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ROHM Launches 2-in-1 SiC Molded <span style='color:red'>Module</span> “DOT-247”

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ROHM Launches 2-in-1 SiC Molded Module “DOT-247”

　　ROHM has developed the "DOT-247," a 2-in-1 SiC molded module (SCZ40xxDTx, SCZ40xxKTx), ideal for industrial applications such as PV inverters, UPS systems, and semiconductor relays. The module retains the versatility of the widely adopted "TO-247" package while achieving high design flexibility and power density.　　The DOT-247 features a combined structure consisting of two TO-247 packages. This design enables the use of large chips, which were structurally difficult to accommodate in the TO-247 package, and achieves low on-resistance through an unique internal structure. Additionally, through optimized package structure, thermal resistance has been reduced by approximately 15% and inductance by approximately 50% compared to the TO-247. This enables a power density 2.3 times higher than the TO-247 in a half-bridge configuration –achieving the same power conversion circuit in approximately half the volume.　　The new products featuring the DOT-247 package are available in two topologies: half-bridge and common-source. Currently, two-level inverters are the mainstream in PV inverters, but there is growing demand for multi-level circuits such as three-level NPC, three-level T-NPC, and five-level ANPC to meet the need for higher voltages. In the switching sections of these circuits, topologies such as half-bridge and common-source are mixed –making custom products necessary in many cases when using conventional SiC modules.　　To address this challenge, ROHM has developed each of these two topologies—the smallest building blocks of multi-level circuits—into a 2-in-1 module. This enables flexibility to support various configurations such as NPC circuits and DC-DC converters, while significantly reducing the number of components and mounting area, and achieving circuit miniaturization compared to discrete components.　　Evaluation boards will also be made available progressively to facilitate evaluation during application design. For more information, please contact a sales representative or visit the contact page on ROHM’s website.　　Product Lineup　　☆:Under Development　　AEC-Q101 is an automotive electronics reliability standard established by the Automotive Electronics Council (AEC).　　The Q101 standard is specifically focused on discrete semiconductor components.　　Application Examples　　PV inverters, semiconductor relays, UPS (uninterruptible power supply), ePTO, and boost converters for FCVs (fuel cell vehicles).　　AI servers (eFuse), EV charging stations, etc.　　Sales Information　　Pricing: $140/unit (samples, excluding tax)　　Availability: ROHM construct mass production (September 2025)　　Products compliant with the automotive reliability standard AEC-Q101 are scheduled to begin sample shipments in October 2025.　　Comprehensive Support　　ROHM is committed to providing application-level support, including the use of in-house motor testing equipment. A variety of supporting materials are also offered, such as simulations and thermal designs that enable quick evaluation and adoption of DOT-247 products. An evaluation kit for double-pulse testing is already available, allowing immediate testing, while an evaluation kit for 3-phase inverters is currently under preparation, with reference designs scheduled to be released from November 2025.　　• About the DOT-247 design models　　SPICE models: Available on the product web pages for each part number　　LTspice® models: Scheduled to be available for three-level NPC from October 2025 on the web pagesLTspice® is a registered trademark of Analog Devices, Inc.When using third-party trademarks, please adhere to the usage guidelines specified by the rights holder.　　For details, please contact a sales representative or visit the contact page on ROHM’s website.　　EcoSiC™ Brand　　EcoSiC™ is a brand of devices that utilize silicon carbide (SiC), which is attracting attention in the power device field for performance that surpasses silicon (Si). ROHM independently develops technologies essential for the evolution of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, we have established an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.• EcoSiC™ is a trademark or registered trademark of ROHM Co., Ltd.　　Terminology　　Half-bridge/ Common-source　　A basic configuration of a power conversion circuit consisting of two MOSFETs. In a half-bridge configuration, the MOSFETs are connected in series, one above the other, and the output is taken from the connection point. By switching the upper and lower MOSFETs alternately, the output voltage can be switched between positive and negative, making this configuration widely used as the basic structure for high-efficiency power conversion in inverters and motor drive circuits.　　Common Source is a configuration where the source terminals of the two MOSFETs are connected, and the output is taken from each drain. By grouping the source terminals, the gate drive circuit can be simplified, making it suitable for applications such as multilevel inverters.　　Types of NPC-type multi-level circuits　　NPC (Neutral Point Clamped) is a multi-level circuit configuration that divides the output voltage into three levels (+, 0, and -) to reduce voltage stress on the switching devices. The "0V" state is created by the neutral point, which is the contact point located between the positive and negative voltages.　　T-NPC (T-type NPC) replaces the diode used to stabilize the neutral point with switching devices such as MOSFETs, enabling more efficient operation. ANPC (Active NPC) actively controls the potential of the neutral point itself using a switch, achieving smoother output waveforms and high-precision power conversion. T-NPC and ANPC are suitable for applications requiring higher output and efficiency.　　ePTO (electric Power Take-Off)　　A system that uses the power from an electric vehicle's motor or battery to drive external work machinery or equipment (such as hydraulic pumps or compressors). This is an electrified version of the PTO (Power Take-Off) used in conventional engine vehicles, and its adoption is advancing in environmentally friendly commercial vehicles and work vehicles.

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ROHM

Release time：2025-09-17 13:11 reading：447 Continue reading>>

Murata Launches iSIM IoT <span style='color:red'>Module</span> with Built-In Global Connectivity from 1NCE

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Murata Launches iSIM IoT Module with Built-In Global Connectivity from 1NCE

　　Murata today introduced a new iSIM-compatible LPWA module, the Type 1SC, pre-integrated with out-of-the-box connectivity from 1NCE, one of the world’s fastest-growing IoT companies. The collaboration delivers simplified, scalable global connectivity, making it easier to launch and manage low-power IoT devices. Optimized for low-power, low-data applications, the solution comes bundled with 50 MB of data and optional top-ups, enabling rapid, cost-effective deployment for applications such as asset tracking, fleet management, and healthcare monitoring. Supporting both LTE-M and NB-IoT, the module offers broad compatibility across networks in 173 countries.　　By embedding 1NCE’s cloud-based connectivity directly into the module, Murata eliminates the need for separate SIM provisioning, streamlining the design and manufacturing process for compact, energy-efficient devices. The result is a faster, more reliable path to market. Additionally, with over 30 million devices managed across 23,000+ customers, its platform simplifies lifetime IoT connectivity – bringing seamless integration, global reach, and built-in scalability to the next generation of connected products.　　“Murata’s Type 1SC module represents our commitment to driving innovation in the IoT space,” said Hiro Hyogo, Senior Manager, Corporate Technology and Innovation at Murata Americas. “By having connectivity pre-installed on our modules, we’re reducing the complexities and costs associated with global IoT deployments while ensuring strong security and performance.”　　"IoT will be dominated by software players, which is why Murata chose and trusted in 1NCE," said Fabian Kochem, Head of Global Product Strategy at 1NCE. “The supply chain of IoT is bloated, but our two companies save our customers time and money.”

Key word：

Murata

Release time：2025-08-13 15:33 reading：524 Continue reading>>

Fibocom Unveils the First LTE Cat.1 bis <span style='color:red'>Module</span> L610-IN with IRNSS and NAVIC for India

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Fibocom Unveils the First LTE Cat.1 bis Module L610-IN with IRNSS and NAVIC for India

　　Fibocom (Stock code:300638), a global leading provider of AIoT solutions and wireless communication modules, launched the L610-IN, the first LTE Cat.1 bis module that supports dual-mode, dual-frequency positioning technology with IRNSS (Indian Regional Navigation Satellite System) and NAVIC. With its precise positioning capabilities, high compatibility, and adaptability to various IoT scenarios, the L610-IN provides an efficient and cost-effective connectivity solution for the Indian IoT market. It fully complies with the AIS140 standard, empowering intelligent transformation in key sectors such as fleet management and electronic toll collection (eToll).　　The L610-IN integrates innovative IRNSS and NAVIC dual-mode, dual-frequency positioning functionality, significantly enhancing positioning accuracy and stability in India and neighboring regions. It effectively addresses the challenge of insufficient navigation signal coverage in complex environments. The module strictly adheres to the AIS140 regulations in India, ensuring compliance for applications like vehicle tracking and eToll collection, making it the ideal communication solution for smart transportation and logistics industries.　　The L610-IN features a compact LCC+LGA package with dimensions of 31mm x 28mm and is pin-to-pin compatible with Fibocom's LTE Cat.4 modules NL668/L716. This design enables customers to seamlessly transition between communication technologies while minimizing hardware modification costs. Supporting LTE/GSM networks, the module is ideal for mid-to-low-speed applications such as smart payment, shared economy, industrial IoT, asset tracking, and aftermarket automotive solutions. With additional features like VoLTE HD voice, camera support, LCD display, and multiple sensor interfaces (USB/UART/SPI/I2C/SDIO), the L610-IN delivers flexible and secure end-to-end connectivity for industry clients.　　In addition to the L610-IN for the Indian market, Fibocom has also introduced the L610-EU for Europe and the L610-LA for Latin America, covering major global operator frequency bands. These variants cater to seamless positioning and long-distance communication needs, further expanding the boundaries of smart city and intelligent tracking applications.　　The L610-IN is expected to begin CS in Q2 2025. With its high cost-efficiency and localized service capabilities, the module will accelerate the development of India's IoT ecosystem.　　Ragin Kallanmar Thodikai, Country Sales Manager of India at Fibocom, stated:　　"The launch of the L610-IN bridges the gap in the Indian market for high-precision Cat.1 bis modules while simplifying customer upgrades through technology compatibility, accelerating the global deployment of mid-to-low-speed IoT solutions."

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Fibocom

Release time：2025-07-17 16:25 reading：649 Continue reading>>

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Fibocom Debuts 5G Module FG390 Powered by MediaTek T930 Platform, Accelerating FWA Innovation with the Convergence of 5G-A and AI

　　Fibocom, a global leading provider of wireless communication modules and AI solutions, announces the launch of its 5G module FG390, developed on the advanced MediaTek T930 platform. Designed specifically for mobile broadband (MBB) terminal products focused on 5G Fixed Wireless Access (FWA), the FG390 series seeks to boost FWA industry growth across diverse applications such as CPEs, ODUs, mobile hotspot devices, enterprise gateways, and industrial gateways.　　FG390 is a highly integrated, high-performance 5G module built on MediaTek’s advanced T930 chipset, featuring cutting-edge 4nm process technology. It incorporates the MediaTek M90 5G modem alongside a quad-core ARM Cortex-A55 CPU, delivering robust functionality and full compliance with 3GPP Release 18 standards. Supporting downlink 6-carrier aggregation (6CC CA) and uplink 5-layer 3Tx transmission within the 5G NR Sub-6GHz spectrum, the FG390 achieves peak standalone (SA) downlink speeds of up to 10 Gbps and uplink speeds reaching 2.8 Gbps, providing an outstanding high-speed 5G experience. Furthermore, with 200MHz bandwidth and 8Rx technology, the module significantly enhances spectrum efficiency about 40% at cell edges, greatly extending signal coverage. Paired with a dedicated NPU chip, the FG390 powers AI-enabled gateway devices to offer advanced, intelligent network interaction capabilities.　　Amid the swift convergence of 5G-A and AI technologies, the FG390 series harnesses cutting-edge specifications, innovative features, and a comprehensive suite of peripherals to drive digital transformation and continuous innovation across both residential and enterprise applications. This breakthrough empowers telecom operators and the broader market to enhance investment efficiency and accelerate returns in the communications terminal sector.　　Leveraged by the MediaTek T930 platform, the FG390 seamlessly integrates robust 5G Release 18 protocol capabilities with exceptional cellular performance and AI-driven intelligence, setting a new benchmark for the next generation of mobile broadband terminals. Enhanced by a dedicated NPU for AI acceleration, this module empowers transformative applications across smart offices, smart homes, and smart cities. Fibocom remains dedicated to deepening the collaboration with MediaTek to drive continuous innovation in 5G technologies, products, and ecosystem development.

Key word：

Fibocom

Release time：2025-07-17 16:21 reading：610 Continue reading>>

Semikron Danfoss’ <span style='color:red'>Module</span> with ROHM’s latest 2kV SiC MOSFETs Integrated into SMA’s Large Scale Solar System

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Semikron Danfoss’ Module with ROHM’s latest 2kV SiC MOSFETs Integrated into SMA’s Large Scale Solar System

　　SMA Solar Technology AG, a leading global specialist in photovoltaic and storage system technology, adopts Semikron Danfoss’ Module with ROHM’s latest 2kV SiC MOSFETs inside its new large scale solar system “Sunny Central FLEX”, a modular platform designed to streamline and enhance grid connections for large-scale photovoltaic installations, battery storage systems, and emerging technologies.　　“ROHM’s new 2kV class SiC MOSFETs are designed to enable simple and highly efficient converter topologies for 1500V DC-links. It is developed with high reliability targets and cosmic radiation robustness – addressing the stringent conditions and extended converter lifetime requirements of the photovoltaic sector and beyond,” says Wolfram Harnack, President at ROHM Semiconductor GmbH. “The technology of our SiC device structure and integrated on-chip gate resistance eases device paralleling and simplifies high power module designs. The mass production has started,” adds Harnack.　　Semikron Danfoss’ SEMITRANS® 20 has designed for high power applications and fast-switching operations, it represents the next generation of power modules for large converters. SEMITRANS® 20 with ROHM’s 2kV SiC MOSFETs is an integral part of SMA’s Sunny Central FLEX. “Semikron Danfoss and ROHM have collaborated for over a decade, focusing primarily on the implementation of silicon carbide (SiC) in power modules. More recently, we have teamed up to integrate silicon IGBTs as well”, says Peter Sontheimer, Senior Vice President of Semikron Danfoss’ Industry division.　　“The new SEMITRANS® 20 offers simple, efficient solutions for 1500VDC applications. These modules are ideal for solar and energy storage inverters. Upcoming high-power electric truck chargers, as well as wind converters, will also benefit,” adds Sontheimer.　　"The cooperation between SMA, Semikron Danfoss and ROHM is proof of how the seamless integration of innovative technologies creates the conditions for future-oriented energy projects," said Bernd Gessner, Product Manager Power Conversion Systems at SMA. "The demands on these solutions are higher than ever. SMA has decades of expertise and fulfills the highest requirements in terms of performance, reliability, durability and flexibility. The fact that Sunny Central FLEX meets these highest future-proof standards is also the result of the excellent cooperation with our partners who share the same commitment to excellence."　　About SMA Solar Technology AG As a leading global specialist in photovoltaic and storage system technology, the SMA Group is setting the standards today for the decentralized and renewable energy supply of tomorrow. SMA’s portfolio contains a wide range of efficient PV and battery inverters, holistic system solutions for PV and battery-storage systems of all power classes, intelligent energy management systems and charging solutions for electric vehicles and power-to-gas applications. Digital energy services as well as extensive services round off SMA’s range. SMA inverters installed throughout the world within the last 20 years with a total output of approximately 144 GW help avoid the emission of more than 64 million tons of CO2. SMA’s multi-award-winning technology is protected by more than 1,600 patents and utility models. Since 2008, the Group’s parent company, SMA Solar Technology AG, has been listed on the Prime Standard of the Frankfurt Stock Exchange (S92) and is listed on the SDAX index.　　About Semikron Danfoss Semikron Danfoss is a global technology leader in power electronics. Our product offerings include semiconductor devices, power modules, stacks and systems. In a world that is going electric, Semikron Danfoss technologies are more relevant than ever. With our innovative solutions for automotive, industrial and renewable applications we help the world utilize energy more efficiently and sustainably and thus to significantly reduce overall CO2 emissions – facing one of the biggest challenges today. We take care of our employees and create value for our customers by investing significantly in innovation, technology, capacity and service to deliver best-in-industry performance and for a sustainable future. Semikron Danfoss is a family-owned business, merged by SEMIKRON and Danfoss Silicon Power in 2022. We employ more than 3,500 people in 28 locations across the world. Our global footprint with production sites in Germany, Brazil, China, France, India, Italy, Slovakia and the United States ensures an unmatched service for our customers and partners. We offer more than 90 years of combined expertise in power module packaging, innovation and customer applications – making us the ultimate partner in power electronics.

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ROHM

Release time：2025-04-29 10:49 reading：583 Continue reading>>

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ROHM Develops New High Power Density SiC Power Modules Compact high heat dissipation design sets a new standard for OBCs

　　ROHM has developed the new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for PFC and LLC converters in onboard chargers (OBC) for xEVs (electric vehicles). The lineup includes six models rated at 750V (BSTxxx1P4K01) and seven products rated at 1200V (BSTxxx2P4K01). All basic circuits required for power conversion in various high-power applications are integrated into a compact module package, reducing the design workload for manufacturers and enabling the miniaturization of power conversion circuits in OBCs and other applications.　　In recent years, the rapid electrification of cars is driving efforts to achieve a decarbonized society. Electric vehicles are seeing higher battery voltages to extend the cruising range and improve charging speed, creating a demand for higher output from OBCs and DC-DC converters. At the same time, there is an increasing need in the market for greater miniaturization and lighter weight for these applications, requiring technological breakthroughs to improve power density - a key factor - while enhancing heat dissipation characteristics that could otherwise hinder progress. ROHM’s HSDIP20 package addresses these technical challenges that were previously becoming difficult to overcome with discrete configurations, contributing to both higher output and the downsizing of electric powertrains.　　The HSDIP20 features an insulating substrate with excellent heat dissipation properties that suppresses the chip temperature rise even during high power operation. When comparing a typical OBC PFC circuit utilizing six discrete SiC MOSFETs with top-side heat dissipation to ROHM’s 6-in-1 module under the same conditions, the HSDIP20 package was verified to be approx. 38°C cooler (at 25W operation). This high heat dissipation performance supports high currents even in a compact package, achieving industry-leading power density more than three times higher than top-side cooled discretes and over 1.4 times that of similar DIP type modules. As a result, in the PFC circuit mentioned above, the HSDIP20 can reduce mounting area by approx. 52% compared to top-side cooled discrete configurations, greatly contributing to the miniaturization of power conversion circuits in applications such as OBCs.　　Going forward, ROHM will continue to advance the development of SiC modules that balance miniaturization with high efficiency while also focusing on the development of automotive SiC IPMs that provide higher reliability in a smaller form factor.　　Product Lineup　　*1: Tc=25°C VGS=18V *2: Combines chips with different ON resistances　　*3: Q1, Q4 pins *4: Q2, Q3, Q5, Q6 pins　　Application Examples　　Power conversion circuits like PFC and LLC converters are commonly used in the primary side circuits of industrial equipment, allowing the HSDIP20 to also contribute to the miniaturization of applications in both the industrial and consumer electronics fields.　　◇ Automotive systems　　Onboard chargers, electric compressors and more.　　◇ Industrial equipment　　EV charging stations, V2X systems, AC servos, server power supplies, PV inverters, power conditioners, etc.　　Sales Information　　Pricing: $100/unit (samples, excluding tax)　　Availability: OEM quantities (April 2025)　　Supporting Information　　ROHM is committed to providing application-level support, including the use of in-house motor testing equipment. A variety of supporting materials are also offered such as simulations and thermal designs that enable quick evaluation and adoption of HSDIP20 products. Two evaluation kits are available as well, one for double-pulse testing and the other for 3-phase full bridge applications, enabling evaluation under close to actual circuit conditions.　　For more information, please contact AMEYA360 or visit the contact page on ROHM’s website.　　EcoSiC™ Brand　　EcoSiC™ is a brand of devices that utilize silicon carbide, which is attracting attention in the power device field for performance that surpasses silicon. ROHM independently develops technologies essential for the advancement of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, we have established an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.　　・EcoSIC™ is a trademark or registered trademark of ROHM Co., Ltd.　　Terminology　　Power Factor Correction (PFC)　　A circuit that enhances the power factor by shaping the waveform of input power in the power supply circuit. By using a PFC circuit, the input power is made closer to a sine wave (power factor = 1), improving power conversion efficiency. While PFC circuits typically rely on diode rectification, OBCs often employ active bridge rectification using MOSFETs or bridgeless PFC. This approach is favored because MOSFETs offer lower switching losses, and especially in high power PFCs, using SiC MOSFETs reduces heat generation and power losses.　　LLC Converter　　A type of resonant DC-DC converter known for its high efficiency with low noise power conversion. The name LLC comes from its basic configuration, which combines two inductors (L) and a capacitor (C) in the circuit. By forming a resonant circuit, switching losses are significantly reduced, making it ideal for applications requiring high efficiency, such as OBCs, power supplies for industrial equipment, and server power supplies.

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ROHM

Release time：2025-04-24 17:23 reading：498 Continue reading>>

Murata Type 2FR Hostless Tri-Radio <span style='color:red'>Module</span>

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Murata Type 2FR Hostless Tri-Radio Module

Murata Electronics Type 2FR Hostless Wi-Fi® 6 + BLUETOOTH® LE 5.4 / 802.15.4 Tri-Radio Module is highly integrated while based on the NXP RW612 Wireless MCU. The Type 2FR wireless module delivers class-leading integration, efficiency, and multiple radio capabilities in a 12mm x 11mm package.The Murata Type 2FR supports dual-band Wi-Fi 6, Bluetooth Low Energy (LE) 5.4, IEEE 802.15.4, and ethernet. This versatility provides seamless connectivity and operational efficiency. Additionally, it supports Matter Network over Wi-Fi, Thread, and ethernet, simplifying device interoperability and management.FEATURESNXP RW612 inside260MHz Arm® Cortex® -M33Supports IEEE 802.11a/b/g/n/ac/ax specification with dual-band 2.4GHz and 5GHz Wi-Fi 6SISO with 20MHz channels; up to MCS9 data ratesSupports Bluetooth specification version 5.4Supports IEEE 802.15.41.2MB SRAM; 16MB Flash; External PSRAM interface for system memory expansion up to 128MB64 GPIOs, FlexSPI, SDIO 3.0, Ethernet, USB, USART, I2C, SPI, I2S, PCM, ACOMP, DAC, ADC, JTAGRF signal from pin padTemperature range of -40°C to 85°C12.0mm x 11.0mm x 1.55mm (maximum) dimensionsMSL 3Surface-mount typeRoHS compliantAPPLICATIONSSmart homeBlood pressure monitorFitness equipmentGaming accessoriesGlucometerHome security and surveillanceIn-home energy displayMajor home appliancesMulti-radio hub/smart device gateway for internet connectivitySmall and medium appliancesSmart power socket and light switchWeighing scaleIndustrialBuilding securityLightingPoint of Sale (POS) terminals

Key word：

Murata

Release time：2025-03-24 13:52 reading：435 Continue reading>>

MWC Barcelona 2025: Fibocom Launches Qualcomm X85/X82 5G Modem-RF-Powered 5G <span style='color:red'>Module</span>s, Enhancing FWA AI Capabilities

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MWC Barcelona 2025: Fibocom Launches Qualcomm X85/X82 5G Modem-RF-Powered 5G Modules, Enhancing FWA AI Capabilities

　　Barcelona, Spain – March.4th 2025 - Fibocom (Stock code:300638), a global leading provider of AIoT solutions and wireless communication modules, announced the launch of its new 5G modules and solutions based on Qualcomm Technologies, Inc.s latest Qualcomm® X85/X82 5G Modem-RF. These new solutions are set to help industry customers seamlessly transition to next-generation Fixed Wireless Access (FWA) technologies and rapidly accelerate the commercialization of new platforms.　　The latest Qualcomm X85/X82 5G Modem-RF delivers significant performance upgrades over the previous X75/X72 generation, including:　　l Supports 3GPP 5G Advanced standards, enabling key 5G Advanced features.　　l Enhanced NR Sub-6GHz downlink carrier aggregation (CA), upgraded from 5CA to 6CA, with carrier bands exceeding 400 MHz.　　l Support for Intra-band ULCA (uplink carrier aggregation) TDD, boosting uplink data rates and optimizing network efficiency.　　l Advanced software capabilities, supporting OpenWRT version 24.x, with compatibility for RDK-B and prplOS.　　l Major AI advancements, including Modem AI functionality and support for external AI NPUs (Neural Processing Units).　　Powered by a quad-core processor, new software suite, and several industry-leading innovations, Fibocom’s 5G modules deliver remarkable capabilities in network coverage, latency, energy efficiency, and mobility. Harnessing advanced AI capabilities, these modules drive 5G FWA solutions to an unprecedented level of intelligence.　　These 5G modules support six-carrier aggregation in the NR Sub-6GHz downlink, offering bandwidth exceeding 300 MHz for faster transmission speeds and broader signal coverage. In addition, Intra-Band uplink carrier aggregation ensures faster data rates, optimizing overall network performance and addressing bandwidth-intensive applications like video conferencing, online gaming, and virtual collaboration.　　In addition to hardware upgrades, the Qualcomm X85 Modem-RF introduces software innovations. The modules will support OpenWRT 24.x, a popular open-source router operating system known for robust features and scalability. Support for RDK-B and prplOS provides users with the flexibility to select the platform that best suits their needs.　　The Qualcomm® 5G AI Suite and Qualcomm® Networking AI Suite combine to deliver QoS management and intelligently prioritized network traffic. These powerful AI Suite capabilities automatically identify high-priority tasks—such as streaming HD video or online gaming—and allocate necessary bandwidth, significantly enhancing the user experience.　　“We are thrilled to collaborate with Fibocom on the launch of their new 5G modules and solutions, powered by our latest Qualcomm X85/X82 5G Modem-RF. Together, we are proud to set new benchmarks with solutions offering exceptional network coverage, low latency, energy efficiency, and enhanced mobility, ultimately paving the way for a more connected and efficient future,” said Gautam Sheoran, VP & GM, Wireless Broadband & Communications, Qualcomm Technologies, Inc.

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Fibocom

Release time：2025-03-20 13:55 reading：655 Continue reading>>

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SGP.32 remote provisioning firmware being added to all SIMCom LTE Cat 1 bis IoT modules

　　SIMCom, a leading provider ofcellular wireless modules and solutions for IoT and M2M applications, has announced that all its range of Cat 1 bis IoT modules are now being prepared with the firmware necessary to support SGP.32 functionality, facilitating simple remote provisioning of IoT modules. Developed by the GSMA, the SGP.32 standard enables connectivity with IoT devices without the need for physical SIM cards or other user interfaces.　　Comments Mads Fischer, European Sales Director. SIMCom: “ SGP.32 allows IoT devices that have no displays, buttons or SIM cards to be deployed and updated. Cat 1 bis has been rolled out globally, so by implementing SGP.32 firmware in our Cat 1 bis modules, we are enabling IoT network designers to easily and seamlessly operate their systems remotely and securely using an eSIM only.”　　SIMCom's key LTE Cat 1 bis modules that have integrated SGP.32 firmware include the A7672 series, SIM7672 series, and A7683E. These modules offer strong connectivity, global certification compliance, and enhanced power efficiency, making them ideal for various IoT applications.　　Based on the ASR1603 platform, the A7672 series supports LTE-FDD, LTE-TDD, GSM, GPRS, and EDGE communication modes. With a comprehensive certification portfolio—including RoHS, REACH, CE-RED, RCM, FCC, Anatel, and Deutsche Telekom—this series ensures compliance with global regulations, facilitating smooth deployment across international markets.　　Powered by the QCX216 chipset, the SIM7672 series supports LTE-FDD and LTE-TDD communication. It boasts a wide range of certifications, including CE-RED, RoHS, REACH, FCC, TELEC, JATE, GCF, PTCRB, IC, KC, CCC, AT&T, and T-Mobile, ensuring reliability in diverse regions. A key feature of the SIM7672 series is its support for 3GPP Rel-14 Power Saving Mode (PSM), which allows power consumption to drop as low as 3µA in PSM mode, making it an excellent choice for battery-sensitive applications. The A7683E module is designed for LTE-FDD applications and carries certifications such as RoHS, REACH, CE-RED, and Anatel. All three modules offering a 10Mbps(maximum)downlink rate and 5Mbps uplink rate.　　Available in theLCC+LGA form factor,A7672 series and SIM7672 series are compatible with SIMComNB/Cat Mand/or2G modules,enabling a smooth migration to LTE Cat 1 products,enabling end-product scalability and upgradability. Modules alsosupport both multiple built-in network protocols and the drivers for main operation systems (USB driver for Windows, Linux and Android).The inclusion of industrial standard interfaces such as UART, USB, I2C and GPIO suit the modules for IoT applications such as telematics, POS, surveillance devices, industrial routers, and remote diagnostics etc.　　SIMCom's A7672 series, SIM7672 series, and A7683E modules, powered by SGP.32 firmware, provide a cost-effective and scalable solution for large-scale IoT deployments, particularly in metering and tracking, by enabling remote SIM provisioning that eliminates the need for physical SIM insertion—thereby reducing costs and simplifying deployment in remote locations. With global certifications and ultra-low power consumption, these modules deliver reliable, energy-efficient performance and long-term deployment stability, making them the ideal choice for massive IoT applications due to their flexibility and efficiency.

Key word：

Simcom

Release time：2025-03-18 16:38 reading：507 Continue reading>>

BIWIN Solutions for Communication <span style='color:red'>Module</span>s: High-Speed, Stable, and Built for Seamless Data Flow

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BIWIN Solutions for Communication Modules: High-Speed, Stable, and Built for Seamless Data Flow

　　The Internet of Things (IoT) is on a steep upward trajectory. Statista predicts that by 2025, the world will see a surge of connected IoT devices to 29.422 billion units from 9.757 billion units, with CAGR reaching 11.67%. This explosion isn’t just powering the deployment of more smart gadgets; it’s opening up huge opportunities for hardware and storage tech. At the core of this ecosystem, communication modules serve as the vital link between the physical and digital realms. Their performance directly shapes the efficiency, stability, and security of IoT systems, handling everything from collecting sensor data to transmitting it wirelessly to the cloud or end devices—powering critical functions like remote monitoring and data analysis.　　With the rapid expansion of IoT applications, storage components within communication modules face heightened challenges. They must excel in high-bandwidth data transmission, multitasking concurrency, continuous data streaming over extended periods, efficient and stable data read/write operations, data security protection, and system compatibility to ensure real-time transmission and secure storage of critical data.　　In response to these industry challenges head-on, BIWIN draws on its “integrated R&D and packaging” expertise, along with its expertise from markets such as smartphones and smart wearables, to offer a comprehensive storage solution product matrix for communication modules, including eMMC, LPDDR, eMCP, uMCP, and more. These products have been widely applied to power 5G/4G and smart modules from industry leaders like Quectel, Fibocom, and MeiG Smart, providing solid foundations for the efficient and reliable operations of communication networks.　　01 Tackling Tough Scenarios with Top-Notch Storage　　In practical deployments across fields such as smart metering, industrial applications, routers, automotive systems, and POS machines, communication modules face numerous challenges. Particularly in outdoor environments, harsh weather, extreme temperatures, humidity fluctuations, prolonged continuous operation, and electromagnetic interference can all impact module performance. Any data loss or delay could result in IoT system failures or degraded service quality.　　Taking specific IoT application scenarios as an example, in surveillance systems requiring uninterrupted high-definition video recording, storage components must maintain stable, high-speed read/write performance. To meet these demanding requirements, BIWIN’s storage chips are featured with custom-designed firmware architectures, dynamic SLC caching and unique direct-write solutions, and firmware optimizations for garbage collection and data encryption, contributing to the consistently stable data read/write operations. Testings show that BIWIN’s eMMC products achieve full-disk write speeds exceeding 15MB/s with performance fluctuations below 5%, perfectly aligning with IoT-specific application standards. Additionally, BIWIN’s storage chips support remote firmware upgrades for communication modules, enhancing device operational efficiency.　　On the reliability front, BIWIN’s chips are loaded with cutting-edge packaging technologies like multi-layer die stacking, ultra-thin dies, and heterogeneous multi-chip integration, capable of realizing a perfect balance among performance, durability, and heat management. Meanwhile, the chips have also been tested with rigorous processes, covering electrical testing, signal integrity (SI) testing, reliability testing, and application testing. These chips can withstand gravitational acceleration up to 1500G, vibration amplitudes of 20-2000Hz, and achieve a mean time between failures (MTBF) exceeding 1.5 million hours, ensuring high-quality delivery and consistency across all aspects.　　02 Building a Comprehensive Product Matrix to Provide Efficient and Reliable Storage Support　　With key attributes such as highly stable read/write performance, exceptional reliability and durability, and excellent compatibility, BIWIN’s eMMC, LPDDR4X, eMCP3/4x, and uMCP2.2 series products have earned certifications from mainstream SoC platforms like Qualcomm, MediaTek, and Unisoc. They have been integrated into the supply chains of multiple renowned communication module manufacturers, continuously empowering the stable operation of communication modules.　　In conclusion　　As technologies such as AI, edge computing, 5G/6G, and LPWAN become deeply integrated, the IoT will evolve into more mature and diverse forms, permeating all aspects of life and generating immense demand for data computation, processing, transmission, and storage. Facing this trend, BIWIN will capitalize on its comprehensive strengths in R&D, controller design, packaging and testing, and supply chain management to deepen collaboration with communication module vendors and platform providers, fully addressing the multidimensional customization needs of edge-side communication modules for storage performance, reliability, and stability and jointly accelerating the expansion of IoT application boundaries.

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Release time：2025-03-13 11:40 reading：933 Continue reading>>

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