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SGP.32 remote provisioning firmware being added to all SIMCom <span style='color:red'>LTE</span> Cat 1 bis IoT modules

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SGP.32 remote provisioning firmware being added to all SIMCom LTE Cat 1 bis IoT modules

　　SIMCom, a leading provider ofcellular wireless modules and solutions for IoT and M2M applications, has announced that all its range of Cat 1 bis IoT modules are now being prepared with the firmware necessary to support SGP.32 functionality, facilitating simple remote provisioning of IoT modules. Developed by the GSMA, the SGP.32 standard enables connectivity with IoT devices without the need for physical SIM cards or other user interfaces.　　Comments Mads Fischer, European Sales Director. SIMCom: “ SGP.32 allows IoT devices that have no displays, buttons or SIM cards to be deployed and updated. Cat 1 bis has been rolled out globally, so by implementing SGP.32 firmware in our Cat 1 bis modules, we are enabling IoT network designers to easily and seamlessly operate their systems remotely and securely using an eSIM only.”　　SIMCom's key LTE Cat 1 bis modules that have integrated SGP.32 firmware include the A7672 series, SIM7672 series, and A7683E. These modules offer strong connectivity, global certification compliance, and enhanced power efficiency, making them ideal for various IoT applications.　　Based on the ASR1603 platform, the A7672 series supports LTE-FDD, LTE-TDD, GSM, GPRS, and EDGE communication modes. With a comprehensive certification portfolio—including RoHS, REACH, CE-RED, RCM, FCC, Anatel, and Deutsche Telekom—this series ensures compliance with global regulations, facilitating smooth deployment across international markets.　　Powered by the QCX216 chipset, the SIM7672 series supports LTE-FDD and LTE-TDD communication. It boasts a wide range of certifications, including CE-RED, RoHS, REACH, FCC, TELEC, JATE, GCF, PTCRB, IC, KC, CCC, AT&T, and T-Mobile, ensuring reliability in diverse regions. A key feature of the SIM7672 series is its support for 3GPP Rel-14 Power Saving Mode (PSM), which allows power consumption to drop as low as 3µA in PSM mode, making it an excellent choice for battery-sensitive applications. The A7683E module is designed for LTE-FDD applications and carries certifications such as RoHS, REACH, CE-RED, and Anatel. All three modules offering a 10Mbps(maximum)downlink rate and 5Mbps uplink rate.　　Available in theLCC+LGA form factor,A7672 series and SIM7672 series are compatible with SIMComNB/Cat Mand/or2G modules,enabling a smooth migration to LTE Cat 1 products,enabling end-product scalability and upgradability. Modules alsosupport both multiple built-in network protocols and the drivers for main operation systems (USB driver for Windows, Linux and Android).The inclusion of industrial standard interfaces such as UART, USB, I2C and GPIO suit the modules for IoT applications such as telematics, POS, surveillance devices, industrial routers, and remote diagnostics etc.　　SIMCom's A7672 series, SIM7672 series, and A7683E modules, powered by SGP.32 firmware, provide a cost-effective and scalable solution for large-scale IoT deployments, particularly in metering and tracking, by enabling remote SIM provisioning that eliminates the need for physical SIM insertion—thereby reducing costs and simplifying deployment in remote locations. With global certifications and ultra-low power consumption, these modules deliver reliable, energy-efficient performance and long-term deployment stability, making them the ideal choice for massive IoT applications due to their flexibility and efficiency.

Key word：

Simcom

Release time：2025-03-18 16:38 reading：266 Continue reading>>

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What are direct current and alternating current?

　　What is direct current?　　Direct current refers to a current whose magnitude and direction do not change within a certain time range. Many electrical appliances that do not contain inductive components are driven by direct current, such as radios, speakers, etc.　　What is alternating current?　　Alternating current refers to a current that continuously changes periodically in magnitude and direction. Usually alternating current changes according to the sine law or the cosine law. The current first changes from zero to the maximum, then from the maximum to zero, and then from zero in the opposite direction. It changes to the maximum, then changes from the maximum to zero, completing a cycle, and changes like this repeatedly.　　Direct current VS alternating current – what are the differences?　　Flow of Current:　　Direct Current (DC): The current flows continuously in one direction. Electrons move in a single direction, like in a battery-powered circuit.　　Alternating Current (AC): The current changes direction periodically at a certain frequency. Electrons oscillate back and forth in direction over time. Household electricity and power grids commonly use AC.　　Generation:　　Direct Current (DC): Typically generated by devices like batteries, solar panels, or DC generators.　　Alternating Current (AC): Produced in power plants using generators and transformers to create alternating currents.　　Applications:　　Direct Current (DC): Used in battery-powered devices such as phones, computers, electric vehicles, and equipment requiring stable voltage.　　Alternating Current (AC): Widely used in household electricity, industrial equipment, and power transmission systems due to its ability to easily adjust voltage using transformers, transmit power over long distances, and convert to different voltage levels conveniently.　　The role of direct currentDirect current is widely used in various situations. The following are its main uses:　　Test equipment for research units and laboratories and power supply for product aging life experiments.　　Charging batteries.　　Automotive applications.　　Manufacturing testing.　　Other low voltage, low current applications.　　The function of alternating currentAlternating current is widely used in daily life and industry. Its main functions include:　　Transmitting power over long distances: AC is more suitable for long-distance power transmission because its voltage and current are stable and there is less loss during transmission.　　Powering household appliances: Almost all household appliances such as televisions, air conditioners, refrigerators, ovens, etc. use AC as the power source.　　Driving electric motors: AC is widely used to drive various electric motors such as household washing machines, automobiles, fans, pumps, and high-speed trains.　　Lighting: Modern lighting systems, such as LED lights and fluorescent lights, also use AC as a power source.　　Provides stable power supply: The stability of AC power makes it ideal for industrial and commercial purposes, especially where precise control of power supply is required.　　Flexibility: AC power can be controlled through a transformer or frequency converter, making household appliances and other equipment work more stably.　　Applicability: In some specific scenarios, such as high altitude areas or ships, DC power cannot be used, and AC power becomes the only option.　　Conclusion　　In general, alternating current has great advantages in power supply, transmission and portability. These advantages make alternating current an indispensable form of energy in daily life and industrial production.

Key word：

direct current

Release time：2024-01-30 13:31 reading：1553 Continue reading>>

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Ameya360:Ubiik and Realtek Partner on Dedicated NB-IoT Module for 3GPP Band 103

　　Ubiik Inc. has joined forces with Realtek Semiconductor Corp. to develop Nimbus 220, an NB-IoT module based on Realtek RTL9518 chipset, and optimized for operation in Upper 700MHz A Block band. This is an important development for the utility and IoT markets in the United States, as the joint development will allow license holders of Band 103 to fully utilize this prime 1MHz paired spectrum by leveraging advanced features such as non-anchor carriers and Non-IP Data Delivery (NIDD).　　After Select Spectrum and Access Spectrum have announced that the Upper 700MHz A Block is officially designated in 3GPP Release 16 as “NB-IoT Band 103” for 4G and 5G services, Ubiik and Realtek are now partnering on the development of this NB-IoT module allowing Ubiik’s cellular base station goRAN to address current gaps in the North American market for band 103 (787-788MHz uplink and 757-758MHz downlink). With NB-IoT using as little as 180kHz of spectrum, and being able to scale up by utilizing multiple carriers simultaneously, companies who are currently utilizing this band now have the possibility to add standard-compliant NB-IoT to deliver affordable, long-range connectivity to low-power or low-throughput devices.　　“We are excited to collaborate with Realtek in bringing forth Nimbus 220 that supports Band 103,” said Tienhaw Peng, Founder and CEO of Ubiik. “This advanced module, when paired with our Ubiik goRAN base station, offers a cost-efficient 3GPP solution for implementing smart grid, AMI, and other IoT applications within the Upper 700MHz spectrum. At Ubiik, we are dedicated to supporting the 3GPP ecosystem and helping our clients fully leverage the capabilities of their IoT investments.”　　With this partnership, Ubiik aims to expand its reach in the North American market and provide customers with reliable private LTE connectivity. The module, whose embedded processing unit can support ANSI meters and other applications/protocols, will be launched together with goRAN base stations and showcased at Distributech 2023 in San Diego from February 7–9, 2023.

Key word：

Realtek,IoT

Release time：2023-02-06 15:03 reading：2949 Continue reading>>

Ameya360:Skyworks and Sequans Launch Compact <span style='color:red'>LTE</span>-M/NB-IoT SIP Solution

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Ameya360:Skyworks and Sequans Launch Compact LTE-M/NB-IoT SIP Solution

　　Skyworks Solutions Inc. and Sequans Communications S.A. have launched the SKY66431, a 5G Massive IoT SiP (system-in-package) solution that combines Sequans’ Monarch 2 modem with Skyworks’ RF front-end solution, creating the world’s smallest LTE-M/NB-IoT connectivity platform in a single package.　　Essential to critical infrastructure, low-power wide-area network (LPWAN) products meet stringent operational requirements for durability, battery lifespan and reliability. Designed to address the increasing demand for form-factor driven cellular LPWAN end points, the SKY66431 is ideally suited for utility meters, asset trackers, security and alert systems and other battery-powered devices such as wearable medical and fleet management.　　The SKY66431 is a highly integrated multi-band, multi-chip SiP supporting 5G Massive IoT platforms, offering high performance connectivity with ultra-low power consumption. Its native 23dBm front-end module leverages Skyworks’ RF design and advanced packaging expertise that optimizes reliability in demanding environments and allows for extremely small footprint designs while maintaining simplified PCB design rules. With SiP form factor-enabling miniaturization and fully encapsulated silver-free conformal shielding, the SKY66431 package is a key differentiator enabling ultra-compact, flexible and robust end-product designs.　　The solution is being certified by a number of industry and regulatory agencies, as well as multiple network operators. This SiP is available now for select customers, with general availability expected in the first quarter of 2023.

Key word：

Ameya360

Release time：2023-01-17 11:50 reading：1980 Continue reading>>

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Ameya360:Realtek Demos Full Range of Semiconductor Solutions at CES 2023

　　Realtek Semiconductor Corp. showcased its full range of PC, communications, consumer electronics, and automotive semiconductor solutions at the recent Consumer Electronics Show (CES) 2023 in Las Vegas, Nevada.　　Among the products on spotlight is Realtek’s intelligent automotive noise suppression technology with voice following (ALC5575), which uses a pre-enrolled voiceprint of a specific user (Speaker ID), retaining only the specific user’s voice, so that a far-end listener can readily hear the talker clearly. The technology integrates Realtek AI noise suppression, which makes it possible to remove noises from tires, wind shear, and rain, to name a few, in a moving vehicle.　　Additionally, Realtek’s low-power vision sensing solution (RTS5868) can extract rich ‘human-centric’ attributes through vision sensing technology and connect to any host platform via a USB interface. Equipped with the performance-optimized AI network, it provides a complete solution in advance for customer products to develop quickly.　　Next is the immersive gaming headphone, powered by the RTL8773D single-chip, low latency (20ms) solution. The device supports simultaneous 2.4GHz and Bluetooth connections with audio-mixing of gaming audio and Bluetooth music/phone call concurrently. Its high performance neural network algorithm perfectly removes all keystroke noises for the best gaming experience. With an integrated high performance ANC engine, the RTL8773D can reach up to 40dB noise cancellation improvement.　　The RTL8720E/RTL8726E/RTL8730E Ameba E series 5th-generation IoT products support the latest technologies such as Smart Voice, Wi-Fi 6, and Matter, among others, to effectively upgrade your smart home systems. Realtek also introduces VR Air Bridge, an accessory that provides an easy streaming wireless PC-VR experience (RTL8832AU/RTL8832CU), and launches the 1st VR USB Wi-Fi 6/6E dongle for simplified air link with VR head-mounted device. It allows the user to explore their wireless VR game and enjoy the freedom of full 360° movement.　　Furthermore, Realtek’s Wi-Fi 7 (RTL8952A/RTL8922A), the next major generation and evolution enhancements, will support time sensitive network applications like AR/VR, 4K and 8K video streaming, automotive, gaming and video applications. There is also Realtek Wi-Fi 6 AP router solution (RTL8198D+RTL8832CR+RTL8192XBR/RTL8198XB+RTL8832CR+RTL8192XBR) with AI QoS and AI technology to elevate online user experience and reduce Internet lag.　　For consumer electronics applications, the Realtek AI super resolution fidelity recovery IC RTD2892NND can enhance the picture quality and solves the video artifact problems due to compression or transmission bandwidth limitation.　　Realtek MACsec protects the cybersecurity and safety of vehicles. The RTL9010B/RTL9000C series is one of the first Automotive Ethernet PHYs equipped with MACsec in the market. This feature will provide enhanced cybersecurity protection for next generation Software-Oriented-Architecture vehicles.　　“Realtek’s PC, communications, consumer electronics, and automotive solutions exhibited at 2023 CES have innovative and exclusive specifications, high performance, and high reliability. They are expected to win the customer mindshare and market share, bringing more convenience and safety to the mass,” said Yee-Wei Huang, Vice President at Realtek.

Key word：

Ameya360,Realtek

Release time：2023-01-13 14:20 reading：3248 Continue reading>>

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MediaTek Adopts Qualtera’s Silicondash Platform to Enhance Semiconductor Yield and Quality

Qualtera today announced that MediaTek’s deployment of Qualtera’s Silicondash Smart Manufacturing Platform has gone live in June 2018 and is now handling the manufacturing operations. Silicondash is used as MediaTek’s primary corporate data analytics solution with data integration across the global supply chain of worldwide manufacturing and test suppliers. With a vision to further enhance manufacturing excellence, MediaTek has implemented Silicondash to further improve overall operational efficiency, yield management, quality control and IC-level traceability.The Silicondash Big Data platform uses embedded expertise, algorithms, analytical engines, machine learning techniques for data preparation, automated analytics and decision-making. Silicondash cloud-based technologies and collaborative features ensure effective collaboration with supply chain partners so that issues can be detected early and appropriate actions are taken swiftly.Qualtera EVP Marketing and Asia Business Operations, Paul Simon comments, “We have been collaborating with MediaTek since November 2017 and I am delighted to see that the Silicondash platform is now in high volume production handling analytics and IC level traceability across the manufacturing volume of MediaTek’s supply chain. The platform’s mix of real-time data collection, stream computing and big data analytics engines provides a host of high speed data visualizations, analytics and modeling capabilities giving semiconductor manufacturers and their supply chain partners the opportunity to improve operational KPIs, yields and product quality”

Key word：

MediaTek

Release time：2018-12-11 00:00 reading：1391 Continue reading>>

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Infineon Buys Cold Split Tech Startup Siltectra for $139M

Infineon Technologies AG has acquired Dresden, Germany-based startup Siltectra to use its cold split technology to split silicon-carbide (SiC) wafers, doubling the number of chips on a wafer. The company was acquired for 124 million euros (about $139 million).Siltectra was founded in 2010 and has an IP portfolio of more than 50 patents. The startup developed a technology for splitting crystalline materials with minimal loss of material compared to common sawing technologies. This technology can also be applied to SiC, for which rapidly rising demand is expected in coming years.SiC products are already used today in very efficient and compact solar inverters. In the future, SiC will play a more and more important role in electro-mobility. The cold split technology will be industrialized at the existing Siltectra site in Dresden and at the Infineon site in Villach, Austria. The transfer to volume production is expected to be completed within the next five years.“This acquisition will help us expand our excellent portfolio with the new material silicon carbide as well,” said Reinhard Ploss, Infineon CEO. “Our system understanding and our unique know-how on thin wafer technology will be ideally complemented by the cold split technology and the innovative capacity of Siltectra.” He said that the higher number of SiC wafers will make the ramp-up of SiC products much easier, especially to address further expansion of renewable energies and the increasing adaptation of SiC for use in the drivetrain of electric vehicles.Infineon said that the cold split technology will help to secure the supply of SiC products, especially in the long run. Over time, further applications for cold split technology might emerge, such as boule splitting or the use for materials other than silicon carbide.Early this year, Siltectra announced its patent covering an extension of its silicon-carbide process capability to split materials with sub-100-micron material loss, regardless of vendor-specific SiC crystal-growing processes. Driving down SiC material loss helps accelerate adoption of the substrate for power devices and other ICs. Until now, its cost has inhibited fast adoption. Cost reductions enabled by Siltectra’s technology could speed deployment of SiC for a broader range of applications, including EVs and 5G technology.

Key word：

Infineon

Release time：2018-11-14 00:00 reading：929 Continue reading>>

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5G to Alter RF Front-End Landscape

　　While the mobile industry is done with its annual Mobile World lovefest — held last month in Barcelona — tech suppliers, system OEMs, and mobile operators now face a host of 5G obstacles not yet overcome. In fact, they’re just getting started.　　The technical issues of 5G are manifold. Among them, smart antennas and RF front ends for 5G mmWave — typically expected to operate at frequencies such as 28 GHz, 39 GHz, or 60 GHz — could seriously affect the performance of yet-to-emerge 5G mmWave mobile phones.　　After returning from the Mobile World Congress, Claire Troadec, activity leader, RF Electronics at Yole Développement, told us, “Although many companies such as Qualcomm, Intel, MediaTek, and Samsung are using a mobile phone as a 5G mmWave demonstrator platform, we don’t believe handsets will be the first place where 5G mmWave will go.” Rather, 5G mmWave will be a stationary data modem sitting on a table or desk so that consumers can download or stream massive broadband applications, she suspected.　　Why so?　　Given that 5G’s mmWave frequency bands are notorious for high propagation loss, directivity, and sensitivity to blockage, it’s no small feat to design a 5G handset that works all the time without losing signals. Picture consumers might well be forced to stay — literally — on their toes, turning and pacing in search of a signal.　　Another challenge in deploying 5G mmWave radio in mobile handsets is battery life and death. During the PyeongChang 2018 Winter Olympics, Samsung is believed to have demonstrated its own 5G tablet. Although it worked fine, the word swirling around Mobile World Congress was a whopping caveat: The battery was toast after 30 minutes.　　Asked about the rumor, Yole’s Troadec said that she believes that “5G mmWave radio for cellphone has high issues related to power consumption.” She suspects that “most of the leaders are extensively looking into this area.” But she added that she has found little evidence of the remedies that these technology vendors might have conceived for the obviously problematic, system-level power consumption issue associated with 5G New Radio. Nobody was willing to discuss this further at the show, she said.　　Disruptions that 5G mmWave RF modules will bring to the nascent 5G market aren’t limited to changes in technologies. Deeply affected will be who’s who in the current supply chain of RF components and modules designed for 3G and 4G.　　Because 5G mmWave potentially allows vendors to design front-end modules in SoC by using CMOS or SOI technology, the door will open to “advanced CMOS design and manufacturing players” currently in the cellphone architecture ecosystem to move into the RF market, explained Yole. Candidates for this move include Samsung, Huawei, and Mediatek in addition to Intel and Qualcomm, added the company.　　More bands, more RF front ends (RFFEs)　　The mobile industry has come a long way as technology suppliers have wrestled with complex RFFE modules capable of handling an ever-increasing number of frequency bands. As the cellular standard progressed from 3G to 4G, the bands with which the RF front end had to cope increased from four to 30, according to Troadec.　　With 5G coming online, though, things are going to get even more complicated. Although 5G is, in theory, a single standard, it comes with three elements: 5G for IoT, 5G using sub-GHz, and 5G on mmWave. In terms of RF technologies, “this would mean bringing together devices that require extremely dissimilar performance,” observed Troadec.　　This implies that 5G will follow “different implementation stages, and different flavors of 5G are in development in parallel.” In other words, there won’t be a single, unified 5G RFFE, but rather, “5G IoT, 5G sub-6 GHz, and 5G mmWave will follow their own paths and create parallel ecosystems with their own RF SiP developments,” she said.　　Asked to assess a different RFFE path for each 5G flavor, Troadec said that she sees 5G mmWave technology bringing the most disruptive innovations. She expects heavy design changes and new materials to be required.　　The good news is that 5G mmWave could practically end the current practice of complex System-in-Package (SiP)-based front-end modules used for 2G, 3G, and 4G RF. “You can design every building block — including power amplifiers, low-noise amplifiers, filtering, switching, and passives — based on advanced CMOS or SOI technology,” explained Troadec. This will give an opportunity to many digital chip vendors who previously had little radio expertise to develop front-end modules in SoC.　　Meanwhile, as for 5G sub-6 GHz, Troadec believes that it will be built on incremental innovation. Expected is modification of current RF packaging architectures with minimal change in the bill of materials, she explained.　　Because 5G IoT will use frequencies below 1 GHz, Troadec sees “little to no innovation” necessary in semiconductor packaging for RFFE. Nonetheless, the 5G IoT spec and protocols, designed to address transfer of data generated by many IoT devices, are yet to be defined and standardized.　　Who’s who in today’s RF supply chain　　Before diving into detailed RF solutions for 5G, let’s take a closer look at the current RF component and module suppliers.　　Typically, RF front-end modules consist of such RF components as RF switches, power amplifiers (PAs)/low-noise amplifiers (LNAs), RF filters, and antenna devices (tuners and switches).　　Key players in the crowded RF supply chain include: Sony, Murata (which acquired Peregrin Semiconductor in late 2014), Skyworks, Qorvo, Infineon, Broadcom/Avago, Cavendish Kinetics, TDK EPCOS, and more.　　Each company has its own specialty RF components that often deploy varied substrates and process technologies. Their choices range from RF-SOI and BiCMOS to bulk CMOS, GaN, and RF MEMS.　　Because of the diverse process technologies used in different types of RF components, the path left for RF integration today is SiP, not SoC.　　Today, for the frequency bands in the 2G, 3G, 4G, and 5G sub-6-GHz landscape (for all of the bands below the 6-GHz regime), “the only way to fulfill the stringent requirements of the radio in a smartphone is to have a SiP approach,” confirmed Troadec.　　There is currently no single RF component supplier who has the best of everything. Troadec explained that in RF front-end integration, “one needs very dedicated technology for each building block: best PA using GaAs technology, best switches using SOI technology, best filters using SAW and BAW technology, best LNA using SiGe technology.”　　Asked who offers SiPs for front-end modules, Troadec said, “Broadcom, Murata, Qorvo, Skyworks, and TDK/Qualcomm are the only players to provide SiP today.”　　She explained that each has its own specifics such as high-band modules, mid-band modules, low-band modules, and diversity receive modules in the form of PAMiD (highly integrated, customized modules that are performance-driven but come with a strong cost penalty, thus only limited to players such as Apple, Samsung, and Huawei to a certain extent) or FEMiD (providing a good compromise in terms of performance and cost and favored by Tier 2 smartphone makers such as LG and Chinese players).　　“We do see that only few companies can play in this high-technology-mixed environment,” she concluded.　　5G sub-GHz: still SiP approach　　As the cellular industry moves to 5G, the same principle — a SiP approach — will remain for the front-end modules for 5G sub-GHz.　　There will be some changes, however, in terms of more integrations inside SiP and packaging, according to Yole. Troadec explained that these include integration of LNAs and switches on the same die based on an SOI platform and more wafer-level packaging for filters to gain in die size (today, only Broadcom has such an approach, while Qorvo is working on it, for example). Also, a wafer-level approach will apply to packaging for PAs (still wire-bonded today) to gain in die size.　　5G mmWave: from SiP to SoC　　5G mmWave front-end modules will undoubtedly alter the most intricate RF component/module supply chain. Gone are a host of complex RF components manufactured by using different process technologies. Instead, emerging on the horizon is the possibility of a mmWave front-end module in SoC based on advanced CMOS or SOI technology.　　There are many reasons why 5G mmWave makes it possible to design RF modules in SoC.　　First, 5G mmWave means moving to an area of the spectrum where bandwidth is available, explained Troadec. “Thus, we do not need many frequency bands to send the information. The architecture of the radio can be much simpler.”　　As a result, this lowers constraints on filtering technology, she explained. “We do not need high-end filtering anymore in the module.” However, she cautioned, “We will need high-end switches (isolation, linearity) in between the different radios (4G or 5G sub-6 GHz and 5G mmWave).”　　She also pointed out that in 4G, “we use carrier aggregation with 20-MHz bandwidth per frequency band and we use many bands. Thus, we need a high-end filtering technology (with a steep curve) to distinguish each signal at each frequency band. This is only available with BAW devices (MEMS technology) today.”　　Another big factor is that 5G mmWave will come with a beam-forming technology, allowing it to shape the beam to send the information to many users simultaneously. “This will lower the constraint on the power emission of the PA. This, in turn, means that CMOS technology can play a role.” She added, “At mmWave frequency, the inductance becomes smaller; thus, it becomes possible to integrate passive components with CMOS/SOI technology.”　　Troadec reiterated, however, that a limiting factor [for a 5G mmWave RF module] seems to be power consumption by the full system. “Why is that something we need to clarify? But up to now, nobody wants to tell us technically why and what needs to be done” to solve the issue.　　New players coming into RF　　Once the industry shifts to designing RF front-end modules for 5G mmWave in SoC by using CMOS or SOI technology, the current RF landscape will change from a seemingly cozy club of RF front-end module vendors such as Broadcom, Murata, Qorvo, Skyworks, and TDK/Qualcomm.　　Troadec noted that Intel and Qualcomm are already into the modem and transceiver business for cellphones. They would very much like to master radio, as well, to deliver an end-to-end solution. The goal is “a full in-house design from A to Z for the RF chain,” she said.　　Had Broadcom acquired Qualcomm…　　Of various product and technology segments that both Broadcom and Qualcomm are in, the cellphone market is one where the two giants have very complementary businesses. Troadec observed that Broadcom is highly positioned in radio and Wi-Fi, Qualcomm in application processor units, modems, transceivers, Wi-Fi/BT, NFC with NXP, and their microcontrollers.　　Now that Qualcomm is getting traction in the 5G mmWave space while Broadcom is focused on the sub-6-GHz regime, Troadec said that their merger, had it not been blocked by the U.S. president, “would have created a very high monopoly.” She suspects, “This is why we saw Intel getting scared and trying to enter in this discussion as well.”

Key word：

5G

Release time：2018-03-16 00:00 reading：1349 Continue reading>>

Intel Updates 5G, <span style='color:red'>LTE</span> Roadmaps

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Intel Updates 5G, LTE Roadmaps

　　Intel released a few bullet points from the roadmap for its cellular baseband chips. Its plans for 5G and advanced LTE chips aim to close the gap with its rival Qualcomm.　　Specifically, Intel said that its customers will ship systems in 2018 with an upgraded XMM 7650 baseband that supports CDMA and Gbits/s downlinks. An XMM 7660 will ship in products in mid-2019 supporting 3GPP Release 14 with 4x4 MIMO and data rates up to 1.6 Gbits/s.　　In 5G, Intel completed a 28-GHz call using a dedicated silicon implementation of the Verizon 5GTF spec. It plans to have XMM 8060 chips in customer systems shipping in mid-2019 that support the still-emerging 3GPP New Radio standard, the first in a series of 5G XMM 8000 products.　　The 8060 will support both non-standalone and standalone modes as well as 2/3G and LTE. Using different RF front-end chips, it will support both millimeter-wave frequencies and bands below 6 GHz.　　Intel declined to provide data rates for the 5G chips or power consumption levels for any of the basebands. Overall, Intel aims to be a top supplier for cellular networks from RF front ends to back-end host processors.　　“We strongly believe our [baseband] capability will be industry-leading,” said Chenwei Yan, general manager of Intel’s connected products group.　　The updated Intel roadmap potentially matches but doesn’t exceed what is expected from Qualcomm, said Jim McGregor, principal analyst of market watcher Tirias Research.　　“Qualcomm will probably still be first with a modem for tests and first devices, but the devil is in the details. In the past, Intel hasn’t been able to match the frequency band combinations [that] Qualcomm supported … details on support for licensed and unlicensed bands and the extent of carrier aggregation is part of the fine print that is hard to get out of everyone.”　　Apple started using Intel LTE basebands in as many as half of its iPhones last year following patent disputes with Qualcomm. It is said to be considering shifting entirely to Intel next year.　　Both Intel and Qualcomm have previously declared their intentions to have 5G basebands supporting sub-6 GHz and mmwave frequencies previously. The current announcement marks a slightly more detailed reveal of Intel’s plans.　　The 3GPP 5G radio standard, led by a Qualcomm engineer, is not expected to be finished until the end of the year.　　The race is on to get 5G chips to carriers in time for trails next year and services in 2019. However, one market watcher said in Julythat base station sales are in decline following the LTE buildout and are not expected to return to growth until 2021.　　“One of the first 5G apps is wireless last-mile service, so millimeter-wave support will be critical,” said Alex Quach, general manager of Intel’s 5G strategy group.　　“Most 3/4G nets were built for coverage from Day 1, but in 5G, we see it evolving differently with the exception of China, which is building a coverage network from Day 1. Other geographies will start with mmwave services to help relieve capacity crunches in metro areas with 5G hot zones … while in parallel, a sub-6-GHz network is built up for coverage.”　　Even the expected 3- to 4-GHz band 5G nets may come on relatively slowly as carriers try to define new high-bandwidth or lower-latency services that they can sell to recoup costs of the buildouts, said Quach. They will seek new kinds of service-level agreements and business-to-business models not previously available with LTE.　　Although Korean carriers have plans for 5G-like services at the Winter Olympics in February, they will not be based on the 3GPP radio standard, which won’t be final until the end of this year. In addition, regulators in Korea have not yet identified and auctioned off spectrum for 5G, he said.　　“There’s a very, very strong interest in accelerating the time to get to define and deploy the 5G New Radio … we see relatively few deployments of non-3GPP standards other than for trial purposes.”

Key word：

Intel,5G, LTE

Release time：2017-11-17 00:00 reading：1321 Continue reading>>

Apple Watch Packs Q’comm <span style='color:red'>LTE</span>

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Apple Watch Packs Q’comm LTE

　　Qualcomm supplied the LTE modem in the Apple Watch Series 3 as well as a handful of other wireless chips, according to a teardown from TechInsights. The latest watch appears to continue to push the boundaries of system-in-package design, packing a dozen major chips and dozens of discretes.　　The new watch uses the same size SiP as the existing device. However, the Series 3 clearly packs more components, TechInsights said.　　TechInsights found the Qualcomm MDM9635M, a Snapdragon X7 LTE modem in the 42mm sport band model A1861 with GPS + cellular it opened up. The same LTE chip appeared in the iPhone 6S/6S Plus, the Samsung Galaxy S6 Edge and other handsets. The modem was mated in a package-on-package with a Samsung K4P1G324EH DRAM in the watch.　　Initial reviews found problems using LTE on the device, Apple’s first watch with cellular connectivity. However, Apple issued an update of its WatchOS said to have eliminated the problems.　　Apple and Qualcomm are embroiled in a handful of patent infringement disputes including investigations at the U.S. International Trade Commission, particularly around baseband modems. Nevertheless, Apple continues to use the Qualcomm parts both in handsets and watches despite threats of injunctions and Apple’s decision to discontinue paying Qualcomm royalties while court cases are in progress.　　Among other wireless chips, TechInsights said the watch contains a Qualcomm PMD9645 PMIC and a WTR3925 RF transceiver. Several other chip vendors also won wireless sockets.　　TechInsights preliminary report identified an Apple/Dialog PMIC, an Avago AFEM-8069 front-end module, and a Skyworks SKY 78198 power amplifier. At least one other power amp is believed to be in the design.　　Toshiba scored a win supplying 16 GBytes of NAND flash in the watch with four die marked FPV7_32G. SK Hynix supplied a DRAM believed to be packaged with Apple’s latest application processor, a dual-core device.　　The Apple-designed application processor in the new watch is slightly larger than the one in the existing device at 7.74mm x 6.25mm, compared to 7.29mm x 6.25mm. What TechInsights believes is the new W2 custom Bluetooth chip, however, measures 2.61mm x 2.50mm, significantly smaller than the W1 in the Series 2 at 3.23mm x 4.42mm.　　TechInsights found a 32-bit STMicro ST33G1M2 MCU on the backside of the SiP near RF components. Analog Devices continued to supply two capacitive touch chips — a touch screen controller and a AD7149 sensor controller also used in the Series 2 watch.　　Broadcom supplied a wireless charging chip, the same one found in a teardown of the iPhone 8. NXP continued to provide NFC support with the same PN80V NFC module used in the iPhone 8.　　Separately, IHS Markit estimated the bill of materials on the iPhone 8 Plus with 64 GBytes memory at $288.08, higher than any previous versions of the company’s smartphones. The iPhone 8 BoM is $247.51, it said. The rising costs are due to a mix of new features, more memory and slower than normal declines in chip prices, particularly in memory, it added.

Key word：

Apple Watch,Q’comm,LTE

Release time：2017-10-10 00:00 reading：1894 Continue reading>>

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