Toshiba Reportedly Mulls Memory Chip IPO as Backup Plan

Release time：2018-01-23
author：Ameya360
source： Dylan McGrath
reading：1192

　　Toshiba is considering a public offering of its Toshiba Memory spinoff the proposed $18 billion sale to a consortium led by Bain Capital doesn't receive regulatory approval by March 31, according to reports.

　　The Financial Times reported that an IPO is one of the contingency plans being considered by Toshiba executives in the event that regulatory approval isn't granted by the end of the Japanese fiscal year. The report, which cites unnamed persons said to be familiar with Toshiba's plans, said some analysts and Toshiba shareholders favor IPO over the existing deal to sell to a group include Bain, Apple, Dell and others.

　　Toshiba has been working for nearly a year to sell its highly profitable memory chip business to help offset massive losses incurred by its U.S. nuclear power subsidiary. After several false starts, Toshiba struck a deal with the Bain-led group last September. However, the deal remains subject to the approval of regulators.

　　Toshiba is no longer under pressure to sell the spin off as quickly as possible after the company raised $5.4 billion in capital through an offering of new stock last year.

（"Note: The information presented in this article is gathered from the internet and is provided as a reference for educational purposes. It does not signify the endorsement or standpoint of our website. If you find any content that violates copyright or intellectual property rights, please inform us for prompt removal."）

Previous：Everspin Targets Niches for MRAM

Next：TSMC Sees HPC Driving Business

Online messageinquiry

reading
Toshiba Building New Facility to Expand Power Semiconductor Production Capacity
Trade news

Toshiba Building New Facility to Expand Power Semiconductor Production Capacity

　　Toshiba will construct a new back-end production facility for power semiconductors to boost its production capacity.　　Toshiba Electronic Devices & Storage Corp. will construct a new back-end production facility for power semiconductors at its Himeji Operations – Semiconductor, in Hyogo Prefecture in western Japan. Construction will start in June 2024, with production scheduled to start in spring 2025. The project will more than double Toshiba’s automotive power semiconductor production capacity at Himeji, against fiscal 2022.　　Power devices are essential components for managing and reducing power consumption in all kinds of electronic equipment, and for saving energy. Above all other products, demand for low-voltage MOSFETs (metal oxide semiconductor field effect transistors), a Toshiba focus technology, is expected to see continued growth with the progress of vehicle electrification and the automation of industrial equipment. Toshiba has decided to meet this demand growth with construction of the new back-end facility.　　Going forward, Toshiba will expand its power semiconductor business and boost competitiveness by offering high efficiency, high reliability products in response to fast growing demand, and to contribute to carbon neutrality.
2022-12-26 13:44 reading：3508
Toshiba announces next-generation superjunction power MOSFETs
Trade news

Toshiba announces next-generation superjunction power MOSFETs

Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has launched a new series of next-generation 650V power MOSFETs that are intended for use in server power supplies in data centers, solar (PV) power conditioners, uninterruptible power systems (UPS) and other industrial applications.The first device in the DTMOS VI series is the TK040N65Z, a 650V device that supports continuous drain currents (ID) up to 57A and 228A when pulsed (IDP). The new device offers an ultra-low drain-source on-resistance RDS(ON) of 0.04Ω (0.033Ω typ.) which reduces losses in power applications. The enhancement mode device is ideal for use in modern high-speed power supplies, due to the reduced capacitance in the design.Power supply efficiency is improved as a result of reductions in the key performance index / figure-of-merit (FoM) – RDS(ON) x Qgd. The TK040N65Z shows a 40% improvement in this important metric over the previous DTMOS IV-H device, which represents a significant gain in power supply efficiency in the region of 0.36%[1] – as measured in a 2.5kW PFC circuit.The new device is housed in an industry-standard TO-247 package, ensuring compatibility with legacy designs as well as suitability for new projects.Toshiba will continue to expand their product lineup to meet market trends and help improve the efficiency of power supplies and systems.The new device enters mass production today and shipments begin immediately.
2018-08-21 00:00 reading：3192
Toshiba Memory announces merger with K. K. Pangea
Trade news

Toshiba Memory announces merger with K. K. Pangea

Toshiba Memory Corporation today announced that it consummated the merger with K. K. Pangea which is its parent company on August 1, 2018. The company name after the merger is Toshiba Memory Corporation. Today the company also introduces the executive officer system to improve the efficiency of business execution and strengthen the corporate governance. The outline of Toshiba Memory and the list of its directors, executive officers and statutory auditors as of August 1, 2018 are as follows.Toshiba Memory Corporation is dedicated to the development, production and sales of flash memory and SSDs. In April 2017, Toshiba Memory was spun off from Toshiba Corporation, the company that invented NAND flash memory in 1987. Toshiba Memory pioneer cutting-edge memory solutions and services that enrich people’s lives and expand society’s horizons.
2018-08-02 00:00 reading：3192
Toshiba Memory Corporation develops 96-layer BiCS FLASH with QLC technology
Trade news

Toshiba Memory Corporation develops 96-layer BiCS FLASH with QLC technology

Toshiba Memory Corporation today announced that it has developed a prototype sample of 96-layer BiCS FLASH, its proprietary 3D flash memory, with 4-bit-per-cell (quad level cell, QLC) technology that boosts single-chip memory capacity to the highest level yet achieved.Toshiba Memory will start to deliver samples to SSD and SSD controller manufacturers for evaluation from the beginning of September, and expects to start mass production in 2019.The advantage of QLC technology is pushing the bit count for data per memory cell from three to four and significantly expanding capacity. The new product achieves the industry’s maximum capacity [1] of 1.33 terabits for a single chip which was jointly developed with Western Digital Corporation.This also realizes an unparalleled capacity of 2.66 terabytes with a 16-chip stacked architecture in one package. The huge volumes of data generated by mobile terminals and the like continue to increase with the spread of SNS and progress in IoT, and the need to analyze and utilize that data in real time is expected to increase dramatically. That will require even faster than HDD, larger capacity storage and QLC products using the 96-layer process will contribute a solution.A packaged prototype of the new device will be exhibited at the 2018 Flash Memory Summit in Santa Clara, California, USA from August 6th to 9th.Looking to the future, Toshiba Memory will continue to improve memory capacity and performance and to develop 3D flash memories that meet diverse market needs, including the fast expanding data center storage market.
2018-07-24 00:00 reading：3100
Popular categories
Boxes, Enclosures, Racks Cables, Wires Circuit Protection Connectors, Interconnects Development Kits Electromechanical Embedded Solutions Fans, Thermal Management Optoelectronics Others Passive Components Power Semiconductors Sensors, Transducers Test and Measurement
  • Week of hot material
  • Material in short supply seckilling
model brand Quote
TL431ACLPR Texas Instruments
MC33074DR2G onsemi
RB751G-40T2R ROHM Semiconductor
CDZVT2R20B ROHM Semiconductor
BD71847AMWV-E2 ROHM Semiconductor
model brand To snap up
IPZ40N04S5L4R8ATMA1 Infineon Technologies
BP3621 ROHM Semiconductor
BU33JA2MNVX-CTL ROHM Semiconductor
TPS63050YFFR Texas Instruments
ESR03EZPJ151 ROHM Semiconductor
STM32F429IGT6 STMicroelectronics
Hot labels
ROHM
IC
Averlogic
Intel
Samsung
IoT
AI
Sensor
Chip
Original authorized brand
More Licensed Brands>>
Information leaderboard
  • Week of ranking
  • Month ranking

About us

Qr code of ameya360 official account

Identify TWO-DIMENSIONAL code, you can pay attention to

AMEYA360 weixin Service Account AMEYA360 weixin Service Account
AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.

Please enter the verification code in the image below：

verification code