Ameya360:<span style='color:red'>Micron</span> Pushes DRAM Node for Mobile First
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Ameya360:Micron Pushes DRAM Node for Mobile First

　　Micron Technology has been setting the pace for DRAM advancement of late. Its 1-beta DRAM technology continues the trend, but other major vendors are keeping up, even as it looks like DRAM prices will be lower in 2023.　　The company said at the beginning of November that it was shipping qualification samples of its 1-beta DRAM to select smartphone customers and that it’s ready for mass production. The advanced DRAM technology node, which will be used first on Micron’s low-power double data rate 5X (LPDDR5X) mobile memory that delivers speeds of 8.5 Gb/s, follows the company’s 1-alpha DRAM that began volume shipment in 2021.　　Micron’s 1-Beta LPDDR5X provides 16Gb per die capacity, 35% higher than the prior generation, and a 15% power saving compared to prior generation products. Thy Tran, Micron’s VP of DRAM process integration, said the new node is the result of new processes, materials, and equipment to advance Micron’s memory cell integration so it can shrink the memory cell array, including the application of its second-generation high-K metal gate (HKMG) technology. “We can then aggressively scale both the memory cell array in terms of size and also the rest of the circuitry in the dye to save space.”　　Aside from the performance improvements that will benefit smartphone functions such as camera launch, night mode and portrait mode and shake-free, high-resolution 8K video recording and in-phone video editing, Micron’s LPDDR5 based on its 1-beta DRAM boasts additional energy efficiency by implementing JEDEC’s new enhanced dynamic voltage and frequency scaling extensions core (eDVFSC) techniques. Adding eDVFSC at a doubled frequency tier of up to 3,200 megabits per second provides improved power savings controls to enable more efficient use of power based on end-user patterns.　　These features not only represent a faster smartphone camera but also demonstrate how artificial intelligence and machine learning are transforming smartphones into mobile editing studios, Tran said. “Be it photos, videos, or voice processing, memory is at the heart of everything we do.”　　Jim Handy, principal analyst with Objective Analysis, said what’s notable about Micron’s 1-beta is that it demonstrates Micron is strongly oriented toward pushing the technology forward with its HKMG technology to make DRAM as fast as it needs to go. “That makes for a complicated process.” If Micron were just trying to get the bits as cheap as they could be, it wouldn’t touch HKMG, he said.　　So far, DDR5 DRAM has mostly found its way into PCs, said Handy, and less so data centers. But Micron would like to see that change sooner than later so it can sell DDR5 before prices collapse, especially given the fact it’s been eight years since DDR4 was introduced. He noted that the company’s focus of late has been being more profitable rather than dominating market share.　　Although LPDDR5 will be the first to benefit from the 1-beta DRAM technology, Micron will expand the product portfolio that will be manufactured on this node as 2023 progresses for all segments of the memory market including High Bandwidth Memory (HBM).　　Not to be outdone, Samsung Electronics closed out 2022 by announcing the development of its 16-Gb DDR5 DRAM built using what it said is the industry’s first 12-nm-class process technology. Like Micron, Samsung is matching performance gains with power efficiency – its new DRAM consumes up to 23%  less power than its predecessor. Mass production is set to begin in 2023.
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Release time：2023-01-17 11:45 reading：1985 Continue reading>>
Samsung, <span style='color:red'>Micron</span> Battling for NAND Supremacy
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Samsung, Micron Battling for NAND Supremacy

　　Samsung Electronics and Micron Technology continue to fight for supremacy in the NAND market, with both companies recently announcing higher-density 3D NAND solutions—albeit with different nomenclatures.　　Samsung has opted to focus on 3D NAND bit density with the introduction of its 1-terabit (Tb) triple-level–cell eighth-generation vertical NAND (V-NAND), which the company claims is the industry’s highest bit density. Meanwhile, Micron has opted to present its latest 3D NAND in term of layers, having announced its 232-layer 3D NAND mid-year in 2022.　　Samsung’s eighth-gen V-NAND　　SungHoi Hur, executive vice president of flash product and technology at Samsung, told EE Times during an interview that the company achieved high bit density through a Cell-on-Peri (COP) structure, which the company introduced with its seventh-generation V-NAND.　　With a COP structure, a cell array area is placed above the peripheral. But even with a COP structure, part of the peripheral is placed outside of the cell, Hur said, meaning the cell array must be reduced along with the peripheral area below and next to the cell array to reduce chip size.　　Samsung first introduced its vertically stacked V-NAND flash in 2013. “Since then, we have been developing disruptive technologies to reduce the area and height of cells and have accumulated a great deal of Samsung know-how,” Hur said.　　That know-how includes Samsung’s high-aspect–ratio contact etching technology, which the company uses to reduce the area of the cell array. For the eighth-generation V-NAND, Samsung successfully minimized the area of all three parts from the previous generation to enable even more density, Hur added.　　A specific challenge that Samsung aims to address is avoiding the cell-to-cell interference that normally occurs with scaling down if the mold of the cell unit gets slimmer for scaling. “To counteract that interference, we have identified possible tradeoffs in performance first; then we moved on to solving the fundamental problems,” Hur said.　　He also noted that the purpose of Samsung’s solution was to develop an optimal operation scheme for minimizing interference during writing, applying a new material to the blocking layer in the cell to prevent electrons from bouncing out of the charge trap layer (CTL) due to voltage and improving the structure of the CTL.　　Hur said reaching this milestone means overcoming a variety of hurdles. From a structural perspective, the molds could lean to one side more easily as the total stack height continues to grow. “As the cells become closer and smaller, we have to fight with decreasing cell current as well as interference among cells,” he said. Samsung is working to lower the total stack height by leveraging the support structure used in its seventh-generation V-NAND and the multi-hole technology while also exploring new solutions, including an innovative cell structure using new materials.
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Release time：2023-01-12 10:40 reading：3485 Continue reading>>
<span style='color:red'>Micron</span> to buy-out Intel's IM Flash
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Micron to buy-out Intel's IM Flash

　　Micron Technology has announced that it is exercising its right to purchase Intel’s interest in their joint venture, IM Flash Technologies (IM Flash).　　This comes after the announcement that was made back in July 2018 that the two companies had agreed to conclude their joint development of 3D XPoint technology after the completion of the second-generation node.　　"The IM Flash acquisition will enable Micron to accelerate our R&D and optimise our manufacturing plan for 3D XPoint,” said Micron Technology President and CEO Sanjay Mehrotra. “The Utah-based facility provides us with the manufacturing flexibility and highly skilled talent to drive 3D XPoint development and innovation, and to deliver on our emerging technology roadmap.”　　Micron anticipates that the pending acquisition will have no meaningful impact on its financial results and said that it saw no changes to the company’s fiscal 2019 capital expenditures or long-term capital expenditure target.　　Micron said that it expects to pay approximately $1.5billion in cash for the transaction.
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Release time：2019-01-16 00:00 reading：1156 Continue reading>>
<span style='color:red'>Micron</span> Sees Weak Market Ahead
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Micron Sees Weak Market Ahead

Over the past few weeks, signs have increasingly signaled that the two-year boom in memory chip sales is grinding to a halt. Now, U.S. memory chipmaker Micron Technology has provided more indications that a bust cycle is at hand.Micron reported on Tuesday quarterly sales and earnings at the low end of Wall Street estimates but said that it expects revenue to decline significantly in the current quarter due to “weak near-term supply-demand dynamics.”However, Micron executives characterized these dynamics as a short-term bump in the road en route to continued expansion in the second half of next year. Some memory market watchers believe that a memory downturn is likely to last significantly longer.Sanjay Mehrotra, Micron’s president and CEO, told analysts on a conference call following the quarterly report that the downbeat forecast is primarily related to a glut of inventory in the supply chain.“We’re just going through an air pocket here related to primarily inventory adjustments as well as some seasonal, weak mobile demand — including mobile demand” he said.While Micron is implementing some cost control measures such as cutting back on capital spending, said Mehotra, he expects 2019 to be a profitable year for the company. “Micron is better-positioned than ever before to win in this environment with our strong balance sheet and the structural improvements we have made to our operating model in the past several years.”“He’s certainly still giving a very bullish outlook,” said Jim Handy, principal at Objective Analysis, of Mehotra’s view. “He’s looking to trim capital spending now to take care of things late in 2019. My understanding of how the market works is that anything you do now to capital spending isn’t going to have an impact for two years.”Handy used the familiar metaphor of trying to turn around an aircraft carrier to compare to a memory chip company steering through a downturn. “What Micron is doing is turning the steering wheel now with the hopes that the ship will turn by the end of 2019, but it’s really not going to have an impact until later,” he said.Micron’s sales for the quarter ended Nov. 30 totaled $7.91 billion, up 16% year over year but down 5% from the previous quarter. The company’s quarterly net income totaled $3.29 billion, up 23% from the year-ago quarter but down 24% compared to the previous quarter.For the current quarter, Micron expects sales to fall to between $5.7 billion to $6.3 billion, well below the $7.34 billion average of analysts’ estimates, according to Yahoo Finance.
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Release time：2018-12-20 00:00 reading：1637 Continue reading>>
<span style='color:red'>Micron</span> collaborates with premium German automaker to advance automotive memory technologies
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Micron collaborates with premium German automaker to advance automotive memory technologies

Micron Technology, Inc., (Nasdaq: MU) today announced at Electronica 2018 that it will collaborate with the BMW Group to further advance the development of automotive memory solutions used in vehicles. Memory and storage are key components in accelerating the intelligence and user experience of next-generation systems in vehicles, including in-cabin infotainment as well as advanced driver-assistance systems (ADAS) technology, which together play an important role in making self-driving autonomous cars a reality.Micron and the BMW Group will intensify their existing efforts toward testing and development of automotive memory solutions at Micron’s state-of-the-art lab in Munich, Germany. Using the Test Automation Framework of the BMW Group as a car emulator platform, the two companies will work together to define and validate memory and storage solutions for next-generation platforms. The collaborative effort will leverage Micron’s memory and storage technology expertise, along with its broad portfolio of DRAM, NAND, and NOR technologies, including LPDRAM, e.MMC, UFS and SSD storage solutions.As a proven memory partner for automotive manufacturers, Micron recognizes the importance of validating and testing new automotive memory technologies for robustness and reliability before releasing them into the market. Micron’s customer lab expertise in developing innovative automotive memory technologies will enable the BMW Group to raise the quality of the driving experience in automobiles of the future.“The incorporation of new features and capabilities in advanced in-vehicle infotainment (IVI) and ADAS, such as voice recognition, hand gesturing and image recognition, are driving an explosive growth in both volatile and nonvolatile memory embedded in vehicles, accelerating intelligence at the edge,” said Giorgio Scuro, vice president of Micron’s automotive division. “Micron has a long-standing record working with automotive industry partners, and this joint initiative with the BMW Group is a testament to our expertise in bringing innovative automotive memory technologies to market.”As a leading memory partner with more than 25 years of experience, Micron provides advanced automotive memory solutions that meet stringent quality, reliability and compliance requirements. Micron’s broad portfolio of volatile and nonvolatile memory products are optimized for automotive and supported by a formal product longevity program.
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Release time：2018-11-15 00:00 reading：1284 Continue reading>>
<span style='color:red'>Micron</span> provides statement on U.S. Department of Justice indictments relating to theft of <span style='color:red'>Micron</span> trade secretsnology Theft
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Micron provides statement on U.S. Department of Justice indictments relating to theft of Micron trade secretsnology Theft

Micron Technology, Inc., (NASDAQ:MU)received the announcement from the U.S. Department of Justice that on Nov. 1, 2018, it had issued indictments against United Microelectronics Corporation (UMC), Fujian Jinhua Integrated Circuit (Jinhua) and three former employees of Micron’s Taiwan unit for conspiracy to commit trade secret theft, economic espionage and related crimes.“We appreciate the U.S. Department of Justice’s decision to prosecute the criminal theft of our intellectual property,” said Joel Poppen, senior vice president, legal affairs, general counsel and corporate secretary at Micron Technology. “Micron has invested billions of dollars over decades to develop its intellectual property. The actions announced today reinforce that criminal misappropriation will be appropriately addressed.”The three former Micron employees named in the indictment are former Micron Memory Taiwan chairman Stephen Chen and engineers JT Ho and Kenny Wang.In December 2017, Micron filed suit against UMC and Jinhua in the U.S. District Court for the Northern District of California for the misappropriation of Micron intellectual property and trade secrets.Background about prior casesIn August 2017, Taiwan authorities filed criminal indictments against UMC and three of its employees for the alleged theft and use of trade secrets from Micron, for the purpose of developing DRAM chip manufacturing technologies in cooperation with Jinhua. Two of those charged are former employees of Micron’s Taiwan unit who have now also been indicted for trade secret theft by the U.S. Department of Justice.In December 2017, Micron filed a civil case against UMC and Jinhua in the U.S. District Court for the Northern District of California for the misappropriation of Micron trade secrets.In January 2018, in retaliation for the criminal indictments filed by Taiwan authorities and the civil lawsuit filed by Micron in Federal Court in California, UMC and Jinhua filed patent infringement suits in Fujian Province, China, against Micron’s China subsidiaries. On July 5, 2018, the court in Fujian notified the Micron subsidiaries that it had issued preliminary injunctions against them. Micron has asked the court to reconsider the injunctions, which the court issued without allowing Micron to present a defense. Micron strongly believes that the patents are invalid, that Micron’s products do not infringe the patents and that these suits are without merit.
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Release time：2018-11-05 00:00 reading：1140 Continue reading>>
<span style='color:red'>Micron</span> Opens Backend Factory in Taichung Aiming 3D memory Market
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Micron Opens Backend Factory in Taichung Aiming 3D memory Market

Major memory manufacturer Micron on October 26 held an opening ceremony for their backend packaging and testing plant in Taichung. With the opening of this factory, Micron Taiwan will be the world’s only memory vertical integration production base with both manufacturing and testing, and the main target product will be 3D memory, which is currently in high demand.Micron Executive Vice President of Global Operations Manish Bhatia stated that following the opening of the backend packaging and testing plant in Taichung, Micron will be capable of responding to customer’s needs more rapidly, and the production cycle will be shortened. At the same time, they will also focus on more valuable and advanced products.Currently, the hottest product in the memory market is 3D NAND flash memory, and mass shipments of Micron’s 64-layer products are underway .The latest 96-layer NAND flash memory products will also go into mass production in the second half of this year. As a result, Micron is upgrading their production capacity for related products, and this will be the key for Micron to increase their profitability.Taiwan Micron Vice President Liang Ming-cheng pointed out that 3D memory that utilizes TSV technology has specialized processing specifications, and there is no general-purpose equipment. All of the packaging and testing equipment has been independently developed by Micron; therefore, it cannot be outsourced. In the future after the new packaging and testing center begins to be utilized, it will be of assistance in expanding production capacity for 3D memory.Following the movement from semiconductor manufacturing to 3D architecture, integrated manufacturing and testing of high-end ICs has become the main trend by and large. For instance, TSMC is continually expanding and increasing their technological capabilities in the domain of packaging and testing and Micron has established their own vertical production line which integrates manufacturing with packaging and testing, which is further evidence of this trend.Hence it will be worth paying attention to whether or not this technology will bring about changes in the current semiconductor industry chain.
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Release time：2018-11-01 00:00 reading：1147 Continue reading>>
<span style='color:red'>Micron</span> celebrates 40 years of leadership and innovation
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Micron celebrates 40 years of leadership and innovation

Micron Technology Inc. (NASDAQ: MU) today marked its 40th anniversary with a celebration on the steps of the Idaho state Capitol, one of many celebrations at Micron sites around the world.From its early days as a startup in Boise 40 years ago, Micron has established itself as the world’s fourth-largest semiconductor company, with the broadest portfolio of memory and storage solutions in the industry. Today, Micron employs more than 34,000 people in 17 countries globally. Micron has contributed nearly 40,000 patents over the course of its history, and the company’s commitment to innovation continues to serve as an engine for its expansion and growth. Over the last 40 years, Micron’s high-performance memory and storage solutions have helped enable many broader technology advances in diverse end applications such as Personal Computing, Mobile Smartphones, Networking and Cloud Computing. In the future, Micron’s products will play an instrumental role in delivering storage and faster access to data that will continue to drive breakthroughs in new areas such as artificial intelligence, machine learning and autonomous driving.“Our 40-year history is a great story of innovation and tenacity, and we are proud of our legacy,” Micron President and CEO Sanjay Mehrotra said. “Micron is scaling new heights and our technology is the foundation on which the AI revolution is being built. We look forward to the next decade with great optimism and excitement – and the confidence that the technology evolution is increasingly making Micron an indispensable player and key partner to the ecosystem and to our customers.”Micron’s leadership and contributions extend to the communities in which it operates. The Micron Foundation, which the company established in 1999, has donated more than US$100 million in 17 countries. In the past two years alone, the Micron Foundation has contributed nearly $25 million globally. At the Boise celebration, Mehrotra announced the “40 For Good” program, awarding donations to four Boise-area charities. Last week at its inaugural Insight 2018 event, Micron announced a $1 million grant for universities and nonprofit organizations to conduct research on AI. The event featured keynotes and discussions with some of the industry’s most important thought leaders in the fields of AI, machine learning and data science.At the Boise state Capitol celebration today, Idaho Gov. Butch Otter and Boise Mayor Dave Bieter joined the festivities, commending Micron on its success and commitment to local communities.“Micron has created a vibrant legacy of leadership and innovation in their industry and an enviable record of civic involvement within our state,” Otter said. “The Micron Foundation has made tremendous investments in critical educational and community infrastructure. As one of Idaho’s largest employers, Micron has played a vital role in providing not just jobs, but meaningful careers. Through their 40 years, Micron has been a big part of Idaho’s success in diversifying our economy and expanding our economic base. With their continued wise and steady leadership, I have no doubt that Micron’s best years are yet to come.”Business leaders around the world extended their congratulations to Micron on its 40th anniversary.“In the course of the last 40 years when I was in the industry, many technology companies have come and gone,” NVIDIA Founder, President and CEO Jensen Huang said. “Yet the great ones, somehow, reinvent themselves, and surf the waves, and somehow are always ahead of it. Micron is one of those great companies.”“As data continues to rise in importance, so does the need to securely and efficiently store and access it,” said Richard Yu, executive director and CEO of the Consumer Business Group for Huawei Technology Co. Ltd. “Micron has proven to be a reliable and innovative partner, helping Huawei address its data storage needs and supporting our growth as a networking and communications leader. We look forward to our future work with Micron.”“Decades ago Micron allowed a small Dutch startup into its fab and has since been instrumental in ASML’s success. I have experienced firsthand the innovation and tenacity that have enabled Micron to survive and thrive when so many others did not,” ASML President and CTO Martin van den Brink said. “It has been a privilege to be part of Micron’s 40-year journey. Throughout the years, Micron has remained fully committed to our shared goal to successfully push leading-edge technology forward as a core differentiator. Congratulations to the whole Micron team on your 40th anniversary.”“Micron is a longtime supplier for our business that has pivoted to provide memory solutions across Dell’s core technologies, from edge devices to data centers,” said Jeff Clarke, vice chairman, products and operations, Dell Technologies. “It is great to work with a company that not only delivers on our current needs, but listens, innovates and leads as new opportunities emerge to serve our customers.”
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Release time：2018-10-19 00:00 reading：1118 Continue reading>>
<span style='color:red'>Micron</span> Places $100 Million AI Bet
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Micron Places $100 Million AI Bet

Micron Technology announced a $100 million venture fund with a focus on AI at a coming-out party for its new chief executive here. Sanjay Mehrotra, former CEO and co-founder of SanDisk, vowed to accelerate new product introductions at the company best known as one of the survivors of consolidation in commodity DRAMs.It’s a challenging time for the memory and storage giant that trails larger rivals Samsung, SK Hynix, and Toshiba. Breakout products such as the Hybrid Memory Cube and Automata processor failed to gain significant traction and 3DXPoint memories co-designed with Intel hit delays, with revenues for Micron now pushed out to 2020.On the positive side, the company hopes to sample 3DXPoint devices late next year. It will also enter the market for high-bandwidth memory stacks, initially with HBM2 in 2019.In its core business, Micron has a DRAM-like product in the lab that it aims to sample in 2021. It has a process technology roadmap with three new nodes ramping into production. In addition, it is privately showing customers software to accelerate NAND storage performance 3x to 5x.At the event here, executives made the case that the rise of deep learning will help drive demand for memory and storage. Its new fund aims to help it ride the wave with future investments in hardware, software, and services.“This is not just about the money, but technology partnerships as well,” said Sumit Sadana, Micron’s chief business officer and a former executive at SanDisk, Freescale, and IBM. “We have some emerging memory technologies not yet in production that we will seek partners to help bring to market.”Micron researchers are exploring the kinds of processor-on-memory architectures that startups such as Mythic and Syntiant hope to pioneer. They are also bullish on so-called neuromorphic chips that use a mesh of synapse-like cores that companies such as BrainChip are pursuing.It’s unclear when or how Micron will be able to turn the concepts into products.“We have a lot of innovative work in memory and future architectures, some of them are focused on deep learning,” said Sadana. “We have grants from the U.S. government to investigate frontiers of processing in memory and deep-learning acceleration, but a lot of the work is extremely sensitive and confidential.”It’s still early days for machine learning, said speakers from Amazon and Microsoft.For example, developers are working to enable Amazon’s Alexa to understand context as well as multiple commands in a sentence, said Prem Natarajan, who heads up natural language work for the web giant. Microsoft recently released a service to let companies create their own voice assistants and aims to enable them to someday engage in realistic conversations, said Lili Cheng, who leads Microsoft’s AI research.AI training could require 7x more DRAM and 2x more NAND in future servers. (Image: Micron)Micron execs remain bullish on its core DRAM roadmap as well as the outlook for 3DXPoint in both main memory and storage.The company expects to use 3DXPoint in both dense, fast main memory products and storage that delivers lower latency than Intel’s current Optane drives. Micron’s stated plan of sampling in late 2019 for revenues in 2020 suggests that it is waiting for a second-generation 3DXPoint device that it is co-developing with Intel.Executives declined to provide any product details or market projections. “Our belief is that [3DXPoint] becomes a meaningful part of the data center hierarchy that will cannibalize a nibble on either side [of DRAM and NAND], but the aggregate market grows quite a bit,” said Tom Eby, who runs Micron’s compute and networking group.“3DXPoint is still in its infancy compared to DRAM and NAND,” said Jeff VerHeul, who oversees Micron’s development for it and non-volatile memories. “It will evolve and become more efficient.”In its core DRAM sector, “we see at least three technology nodes beyond the one we are working in now … we have more visibility than we have had in the last decade,” said Scott DeBoer, head of tech development at Micron. That said, “the cost reduction and bit-density increase per node is slowing and is not at the pace of the last 20 years.”Micron’s DRAM roadmap does not require extreme ultraviolet lithography and is already using double- and quad-patterning. Advanced circuit designs are enabling operation with less charge stored in taller capacitors than used in the past, but otherwise, the overall architecture is a conventional one, added DeBoer.Micron is already shipping DRAMs made in its sub-20-nm 1x process and expects first revenue for some made in its 1y process next quarter, said Eby. The transition to 16-Gbit chips from today’s mainstream 8-Gbit designs is near, but he would not comment on the viability of a 32G design.
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Release time：2018-10-12 00:00 reading：1071 Continue reading>>
<span style='color:red'>Micron</span> appoints Mike Bokan as Senior VP, Worldwide Sales
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Micron appoints Mike Bokan as Senior VP, Worldwide Sales

Micron Technology, Inc. (Nasdaq: MU) announced today that the company has appointed Mike Bokan as senior vice president of Worldwide Sales, effective Oct. 1, 2018. Bokan succeeds Steve Thorsen, who is retiring from Micron after 30 years with the company but will remain as an adviser through early November 2018 to ensure a smooth transition. Bokan is being promoted to senior vice president and will report directly to Micron President and CEO Sanjay Mehrotra.“On behalf of the company, I want to thank Steve for his dedication to Micron’s success over the last three decades,” Mehrotra said. “He has been instrumental to the company’s tremendous growth over the years. During his tenure as head of Worldwide Sales, the company has enjoyed record sales, culminating in fiscal year 2018 revenue of over $30 billion. We wish Steve the very best in this next chapter of his life.”“I am proud of my long career at Micron and have enjoyed building strong relationships with our customers around the world,” Thorsen said. “Mike and I have worked closely for many years, and I am confident he will be highly successful in taking on the leadership of the Worldwide Sales organization.”Bokan is currently corporate vice president of Worldwide Sales at Micron. He joined the company in 1996 and held various sales management positions before moving to Micron’s Crucial division, where he eventually became general manager. In 2003, Bokan took on the role of director of Sales for Micron Technology. In 2007 he was promoted to senior director of Sales before becoming vice president of Worldwide OEM Sales in 2008 and corporate vice president of Worldwide Sales in 2018.“Mike has been a great part of our sales leadership team,” Mehrotra said. “He has developed deep and trusted relationships with our OEM and hyperscale customers, as well as with our distribution partners. This is a natural next step for him, and we look forward to his leadership in driving our sales organization.”“I am honored to follow in Steve’s footsteps and continue to broaden our market reach as memory and storage become increasingly critical to our customers,” Bokan said. “Micron is very well-positioned to take advantage of the growing demand for our products and solutions. I look forward to helping lead the company to the next level.”Bokan earned a bachelor’s degree in business administration from Colorado State University.
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Release time：2018-09-25 00:00 reading：978 Continue reading>>

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