英飞凌为小米SU7智能电动汽车供应多款产品

Release time:2024-05-13
author:AMEYA360
source:英飞凌
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  作为全球功率系统和物联网领域的半导体领导者,英飞凌科技股份公司宣布将为小米汽车最新发布的SU7智能电动汽车供应碳化硅(SiC)HybridPACK™ Drive G2 CoolSiC™功率模块及芯片产品直至2027年。英飞凌的CoolSiC™功率模块可适应更高的工作温度,从而实现一流的性能、驾驶动力和寿命。例如,基于该技术的牵引逆变器可进一步增加电动汽车续航里程。HybridPACK™ Drive是英飞凌市场领先的电动汽车功率模块系列,自2017年以来已累计出货近850万颗。

英飞凌为小米SU7智能电动汽车供应多款产品

  英飞凌为小米SU7 Max版供应两颗1200 V HybridPACK™ Drive G2 CoolSiC™模块。此外还为小米汽车供应满足不同需求的其它广泛产品,例如不同应用中的EiceDRIVER™栅极驱动器和10款以上的微控制器。两家公司还同意在SiC汽车应用领域开展进一步合作,以充分发挥英飞凌碳化硅产品组合的优势。

  英飞凌汽车电子事业部总裁

  我们很高兴能与小米汽车这样新兴蓬勃的汽车品牌建立合作,为其提供能够进一步提升电动汽车性能的碳化硅器件产品。作为汽车行业的领先供应商,我们提供广泛的产品组合,对不同系统有着深刻的理解,且拥有多个生产基地,能充分助力未来移动出行。

  小米汽车副总裁、供应链部总经理

  英飞凌是我们重要的合作伙伴,在功率半导体领域拥有先进的技术实力和稳定的生产能力,并且可提供丰富的微控制器产品组合。两家公司的合作不仅有助于确保小米汽车碳化硅器件的供货稳定,还能帮助我们为客户打造安全可靠、性能出色和功能强大的豪华科技汽车。

  本次合作将进一步巩固英飞凌作为全球汽车半导体行业的领先地位。根据TechInsights的最新数据,英飞凌是全球最大的汽车半导体供应商。此外,除了在汽车功率半导体领域位居第一,英飞凌去年还在汽车微控制器领域也占据领先地位。

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