AMEYA360:TDK-Lambda CCG1R5 & CCG3 DC-DC Converters
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AMEYA360:TDK-Lambda CCG1R5 & CCG3 DC-DC Converters

　　TDK-Lambda CCG1R5 and CCG3 DC-DC Converters are a space-saving series of isolated DC-DC converters operating from 4.5V to 18V, 9VDC to 36VDC, or 18V to 76V inputs with 1.5W and 3W power levels and output voltages from 3.3V to 30V. Single output models of these converters can be adjusted -from 5% to +10% using the trim terminal. The CCG can operate in ambient temperatures of -40°C to +100°C and have an input-to-output isolation of 1,500VDC. TDK-Lambda CCG1R5 and CCG3 DC-DC Converters offer through-hole and surface mount packages.　　FEATURES：　　Wide 4:1 input ranges　　Space-saving package sizes　　Certified to IEC 62368-1　　Reduced derating at high ambient temperatures　　Supports dual 5V to 12V, 12V to 24V, or 24V to 48V system voltages　　No silicone potting　　Less board area needed　　Easier system compliance　　More useable power　　Reduced quality risk during surface mount reflow process
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Release time：2023-04-14 13:19 reading：2183 Continue reading>>
AMEYA360:TDK-Lambda RGC Series DC-DC Buck-Boost Converters
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AMEYA360:TDK-Lambda RGC Series DC-DC Buck-Boost Converters

　　TDK-Lambda RGC Series Non-Isolated DC-DC Buck-Boost Converters offer a 9V to 53V input voltage range, 300W maximum power rating, and 8A to 12.5A current range. These converters are encapsulated in a five-sided aluminum case and rated to temperatures of up to +115°C. The RGC converter modules have an industry-standard 1/16th brick pin-out construction, are qualified for MIL-STD-810G, and are designed for fanless conduction-cooled applications.       Additional features include remote On/Off, remote sense and output trim, frequency synchronization, and output current monitoring. TDK-Lambda RGC Series Non-Isolated DC-DC Buck-Boost Converters offer a wide output adjustment range that allows one model to be used in multiple positions, assisting in inventory and part number reduction.　　FEATURES　　High power density　　Less board area needed　　Improved EMI　　Long battery life　　Low power consumption　　Supports multiple system voltages　　Operates from different DC input source voltages　　Extends run times on battery-powered equipment　　SPECIFICATIONS　　300W maximum power rating　　1/16th brick pin-out design　　+115°C maximum case temperature　　5V up to 48V output adjustment range　　9V to 53V input range　　Up to 97% efficiency　　Qualified to MIL-STD-810G (shock and vibration)　　38.1mm x 49.5mm x 13mm dimensions　　-40°C to +115°C operating temperature range
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Release time：2023-03-31 10:05 reading：2401 Continue reading>>
TDK-Lambda acquires Nextys
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TDK-Lambda acquires Nextys

　　TDK-Lambda has acquired Nextys, a company that designs and manufactures DIN rail power supplies and accessories.　　Through the acquisition, TDK-Lambda hopes to strengthen its market position in DIN rail power supplies.　　“We are pleased to welcome Nextys to the TDK family,” said Adam Rawicz, Managing Director, TDK-Lambda EMEA. “The DIN rail power supply market is growing much faster than many other segments and the specialist expertise of the Nextys team will enhance our position as market leader in industrial power supplies. Also, our strong global sales channels will substantially increase the opportunities for Nextys products.”　　The advent of Industry 4.0 and the Smart Factory is expanding the market for high reliability DIN rail power supplies. Also the convenience of the DIN rail mounting standard is driving adoption in other high end capital equipment segments including medical and semiconductor manufacturing equipment. Additionally, the fast-developing renewable energy equipment market is driving further growth.　　“The inclusion of Nextys’ innovative solutions for DIN rail powered equipment to the portfolio of TDK-Lambda, the market leader in industrial power supplies, will consolidate the prospect of development of this business for both players. Nextys’ team is ready to bring its contribution to the enhancement of TDK presence in the DIN rail segment," concluded Marius Ciorica, CEO and founder of Nextys.
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Release time：2019-01-17 00:00 reading：1159 Continue reading>>
Soitec and <span style='color:red'>MBDA</span> to acquire Dolphin Integration Assets
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Soitec and MBDA to acquire Dolphin Integration Assets

Soitec (Euronext Paris), a designer and manufacturer of semiconductor materials, and MBDA, announce the joint acquisition of Dolphin Integration.Dolphin Integration is an industry recognized provider of semiconductor design, silicon IP and SoC (System-On-Chip) solutions for low power applications. Headquartered in Grenoble, Dolphin Integration was founded in 1985. It currently employs 155 people, including 130 design engineers. For the fiscal year ended March 31th, 2018, the company generated revenues of 17 million Euros.The joint venture formed by Soitec and MBDA acquires Dolphin Integration, including all employees. The resulting ownership of the joint venture is as follows: Soitec at 60% and MBDA at 40%.The transaction was authorized today by the Commercial Court of Grenoble. It comes as a prompt and positive outcome of Dolphin Integration insolvency proceedings. The company went into receivership on July 24, 2018.Soitec and MBDA each provide complementary strategic support to Dolphin Integration.Soitec brings its engineered substrates expertise and unique low-power design methodology (body biasing) to accelerate Dolphin Integration design activities in low-power electronic devices, where a growing number of critical chips are built on FD-SOI technology. In addition, Soitec will strengthen Dolphin Integration’s position within the entire semiconductor ecosystem, to develop and promote products and services in several strategic markets, including mobile devices and infrastructure, data centers, and space and industrial applications.MBDA, a strategic customer of Dolphin Integration for defense applications since 2004, strengthens its existing industrial collaboration and long-term commercial pipeline for ASIC (Application Specific Integrated Circuit) and SoC (System on Chip) products. With the support of MBDA, Dolphin Integration will be able to advance its positions in aerospace and defense design.Soitec and MBDA confident in Dolphin Integration profitable growth.Soitec and MBDA together committed to a financial investment of around 6 million Euros including the acquisition of most of Dolphin Integration’s assets, the payment of certain liabilities and a significant cash injection to finance Dolphin Integration’s working capital requirements.Soitec and MBDA are confident in their ability to turnaround the financial position of Dolphin Integration. Dolphin Integration is expected to be fully consolidated into Soitec’s financial statements as of September 2018.“Dolphin Integration represents a strategic opportunity for Soitec to reinforce a full IP and service offering related to energy efficient solutions for chip design on FD-SOI. This is a major differentiating factor for FD-SOI and a key accelerator of FD-SOI adoption in major market segments,” highlighted Paul Boudre, CEO of Soitec.“MBDA investment will strengthen the French defense industrial base since it will provide Dolphin Integration with a more stable flow of defense related revenues and a closer technological collaboration that will allow it to enhance the access of its specialized microelectronics offering to the entire French and European defense industry,” said Antoine Bouvier, CEO of MBDA.
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Release time：2018-08-22 00:00 reading：1182 Continue reading>>

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