Renesas’ R-Car Open Access Platform Accelerates Software-Defined Vehicle Development With Market-Ready Software

Release time:2024-06-20
author:AMEYA360
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  Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today launched R-Car Open Access (RoX), a development platform for software-defined vehicles (SDVs) that integrates all essential hardware, operating systems (OS), software and tools needed for automotive developers to rapidly develop next-generation vehicles with secure and continuous software updates. Designed for the Renesas R-Car family of system on chips (SoCs) and microcontrollers (MCUs), the SDV platform includes comprehensive tools for the seamless deployment of AI applications. By pre-integrating all fundamental layers required to develop SDVs, RoX drastically reduces the complexities for car OEMs and Tier 1 suppliers, saving time and money.

Renesas’ R-Car Open Access Platform Accelerates Software-Defined Vehicle Development With Market-Ready Software

  The advent of SDVs represents a major step forward in automotive technology – accelerating toward more driving autonomy, electrification and connected experiences. Cars have to be aware of the 360-degree surrounding space with ASIL D levels of sensing, processing and control to deliver safety and autonomy applications. The in-cabin experiences for drivers and passengers are being revolutionized. As a result, modern electrical/electronics (E/E) architecture depends on software to control vehicle functions, manage real-time data networks across different ECU zones, and provide customer differentiation. It has become more difficult to maintain and upgrade these complex software stacks while ensuring the highest levels of safety. Renesas’ customizable solution solves these challenges by offering a cloud-native development environment and a simulation platform, supporting the software-first approach and parallel hardware and software development.

  Out-of-box Platform with Market-Ready Software Stacks

  The flexible RoX SDV platform is available in two versions. “RoX Whitebox” is an open, easily accessible software package that includes royalty-free OS and hypervisor software such as Android Automotive OS, FreeRTOS, Linux, Xen and Zephyr RTOS, as well as reference applications designed for specific domain systems. “RoX Licensed” is based on industry-proven commercial software solutions, such as QNX and Red Hat In-Vehicle Operating System, as well as AUTOSAR-compliant software and SAFERTOS®. It is pre-integrated and tested to run on Renesas’ R-Car SoCs and MCUs and includes pre-validated software stacks from STRADVISION for Advanced Driver Assistance Systems (ADAS) and Candera CGI Studio for in-vehicle infotainment (IVI), to name a few. These software solutions can be easily productized and customized or expanded depending on OEMs’ needs.

  With the RoX SDV platform, automotive system engineers can start building their software immediately using a highly integrated toolchain even before the hardware is available. This is made possible through the cloud environment and the virtual development platform, which let developers design, debug in simulation, and verify their software before deploying on live SoCs and MCUs. The virtual development platform includes the Renesas Fast Simulator (RFS) as well as partner solutions such as ASTC VLAB VDM and Synopsys Virtualizer Development Kit (VDK) to provide broad coverage of simulation speed, features and use cases.

  For seamless end-to-end AI development, RoX offers the AI Workbench to enable developers to validate and optimize their models and test their AI applications all in the cloud, either on the virtual development platform or on Renesas board farms. A wide range of AI models, automated pipelines, as well as a specific hybrid compiler toolchain (HyCo) are available to support the rapid AI deployment on the R-Car heterogeneous compute platform across generations of SoCs.

  AWS Cloud Services Now Available

  The RoX SDV platform now supports Amazon Web Services (AWS) cloud computing services as part of the AI Workbench development environment. With the Renesas R-Car SDK (Software Development Kit) containerized in the AWS cloud environment, developers can innovate and optimize their designs more efficiently. This tight integration allows them to simulate and test hardware and software combinations instantly and deploy AI applications that seamlessly run on R-Car devices.

  Scalable R-Car Gen 5 Family

  The RoX SDV platform is designed for current generation R-Car SoCs, the upcoming R-Car Gen 5 MCU/SoC Family, and future devices. The SDV platform provides car OEMs and Tier1 suppliers the flexibility to design a broad range of scalable compute solutions for ADAS, IVI, gateway and cross-domain fusion systems as well as body control, domain and zone control systems.

  Renesas’ R-Car Gen 5 is currently the only hardware architecture in the industry that can accommodate the full range of processing requirements – from zonal ECUs to high-end central compute, serving from entry-level vehicles to luxury-class models. Thanks to a new unified hardware architecture based on Arm® CPU cores, customers developing with the R-Car Gen 5 devices will be able to reuse the same software and tools across diverse E/E applications that span car models and generations, preserving their engineering investments. Renesas’ high-performance SoC products will offer both domain-specific and cross-domain solutions using application processing, large display capabilities, sensor connectivity, GPU and AI processing.

  “RoX is a significant advancement that will speed up the shift-left approach for software-defined vehicles,” said Vivek Bhan, Senior Vice President and General Manager of High Performance Computing at Renesas. “Today, car OEMs and Tier1 suppliers are heavily investing in software development and maintenance. Renesas understands this challenge and is closely working with them to deliver a flexible, ready-to-deploy development solution that can be maintained throughout the vehicle’s lifespan. The RoX platform empowers our customers to design vehicles that deliver new value and bring improved safety and delightful comfort experiences to drivers and passengers.”

  “At AWS, we’re committed to helping our customers and partners accelerate development and bring innovation to drivers faster than ever before,” said Andrea Ketzer, Director of Technology Strategy, Automotive & Manufacturing at AWS. “With Renesas’ R-Car Gen 5 devices supported by the AI Workbench on AWS, customers will achieve faster and more validated simulations and the ability to develop independently of hardware. This step change in development will drive the industry forward and place software innovation at the forefront of mobility.”

  According to TechInsights, the market shift to domain, zonal and centralized architectures will translate to a growing processor market, incorporating SoCs and MCUs, worth $25.9 billion by 2031. “Being able to maintain and upgrade complex software stacks that incorporate operating systems, hypervisors and other functional software stacks will thus become an increasingly critical element of the supply chain,” said Asif Anwar, Executive Director of Automotive End Market Research at TechInsights. “By also being able to offer cloud-native environments to support a software-first approach to development and testing of the hardware, the Renesas RoX SDV platform offers a ready-built ecosystem that encompasses these elements in support of a scalable portfolio of next generation R-Car Gen 5 processors to address this sizable market.”

  Renesas’ R-Car Open Access Platform is being demonstrated at the AWS Summit Japan in Tokyo from June 20-21.

  RoX SDV Platform Partners:

  Operating System/Hypervisor Partners

  QNX

  Red Hat

  Vector AUTOSAR

  WITTENSTEIN SAFERTOS®

  Software Stack Partners

  Candera CGI Studio

  EPAM AosEdge

  Excelfore eSync

  MM Solutions

  STRADVISION SVNet

  Nullmax

  Development Tools Partners

  ASTC VLAB Works

  Synopsys Virtualizer Development Kit (VDK)

  Cloud Partners

  AWS

  Microsoft Azure

  Availability

  The R-Car Open Access Platform is available today with the option to license. Open-source OS, commercial OS, full application software stacks, virtual development, cloud infrastructure and debugging and emulation tools are available by Renesas or through partners. Additional information about the development platform is available here and information about the R-Car Gen 5 Family can be found here. Please contact your local sales teams for more details.

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Renesas Partners with Indian Government to Drive Innovation Through Startups and Industry-Academia Collaboration, Strengthening India’s Semiconductor Ecosystem
  Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced its partnership with the Ministry of Electronics & Information Technology (MeitY), Government of India, to support local startups and academic institutions in the field of VLSI and embedded semiconductor systems. Renesas also celebrated the expansion of its offices in Bengaluru and Noida to accommodateits growing R&D teams, with the inauguration ceremonies held today. This strategic move underscores Renesas’ commitment to innovation and excellence in India and aims to drive continued growth in the region.  Renesas and the Centre for Development of Advanced Computing (C-DAC), an autonomous scientific society of MeitY, today signed and exchanged two Memoranda of Understanding (MOUs) under the MeitY Chips to Startup (C2S) programme (Note). These MOUs focus on 1) Supporting local startups by enabling them to drive technological advancement andpromote local manufacturing in alignment with the Make in India initiative; and 2) Enhancing industry-academia collaboration by fostering an innovative, product-focused mindset among students.  Shri Ashwini Vaishnaw, Minister for Railways, Information & Broadcasting, and Electronics & Information Technology, Government of India; along with Malini Narayanamoorthi, India Country Manager and VP, MID Engineering, Analog & Connectivity Group at Renesas; and Rea Callendar, Head of Platform Adoption and Ecosystem Enablement at Altium, which joined forces with Renesas in August 2024, attended the celebration at the Noida office. Hidetoshi Shibata, CEO of Renesas, also joined virtually, underscoring the global significance of this milestone.  India is a key market for Renesas, offering significant growth potential and access to a highly skilled talent pool. Renesas is committed to deepening its partnerships with local companies, startups, and universities, with the target to generate over 10 percent of itsglobal revenue from the Indian market by 2030. Recent collaborations include the OSAT factory project with CG Power and Stars Microelectronics in Gujarat and the MOU with IIT Hyderabad. Renesas is also expanding its operations in India, with plans to increase its headcount to 1,000 by the end of 2025. This growth initiative reinforces Renesas' long-term commitment to India and supports its ambition to become an employer of choice in this dynamic and fast-evolving market.  "The inauguration of our expanded offices marks a significant milestone for Renesas in India. It reflects our unwavering commitment to innovation, excellence, and the nurturing of local talent. By building products in India, for India and the world, we continue to drive growth and deliver meaningful impact across the Indian market,” said Malini Narayanamoorthi, India Country Manager and VP, MID Engineering, Analog & Connectivity Group at Renesas. "We are proud to sign two MOUs under the MeitY C2S programme, focused on advancing research, fostering innovation, and nurturing product-focused engineers. These strategic collaborations align with the Make in India initiative, aiming to strengthen local design and manufacturing capabilities and empower homegrown talent to drive the future of industry."  MOUs under MeitY C2S programme  Renesas and C-DAC signed two MOUs to collaborate in the field of VLSI and embedded semiconductor systems, with the aim of supporting local startups and academic institutions to accelerate innovation and foster self-reliance in India’s semiconductor and product ecosystem. The C2S programme encompasses collaboration with over 250 academic institutions and R&D organizations across the country, including IITs, NITs, IIITs, government and private colleges, along with approximately 15 startups, creating a strong ecosystem for indigenous innovation.  MOU for Startups: Renesas will help strengthen the product engineering capabilities of local startups by providing Renesas development boards and Altium Designer, the leading PCB design software.  MOU for Academic Institutions: Renesas will support experiential learning by offering development boards, PCB education and training, Altium Designer software, and access to the Altium 365 cloud platform, aiming to empower the next generation of electronics engineers and nurture a community of innovators.  Opening of new offices in Bengaluru and Noida  In May, Renesas consolidated and relocated its existing offices in Bengaluru and Noida into new, state-of-the-art office spaces, marking a significant milestone in the company’s growth and expansion in India.  The new Bengaluru office is Renesas’ largest site in India, encompassing world-class design teams, test labs, and comprehensive facilities to support employees. It brings together approximately 500 team members, including R&D engineers, business teams, and employees from the recently acquired Altium and Part Analytics, creating a unified and collaborative workspace. The facility is designed to leverage India’s rich talent ecosystem to drive the development of innovative products.  The new Noida office brings the engineering and business teams together to accelerate the delivery of world-class high-performance compute solutions, driving automotive market growth through innovation, collaboration, and consistent execution. This strategic expansion reinforces Renesas’ commitment to investing in top-tier local talent and strengthening its capabilities in R-Car system-on-chip (SoC) solutions. Designed to integrate cutting-edge tools and workflows, the new Noida site will further enhance synergy across the global engineering team and support Renesas’ long-term strategy in this critical domain.  (Note) Chips to Startup (C2S) programme: An initiative launched by the Indian government in December 2021 to boost semiconductor and display manufacturing in the country. C2S not only aims at developing specialized manpower in VLSI/Embedded System Design domain but also addresses each entity of the electronics value chain via specialized manpower training, creation of reusable IP repository, design of application-oriented Systems/ASICs/FPGAs, and deployment by academia/ R&D organization by way of leveraging the expertise available at Startups/MSMEs. For more details, please visit the C2S programme website.  About Renesas Electronics Corporation  Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at renesas.com. Follow us on LinkedIn, Facebook, X, YouTube and Instagram  (Remarks). All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.
2025-05-14 14:21 reading:261
Renesas Unveils Complete Lithium-Ion Battery Management Platform with Pre-Validated Firmware
  Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced all-in-one solutions for managing lithium-ion battery packs in a wide range of battery-powered consumer products, such as e-bikes, vacuum cleaners, robotics and drones. With pre-validated firmware provided, the R-BMS F (Ready Battery Management System with Fixed Firmware) will significantly reduce the learning curve for developers, enabling rapid designs of safe, power-efficient battery management systems.  Designed for lithium-ion batteries in both 2-4 and 3-10 cell series (S), R-BMS F solutions include Renesas’ industry-leading fuel gauge ICs (FGICs), an integrated microcontroller (MCU) and an analog battery front end, pre-programmed firmware, software, development tools and full documentation – all available in complete evaluation kits that are now ready to ship.  Pre-programmed Firmware to Simplify Development  Firmware is essential in battery management systems as it is used to monitor batteries’ state of charge (SoC), state of health (SoH), current, and temperature, as well as actively balancing the voltages of the individual cells, and detect faults. In some cases, however, consumer electronics developers may lack the highly specialized expertise needed to develop control algorithms that keep the batteries operating in a safe temperature region and ensure adequate battery life over many charge/discharge cycles.  Renesas’ R-BMS F solutions include built-in, pre-tested firmware designed to work with the FGIC’s on-board MCU. The firmware includes critical pre-programmed functions to maximize battery life and ensure safe operation. These include cell balancing, current control, and voltage and temperature monitoring. For added flexibility, the battery management system lets developers set many parameters to meet specific requirements and adjust the solution for different cell chemistries via a graphical user interface (GUI), without the need for a full integrated development environment (IDE).  “One of the biggest bottlenecks for designing advanced power management solutions is the complex task of firmware development and validation,” said Chris Allexandre, Senior Vice President and General Manager of Power at Renesas. “Not everyone has the expertise or in-house resources to write their own algorithms. Our all-in-one R-BMS F battery management system eliminates this process and provides market-ready power solutions that work without requiring specialized technical knowledge of MCU programming or advanced battery management design.”  All-Inclusive Evaluation Kits Ready to Ship  Both R-BMS F solutions contain a full evaluation kit, which has all the hardware, software, tools and documentation required to start developing. The underlying hardware powering the R-BMS F is Renesas’ FGIC solution, which combines an analog battery front end and an ultra-low-power RL78 MCU into a single, small package. The analog portion provides accurate measurements of cell voltage, current and temperature, as well as controlling the external MOSFETs and converting analog data to digital signals. The digital section is where synchronous functions reside, including the main CPU, clocks, timers and serial interfaces. Also included in the evaluation kits are: pre-programmed firmware stored in embedded flash memory with the flexibility to set the battery pack and cell chemistry parameters; the USB System Management Bus (SMBus) interface; GUI-based software; cables to communicate with the host system; dedicated development tools for parameter setting; and full documentation, including schematics and an engineering bill of materials (eBOM). With these resources, developers can confidently innovate intelligent power management systems that safely monitor battery usage and provide longevity, while reducing their impact on the environment. Renesas plans to include turn-key R-BMS F solutions in all future FGICs.  2-4 Cell Series Solution (RTK0EF0163DK0002BU)  The R-BMS F for 2 to 4S cell (~8V to 16V) solutions targets small vacuum cleaners, robotic vacuums, consumer and medical devices and runs on Renesas’ RAJ240055 Li-ion battery FGIC. Renesas offers Smart Robot Vacuum Cleaner | Renesas by combining this FGIC with other devices from its portfolio.  3-10 Cell Series Solution (RTK0EF0136DK0002BU)  The R-BMS F for 3 to 10S cell (~12V to 40V) solutions runs on Renesas RAJ240100 and RAJ240090 Li-ion battery FGICs, with target applications including e-bikes, e-mobility, vacuum cleaners, robotics, drones and industrial, consumer and medical systems.  Renesas has combined these FGICs with other devices from its portfolio to offer Wall to Battery Low Power Energy Storage System and USB-PD All in One Battery and Charging Solution. These Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly.  Availability  Both R-BMS F solutions are available today in production volumes.
2025-05-08 13:23 reading:321
Renesas Debuts New Group in Popular RA0 Series with Best-in-Class Power Consumption and Extended Temperature Range
  Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RA0E2 microcontroller (MCU) Group based on the Arm® Cortex®-M23 processor. The new, cost-competitive devices offer extremely low power consumption, extended temperature range, and a wide variety of peripheral functions and safety features.  Renesas introduced the RA0 MCU series in 2024 and it has quickly become very popular with a wide range of customers due to its affordability and low power consumption. RA0E1 devices have already been adopted in consumer electronics, appliance and white goods, power tools, industrial monitoring and other applications.  RA0E2 MCUs are fully compatible with RA0E1 devices, offering pin-expansion while maintaining the same peripherals and ultra-low power. This compatibility lets customers re-use existing software assets. The new devices deliver industry-leading power consumption of only 2.8mA current in active mode, and 0.89 mA in sleep mode. In addition, an integrated High-speed On-Chip Oscillator (HOCO) enables the fastest wake-up time for this class of microcontroller. The fast wake-up enables the RA0 MCUs to stay in Software Standby mode more of the time, where power consumption drops to a minuscule 0.25 µA.  Renesas’ RA0E1 and RA0E2 ultra-low power MCUs deliver an ideal solution for battery-operated consumer electronics devices, small appliances, industrial system control and building automation application.  Feature Set Optimized for Low Cost  The RA0E2 devices have a feature set optimized for cost-sensitive applications. They offer a wide operating voltage range of 1.6V to 5.5V so customers don’t need a level shifter/regulator in 5V systems. The RA0 MCUs also integrate timers, serial communications, analog functions, safety functions and security functionality to reduce customer BOM cost. A wide range of packaging options is also available, including a tiny 5mm x 5mm 32-lead QFN.  In addition, the new MCU’s high-precision (±1.0%) HOCO improves baud rate accuracy and enables designers to forego a standalone oscillator. Unlike other HOCOs in the industry, it maintains this precision in environments from -40°C to 125°C. This wide temperature range enables customers to avoid costly and time-consuming “trimming,” even after the reflow process.  “The market reception for our RA0 Series has exceeded even our own high expectations,” said Daryl Khoo, Vice President of the Embedded Processing Marketing Division at Renesas. “The RA0E2 Group MCUs deliver the same ultra-low power and price point that have been so popular with our customers. The addition of extended temperature range and more memory opens up even more applications and use cases. We plan to further expand the RA0 product lineup, delivering optimal solutions for 8-16 bit MCU users transitioning to 32-bit MCUs.”  Key Features of the RA0E2 Group MCUs  Core: 32MHz Arm Cortex-M23  Memory: Up to 128KB integrated Code Flash memory and 16KB SRAM  Extended Temperature Range: Ta -40°C to 125°C  Timers: Timer array unit (16b x 8 channels), 32-bit interval timer (8b x 4 channels), RTC  Communications Peripherals: 3 UARTs, 2 Async UART, 6 Simplified SPIs, 2 I2C, 6 Simplified I2Cs  Analog Peripherals: 12-bit ADC, temperature sensor, internal reference voltage  Safety: SRAM parity check, invalid memory access detection, frequency detection, A/D test, output level detection, CRC calculator, register write protection  Security: Unique ID, TRNG, AES libraries, Flash read protection  Packages: 32- and 48-lead QFNs, 32-, 48-, and 64-pin LQFP  The new RA0E2 Group MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. Using the FSP will ease migration of RA0E1 designs to larger RA0E2 devices if customers wish to do so.  Availability  The RA0E2 Group MCUs are available now, along with the FSP software and the RA0E2 Fast Prototyping Board. Samples and kits can be ordered either on the Renesas website or through distributors. More information on the new MCUs is available at renesas.com/RA0E2.  Renesas MCU Leadership  The world leader in MCUs, Renesas ships more than 3.5 billion units per year, with approximately 50% of shipments serving the automotive industry, and the remainder supporting industrial and Internet of Things applications as well as data center and communications infrastructure. Renesas has the broadest portfolio of 8-, 16- and 32-bit devices, delivering unmatched quality and efficiency with exceptional performance. As a trusted supplier, Renesas has decades of experience designing smart, secure MCUs, backed by a dual-source production model, the industry’s most advanced MCU process technology and a vast network of more than 250 ecosystem partners. For more information about Renesas MCUs, visit renesas.com/MCUs.
2025-04-29 10:54 reading:354
Renesas Introduces Low-Power Bluetooth Low Energy SoC for Automotive Applications
  Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced a new industry-leading Bluetooth chip that combines a radio transceiver, an Arm® M0+ microcontroller, memory, peripherals and security features in a compact SoC design. The DA14533, the first automotive-qualified device in the company’s Bluetooth® Low Energy system-on-chip (SoC) family, includes advanced power management features to simplify system integration and reduce power consumption. With its software stack qualified against Bluetooth Core 5.3 and support for extended temperatures, developers can jump-start projects in applications from tire pressure monitoring and keyless entry to wireless sensors and battery management systems.  Optimized Design to Deliver Unparalleled Power Efficiency  Building on Renesas’ leadership in Bluetooth LE SoCs (SmartBond Tiny Family) with industry-leading low power consumption, the new DA14533 includes some of the most advanced power management features in the industry. The device includes an integrated DC-DC buck converter, which accurately adjusts the output voltage according to system requirements. Active system power consumption is lower than comparable devices in the market, requiring only 3.1mA during transmission and 2.5mA during reception. In hibernation mode, the current drops to 500nA. These power management and power-saving features help extend the operational life of small-capacity battery-powered systems and meet the stringent power requirements of tire pressure monitoring systems’ mission profile.  Auto-Grade AEC-Q100 Qualified and Up-to-Date Security Features  The DA14533 is an AEC-Q100 Grade 2 qualified device, which means the device has passed strict testing to sustain quality and reliability in harsh automotive environments. Moreover, the device’s extended temperature range (-40 to +105°C) ensures reliable performance in demanding conditions, making it ideal for automotive and industrial systems where stability and durability are essential. Qualified against Bluetooth Core 5.3 specifications, the device contains the latest security features to safeguard connected devices from various threats.  “Our SmartBond Tiny SoC family has seen remarkable success in the industrial market, with over 100 million units shipped to date,” said Chandana Pairla, VP of Connectivity Solutions Division at Renesas. “This new automotive-grade device will enable a new class of Bluetooth LE applications that demand high power efficiency, a small footprint and broader temperature tolerance for next-generation battery-powered automotive and industrial systems.”  Lower Bill-of-Materials Reduces Costs and Simplifies Development  Similar to other Bluetooth LE SoC devices in the SmartBond Tiny family, the DA14533 only requires 6 external components, offering a best-in-class engineering bill of materials (eBOM).  A single external crystal oscillator (XTAL) is used for both active and sleep modes, eliminating the need for a separate oscillator for sleep mode. Its ultra-compact design – available in a WFFCQFN 22-pin 3.5 x 3.5 mm package – makes the device the smallest automotive Bluetooth LE SoC on the market. With its compact design and low eBOM, the device integrates seamlessly into space-constrained systems, reducing overall system costs and accelerating time-to-market for customers.  Key Features of the DA14533  Arm® Cortex®-M0+ microcontroller – Standalone application processor or data pump in hosted systems  64KB RAM and 12KB One-Time Programmable (OTP) memory  2.4 GHz radio transceiver  Integrated low IQ buck DC-DC converter  External SPI flash  Single XTAL operation (single crystal oscillator)  Software stack qualified against Bluetooth Core 5.3  AEC-Q100 Grade 2-qualified with wide operating temperature range support (-40 to +105°C)  WFFCQFN 22-pin 3.5 x 3.5 mm package
2025-04-08 14:06 reading:421
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