Murata Type 2FR Hostless Tri-Radio <span style='color:red'>Module</span>
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Murata Type 2FR Hostless Tri-Radio Module

     Murata Electronics Type 2FR Hostless Wi-Fi® 6 + BLUETOOTH® LE 5.4 / 802.15.4 Tri-Radio Module is highly integrated while based on the NXP RW612 Wireless MCU. The Type 2FR wireless module delivers class-leading integration, efficiency, and multiple radio capabilities in a 12mm x 11mm package.The Murata Type 2FR supports dual-band Wi-Fi 6, Bluetooth Low Energy (LE) 5.4, IEEE 802.15.4, and ethernet. This versatility provides seamless connectivity and operational efficiency. Additionally, it supports Matter Network over Wi-Fi, Thread, and ethernet, simplifying device interoperability and management.FEATURESNXP RW612 inside260MHz Arm® Cortex® -M33Supports IEEE 802.11a/b/g/n/ac/ax specification with dual-band 2.4GHz and 5GHz Wi-Fi 6SISO with 20MHz channels; up to MCS9 data ratesSupports Bluetooth specification version 5.4Supports IEEE 802.15.41.2MB SRAM; 16MB Flash; External PSRAM interface for system memory expansion up to 128MB64 GPIOs, FlexSPI, SDIO 3.0, Ethernet, USB, USART, I2C, SPI, I2S, PCM, ACOMP, DAC, ADC, JTAGRF signal from pin padTemperature range of -40°C to 85°C12.0mm x 11.0mm x 1.55mm (maximum) dimensionsMSL 3Surface-mount typeRoHS compliantAPPLICATIONSSmart homeBlood pressure monitorFitness equipmentGaming accessoriesGlucometerHome security and surveillanceIn-home energy displayMajor home appliancesMulti-radio hub/smart device gateway for internet connectivitySmall and medium appliancesSmart power socket and light switchWeighing scaleIndustrialBuilding securityLightingPoint of Sale (POS) terminals
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Release time：2025-03-24 13:52 reading：200 Continue reading>>
MWC Barcelona 2025: Fibocom Launches Qualcomm X85/X82 5G Modem-RF-Powered 5G <span style='color:red'>Module</span>s, Enhancing FWA AI Capabilities
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MWC Barcelona 2025: Fibocom Launches Qualcomm X85/X82 5G Modem-RF-Powered 5G Modules, Enhancing FWA AI Capabilities

　　Barcelona, Spain – March.4th 2025 - Fibocom (Stock code:300638), a global leading provider of AIoT solutions and wireless communication modules, announced the launch of its new 5G modules and solutions based on Qualcomm Technologies, Inc.s latest Qualcomm® X85/X82 5G Modem-RF. These new solutions are set to help industry customers seamlessly transition to next-generation Fixed Wireless Access (FWA) technologies and rapidly accelerate the commercialization of new platforms.　　The latest Qualcomm X85/X82 5G Modem-RF delivers significant performance upgrades over the previous X75/X72 generation, including:　　l Supports 3GPP 5G Advanced standards, enabling key 5G Advanced features.　　l Enhanced NR Sub-6GHz downlink carrier aggregation (CA), upgraded from 5CA to 6CA, with carrier bands exceeding 400 MHz.　　l Support for Intra-band ULCA (uplink carrier aggregation) TDD, boosting uplink data rates and optimizing network efficiency.　　l Advanced software capabilities, supporting OpenWRT version 24.x, with compatibility for RDK-B and prplOS.　　l Major AI advancements, including Modem AI functionality and support for external AI NPUs (Neural Processing Units).　　Powered by a quad-core processor, new software suite, and several industry-leading innovations, Fibocom’s 5G modules deliver remarkable capabilities in network coverage, latency, energy efficiency, and mobility. Harnessing advanced AI capabilities, these modules drive 5G FWA solutions to an unprecedented level of intelligence.　　These 5G modules support six-carrier aggregation in the NR Sub-6GHz downlink, offering bandwidth exceeding 300 MHz for faster transmission speeds and broader signal coverage. In addition, Intra-Band uplink carrier aggregation ensures faster data rates, optimizing overall network performance and addressing bandwidth-intensive applications like video conferencing, online gaming, and virtual collaboration.　　In addition to hardware upgrades, the Qualcomm X85 Modem-RF introduces software innovations. The modules will support OpenWRT 24.x, a popular open-source router operating system known for robust features and scalability. Support for RDK-B and prplOS provides users with the flexibility to select the platform that best suits their needs.　　The Qualcomm® 5G AI Suite and Qualcomm® Networking AI Suite combine to deliver QoS management and intelligently prioritized network traffic. These powerful AI Suite capabilities automatically identify high-priority tasks—such as streaming HD video or online gaming—and allocate necessary bandwidth, significantly enhancing the user experience.　　“We are thrilled to collaborate with Fibocom on the launch of their new 5G modules and solutions, powered by our latest Qualcomm X85/X82 5G Modem-RF. Together, we are proud to set new benchmarks with solutions offering exceptional network coverage, low latency, energy efficiency, and enhanced mobility, ultimately paving the way for a more connected and efficient future,” said Gautam Sheoran, VP & GM, Wireless Broadband & Communications, Qualcomm Technologies, Inc.
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Release time：2025-03-20 13:55 reading：221 Continue reading>>
SGP.32 remote provisioning firmware being added to all SIMCom LTE Cat 1 bis IoT modules
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SGP.32 remote provisioning firmware being added to all SIMCom LTE Cat 1 bis IoT modules

　　SIMCom, a leading provider ofcellular wireless modules and solutions for IoT and M2M applications, has announced that all its range of Cat 1 bis IoT modules are now being prepared with the firmware necessary to support SGP.32 functionality, facilitating simple remote provisioning of IoT modules. Developed by the GSMA, the SGP.32 standard enables connectivity with IoT devices without the need for physical SIM cards or other user interfaces.　　Comments Mads Fischer, European Sales Director. SIMCom: “ SGP.32 allows IoT devices that have no displays, buttons or SIM cards to be deployed and updated. Cat 1 bis has been rolled out globally, so by implementing SGP.32 firmware in our Cat 1 bis modules, we are enabling IoT network designers to easily and seamlessly operate their systems remotely and securely using an eSIM only.”　　SIMCom's key LTE Cat 1 bis modules that have integrated SGP.32 firmware include the A7672 series, SIM7672 series, and A7683E. These modules offer strong connectivity, global certification compliance, and enhanced power efficiency, making them ideal for various IoT applications.　　Based on the ASR1603 platform, the A7672 series supports LTE-FDD, LTE-TDD, GSM, GPRS, and EDGE communication modes. With a comprehensive certification portfolio—including RoHS, REACH, CE-RED, RCM, FCC, Anatel, and Deutsche Telekom—this series ensures compliance with global regulations, facilitating smooth deployment across international markets.　　Powered by the QCX216 chipset, the SIM7672 series supports LTE-FDD and LTE-TDD communication. It boasts a wide range of certifications, including CE-RED, RoHS, REACH, FCC, TELEC, JATE, GCF, PTCRB, IC, KC, CCC, AT&T, and T-Mobile, ensuring reliability in diverse regions. A key feature of the SIM7672 series is its support for 3GPP Rel-14 Power Saving Mode (PSM), which allows power consumption to drop as low as 3µA in PSM mode, making it an excellent choice for battery-sensitive applications. The A7683E module is designed for LTE-FDD applications and carries certifications such as RoHS, REACH, CE-RED, and Anatel. All three modules offering a 10Mbps(maximum)downlink rate and 5Mbps uplink rate.　　Available in theLCC+LGA form factor,A7672 series and SIM7672 series are compatible with SIMComNB/Cat Mand/or2G modules,enabling a smooth migration to LTE Cat 1 products,enabling end-product scalability and upgradability. Modules alsosupport both multiple built-in network protocols and the drivers for main operation systems (USB driver for Windows, Linux and Android).The inclusion of industrial standard interfaces such as UART, USB, I2C and GPIO suit the modules for IoT applications such as telematics, POS, surveillance devices, industrial routers, and remote diagnostics etc.　　SIMCom's A7672 series, SIM7672 series, and A7683E modules, powered by SGP.32 firmware, provide a cost-effective and scalable solution for large-scale IoT deployments, particularly in metering and tracking, by enabling remote SIM provisioning that eliminates the need for physical SIM insertion—thereby reducing costs and simplifying deployment in remote locations. With global certifications and ultra-low power consumption, these modules deliver reliable, energy-efficient performance and long-term deployment stability, making them the ideal choice for massive IoT applications due to their flexibility and efficiency.
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Release time：2025-03-18 16:38 reading：265 Continue reading>>
BIWIN Solutions for Communication <span style='color:red'>Module</span>s: High-Speed, Stable, and Built for Seamless Data Flow
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BIWIN Solutions for Communication Modules: High-Speed, Stable, and Built for Seamless Data Flow

　　The Internet of Things (IoT) is on a steep upward trajectory. Statista predicts that by 2025, the world will see a surge of connected IoT devices to 29.422 billion units from 9.757 billion units, with CAGR reaching 11.67%. This explosion isn’t just powering the deployment of more smart gadgets; it’s opening up huge opportunities for hardware and storage tech. At the core of this ecosystem, communication modules serve as the vital link between the physical and digital realms. Their performance directly shapes the efficiency, stability, and security of IoT systems, handling everything from collecting sensor data to transmitting it wirelessly to the cloud or end devices—powering critical functions like remote monitoring and data analysis.　　With the rapid expansion of IoT applications, storage components within communication modules face heightened challenges. They must excel in high-bandwidth data transmission, multitasking concurrency, continuous data streaming over extended periods, efficient and stable data read/write operations, data security protection, and system compatibility to ensure real-time transmission and secure storage of critical data.　　In response to these industry challenges head-on, BIWIN draws on its “integrated R&D and packaging” expertise, along with its expertise from markets such as smartphones and smart wearables, to offer a comprehensive storage solution product matrix for communication modules, including eMMC, LPDDR, eMCP, uMCP, and more. These products have been widely applied to power 5G/4G and smart modules from industry leaders like Quectel, Fibocom, and MeiG Smart, providing solid foundations for the efficient and reliable operations of communication networks.　　01 Tackling Tough Scenarios with Top-Notch Storage　　In practical deployments across fields such as smart metering, industrial applications, routers, automotive systems, and POS machines, communication modules face numerous challenges. Particularly in outdoor environments, harsh weather, extreme temperatures, humidity fluctuations, prolonged continuous operation, and electromagnetic interference can all impact module performance. Any data loss or delay could result in IoT system failures or degraded service quality.　　Taking specific IoT application scenarios as an example, in surveillance systems requiring uninterrupted high-definition video recording, storage components must maintain stable, high-speed read/write performance. To meet these demanding requirements, BIWIN’s storage chips are featured with custom-designed firmware architectures, dynamic SLC caching and unique direct-write solutions, and firmware optimizations for garbage collection and data encryption, contributing to the consistently stable data read/write operations. Testings show that BIWIN’s eMMC products achieve full-disk write speeds exceeding 15MB/s with performance fluctuations below 5%, perfectly aligning with IoT-specific application standards. Additionally, BIWIN’s storage chips support remote firmware upgrades for communication modules, enhancing device operational efficiency.　　On the reliability front, BIWIN’s chips are loaded with cutting-edge packaging technologies like multi-layer die stacking, ultra-thin dies, and heterogeneous multi-chip integration, capable of realizing a perfect balance among performance, durability, and heat management. Meanwhile, the chips have also been tested with rigorous processes, covering electrical testing, signal integrity (SI) testing, reliability testing, and application testing. These chips can withstand gravitational acceleration up to 1500G, vibration amplitudes of 20-2000Hz, and achieve a mean time between failures (MTBF) exceeding 1.5 million hours, ensuring high-quality delivery and consistency across all aspects.　　02 Building a Comprehensive Product Matrix to Provide Efficient and Reliable Storage Support　　With key attributes such as highly stable read/write performance, exceptional reliability and durability, and excellent compatibility, BIWIN’s eMMC, LPDDR4X, eMCP3/4x, and uMCP2.2 series products have earned certifications from mainstream SoC platforms like Qualcomm, MediaTek, and Unisoc. They have been integrated into the supply chains of multiple renowned communication module manufacturers, continuously empowering the stable operation of communication modules.　　In conclusion　　As technologies such as AI, edge computing, 5G/6G, and LPWAN become deeply integrated, the IoT will evolve into more mature and diverse forms, permeating all aspects of life and generating immense demand for data computation, processing, transmission, and storage. Facing this trend, BIWIN will capitalize on its comprehensive strengths in R&D, controller design, packaging and testing, and supply chain management to deepen collaboration with communication module vendors and platform providers, fully addressing the multidimensional customization needs of edge-side communication modules for storage performance, reliability, and stability and jointly accelerating the expansion of IoT application boundaries.
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Release time：2025-03-13 11:40 reading：346 Continue reading>>
Fibocom Fosters Local 5G AIoT Market with Newly Launched 5G <span style='color:red'>Module</span> FG370-KR at AIoT Korea 2024
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Fibocom Fosters Local 5G AIoT Market with Newly Launched 5G Module FG370-KR at AIoT Korea 2024

　　wireless communication modules, announces the launch of FG370-KR, a regional version of the FG370 series module, which is positioned to accelerate the commercial development of Korean’s 5G AIoT industries such as Fixed Wireless Access (FWA), live streaming, and industrial automation, etc. By adopting the advancements from FG370-KR, the solution allows local customers to benefit from the seamless 5G experience and fast-to-market industry solutions.　　5G subscribers in South Korea reached around 33 million as of the end of March 2024, according to the latest report from Statista. SK Telecom accounted for 15.9 million of the total 5G subscribers, followed by KT with 9.9 million and LG U+ with 7.2 million. At present, the country accelerates the rollout of commercial 5G services to industry-related field and shows strong growing trends. Fibocom's 5G Sub-6GHz module FG370-KR is compatible with Korea's mainstream 5G frequency bands, supports both 5G SA and NSA network architecture, making it an ideal 5G solution for industry customers that require high-transmission speed, large capacity, and ultra-low latency.　　Developed from the MediaTek T830 chipset platform, the FG370-KR is a 3GPP Release 16 compliant module that adopts a 4nm process integrated with an Arm Cortex-A55 quad-core CPU, leading to a 10% improvement in speed performance compared to the previous generation. In terms of data transmission, FG370-KR supports NR 4CA (Carrier Aggregation) with up to 300MHz bandwidth on the downlink, and NR 2CA in FDD and TDD hybrid mode on the uplink, reaches a maximum speed of up to 7.01Gbps DL and 1.25Gbps UL. In addition, it also supports PC2 of HPUE (High Power User Equipment) technology, significantly enhances 5G uplink capability and network coverage. It is worth highlighting that, FG370-KR can greatly reducing the time-to-market of customers’ devices with the support of a wide range of peripheral interfaces, including three PCI-Express, USB 3.2, two USXGMII interfaces along with software features such as Kernel, OpenWRT drivers.　　“The launch of the FG370-KR signifies that Fibocom will provide a Korea-dedicated solution for local customers, boosting the 5G adoption towards a larger-scale of industries with optimal network connectivity and enhanced operational efficiency, said Simon Tao, VP of Product Management Dept., Head of MBB BU at Fibocom. “We have the confidence in helping enterprises to accomplish the 5G commercialization with our industry know-how and expertise accumulated, without doubt, Korea’s 5G deployment will keep experiencing a fast-growing rate and Fibocom will continually invest in cutting-edge 5G module solutions and delivering superior wireless experience.”　　To learn more about 5G Sub-6GHz module and its demos, welcome to visit Fibocom booth #G101 on the 3rd Floor of Hall D in COEX at the AIoT Korea from October 30 to November 1 2024.
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Release time：2024-12-13 10:55 reading：824 Continue reading>>
NOVOSENSE Launches Automotive-Grade High-Side Switches for Body Control <span style='color:red'>Module</span>s and Zone Control Units
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NOVOSENSE Launches Automotive-Grade High-Side Switches for Body Control Modules and Zone Control Units

　　NOVOSENSE Microelectronics, a semiconductor company specializing in high-performance analog and mixed-signal chips, has announced a range of high-side switches for driving traditional resistive, inductive, and halogen lamp loads in automotive body control modules (BCM) as well as large capacitive loads commonly found in the first-level and second-level power distribution within zone control units (ZCU).　　At time of launch, the NSE34 and NSE35 families includes 26 single-, dual- and quad-channel devices developed for operation across 11 separate load currents intervals (11 A to sub-2 A). These devices have an Rds(on) resistance range from 8 mΩ to 140 mΩ and feature industry-leading load-driving capabilities and advanced diagnostic and protection functions such as advanced over-current protection and over-voltage clamping protection.　　All devices in the two families are fully compliant with multiple automotive standards, including AEC-Q100, AEC-Q100-006, AEC-Q100-012 Grade A, ISO7637, ISO16570 and CISPR25-2021 Class 5.　　Yang WANG, Product Line Marketing Director of NOVOSENSE said: “For electric and autonomous vehicles, body domain controllers have become increasingly important, enabling smart power distribution and functional integration. Indeed, they are essential for many applications, whether in resistive loads such as a seat heater, capacitive or halogen lamp loads for surge-current handling, or inductive loads such as in wipers, solenoids and relays, where it protects against negative voltage spikes.”　　The NSE34 and NSE35 families of high-side switches are available in 14- and 16-pin HSSOP packages measuring 4.9mm x 3.9mm respectively.
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Release time：2024-11-06 14:11 reading：1051 Continue reading>>
Murata’s Type 1SC-NTN module achieves Skylo U.S. certification for cellular and non-terrestrial network connectivity
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Murata’s Type 1SC-NTN module achieves Skylo U.S. certification for cellular and non-terrestrial network connectivity

　　Murata announced today that its Type 1SC-NTN has received Skylo U.S. certification for its dual-mode cellular and non-terrestrial network (NTN) capabilities, making it the first ultra-compact resin mold module to achieve this recognition from an NTN service provider. The product seamlessly integrates the latest Rel-17 NTN standard, enabling satellite data communication capabilities without necessitating any hardware design changes. When paired with Skylo's NTN service, it extends the reach of satellite connectivity, ensures uninterrupted communication, and delivers a new class of solution for the demanding satellite IoT market.　　Murata’s Type 1SC is the world’s smallest form factor LTE Cat M/NB-IoT module with both global regulatory and NTN certification. It supports GPS/GNSS, OpenMCU, and Integrated SIM to support the applications that are defining today’s market, such as dual-mode cellular IoT. In addition to its unmatched size, low power, and cost-efficiency, its high level of integration accelerates time to market while lowering development and deployment costs for customers. Target uses include wearable, tracking, and medical monitoring devices, as well as M2M communication, smart meters, and other size-limited IoT edge products.
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Release time：2024-10-15 13:19 reading：493 Continue reading>>
Renesas Launches Ultra-Compact Sensor <span style='color:red'>Module</span> for Smart Air Quality Monitoring at Homes, Schools and Public Buildings
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Renesas Launches Ultra-Compact Sensor Module for Smart Air Quality Monitoring at Homes, Schools and Public Buildings

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced an advanced all-in-one sensor module designed for indoor air quality monitoring. The RRH62000, the first multi-sensor air quality module from Renesas, integrates multiple sensor parameters in a compact design and accurately detects different particle sizes, volatile organic compounds, and gasses harmful to human health. With a Renesas microcontroller (MCU) on board, the module offers an intelligent sensor management solution for a growing market of air monitoring applications, including air purifiers, smoke detectors, HVAC systems, weather stations, and smart home systems. Its robust firmware also enables customer products to comply with various air quality standards around the world.　　The RRH62000 features one of the smallest footprints in its class of sensor modules, measuring only 46.6 x 34.8 x 12 mm. It packs Renesas’ RA Family MCU and seven sensor signals: the laser-based PM1/ 2.5/ 10 sensor, ZMOD4410 gas sensor, and the HS4003 humidity and temperature sensor. Together, these sensors can detect particulate matter, total volatile organic compounds (TVOC), estimated CO2, temperature, and humidity all in one system. All key components have been pre-integrated and fully calibrated at the factory, allowing developers to start their sensor system designs right out of the box.　　"Our RRH62000 module represents the next step in sensor fusion technology, which combines data from multiple sensors and turns it into comprehensive and actionable insights for environmental monitoring," said Uwe Guenther, Sr. Director, Modules and Solutions Product Line at Renesas. "We are dedicated to providing integrated sensing solutions that simplify development for customers and will continue to drive innovation in sustainable products that reduce environmental impact and enhance safety and comfort in our lives."　　Public interest in air quality and its effects on health has increased significantly since the COVID-19 pandemic. People are now more aware of how air pollutants can affect respiratory health and overall well-being. Less known is that pollutants are typically six to ten times more concentrated indoors than outdoors. These include dust, paint fumes, smoke from cooking, pollen, and particulates from HVAC filters, which can enter the respiratory system and cause lung damage, cancer, and other health problems.　　In order to meet these new challenges, Renesas’ new sensor module is equipped to monitor a broad range of air quality conditions. Using laser-based technology, which offers higher precision compared to conventional LED methods, it can monitor concentrations of PM1, PM2.5, and PM10 particulates -- particles with diameters of 0.3- to 10µm -- as well as absolute or relative TVOC measurements in different power mode settings, providing the highest level of accuracy for these pollutants. The RRH62000 delivers seven sensor outputs simultaneously, and its onboard MCU allows the system to detect surrounding air quality data in real time.　　The RRH62000 combo module comes with building standard firmware plus artificial intelligence (AI) algorithms, which lets engineers configure the sensors to conform to the requirements of various green air quality standards in public buildings, such as The Well Building Standard (WELL), Home Ventilating Institute (HVI) and RESET. With these features, for example, a school in China can use the same hardware as one in the U.S. or another location and simply update the AI-enabled firmware for its needs.　　Intelligent sensor devices, such as the Renesas RRH62000 and recently announced RRH46410 gas sensor module, can support demand-controlled ventilation, allowing HVAC systems to adjust airflow based on carbon dioxide levels and occupancy information to maintain optimal air quality and energy efficiency. Similarly, these modules use AI algorithms to predict when HVAC filters must be replaced or detect an anomaly before system failure occurs, significantly saving cost and time for system maintenance.　　Key Features of the RRH62000 All-in-One Sensor Module　　Up to 7 simultaneous sensor outputs　　Laser-based technology for accurate detection of PM1, PM2.5, PM10　　Metal oxide-based gas sensor　　Precise temperature and humidity sensor　　Absolute measurement of TVOC　　Estimated CO2 for low-cost CO2 room indication　　Ultra-compact size: 46.6 x 34.8 x 12mm to fit in many applications　　On-board MCU for smart sensor management　　Robust & Siloxane resistant　　Support I²C and UART communication　　Winning Combinations　　Renesas has combined the RRH62000 with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations. This includes the In-home Air Quality Monitoring System and Air Quality Monitor (PM2.5) with Secure Cloud Connection, which combine the RRH62000 with the RA6M3 and RL78/G14 MCUs, and various power devices to enable cost-efficient, compact, modular solutions for modern appliances. These Winning Combinations are technically vetted system architectures designed from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.　　Availability　　The RRH62000 is available today along with the RRH62000-EVK evaluation kit. The RRH46410 and the RRH46410-EVK are also available. Please contact your local sales teams for more details. A blog about the new air quality sensor module is also available on the Renesas website.
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Release time：2024-08-26 14:10 reading：1102 Continue reading>>
Power <span style='color:red'>Module</span> : Working Principle, Structural Features, and Process
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Power Module : Working Principle, Structural Features, and Process

　　A power module is an electronic device used to convert one form of electrical energy into another for supply to specific electronic systems or devices. It typically comprises an input terminal for receiving the raw power source (such as AC or DC) and one or more output terminals for providing converted and regulated electrical energy. This article summarizes the working principle, structural features, process flow, selection parameters, and design considerations of power modules.　　Working Principle of Power ModuleThe working principle of a power module is based on power electronics technology and control circuitry. Its core consists of switching power devices and control circuits. The following are detailed operational steps of power module operation:　　1. Input Voltage Conversion　　The power module first receives input voltage from the power line, typically AC.　　Next, through rectification circuitry using diodes or bridge rectifiers, AC is converted into pulsating DC.　　Subsequently, filtering circuits utilize capacitors to remove the pulsation, resulting in stable DC.　　2. Output Voltage Regulation　　The converted DC enters a voltage regulation circuit for voltage regulation.　　The voltage regulation circuit operates using feedback control. Specifically, it compares the difference between the output voltage and a reference voltage and controls the regulator’s operation based on this difference.　　Through this regulation, the output voltage is maintained at the set stable value.　　3. Role of Switching Power Devices　　During the power conversion process of the power module, switching power devices (such as MOSFETs, BJTs, IGBTs, etc.) play a crucial role.　　When the switching device is conducting, the power module can convert input energy into output energy. The primary function of the switching device is to achieve intermittent energy conversion to provide the required stable voltage or current.　　When the switching device receives an input or control signal, it generates corresponding switch signals to control its state.　　4. Role of Control Circuits　　Control circuits are another important component of the power module responsible for precise regulation and stabilization.　　Feedback circuits monitor changes in output voltage or current and send feedback signals to comparators. This allows the power module to adjust output energy promptly based on the feedback signal to meet various circuit requirements.　　5. Protection Mechanisms　　Power modules typically feature various protection mechanisms such as overload protection, overvoltage protection, and short circuit protection.　　Overload protection monitors the output current and limits or cuts off the output when the current exceeds a set value.　　Overvoltage protection monitors the output voltage and automatically cuts off the output power when the voltage exceeds a set value.　　Short circuit protection similarly operates by monitoring the output current. When a short circuit is detected, it promptly cuts off the power to prevent damage.　　Structural Features of Power ModuleThe structural features of power modules are summarized as follows:　　1. Modular Design　　Power modules typically employ modular design, making the entire power system more compact and efficient. Each module has independent functionality, allowing for flexible combinations and extensions based on actual needs. This facilitates users in customizing power solutions according to specific application scenarios.　　2. High Integration　　Power modules integrate numerous electronic components and circuits internally, such as transformers, rectifiers, and filters. The optimized design of these components and circuits endows the power module with high efficiency and stability.　　3. High Reliability　　Power modules undergo rigorous production processes and quality control, resulting in high reliability. Additionally, internal redundancy design and protection circuits effectively prevent damage to the system due to abnormal conditions such as power fluctuations, overcurrent, and overvoltage.　　4. Ease of Maintenance　　Due to the modular design of power modules, when a fault occurs, users can conveniently replace the faulty module, thereby reducing maintenance costs and time. Furthermore, the modular structure facilitates upgrades and modifications to the power system.　　Process Flow of Power ModuleThe production process of power modules involves multiple steps, from material preparation to final testing and quality inspection, with each step being crucial. Below is a simplified description of the operation process of power module production:　　1. Material Preparation and Bill of Materials (BOM) Verification　　Based on the design drawings of the power module and the BOM (Bill of Materials) list, prepare the required components, PCB boards, connecting wires, insulation materials, etc.　　Check the quantity, model, and specifications of the materials to ensure accuracy.　　2. PCB Board Processing and Component Soldering　　Clean and dry the PCB board to remove surface stains and moisture.　　According to the design drawings, solder the components onto the PCB board. Pay attention to soldering temperature and time control to avoid solder joints or poor soldering.　　3. Power Circuit Connection and Insulation Processing　　Based on the circuit diagram of the power module, connect the power input and output lines.　　Insulate exposed wires and connection points to ensure safety.　　4. Functional Testing and Performance Debugging　　Conduct functional testing on the power module to check if input and output voltage and current are normal.　　Based on the test results, perform performance debugging to optimize the efficiency of the power module.　　5. Overall Assembly and Enclosure Installation　　Assemble the soldered PCB board, connecting wires, and other components into a complete power module.　　Install the enclosure of the power module to ensure reliable fastening.　　6. Final Testing and Quality Inspection　　Conduct final testing on the assembled power module, including voltage stability, ripple coefficient, load capacity, and other indicators.　　According to quality inspection standards, screen and classify the power modules to ensure product quality.　　7. Packaging and Warehouse Entry　　Package the qualified power modules, indicating model, specifications, quantity, etc.　　Store the packaged power modules in the warehouse, awaiting shipment or subsequent use.　　Selection Parameters of Power ModuleDuring the process of selecting power modules, it is essential to consider a series of key parameters to ensure that the chosen power module can meet specific application requirements. Below is a detailed consideration of these parameters:　　1. Input Voltage Range　　Firstly, it is necessary to determine the input voltage range of the power module, i.e., the range within which it can operate normally. This depends on the power supply situation in the application, such as battery-powered or AC grid-powered. Ensure that the selected module can adapt to the existing input voltage and maintain stability during voltage fluctuations.　　2. Output Voltage and Current　　The output voltage and current of the power module are critical parameters to meet load requirements. Depending on the power consumption and characteristics of the load, choose appropriate output voltage and current levels. Also, consider whether the current output capacity of the power module is sufficient to handle the startup impact of the load and the current requirements during normal operation.　　3. Efficiency and Power Consumption　　Efficiency is the ability of the power module to convert electrical energy, i.e., the ratio of output power to input power. High efficiency means less energy loss and lower heat generation. Additionally, pay attention to the module’s power consumption, especially during standby or light load, to optimize energy use.　　4. Ripple and Noise　　Ripple refers to the AC component in the output voltage, while noise is the interference signal generated by the power module. These parameters are crucial for sensitive applications such as signal processing or measurement equipment. Therefore, when selecting, ensure that the ripple and noise levels of the selected module are below the system’s acceptable threshold.　　5. Temperature Range　　The operating temperature range of the power module is also a factor to consider. In extreme temperature environments, the performance and reliability of the module may be affected. Therefore, choose a module that can operate stably within the temperature range of the application.　　6. Reliability and Lifespan　　The reliability and expected lifespan of the power module are important indicators for assessing its long-term performance. When choosing, consider the module’s MTBF (Mean Time Between Failures) and the manufacturer’s provided warranty period.　　7. Size and Packaging　　The size and packaging of the power module are also factors to consider during the selection process. Ensure that the selected module can fit within the space constraints of the application and is easy to integrate into existing systems.　　8. Certification and Compliance　　The selected power module should comply with relevant safety standards and regulatory requirements, such as UL, CE, etc. This helps ensure the safety and compliance of the power module.　　9. Cost　　Last but equally important is cost consideration. While meeting all performance requirements, strive to choose a cost-effective power module to optimize the overall cost-effectiveness of the system.　　During the design and use of power modules, the following operational issues should be noted:I. Design Phase Considerations1. Clarify Requirements and Specifications　　Before designing the power module, clarify the system’s requirements for power, including voltage, current, power, efficiency, and other specifications.　　Fully consider the working environment of the module, such as temperature, humidity, vibration, and other factors that may affect the performance of the power supply.　　2. Select Appropriate Topology　　Choose the appropriate power supply topology according to the requirements, such as linear power supply, switching power supply, etc., to achieve high efficiency, stability, and reliability.　　3. Optimize Circuit Layout and Wiring　　Reasonably layout circuit components to reduce interference and losses.　　Adopt the principle of wide and short wiring to reduce resistance and inductance, thereby improving power supply efficiency.　　4. Redundancy and Protection Design　　Consider redundancy design for the power module to improve system reliability and stability.　　Design overvoltage, overcurrent, overheating, and other protection measures to prevent module damage or safety accidents.　　5. Electromagnetic Compatibility (EMC) Design　　Consider the electromagnetic compatibility of the power module and use filtering, shielding, and other technologies to reduce interference with other devices.　　II. Considerations During Use1. Proper Installation and Connection　　Follow the manufacturer’s installation guide to ensure the power module is installed correctly and securely fixed.　　Carefully inspect the connections of input and output terminals to ensure good contact, no looseness, or short circuits.　　2. Adjust Parameters Reasonably　　According to actual needs, set the voltage, current, and other parameters of the power module reasonably to avoid overloading or underloading.　　Regularly check parameter settings to ensure consistency with actual requirements.　　3. Monitoring and Maintenance　　Regularly conduct status checks on the power module, including monitoring parameters such as voltage, current, and temperature.　　If any abnormal conditions are detected, take timely measures to address them, such as cleaning dust or replacing damaged components.　　4. Heat Dissipation and Working Environment　　Pay attention to the impact of electromagnetic interference and mechanical vibration in the working environment on the power module and take corresponding measures for protection.　　5. Training and Operational Standards　　Provide training for personnel using the power module to ensure they understand the working principle, operation methods, and safety precautions of the module.　　Establish operational standards to ensure that personnel operate in accordance with the standards, avoiding problems caused by improper operation.
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Release time：2024-08-22 13:33 reading：481 Continue reading>>
Panasonic Industrial Devices PAN9019/PAN9019A Wi-Fi® Dual Band Wireless <span style='color:red'>Module</span>s
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Panasonic Industrial Devices PAN9019/PAN9019A Wi-Fi® Dual Band Wireless Modules

　　Panasonic Industrial Devices PAN9019/PAN9019A Series Wi-Fi® 6 Dual Band 2.4GHz to 5GHz and BLUETOOTH® 5.4® Modules are wireless radio modules with integrated Bluetooth BDR/EDR/Low Energy (LE). These modules are designed for highly integrated and cost-effective applications requiring high data rates and low power consumption. The PAN9019/PAN9019A features integrated power management, a dual-core CPU, 802.11i security standard support, and high-speed data interfaces. The modules provide a combination of Wi-Fi, Bluetooth, and 802.15.4 wireless connectivity, allowing for high throughput applications and enhanced flexibility. Panasonic Industrial Devices PAN9019/PAN9019A Series Wi-Fi 6 Dual Band 2.4GHz to 5GHz and Bluetooth 5.4 Modules are available in an M.2 form factor for use with host processors as an evaluation tool using an M.2 Key E socket.FEATURES　　Dual-band 2.4GHz to 5GHz 802.11a/b/g/n/ac/ax Wi-Fi, Bluetooth, and 802.15.41 combo module　　Supports WPA3 security　　Secured boot and firmware　　802.11e quality of service supported for multimedia application　　IEEE 802.11ax, 1x1 spatial stream with up to 600Mbps data rate　　OFDMA (UL/DL) and MU-MIMO (UL/DL)　　Bluetooth 5.4 (LE and long range)　　WCI-2- and 5-wire PTA coexistence interfaces　　SDIO 3.0, high-speed UART, and SPI2 for host processor connection general interfaces　　OS driver support for RTOS, Linux, and Android　　Available in M.2 form for evaluation with host processor using an M.2 Key E socket　　SPECIFICATIONS　　PAN9019　　NXP IW611 WLAN 2.4GHz and 5GHz, Bluetooth single-chip solution inside　　PAN9019A　　NXP IW612 WLAN 2.4GHz and 5GHz, Bluetooth and 802.15.4 single-chip solution inside　　15.3mm x 12mm x 2.5mm SMT package size　　-98dBm Rx sensitivity at IEEE 802.11b　　IEEE 802.11ax 20MHz, 40MHz, 80MHz channel bandwidth　　1.8V to 3.3V power supply range　　-40°C to +85°C operating temperature range　　BLOCK DIAGRAM　　PRODUCT OVERVIEW
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Release time：2024-07-15 14:05 reading：901 Continue reading>>

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