TAIYO丨Multilayer Metal Power Inductor Rated at 165°C for Automobiles 1608 Size Added to the Lineup
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TAIYO丨Multilayer Metal Power Inductor Rated at 165°C for Automobiles 1608 Size Added to the Lineup

　　TAIYO YUDEN CO., LTD. has commercialized 14 items, including the multilayer metal power inductor MCOIL™ "LACNF1608KKT1R0MAB" (1.6 x 0.8 x 1.0 mm, maximum height shown), which complies with the "AEC-Q200" certification reliability test standard for passive automotive components.　　The new product is approximately 49% smaller than our previous product, the "LACNF2012KKT1R0MAB" (2.0 x 1.25 x 1.0 mm), and can contribute to the miniaturization and higher performance of power supply circuits installed in automobiles.　　These products are used as choke coils in DC-DC converters used in automotive engine control systems such as ECUs, safety systems such as ABS, body-related systems such as ADAS, and information systems such as instrument clusters.　　Mass production of this products began at our subsidiary, WAKAYAMA TAIYO YUDEN CO., LTD. (Inami-cho, Hidaka-gun, Wakayama Prefecture), in December 2025. Samples are available for 50 yen per unit.　　Background　　The advancements that we have seen in recent years in electronic controls in production vehicles, as typified by ADAS units, has led to a greater number of power supply circuits on vehicles, which in turn has led to growth in the demand for power inductors that are used in these circuits. Furthermore, performance also continues to improve through functional integration, such as in integrated cockpits that combine instrument clusters and infotainment devices. While the throughput of IC chips continues to grow as these devices become increasingly multifunctional and high-performance, there is also a growing need to make on-board electronic components smaller in order to arrange devices in highly dense configurations and integrate them into single modules. Furthermore, since ECUs are increasingly being installed in engine compartments--a high temperature environment--on-board electronic components must be able to withstand high temperatures.　　In response, TAIYO YUDEN has added a new 1608 size to its MCOIL™ LACN series of multilayer metal power inductors, which boast the advantages of being smaller and thinner, and having an operating temperature range of -55°C to +165°C. Our proprietary metal materials are bonded to each other by an oxide film using heat treatment, ensuring insulation and providing high heat resistance and thermal conductivity. Thanks to these features, the product exhibits stable characteristics, is able to withstand high temperatures, and achieves high reliability, even in devices used in harsh temperature environments such as automotive applications.　　TAIYO YUDEN focuses on the development of products that meet market needs, and will continue to expand its power inductor product lineup.　　■Application　　Choke coils in DC-DC converters used in automotive engine control systems such as ECUs, safety systems such as ABS, body-related systems such as ADAS, and information systems such as instrument clusters　　* Derating of rated current is necessary depending on the ambient temperature.　　Please see our website below for detailed specifications.　　LACN series　　https://ds.yuden.co.jp/TYCOMPAS/ut/specificationSearcher?cid=L&u=M&Seri=LACN_A&SR2=LM%2CMP　　LCCN series　　https://ds.yuden.co.jp/TYCOMPAS/ut/specificationSearcher?SR6-L=AP2&Ind=1000.0%3A1500.0&Current_Srch=%3A1.9&pg=1&pn=L*CNF&cid=L&u=M　　* "MCOIL" is a registered trademark or a trademark of TAIYO YUDEN CO., LTD. in Japan and other countries.　　* The names of series noted in the text are excerpted from part numbers that indicate the types and characteristics of the products, and therefore are neither product names nor trademarks.
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Release time：2026-01-08 15:22 reading：277 Continue reading>>
A Comprehensive Guide to Choosing Between LDO (Low Dropout Linear Regulators) and DC-DC (Switching Regulators)
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A Comprehensive Guide to Choosing Between LDO (Low Dropout Linear Regulators) and DC-DC (Switching Regulators)

　　Selecting the appropriate voltage regulator is critical for the stability and efficiency of various circuit systems. Among the numerous types available, LDO (Low Dropout Linear Regulators) and DC-DC (Switching Regulators) are two common voltage stabilizers. This article will thoroughly explore the selection methods for LDO and DC-DC regulators, covering concepts, operating principles, characteristics, and application scenarios.　　A Comprehensive Guide to Selecting LDO (Low Dropout Linear Regulators) and DC-DC (Switching Regulators)　　1. LDO (Low Dropout Linear Regulator)　　1.1 Concept　　LDO stands for Low Dropout Regulator, typically used to regulate high input voltages to lower output voltages. It achieves stable output voltage by adjusting the conduction resistance of its internal transistor.　　1.2 Working Principle　　When the input voltage exceeds the output voltage, the internal transistor enters an amplified state. It dissipates excess power to regulate the output voltage, maintaining it at the set value.　　1.3 Characteristics　　Simple design, low noise, relatively low cost, suitable for applications requiring high precision. However, it has low efficiency and significant thermal distortion.　　2. DC-DC (Switching Regulator)　　2.1 Concept　　DC-DC refers to a switching regulator (DC-to-DC Converter) that converts input voltage to the desired output voltage by switching the state of a switching element (e.g., MOSFET).　　2.2 Working Principle　　DC-DC operates by periodically turning the switching element on and off to control the output voltage magnitude, while a filter removes high-frequency noise from the output waveform.　　2.3 Features　　High efficiency, capable of delivering substantial output power, suitable for applications requiring large voltage drops or enhanced efficiency, but involves complex design and relatively higher cost.　　3. How to Select?　　3.1 Output Voltage Range　　For lower output voltages, an LDO is more suitable; whereas for large voltage drops or higher output power requirements, a DC-DC converter is more appropriate.　　3.2 Efficiency Requirements　　When prioritizing power efficiency, especially under large voltage drops, DC-DC converters typically outperform LDOs.　　3.3 System Complexity　　LDOs may be preferable for simplified design and cost reduction; DC-DC converters are necessary when higher output power and efficiency are required.　　3.4 Ripple and Noise　　In applications sensitive to output ripple and noise, LDOs are generally more suitable than DC-DC converters because they produce lower ripple and noise.　　4. Application Scenarios　　4.1 LDO Application Scenarios　　Applications requiring high output voltage accuracy, low output current, and strict ripple/noise specifications.　　4.2 DC-DC Applications　　Applications requiring large voltage drops, high output power, and high efficiency, such as mobile devices, power amplifiers, and communication equipment.　　4.3 Comprehensive Considerations　　In practical applications, the optimal regulator type must be selected by comprehensively evaluating system power consumption, output load conditions, stability requirements, and cost factors.　　As common voltage regulators, LDOs and DC-DC converters play vital roles in electronic product design. Selecting the appropriate regulator type depends on specific application requirements, including output voltage range, efficiency demands, system complexity, and ripple noise. During the selection process, a comprehensive evaluation of all factors is necessary to ensure the circuit system operates stably, reliably, and efficiently.
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Release time：2025-12-31 17:31 reading：323 Continue reading>>
Renesas Fast-Tracks SDV Innovation with R-Car Gen 5 SoC-Based End-to-End Multi-Domain Solution Platform
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Renesas Fast-Tracks SDV Innovation with R-Car Gen 5 SoC-Based End-to-End Multi-Domain Solution Platform

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, is expanding its software-defined vehicle (SDV) solution offerings centered around the fifth-generation (Gen 5) R-Car family. The latest device in the Gen 5 family, the R-Car X5H is the industry’s first multi-domain automotive system-on-chip (SoC) manufactured with advanced 3nm process technology. It is capable of simultaneously running vehicle functions across advanced driver assistance systems (ADAS), in-vehicle infotainment (IVI), and gateway systems.　　Renesas has begun sampling Gen 5 silicon and now offers full evaluation boards and the R-Car Open Access (RoX) Whitebox Software Development Kit (SDK) as part of the next phase of development. Renesas is also driving deeper collaboration with customers and partners to accelerate adoption. At CES 2026, Renesas will showcase AI-powered multi-domain demonstrations of the R-Car X5H in action.　　The R-Car X5H leverages one of the most advanced process nodes in the industry to offer the highest level of integration, performance and power efficiency, with up to 35 percent lower power consumption than previous 5nm solutions. As AI becomes integral to next-generation SDVs, the SoC delivers powerful central compute targeting multiple automotive domains, with the flexibility to scale AI performance using chiplet extensions. It delivers up to 400 TOPS of AI performance, with chiplets boosting acceleration by four times or more. It also features 4 TFLOPS equivalent* of GPU power for high-end graphics and over 1,000k DMIPS powered by 32 Arm® Cortex®-A720AE CPU cores and six Cortex-R52 lockstep cores with ASIL D support. Leveraging mixed criticality technology, the SoC executes advanced features in multiple domains without compromising safety.　　As hardware and software become more tightly integrated early in development to support complex E/E architectures, Renesas is adding new capabilities to the RoX development platform. RoX dramatically simplifies development by combining all essential hardware, operating systems, software and tools required to rapidly develop next-generation vehicles with seamless software updates.　　Accelerating Automotive Innovation with an Open, Scalable RoX Whitebox SDK　　To accelerate time-to-market, Renesas now offers the RoX Whitebox Software Development Kit (SDK) for the R-Car X5H, an open platform built on Linux, Android, and XEN hypervisor. Additional support for partner OS and solutions is available, including AUTOSAR, EB corbos Linux, QNX, Red Hat and SafeRTOS. Developers can jumpstart development out of the box using the SDK to build ADAS, L3/L4 autonomy, intelligent cockpit, and gateway systems. An integrated stack of AI and ADAS software enables real-time perception and sensor fusion while generative AI and Large Language Models (LLMs) enable intelligent human-machine interaction for next-generation AI cockpits. The SDK integrates production-grade application software stacks from leading partners such as Candera, DSP Concepts, Nullmax, Smart Eye, STRADVISION and ThunderSoft, supporting end-to-end development of modern automotive software architectures and faster time to market.　　“Since introducing our most advanced R-Car device last year, we have been steadfast in developing market-ready solutions, including delivering silicon samples to customers earlier this year,” Vivek Bhan, Senior Vice President and General Manager of High Performance Computing at Renesas. “In collaboration with OEMs, Tier-1s and partners, we are rapidly rolling out a complete development system that powers the next generation of software-defined vehicles. These intelligent compute platforms deliver a smarter, safer and more connected driving experience and are built to scale with future AI mobility demands.”　　“Integrating Renesas’ R-Car X5 generation series into our high-performance compute portfolio is a natural next step that builds on our existing collaboration,” said Christian Koepp, Senior Vice President Compute Performance at Bosch’s Cross-Domain Computing Solutions Division. “At CES 2026, we look forward to showcasing this powerful solution with Renesas X5H SoC, demonstrating its fusion capabilities across multiple vehicle domains, including video perception for advanced driver assistance systems."　　“Innovative system-on-chip technology, such as Renesas’ R-Car X5H, is paving the way for ZF’s software-defined vehicle strategy,” said Dr. Christian Brenneke, Head of ZF’s Electronics & ADAS division. “Combining Renesas’ R-Car X5H with our ADAS software solutions enables us to offer full-stack ADAS capabilities with high computing power and scalability. The joint platform combines radar localization and HD mapping to provide accurate perception and positioning for reliable ADAS performance. At CES 2026, we’ll showcase our joint ADAS solution.”　　First Fusion Demo on R-Car X5H with Partner Solutions at CES 2026　　Renesas will showcase the capabilities of the R-Car X5H for the first time through a series of invitation-only demos at CES 2026. For more information about how to attend this event, contact sales at: CES26_Info@lm.renesas.com.　　The new multi-domain demo upscales from R-Car Gen 4 to the next-generation R-Car X5H on the RoX platform, integrating ADAS and IVI stacks, RTOS, and edge AI functionality on Linux and Android with XEN hypervisor virtualization. Supporting input from eight high-resolution cameras and up to eight displays with resolutions reaching 8K2K, the platform delivers immersive visualization and robust sensor integration for next-generation SDVs. Combined with the RoX Whitebox SDK and production-grade partner software stacks, the platform is engineered for real-world deployment covering multiple automotive domains.　　Availability　　Renesas is shipping R-Car X5H silicon samples and evaluation boards, along with the RoX Whitebox SDK, to select customers and partners.
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Release time：2025-12-24 16:06 reading：482 Continue reading>>
Murata Launches World’s First Inner Cavity-Structure Ultra-Low-Loss LCP Flexible Substrate, Achieving Dk below 2.0, Contributing to 6G Realization
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Murata Launches World’s First Inner Cavity-Structure Ultra-Low-Loss LCP Flexible Substrate, Achieving Dk below 2.0, Contributing to 6G Realization

　　Murata Manufacturing Co., Ltd announces the World’s First LCP (liquid crystal polymer) flexible substrate with an Inner Cavity structure, ULTICIRC, and has already begun mass production*. Murata’s proprietary design incorporates an Inner Cavity within the substrate to achieve a dielectric constant (Dk) below 2.0, dramatically reducing transmission loss.Cross-Section Image　　With 6G expected to leverage the FR3 (Frequency Range 3) band—roughly 7–24 GHz—substrates with minimal transmission loss are essential to enable high-speed, high-capacity communications at high frequencies. At the same time, demand is growing for thin, space-saving flexible substrates that support free-form mechanical design to meet the ongoing miniaturization of smartphones and communication equipment. Murata has provided LCP flexible substrates with excellent high-frequency characteristics, featuring a proprietary high-performance resin that eliminates spring-back and an adhesive-free, one-shot press multilayer lamination process; building on this expertise for 6G readiness, Murata has developed and launched ULTICIRC. Conventional flexible substrates faced the challenge that making them thinner resulted in increased transmission loss, but this product incorporates an Inner Cavity structure within the substrate, achieving a dielectric constant (Dk) below 2.0, which is significantly lower than Murata's conventional products, enabling both thin profiles and ultra-low transmission loss simultaneously.　　Furthermore, thanks to an adhesive-free proprietary manufacturing method and the excellent barrier properties of LCP, the Inner Cavity structure maintains high moisture resistance.　　For inquiries regarding this product, please contact us.
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Release time：2025-12-18 16:00 reading：476 Continue reading>>
TAIYO YUDEN Commercializes 1005M-Size Embeddable Multilayer Ceramic Capacitor with 22-μF Capacitance for AI Servers
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TAIYO YUDEN Commercializes 1005M-Size Embeddable Multilayer Ceramic Capacitor with 22-μF Capacitance for AI Servers

　　TAIYO YUDEN CO., LTD. has commercialized and begun mass production of embeddable multilayer ceramic capacitor (MLCC) that achieves a capacitance of 22-μF in a 1005M size (1.0 x 0.5 mm).　　This ceramic capacitor is an MLCC designed for decoupling applications on IC power lines used in AI servers and other types of information devices.　　Components embedded in a board require high precision in terms of flatness of the external electrodes for connection to the circuit. With respect to this requirement, TAIYO YUDEN has commercialized an embeddable MLCC that achieves a 22-μF capacitance in a 1005M size by enhancing external electrode formation technology and other elemental technologies.　　Mass production of the capacitor began at our Tamamura Plant (Sawa District, Gunma Prefecture) in August 2025. Samples are available for 20 yen per unit.　　Technology Background　　AI servers and other types of devices with advanced information processing capabilities are equipped with ICs that consume extremely large amounts of power. For decoupling purposes in such power supply circuits, small, high-capacity MLCCs are required to handle large currents.　　Additionally, to minimize circuit loss and noise, it is important to route the power supply circuit close to the ICs. Traditional power supply circuits are routed around ICs. But, technological developments are progressing, allowing them to be placed closer, such as on the back of the board or directly under the ICs. Thus, embeddable MLCCs need to be equipped with high-precision external electrodes to connect to the lines.　　To satisfy this need, TAIYO YUDEN has improved its external electrode formation technology and commercialized 1005M-size embeddable MLCC with a capacitance of 22 μF.　　TAIYO YUDEN is continuing to develop new MLCCs with higher capacitance and other distinguishing features.　　■ Application　　Decoupling applications on IC power lines used in AI servers and other types of information devices
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Release time：2025-10-20 16:40 reading：517 Continue reading>>
NOVOSENSE launches NSUC1612: Fully Integrated Embedded Motor Drive SoC for Smarter, Cost-Efficient Automotive Actuators
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NOVOSENSE launches NSUC1612: Fully Integrated Embedded Motor Drive SoC for Smarter, Cost-Efficient Automotive Actuators

　　NOVOSENSE has released the NSUC1612, a next-generation motor driver SoC designed to address the limitations of traditional discrete solutions in automotive smart actuators, such as system complexity, high cost, and limited reliability.　　With its fully integrated single-chip architecture, the NSUC1612 can simplify design, reduce cost, and enhance stability. It supports a wide range of applications, including automotive water valves, automotive air-conditioning vent, active grille shutters, as well as stepper motors, DC brushed motors, and DC brushless motors—delivering an efficient and scalable solution for automotive electronics.　　1.Fully Integrated Architecture: Simplified Design, Reduced Complexity　　Conventional actuator control systems often require multiple components, including MCU, motor drivers, communication interfaces, and protection circuits, leading to complex PCB layout, increased solder joints, and compatibility issues.The NSUC1612 integrates a 32-bit ARM® Cortex®-M3 MCU with 4- or 3-channel half-bridge drivers, LIN/CAN controller communication interfaces, a 12-bit ADC, temperature sensors, and other essential modules, all in a single-chip. This eliminates the need for additional companion ICs while covering the full motor control, communication, and protection process.By reducing external components and simplifying hardware design, the NSUC1612 shortens development cycles and minimizes EMI risk through optimized internal signal routing.　　2.Excellent EMC Performance: Reliable Operation in Harsh Environments　　Automotive electronics operate in complex electromagnetic conditions where EMC performance directly impacts actuator precision and system stability. The NSUC1612 provides simplified reference circuits and optimized PCB layout. In compliance with CISPR 25:2021 Class 5, it passes stringent automotive EMC/EMI tests, compliant with the automotive standardsSelected Test Results Based on CISPR 25:2021　　This ensures stable motor control signals and helps prevent malfunctions such as actuator stalls or misoperation caused by electromagnetic interference.　　3.Strong Performance: Balanced Drive Capability and Processing Power　　The NSUC1612 is designed to deliver both reliable motor driving capability and efficient computation: NSUC1612B: 4 half-bridge outputs, peak current up to 500 mA NSUC1612E: 3 half-bridge outputs, peak current up to 2.1 AThese options support brushed DC, BLDC, and stepper motors across diverse applications, from HVAC air vent adjustment to seat ventilation.　　The ARM® Cortex®-M3 core with Harvard architecture integrates 32 KB Flash, 2 KB SRAM, and 15 KB ROM with Bootloader, supporting OTA upgrades. A 32 MHz high-precision oscillator with PLL ensures stable computation, while low-power sleep mode consumes less than 50 μA across the full operation temperature range, balancing performance with energy efficiency.　　4.Automotive-Grade Reliability: Built for Demanding Conditions　　The NSUC1612 is designed with comprehensive reliability features to withstand harsh operating environments. It is compliant with AEC-Q100 Grade 1, supporting junction temperatures up to 150°C and ensuring stable operation across a wide temperature range from -40°C to +125°C. The device’s LIN port can tolerate up to ±40 V, while the BVDD pin supports -0.3 V to 40 V, enabling direct connection to 12V automotive batteries. In addition, integrated protection mechanisms such as over-voltage and over-temperature safeguards provide robust defense against voltage fluctuations and transient surges, delivering system-level reliability under real-world automotive conditions.　　The NSUC1612 extends its value through broad application compatibility, making it suitable for automotive actuator systems. It supports brushed DC, BLDC, and stepper motors, while integrated communication interfaces—including LIN PHY (compliant with LIN 2.x, ISO 17987, and SAE J2602), FlexCAN, and SPI—allow seamless integration into existing automotive network architectures.　　The NSUC1612 is ideal for a wide range of applications, including thermal management components (e.g., automotive water valves and expansion valves), cabin comfort modules (automotive air-conditioning vent), and smart body systems (active grille shutters and charging port actuators). By integrating these functions into a single device, it helps reduce design costs and simplify development.
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Release time：2025-09-23 13:12 reading：1028 Continue reading>>
Renesas Adds Capacitive Touch to Ultra-Low-Power RA0 MCUs
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Renesas Adds Capacitive Touch to Ultra-Low-Power RA0 MCUs

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RA0L1 microcontroller (MCU) Group based on the Arm® Cortex®-M23 processor. The new devices offer extremely low power consumption and the industry’s best solution for quickly and economically implementing capacitive touch in battery-powered and other consumer electronics, appliances, white goods and industrial system controls.　　Renesas introduced the RA0 MCU series in 2024 and it has quickly become very popular with a wide range of customers due to its affordability and low power consumption. With the addition of capacitive touch functionality, RA0L1 devices offer designers the ability to create responsive, attractive, low-power user interfaces at very low cost.　　RA0L1 MCUs deliver industry-leading power consumption of only 2.9mA current in active mode, and 0.92mA in sleep mode. In addition, an integrated High-speed On-Chip Oscillator (HOCO) enables the fastest wake-up time for this class of microcontroller. The fast wake-up enables the RA0L1 MCUs to stay in Software Standby mode more of the time, where power consumption drops to a minuscule 0.25 µA. With this feature, current consumption can be reduced by up to 90 percent compared with other solutions.　　Feature Set Optimized for Low Cost　　The RA0L1 devices have a feature set optimized for cost-sensitive applications. They offer a wide operating voltage range of 1.6V to 5.5V so customers don’t need a level shifter/regulator in 5V systems. The RA0L1 MCUs also integrate multiple communications interfaces, analog functions, safety functions and security functionality to reduce customer BOM cost. A wide range of packaging options is also available, including a tiny 4mm x 4mm 24-pin QFN.　　In addition, the new MCU’s high-precision (±1.0%) HOCO improves baud rate accuracy and enables designers to forego a standalone oscillator. Unlike other HOCOs in the industry, it maintains this precision in environments from -40°C to 125°C. This wide temperature range enables customers to simplify thermal design by avoiding costly and time-consuming “trimming,” even after the reflow process.　　Renesas Capacitive Touch Leadership　　Renesas provides industry-leading capacitive touch technology, ensuring customers can quickly and cost-effectively implement high-quality touch interfaces in a variety of systems. Its self-capacitance method simplifies waterproof design, offering simpler design and reduced complexity compared to mutual capacitance solutions. Renesas’ multi-frequency measurement meets IEC61000 4-3 Level 4 standards, making it ideal for medical applications that demand robust protection from electromagnetic interference. Renesas also offers specialized development resources for capacitive touch, including the QE for Capacitive Touch that streamlines sensitivity adjustments for capacitive touch buttons, speeding up development.　　“The RA0L1 combines the industry-leading power consumption and cost-effectiveness of our RA0 Series MCUs with our unmatched capacitive touch technology and tools,” said Daryl Khoo, Vice President of the Embedded Processing Marketing Division at Renesas. “We look forward to the many innovative touch interface solutions that our customers will create using these devices.”　　Key Features of the RA0L1 Group MCUs　　Core: 32MHz Arm Cortex-M23　　Memory: Up to 64KB integrated Code Flash memory and 16KB SRAM　　Extended Temperature Range: Ta -40°C to 125°C　　Timers: Timer array unit (16b x 8 channels), 32-bit interval timer (8b x 4 channels), RTC　　Communications Peripherals: 3 UARTs, 2 Async UART, 6 Simplified SPIs, 2 I2C, 6 Simplified I2Cs　　Analog Peripherals: 12-bit ADC, temperature sensor, internal reference voltage　　HMI: Capacitive Touch (up to 24 channels), Controlled Current Drive Port (up to 8)　　Safety: SRAM parity check, invalid memory access detection, frequency detection, A/D test, output level detection, CRC calculator, register write protection　　Security: Unique ID, TRNG, Flash access window, Flash read protection　　Packages: 24-, 32- and 48-pin QFNs, 32-, 48-pin LQFP, 20-pin LSSOP　　The new RA0L1 Group MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. Using the FSP will ease migration to and from other RA family devices.　　Winning Combinations　　Renesas has combined the new RA0L1 Group MCUs with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations, including the Capacitive Touch Remote Controller. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly.　　Availability　　The RA0L1 Group MCUs are available now, along with the FSP software, the RA0L1 Fast Prototyping Board and the RA0L1 Renesas Solution Starter Kit for Cap Touch. Samples and kits can be ordered either on the Renesas website or through AMEYA360.
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Release time：2025-09-18 16:11 reading：1028 Continue reading>>
ROHM Launches 2-in-1 SiC Molded Module “DOT-247”
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ROHM Launches 2-in-1 SiC Molded Module “DOT-247”

　　ROHM has developed the "DOT-247," a 2-in-1 SiC molded module (SCZ40xxDTx, SCZ40xxKTx), ideal for industrial applications such as PV inverters, UPS systems, and semiconductor relays. The module retains the versatility of the widely adopted "TO-247" package while achieving high design flexibility and power density.　　The DOT-247 features a combined structure consisting of two TO-247 packages. This design enables the use of large chips, which were structurally difficult to accommodate in the TO-247 package, and achieves low on-resistance through an unique internal structure. Additionally, through optimized package structure, thermal resistance has been reduced by approximately 15% and inductance by approximately 50% compared to the TO-247. This enables a power density 2.3 times higher than the TO-247 in a half-bridge configuration –achieving the same power conversion circuit in approximately half the volume.　　The new products featuring the DOT-247 package are available in two topologies: half-bridge and common-source. Currently, two-level inverters are the mainstream in PV inverters, but there is growing demand for multi-level circuits such as three-level NPC, three-level T-NPC, and five-level ANPC to meet the need for higher voltages. In the switching sections of these circuits, topologies such as half-bridge and common-source are mixed –making custom products necessary in many cases when using conventional SiC modules.　　To address this challenge, ROHM has developed each of these two topologies—the smallest building blocks of multi-level circuits—into a 2-in-1 module. This enables flexibility to support various configurations such as NPC circuits and DC-DC converters, while significantly reducing the number of components and mounting area, and achieving circuit miniaturization compared to discrete components.　　Evaluation boards will also be made available progressively to facilitate evaluation during application design. For more information, please contact a sales representative or visit the contact page on ROHM’s website.　　Product Lineup　　☆:Under Development　　AEC-Q101 is an automotive electronics reliability standard established by the Automotive Electronics Council (AEC).　　The Q101 standard is specifically focused on discrete semiconductor components.　　Application Examples　　PV inverters, semiconductor relays, UPS (uninterruptible power supply), ePTO, and boost converters for FCVs (fuel cell vehicles).　　AI servers (eFuse), EV charging stations, etc.　　Sales Information　　Pricing: $140/unit (samples, excluding tax)　　Availability: ROHM construct mass production (September 2025)　　Products compliant with the automotive reliability standard AEC-Q101 are scheduled to begin sample shipments in October 2025.　　Comprehensive Support　　ROHM is committed to providing application-level support, including the use of in-house motor testing equipment. A variety of supporting materials are also offered, such as simulations and thermal designs that enable quick evaluation and adoption of DOT-247 products. An evaluation kit for double-pulse testing is already available, allowing immediate testing, while an evaluation kit for 3-phase inverters is currently under preparation, with reference designs scheduled to be released from November 2025.　　• About the DOT-247 design models　　SPICE models: Available on the product web pages for each part number　　LTspice® models: Scheduled to be available for three-level NPC from October 2025 on the web pagesLTspice® is a registered trademark of Analog Devices, Inc.When using third-party trademarks, please adhere to the usage guidelines specified by the rights holder.　　For details, please contact a sales representative or visit the contact page on ROHM’s website.　　EcoSiC™ Brand　　EcoSiC™ is a brand of devices that utilize silicon carbide (SiC), which is attracting attention in the power device field for performance that surpasses silicon (Si). ROHM independently develops technologies essential for the evolution of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, we have established an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.• EcoSiC™ is a trademark or registered trademark of ROHM Co., Ltd.　　Terminology　　Half-bridge/ Common-source　　A basic configuration of a power conversion circuit consisting of two MOSFETs. In a half-bridge configuration, the MOSFETs are connected in series, one above the other, and the output is taken from the connection point. By switching the upper and lower MOSFETs alternately, the output voltage can be switched between positive and negative, making this configuration widely used as the basic structure for high-efficiency power conversion in inverters and motor drive circuits.　　Common Source is a configuration where the source terminals of the two MOSFETs are connected, and the output is taken from each drain. By grouping the source terminals, the gate drive circuit can be simplified, making it suitable for applications such as multilevel inverters.　　Types of NPC-type multi-level circuits　　NPC (Neutral Point Clamped) is a multi-level circuit configuration that divides the output voltage into three levels (+, 0, and -) to reduce voltage stress on the switching devices. The "0V" state is created by the neutral point, which is the contact point located between the positive and negative voltages.　　T-NPC (T-type NPC) replaces the diode used to stabilize the neutral point with switching devices such as MOSFETs, enabling more efficient operation. ANPC (Active NPC) actively controls the potential of the neutral point itself using a switch, achieving smoother output waveforms and high-precision power conversion. T-NPC and ANPC are suitable for applications requiring higher output and efficiency.　　ePTO (electric Power Take-Off)　　A system that uses the power from an electric vehicle's motor or battery to drive external work machinery or equipment (such as hydraulic pumps or compressors). This is an electrified version of the PTO (Power Take-Off) used in conventional engine vehicles, and its adoption is advancing in environmentally friendly commercial vehicles and work vehicles.
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Release time：2025-09-17 13:11 reading：725 Continue reading>>
ROHM has Developed Ultra-Compact CMOS Op Amp: Delivering Industry-Leading* Ultra-Low Circuit Current
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ROHM has Developed Ultra-Compact CMOS Op Amp: Delivering Industry-Leading* Ultra-Low Circuit Current

　　ROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current. This IC is optimized to be applied as a measurement sensing amplifier in size-constrained applications such as handheld measurement instruments, wearable devices, and indoor motion detectors.　　As the demand continues to grow for more sophisticated control in battery-driven devices, the importance of sensors that detect parameters such as temperature, humidity, vibration, pressure, and flow rate – along with the op amps used to amplify these sensor signals – continues to rise. At the same time, greater miniaturization and energy savings in applications is a necessary step to realizing a sustainable society –placing similar demands on individual devices as well.　　In response to these evolving market needs, ROHM has advanced its process, packaging, and proprietary Nano Energy™ circuit technologies to develop an op amp that addresses three key requirements: lower power consumption, higher accuracy, and compact size. The newly developed TLR1901GXZ achieves an ultra-compact footprint of less than 1mm2 by adopting a WLCSP (Wafer Level Chip Scale Package) with a fine ball pitch of 0.35mm while delivering an industry-leading low operating current of 160nA (typ.). This not only contributes to high-density mounting in space-constrained applications, but also to a significantly extended battery life.　　Moreover, the TLR1901GXZ features an exceptionally low input offset voltage of just 0.55mV (max.), one of the best among ultra-low current op amps. This represents an approximate 45% reduction compared to typical products on the market. A maximum input offset voltage temperature drift of 7uV/°C ensures high accuracy operation over the operating temperature range.　　Design flexibility can be further enhanced by pairing the op amp with ROHM’s ultra-compact general-purpose resistors, such as the MCR004 (0402 metric / 01005 inch) and MCR006 (0603 metric / 0201 inch), for applications like gain adjustment. The MCR004 series lineup includes the MCR004E –an environmentally friendly, fully lead-free option designed to support sustainable designs. Adapter boards featuring SSOP5 package ICs are offered as well to support initial evaluation and replacement assessments.　　Going forward, ROHM will continue to pursue further power savings in op amps by advancing both miniaturization and original ultra-low power technologies. At the same time, we are committed to improving device performance by reducing noise and offset, expanding power supply voltage ranges, and contributing to solving social issues through more precise application control.　　Key Product Characteristics　　Application Examples　　• Consumer devices: wearables, smart devices, motion sensors, etc.　　• Industrial equipment: gas detectors, fire alarms, handheld measurement instruments, environmental sensors for IoT, etc.　　Online Sales Information　　Sales Launch Date: Now　　Pricing: $2.1/unit (samples, excluding tax)　　Online Distributors: AMEYA360　　• Applicable Part No: TLR1901GXZ-E2　　• IC-Mounted Adapter Board: TLR1901GXZ-EVK-001　　What is Nano Energy™ Technology?　　Nano Energy™ refers to proprietary ultra-low current consumption technology that achieves a current consumption on the order of nano ampere (nA) by combining advanced analog technologies covering circuit design, layout, and processes utilizing ROHM’s vertically integrated production system.　　This contributes not only to extending operating time of battery operated IoT and mobile devices, but also improving efficiency in industrial and automotive equipment where increased power consumption is problematic.　　https://www.rohm.com/support/nano 　　Nano Energy™ is a trademark or registered trademark of ROHM Co., Ltd.　　Terminology　　WLCSP (Wafer Level Chip Scale Package)　　An ultra-compact package in which terminals and wiring are formed directly on the wafer before separated into individual chips. Unlike general packages where the chips are cut from wafers and then molded with resin to form terminals, WLCSP allows the package size to match the chip itself, making it possible to further reduce size.　　Input Offset Voltage　　The small voltage difference that must be applied between the inverting and non-inverting inputs of the operational amplifier to make the output voltage exactly zero.　　Input Offset Voltage Temperature Drift　　Refers to how much an op amp's input offset voltage changes as the temperature changes.
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Release time：2025-09-12 17:23 reading：660 Continue reading>>
Renesas Introduces Ultra-Low-Power RL78/L23 MCUs for Next-Generation Smart Home Appliances
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Renesas Introduces Ultra-Low-Power RL78/L23 MCUs for Next-Generation Smart Home Appliances

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the new 16-bit RL78/L23 microcontroller (MCU) group, expanding its low-power RL78 family. Running at 32MHz, the RL78/L23 MCUs combine industry-leading low-power performance with essential features such as dual-bank flash memory, segment LCD control, and capacitive touch functionality to support smart home appliances, consumer electronics, IoT and metering systems. These compact, cost-effective devices address the performance and power requirements of modern display-based human-machine interface (HMI) applications.　　Ultra-Low Power Operation with Optimized LCD Performance　　The RL78/L23 is optimized for ultra-low power consumption and ideal for battery-powered applications that spend the majority of time in standby. They offer an active current of just 109μA/MHz and a standby current as low as 0.365μA, along with a fast 1μs wake-up time to help minimize CPU activity. The LCD controller’s new reference mode, VL4, reduces LCD operating current by approximately 30 percent when compared to the existing RL78/L1X group. The MCUs come with SMS (SNOOZE Mode Sequencer), which enables dynamic LCD segment display without CPU intervention. By offloading tasks to the SMS, the devices minimize CPU wake-ups and contribute to system-level power savings. These innovations significantly extend battery life, simplify design and reduce replacement costs, while minimizing environmental impact.　　The RL78/L23 offers a wide operating voltage range of 1.6V to 5.5V, which supports direct operation from 5V power supplies commonly used in home appliances and industrial systems. This capability reduces the need for external voltage regulators. The MCUs also integrate key components such as capacitive touch sensing, a temperature sensor, and internal oscillator, reducing BOM cost and PCB size.　　Feature-Rich Peripherals for HMI Systems　　Designed to meet the dynamic requirements of the HMI market, RL78/L23 integrates a suite of advanced features in a compact, cost-effective package. Its built-in segment LCD controller and capacitive touch realize sleek, responsive user interfaces for products such as induction cooktops and HVAC systems. The IH timer (Timer KB40) enables precise multi-channel heat control, which is essential in smart kitchen appliances such as rice cookers and IH cooktops. The devices include dual-bank flash memory for seamless firmware updates via FOTA (Firmware Over-the-Air), allowing continuous system operation in applications like metering, where downtime must be minimized. The dual-bank architecture allows one memory bank to run the user program, while the other receives updates. This approach keeps the system functional throughout the process for improved reliability.　　“The Renesas RL78 Family of 16-bit microcontrollers has been one of the most successful products since its launch more than 10 years ago, particularly in home appliances,” said Daryl Khoo, Vice President of Embedded Processing at Renesas. “I’m pleased to announce the RL78/L23, a new generation of RL78 microcontrollers with rich features, ideally suited for smart home appliances and cost-sensitive IoT solutions. With these devices, we aim to provide a better user experience with our intuitive development environment so that customers can get to production faster with confidence, based on market-proven Renesas technologies.”　　Key Features of the RL78/L23　　16-bit RL78 microcontroller running at 32MHz　　Built-in segment LCD controller and capacitive touch　　Up to 512KB of dual-bank flash memory for seamless FOTA　　Up to 32KB of SRAM and 8KB of data flash　　SMS for ultra-low power operation　　IH Timer (KB40) supporting up to 3-channel induction heating control　　Wide operating voltage range from 1.6V to 5.5V　　Operating temperature range of -40°C to +105°C　　Multiple serial interfaces including UART, I2C, CSI　　IEC60730-compliant self-test library　　44-100-pin LFQFP, LQFP and HWQFN packages　　Intuitive Development Environment for Faster Time-to-Market　　The RL78/L23 comes with an easy-to-use development environment. Developers can leverage robust support tools such as Smart Configurator and QE for Capacitive Touch to streamline system design. Renesas offers the RL78/L23 Fast Prototyping Board which is compatible with Arduino IDE, and a capacitive touch evaluation system for in-depth testing and validation.　　Winning Combinations　　Renesas offers Induction Heating Rice Cooker Solution which combines the new RL78/L23 devices with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.　　Availability　　The RL78/L23 MCUs are available today, along with the Fast Prototyping Board (FPB-RL78L23) and the capacitive touch evaluation system (RSSK-RL78L23). 
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Release time：2025-08-27 15:18 reading：1081 Continue reading>>

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