effect of the cyclical constraints of the electronic component industry, functions of the electronic component reservoir in sales order configuration, I found out some rules of electronic business in Huaqiangbei. Once I had drunk too much in Huaqiangbei, I spoke the knack out in bragging.         A businesswoman heard about my elucidation on the knack and was consequently enlightened. She followed the ways and means proposed in the elucidation in her speculation and made much profit worth several Bentley cars. She even sent a Bentley model to me to express her gratitude. Businesswomen in Huaqiangbei sighed with astonishment that in addition to writing jokes and advertisement, Mr. SONG from Kinghelm also knew a lot about stall business in Huaqiangbei, "How I wish to meet him  before my speculation rather than after that". One day, I was having tea with businesswomen in Huaqiangbei to do a pre-sale roadshow for my new book “Guide to Speculation in Huaqiangbei”. I accidentally saw a boss throwing a package of glittering items into the trash can behind a small counter. I picked the package up because I enjoy learning. I found it was a package of thin objects covered with a thin layer of blue film! Later, I asked experts of the industry and knew that they were wafer scraps with demerits sold to Huaqiangbei at lower prices from wafer fabs.           Afterthese wafer scraps are sealed and tested, they become electronic components sold in counters and stalls in Huaqiangbei. If you want to trace the brand, model, or even the production date, you can find a professional testing company for help. If you need a testing authority, the No. 5th Research Institute of the Ministry of Industry and Information Technology (CEPREI) in Guangzhou is recommended. In contrast, White Horse Laboratories is a more convenient choice. Additionally, 360IC also has a lab similar to this. By chance, I found ways and means to test electronic components. For problems arising out of the electronic components, causes of problems should be analyzed. If there are disputes, all responsibilities should be clearly defined, or some information should be traced and confirmed. Then the test and inspection of electronic components will play a role.　　For example, a testing company has advanced ultrasonic testing equipment capable of doing non-destructive tests widely applied in material test, failure analysis, Research and Development (R&D), Quality Assurance and Reliability (QA/REL) tests. Items can be inspected include electronic components, LEDs, metal substrates, cracks, delamination, cavities and other irregularities. The image contrast can be used to identify the internal impedance anomalies of materials, to determine the shape and size of defects, and to determine the positions of defects. I observed wafer scraps mentioned above with a 1000x magnifying instrument lent from a friend of mine. They were found memory chip made by TSMC with models and capacity specifications clearly visible! Of course, the conventional opening, sol, electrical performance testing, sealing material testing, and sealing process analysis are all available. After this comprehensive test, similar to four ways of diagnosis --looking, listening, inquiring and feeling the pulse practiced by a doctor trained in the traditional Chinese medicine and blood test practiced by a doctor trained in the western medicine, the DNA result reveal the parents of a child clearly!　　Test results of wafer scraps found in Huaqiangbei　　What I want to state here under my name SONG Shiqiang from Kinghelm and Slkor is that in procurement of expensive chips especially those for vehicle use from Huaqingbei, the test report from the professional lab is prerequisite for the issuance of a Purchase Order from a customer for both samples and small batches. A buyer with rich procurement experience in Huaqiangbei knows the origin of a chip, the level of processing of a chip and stage of modifying for a chip through visual inspection with his naked eyes. That is why I was shocked by the simplicity involved in buying chips for vehicle use described in the article by Bloomberg easier than blowing a whistle. Too much emphasis on the importance of customer relationship in the article revealed a blurred business image in Huaqiangbei that is far away from real business practice. The prerequisite for business in Huaqiangbei is the stock available and the same stock with authenticity!
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Release time：2023-05-05 11:07 reading：1848 Continue reading>>
Ameya360:Philippine Smartphone Market Recorded Its Biggest Annual Decline Yet
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Ameya360:Philippine Smartphone Market Recorded Its Biggest Annual Decline Yet

　　The Philippine smartphone market marked its biggest annual decline yet by shipping 16.3 million units in 2022, down by 8.6% year-on-year (YoY), according to the International Data Corp.’s (IDC) Quarterly Mobile Phone Tracker.　　Though the last quarter in 2022 grew by 6.3% quarter-on-quarter (QoQ), it registered a 16.3% decline compared to last year as several vendors focused on clearing out inventories rather than bringing in new shipments during the holiday season due to unfavorable market conditions.　　“Both consumer and vendor confidence have been seriously dampened as inflation progressively soared throughout 2022 ending the year at a 14-year high,” says Angela Medez, Senior Market Analyst at IDC Philippines.　　realme maintained the top spot in 2022 by launching several new smartphones in the narzo series to cater to the price-conscious customer, while Transsion was the only company in the Top 5 rankings that registered growth. Both of its Infinix and Tecno brands upscaled their products in bringing in more models in the higher price range of US$100+, such as Infinix’ Note series and Tecno’s Pova and Camon series, while itel continued to cater to the entry-level segment.　　“Though inventory levels started to normalize towards the end of 2022, IDC is lowering its forecast for 2023 as vendors will remain cautious in their shipments amid the looming economic uncertainties and accelerating inflation,” Medez added.
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Release time：2023-02-21 15:13 reading：1802 Continue reading>>

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