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Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, has developed three System-on-Chip (SoC) technologies for automotive multi-domain electronic control units (ECUs). They feature advanced AI processing capabilities and chiplet functions, serving as the core technology platform for next-generation automotive electrical/electronic (E/E) architectures. Renesas presented the results at the International Solid-State Circuits Conference 2026 (ISSCC 2026), held February 15–19 in San Francisco, USA.　　In the age of software-defined vehicles (SDVs), automotive SoCs require advanced performance to run multiple applications simultaneously and must offer scalability through chiplets. They must also meet the functional safety requirements of automotive SoCs. As multi-domain SoCs powering central computing are growing larger and more complex, maintaining automotive-grade quality is becoming more difficult. With increased performance in advanced SoCs, power consumption also rises, making improvements in power efficiency and safety vital. To meet these needs, Renesas has developed the following new technologies.　　1. Chiplet architecture that supports functional safety　　To meet the functional safety requirements of automotive SoCs, Renesas has developed a new, proprietary architecture that supports ASIL D even in a chiplet configuration. By combining the standard die-to-die UCIe interface with a proprietary RegionID mechanism, the architecture prevents interference with hardware resources, even when numerous applications run simultaneously, thereby achieving Freedom from Interference (FFI).　　Conventional UCIe interfaces lack functionality to transmit RegionIDs between dies. Renesas developed a method for mapping RegionIDs into physical address space, encoding them into the UCIe region, and transmitting them. This enables safe access control through the memory management unit (MMU) and real-time cores, and meets functional safety requirements across chiplets. Additionally, by maintaining bandwidth from processors to the memory bus, the UCIe interface was confirmed through testing to achieve a high transmission speed of 51.2 GB/s, approaching the upper limit of intra-SoC transfer speeds. This technology provides both scalability and safety for high-performance automotive SoCs.　　2. Advanced AI processing capabilities and automotive-grade quality　　Automotive-grade quality is vital for SDV systems. Renesas has created a 3 nm SoC design that improves the performance of neural processing units (NPUs) for AI processing, while maintaining automotive-grade quality. In recent years, NPUs have been growing larger, with their area expanding 1.5-fold compared to previous generations. This has led to increased clock latency between shared clock sources and individual circuits. To address this problem, Renesas has redesigned the clock architecture by splitting up clock pulse generators (CPGs), which in past designs were module-level units, and placing mini-CPGs (mCPGs) at the sub-module level. This greatly reduces clock latency and meets timing requirements.　　However, multi-layer mCPGs complicate test clock synchronization, which is critical for achieving zero defects in automotive applications. Renesas has integrated test circuits into the hierarchical CPG architecture and unified the signal path for user clocks and test clocks. The new design also synchronizes upper- and lower-level mCPGs under a single clock source in test mode. This makes unified phase adjustment possible. As a result, Renesas has been able to achieve quality aligned with zero-defect expectations, even for large-scale SoCs, providing the high reliability required for next-generation SDV automotive SoCs.　　3. Advanced power control and monitoring for improved power efficiency and safety　　To achieve the high level of performance required for automotive SoCs with improved power efficiency and safety, Renesas has developed advanced power gating technology that uses over 90 power domains. It enables precise power control, from several milliwatts to several tens of watts, depending on operating conditions. Furthermore, Renesas has split power switches (PSWs) into ring PSWs and row PSWs to reduce IR drops (voltage drops) associated with increasing current density from smaller process geometries. When power is turned on, the ring PSW suppresses rush currents. Then the row PSW equalizes impedance within the domain. Together, these reduce IR drops by roughly 13% compared with conventional designs.　　To meet ASIL D functional safety standards, the dual core lock step (DCLS) configuration controls the master and checker cores with independent power switches and controllers. With this design, even if one side fails, the failure can be detected through lockstep operation. Furthermore, loopback monitoring is performed for each PSW's gate signal, so OFF states are detected when a failure occurs. A digital voltage meter (DVMON), which is highly resistant to temperature drift, is used for voltage monitoring. This improves aging tolerance by 1.4 mV. These technologies enable high-performance automotive SoCs that offer both power efficiency and safety.　　These new technologies are being used in Renesas' R-Car X5H SoC for automotive multi-domain ECUs. With R-Car X5H, users can accelerate the evolution of SDVs while ensuring safety and enabling autonomous driving, digital cockpit and more.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at renesas.com. Follow us on LinkedIn, Facebook, X, YouTube, and Instagram.　　(Remarks) All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.

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Renesas

Release time：2026-02-28 15:45 reading：244 Continue reading>>

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Fullhan launches FH8626V300: 2M/3M IP Camera SoC

　　FH8626V300 is a cost-effective and easy to develop 2M/3M IP camera solution. The chip integrates a high-performance ISP module and H.264/JPEG encoder, delivering excellent image processing capability, high encoding quality, and low bitrates.It also incorporates 64MB DDR2 memory and provides a complete set of peripheral interfaces required for IP camera applications, including USB, SDIO, and Ethernet, making it suitable for a wide range of network camera products.FH8626V300 features a high-performance 0.5T NPU, enabling intelligent functions such as smart detection.

Key word：

Fullhan

Release time：2026-02-10 16:49 reading：437 Continue reading>>

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MQ771-GL: Fibocom’s Compact Cat.M Module Enters Sampling, Driving Asset Tracking Innovation

　　Fibocom (300638.SZ | 0638.HK), a global leader in wireless communicationmodules and AI solutions, announced that its Cat.Mmodule MQ771-GL has entered the engineering sample stage. Withits ultra-compact size, low power consumption,global frequency coverage, and stable network compatibility,the MQ771-GL offers a cost-effective IoT solution for asset tracking, enablinglong battery life, high reliability, and precise positioning for large-scaleLPWA deployments.　　Dual-Mode Support for FlexibleDeployment　　The MQ771-GL supports 3GPP Release 14Cat.M1 and NB-IoT standards and is compatible with mainstream frequencybands worldwide, making it ideal for LPWA network deployments across NorthAmerica, Europe, Asia, and beyond. This global compatibility ensuresreliable connectivity for asset tracking devices and enables flexible operationeven in complex or challenging environments.　　Compact Size with Ultra-Low Power Consumption　　Leveraging advanced power managementtechnologies, the MQ771-GL supports PSM (Power Saving Mode) and eDRX (extendedDiscontinuous Reception), dramatically extending device battery life. InPSM mode, standby current drops to the microampere (μA) level, cutting powerconsumption by 75% compared with the previous generation — ideal for smartwater meters. In eDRX mode, power usage is reduced by 90%, making itsuitable for gas meters, asset trackers, and other long-term outdoor devices,enabling multi-year operation.　　The module’s 17.7mm × 15.8mm LGA package is compatible with the pin layout of Fibocom’s Cat.1 modules, supportingflexible product iteration. Its compact form factor is well-suited forspace-constrained tracking devices, simplifying integration and deployment.　　Enhanced Performance with Rich InterfaceOptions　　The MQ771-GLsupports MQTT, CoAP, LwM2M and standard interfaces like UART, I2C,and I2S, making it adaptable for diverse asset tracking terminals. Itintegrates Soft GPS for precise real-time positioning and features a hardware-levelsecurity engine for encrypted, secure communications, protecting againstunauthorized access.　　Liu Sunzhi,General Manager of Fibocom’s MTC Business Unit, commented:　　"With the MQ771-GL now entering the engineering sample stage, itsultra-compact, ultra-low-power design is set to lower development barriers forasset tracking terminals and accelerate large-scale IoT connectivity. Movingforward, we will continue to strengthen collaborative innovation with verticalindustries, driving the rapid commercialization of low-power, wide-connectivitysolutions for asset tracking and other IoT applications."

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Fibocom

Release time：2026-02-06 17:41 reading：426 Continue reading>>

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Fibocom Launches Global LTE Cat.1 bis Module LE271-GL

　　January 14, 2026 – Fibocom (300638.SZ | 0638.HK), a global leader in wireless communication modules and edge AI solutions, today announced the launch of its global LTE Cat.1 bis module, LE271-GL, providing IoT devices with single-SKU global connectivity. With compact size, global frequency coverage, low power consumption, and high compatibility, the LE271-GL offers a cost-effective 4G solution for worldwide IoT applications such as asset tracking, IP cameras, new energy systems, and consumer electronics.　　Compact Design and Global Coverage　　Measuring 17.7mm × 15.8mm, the LE271-GL is pin-to-pin compatible with Fibocom’s MC661, LE270, and LE37X series, as well as other modules of similar packaging. Customers can migrate without changing PCB designs. Supporting both FDD-LTE and TDD-LTE bands, the module covers all major global frequencies under a single SKU, simplifying inventory management and reducing logistics costs for international deployment.　　High Performance and Fast Network Access　　The LE271-GL ensures quick and stable connections, achieving network registration in under 3.5 seconds. Optimized AT command response and USB enumeration improve device startup and connectivity efficiency. Its OpenCPU architecture provides flexibility for secondary development, lowering overall device costs.　　Ultra-Low Power and Extended Battery Life　　Optimized for battery-powered applications, the LE271-GL achieves microamp-level sleep current and supports DRX and other low-power modes. Interfaces including VDD_EXT and multiple GPIOs remain powered in standby, ensuring long battery life while maintaining critical functionality.　　Rich Functionality and Strong Compatibility　　LE271-GL supports LBS + Wi-Fi scan positioning (for indoor and international use), eSIM, and single/dual-SIM configurations. It integrates USB, UART, SPI, I2C, ADC, LCD, Camera, and GPIO interfaces, and supports TTS, MQTT, HTTP, and SSL protocols for versatile IoT applications.　　Now in the engineering sample stage, Fibocom’s LE271-GL sets a new benchmark for global Cat.1 bis connectivity, enabling customers and partners worldwide to explore new opportunities in the IoT market.

Key word：

Fibocom

Release time：2026-01-30 15:28 reading：465 Continue reading>>

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ROHM’s New LDO Regulators with 500mA Output Current Achieving Stable Operation Even with Ultra-small Capacitors to Expand Design Flexibility for High-current Applications

　　ROHM has developed the “BD9xxN5 Series” of LDO regulator ICs with 500mA output current, featuring its proprietary ultra-stable control technology “Nano Cap™”. This series comprises 18 products designed for 12V/24V primary power supply applications used in automotive equipment, industrial equipment, and communication infrastructure.　　In recent years, electronic devices have demanded higher density in smaller form factors at the same time. To meet this demand and achieve space savings and design flexibility, power supply ICs must be capable of stable operation even with small-capacity capacitors. However, achieving such performance with output capacitors of 1µF or less has been technically difficult.　　To address this challenge, ROHM developed the “BD9xxN1 Series” LDO regulator (150mA output current) in 2022, incorporating its proprietary ultra-stable control technology, “Nano Cap™”. This innovation enables stable operation with output capacitors as small as 100nF, earning widespread adoption across numerous applications.　　The newly developed BD9xxN5 Series builds on the success of the BD9xxN1 Series by increasing the output current to 500mA – more than three times higher than before – significantly broadening its suitability for applications requiring higher power. In addition, very low output voltage ripple of approximately 250mV (with load current variation of 1mA to 500mA within 1µs) is achieved with a small output capacitance of just 470nF (typical). Beyond standard small MLCCs (multi-layer ceramic capacitors) in the range of several µF and large-capacity electrolytic capacitors, it also supports ultra-small MLCCs, such as the 0603M size (0.6mm × 0.3mm), with capacities below 1µF – where stability was previously difficult to achieve. This contributes to space saving as well as greater flexibility in component selection.　　Furthermore, high-precision SPICE models, “ROHM Real Model” are provided for accurate simulation and can be downloaded from the ROHM official website.　　SPICE Models: BD900N5xxx-C BD933N5xxxx-C BD950N5xxxx-C　　ROHM will continue to contribute to the high performance, miniaturization, and high reliability of electronic devices by further expanding its Nano Cap™ technology-equipped LDO series.　　Application Examples　　Automotive Equipment　　● Powertrain system power supplies for fuel injection systems (FI) and tire pressure monitoring systems (TPMS)● Body system power supplies for body control modules (BCM)● Infotainment system power supplies for clusters ad head-up displays (HUD), etc.Industrial Equipment　　● Power supplies for controllers like Programmable Logic Controllers (PLC), Remote Terminal Units (RTU), and industrial gateways● High-precision LDOs for analog loads and sensors measuring temperature, pressure, flow rate, etc.● Power supplies for monitoring and control panels in disaster prevention systems, access control systems and building automation.● Standby power supplies for Human-Machine Interfaces (HMI) and panel equipment, etc.Consumer Electronics　　● Power supplies for control boards in refrigerators, dishwashers, air conditioners, etc.● Power supplies for home appliances like thermostats and doorbells● Power supplies for constant power applications in home security and network equipment, etc.　　What is Nano Cap™ Technology?　　Nano Cap™ refers to ultra-stable control technology achieved by combining advanced analog expertise covering circuit design, processes, and layout utilizing ROHM’s vertically integrated production system. Stable control eliminates the problem of unstable operation related to capacitors in analog circuits, contributing to a reduction in design resources for a wide range of applications in automotive, industrial equipment, consumer, and other fields.　　Terminology　　Primary　　In a power supply circuit, the side in charge of 1st stage conversion from a power source such as a battery is called the primary and the side responsible for 2nd stage conversion is referred to as the secondary.　　LDO Regulator (Low Drop Out Regulator / Low Saturation Regulator)　　A type of power supply IC that converts between two different DC voltage levels. Falls under the category of linear regulator (where the input/output voltages operate linearly) characterized by a small input-output voltage difference. Compared to DC-DC converter ICs (switching regulators), LDOs feature a simpler circuit configuration and lower noise.　　ROHM Real Model　　A high-accuracy simulation model that make it possible to also achieve a perfect match between the actual IC and simulation values utilizing ROHM’s proprietary model-based technology.

Key word：

ROHM

Release time：2026-01-27 13:47 reading：399 Continue reading>>

Trade news

GigaDevice Successfully Lists in Hong Kong, Marking a New Phase of Global Expansion

　　GigaDevice Semiconductor Inc. (stock codes: 3986.HK; 603986.SH) was officially listed on the Main Board of the Hong Kong Stock Exchange on January 13, 2026, marking a major milestone with its dual listing in Shanghai and Hong Kong. This achievement represents a significant step forward in strengthening the company's capital base and supporting its long-term global growth strategy.　　The Hong Kong listing comes at a pivotal stage of GigaDevice’s development, as the company continues to expand its business scale and accelerate its presence in global markets. Leveraging Hong Kong’s role as an international financial hub, GigaDevice will further enhance its global capital support capabilities, strengthen connections with international customers and partners, and elevate its global brand profile.　　Founded in 2005, GigaDevice is a global leading fabless supplier dedicated to integrated circuit design. The company has built a diversified product portfolio spanning Flash memory, specialty DRAM, MCUs, analog ICs, and sensor chips. Its products are widely applied across consumer electronics, automotive electronics, industrial control, energy storage, the Internet of Things (IoT), PCs and servers, and communications markets. GigaDevice is among the few Chinese semiconductor companies to achieve global competitiveness across multiple core storage and control chip segments.The successful listing in Hong Kong underscores GigaDevice’s commitment to making international development a strategic priority. Beyond being a major corporate milestone, this listing establishes a new platform to support the company’s global operations and growth. Looking ahead, GigaDevice will continue to expand its diversified semiconductor portfolio globally, focus on long-term growth opportunities in areas such as artificial intelligence, IoT, and intelligent vehicles, and strengthen its long-term competitiveness through technology innovation, ecosystem partnerships, and brand building.

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GigaDevice

Release time：2026-01-22 11:22 reading：1450 Continue reading>>

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GigaDevice Partners With Melchioni Electronics to Expand Business in France, Italy and the Iberian Peninsula

Key word：

GigaDevice

Release time：2026-01-20 15:00 reading：1407 Continue reading>>

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TAIYO丨Multilayer Metal Power Inductor Rated at 165°C for Automobiles 1608 Size Added to the Lineup

　　TAIYO YUDEN CO., LTD. has commercialized 14 items, including the multilayer metal power inductor MCOIL™ "LACNF1608KKT1R0MAB" (1.6 x 0.8 x 1.0 mm, maximum height shown), which complies with the "AEC-Q200" certification reliability test standard for passive automotive components.　　The new product is approximately 49% smaller than our previous product, the "LACNF2012KKT1R0MAB" (2.0 x 1.25 x 1.0 mm), and can contribute to the miniaturization and higher performance of power supply circuits installed in automobiles.　　These products are used as choke coils in DC-DC converters used in automotive engine control systems such as ECUs, safety systems such as ABS, body-related systems such as ADAS, and information systems such as instrument clusters.　　Mass production of this products began at our subsidiary, WAKAYAMA TAIYO YUDEN CO., LTD. (Inami-cho, Hidaka-gun, Wakayama Prefecture), in December 2025. Samples are available for 50 yen per unit.　　Background　　The advancements that we have seen in recent years in electronic controls in production vehicles, as typified by ADAS units, has led to a greater number of power supply circuits on vehicles, which in turn has led to growth in the demand for power inductors that are used in these circuits. Furthermore, performance also continues to improve through functional integration, such as in integrated cockpits that combine instrument clusters and infotainment devices. While the throughput of IC chips continues to grow as these devices become increasingly multifunctional and high-performance, there is also a growing need to make on-board electronic components smaller in order to arrange devices in highly dense configurations and integrate them into single modules. Furthermore, since ECUs are increasingly being installed in engine compartments--a high temperature environment--on-board electronic components must be able to withstand high temperatures.　　In response, TAIYO YUDEN has added a new 1608 size to its MCOIL™ LACN series of multilayer metal power inductors, which boast the advantages of being smaller and thinner, and having an operating temperature range of -55°C to +165°C. Our proprietary metal materials are bonded to each other by an oxide film using heat treatment, ensuring insulation and providing high heat resistance and thermal conductivity. Thanks to these features, the product exhibits stable characteristics, is able to withstand high temperatures, and achieves high reliability, even in devices used in harsh temperature environments such as automotive applications.　　TAIYO YUDEN focuses on the development of products that meet market needs, and will continue to expand its power inductor product lineup.　　■Application　　Choke coils in DC-DC converters used in automotive engine control systems such as ECUs, safety systems such as ABS, body-related systems such as ADAS, and information systems such as instrument clusters　　* Derating of rated current is necessary depending on the ambient temperature.　　Please see our website below for detailed specifications.　　LACN series　　https://ds.yuden.co.jp/TYCOMPAS/ut/specificationSearcher?cid=L&u=M&Seri=LACN_A&SR2=LM%2CMP　　LCCN series　　https://ds.yuden.co.jp/TYCOMPAS/ut/specificationSearcher?SR6-L=AP2&Ind=1000.0%3A1500.0&Current_Srch=%3A1.9&pg=1&pn=L*CNF&cid=L&u=M　　* "MCOIL" is a registered trademark or a trademark of TAIYO YUDEN CO., LTD. in Japan and other countries.　　* The names of series noted in the text are excerpted from part numbers that indicate the types and characteristics of the products, and therefore are neither product names nor trademarks.

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TAIYO

Release time：2026-01-08 15:22 reading：726 Continue reading>>

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A Comprehensive Guide to Choosing Between LDO (Low Dropout Linear Regulators) and DC-DC (Switching Regulators)

　　Selecting the appropriate voltage regulator is critical for the stability and efficiency of various circuit systems. Among the numerous types available, LDO (Low Dropout Linear Regulators) and DC-DC (Switching Regulators) are two common voltage stabilizers. This article will thoroughly explore the selection methods for LDO and DC-DC regulators, covering concepts, operating principles, characteristics, and application scenarios.　　A Comprehensive Guide to Selecting LDO (Low Dropout Linear Regulators) and DC-DC (Switching Regulators)　　1. LDO (Low Dropout Linear Regulator)　　1.1 Concept　　LDO stands for Low Dropout Regulator, typically used to regulate high input voltages to lower output voltages. It achieves stable output voltage by adjusting the conduction resistance of its internal transistor.　　1.2 Working Principle　　When the input voltage exceeds the output voltage, the internal transistor enters an amplified state. It dissipates excess power to regulate the output voltage, maintaining it at the set value.　　1.3 Characteristics　　Simple design, low noise, relatively low cost, suitable for applications requiring high precision. However, it has low efficiency and significant thermal distortion.　　2. DC-DC (Switching Regulator)　　2.1 Concept　　DC-DC refers to a switching regulator (DC-to-DC Converter) that converts input voltage to the desired output voltage by switching the state of a switching element (e.g., MOSFET).　　2.2 Working Principle　　DC-DC operates by periodically turning the switching element on and off to control the output voltage magnitude, while a filter removes high-frequency noise from the output waveform.　　2.3 Features　　High efficiency, capable of delivering substantial output power, suitable for applications requiring large voltage drops or enhanced efficiency, but involves complex design and relatively higher cost.　　3. How to Select?　　3.1 Output Voltage Range　　For lower output voltages, an LDO is more suitable; whereas for large voltage drops or higher output power requirements, a DC-DC converter is more appropriate.　　3.2 Efficiency Requirements　　When prioritizing power efficiency, especially under large voltage drops, DC-DC converters typically outperform LDOs.　　3.3 System Complexity　　LDOs may be preferable for simplified design and cost reduction; DC-DC converters are necessary when higher output power and efficiency are required.　　3.4 Ripple and Noise　　In applications sensitive to output ripple and noise, LDOs are generally more suitable than DC-DC converters because they produce lower ripple and noise.　　4. Application Scenarios　　4.1 LDO Application Scenarios　　Applications requiring high output voltage accuracy, low output current, and strict ripple/noise specifications.　　4.2 DC-DC Applications　　Applications requiring large voltage drops, high output power, and high efficiency, such as mobile devices, power amplifiers, and communication equipment.　　4.3 Comprehensive Considerations　　In practical applications, the optimal regulator type must be selected by comprehensively evaluating system power consumption, output load conditions, stability requirements, and cost factors.　　As common voltage regulators, LDOs and DC-DC converters play vital roles in electronic product design. Selecting the appropriate regulator type depends on specific application requirements, including output voltage range, efficiency demands, system complexity, and ripple noise. During the selection process, a comprehensive evaluation of all factors is necessary to ensure the circuit system operates stably, reliably, and efficiently.

Key word：

Regulators

Release time：2025-12-31 17:31 reading：918 Continue reading>>

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Renesas Fast-Tracks SDV Innovation with R-Car Gen 5 SoC-Based End-to-End Multi-Domain Solution Platform

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, is expanding its software-defined vehicle (SDV) solution offerings centered around the fifth-generation (Gen 5) R-Car family. The latest device in the Gen 5 family, the R-Car X5H is the industry’s first multi-domain automotive system-on-chip (SoC) manufactured with advanced 3nm process technology. It is capable of simultaneously running vehicle functions across advanced driver assistance systems (ADAS), in-vehicle infotainment (IVI), and gateway systems.　　Renesas has begun sampling Gen 5 silicon and now offers full evaluation boards and the R-Car Open Access (RoX) Whitebox Software Development Kit (SDK) as part of the next phase of development. Renesas is also driving deeper collaboration with customers and partners to accelerate adoption. At CES 2026, Renesas will showcase AI-powered multi-domain demonstrations of the R-Car X5H in action.　　The R-Car X5H leverages one of the most advanced process nodes in the industry to offer the highest level of integration, performance and power efficiency, with up to 35 percent lower power consumption than previous 5nm solutions. As AI becomes integral to next-generation SDVs, the SoC delivers powerful central compute targeting multiple automotive domains, with the flexibility to scale AI performance using chiplet extensions. It delivers up to 400 TOPS of AI performance, with chiplets boosting acceleration by four times or more. It also features 4 TFLOPS equivalent* of GPU power for high-end graphics and over 1,000k DMIPS powered by 32 Arm® Cortex®-A720AE CPU cores and six Cortex-R52 lockstep cores with ASIL D support. Leveraging mixed criticality technology, the SoC executes advanced features in multiple domains without compromising safety.　　As hardware and software become more tightly integrated early in development to support complex E/E architectures, Renesas is adding new capabilities to the RoX development platform. RoX dramatically simplifies development by combining all essential hardware, operating systems, software and tools required to rapidly develop next-generation vehicles with seamless software updates.　　Accelerating Automotive Innovation with an Open, Scalable RoX Whitebox SDK　　To accelerate time-to-market, Renesas now offers the RoX Whitebox Software Development Kit (SDK) for the R-Car X5H, an open platform built on Linux, Android, and XEN hypervisor. Additional support for partner OS and solutions is available, including AUTOSAR, EB corbos Linux, QNX, Red Hat and SafeRTOS. Developers can jumpstart development out of the box using the SDK to build ADAS, L3/L4 autonomy, intelligent cockpit, and gateway systems. An integrated stack of AI and ADAS software enables real-time perception and sensor fusion while generative AI and Large Language Models (LLMs) enable intelligent human-machine interaction for next-generation AI cockpits. The SDK integrates production-grade application software stacks from leading partners such as Candera, DSP Concepts, Nullmax, Smart Eye, STRADVISION and ThunderSoft, supporting end-to-end development of modern automotive software architectures and faster time to market.　　“Since introducing our most advanced R-Car device last year, we have been steadfast in developing market-ready solutions, including delivering silicon samples to customers earlier this year,” Vivek Bhan, Senior Vice President and General Manager of High Performance Computing at Renesas. “In collaboration with OEMs, Tier-1s and partners, we are rapidly rolling out a complete development system that powers the next generation of software-defined vehicles. These intelligent compute platforms deliver a smarter, safer and more connected driving experience and are built to scale with future AI mobility demands.”　　“Integrating Renesas’ R-Car X5 generation series into our high-performance compute portfolio is a natural next step that builds on our existing collaboration,” said Christian Koepp, Senior Vice President Compute Performance at Bosch’s Cross-Domain Computing Solutions Division. “At CES 2026, we look forward to showcasing this powerful solution with Renesas X5H SoC, demonstrating its fusion capabilities across multiple vehicle domains, including video perception for advanced driver assistance systems."　　“Innovative system-on-chip technology, such as Renesas’ R-Car X5H, is paving the way for ZF’s software-defined vehicle strategy,” said Dr. Christian Brenneke, Head of ZF’s Electronics & ADAS division. “Combining Renesas’ R-Car X5H with our ADAS software solutions enables us to offer full-stack ADAS capabilities with high computing power and scalability. The joint platform combines radar localization and HD mapping to provide accurate perception and positioning for reliable ADAS performance. At CES 2026, we’ll showcase our joint ADAS solution.”　　First Fusion Demo on R-Car X5H with Partner Solutions at CES 2026　　Renesas will showcase the capabilities of the R-Car X5H for the first time through a series of invitation-only demos at CES 2026. For more information about how to attend this event, contact sales at: CES26_Info@lm.renesas.com.　　The new multi-domain demo upscales from R-Car Gen 4 to the next-generation R-Car X5H on the RoX platform, integrating ADAS and IVI stacks, RTOS, and edge AI functionality on Linux and Android with XEN hypervisor virtualization. Supporting input from eight high-resolution cameras and up to eight displays with resolutions reaching 8K2K, the platform delivers immersive visualization and robust sensor integration for next-generation SDVs. Combined with the RoX Whitebox SDK and production-grade partner software stacks, the platform is engineered for real-world deployment covering multiple automotive domains.　　Availability　　Renesas is shipping R-Car X5H silicon samples and evaluation boards, along with the RoX Whitebox SDK, to select customers and partners.

Key word：

Renesas

Release time：2025-12-24 16:06 reading：1285 Continue reading>>

model	brand	Quote
CDZVT2R20B	ROHM Semiconductor
RB751G-40T2R	ROHM Semiconductor
BD71847AMWV-E2	ROHM Semiconductor
MC33074DR2G	onsemi
TL431ACLPR	Texas Instruments

model	brand	To snap up
IPZ40N04S5L4R8ATMA1	Infineon Technologies
BU33JA2MNVX-CTL	ROHM Semiconductor
ESR03EZPJ151	ROHM Semiconductor
TPS63050YFFR	Texas Instruments
BP3621	ROHM Semiconductor
STM32F429IGT6	STMicroelectronics

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