ROHM included in S&P Global's Sustainability Yearbook 2025 as Sustainability Yearbook Member for the second consecutive year
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ROHM included in S&P Global's Sustainability Yearbook 2025 as Sustainability Yearbook Member for the second consecutive year

　　ROHM Co., Ltd. was included for the second year in a row in the Sustainability Yearbook 2025, published by S&P Global on February 11, 2025, as a Sustainability Yearbook Member, one of the top 15% companies in the Semiconductor & Semiconductor Equipment industry.　　S&P Global annually evaluates the sustainability efforts of the world's leading companies from governance & economic, environmental, and social perspectives based on its proprietary Corporate Sustainability Assessment (CSA) methodology and selects companies with outstanding sustainability efforts in each industry for inclusion in the Sustainability Yearbook.　　This year, more than 7,690 companies worldwide from 60 industries were evaluated, and 780 companies (including 80 Japanese companies) were selected for this year's Yearbook.　　Encouraged by the results of this year's evaluation, ROHM will continue to promote sustainability activities and address social issues to create a sustainable society, aiming to be a company that meets the expectations of our stakeholders.
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Release time：2025-03-20 10:11 reading：395 Continue reading>>
Fibocom to Unveil a Series of Linux-based Edge AI Solutions Mastering the Peak Performance for Industrial Applications Powered by Qualcomm Technologies at Embedded World 2024
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Fibocom to Unveil a Series of Linux-based Edge AI Solutions Mastering the Peak Performance for Industrial Applications Powered by Qualcomm Technologies at Embedded World 2024

　　Nuremberg, Germany – April 10th, 2024 – Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, in collaboration with Qualcomm Technologies Inc., a global leading semiconductor company, is proud to announce the launch of their cutting-edge Linux-based edge AI solutions which integrates a series of Qualcomm Technologies-powered Fibocom smart modules.　　This new series of solutions utilize a wide array of Fibocom’s smart modules SC171, SC171L, SC138, and SC126 series that are developed based on the Qualcomm® QCM6490/QCS6490, Qualcomm® QCM5430/QCS5430, Qualcomm® QCM6125, and Qualcomm® QCM2290 processors from Qualcomm Technologies with integrated Linux system, will unleash the peak performance of Linux-based industrial applications with robust connectivity and scalable operating system compatibility, and also accelerate the integration of advanced 5G, edge AI across emerging industries like robotics. With the expansion of digitalized industries, Fibocom will intensify the Linux-focused embedded computing intelligence, and leverage expertise in edge AI inclusion to help industry customers realize responsive decision-making, real-time communication and ultra-reliable system interoperability in industrial automation, smart manufacturing, smart retailing through the partnership.　　At the “heart” of Industry 4.0, interoperability is crucial for operators to get insights into the equipment’s performance in the field. This groundbreaking series solutions is poised to advance the industrial applications that demand wireless connection, high-integration expertise with design-in Linux operating system for easy integration, and long-term product lifecycle optimization. By adopting Linux-supported Fibocom’s smart modules, Linux engineers around the world have the ability to develop industrial devices such as industrial PCs (IPCs), edge AI workstations, smart POS terminals, and industrial routers with higher efficiency as well as potent multimedia processing capabilities.　　Harnessing the interoperability of the Linux operating system, industry-focused customers catered to the benefits below:　　· Utilizing the stability and reliability of the Linux system, the Linux-based edge AI solutions integrated with Qualcomm Technologies-powered smart modules ease the concerns of diverse system integration to industrial control systems and enable the 24/7 data transmission and management of industrial equipment with minimum risk of malfunction and downtime.　　· The Linux-based Edge AI Solutions are highly flexible and customizable compatible with industrial standards, and can be widely deployed in industrial PCs (IPCs), industrial cameras, edge AI workstations, smart POS terminals, and robotics.　　· Inherently beneficial from the robust feature and open-source nature of the Linux operating system, the solutions allow equipment manufacturers to safeguard product development and management with long-term upgradable support through the entire lifecycle.　　Fibocom Unveils Intelligent Lawn Mower Robotic Solution with Linux-based Smart Module SC171 Integrated　　The lawn mower robotic solution is a highly integrated solution equipped with Fibocom smart module SC171 and edge AI algorithm, empowering lawn mowers with unparalleled capabilities in environmental perception, precise positioning, map construction, path planning, autonomous obstacle avoidance, and seamless wireless connectivity. The revolutionary lawnmower robotic solution enables the autonomous navigation of the lawn mower without using boundary cables, significantly transforming the lawn mower industry. The core of this robotic solution lies in the AI-based lawn recognition algorithm, equipped with outdoor cameras, to achieve accurate detection and efficient planning of the lawn boundaries. It is worth mentioning that the solution also includes responsive obstacle avoidance and automatic recharging, in addition to the mapping function and an “edge-cutting mode” to facilitate precise mowing even at the sidelines. By deploying the solution, it will enhance the operational efficiency of the lawnmowers and reduce the time-to-market of lawnmower’s massive deployment in the global marketplace.　　"We are proud to collaborate with Fibocom to help them develop these Linux-based edge AI solutions for industrial applications," said Dev Singh, Vice President of Business Development and Head of building, enterprise & industrial automation at Qualcomm Technologies, Inc. "By utilizing Fibocom's smart modules and Qualcomm Technologies’ powerful processors, Fibocom are enabling the integration of advanced edge AI technologies, empowering industries with responsive decision-making and real-time communication capabilities."　　“We have a clear vision for the edge AI-enabled future, and with the collaboration with Qualcomm Technologies, we will continue building the Linux-based edge AI-driven core solution for industrial-focused markets,” said Ralph Zhao, VP of MC BU at Fibocom. “The first landed implementation in the robotic industry has infused confidence into the utilization of both Fibocom and Qualcomm Technologies’ strength to empower an intelligent, future-promising digitalized world.­­”
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Release time：2024-04-16 11:14 reading：940 Continue reading>>
3PEAK Partners with IAR to Build a New Embedded Development Ecosystem！
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3PEAK Partners with IAR to Build a New Embedded Development Ecosystem！

　　On January 18, 2024, 3PEAK and IAR jointly announced that IAR's flagship product, IAR Embedded Workbench for Arm, fully supports 3PEAK's mainstream TPS32 mixed-signal microcontrollers, giving developers a more complete and efficient development solution.　　Based in China, 3PEAK provides analog chips alongside embedded processors and solutions and has sales and technical support networks across the USA, Europe, Japan, South Korea, and Taiwan (China). After years of deep exploration in the signal chain and power management domains, 3PEAK ventured into the embedded processor sector and achieved notable success.　　Following two years of dedicated research and development, and through careful process selection and strict quality control efforts, 3PEAK successfully launched its first mixed-signal MCU platform. The TPS32 Series is the flagship brand of 3PEAK's independently developed mixed-signal microcontrollers. Through our deep understanding of vertical applications and continuous exploration of customer needs, 3PEAK introduced the TPS325M0 Series and TPS325M5 Series to serve a broad range of industrial applications, which have rapidly earned widespread adoption and praise from leading industry customers.　　The IAR Embedded Workbench remains the optimal solution for many embedded software developers worldwide. This powerful toolkit provides comprehensive and efficient support for millions of developers. It enables developers to fully utilize code optimization features and offers a range of powerful debugging functions, including code and data breakpoints, runtime stack analysis, and call stack visualization. Additionally, the IAR Embedded Workbench features C-STAT, a static code analysis tool, and C-RUN, a dynamic code analysis tool, to help developers identify potential issues early and improve code quality. Notably, IAR also offers a TÜV SÜD-certified functional safety version that meets functional safety certification standards like ISO 26262. This version is an important tool for developers of functional safety products.　　Ms. Chen Lihua, Senior Director of the 3PEAK MCU BU, said,　　"While we are focused on providing high-quality devices, 3PEAK is also committed to creating an easy-to-use, high-quality, comprehensive, and open hardware and software development ecosystem for users. We are honored to be able to establish a partnership with renowned toolchain provider IAR. Our relationship has just started, but we expect to make steady progress. IAR's comprehensive support for 3PEAK devices and 3PEAK's full TPS32 SDK software package based on the IAR Embedded Workbench for Arm are just the first results of our work together. We believe that soon we will expand our collaboration with IAR into more areas to build a new embedded development ecosystem and create genuine value and convenience for our customers.　　Kiyo Uemura, Vice President of IAR Asia-Pacific Region, expressed,　　We are delighted to partner with 3PEAK, and we look to the future with confidence and anticipation. We have long recognized China's key position in the global market, with its vast potential and endless opportunities. As both a listed and domestically influential semiconductor company, 3PEAK possesses powerful technical capabilities and persistently pursues innovation. Our collaboration with 3PEAK highlights our mutual trust. Both companies will leverage their technical strengths in their respective fields to build a vibrant embedded ecosystem, as well as provide developers with world-class development tools and original manufacturer technical support.
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Release time：2024-03-22 14:51 reading：2010 Continue reading>>
GigaDevice partners with SEGGER on Embedded Studio for RISC-V
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GigaDevice partners with SEGGER on Embedded Studio for RISC-V

　　GigaDevice and SEGGER jointly announced today that GigaDevice's customers can now use SEGGER's leading multi-platform IDE Embedded Studio free of charge across all GigaDevice RISC-V microcontrollers (MCUs) including the latest GD32VW553.　　GigaDevice officially launched the world's first RISC-V based GD32VF103 series of 32-bit general-purpose MCU products in 2019, and very recently introduced the dual-band wireless GD32VW553 series, based on a 160MHz RISC-V core. The device is equipped with 4MB of flash and 320KB of SRAM. GD32VW553 supports the latest Wi-Fi 6 and BLE 5.2 wireless communication protocols. It also integrates rich peripheral interfaces and hardware encryption functions to create a safe and reliable wireless connection solution. High performance and low energy consumption make it ideal for smart home appliances, industrial Internet, communication gateway and other wireless connection scenarios.　　Characterized by its flexibility of use, Embedded Studio has all the tools and features a developer needs for professional embedded C and C++ development, including a complete toolchain, optimized run-time library, core simulator and hardware debugging with the J-Link debug probes. Other SEGGER tools that also fully support GD32V RISC-V MCUs include: The market-leading J-Link debug probe, Ozone debugger, real-time operating system embOS and software libraries for communications, data storage, compression, and IoT, as well as the Flasher family of in-circuit programmers.　　“GigaDevice and SEGGER have a long history of cooperation”, says Eric Jin, GigaDevice's Product Marketing Director. “SEGGER was the first ecosystem partner to support the GD32V RISC-V core MCUs. Making SEGGER Embedded Studio available to our customers free of charge facilitates software development for our GD32V series. Embedded Studio fully supports and adapts to the GD32V family of RISC-V MCUs in terms of efficiency, performance, and ease of use, significantly accelerating the development and mass production of innovative applications.”　　“We have been partners with GigaDevice and have supported GigaDevice products for many years now,“ says Ivo Geilenbruegge, Managing Director of SEGGER. “We immediately added full tool support when they unveiled the first commercially available flash-based RISC-V microcontroller back in 2019. We are impressed by their speed of innovation, the many new devices they have brought to market, and the extent to which they’ve quickly become a key player in the industry.”　　For user registration and downloads, visit wiki.segger.com/GD32V now to get Embedded Studio available free of charge for commercial development on GD32V MCUs.　　About GigaDevice　　GigaDevice Semiconductor Inc. (SSE Stock Code 603986) is a global leading fabless supplier. The company was founded in April 2005 and headquartered in Beijing, China, with branch offices in many countries and regions worldwide, providing local support at customers' fingertips. Committed to building a complete ecosystem with four major product lines – Flash memory, MCU, sensor and analog – as the core driving force, GigaDevice can provide a wide range of solutions and services in the fields of industrial, automotive, computing, consumer electronics, IoT, mobile, networking and communications. GigaDevice has received the ISO26262:2018 automotive functional safety ASIL D certification, as well as ISO9001, ISO14001, ISO45001, and Duns certifications. In a constant quest to expand our technology offering to customers, GigaDevice has also formed strategic alliances with leading foundries, assembly, and test plants to streamline supply chain management. For more details, please visit: www.gigadevice.com.　　About SEGGER　　SEGGER Microcontroller, now in its fourth decade in the embedded system industry, produces cutting-edge RTOS and Software Libraries, the marketing-leading J-Link and J-Trace debug and trace probes, a fast, robust, reliable, and easy-to-use family of Flasher In-System Programmers and second-to-none software development tools.　　SEGGER's all-in-one solution emPower OS provides an RTOS plus a complete spectrum of software libraries including communication, security, data compression and storage, user interface software and more. Using emPower OS gives developers a head start, benefiting from decades of experience in the industry.　　SEGGER's professional embedded development software and tools are simple in design, optimized for embedded systems, and support the entire embedded system development process through affordable, high-quality, flexible, and easy-to-use tools.　　The company was founded by Rolf Segger in 1992, is privately held, and is growing steadily. SEGGER also has a U.S. office in the Boston area and branch operations in Silicon Valley, Shanghai, and the UK, plus distributors on most continents, making SEGGER’s full product range available worldwide.
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Release time：2024-01-02 16:39 reading：2286 Continue reading>>
Fibocom launches 5G FWA solutions embedded with FG190 and FG180 5G modules at MWC Shanghai 2023
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Fibocom launches 5G FWA solutions embedded with FG190 and FG180 5G modules at MWC Shanghai 2023

　　During MWC Shanghai 2023, Fibocom introduces the cutting-edge 5G FWA solution embedded with 3GPP Release 17 compliant modules FG190 and FG180, with the advanced and scalable configurations, the solution ensures the smooth escalation of 5G FWA applications towards 10 Gigabits era, especially crucial for CPE and mobile hot-spot use cases.　　a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, introduces the pioneering 5G FWA solution based on the latest generation 5G modules FG190 and FG180 at MWC Shanghai 2023. The solution offers a wide range of flexible configurations and multiple enhancements to CPE and mobile hot-spot customers, significantly reducing the complexity to deploy advanced 5G solutions and accelerate the time to market.　　As 5G technology has improved, mobile broadband service providers are no longer limited to older technologies, mobile data subscriptions associated with mobile phones, dongles or even hot-spot devices are looking for agile and high data throughput network connectivity solutions. The cutting-edge 5G FWA solution specialized in CPE and mobile hot-spot use cases, embedded with Fibocom's latest generation 5G Sub-6GHz and mmWave modules FG190 and FG180. The 5G CPE solution is architected with a set of rich interfaces plus flexible dual-band/tri-band Wi-Fi 7 combinations. For example, an FG190 can simultaneously connect three PCIe and two USXGMII ports, in addition to the Wi-Fi 7 selections, CPE customers can adjust the combinations between QFW7114 and QFW7124 to utilize the band capacity from maximum BE21000 to BE5000. Regarding the wired configurations, either the10GbE+2.5GbE or 2.5GbE+2.5GbE could be the most recommendable and efficient options to unleash the full potential of cable access.　　However, the solution for 5G mobile hot spot offers a range of top-quality wireless performance to mobile scenarios. In the support of a highly integrated WCN7851 chip, the multi-channel options will be utilized efficiently to increase the data rate, depending on the requirements, the dual-band options can be switched to 2.4GHz/5GHz/6GHz to achieve maximum throughput up to BE5800. The seamless Wi-Fi 7 connectivity is also benefiting from the contribution of MLO (Multi-Link Operation) and 4K QAM modulation schemes, offering a highly reliable connectivity service, especially in congested environments like airport terminals, sports venues, and hospitals, etc.　　In software design, Fibocom's cutting-edge 5G FWA solution embedded with FG190 and FG180 is loaded with OpenWRT, which allows maximum customization for CPE and mobile hot-spot customers.　　Powered by the Snapdragon® X75 and X72 5G Modem-RF System, Fibocom FG190 and FG180 is compliant with 3GPP Release 17 and equipped with a quad-core A55 CPU to enable a lightning-fast and ultra-reliable 5G network experience. With Snapdragon®X75, Fibocom FG190 supports 5G Sub-6GHz and mmWave dual-connectivity, thus capable of NR 10CA with up to 1000MHz bandwidth in the mmWave spectrum, and NR5CA with up to 300MHz bandwidth in the Sub-6GHz, significantly elevating the maximum downlink speed to 10Gbps. Followed by the FG180, the module integrated with Snapdragon® X72, offers an agile solution for various 5G FWA customers by supporting up to 400MHz bandwidth of NR 4CA under mmwave bands, and 200MHz bandwidth of NR 3CA under Sub-6GHz. Both FG190 and FG180 are adopting LGA form factors, therefore making both modules the ideal wireless solution for a diversified FWA market.
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Release time：2023-09-12 10:52 reading：3408 Continue reading>>
BIWIN Embedded Storage for High-end Smart Watches
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BIWIN Embedded Storage for High-end Smart Watches

　　Trends in smart wearables head towards multi-functional integration, longer battery life, and smoother user experience, placing higher requirements on chips to deliver smaller size, better power consumption, improved performance, better application tuning, and more. ePOP storage chips are ideal for smart wearable devices for their small size, low power consumption, high performance, and high reliability. Now BIWIN brings the LPDDR4X 144-Ball ePOP for high-end smart watches, offering 128.6% higher frequency and 32% less chip size compared with LPDDR3.　　Having passed the Qualcomm 5100 SOC platform certification, BIWIN LPDDR4X ePOP integrates eMMC 5.1 and LPDDR4X in a compact dimension of 8 mm x 9.5 mm x 0.8 mm, delivering ROM sequential read and write speeds of up to 310 MB/s and 240 MB/s respectively. With RAM frequency up to 4266 Mpbs and capacity up to 32 GB + 16 Gb (with a 64 GB+16 Gb version coming soon), BIWIN ePOP is a flagship storage solution for high-end smart watches.　　BIWIN LPDDR4X 144-Ball ePOP Advantages:　　1. Complies with JEDEC standards, integrates eMMC 5.1 and LPDDR4X, and allows smart watches to have a more compact design (by mounting directly on the SoC chip).　　2. Low power consumption and high performance (with frequency up by 128.6%), powered by low-power LPDRAM and optimized firmware.　　3. Works faultlessly in extended temperature from -20 ℃ ~ 85 ℃, featuring Wear Leveling, LDPC (Low-Density Parity Check) codes, and FFU (Field Firmware Update).　　4. Simplifies system design and speed up your product’s time-to-market with Qualcomm 5100 SoC platform certification.　　With high performance, low power consumption and high reliability, BIWIN LPDDR4X 144-Ball ePOP significantly improves user experience for smart wearables. BIWIN ePOP provides high data storage efficiency, smooth switching on/off, APP start/shutdown, screen-off and lock. It efficiently deals with different loads of sensors and the demand for multi-threaded storage to ensure fast response to the user's operations and commands. Featuring low power consumption, BIWIN ePOP reduces heat dissipation in multi-threaded, high-load, and long-work time scenarios, preventing the overheating which can cause system collapse and bad user experience. In addition, BIWIN ePOP is highly reliable in dealing with abnormalities such as blue screen error, cold start, and reset.　　Compared with memory chips in cell phones, storage solutions for smart wearables require higher responsiveness and more customized service. BIWIN ePOP features high performance, low power consumption, small size, and high reliability, showing the advantages in BIWIN R&D, packaging and testing. BIWIN storage solutions for smart wearables already serve the supply chain system of world-class customers, capturing a dominant share of the market. BIWIN offers proven storage solutions that bring compatibility with their existing SOC platform, system, and application. Moving forward, BIWIN will continue to optimize user experience for different user scenarios, helping customers increase the competitiveness of their terminal products.
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Release time：2023-09-01 13:16 reading：3406 Continue reading>>
Quicker, More Advanced GUI as TARA Systems' Embedded Wizard Partners with GigaDevice
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Quicker, More Advanced GUI as TARA Systems' Embedded Wizard Partners with GigaDevice

　　Created by TARA Systems GmbH, Embedded Wizard is the market-leader for embedded GUI technology. The company has announced a new partnership with GigaDevice Semiconductor, a leading supplier of high-performance memory and microcontrollers.　　The partnership represents a groundbreaking update to Embedded Wizard's popular graphical user interfaces, making embedded GUI software development faster and more cost-effective for customers.　　According to Mr. Eric Jin, Product Marketing Director at GigaDevice, "This collaboration is set to bring advanced solutions to our clients, providing customers with exceptional user experiences and faster time-to-market for their products."　　Manuel Melic, Product Manager at Embedded Wizard and Managing Director of TARA Systems, says: "We are excited to work with GigaDevice and provide software engineers with a more comprehensive, quicker method for developing custom GUIs."　　The exciting combination of leading microcontroller hardware plus powerful embedded GUI software means customers can effectively reduce the system resource footprint of advanced graphic displays and simplify the human-machine interface (HMI) development process.　　Customers can be confident that the hardware will work flawlessly with all Embedded Wizard software. From idea to production, with the expertise of Embedded Wizard and GigaDevice, customers can get their GUI products to market and deploy them in less time, manage their budgets more easily.　　The advantages of the partnership are easily demonstrated in the recent integration of GigaDevice's GD32 family of microcontrollers to the range of Embedded Wizard’s platform partners. Through this collaboration, customers will be treated to faster performance, lower power consumption, a richer set of peripherals and a more user-friendly graphical interface.　　For a free trial of Embedded Wizard GUI software, download now at embedded-wizard.de/download.　　About GigaDevice　　GigaDevice Semiconductor Inc. (SSE Stock Code 603986) is a leading global fabless supplier. The company was founded in April 2005 with branch offices in many countries and regions worldwide, providing local support at customers' fingertips. Committed to building a complete ecosystem with major product lines – Flash memory, MCU, sensor, and power as the core driving force, GigaDevice can provide a wide range of solutions and services in the fields of industrial, automotive, computing, consumer electronics, IoT, mobile, networking, and communications. GigaDevice management system has achieved ISO 9001:2015 and ISO 14001:2015 certifications. Constantly looking to expand the technology offering to customers, GigaDevice has also formed multiple strategic alliances with leading foundries, assembly, and test plants to streamline supply chain management.　　About TARA Systems' Embedded Wizard　　Embedded Wizard is a market-leading solution for creating Graphical User Interfaces (GUIs) for embedded systems with more than 30 years of experience in the industry. Its mission is to provide developers with the most convenient and efficient tool for programming embedded GUIs by simplifying development efforts. Developers use this versatile tool to create complex user interfaces in the shortest possible time and stand out from their competitors due to the numerous highly sophisticated features of the tool. Additionally, Embedded Wizard's GUI Services team offers their customers a portfolio of different services. These range from Embedded Wizard trainings, via GUI prototyping and implementation of dedicated GUI controls up to holistic GUI application development. Under the patronage of the independent software company TARA Systems, Embedded Wizard is constantly improving and entering more industries and markets worldwide. Embedded Wizard is driven by the idea of providing a comfortable workflow for embedded systems in consumer electronics, industrial, automotive, medical, home appliances and mobile devices. GUIs created with Embedded Wizard are already used on over 100 million devices worldwide.
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Release time：2023-08-29 11:18 reading：3517 Continue reading>>
Baiwei launched a number of industrial grade wide temperature SSD
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Baiwei launched a number of industrial grade wide temperature SSD

　　Li Zhenhua, vice general manager of Marketing Department of Baiwei Storage, said: Based on the company's rich development experience in the field of industrial storage, Baiwei industrial wide temperature SSD products adopted optimized and upgraded hardware design, advanced flash memory management firmware algorithm, after more than 3000 test cases, combined with the company's advanced manufacturing capabilities, products have high reliability, long life, stable performance and other characteristics. It is especially suitable for system operation and data saving in harsh environments such as high and low temperatures, abnormal power failure, humidity, vibration, and shock.　　Recently, Baiwei launched a number of industrial wide temperature SSD products for extreme temperature and other working environments, including GP303, GP304, GS301, GS302, GS303, GS304 and so on. Series products adopt domestic brand 3D NAND wafers and master control, while relying on the company's storage solution development endowment of media characteristics research and screening, firmware algorithm development, hardware design, advanced manufacturing capabilities, making products with high performance, high stability, high reliability and more secure and other advantages. It is widely used in electric power, Internet of Things, 5G, intelligent manufacturing, rail transit, industrial control and other fields.　　1, fully self-developed firmware, sequential read/write speed up to 3400MB/s, 2700MB/s, overall write speed maintained at 1000MB/s　　Equipped with self-developed firmware, the GP30 SSD series has excellent performance. The SSD series uses PCIe Gen3.0x4 interface and NVMe1.4 protocol, with the maximum sequential read/write speed of 3400MB/s and 2700MB/s, respectively, and the maximum capacity of 2TB. In addition, based on multiple optimization of firmware, GP30/GS30 series SSDS have stable data reading and writing performance. In FIO test, the overall write speed of GP30 series SSDS is maintained at about 1000MB/s, while that of GS30 series SSDS is maintained at about 450MB/s.　　2, support -40℃~85℃ wide temperature work, MTBF>3 million hours　　In terms of reliability, the series of products adopt high-specification wide-temperature flash particles, and the company abandons the traditional component screening method to ensure that all components in the products meet the requirements of wide-temperature. At the same time, the series of products have been tested in high and low temperature, functional testing, hardware testing, performance testing, stability testing, reliability testing, compatibility testing and other strict testing verification, support -40℃~85℃ operating temperature, MTBF(mean time to failure) is more than 3 million hours. The products are reinforced with Corner Fill, anti-vulcanization and other technologies to ensure reliable storage of data in extreme temperature and other harsh environments.　　3. Support power failure protection, end to end data protection and other functions and features　　In terms of security, multiple firmware and hardware optimizations are implemented for power failure data protection, data inspection, end-to-end data protection, and data soft destruction, effectively ensuring the security and integrity of SSD data transmission.　　Baiwei GP30/GS30 series SSDS feature wide temperature resistance, stable read/write, and high reliability, fully meeting the strict requirements of industrial applications for data storage. Relying on the integrated layout of research and development, encapsulation and testing, Baiwei will continue to deepen the company's important advantages in technology research and development, advanced manufacturing, quality assurance and other aspects, continue to deepen industrial storage, vehicle gauge storage and other fields, to provide customers with more professional, higher quality customized storage products and services.
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Release time：2023-05-22 14:25 reading：2579 Continue reading>>
AMEYA360:A Refutation of “China’s Underground Market of Chips Draws Desperate Automakers” by Bloomberg 2
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AMEYA360:A Refutation of “China’s Underground Market of Chips Draws Desperate Automakers” by Bloomberg 2

　　In China, cars are basically standardized products when they leave the factory. In order to meet the personalized and diversified needs of car owners, there is a huge "car aftermarket", namely 4S stores, maintenance stations, and modification plants, where automobile enthusiasts can modify or add some products into their vehicles. Products in the aftermarket do not have to pass the vehicle regulations. These parts will never change the core electronic components or interfere with the car safety, as they belongs to peripheral products. I did a survey and found that most so-called car chips speculated in Huaqiangbei belong to this category! They do not belong to the ABS, ESP, and other parts asserted by Bloomberg in the article!　　Introduction to Slkor in Chinese and English　　III.Inspection of electronic components　　I, SONG Shiqiang, as a stall economist in Huaqiangbei and the General Manager of Kinghelm and Slkor, explored some rules by using the basic theories of "Kondratieff waves" and "Fiboracci Arc" in Macroeconomics. With due consideration of the effect of the cyclical constraints of the electronic component industry, functions of the electronic component reservoir in sales order configuration, I found out some rules of electronic business in Huaqiangbei. Once I had drunk too much in Huaqiangbei, I spoke the knack out in bragging.         A businesswoman heard about my elucidation on the knack and was consequently enlightened. She followed the ways and means proposed in the elucidation in her speculation and made much profit worth several Bentley cars. She even sent a Bentley model to me to express her gratitude. Businesswomen in Huaqiangbei sighed with astonishment that in addition to writing jokes and advertisement, Mr. SONG from Kinghelm also knew a lot about stall business in Huaqiangbei, "How I wish to meet him  before my speculation rather than after that". One day, I was having tea with businesswomen in Huaqiangbei to do a pre-sale roadshow for my new book “Guide to Speculation in Huaqiangbei”. I accidentally saw a boss throwing a package of glittering items into the trash can behind a small counter. I picked the package up because I enjoy learning. I found it was a package of thin objects covered with a thin layer of blue film! Later, I asked experts of the industry and knew that they were wafer scraps with demerits sold to Huaqiangbei at lower prices from wafer fabs.           Afterthese wafer scraps are sealed and tested, they become electronic components sold in counters and stalls in Huaqiangbei. If you want to trace the brand, model, or even the production date, you can find a professional testing company for help. If you need a testing authority, the No. 5th Research Institute of the Ministry of Industry and Information Technology (CEPREI) in Guangzhou is recommended. In contrast, White Horse Laboratories is a more convenient choice. Additionally, 360IC also has a lab similar to this. By chance, I found ways and means to test electronic components. For problems arising out of the electronic components, causes of problems should be analyzed. If there are disputes, all responsibilities should be clearly defined, or some information should be traced and confirmed. Then the test and inspection of electronic components will play a role.　　For example, a testing company has advanced ultrasonic testing equipment capable of doing non-destructive tests widely applied in material test, failure analysis, Research and Development (R&D), Quality Assurance and Reliability (QA/REL) tests. Items can be inspected include electronic components, LEDs, metal substrates, cracks, delamination, cavities and other irregularities. The image contrast can be used to identify the internal impedance anomalies of materials, to determine the shape and size of defects, and to determine the positions of defects. I observed wafer scraps mentioned above with a 1000x magnifying instrument lent from a friend of mine. They were found memory chip made by TSMC with models and capacity specifications clearly visible! Of course, the conventional opening, sol, electrical performance testing, sealing material testing, and sealing process analysis are all available. After this comprehensive test, similar to four ways of diagnosis --looking, listening, inquiring and feeling the pulse practiced by a doctor trained in the traditional Chinese medicine and blood test practiced by a doctor trained in the western medicine, the DNA result reveal the parents of a child clearly!　　Test results of wafer scraps found in Huaqiangbei　　What I want to state here under my name SONG Shiqiang from Kinghelm and Slkor is that in procurement of expensive chips especially those for vehicle use from Huaqingbei, the test report from the professional lab is prerequisite for the issuance of a Purchase Order from a customer for both samples and small batches. A buyer with rich procurement experience in Huaqiangbei knows the origin of a chip, the level of processing of a chip and stage of modifying for a chip through visual inspection with his naked eyes. That is why I was shocked by the simplicity involved in buying chips for vehicle use described in the article by Bloomberg easier than blowing a whistle. Too much emphasis on the importance of customer relationship in the article revealed a blurred business image in Huaqiangbei that is far away from real business practice. The prerequisite for business in Huaqiangbei is the stock available and the same stock with authenticity!
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Release time：2023-05-05 11:07 reading：1889 Continue reading>>
Ameya360:YAGEO Reported 2022 December Consolidated Sales of NT$ 9.001 Billion
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Ameya360:YAGEO Reported 2022 December Consolidated Sales of NT$ 9.001 Billion

　　YAGEO Corporation announced today its 2022 December consolidated sales of NT$ 9.001 billion, down 10.0% m-o-m but up 9.5% y-o-y, respectively. The fourth quarter sales totaled NT$ 28.809 billion, down 6.4% q-o-q but up 12.1% y-o-y, respectively. The full year consolidated sales reached NT$ 121.069 billion, up 13.6% y-o-y.　　December’s consolidated sales was lower than previous month mainly attributed to less working days due to annual inventory counting and reduced shipments from customers in Americas and Europe during holiday season.　　Moving forward to the first quarter, the company's premium business, which accounts a higher proportion of the total revenue, maintains steady order momentum, while the standard products' inventory adjustment continues. In addition, with fewer working days due to Lunar New Year holiday in late January, the macro uncertainties such as pandemic outbreak and lockdowns in China, rising inflation, and international conflicts, YAGEO will stay cautiously optimistic to its sales and operation outlook.
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Release time：2023-01-30 14:35 reading：3525 Continue reading>>

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