ROHM and Infineon collaborate on silicon carbide power electronics packages to enhance flexibility for customers
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ROHM and Infineon collaborate on silicon carbide power electronics packages to enhance flexibility for customers

　　ROHM and Infineon Technologies AG have signed a Memorandum of Understanding to collaborate on packages for silicon carbide (SiC) power semiconductors used in applications such as on-board chargers, photovoltaics, energy storage systems, and AI data centers. Specifically, the partners aim to enable each other as second sources of selected packages for SiC power devices, a move which will increase design and procurement flexibility for their customers. In the future, customers will be able to source devices with compatible housings from both ROHM and Infineon. The collaboration will ensure seamless compatibility and interchangeability to match specific customer needs.　　"We are excited about working with ROHM to further accelerate the establishment of SiC power devices," said Dr. Peter Wawer, Division President Green Industrial Power at Infineon. "Our collaboration will provide customers with a wider range of options and greater flexibility in their design and procurement processes, enabling them to develop more energy-efficient applications that will further drive decarbonization."　　"ROHM is committed to providing customers with the best possible solutions. Our collaboration with Infineon constitutes a significant step towards the realization of this goal, since it broadens the portfolio of solutions," said Dr. Kazuhide Ino, Member of the Board, Managing Executive Officer, in charge of Power Devices Business at ROHM. "By working together, we can drive innovation, reduce complexity, and increase customer satisfaction, ultimately shaping the future of the power electronics industry."Dr. Peter Wawer, Division President Green Industrial Power at Infineon (left)and Dr. Kazuhide Ino, Member of the Board and Managing Executive Officer at ROHM　　As part of the agreement, ROHM will adopt Infineon’s innovative top-side cooling platform for SiC, including TOLT, D-DPAK, Q-DPAK, Q-DPAK dual, and H-DPAK packages. Infineon's top-side cooling platform offers several benefits, including a standardized height of 2.3 mm for all packages. This facilitates designs and reduces system costs for cooling, while also enabling better board space utilization and up to two times more power density.　　At the same time, Infineon will take on ROHM’s DOT-247 package with SiC half-bridge configuration to develop a compatible package. That will expand Infineon’s recently announced Double TO-247 IGBT portfolio to include SiC half-bridge solutions. ROHM's advanced DOT-247 delivers higher power density and reduces assembly effort compared to standard discrete packages. Featuring a unique structure that integrates two TO-247 packages, it enables to reduce thermal resistance by approximately 15 percent and inductance by 50 percent compared to the TO-247. The advantages bring 2.3 times higher power density than the TO-247.　　ROHM and Infineon plan to expand their collaboration in the future to include other packages with both silicon and wide-bandgap power technologies such as SiC and gallium nitride (GaN). This will further strengthen the relationship between the two companies and provide customers with an even broader range of solutions and sourcing options.　　Semiconductors based on SiC have improved the performance of high-power applications by switching electricity even more efficiently, enabling high reliability and robustness under extreme conditions, while allowing for even smaller designs. Using ROHM’s and Infineon’s SiC products, customers can develop energy-efficient solutions and increase power density for applications such as electric vehicle charging, renewable energy systems and AI data centers.　　About ROHM　　ROHM, a leading semiconductor and electronic component manufacturer, was established in 1958. From the automotive and industrial equipment markets to the consumer and communication sectors, ROHM supplies ICs, discretes, and electronic components featuring superior quality and reliability through a global sales and development network. Our strengths in the analog and power markets allow us to propose optimized solutions for entire systems that combine peripheral components (i.e., transistors, diodes, resistors) with the latest SiC power devices as well as drive ICs that maximize their performance.　　Further information is available at https://www.rohm.com　　About Infineon　　Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The company has around 58,060 employees worldwide and generated revenue of about €15 billion in the 2024 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market (ticker symbol: IFNNY).
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Release time：2025-09-29 14:53 reading：386 Continue reading>>
ROHM Launches 2-in-1 SiC Molded Module “DOT-247”
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ROHM Launches 2-in-1 SiC Molded Module “DOT-247”

　　ROHM has developed the "DOT-247," a 2-in-1 SiC molded module (SCZ40xxDTx, SCZ40xxKTx), ideal for industrial applications such as PV inverters, UPS systems, and semiconductor relays. The module retains the versatility of the widely adopted "TO-247" package while achieving high design flexibility and power density.　　The DOT-247 features a combined structure consisting of two TO-247 packages. This design enables the use of large chips, which were structurally difficult to accommodate in the TO-247 package, and achieves low on-resistance through an unique internal structure. Additionally, through optimized package structure, thermal resistance has been reduced by approximately 15% and inductance by approximately 50% compared to the TO-247. This enables a power density 2.3 times higher than the TO-247 in a half-bridge configuration –achieving the same power conversion circuit in approximately half the volume.　　The new products featuring the DOT-247 package are available in two topologies: half-bridge and common-source. Currently, two-level inverters are the mainstream in PV inverters, but there is growing demand for multi-level circuits such as three-level NPC, three-level T-NPC, and five-level ANPC to meet the need for higher voltages. In the switching sections of these circuits, topologies such as half-bridge and common-source are mixed –making custom products necessary in many cases when using conventional SiC modules.　　To address this challenge, ROHM has developed each of these two topologies—the smallest building blocks of multi-level circuits—into a 2-in-1 module. This enables flexibility to support various configurations such as NPC circuits and DC-DC converters, while significantly reducing the number of components and mounting area, and achieving circuit miniaturization compared to discrete components.　　Evaluation boards will also be made available progressively to facilitate evaluation during application design. For more information, please contact a sales representative or visit the contact page on ROHM’s website.　　Product Lineup　　☆:Under Development　　AEC-Q101 is an automotive electronics reliability standard established by the Automotive Electronics Council (AEC).　　The Q101 standard is specifically focused on discrete semiconductor components.　　Application Examples　　PV inverters, semiconductor relays, UPS (uninterruptible power supply), ePTO, and boost converters for FCVs (fuel cell vehicles).　　AI servers (eFuse), EV charging stations, etc.　　Sales Information　　Pricing: $140/unit (samples, excluding tax)　　Availability: ROHM construct mass production (September 2025)　　Products compliant with the automotive reliability standard AEC-Q101 are scheduled to begin sample shipments in October 2025.　　Comprehensive Support　　ROHM is committed to providing application-level support, including the use of in-house motor testing equipment. A variety of supporting materials are also offered, such as simulations and thermal designs that enable quick evaluation and adoption of DOT-247 products. An evaluation kit for double-pulse testing is already available, allowing immediate testing, while an evaluation kit for 3-phase inverters is currently under preparation, with reference designs scheduled to be released from November 2025.　　• About the DOT-247 design models　　SPICE models: Available on the product web pages for each part number　　LTspice® models: Scheduled to be available for three-level NPC from October 2025 on the web pagesLTspice® is a registered trademark of Analog Devices, Inc.When using third-party trademarks, please adhere to the usage guidelines specified by the rights holder.　　For details, please contact a sales representative or visit the contact page on ROHM’s website.　　EcoSiC™ Brand　　EcoSiC™ is a brand of devices that utilize silicon carbide (SiC), which is attracting attention in the power device field for performance that surpasses silicon (Si). ROHM independently develops technologies essential for the evolution of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, we have established an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.• EcoSiC™ is a trademark or registered trademark of ROHM Co., Ltd.　　Terminology　　Half-bridge/ Common-source　　A basic configuration of a power conversion circuit consisting of two MOSFETs. In a half-bridge configuration, the MOSFETs are connected in series, one above the other, and the output is taken from the connection point. By switching the upper and lower MOSFETs alternately, the output voltage can be switched between positive and negative, making this configuration widely used as the basic structure for high-efficiency power conversion in inverters and motor drive circuits.　　Common Source is a configuration where the source terminals of the two MOSFETs are connected, and the output is taken from each drain. By grouping the source terminals, the gate drive circuit can be simplified, making it suitable for applications such as multilevel inverters.　　Types of NPC-type multi-level circuits　　NPC (Neutral Point Clamped) is a multi-level circuit configuration that divides the output voltage into three levels (+, 0, and -) to reduce voltage stress on the switching devices. The "0V" state is created by the neutral point, which is the contact point located between the positive and negative voltages.　　T-NPC (T-type NPC) replaces the diode used to stabilize the neutral point with switching devices such as MOSFETs, enabling more efficient operation. ANPC (Active NPC) actively controls the potential of the neutral point itself using a switch, achieving smoother output waveforms and high-precision power conversion. T-NPC and ANPC are suitable for applications requiring higher output and efficiency.　　ePTO (electric Power Take-Off)　　A system that uses the power from an electric vehicle's motor or battery to drive external work machinery or equipment (such as hydraulic pumps or compressors). This is an electrified version of the PTO (Power Take-Off) used in conventional engine vehicles, and its adoption is advancing in environmentally friendly commercial vehicles and work vehicles.
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Release time：2025-09-17 13:11 reading：454 Continue reading>>
ROHM’s SiC MOSFETs Adopted in Schaeffler’s Inverter Brick, Now in Mass Production
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ROHM’s SiC MOSFETs Adopted in Schaeffler’s Inverter Brick, Now in Mass Production

　　ROHM and Schaeffler, a leading German automotive supplier, have started mass production of a new high-voltage inverter brick equipped with ROHM’s SiC (silicon carbide) MOSFET bare chips as part of their strategic partnership. The inverter brick is intended for a major Chinese car manufacturer.High voltage inverter brickSiC MOS Wafer　　The Schaeffler inverter subassembly is the essential power device building block (brick) to control the electric drive via logic signals. This is where the high-frequency current pulses are produced that set the vehicle’s electric motor in motion. The performance characteristics of the inverter brick now being produced are impressive: Schaeffler increased the output of the brick by increasing the maximum possible battery voltage to much more than the usual 800 V – and with RMS currents of up to 650 A, which turn the sub-module into a compact power pack.　　“Through our strategic approach of incorporating scalability and modularity into our e-mobility solutions – from individual components to a highly integrated electric axle – we developed the readily integrated inverter brick. Based on our generic platform development, it took us just one year to bring this optimal product for the popular X-in-1 architectures to volume production readiness,” says Thomas Stierle, CEO of the E-Mobility Division at Schaeffler.　　Modularity and scalability as the key to easy integration　　As a core component of an inverter, a brick has to meet strict requirements. The characteristics of the sub-module are indicative of the factors behind the current sales success and start of volume production: ROHM’s silicon carbide (SiC) power semiconductors enable the frame-mounted sub-module with high power density to be compact, efficient, and readily integrated into various inverters through its modular and scalable design. The sub-module incorporates the power module for pulse width modulation (PWM) of the current pulses, the DC link capacitor, a DC link and a cooler. Moreover, the brick has a DC boost function, thanks to which a vehicle with 800 V architecture can also be charged at a 400 V charging station at a charging speed of 800 V.　　“We are glad about the launch of volume production for Schaeffler’s inverter brick with our 4th generation SiC MOSFET,” says Dr. Kazuhide Ino, Member of the Board and Managing Executive Officer at ROHM. “With our SiC technology we are making a substantial contribution to increasing the efficiency and performance of electric cars. Working with Schaeffler as our partner, we are thus fostering innovation and sustainability in the automotive industry,” Dr. Ino adds.　　The strategic partnership of Schaeffler (originally initiated under Vitesco Technologies) with ROHM has existed since 2020 and serves to secure capacity for energy-efficient SiC power semiconductors.Thomas Stierle, CEO E-Mobility Division at Schaeffler (left) and Dr. Kazuhide Ino, Member of the Board and Managing Executive Officer at ROHM　　About Schaeffler Group　　The Schaeffler Group has been driving forward groundbreaking inventions and developments in the field of motion technology for more than 75 years. With innovative technologies, products and services for electric mobility, CO₂-efficient drives, chassis solutions and renewable energies, the company is a reliable partner for making motion more efficient, intelligent and sustainable – over the entire life cycle. Schaeffler describes its comprehensive range of products and services in the mobility ecosystem by means of eight product families, from bearing solutions and linear guidance systems of all kinds to repair and monitoring services. With around 120,000 employees at more than 250 locations in 55 countries, Schaeffler is one of the world’s largest family-owned companies and ranks among Germany’s most innovative companies.
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Release time：2025-09-05 16:57 reading：528 Continue reading>>
Renesas Expands MCU/MPU Portfolio to Meet New Processing Needs of Edge AI
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Renesas Expands MCU/MPU Portfolio to Meet New Processing Needs of Edge AI

　　Artificial intelligence at the IoT edge is redefining how connected devices capture, process, and analyze data to render actionable outcomes in a variety of consumer and industrial applications. Unlike AI cloud servers, where power, data latency, and security management are prime design considerations, AIoT moves intelligence closer to the data source to enable real-time, in-situ decision-making with enhanced privacy and lower energy use.　　Despite its promise, AI at the IoT edge carries significant engineering challenges. Traditional AI models are computationally intensive. They require large amounts of memory and power, which resource-constrained IoT devices, often battery-operated with limited processing capacity, cannot easily support. Instead, designers need highly optimized, lightweight neural network models that run efficiently on microcontrollers, microprocessors, and other low-power hardware without sacrificing performance or accuracy.　　Managing AIoT Processing with TinyML Models　　Because it is inherently decentralized, AIoT reduces dependency on cloud servers while instantly acting upon real-time analytics and boosting security by keeping data local. This makes the process of outfitting factory equipment with predictive maintenance easier by embedding machine learning (ML) models within local sensors to detect anomalies or faults without waiting for cloud analysis. Smart home devices with AI-enhanced voice interfaces can perform instant keyword recognition and natural language understanding without sending sensitive audio data over the network.　　Similar to a trend underway in AI data centers, AIoT at the edge is also evolving to handle the proliferation of inference modeling. If data is the fuel for intelligent, real-time decision making, then AI inference is the engine that processes pre-trained ML models directly on edge devices.　　Data center AI inference modeling has a unique set of computational requirements best served by powerful parallel processors that can train large language models (LLMs) models that may have billions of parameters. On the other end of the spectrum, edge AIoT technologies like TinyML minimize memory requirements and computing overhead, making real-time analytics feasible for battery-powered IoT endpoints. Moreover, TinyML inference modeling enables multi-modal applications, combining voice, vision, and sensor data for advanced use cases like environmental monitoring and autonomous navigation.　　Real-time data processing is another function complicated by the memory limitations, modest energy budgets, and thermal constraints of edge AIoT. Many consumer and industrial applications, such as smart home voice recognition and autonomous sensors, demand ultra-low latency responses. Cloud-based AI struggles to meet these requirements due to network delays, making on-device inference essential. Engineers must also ensure data security and privacy by embedding strong encryption and root-of-trust mechanisms directly at the endpoint.　　Tools like TinyML are critical for overcoming these barriers and enabling compact machine learning models that operate efficiently on IoT hardware while extending battery life.　　Renesas Optimizes New MCUs and MPUs for Edge AIoT　　To better serve edge AIoT applications, Renesas recently expanded its processor portfolio, introducing new high-performance, low-power MCUs and MPUs with integrated neural processing units (NPUs) purpose-built for AI computing.　　The 32-bit Renesas RA8P1 MCU is designed for voice and vision edge AI applications and features dual Arm® cores, the 1GHz Cortex®-M85 and 250MHz Cortex-M33, and an Arm Ethos™-U55 NPU that delivers up to 256GOPS of AI performance. For security, the new MCU supports the Arm TrustZone® secure execution environment, hardware root-of-trust, secure boot, and advanced cryptographic engines, ensuring safe deployment in critical edge applications.　　Renesas also introduced the 64-bit RZ/G3E MPU for high-performance edge AIoT and human machine interfaces, combining a quad-core Arm Cortex-A55 CPU, Cortex-M33, and advanced graphics. The RZ/G3E embeds an Arm Ethos-U55 NPU to offload the main CPU by delivering up to 512GOPS of AI performance for image classification, voice recognition, and anomaly detection.　　Arm NPUs Right-Size Power and Performance for AIoT Applications　　The Arm Ethos-U55 NPU supports popular neural network models like ResNet, DS-CNN, and MobileNet with up to 35x faster inference compared to CPU-only processing. Unlike GPUs that burn tens to hundreds of watts on high-throughput, parallel computing, the Ethos-U55 delivers hardware-accelerated inference at milliwatt-level power, making it ideal for IoT edge devices.　　The Arm NPU supports compressed and quantized neural networks, reducing memory and compute overhead to allow for real-time, localized AI processing. In contrast, GPUs excel at training large models but are impractical for edge deployments due to size, cost, and energy use.　　Integrated RUHMI Framework and e² studio Streamline AI Edge Development　　The new MCU and MPU are both supported by the Renesas e² studio integrated development environment and incorporate Renesas' RUHMI Framework to accelerate edge AIoT design. RUHMI (Robust Unified Heterogeneous Model Integration) is an end-to-end toolset and Renesas' first comprehensive MCU/MPU framework for simplifying AI workloads on resource-constrained devices. RUHMI supports leading ML formats like TensorFlow™ Lite, PyTorch®, and ONNX, enabling developers to import and optimize pre-trained models for high-performance, low-power edge AI deployments.　　The RUHMI framework is enhanced by Renesas' e² studio, which provides intuitive tools, sample applications, and debugging features. When used together, they help developers more easily handle pre-processing of image and audio data, execute inference on the NPU, and post-process results within a unified environment.　　Edge AIoT Relies on Processors with Low Power and High Compute Density　　Grand View Research reports that the global edge AI market recorded sales of more than $20 billion in 2024, on its way to nearly $66.5 billion by 2030, driven by demand for real-time data processing and analysis at the network edge.　　Increasingly, MCUs and MPUs are the preferred choice for edge AIoT vision and voice applications due to low power consumption, localized processing, and cost efficiency. Unlike GPUs, which require cloud connectivity and high power, MCUs and MPUs can process data directly at the endpoint, enabling real-time inference and decision-making without network delays. By keeping sensitive data on-device, these processors also enhance security and privacy, eliminating the need for constant cloud communication.　　This combination of speed, energy efficiency, and data security makes MCUs and MPUs ideal for wearables, smart homes, and industrial edge AI systems.　　Future Efforts Will Prioritize HD Vision, Security, and a Robust IoT Supply Chain　　As we right-size support for our processor ecosystem using highly efficient TinyML models, Renesas is also developing MPUs for Vision Transformer (ViT) networks. This form of deep learning applies Transformer models originally designed for natural language processing to computer vision, but unlike power-hungry GPUs, ViTs process high-resolution images and videos without the need for cooling fans.　　Renesas is also creating zero-touch security solutions such as post-quantum cryptography (PQC), which secures against attacks from both classic and quantum computers to better defend against a widening range of cyber threats.　　As we foster AI-accelerated hardware, software, and tool chain development, Renesas remains committed to supporting legacy (non-AI) products and the open-source software environment that powers much of today's IoT systems. By collaborating with our partner ecosystem to keep abreast of the rapidly changing IoT landscape, we can better help our customers design sustainable, smart, secure, and connected systems safely and reliably.
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Release time：2025-08-25 14:59 reading：732 Continue reading>>
ROHM Releases a New Compact PFC + Flyback Control Reference Design for Power
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ROHM Releases a New Compact PFC + Flyback Control Reference Design for Power

　　ROHM’s new reference design (REF67004) is capable of controlling two commonly used power converter types in consumer and industrial power supply applications by using a single MCU :critical conduction mode PFC (Power Factor Correction) and quasi-resonant flyback. This is part of ROHM’s LogiCoA™ Power Supply Solution, that leverages analog-digital hybrid control technology. It combines an analog-controlled power stage circuit featuring ROHM’s superior silicon MOSFETs and gate driver ICs with a digitally managed power supply circuit built around the low-power LogiCoA™ MCU.　　Analog-controlled power supplies are widely used in small- to medium-power industrial applications, such as industrial robots and semiconductor manufacturing equipment. However, growing demands for higher reliability and more precise control have made it increasingly difficult for analog-only configurations to meet market expectations. On the other hand, while fully digital power supplies offer fine control and greater flexibility, their adoption in the small to medium power range has been limited due to the high cost and power consumption of digital controllers.　　To overcome these challenges, ROHM has developed the LogiCoA™ Power Supply Solution, a hybrid approach that integrates the advantages of both analog and digital control. Combined with ROHM’s high-performance, the low power LogiCoA™ MCUs enable easy control of various power topologies. As the first step, ROHM has released the REF66009 evaluation reference design, allowing users to explore the LogiCoA™ Power Supply Solution using a non-isolated buck converter circuit. This was followed by the launch of the REF67004, a reference design incorporating both PFC and flyback converters – topologies commonly used in consumer and industrial equipment.　　The newly introduced REF67004 is a reference design that boosts AC input using a Critical Conduction Mode PFC converter, followed by a Quasi-Resonant Flyback converter to deliver a regulated DC 24V output. Features include a calibration function that compensates for variations in the external component characteristics, enabling the LogiCoA™ MCU to perform high-precision voltage configuration and overcurrent protection. This allows for reduced design margins, making it possible to select more compact (low power) power devices and inductors, ultimately helping to minimize PCB area and lower overall system costs.　　The REF67004 also includes a logging function that allows the LogiCoA™ MCU to store operational data, such as input/output voltage, current, temperature, pre-shutdown system status, and cumulative operating time, in its built-in non-volatile memory. This data can be analyzed to easily identify the root cause of power supply failures. On top, various power control parameters and operational history can be easily configured and retrieved from a PC via UART (with a signal conversion device) using sample programs, including the RMOS (Real-time Micro Operating System) power control OS, available on ROHM's website. Practical evaluation is possible through the use of the reference design board LogiCoA003-EVK-001. Going forward, ROHM will continue to provide a variety of power supply reference designs to support and accelerate customer power supply development.　　LogiCoA™ Brand　　LogiCoA™ is a brand that embodies a design philosophy of fusing digital elements to maximize the performance of analog circuits. By combining the advantages of analog circuitry with those of digital control, it is possible to maximize the potential of circuit topologies, contributing to more efficient power utilization. As LogiCoA™ is a design concept that can be applied not only to the power supply field, but also to power solutions as a whole, ROHM is considering its application in future products and solutions.　　・LogiCoA™ is a trademark or registered trademark of ROHM Co., Ltd.　　LogiCoA™ Power Supply Solution Page　　The basic architecture and key features of the LogiCoA™ Power Supply Solution are available on ROHM’s website.　　https://www.rohm.com/support/logicoa　　LogiCoA™ Power Supply Solution Reference Design Lineup　　In addition to sample software, a variety of tools necessary for evaluation, such as circuit diagrams, PCB layouts, parts lists, and support documents are available on ROHM’s website, while actual device evaluation is also possible using the reference design board. Going forward, ROHM will continue to expand its lineup of reference designs to support a wide range of power topologies.　　● Reference Design Part No.　　• PFC + Flyback Converter: REF67004　　• Buck Converter: REF66009　　LogiCoA™ MCU  Lineup　　Key features include a built-in 3ch analog comparator that can be synchronized with timers, along with a D/A converter that enables digital control of various parameters to support different power supply topologies.　　LogiCoA™ MCU Development Support System　　Built on a ROHM’s proprietary 16bit RISC CPU core, LogiCoA™ MCUs are fully supported by a dedicated integrated development environment and emulator tools.　　For more information on the LogiCoA™ development support system and a product overviews, please visit ROHM’s LogiCoA™ MCU development system support page (link below).　　https://www.rohm.com/lapis-tech/product/micon/logicoa-software　　Online Sales Information　　Reference design boards, reference board and LogiCoA™ MCUs are available for purchase through online distributors such as AMEYA360.　　• Reference Design Board P/N:　　LogiCoA003-EVK-001*, LogiCoA001-EVK-001　　• Reference Board P/N:　　RB-D62Q2035TD20, RB-D62Q2045GD24　　• LogiCoA™ MCU P/N:　　ML62Q2035-NNNTDZWATZ, ML62Q2045-NNNGDZW5BY　　Pricing : $677/unit (samples for LogiCoA003- EVK-001, excluding tax)　　Application Examples　　• Industrial robots　• Semiconductor manufacturing equipment　• Gaming devices　　The LogiCoA™ Power Supply Solution is also suitable for integration into general industrial equipment and consumer devices with power requirements ranging from approximately 50W to 1kW.　　Terminology　　Critical Conduction Mode PFC (Power Factor Correction) Converter　　A configuration used in AC-DC converters within switching power supplies, Critical Conduction Mode PFC offers a high-power factor (indicating efficient utilization of supplied power) while generating less noise compared to Continuous Conduction Mode PFC. A power factor of ‘1’ signifies that all supplied power is being effectively used without waste.　　Quasi-Resonant Flyback Converter　　A DC-DC converter topology commonly used in isolated power supply designs, these converters leverage a quasi-resonant control technique to minimize switching losses and noise. Ideal for applications up to 100W, it offers advantages in terms of reduced component count and cost. While other forward-type topologies exist, advancements in the components used in these designs have led to smaller, more efficient isolated power supply solutions.　　Analog Control Power Supply　　A power supply configuration built with analog components, commonly used for applications up to 1kW due to its simplicity and low power consumption. However, implementing advanced features such as customizable parameter settings and data logging is challenging with analog control alone, often requiring fully digital solutions that tend to increase both cost and power consumption.　　Digital Control Power Supply　　A power supply is managed using digital technology. High-speed CPUs and DSPs are used to precisely monitor and control key parameters such as voltage and current, improving power supply efficiency and reliability. Digital control also enables advanced functions, such as operation log data acquisition, that are difficult to implement with analog control alone. However, CPUs and DSPs tend to be expensive and consume significant power, posing challenges in terms of cost effectiveness and energy efficiency.　　• CPU (Central Processing Unit): The core processor responsible for executing programs and performing data processing.　　• DSP (Digital Signal Processor): A processor that converts analog signals into digital form and performs operations such as filtering and amplification.　　Topology　　Refers to the circuit configuration. Power topology defines how electrical energy is transformed and managed within a circuit. The specific configuration depends on factors such as input and output voltage levels, power requirements, and whether electrical isolation is necessary.
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Release time：2025-08-25 14:24 reading：543 Continue reading>>
New Renesas USB-C Power Solution with Innovative Three-Level Topology Improves Performance and Reduces System Size
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New Renesas USB-C Power Solution with Innovative Three-Level Topology Improves Performance and Reduces System Size

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RAA489300/RAA489301 high-performance buck controller designed with a three-level buck topology used for battery charging and voltage regulation in USB-C systems such as multiple-port USB-PD chargers, portable power stations, PC docking station, robots, drones, and other applications that need a high efficiency DC/DC controller.　　The three-level buck converter topology enabled by the new IC delivers exceptional efficiency and significantly reduces the required inductance for regulating the output voltage. Its innovative design minimizes power loss and reduces system size, making it ideal for compact, high-performance applications.　　The three-level topology consists of two additional switches and a flying capacitor compared to a conventional two-level buck converter. The flying capacitor reduces voltage stress on the switches, allowing designers to use lower voltage FETs with better figures of merit. The result is reduced conduction and switching losses. This topology also enables the use of a smaller inductor with peak-to-peak ripple of only about 25 percent of that of a two-level converter, enabling reduced inductor core and direct current resistance losses.　　Renesas is a worldwide leader in USB-PD solutions, offering a comprehensive range of products, including turnkey solutions for various applications. Renesas helps customers shorten their time-to-market with an extensive development environment and pre-certified USB-IF reference designs. Renesas USB-PD solutions offer superior quality and safety, along with high efficiency and power density.　　“This three-level buck topology solution is a prime example of Renesas’ worldwide leadership in battery charging,” said Gaurang Shah, Vice President of the Power Division at Renesas. “The innovative technology includes patent-pending breakthroughs that offer our customers clear advantages over competing USB-C power offerings.”　　The 3-Level DC-DC RAA489300/RAA489301 battery charger and voltage regulator offers superior thermal performance, which reduces cooling requirements and results in cost and space savings. This innovative approach addresses the growing demand for compact and efficient power management systems.　　Key Features of the RAA489300/RAA489301 battery charger and voltage regulator　　Wide range of input and output voltages for use in voltage battery packs and with various PD adapters　　Integrated safety features with built-in protection mechanisms against overcharging, overheating, and voltage anomalies　　Scalability for easily adapting to various power levels and application requirements　　Optimized switching architecture divides the voltage across power switches, improving efficiency　　Minimizes power consumption, contributing to greener, more sustainable designs　　Lower thermal stress improves system reliability and extends product lifespan　　Winning Combinations　　Renesas offers the RTK-251-SinkCharger-240W and the 240W Dual-Port Daughter Card Winning Combinations that minimize the effort required for customers to design USB-C battery charging into their products. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. 　　Device Availability　　The RAA489300/RAA489301 is available today in a 4×4 mm 32-lead TQFN package. Comprehensive design support and tools, including the RTK-251-SinkCharger-240W Kit and the RTKA489300DE0000BU Evaluation Board, are also available.
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Release time：2025-08-20 11:46 reading：732 Continue reading>>
Murata Launches i<span style='color:red'>SI</span>M IoT Module with Built-In Global Connectivity from 1NCE
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Murata Launches iSIM IoT Module with Built-In Global Connectivity from 1NCE

　　Murata today introduced a new iSIM-compatible LPWA module, the Type 1SC, pre-integrated with out-of-the-box connectivity from 1NCE, one of the world’s fastest-growing IoT companies. The collaboration delivers simplified, scalable global connectivity, making it easier to launch and manage low-power IoT devices. Optimized for low-power, low-data applications, the solution comes bundled with 50 MB of data and optional top-ups, enabling rapid, cost-effective deployment for applications such as asset tracking, fleet management, and healthcare monitoring. Supporting both LTE-M and NB-IoT, the module offers broad compatibility across networks in 173 countries.　　By embedding 1NCE’s cloud-based connectivity directly into the module, Murata eliminates the need for separate SIM provisioning, streamlining the design and manufacturing process for compact, energy-efficient devices. The result is a faster, more reliable path to market. Additionally, with over 30 million devices managed across 23,000+ customers, its platform simplifies lifetime IoT connectivity – bringing seamless integration, global reach, and built-in scalability to the next generation of connected products.　　“Murata’s Type 1SC module represents our commitment to driving innovation in the IoT space,” said Hiro Hyogo, Senior Manager, Corporate Technology and Innovation at Murata Americas. “By having connectivity pre-installed on our modules, we’re reducing the complexities and costs associated with global IoT deployments while ensuring strong security and performance.”　　"IoT will be dominated by software players, which is why Murata chose and trusted in 1NCE," said Fabian Kochem, Head of Global Product Strategy at 1NCE. “The supply chain of IoT is bloated, but our two companies save our customers time and money.”
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Release time：2025-08-13 15:33 reading：525 Continue reading>>
Renesas Announces Establishment of New Subsidiary and Changes as Specified Subsidiary
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Renesas Announces Establishment of New Subsidiary and Changes as Specified Subsidiary

　　Renesas Electronics Corporation (TSE: 6723, "Renesas"), a premier supplier of advanced semiconductor solutions,  announced the establishment of a new subsidiary (the “New Subsidiary”) in the United States as a holding company for its Software & Digitalization business. The New Subsidiary is expected to be classified as a specified subsidiary of Renesas.　　1. Purpose of Establishing the New Subsidiary　　In January 2024, Renesas established a new organization dedicated to software and digitalization, accelerating efforts in these fields. As part of this initiative, Renesas acquired Altium Limited ("Altium", Note) in August 2024 and is working together with Altium as one team to establish an integrated and open “electronics system design and lifecycle management platform” to make electronics design accessible to a broader market to allow more innovation. In January 2025, Altium’s acquisition of Part Analytics, Inc., a supply chain management company, marked another step toward realizing Renesas’ Digitalization Vision.　　To further strengthen and grow its Software & Digitalization business, Renesas plans to establish a holding company as its wholly owned subsidiary in the first quarter ending March 31,2026, to oversee the management of its subsidiaries related to this business. Following the necessary procedures, Renesas intends to consolidate the shares of its Software & Digitalization-related subsidiaries, including Altium, under the New Subsidiary. The New Subsidiary's net assets are expected to exceed 30 percent of Renesas' total equity, and, as a result, it will be treated as a specified subsidiary of Renesas. By centrally managing its Software & Digitalization-related subsidiaries under the New Subsidiary, Renesas aims to enhance governance and operational efficiency, while building a structure that can flexibly respond to future business development and internal resource allocation.　　2. Overview of the Specified Subsidiary　　3. Future Outlook　　There is no material impact on Renesas' consolidated financial results for the fiscal year ending December 31, 2025. Renesas will make an announcement in a timely manner should any matters requiring disclosure arise in the future.　　(Note) Altium Limited has changed its corporate name to Altium Pty Ltd, effective December 12, 2024.
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Release time：2025-07-28 14:40 reading：605 Continue reading>>
<span style='color:red'>SI</span>MCom：A7663E Achieves Key Global Certifications, Enabling Scalable 4G IoT Deployments
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SIMCom：A7663E Achieves Key Global Certifications, Enabling Scalable 4G IoT Deployments

　　As the global demand for LTE Cat 1 modules continues to rise in industrial IoT, asset tracking, and metering applications, SIMCom (as a global leader in IoT communication and solution)'s A7663E stands out with a balanced mix of performance, integration flexibility, and certification readiness. The module has recently secured a comprehensive set of international certifications, including RoHS, REACH, CE (RED) for the European market, Anatel for Brazil, and Cybersecurity compliance, paving the way for faster IoT deployment in regulated global markets.　　The A7663E is built LGA form factor, offering high integration capability while maintaining reliability. It supports LTE-FDD with downlink speeds up to 10 Mbps and uplink up to 5 Mbps, making it suitable for medium-data-rate IoT scenarios that demand efficient wireless performance and long lifecycle support. The inclusion of integrated multi-constellation GNSS (GPS, GLONASS, BeiDou) further enhances its value for location-based applications like asset tracking, smart mobility, telematics, surveillance devices, industrial routers, and remote diagnostics and so on.　　Additionally, A7663E provides a rich set of interfaces to support diverse product architectures. Its software feature set includes FOTA (Firmware Over-The-Air), SSL encryption, and LBS—ensuring devices stay secure and up-to-date throughout their lifecycle. This greatly reduces time-to-market and engineering cost.　　With global compatibility, the A7663E is an ideal LTE Cat 1 solution for IoT developers aiming to scale deployments across multiple regions with confidence.
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Release time：2025-07-24 10:37 reading：513 Continue reading>>
Commercialized the XRCGB_F_C Series In-vehicle Compact Crystal Unit in 2016 Size
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Commercialized the XRCGB_F_C Series In-vehicle Compact Crystal Unit in 2016 Size

　　Murata Manufacturing Co., Ltd. (hereinafter ‘Murata’) commercialized the ‘XRCGB_F_C’ series compact crystal unit (hereinafter ‘this product’) in 2016 size for in-vehicle infotainment (IVI*1) and other automotive applications. Mass production has already begun.　　*1In-Vehicle Infotainment (IVI): An automotive function that provides information and entertainment to the driver and passengers through an IT device mounted on the automobile.　　Most in-vehicle infotainment systems use 3225 size crystal units. In recent years, the growing demand for enhanced functionality in electronic systems—particularly with the integration of ADAS*2 — has led to an increased reliance on electronic components. This trend necessitates the development of even smaller electronic parts. Simultaneously, communications standards for in-vehicle systems are also advancing, which results in an intense wireless traffic of these individual devices. Under these circumstances, signal transmission timing must be accurately synchronized between in-vehicle device ICs in order to correctly receive electric signals on frequencies defined by different communications standards and avoid inter-IC communication errors. This therefore requires high-precision timing devices that generate stable clock signals.*3　　*2ADAS: Advanced Driver Assistance System.　　*3Clock signals: Signals transmitted at a stable cycle with certain intervals.　　To respond to this need, Murata developed this 2016-size product for in-vehicle applications, achieving both smaller size and higher precision thanks to our original packaging technique and design and process optimization. Compared to the 3225 size, the new product achieves about 60% reduction in implementation space, contributing to downsizing the device itself while offering enhanced functionality. This product also features powerful cracking resistance while soldering and is preferred by many customers for in-vehicle applications.　　We will continue to help bring safety and reliability to customers by expanding the use of highly reliable and high-performance crystal units.　　Product characteristics　　Compact 2016 size　　High precision　　Operating temperature 105°C guaranteed　　High resistance to cracks while soldering　　Highly reliable with a low failure rate (particle-less)　　Stable supply　　Lead-free
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Release time：2025-07-23 13:16 reading：411 Continue reading>>

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