Ameya360:Micron Pushes <span style='color:red'>DRAM</span> Node for Mobile First
  Micron Technology has been setting the pace for DRAM advancement of late. Its 1-beta DRAM technology continues the trend, but other major vendors are keeping up, even as it looks like DRAM prices will be lower in 2023.  The company said at the beginning of November that it was shipping qualification samples of its 1-beta DRAM to select smartphone customers and that it’s ready for mass production. The advanced DRAM technology node, which will be used first on Micron’s low-power double data rate 5X (LPDDR5X) mobile memory that delivers speeds of 8.5 Gb/s, follows the company’s 1-alpha DRAM that began volume shipment in 2021.  Micron’s 1-Beta LPDDR5X provides 16Gb per die capacity, 35% higher than the prior generation, and a 15% power saving compared to prior generation products. Thy Tran, Micron’s VP of DRAM process integration, said the new node is the result of new processes, materials, and equipment to advance Micron’s memory cell integration so it can shrink the memory cell array, including the application of its second-generation high-K metal gate (HKMG) technology. “We can then aggressively scale both the memory cell array in terms of size and also the rest of the circuitry in the dye to save space.”  Aside from the performance improvements that will benefit smartphone functions such as camera launch, night mode and portrait mode and shake-free, high-resolution 8K video recording and in-phone video editing, Micron’s LPDDR5 based on its 1-beta DRAM boasts additional energy efficiency by implementing JEDEC’s new enhanced dynamic voltage and frequency scaling extensions core (eDVFSC) techniques. Adding eDVFSC at a doubled frequency tier of up to 3,200 megabits per second provides improved power savings controls to enable more efficient use of power based on end-user patterns.  These features not only represent a faster smartphone camera but also demonstrate how artificial intelligence and machine learning are transforming smartphones into mobile editing studios, Tran said. “Be it photos, videos, or voice processing, memory is at the heart of everything we do.”  Jim Handy, principal analyst with Objective Analysis, said what’s notable about Micron’s 1-beta is that it demonstrates Micron is strongly oriented toward pushing the technology forward with its HKMG technology to make DRAM as fast as it needs to go. “That makes for a complicated process.” If Micron were just trying to get the bits as cheap as they could be, it wouldn’t touch HKMG, he said.  So far, DDR5 DRAM has mostly found its way into PCs, said Handy, and less so data centers. But Micron would like to see that change sooner than later so it can sell DDR5 before prices collapse, especially given the fact it’s been eight years since DDR4 was introduced. He noted that the company’s focus of late has been being more profitable rather than dominating market share.  Although LPDDR5 will be the first to benefit from the 1-beta DRAM technology, Micron will expand the product portfolio that will be manufactured on this node as 2023 progresses for all segments of the memory market including High Bandwidth Memory (HBM).  Not to be outdone, Samsung Electronics closed out 2022 by announcing the development of its 16-Gb DDR5 DRAM built using what it said is the industry’s first 12-nm-class process technology. Like Micron, Samsung is matching performance gains with power efficiency – its new DRAM consumes up to 23%  less power than its predecessor. Mass production is set to begin in 2023.
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Release time:2023-01-17 11:45 reading:1985 Continue reading>>
Server <span style='color:red'>DRAM</span> Contract Prices to Fall by Over 20% QoQ in 1Q19 Due to Difficulties in Reducing Inventory
  Contract prices of server DRAM are expected to fall by more than 20% QoQ in 1Q19, steeper than the previous forecast of 15%, reports DRAMeXchange, a division of TrendForce. The demand outlook remains weak due to high inventory levels and seasonal headwinds. Moreover, uncertainties brought by the China-U.S. trade war would also lead to conservative demand.  According to Mark Liu, senior analyst at DRAMeXchange, the main reason for steeper price fall lies in the difficulties in reducing inventory. The DRAM suppliers’ fulfillment rate has improved from 90% in 4Q18 to 120% in 1Q19, indicating an oversupply in the market. Currently, the major operators of data centers in North America are holding fairly high levels of server memory inventory that can cover the usage for at least 5 to 6 weeks, while OEMs’ current inventory can cover around 4 weeks. Based on the previous production plans of the companies, their inventory levels have apparently doubled the normal levels or even higher.  In terms of demand, after enjoying two years of strong demand growth for server systems, the server DRAM market is now seeing a tapering of its own demand growth. Demand from the upgrade to Intel’s Purley platform has started to wear off; memory component orders have also been fulfilled; a pessimistic economic outlook and uncertainties brought by China-U.S. trade war may also affect the DRAM market. As the general demand outlook becomes more conservative in the first half of this year, data centers and other server DRAM clients are anticipating falling prices in the future and are thus less keen on stocking up on memory components.  On the supply front, major DRAM suppliers plan not to expand their production capacity actively this year in the fear of worsening market outlook. They also slow down the migration to advanced processes and high-density chips (eg., 16Gb mono die), trying to offset the oversupply.  In order to reduce the inventory faster, suppliers have started to negotiate DRAM contracts as monthly deals since 4Q18, instead of quarterly ones. The quarterly lock-in deals have changed into quantity-based bargains, due to capacity expansion and increasing pressure from sales. With the emerging trend of build to order and low price, contract prices of DRAM products would continue to slide.  On the whole, DRAMeXchange believes that the demand for servers will recover since 2Q19, with increased shipments to Chinese data centers and branded server makers worldwide. If the inventory problems are properly solved, server DRAM price decline may be moderated in 3Q19 and 4Q19, bringing the annual price fall to almost 50%.
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Release time:2019-01-23 00:00 reading:1761 Continue reading>>
<span style='color:red'>DRAM</span> Prices Forecast to Crash in Q1
A Sharper Price Decline of Nearly 20% Is Expected for 1Q19 in <span style='color:red'>DRAM</span> Market
  The overall price trend in the DRAM market has been stable in December, showing no noticeable change from November, reports DRAMeXchange, a division of TrendForce. Clients in North America and Europe were taking a break during the year-end holiday season, so the quantities of DRAM products traded in December were too small to be considered in the survey of contract prices. With regard to contract prices of mainstream products, the monthly average of 8GB modules is staying roughly at US$60, while that of 4GB modules is around US$30. However, for both 8GB and 4GB ones, their monthly lows have already dropped below their respective US$60 and US$30 thresholds.  DRAM suppliers and OEMs have already begun to discuss prices for the first-quarter contracts since last December. Taking account of the high inventory, the weak demand, and the pessimistic economic outlook for the medium to long term, both sides have reached a general consensus that prices of 8GB modules for the first-quarter contracts will be around US$55 or even lower. This implies that the average contract price of 8GB modules will drop by at least 10% MoM in January, and there is a strong possibility that prices will continue to fall in February and March. For the DRAM price trend in 1Q19, DRAMeXchange expects a quarterly decline of nearly 20%, steeper than the previous forecast of 15%, with the most noticeable decline in the segment of server DRAM.  At present, the biggest problem in the DRAM market is not the growth of the industry’s bit output, but the earlier arrival of the traditional slow season in 4Q18, which has resulted in increasing inventory level earlier than expected. Among the major DRAM suppliers, Micron witnessed the biggest drop in prices in 4Q18, which lowered its inventory level timely. In comparison, South Korean-based suppliers experienced the lowest price fall and thus lower shipments, which may lead to considerable inventory level throughout 1Q19. For the short term, the supply bit growth will remain constantly higher than sales bit growth, so the inventory level will keep rising, and the prices will keep falling. This price downtrend may even last for more than four quarters from 4Q18.  With oligopoly in DRAM market, module makers will face lower profitability  Contract prices of DRAM products have turned downward since 2H18, but further price competition in the highly concentrated DRAM market would only harm the suppliers’ high profitability. Therefore, DRAM suppliers have scaled back their CAPEXs for 2019 so as to stabilize the prices and moderate the oversupply.  It should be noted that the distribution of the profit across the DRAM supply chain has been heavily skewed toward the memory suppliers in 2018. On the whole, the trend of rising prices that lasted for more than two years before 4Q18 has not produced significant gains for clients in the downstream. For memory module makers, most did very well in 2017 because the short-term price surge during the early phase of the price uptrend allowed them to translate their low-price inventories into profits. However, module makers were unable to extract profits from the price differences of memory chips at the start of 2018 because DRAM prices by then had become excessively high. Their profitability became dependent on just the additional processing work. As DRAM prices have now swung downward in 2H18, module makers carrying high inventories have been exposed to losses in each successive month. With revenues dropping, many of them are projecting that their actual profits for this year will shrink to around one tenth of last year’s (some are also expecting an annual loss). Going forward, 2019 will be even more challenging for module makers and the rest of the supply chain.
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Release time:2019-01-16 00:00 reading:1195 Continue reading>>
<span style='color:red'>DRAM</span> Market to See Lower Capital Expenditure and Moderated Bit Output in 2019 Due to Weak Demand
After contract prices of DRAM products turned downward sharply in 4Q18 by 10% QoQ, major DRAM manufacturers have tried to offset fall in prices by slowing down capacity expansion in 2019, as the demand outlook for PCs, servers, smartphones, and other end consumer products remains weak, reports DRAMeXchange, a division of TrendForce.DRAMeXchange points out that, manufacturers’ capex plans are normally the most relevant indicators for their actual bit output. In 2019, the total capital expenditure for DRAM production is forecast at about $18 billion, an annual decrease of 10%. This CAPEX is at the most conservative investment level in recent years.Samsung and SK Hynix have been the first two suppliers who announced the plans to cut their 2019 semiconductor capex. Samsung, the market leader, would spend $8 billion on capex in 2019, mainly for migration to advanced process (1Ynm) and development of new products. Samsung’s 2019 plan for wafer starts would be the most conservative in recent years. The company has also decided to terminate the production capacity expansion in its Pyeongtaek fab, which will lower Samsung’s annual output growth to around 20%, a new low over the years.SK Hynix says its 2019 capex will be reduced to $5.5 billion, mainly for migration to advanced process and yield improvement. However, its new fab in Wuxi has just been completed, with potential capacity expansion of 30-40K pieces for the whole year of 2019. According to DRAMeXchange, SK Hynix’s output growth would be 21% YoY in 2019, slightly higher than that of Samsung.As for Micron, who has recently announced to cut its capex to $3 billion, revised its 2019 output growth forecast downward to 15%, from almost 20% previously, in order to prevent its inventory level from increasing further. Micron would not expand its production capacity in its subsidiary Micron Memory Taiwan (formerly Rexchip), Micron Technology Taiwan (formerly Inotera), or its Hiroshima fab of former Elpida Memory, so Micron’s monthly wafer starts would remain 350K in 2019. And the output growth would only come from its migration to 1Ynm production this year. DRAMeXchange believes that Micron is more vulnerable to the drop in prices due to its weaker cost structure than Samsung and SK Hynix. Thus, Micron has to make more production and capex adjustments to cope with the price falls. As the result, Micron's market share would continue to decrease after two years with only 15% growth in bit output.Manufacturers try to avoid price competition and maintain profitability by slowing down capacity expansionIn the oligopolistic market with no new competitors, manufacturers have tried to adjust their production plans and cut down capex to avoid price competition. In terms of profitability, the gross margins of Samsung’s and SK Hynix’s DRAM production remain nearly 80%, while that of Micron remains over 60%. With such high margins, it is reasonable for the manufacturers to be conservative in their production outlook for 2019.On the demand front, the first quarter of 2019 will witness the weakest demand of the year due to holidays and seasonal headwinds. Moreover, there is currently no sign of demand recovery in the second quarter or afterwards. The market is still full of uncertainties due to the looming trade war between China and the U.S. Therefore, for the DRAM price trends this year, DRAMeXchange expects a quarterly decline of 15% in 1Q19, and less than 10% in 2Q19. For 2H19, the prices would continue to fall by 5% each quarter unless the demand is significantly improved.
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Release time:2019-01-03 00:00 reading:1204 Continue reading>>
<span style='color:red'>DRAM</span> Outlook Dims for 2019
DRAM will once again finish the year with the highest growth rate of any semiconductor product, though 2019 is shaping up to be a very different story, according to market research firm IC Insights.DRAM is expected to finish 2018 with 39% growth, following up its 77% growth in 2017, IC Insights said. DRAM has once again benefited from a steady surge of rising average selling prices over the past two years amid a shortage in the market.But the historically cyclical DRAM market appears to be headed for tougher times in 2019. After two strong years of growth, the world's leading DRAM suppliers — South Korea's Samsung Electronics and SK Hynix and U.S.-based Micron Technology — have significantly expanded their manufacturing capacity and are beginning to ramp up production, bringing relief to strained supplies, especially for high-performance DRAM parts, IC Insights said. Meanwhile, shipments of large-scale datacenter servers — the primary catalyst for much of the recent DRAM market surge — have begun to ease amid uncertain economic and trade conditions, the firm said.IC Insights predicts that that DRAM will rank near the bottom of all semiconductor categories in terms of growth rate in 2019, with sales forecast to decline by 1%.DRAM has consistently been at the top or near the bottom of all semiconductor products in terms of growth rate over the past six years, a testament to its highly cyclical nature, according to IC Insights. DRAM was also the fastest growing semiconductor product in both 2013 and 2014, according to the firm.
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Release time:2018-12-19 00:00 reading:1267 Continue reading>>
<span style='color:red'>DRAM</span> Growth Tops Industry Ranking in 2018; Outlook Dims for 2019
DRAM fastest growing market in four of past six years, demonstrating very cyclical market.IC Insights is in the process of revising its forecast and analysis of the IC industry and will present its new findings in The McClean Report 2019, which will be published in January 2019.  Among the revisions is a complete update of forecast growth rates of the 33 main product categories classified by the World Semiconductor Trade Statistics organization (WSTS) through the year 2023.Topping the chart of fastest-growing products for 2018 is DRAM, which comes as no surprise given the strong rise of average selling prices in this segment over the past two years (Figure 1).  The 2018 DRAM market is expected to show an increase of 39%, a solid follow-up to the 77% growth in 2017. The number-one position is not unfamiliar territory for the DRAM market.  It was also the fastest-growing IC segment in 2013 and 2014.Figure 1Remarkably, DRAM has been at the top and near the bottom of this list over the past six years, demonstrating its very volatile and cyclical nature.  IC Insights forecasts that DRAM will rank nearly last in terms of market growth in 2019, with a 1% decrease in total sales.  After two strong years of growth, Samsung, SK Hynix, and Micron—the world’s three primary DRAM suppliers—have expanded their manufacturing capacity and are beginning to ramp up production, bringing some much needed relief to strained supplies, especially for high-performance DRAM devices. At the same time, shipments of large-scale datacenter servers, which were a primary catalyst for much of the recent DRAM market surge, have begun to ease as uncertain economic and trade conditions factor into decisions about continuing with the strong build out.NAND flash joins DRAM as another memory segment that has enjoyed very strong growth over the past two years (Figure 2).  Solid-state computing, particularly, has been a key driver for high-density, high-performance NAND flash even as mobile applications continue to be a significant driver. Meanwhile, automotive and computing special purpose logic devices have also been strong performers the past two years.  The top five IC markets listed for 2018 are the only product categories that are expected to surpasses the 17% growth rate of the total IC market this year.Figure 2The full list of IC product rankings and forecasts for the 2019-2023 timeperiod is included in The McClean Report 2019, which will be released in January 2019.
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Release time:2018-12-14 00:00 reading:1314 Continue reading>>
Global <span style='color:red'>DRAM</span> Revenue to Reach a New Record in 3Q18
The total revenue of the global DRAM industry grew by 9% QoQ, and again hit a new record high in 3Q18, reports DRAMeXchange, a division of TrendForce. The survey of the price trends in the third quarter shows that contract prices in the mainstream application segments (i.e. PC, server, and mobile) maintained QoQ increases of 0-2%. Particularly, the contract price of mainstream DDR3 consumer DRAM was the first to drop during the quarter because of the weakening demand. Also, contract prices of graphics DRAM products fell by around 3% QoQ due to the sharp drop in the demand related to cryptocurrency mining as well as the higher base of the previous quarter.The revenue growth of the quarter was attributed to the increased bit shipments rather than rising prices, which had been the main cause of the strong climb in the industry’s revenue during the past period of more than two years. In fact, prices practically flattened out in 3Q18 as the market supply has been steadily expanding in the second half of the year. As for the last quarter of 2018, contract prices started to slide in October and will keep falling through 4Q18, thus ending the upswing that had lasted for more than two years. Moreover, the future price declines will be rather steep because the market has entered oversupply and is experiencing high inventories as well. Against this backdrop, DRAMeXchange anticipates that the slump in contract prices will worsen in 1Q19, since excess inventories are still being carried by memory suppliers, downstream OEMs, and the channel market during that period.With prices reaching the inflection point and starting to turn downward, divergence has appeared between the large and small memory suppliers with respect to their performances. Suppliers that are smaller in scale are generally the first ones to feel the impact of the price decline and take bigger hits in their revenues. Regarding the results of the top three DRAM suppliers for 3Q18, Samsung as the market leader again posted a new record high. Although there was no significant change in the ASP of its products, Samsung raised its bit shipments by deploying its newly added production capacity. Samsung’s 3Q18 revenue rose by 13.6% QoQ to US$12.73 billion, showing the most impressive results among the top three. With its ASP having risen by just 1% QoQ, SK Hynix grew its revenue by 6.0% QoQ to US$8.15 billion in 3Q18. Together, the two leading Korean suppliers accounted for 74.6% of the global DRAM market in revenue terms. Samsung’s market share was 45.5%, while SK Hynix’s was 29.1%. Micron, which remained third place in the revenue ranking, also increased its bit shipments. The growth of its ASP was relatively flat, however. Micron’s 3Q18 revenue advanced by 6.8% QoQ to US$5.92 billion. Its global market share was 21.1%, showing no noticeable change from the previous quarter.The top DRAM suppliers also took their operating margins to new record highs in 3Q18. Although the increases in their ASPs moderated during the period, they were able to raise their operating margins from the previous quarter by optimizing their cost structures via the use of the more advanced manufacturing technologies. Samsung’s increase was the smallest among the top three because of the low yield rate of its 1Y-nm process that was just deployed in the same quarter. Still, Samsung achieved a new record by a nudge of one percentage point from 69% in 2Q18 to 70% in 3Q18. This result also means that Samsung’s gross margin already surpassed the 80% threshold.SK Hynix raised its operating margin from 63% in 2Q18 to 66% in 3Q18, as it has effectively boosted the yield rate of its 1X-nm process. SK Hynix’s increase was also the largest among the top three. As for Micron, its operating margin came to 62% in 3Q18, up from 60% in 2Q18. The improvement in Micron’s profitability was attributed to the increase in the output share of its 1X-nm process. Looking ahead to 4Q18, the top suppliers are not expected to make new records since their cost reduction efforts will unlikely be enough to offset the effect of plummeting prices.On the technology front, Samsung’s plan for 2018 is to maintain a higher percentage for the 1X-nm production within its total DRAM output. On the other hand, a part of the expanded production capacity at Samsung’s Line 17 and Line 18 (the second floor of the Pyeongtaek plant) will be allocated to the 1Y-nm production. Samsung aims to have the share of 1X- and 1Y-nm production in its total DRAM output reach 70% by the end of 2018, and then the supplier will raise the output share of its 1Y-nm production in 2019.SK Hynix began using its 1X-nm process for mass production at the end of 2017 and focused on raising the yield rate of the technology during 1H18. Significant progress occurred in 3Q18. SK Hynix will finish the construction of its second 12-inch wafer fab in Wuxi at the end of 2018 as scheduled. The new fab will begin contributing to the supplier’s DRAM output in 1H19, but it is not expected to quickly ramp up to full capacity because of the economic uncertainties resulting from the US-China trade dispute.Micron’s subsidiary Micron Memory Taiwan (formerly Rexchip) has all of its production capacity on the 1X-nm process. For its next step, Micron Memory Taiwan will bypass the 1Y-nm production and move directly to the 1Z-nm production. However, the 1Z-nm process is not expected to ready for deployment until 2020. Micron’s other subsidiary Micron Technology Taiwan (formerly Inotera) started the migration from the 20nm to the 1X-nm process in 2Q18 and will also begin developing its 1Y-nm technology toward the end of 2018. DRAMeXchange expects Micron Technology Taiwan to gradually raise the output share of its 1Y-nm production in 2019.Regarding Taiwan-based suppliers, Nanya posted a drop of 3.7% QoQ in its DRAM revenue for 3Q18. However, Nanya’s operating margin in the same period increased considerably to 51.0%, up from 46.8% in the previous quarter. This was due to cost improvement associated with the deployment of its 20nm technology. The pressure on Nanya’s profitability is mounting, however, as the supplier faces falling prices and will be paying off the depreciation cost related to its capacity expansion.Powerchip’s DRAM revenue for 3Q18 fell by 13.3% QoQ because the company allocated more its production capacity to make SLC NAND Flash and to provide foundry services for other IC products excluding DRAM. Powerchip currently finds the latter two businesses more profitable than selling DRAM. Winbond’s DRAM revenue for 3Q18 did not change noticeably from the previous quarter. Its bit shipments and ASP also remained stable.
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Release time:2018-11-16 00:00 reading:1017 Continue reading>>
Contract Prices Have Started to Drop in PC <span style='color:red'>DRAM</span> Market
Contract prices of PC DRAM products have started to turn downward sharply this October as major suppliers have completed most contract negotiations, reports DRAMeXchange, a division of TrendForce. The average price of 4GB PC DRAM modules for 4Q18 contracts has dropped by 10.14% QoQ from US$34.5 in 3Q18 to the current US$31. As for the average contract price of 8GB PC DRAM modules, it has dropped by 10.29% QoQ from US$68 in 3Q18 to the current US$61. Since the DRAM market has just entered oversupply, DRAMeXchange does not discount the possibility of further price declines in November and December. Also, the price decline of 8GB solutions will continue to surpass that of 4GB solutions because DRAM suppliers are now eager to sell off their inventory.“As the indicator of the price trend in the contract market, spot prices have kept falling since the early 2018 and continued their downtrend from September”, says Avril Wu, senior research director of DRAMeXchange. The latest update reports that the average spot price of 1G*8 chips has dropped to US$6.946, showing a difference of 5% with the average contract price of US$7.31. While the oversupply situation and the falling spot prices pull contract prices of PC DRAM modules downward, the market penetration of 8GB modules is starting to increase very rapidly because suppliers have aggressively expanded shipments of the higher-density products. DRAMeXchange furthermore believes that 8GB modules will surpass 4GB counterparts in shipment volume much sooner than originally anticipated and become the market mainstream. It should also be noted that DRAMeXchange will be using prices of 8GB modules as the base for determining the contract price trend in the PC DRAM market starting in 2019.Seasonal headwinds expected to aggravate price decline in the PC DRAM market during 1Q19PC-OEMs have not been able to step up their product shipments in 2H18 due to the shortage of Intel CPUs. Going forward, the pressure of rising component costs will only mount as the shipment season transitions from the peak period to the slow period. Since DRAM prices had risen for nine consecutive quarters, they are expected to take a plunge as they move past the inflection point. The sliding ASP in the PC DRAM market will also add to the downward pressure on prices of PC DRAM modules, leading to large and sudden drops.Looking ahead to 1Q19, seasonal headwinds will affect shipments of end products not only in the PC market but also in the server and smartphone markets. Furthermore, the quarter will be the period for the channel market and OEMs to eliminate excess inventory. Thus, negotiating contracts will be very challenging for the DRAM suppliers. The ASP in the whole DRAM market is forecast to fall by as much as around 20% YoY in 2019, according to DRAMeXchange’s latest analysis. After reaching peak profit in 3Q18, DRAM suppliers are now optimizing their costs so that they will have a soft landing in 2019 as prices are marked down every quarter.
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Release time:2018-11-06 00:00 reading:1094 Continue reading>>
U.S. Bans Exports to Chinese <span style='color:red'>DRAM</span> Maker
The U.S. Commerce Dept. issued an order on Monday banning U.S. companies from selling equipment, software, and materials to Chinese chipmaker Fujian Jinhua Integrated Circuit Co., saying that the company poses a risk to U.S. national security.The Commerce Dept. said that Fujian Jinhua IC is nearing completion of its DRAM fab in the southern Chinese city of Fujian and that its technology likely originated in the U.S. The Commerce Dept. offered no evidence to support the claim, but the U.S. and semiconductor firms have long accused China of practices including intellectual property theft and forced technology transfers.Fujian Jinhua “poses a significant risk of becoming involved in activities that are contrary to the national security interests of the United States,” said the Commerce Dept. in a statement. “The additional production, in light of the likely U.S.-origin technology, threatens the long-term economic viability of U.S. suppliers of these essential components of U.S. military systems.”“When a foreign company engages in activity contrary to our national security interests, we will take strong action to protect our national security,” said U.S. Commerce Secretary Wilbur Ross in the statement.The Commerce Dept. added Fujian Jinhua to a list of firms and entities subject to U.S. Export Administration Regulations (EAR), which impose additional license requirements on and limits the availability of most license exceptions for exports, re-exports, and in-country transfers to the firm. The move means that U.S. firms need a license for all exports, re-exports, and transfers of commodities and software to Jinhua. Such license applications will be reviewed with a presumption of denial, said the Commerce Dept.“Placing Jinhua on the entity list will limit its ability to threaten the supply chain for essential components in our military systems,” said Ross.The move is almost certain to further inflame tensions between the U.S. and China, which are already strained amidst an escalating trade war and claims by the U.S. that China’s industrial practices put U.S. firms at a disadvantage and threaten U.S. national security.
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Release time:2018-10-31 00:00 reading:1002 Continue reading>>

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