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<span style='color:red'>NXP Semiconductors</span> LPCXpresso55S36 Development Board

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NXP Semiconductors LPCXpresso55S36 Development Board

　　NXP Semiconductors LPCXpresso55S36 Development Board provides a powerful, extendable platform for evaluating the LPC5536 Microcontroller (MCU). This development board features a high-speed USB debug probe based on easy firmware update options. The board is compatible with the Arduino UNO R3 and Mikroe click boards. This LPCXpresso55S36 board is lead-free and RoHS-compliant. The board is used with a wide range of development tools, including NXP MCUXpresso IDE, Keil µVision, and IAR embedded workbench.　　FEATURES　　High-speed USB, MCU-link debug probe with CMSIS-DAP and SEGGER J-Link protocol options　　Hardware support for external debug probe or external debug target　　MikroEletronika click expansion option　　LPCXpresso-V3 expansion connectors, compatible with Arduino UNO R3　　PMod-compatible expansion/host connector　　BLOCK DIAGRAM　　LPCXPRESSO55S36 CONNECTORS, PUSH BUTTONS, AND LEDS

Key word：

NXP Semiconductors

Release time：2023-09-26 15:10 reading：2789 Continue reading>>

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NXP Semiconductors TJA1051 High-Speed CAN Transceivers

　　NXP Semiconductors TJA1051 High-Speed CAN Transceivers offer an interface between a Controller Area Network (CAN) protocol controller and the physical two-wire CAN bus. The TJA1051 is intended for high-speed CAN applications in the automotive industry. The device provides differential transmit and receive capability to (a microcontroller with) a CAN protocol controller.The TJA1051 Transceivers are part of the third generation of high-speed CAN transceivers from NXP Semiconductors, supplying significant improvements over first- and second-generation devices such as the TJA1050. The TJA1051 also provides improved ElectroMagnetic Compatibility (EMC) and ElectroStatic Discharge (ESD) performance with:　　• Ideal passive behavior to the CAN bus when the supply voltage is off　　• TJA1051T/3 and TJA1051TK/3 can be interfaced directly to microcontrollers with supply voltages from 3V to 5V　　The TJA1051 implements the CAN physical layer defined in ISO 11898-2:2016 and SAE J2284-1 to SAE J2284-5. This implementation allows reliable communication in the CAN FD fast phase at data rates up to 5Mbit/s. These features make the TJA1051 an exceptional choice for all types of HS-CAN networks in nodes that do not require a standby mode with wake-up capability through the bus.　　The TJA1051 is a high-speed CAN stand-alone transceiver with Silent mode and available in three versions, determined only by the function of pin 5:　　• The TJA1051T is backward compatible with the TJA1050　　• The TJA1051T/3 and TJA1051TK/3 allow for direct interfacing to microcontrollers with supply voltages down to 3V　　• The TJA1051T/E allows the transceiver to be switched to a very low-current Off modeFEATURES　　General　　ISO 11898-2:2016 and SAE J2284-1 to SAE J2284-5 compliant　　Timing guaranteed for data rates up to 5Mbit/s in the CAN FD fast phase　　Suitable for 12V and 24V systems　　Low ElectroMagnetic Emission (EME) and high Electromagnetic Immunity (EMI)　　VIO input on TJA1051T/3 and TJA1051TK/3 allows for direct interfacing with 3V to 5V microcontrollers (available in SO8 and very small HVSON8 packages, respectively)　　EN input on TJA1051T/E allows the microcontroller to switch the transceiver to a very low-current Off mode　　Available in SO8 package or leadless HVSON8 package (3.0mm x 3.0mm) with improved Automated Optical Inspection (AOI) capability　　Dark green product (halogen-free and Restriction of Hazardous Substances (RoHS) compliant)　　AEC-Q100 qualified　　Low-power management　　Functional behavior predictable under all supply conditions　　Transceiver disengages from the bus when not powered up (zero loads)　　Protection　　High ElectroStatic Discharge (ESD) handling capability on the bus pins　　Bus pins protected against transients in automotive environments　　Transmit Data (TXD) dominant time-out function　　Undervoltage detection on pins VCC and VIO　　Thermally protected　　SPECIFICATIONS　　4.5V to 5.5V supply voltage　　-8kV to +8kV electrostatic discharge voltage　　Supply current　　2.5mA silent mode　　10mA normal mode, bus recessive　　70mA normal mode, bus dominant

Key word：

NXP

Release time：2023-08-22 13:23 reading：2115 Continue reading>>

<span style='color:red'>NXP Semiconductors</span> PF5030 Fail-Safe System Basis Chip PMICs

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NXP Semiconductors PF5030 Fail-Safe System Basis Chip PMICs

　　NXP Semiconductor PF5030 Fail-Safe System Basis Chip PMICs with multiple switch-mode power supplies (SMPSs) and low-dropout regulators (LDOs) are designed for S32Z2/E2 processors. A maximum input voltage of up to 5.25V makes the PF5030 PMICs ideal for working with NXP front system supply families (FS86, FS6x) or any other front supply in the automotive drive train market. Built-in One-Time Programmable (OTP) memory stores key start-up configurations that drastically reduce external components typically used to set external regulators' output voltage and sequence. Regulator parameters are adjustable through the I2C after start-up, offering flexibility for different system states.　　FEATURES　　Voltage　　5.25VDC maximum operating voltage　　Supports operating voltage range down to 3.3V　　Low power OFF mode with low sleep current (15?A typical)　　Power supplies　　BUCK1/2 low voltage integrated synchronous buck converter　　Configurable output voltage from 0.7V to 1.5V and current capability up to 3.5ADC　　Capable of multiphase operation up to 7.0ADC　　BUCK3 low voltage integrated synchronous buck converter　　Configurable output voltage from 1.0V to 4.1V and current capability up to 2.5ADC　　LDO1/2 low voltage LDO regulator for MCU I/O and system peripheral　　Configurable output voltage from 1.1V to 4.1V and current capability up to 400mADC　　System support　　1x input pin for power-ON detection, 1.8V, 3.3V, and 5.0V compatible　　Analog multiplexer with full system voltages and temperature monitoring　　Enhanced leader/follower power-up sequencing management through XFAILB pin　　10ms optional RSTB release delay during power-up for certain MCU compliance　　Device control via 32-bit I2C interface with 8-bit CRC　　Compliance　　EMC optimization techniques on switching regulators, including spread spectrum and manual frequency tuning　　EMI robustness supporting various automotive EMI test standards　　IEC 61967-4 conducted emission　　IEC 62132-4 conducted immunity　　Functional safety　　ASIL D capability on safety goal 1 (SG1/CSG_01) on UV/OV for all S32Z2/E2 power rails (0.8V, 1.1V, 1.8V, and 3.3V)　　Configurable ASIL from QM to ASIL D on safety goal 2 (SG2/CSG_02) on MCU monitoring function (watchdog)　　Independent voltage monitoring circuitry　　Up to 6x voltage monitoring inputs with 1.0% target accuracy　　Logical and analog built-in self-test (LBIST/ABIST)　　Safety outputs with latent fault detection mechanism (PGOOD, RSTB, FS0B)　　Configuration and enablement　　40-pin QFN with exposed pad for optimized thermal management　　OTP programming for device customization　　APPLICATIONS　　EV propulsion and power train domain controllers　　Chassis-integrated systems　　S32Z2/E2 companion chips

Key word：

NXP

Release time：2023-04-26 11:35 reading：1271 Continue reading>>

AMEYA360:<span style='color:red'>NXP Semiconductors</span> PCA9451AHN PMIC

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AMEYA360:NXP Semiconductors PCA9451AHN PMIC

　　NXP Semiconductors PCA9451AHN PMIC is a highly integrated power management solution for reliable and efficient application performance. NXP Semiconductors PCA9451AHN are designed to support i.MX 93x family processors. This single-chip PMIC is versatile enough to cater to 1-cell Li-Ion, Li-polymer battery portable applications, and 5V adapter non-portable applications. The PCA9451AHN is packed with features that make it a top choice for engineers looking to design power-efficient solutions.　　FEATURES　　Six high-efficiency step-down regulators　　One 4A dual-phase buck regulator with DVS feature and remote senseOne 2A buck regulator with DVS feature and remote senseOne 3A buck regulator　　One 2A buck regulator　　One 1.5A buck regulator　　Three linear regulators　　One low IQ 10mA LDO　　One 150mA LDO　　One 200mA LDO　　400mA load switch with a built-in active discharge resistor32.768kHz crystal oscillator driver and buffer outputProduct longevity program　　This product is included in the NXP Product Longevity program, with assured supply for a minimum of 15 years after launch APPLICATIONS　　Automotive　　Hue bridge　　Smart home　　Audio sound bar　　Energy grid equipment　　Energy meter　　Environmental control　　Home security hub　　Sensor hub　　Smart doorbell　　Smart lock　　Industrial　　EV charging station　　I/O control　　Industrial gateway　　Industrial HMI　　Machine vision and scanning

Key word：

NXP,PCA9451AHN

Release time：2023-04-19 13:36 reading：2190 Continue reading>>

Ameya360:<span style='color:red'>NXP Semiconductors</span> GoldBox 3 Vehicle Networking Development Platform

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Ameya360:NXP Semiconductors GoldBox 3 Vehicle Networking Development Platform

　　NXP Semiconductors GoldBox 3 Vehicle Networking Development Platform is designed for vehicle Service-Oriented Gateways (SoGs), domain control applications, high-performance processing, and safety and security applications. This development platform offers high-performance computing capacity, real-time network performance, multi-Gigabit packet acceleration, security, and rich input/output (I/O).　　These target the central gateway, domain controller, FOTA, secure key management, smart antenna, and high-performance central compute nodes. The GoldBox 3 vehicle networking development platform supports low-power mode, multiple wake-up sources, and two M.2 modules. Typical applications include Firmware Over-the-Air (FOTA), automotive access points, safety processors, service-oriented gateway, vehicle compute, and zonal gateways.　　FEATURES　　Hardware:　　Supports service-oriented gateway and domain controller applications　　Multiple network interfaces featuring 18 CAN/CAN FD and 12 Ethernet ports　　Supports low-power mode and multiple wake-up sources　　Supports two M.2 modules (M-key slot and E-key slot)　　12V AC-DC adapter power supply　　Interfaces:　　LIN, CAN/CAN FD, 100BASE-T1, 1000BASE-T / 2.5GBASE-T, 100BASE-TX, 1000BASE-T, FlexRay, USB, PCIe, JTAG, UART, AURORA, and M.2 slots　　Safety:　　ISO 26262 support by using safety components and architecture　　KIT CONTENTS　　Rugged enclosure with integrated thermal management　　S32G reference design board 3　　Universal AC adapter　　AC/DC 12V 6.67A power supply　　32GB SD card　　DuPont line　　2x USB A-to-micro B cables (UART0/1)　　CAT6A Ethernet cable　　Ethernet loopback cable　　3x Heatsinks　　FAN solution for S32G　　Screws (M.2 slots)　　1.27mm mini jumpers and cables　　APPLICATIONS　　Automotive access point　　Automotive data logger　　Automotive zone controller　　Domain controllers　　Firmware Over-the-Air (FOTA)　　Gateway　　In-vehicle networks　　Safety processors　　Service-oriented gateway　　Vehicle compute　　Zonal gateways

Key word：

AMEYA360,NXP

Release time：2023-03-24 13:44 reading：1874 Continue reading>>

AMEYA360:<span style='color:red'>NXP Semiconductors</span> S32G3 Vehicle Networking Reference Design

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AMEYA360:NXP Semiconductors S32G3 Vehicle Networking Reference Design

　　NXP Semiconductors S32G3 Vehicle Networking Reference Design is designed for vehicle Service-Oriented Gateways (SoGs), domain control applications, high-performance processing, and safety and security applications. This reference design is based on the octal Arm Cortex-A53 cores and quad, dual-core lockstep Arm Cortex-M7 cores. The S32G3 vehicle networking reference design offers high-performance, real-time network performance, multi-gigabit packet acceleration and security, and rich input/output (I/O). Typical applications include Firmware Over-the-Air (FOTA), automotive access points, safety processors, service-oriented gateway, vehicle compute, and zonal gateways.　　FEATURES　　Hardware:　　Supports service-oriented gateway and domain controller applications　　Multiple network interfaces, featuring 18 CAN/CAN FD and 12 Ethernet ports　　Supports low-power mode and multiple wake-up sources　　Supports two M.2 modules (M-key slot, E-key slot)　　ISO 26262 support by using safety components and architecture　　12V AC-DC adapter　　Interfaces:　　LIN, CAN/CAN FD, 100BASE-T1, 1000BASE-T / 2.5GBASE-T, 100BASE-TX, 1000BASE-T, FlexRay, USB, PCIe, JTAG, UART, AURORA, and M.2 slots　　KIT CONTENTS　　S32G Reference Design Board 3　　Universal AC adapter　　AC/DC 12V 6.67A power supply　　32GB SD card　　DuPont line　　2x USB A-to-micro B cables (UART0/1)　　CAT6A Ethernet cable　　Ethernet loopback cable　　3x Heatsinks　　FAN solution for S32G　　Screws (M.2 slots)　　1.27mm mini jumpers and cables　　APPLICATIONS　　Automotive access point　　Automotive data logger　　Automotive zone controller　　Domain controllers　　Firmware Over-the-Air (FOTA)　　Gateway　　In-vehicle networks　　Safety processors　　Service-oriented gateway　　Vehicle compute　　Zonal gateways

Key word：

NXP,S32G3

Release time：2023-03-24 13:41 reading：2119 Continue reading>>

Ameya360:<span style='color:red'>NXP Semiconductors</span> TEA2096T synchronous Rectifier Controller

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Ameya360:NXP Semiconductors TEA2096T synchronous Rectifier Controller

　　The NXP Semiconductors TEA2096T synchronous Rectifier Controller is ideal for switching mode power supplies. The TEA2096T uses an adaptive grid drive method to provide maximum efficiency under any load. The controller can be used for synchronous rectification of the secondary side of the resonant converter. The device has two driver stages that drive SR MosFETs and corrects the output of the center tapped secondary transformer windings.　　characteristic　　Efficiency characteristic　　Adaptive grid drive for maximum efficiency under any load　　The power supply current is 80μA in energy saving mode　　Voltage regulator: -29mV, used to drive low resistance mosFeTs　　Application characteristics　　Drain detection voltage: up to 200V　　Wide supply voltage range: 4.5V to 38V　　Dual-channel synchronous rectifier for LLC resonance　　Support 5V power supply operation, with logical level SR MOSFET　　Differential input, used to detect the drain-source voltage of each synchronous rectifier MOSFET　　SO8 package　　Control characteristic　　SR control, no minimum on-off time　　Adaptive grid drive for quick shutdown at the end of on-off　　Undervoltage latching (UVLO) protection with active grid pull-down function　　Interlocking function prevents external MOSFeTs from being switched on at the same time　　Supports 1MHz switching frequency　　application　　adapter　　Desktop and all-in-one power supplies　　Television power supply　　Server power supply　　Industrial power supply

Key word：

Ameya360,NXP

Release time：2023-03-07 13:34 reading：1470 Continue reading>>

Ameya360：<span style='color:red'>NXP Semiconductors</span> DSC Multilink Debug Interface

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Ameya360：NXP Semiconductors DSC Multilink Debug Interface

　　NXP Semiconductors DSC Multilink Debug Interface accelerates the debug and flash programming process, saving valuable development time. The Multilink provides access to the debug modes of NXP’s DSC MCUs by allowing communications between the target device and a laptop / PC. The Multilink connects the target’s standard debug header to the laptop / PC’s USB port using a Type A to Type B male-to-male USB cable. A 14-pin ribbon cable is included for connection to DSC target debug headers. The NXP Semiconductors DSC Multilink provides multi-voltage support for targets ranging from 1.8V to 5V.　　FEATURES:　　Multi-voltage support for targets ranging from 1.8V to 5V　　Fast, hassle-free USB 2.0 communications interface　　Type A to Type B male-to-male USB cable connects the interface to the PC　　Debugging via NXP Codewarrior for microcontrollers　　Includes a 14-pin ribbon cable for connection to DSC target debug headers　　Supports Program and Data Flash, Securing and Unsecuring

Key word：

NXP,Ameya360

Release time：2023-02-24 10:45 reading：1742 Continue reading>>

<span style='color:red'>NXP Semiconductors</span> announces $1B bridge financing

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NXP Semiconductors announces $1B bridge financing

NXP Semiconductors N.V. (NASDAQ: NXPI) today announced that on September 19, 2018 (the “Closing Date”) its subsidiaries NXP B.V and NXP Funding LLC (the “Borrowers”), the lenders party thereto and Barclays Bank Plc, as administrative agent, entered into a US$1,000,000,000 senior unsecured bridge term credit facility agreement (the “Bridge Term Credit Agreement”). On the Closing Date, an aggregate principal amount of US$1,000,000,000 of term loans (the “Term Loans”) were borrowed under the Bridge Term Credit Agreement. The Term Loans mature 364 days following the Closing Date and bear interest, at the option of the Borrowers, at either (a) a LIBOR rate plus an applicable margin of 1.5 percent or (b) a base rate plus an applicable margin of 0.5 percent.The proceeds of the Loans hereunder shall be used for general corporate purposes of the Borrower as well as to finance parts of the announced equity buy-back program.All present and future obligations of the Borrowers arising under and pursuant to the terms of the Bridge Term Credit Agreement are guaranteed pursuant to a guaranty agreement dated as of the Closing Date (the “Guaranty Agreement”) and made by NXP Semiconductors Netherlands B.V., Freescale Semiconductor Holdings V, Inc., and NXP USA, Inc., in favor of Barclays Bank Plc, as administrative agent.

Key word：

NXP Semiconductors

Release time：2018-09-21 00:00 reading：3762 Continue reading>>

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